Display module, assembling method thereof and display device

Abstract

The invention provides a display module, an assembling method thereof and a display device, relates to the technical field of display, and reduces the frame width. The display module comprises a display screen, a circuit board and a conductive layer; the display screen comprises a substrate and a first conductive pad, and the first conductive pad is located on one side of the substrate. The circuit board is located on the side, away from the first conductive pad, of the substrate and comprises a second conductive pad located on the side, away from the display screen, of the circuit board. The conducting layer is arranged on the first side wall of the display screen and the second side wall of the circuit board and extends towards the two ends to be in contact with the first conducting pad and the second conducting pad respectively. According to the display module, the first conductive pad is in contact with the conductive layer instead of being in contact with the circuit board, the electric connection requirement of the first conductive pad and the conductive layer can be met due to the fact that the length of the first conductive pad is small, only a small distance needs to be reserved for the distance between the first conductive pad and the polaroid, and even the distance does not need to be reserved, so that the frame width of the display module is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, an assembly method thereof, and a display device. Background Art

[0002] In recent years, organic light-emitting display panels have gradually become the mainstream products in the display field. Due to their advantages such as high image quality, power saving, thin body and wide range of applications, they are widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc.

[0003] However, the current display module has the problem of wide borders. Summary of the invention

[0004] In order to solve the above technical problems, the present application is proposed. The embodiment of the present application provides a display module and an assembly method thereof and a display device.

[0005] In the first aspect, an embodiment of the present application provides a display module, the display module includes a display screen, a circuit board and a conductive layer; wherein the display screen includes a substrate and a first conductive pad, the first conductive pad is located on one side of the substrate; the circuit board is located on the side of the substrate away from the first conductive pad, the circuit board includes a second conductive pad, the second conductive pad is located on the side of the circuit board away from the display screen; the conductive layer is arranged on the first side wall of the display screen and the second side wall of the circuit board, and extends to both ends to contact the first conductive pad and the second conductive pad respectively. The first conductive pad is in contact with the conductive layer, not the circuit board, so the length of the first conductive pad is relatively small to meet the electrical connection requirements of the first conductive pad and the conductive layer, and the contact between the first conductive pad and the conductive layer does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damaging the polarizer, so for the spacing between the first conductive pad and the polarizer, the present application only needs to reserve a small spacing, or even no spacing is required, thereby reducing the border width of the display module and improving the display effect.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the first side wall and the second side wall are in a stepped state, thereby reducing the climbing height of the conductive layer and thus reducing the risk of fracture of the conductive layer.

[0007] Preferably, the orthographic projection of the second side wall on the display screen is located inside the display screen, so that the first side wall and the second side wall are in a stepped state.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the display module further comprises a glue layer, the glue layer is located between the circuit board and the display screen, and the conductive layer is further disposed on a third side wall of the glue layer. The glue layer is used to bond the circuit board and the display screen together to ensure that the circuit board and the display screen maintain a correct position and spacing during the assembly process of the display module; in addition, the glue layer also has a buffering effect, reducing stress concentration caused by different thermal expansion coefficients or mechanical stress, thereby reducing the risk of cracking of the circuit board and the display screen.

[0009] Preferably, the first side wall, the third side wall and the second side wall are in a multi-step state, which reduces the climbing height of the conductive layer and thus reduces the risk of the conductive layer breaking.

[0010] Preferably, the orthographic projection of the third side wall on the display screen is located inside the display screen.

[0011] Preferably, the distance between the orthographic projection of the second side wall on the glue layer and the third side wall is greater than or equal to 50 micrometers and less than or equal to 100 micrometers.

[0012] Preferably, a distance between the orthographic projection of the third side wall on the display screen and the first side wall is greater than or equal to 800 micrometers and less than or equal to 1000 micrometers.

[0013] Preferably, the thickness of the glue layer is greater than or equal to 10 micrometers and less than or equal to 75 micrometers.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the display module further includes a polarizer, the polarizer is located on the side of the display screen away from the circuit board, and the spacing between the fourth side wall of the polarizer and the first conductive pad is greater than or equal to 0 mm and less than 0.8 mm. The contact between the first conductive pad and the conductive layer does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damage to the polarizer, so for the spacing between the first conductive pad and the fourth side wall of the polarizer, the present application only needs to reserve a smaller spacing, or even no spacing, thereby reducing the border width of the display module.

[0015] In combination with the first aspect, in some implementations of the first aspect, a length of the first conductive pad is greater than or equal to 0.2 mm and less than or equal to 2 mm.

[0016] Preferably, the length of the first conductive pad is greater than or equal to 0.2 mm and less than or equal to 1 mm, which is much smaller than the length of the first conductive pad in the related art (2 mm), thereby reducing the border width of the display module.

[0017] In combination with the first aspect, in some implementations of the first aspect, the conductive layer includes conductive silver paste.

[0018] Preferably, the conductive silver paste includes a plurality of silver particles, and a volume proportion of the plurality of silver particles is greater than or equal to 60% and less than or equal to 90%.

[0019] Preferably, the diameter of the silver particles is less than or equal to 500 nanometers.

[0020] Preferably, the diameter of the silver particles is greater than or equal to 20 nanometers and less than or equal to 200 nanometers.

[0021] Preferably, the conductive silver paste further comprises a binder, and a plurality of silver particles are mixed in the binder. The volume proportion of the binder is greater than or equal to 10% and less than or equal to 40%. The conductive silver paste achieves conductive properties through a plurality of silver particles in contact with each other.

[0022] In combination with the first aspect, in some implementations of the first aspect, the display screen includes a hard screen.

[0023] In the second aspect, an embodiment of the present application provides a method for assembling a display module, the assembly method comprising: flip-chip attaching a circuit board on the non-display side of a display screen, the display screen comprising a first conductive pad, and the circuit board comprising a second conductive pad; preparing a conductive layer on a first side wall of the display screen and a second side wall of the circuit board, the conductive layer extending to both ends to contact the first conductive pad and the second conductive pad respectively.

[0024] In the display module obtained by the assembly method provided in the embodiment of the present application, the first conductive pad is in contact with the conductive layer instead of the circuit board. Therefore, a smaller length of the first conductive pad can meet the electrical connection requirements between the first conductive pad and the conductive layer, and the contact between the first conductive pad and the conductive layer does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damaging the polarizer. Therefore, for the spacing between the first conductive pad and the polarizer, the present application only needs to reserve a smaller spacing, or even no spacing needs to be reserved, thereby reducing the border width of the display module and improving the display effect.

[0025] In combination with the second aspect, in some implementations of the second aspect, preparing a conductive layer on the first side wall of the display screen and the second side wall of the circuit board includes: using a 3D printing process to prepare a conductive layer on the first side wall of the display screen and the second side wall of the circuit board.

[0026] Preferably, the assembling method further comprises: attaching a polarizer to the display side of the display screen, wherein the spacing between the fourth side wall of the polarizer and the first conductive pad is greater than or equal to 0 mm and less than 0.8 mm.

[0027] In a third aspect, an embodiment of the present application provides a display device, which includes a display module provided by any of the above embodiments or a display module obtained according to the assembly method provided by any of the above embodiments.

[0028] The display module provided in the embodiment of the present application includes a display screen, a circuit board and a conductive layer; wherein the display screen includes a substrate and a first conductive pad, the first conductive pad is located on one side of the substrate; the circuit board is located on the side of the substrate away from the first conductive pad, the circuit board includes a second conductive pad, the second conductive pad is located on the side of the circuit board away from the display screen; the conductive layer is arranged on the first side wall of the display screen and the second side wall of the circuit board, and extends to both ends to contact the first conductive pad and the second conductive pad respectively. Since the first conductive pad in the present application is in contact with the conductive layer instead of the circuit board, the length of the first conductive pad is relatively small to meet the electrical connection requirements of the first conductive pad and the conductive layer, and for the spacing between the first conductive pad and the polarizer, the present application only needs to reserve a small spacing, or even no spacing is required, thereby reducing the border width of the display module and improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0030] Figure 1 Shown is a structural schematic diagram of a display module provided by the related art.

[0031] Figure 2 Shown is a schematic structural diagram of a display module provided in one embodiment of the present application.

[0032] Figure 3 Shown is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0033] Figure 4 Shown is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0034] Figure 5 Shown is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0035] Figure 6 Shown is a schematic structural diagram of a display module provided in another embodiment of the present application.

[0036] Figure 7 FIG. 1 is a flow chart of a method for assembling a display module according to an embodiment of the present application.

[0037] Figure 8 FIG. 4 is a flow chart of a method for assembling a display module according to another embodiment of the present application.

[0038] Fig. 9 Shown is a schematic structural diagram of a display device provided in one embodiment of the present application.

[0039] Reference numerals: display module 100 ; substrate 111 ; first conductive pad 112 ; circuit board 120 ; second conductive pad 121 ; conductive layer 130 ; adhesive layer 140 ; ​​polarizer 150 ; first side wall C1 ; second side wall C2 ; third side wall C3 ; fourth side wall C4 ; display device 10 . DETAILED DESCRIPTION

[0040] Figure 1 FIG. 1 is a schematic diagram of the structure of a display module provided by the related art. Figure 1 As shown, the related technology provides a display module 100, which includes a display screen, a circuit board 120 and a polarizer 150, wherein the display screen includes a substrate 111 and a first conductive pad 112, and the first conductive pad 112 is located on one side of the substrate 111; the circuit board 120 is located on the side of the substrate 111 away from the first conductive pad 112, and extends toward the side close to the first conductive pad 112 until it contacts the first conductive pad 112; the polarizer 150 and the first conductive pad 112 are located on the same side of the substrate 111, and the spacing between the fourth side wall C4 of the polarizer 150 and the first conductive pad 112 is 0.8 mm.

[0041] Since the length of the contact portion between the first conductive pad 112 and the circuit board 120 needs to meet the preset length requirement, the length of the first conductive pad 112 is set to 2 mm; and since the contact between the first conductive pad 112 and the circuit board 120 is completed under high temperature (180° C.), the spacing between the fourth side wall C4 of the polarizer 150 and the first conductive pad 112 is set to 0.8 mm to avoid high temperature damage to the polarizer 150. Based on this, the display module 100 in the related art has the problem of a wide frame.

[0042] In order to solve the above technical problems, the display module provided by the present application includes a display screen, a circuit board and a conductive layer; wherein the display screen includes a substrate and a first conductive pad, the first conductive pad is located on one side of the substrate; the circuit board is located on the side of the substrate away from the first conductive pad, the circuit board includes a second conductive pad, the second conductive pad is located on the side of the circuit board away from the display screen; the conductive layer is arranged on the first side wall of the display screen and the second side wall of the circuit board, and extends to both ends to contact the first conductive pad and the second conductive pad respectively. Since the first conductive pad in the present application is in contact with the conductive layer instead of the circuit board, the length of the first conductive pad is relatively small to meet the electrical connection requirements of the first conductive pad and the conductive layer, and for the spacing between the first conductive pad and the polarizer, the present application only needs to reserve a small spacing, or even no spacing is required, thereby reducing the border width of the display module and improving the display effect.

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0045] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0046] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0047] Figure 2 FIG. 1 is a schematic diagram of the structure of a display module provided by an embodiment of the present application. Figure 2 As shown, an embodiment of the present application provides a display module 100, which includes a display screen, a circuit board 120 and a conductive layer 130; wherein the display screen includes a substrate 111 and a first conductive pad 112, and the first conductive pad 112 is located on one side of the substrate 111; the circuit board 120 is located on the side of the substrate 111 away from the first conductive pad 112, and the circuit board 120 includes a second conductive pad 121, and the second conductive pad 121 is located on the side of the circuit board 120 away from the display screen; the conductive layer 130 is arranged on the first side wall C1 of the display screen and the second side wall C2 of the circuit board 120, and extends to both ends to contact the first conductive pad 112 and the second conductive pad 121 respectively.

[0048] In the present application, the first conductive pad 112 is in contact with the conductive layer 130 instead of the circuit board 120. Therefore, a shorter length of the first conductive pad 112 can satisfy the electrical connection requirements between the first conductive pad 112 and the conductive layer 130. In addition, the contact between the first conductive pad 112 and the conductive layer 130 does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damaging the polarizer. Therefore, for the spacing between the first conductive pad 112 and the polarizer, the present application only needs to reserve a smaller spacing, or even no spacing is required, thereby reducing the border width of the display module 100 and improving the display effect.

[0049] In one embodiment, the material of the first conducting pad 112 may be titanium aluminum titanium, the second conducting pad 121 may be a welding end of the circuit board 120 , and the substrate 111 includes a glass substrate.

[0050] refer to Figure 2 , Figure 2 The description is only made by taking the example that the first side wall C1 of the display screen is flush with the second side wall C2 of the circuit board 120 , and another embodiment is provided below. Figure 3 FIG. 2 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 3 As shown, in the display module 100 provided in the embodiment of the present application, the first side wall C1 and the second side wall C2 are in a stepped state.

[0051] exist Figure 3 In the illustrated embodiment, the conductive layer 130 on the first side wall C1 and the conductive layer 130 on the second side wall C2 are not in direct contact. Figure 2 In the illustrated embodiment, the conductive layer 130 on the first side wall C1 and the conductive layer 130 on the second side wall C2 are in direct contact. Figure 3 In the embodiment shown, the height of the conductive layer 130 on the first side wall C1 and the height of the conductive layer 130 on the second side wall C2 are both less than Figure 2 In the embodiment shown, the height of the conductive layer 130 starts from the end of the first side wall C1 away from the circuit board 120 and ends at the end of the second side wall C2 away from the display screen, that is, Figure 3 The illustrated embodiment reduces the climbing height of the conductive layer 130 , thereby reducing the risk of the conductive layer 130 breaking, and at the same time reduces the thickness of the display module 100 close to the frame, that is, reduces the thickness of the display module 100 close to the first side wall C1 .

[0052] It should be noted that the height of the conductive layer 130 on the first side wall C1 refers to the height of the conductive layer 130 on the first side wall C1 in the thickness direction of the display screen, and the height of the conductive layer 130 on the second side wall C2 refers to the height of the conductive layer 130 on the second side wall C2 in the thickness direction of the display screen. Figure 2 In the illustrated embodiment, the height of the conductive layer 130 starting from the end of the first side wall C1 away from the circuit board 120 and ending at the end of the second side wall C2 away from the display screen refers to the height of the conductive layer 130 in the thickness direction of the display screen.

[0053] refer to Figure 3 Preferably, the orthographic projection of the second side wall C2 on the display screen is located inside the display screen, so that the first side wall C1 and the second side wall C2 are in a stepped state.

[0054] Figure 4 FIG. 2 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 4As shown, in the display module 100 provided in the embodiment of the present application, the display module 100 further includes a glue layer 140 , the glue layer 140 is located between the circuit board 120 and the display screen, and the conductive layer 130 is further disposed on a third side wall C3 of the glue layer 140 .

[0055] Figure 4 The third side wall C3 of the adhesive layer 140 is flush with the first side wall C1 of the display screen. Figure 4 The adhesive layer 140 is used to bond the circuit board 120 and the display screen together to ensure that the circuit board 120 and the display screen maintain the correct position and spacing during the assembly process of the display module 100; in addition, the adhesive layer 140 also has a buffering effect, reducing stress concentration caused by different thermal expansion coefficients or mechanical stress, thereby reducing the risk of cracking of the circuit board 120 and the display screen.

[0056] Figure 5 FIG. 2 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 5 As shown, the embodiment of the present application provides an embodiment in which the third side wall C3 and the first side wall C1 are not flush. Figure 5 In the display module 100 provided in the embodiment of the present application, the first side wall C1, the third side wall C3 and the second side wall C2 are in a multi-step state.

[0057] exist Figure 5 In the illustrated embodiment, the conductive layer 130 on the first side wall C1, the conductive layer 130 on the second side wall C2, and the conductive layer 130 on the third side wall C3 are not in direct contact with each other. Figure 5 The illustrated embodiment reduces the climbing height of the conductive layer 130 , thereby reducing the risk of the conductive layer 130 breaking.

[0058] refer to Figure 5 Preferably, the orthographic projection of the third side wall C3 on the display screen is located within the display screen.

[0059] Preferably, the distance between the orthographic projection of the second side wall C2 on the glue layer 140 and the third side wall C3 is greater than or equal to 50 microns and less than or equal to 100 microns. For example, the distance is 50 microns, 65 microns, 80 microns, 95 microns, etc. The advantage of such a setting is that both the process requirements and the conductive performance requirements of the conductive layer 130 are met.

[0060] Preferably, the distance between the orthographic projection of the third side wall C3 on the display screen and the first side wall C1 is greater than or equal to 800 microns and less than or equal to 1000 microns. For example, the distance is 850 microns, 900 microns, 950 microns, 1000 microns, etc. The advantage of such a setting is that both the process requirements and the conductive performance requirements of the conductive layer 130 are met.

[0061] Preferably, the thickness of the adhesive layer 140 is greater than or equal to 10 microns and less than or equal to 75 microns. For example, the thickness of the adhesive layer 140 is 15 microns, 25 microns, 35 microns, 45 microns, 55 microns or 65 microns. The advantage of such a setting is that while meeting the viscosity requirement, the thickness of the adhesive layer 140 is prevented from being too thick, which is not conducive to the thinness of the product.

[0062] Specifically, the thickness of the glue layer 140 refers to the thickness of the glue layer 140 in the thickness direction of the display screen.

[0063] Figure 6 FIG. 2 is a schematic diagram of the structure of a display module provided by another embodiment of the present application. Figure 6 As shown, the display module 100 further includes a polarizer 150 , which is located on the side of the display screen away from the circuit board 120 , and the distance between the fourth side wall C4 of the polarizer 150 and the first conductive pad 112 is greater than or equal to 0 mm and less than 0.8 mm.

[0064] In the present application, the contact between the first conductive pad 112 and the conductive layer 130 does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damaging the polarizer 150. Therefore, for the spacing between the first conductive pad 112 and the fourth side wall C4 of the polarizer 150, the present application only needs to reserve a smaller spacing, or even no spacing needs to be reserved, thereby reducing the border width of the display module 100.

[0065] In the display module 100, the polarizer 150 is an important optical element, which is used to control and optimize the propagation direction of light to enhance the display effect and improve the contrast of the display screen. Specifically, the polarizer 150 can filter out the vibration direction in natural light and only allow light in a specific direction to pass through, thereby controlling the propagation direction of light. This helps to reduce reflection and scattering and improve the clarity and contrast of the display screen.

[0066] By using the polarizer 150, the display module 100 can effectively reduce the interference of backlight reflection and ambient light, making the content displayed on the display screen clearer and easier to identify, thereby improving the contrast of the display module 100. In addition, the polarizer 150 can also protect the display screen, preventing dust, dirt and other pollutants from entering the interior of the display screen, thereby extending the service life of the display module 100. By properly designing and installing the polarizer 150, the optical performance of the display module 100 can be optimized, the color saturation and display effect can be improved, and the display effect can be made more vivid and realistic.

[0067] In some embodiments, the length of the first conductive pad 112 is greater than or equal to 0.2 mm and less than or equal to 2 mm. Exemplarily, the length of the first conductive pad 112 is 0.2 mm, 0.5 mm, 1.5 mm, etc. The advantage of such a setting is that the process requirements for preparing the first conductive pad 112 by laser drilling and the conduction area requirements of the first conductive pad 112 are met at the same time.

[0068] refer to Figures 2 to 6 The length of the first conductive pad 112 refers to the length of the first conductive pad 112 in a direction perpendicular to the thickness of the display screen.

[0069] Preferably, the length of the first conductive pad 112 is 0.2 mm, which is much smaller than the length of the first conductive pad 112 in the related art (2 mm), thereby reducing the frame width of the display module 100 .

[0070] In some embodiments, the conductive layer 130 includes conductive silver paste.

[0071] Preferably, the conductive silver paste includes a plurality of silver particles, and a volume proportion of the plurality of silver particles is greater than or equal to 60% and less than or equal to 90%.

[0072] In one embodiment, the diameter of the silver particles is less than or equal to 500 nanometers. For example, the diameter of the silver particles is 100 nanometers, 300 nanometers, 400 nanometers, etc.

[0073] In one embodiment, the diameter of the silver particles is greater than or equal to 20 nanometers and less than 200 nanometers. Exemplarily, the diameter of the silver particles is 20 nanometers, 50 nanometers, 70 nanometers, 100 nanometers, 150 nanometers, etc. The advantage of this is that both the process requirements and the uniformity requirements of the silver particle size are met.

[0074] Preferably, the conductive silver paste further comprises a binder, and a plurality of silver particles are mixed in the binder. The volume proportion of the binder is greater than or equal to 10% and less than or equal to 40%. The conductive silver paste achieves conductive properties through a plurality of silver particles in contact with each other.

[0075] In some embodiments, the display screen includes a hard screen. The embodiments of the present application particularly reduce the problem of a hard screen display screen having a wide border.

[0076] The structure of the display module 100 provided by the present application is described in detail above, and the following describes the assembly method of the display module 100. It can be understood that the assembly method corresponds to the structure of the display module 100, so the structure mentioned in the assembly method can refer to the content of the display module 100 above, and will not be repeated here.

[0077] Figure 7 FIG. 1 is a flow chart of a method for assembling a display module according to an embodiment of the present application. Figure 7 As shown, an embodiment of the present application provides a method for assembling a display module, and the assembly method includes the following steps.

[0078] Step S701, flip-chip attaching a circuit board 120 to the non-display side of the display screen, the display screen includes a first conductive pad 112, and the circuit board 120 includes a second conductive pad 121. Flip-chip attaching means that the active surface (i.e., the side with the circuit pattern) of the circuit board 120 faces downward, and correspondingly, the second conductive pad 121 faces downward, and the passive surface of the circuit board 120 is adhered and fixed to the non-display surface of the display screen. The circuit board 120 includes a flexible circuit board.

[0079] Step S702 , preparing a conductive layer 130 on the first side wall C1 of the display screen and the second side wall C2 of the circuit board 120 , wherein the conductive layer 130 extends to both ends to contact the first conductive pad 112 and the second conductive pad 121 respectively.

[0080] In the display module obtained by the assembly method provided in the embodiment of the present application, the first conductive pad 112 is in contact with the conductive layer 130 instead of the circuit board 120. Therefore, a smaller length of the first conductive pad 112 can satisfy the electrical connection requirement between the first conductive pad 112 and the conductive layer 130, and the contact between the first conductive pad 112 and the conductive layer 130 does not need to be completed under high temperature conditions, that is, there is no need to consider the problem of high temperature damaging the polarizer 150. Therefore, for the spacing between the first conductive pad 112 and the polarizer 150, the present application only needs to reserve a smaller spacing, or even no spacing is required, thereby reducing the border width of the display module and improving the display effect.

[0081] In some embodiments, preparing the conductive layer 130 on the first side wall C1 of the display screen and the second side wall C2 of the circuit board 120 includes: preparing the conductive layer 130 on the first side wall C1 of the display screen and the second side wall C2 of the circuit board 120 using a 3D printing process.

[0082] Preferably, the assembling method further comprises: attaching a polarizer 150 to the display side of the display screen, and the distance between the fourth side wall C4 of the polarizer 150 and the first conductive pad 112 is greater than or equal to 0 mm and less than 0.8 mm.

[0083] Figure 8 FIG. 2 is a flow chart of a method for assembling a display module according to another embodiment of the present application. Figure 8 As shown, based on the steps of the above-mentioned assembly method, the assembly method provided in the embodiment of the present application includes the following steps.

[0084] Step S801 , flip-chip attaching a circuit board 120 to the non-display side of a display screen, the display screen includes a first conductive pad 112 , and the circuit board 120 includes a second conductive pad 121 .

[0085] Step S802 , using a 3D printing process, prepare a conductive layer 130 on the first side wall C1 of the display screen and the second side wall C2 of the circuit board 120 , and the conductive layer 130 extends to both ends to contact the first conductive pad 112 and the second conductive pad 121 respectively.

[0086] Step S803 , attaching a polarizer 150 to the display side of the display screen, wherein the distance between the fourth side wall C4 of the polarizer 150 and the first conductive pad 112 is greater than or equal to 0 mm and less than 0.8 mm.

[0087] Fig. 9 FIG. 1 is a schematic diagram of the structure of a display device provided by an embodiment of the present application. Fig. 9 As shown, an embodiment of the present application provides a display device 10, which includes a display module 100 provided by any of the above embodiments or a display module 100 obtained according to the assembly method provided by any of the above embodiments. The technical principles and effects produced are similar and will not be repeated here.

[0088] It is understandable that the display module 100 can be applied to a display device 10, which can be, for example, a mobile terminal, a tablet computer, a computer monitor, a television, a wearable device, an information query machine, or any other product or component with a display function.

[0089] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0090] It should also be noted that, in the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present application. Although multiple exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize some variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display module, characterized in that: include: A display screen comprises a substrate and a first conductive pad, wherein the first conductive pad is located at one side of the substrate; A circuit board is located on a side of the substrate away from the first conductive pad, the circuit board includes a second conductive pad, and the second conductive pad is located on a side of the circuit board away from the display screen; as well as The conductive layer is disposed on the first side wall of the display screen and the second side wall of the circuit board, and extends to both ends to contact the first conductive pad and the second conductive pad respectively.

2. The display module according to claim 1, characterized in that: The first side wall and the second side wall are in a stepped state; Preferably, an orthographic projection of the second side wall on the display screen is located within the display screen.

3. The display module according to claim 1 or 2, characterized in that: It also includes a glue layer, the glue layer is located between the circuit board and the display screen, and the conductive layer is further arranged on a third side wall of the glue layer; Preferably, the first side wall, the third side wall and the second side wall are in a multi-step state; Preferably, the orthographic projection of the third side wall on the display screen is located inside the display screen; Preferably, the distance between the orthographic projection of the second side wall on the glue layer and the third side wall is greater than or equal to 50 microns and less than or equal to 100 microns; Preferably, the distance between the orthographic projection of the third side wall on the display screen and the first side wall is greater than or equal to 800 microns and less than or equal to 1000 microns; Preferably, the thickness of the adhesive layer is greater than or equal to 10 microns and less than or equal to 75 microns.

4. The display module according to claim 1, characterized in that: It also includes a polarizer, which is located on the side of the display screen away from the circuit board, and the distance between the fourth side wall of the polarizer and the first conductive pad is greater than or equal to 0 mm and less than 0.8 mm.

5. The display module according to claim 1, characterized in that: The length of the first conductive pad is greater than or equal to 0.2 mm and less than or equal to 2 mm; Preferably, the length of the first conductive pad is greater than or equal to 0.2 mm and less than or equal to 1 mm.

6. The display module according to claim 1, characterized in that: The conductive layer includes conductive silver paste; Preferably, the conductive silver paste comprises a plurality of silver particles, and a volume proportion of the plurality of silver particles is greater than or equal to 60% and less than or equal to 90%; Preferably, the diameter of the silver particles is less than or equal to 500 nanometers; Preferably, the diameter of the silver particles is greater than or equal to 20 nanometers and less than or equal to 200 nanometers; Preferably, the conductive silver paste further includes a binder, and the plurality of silver particles are mixed in the binder.

7. The display module according to claim 1, characterized in that: The display screen includes a hard screen.

8. A method for assembling a display module, characterized in that: include: A circuit board is flip-chip mounted on the non-display side of the display screen, wherein the display screen includes a first conductive pad and the circuit board includes a second conductive pad; A conductive layer is prepared on the first side wall of the display screen and the second side wall of the circuit board, and the conductive layer extends to both ends to contact the first conductive pad and the second conductive pad respectively.

9. The assembly method according to claim 8, characterized in that: The step of preparing a conductive layer on the first side wall of the display screen and the second side wall of the circuit board comprises: Using a 3D printing process, preparing the conductive layer on the first side wall of the display screen and the second side wall of the circuit board; Preferably, the assembly method further comprises: A polarizer is attached to the display side of the display screen, and a distance between the fourth side wall of the polarizer and the first conductive pad is greater than or equal to 0 mm and less than 0.8 mm.

10. A display device, characterized in that: A display module comprising any one of claims 1 to 7 or a display module obtained according to the assembly method of claim 8 or 9.

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