PC (Personal Computer) built-in mainboard structure and interactive intelligent tablet

Abstract

A PC built-in mainboard structure (100) and an interactive smart tablet (1000), comprising a mainboard (10) and a heat dissipation assembly (20). A PC module (11) is integrated on the mainboard (10), and the PC module (11) comprises a chip (111). The heat dissipation assembly (20) comprises a heat conduction sheet (21), a heat conduction pipe (22), a heat dissipation sheet (23) and a fan (24), the heat conduction sheet (21) is attached to the chip (111), the heat conduction pipe (22) is connected between the heat conduction sheet (21) and the heat dissipation sheet (23), and the fan (24) is arranged on the mainboard (10) and faces the chip (111). The PC module (11) is directly integrated on the mainboard (10), the structure that the PC module (11) is arranged in the mainboard (10) is adopted, the structure is simpler and more compact, and the plugging space of the PC module (11) and the mainboard (10) can be reduced. Moreover, through solid heat conduction of the heat conduction sheet (21), the heat conduction pipe (22) and the heat dissipation sheet (23) and heat conduction of air blown by the fan (24), heat dissipation of the chip (111) can be accelerated, and heat dissipation efficiency of the chip (111) can be improved.

Description

PC built-in motherboard structure and interactive smart tablet Technical Field

[0001] The embodiments of the present application relate to the technical field of display devices, and in particular to a PC built-in motherboard structure and an interactive smart tablet. Background Art

[0002] With technological advancements and people's needs, interactive smart tablets are becoming increasingly powerful. These devices are integrated devices that use touch technology to control content displayed on the display and enable human-computer interaction. They combine multiple functions, including a television, computer, projector, electronic whiteboard, audio, and video conferencing terminals. To realize these functions, the interactive smart tablet requires the installation of various functional modules, such as a PC (Personal Computer) module.

[0003] Traditional PC modules are typically integrated into a PC board, which is connected to the mainboard via a plug-and-socket mechanism. Interactive smart tablets require space inside to allow for these connections, resulting in a complex structure. Furthermore, when the PC module is operating, it generates significant heat. If this heat cannot be dissipated promptly, it can affect the stability of the PC module and, in turn, the interactive smart tablet.

[0004] Summary of the Invention

[0005] The embodiments of the present application aim to provide a PC built-in motherboard structure and an interactive smart tablet, which can improve the complex internal structure of the interactive smart tablet and enhance the heat dissipation effect.

[0006] In order to solve the technical problems, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, the present application proposes a PC built-in motherboard structure, comprising a motherboard and a heat dissipation assembly. The motherboard has a PC module integrated thereon, and the PC module includes a chip. The heat dissipation assembly includes a thermal pad, a heat pipe, a heat sink, and a fan. The thermal pad is attached to the chip, the heat pipe is connected between the thermal pad and the heat sink, and the fan is disposed on the motherboard and faces the chip.

[0008] In this technical solution, the PC module is directly integrated into the motherboard. This simpler and more compact structure reduces the space required to plug and unplug the PC module from the motherboard. Furthermore, through solid heat conduction through the heat sink, heat pipe, and heat sink, as well as gas heat conduction through the fan, heat dissipation from the chip is accelerated, improving heat dissipation efficiency.

[0009] In some preferred embodiments, the PC built-in motherboard structure further includes a reinforcement assembly. The motherboard includes a first surface and a second surface disposed opposite each other in a first direction. The PC module is integrated into the first surface, and the reinforcement assembly encloses a first reinforcement area on the second surface. When viewed along the first direction, the projection of the chip lies within the first reinforcement area. The reinforcement assembly reduces motherboard deformation, thereby preventing damage to the chip or other electronic components caused by stress generated by motherboard deformation.

[0010] In some preferred embodiments, the PC built-in motherboard structure further includes a plurality of cushioning pads. These cushioning pads are disposed on the motherboard and define a first mounting area on the motherboard, where the chip is mounted. The thermal pad is attached to the chip, with the cushioning pads supported between the thermal pad and the motherboard. The cushioning pads position the chip to facilitate installation and act as a buffer when the motherboard shakes or the fan rotates, reducing friction between the thermal pad and the chip.

[0011] In some preferred embodiments, the heat dissipation assembly further includes a heat dissipation base, the heat dissipation base being mounted on the mainboard, the heat pipe being connected to the heat dissipation base, and the heat sink being mounted on the heat dissipation base. The heat sink being mounted on the heat dissipation base increases the contact area, and the heat dissipation base can improve heat dissipation while supporting the heat sink.

[0012] In some preferred embodiments, the PC built-in motherboard structure further includes a thermally conductive silicone pad disposed between the heat sink and the motherboard, with the heat pipe disposed between the heat sink and the pad. Supporting the heat sink with the pad reduces frictional scratches on the motherboard caused by the heat sink. Furthermore, the pad, located between the heat sink and the pipe, increases the contact area between the pipe, the heat sink, and the pad, thereby improving heat transfer efficiency.

[0013] In some preferred embodiments, a layer of thermal grease is provided between the thermal pad and the chip. This layer of thermal grease fills the mounting gap between the chip and the thermal pad, further improving heat transfer efficiency. The thermal grease also serves as a buffer, reducing the impact of the thermal pad on the chip and thus minimizing damage to the chip from direct contact.

[0014] In some preferred embodiments, the PC built-in motherboard structure further includes an air intake ring disposed on the fan and surrounding the fan's air inlet. The air intake ring can block some of the hot air flow generated by the chip, thereby reducing the backflow of hot air to the chip and ensuring better heat dissipation.

[0015] In some preferred embodiments, the PC built-in motherboard structure further includes an air outlet connected to the heat sink. Solid heat conduction through the heat sink, heat pipe, heat sink base, and heat sink, as well as gas heat conduction from the fan, accelerates heat dissipation and improves the chip's heat dissipation efficiency. The air outlet can be positioned away from or away from the air inlet ring to reduce the amount of hot air discharged from the air outlet being reabsorbed by the fan, preventing hot air backflow and improving heat dissipation.

[0016] In some preferred embodiments, a plurality of studs are further provided on the mainboard, and the plurality of studs define a first integrated area on the first surface, and the chip is integrated in the first integrated area. The stud includes a first end face and a second end face arranged opposite to each other in a first direction, the first end face protruding from the first surface, and the second end face protruding from the second surface. The first end face is provided with a first threaded hole, which is configured to be locked with the fan, and the second end face is provided with a second threaded hole, which is configured to be locked with the reinforcement component. The screw connection is convenient for installation and disassembly, and the use of a stud structure with threaded holes on both sides facilitates the simultaneous installation and disassembly of the fan and the reinforcement component, facilitating subsequent maintenance.

[0017] In a second aspect, the present application also proposes an interactive smart tablet comprising a housing and a PC built-in motherboard structure as described in any embodiment of the first aspect. The PC built-in motherboard structure is disposed within the housing, which is provided with an air inlet and an air outlet. The air inlet ring of the PC built-in motherboard structure is affixed to the housing and arranged around the air inlet. The air inlet ring can isolate the internal environment. When the fan is operating, due to the isolation of the air inlet ring, the hot air flow inside the housing cannot reach the air inlet. The fan can only enter through the air inlet from outside the housing through the air inlet, thereby preventing hot air from flowing back. The air outlet nozzle of the PC built-in motherboard structure is connected to the air outlet. Under the action of the fan, the heat inside the housing can be discharged through the air outlet nozzle and out of the air outlet, thereby accelerating heat dissipation. The interactive smart tablet of this embodiment has an excellent heat dissipation effect. The air outlet nozzle is arranged away from or in a direction away from the air inlet to prevent hot air from being re-inhaled by the fan, further reducing hot air backflow. At the same time, since the PC built-in motherboard structure adopts a four-in-one motherboard structure with a TV module, power module, backlight module and PC module, it can further ensure the compact structure to meet the miniaturization design requirements of interactive smart tablets.

[0018] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] FIG1 is a schematic structural diagram of a PC built-in motherboard structure according to some embodiments of the present application;

[0021] FIG2 is an exploded schematic diagram of a PC built-in motherboard structure according to some embodiments of the present application;

[0022] FIG3 is a top view and an AA cross-sectional view of a PC built-in motherboard structure according to some embodiments of the present application;

[0023] FIG4 is a partial enlarged view of point M in FIG3 ;

[0024] FIG5 is a schematic diagram of the installation of a chip and a mainboard according to some embodiments of the present application;

[0025] FIG6 is a schematic structural diagram of a PC built-in mainboard structure according to some embodiments of the present application;

[0026] FIG7 is a partial enlarged view of point N in FIG6;

[0027] FIG8 is a schematic structural diagram of a PC built-in mainboard structure according to some embodiments of the present application;

[0028] FIG9 is a schematic diagram of the installation of studs on a mainboard according to some embodiments of the present application;

[0029] FIG10 is a top view and a BB cross-sectional view of a PC built-in motherboard structure according to some embodiments of the present application;

[0030] FIG11 is a partial enlarged view of L in FIG10 ;

[0031] FIG12 is an exploded schematic diagram of an interactive smart tablet according to some embodiments of the present application;

[0032] FIG13 is a top view and CC cross-sectional view of an interactive smart tablet according to some embodiments of the present application;

[0033] FIG14 is a partial enlarged view of point H in FIG13 .

[0034] Explanation of reference numerals: 100, PC built-in motherboard structure; 10, motherboard; 10a, first surface; 10b, second surface; 11, PC module; 111, chip; 112, memory module; 113, hard disk; 20, heat dissipation assembly; 21, heat conductive sheet; 22, heat pipe; 23, heat sink; 24, fan; 25, fan bracket; 26, heat dissipation base; 27, air inlet ring; 28, air outlet nozzle; 30, thermal grease layer; 40, buffer pad; 40a, first mounting area; 50, thermal conductive silicone pad; 51, first through hole; 60, reinforcement assembly; 60a, first reinforcement area; 61, connecting rod; 70, stud; 70a, first integration area; 71, first end surface; 72, second end surface; 73, first threaded hole; 74, second threaded hole; 1000, interactive smart tablet; 200, housing; 210, air inlet; 220, air outlet; X, first direction. DETAILED DESCRIPTION

[0035] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0036] In the description of the embodiments of this application, the technical terms "first," "second," etc. are used only to distinguish different objects and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise specifically defined.

[0037] In the description of the embodiments of the present application, the terms "plurality" and "several" refer to two or more (including two). The terms "including" and "having" and any variations thereof in the specification and claims of the present application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0038] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", and "fixing" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements.

[0039] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive with other embodiments. Furthermore, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not conflict with each other.

[0040] First, embodiments of the present application provide a PC built-in motherboard structure 100. Referring to Figures 1 and 2, the PC built-in motherboard structure 100 includes a motherboard 10 and a heat dissipation assembly 20. The motherboard 10 is integrated with a PC module 11, and the heat dissipation assembly 20 is capable of dissipating heat from the PC module 11 to ensure stable operation of the PC module 11. It should be noted that "integrated" also means self-contained. For example, a motherboard 10 with its own graphics card is called an integrated graphics card. In the embodiments of the present application, the motherboard 10 is integrated with the PC module 11, meaning that the motherboard 10 has the PC module 11 built into it and the PC module 11 is built into the motherboard 10.

[0041] Regarding the motherboard 10, referring to FIG2 , the PC module 11 is built into the motherboard 10, for example, the PC module 11 is directly integrated onto the motherboard 10. Along the thickness direction (first direction X) of the motherboard 10, the motherboard 10 includes a first surface 10a and a second surface 10b disposed opposite each other. The PC module 11 can be directly integrated onto the first surface 10a of the motherboard 10. The PC module 11 is a highly integrated computer module, typically including a chip 111, a memory module 112, and a hard disk 113. The chip 111 can be directly integrated onto the motherboard 10 via a surface mount process. For components such as the memory module 112 and the hard disk 113, a memory socket (not shown) and a hard disk socket (not shown) can be pre-fabricated on the motherboard 10. The memory module 112 can then be plugged into the memory socket via a surface mount process, and the hard disk 113 can be positioned and plugged into the hard disk socket via a surface mount process. This completes the assembly of the PC module 11 onto the motherboard 10. It is understood that the SMT process refers to the process of mounting components on the motherboard 10. This process is typically performed using SMT (Surface Mount Technology) equipment, including SMT machines, reflow ovens, and other equipment. The SMT process can improve the production efficiency and quality of the motherboard 10, shorten the product manufacturing cycle, and achieve smaller, lighter, and more energy-efficient product designs. Furthermore, in this embodiment, the PC module 11 is directly integrated into the motherboard 10, resulting in a simpler and more compact structure, which reduces the space required for plugging and unplugging the PC module 11 and the motherboard 10.

[0042] In other embodiments, the mainboard 10 may also integrate a TV module (not shown), a power module (not shown), and a backlight module (not shown). A TV module is a highly integrated television mainboard module that includes components such as a processor, memory, a video decoder, an audio decoder, and a tuner. It features small size, low power consumption, and ease of maintenance and upgrades. A power module is the module responsible for power supply, typically consisting of a DC power supply and an AC power supply. It is responsible for converting the input AC power into a suitable DC power supply while also ensuring the stability and reliability of the output voltage and current. A backlight module is the module that provides the screen's backlight. It typically includes a backlight source, a driver circuit, and a control circuit. The backlight source can be an LED or CCFL lamp, with the backlight brightness and color controlled by the driver and control circuits. The four-in-one mainboard 10 structure, comprising a TV module, a power module, a backlight module, and a PC module 11, further ensures a compact structure and simplifies the design and production process of the PC built-in mainboard structure 100, improving production efficiency and product quality.

[0043] With reference to Figures 1 and 2 , the heat dissipation assembly 20 provides a heat dissipation channel for the PC module 11, dissipating heat generated by the PC module 11 during operation to the outside world, thereby ensuring stable operation and extending the service life of the PC module 11. The heat dissipation assembly 20 includes a heat conducting sheet 21, a heat pipe 22, a heat sink 23, and a fan 24.

[0044] The heat conducting sheet 21 can be made of a flat heat conducting metal sheet such as a copper sheet or an aluminum sheet, or can be made of non-metallic materials such as ceramics and silicone. The main function of the heat conducting sheet is to quickly conduct heat to improve the heat dissipation efficiency and reduce the temperature. The chip 111 serves as the main heat source. The heat conducting sheet 21 can be fitted on the chip 111, and the heat conducting sheet 21 can completely cover the chip 111 to increase the contact area with the chip 111, which can facilitate the heat generated by the chip 111 to be conducted to the heat conducting sheet 21. Please further refer to Figures 3 and 4. A thermal grease layer 30 can also be set between the heat conducting sheet 21 and the chip 111. The thermal grease layer 30 can fill the installation gap between the chip 111 and the heat conducting sheet 21 to further improve the heat conduction efficiency. In addition, the thermal grease layer 30 can also serve as a buffer to prevent the chip 111 from being worn due to the direct pressing of the heat conducting sheet 21 on the chip 111.

[0045] One end of the heat pipe 22 is connected to the thermal pad 21, and the other end is connected to the heat sink 23. The heat pipe 22 can also be made of a heat-conducting metal material such as copper or aluminum, or a non-metallic material such as ceramic or silicone. The heat pipe 22 has a heat transfer channel (not shown). The heat generated by the chip 111 is transferred from the thermal pad 21 to the heat pipe 22 and ultimately dissipated from the heat sink 23, thereby improving the heat dissipation of the chip 111 and ensuring its stable operation.

[0046] The fan 24 is positioned facing the chip 111, meaning that the fan 24 can blow air directly toward the chip 111 and the heat conducting plate 21. This accelerates air flow, ensuring rapid heat dissipation from the chip 111 and the heat conducting plate 21, thereby further improving the heat dissipation efficiency of the chip 111. The fan 24 can be mounted on the motherboard 10 via a fan bracket 25, which can be screwed to the motherboard 10. For example, two fan brackets 25 can be mounted on either side of the chip 111, and the fan 24 can be directly mounted on the two fan brackets 25. The air outlet of the fan 24 is positioned facing the chip 111 and the heat conducting plate 21, while the air inlet is positioned away from the chip 111 and the heat conducting plate 21. The fan 24 can draw in external cold air and blow it toward the chip 111 and the heat conducting plate 21, thereby alleviating the temperature rise of the chip 111. Optionally, the fan bracket 25 can also be installed on any two sides, three sides of the chip 111 or directly surround the chip by means of clipping, bonding, etc., so as to set up the fan 24, so that a spacing space is formed between the fan 24 and the chip 111 and the heat conducting plate 21. The spacing space provides a blowing channel for the fan 24 to the chip 111 and the heat conducting plate 21, thereby improving the heat dissipation efficiency.

[0047] Referring to Figures 3 to 5 , the PC built-in motherboard structure 100 further includes a plurality of buffer pads 40 . The buffer pads 40 are disposed on the motherboard 10 and define a first mounting area 40a on the first surface 10a of the motherboard 10. The chip 111 is disposed in the first mounting area 40a. For example, three buffer pads 40 may be included, enclosing and forming a triangular mounting area 40a. The chip 111 is sandwiched between the three buffer pads 40 . The positioning of the chip 111 by the buffer pads 40 facilitates its installation. The mounting area 40a enclosed by the buffer pads 40 is not unique and can be configured based on the specific shape of the chip 111. For example, if the chip 111 is circular, the mounting area 40a enclosed by the buffer pads 40 can also be circular.

[0048] The thermal pad 21 is attached to the chip 111, and the buffer pad 40 is supported between the thermal pad 21 and the motherboard 10. The buffer pad 40 slightly protrudes from the chip 111 to support the thermal pad 21. When the motherboard 10 shakes, the buffer pad 40 can act as a buffer to reduce friction between the thermal pad 21 and the chip 111. Furthermore, when the fan 24 rotates, the buffer pad 40 can reduce the dynamic or instantaneous impact force on the chip 111 caused by the fan 24 vibration, thereby reducing damage to the chip 111. At the same time, some of the heat generated by the chip 111 can be directly transferred to the motherboard 10 through the buffer pad 40 and dissipated through the motherboard 10, thereby improving the heat dissipation effect of the chip 111.

[0049] In some embodiments, the heat dissipation assembly 20 further includes a heat dissipation base 26. Referring to FIG. 2 , the heat dissipation base 26 is disposed on the mainboard 10. The heat pipe 22 is connected to the heat dissipation base 26, and the heat sink 23 is disposed on the heat dissipation base 26. The heat dissipation base 26 can be fastened to the first surface 10a of the mainboard 10 by means of spring screws, or fixed to the first surface 10a by means of clamping, bonding, or the like. The heat sink 23 can be directly disposed on the heat dissipation base 26. The heat dissipation base 26 can also be made of a heat-conducting metal material such as copper or aluminum, or made of a non-metallic material such as ceramic and silicone. While supporting the heat sink 23, the heat dissipation effect can be improved. For example, the heat sink 23 includes a plurality of fins (not shown in the figure), and the plurality of fins are directly connected to the heat dissipation base 26, which can increase the contact area between the heat sink 23 and the heat dissipation base 26 to facilitate heat conduction. At the same time, adjacent fins are spaced apart to provide a heat dissipation space between the adjacent fins, thereby accelerating the heat dissipation of the fins. Optionally, the heat sink 23 and the heat sink base 26 may be integrally formed, or a heat conducting layer (not shown in the figure) may be provided between the heat sink 23 and the heat sink base 26 to further accelerate heat conduction.

[0050] One end of the heat pipe 22 can be welded to the end of the thermal pad 21 facing away from the chip 111. The other end extends to and is welded to the heat sink 26. The heat pipe 22 can be bent on the heat sink 26 or the thermal pad 21 to increase the contact area and improve heat transfer efficiency. Heat generated by the chip 111 is transferred through the thermal pad 21 and the heat pipe 22 to the heat sink 26, where it is dissipated through the heat sink 23.

[0051] In some embodiments, the heat dissipation assembly 20 further includes an air inlet ring 27. Referring to FIG. 2 , the air inlet ring 27 is disposed on the fan 24 and surrounds the air inlet of the fan 24. The air inlet ring 27 can block part of the hot air flow generated by the chip 111, thereby reducing the backflow of hot air to the chip 111.

[0052] Continuing to refer to FIG. 2 , the PC built-in motherboard structure 100 further includes an air outlet 28, which is connected to the heat sink 23. When the chip 111 generates heat during operation, the heat conducting sheet 21 can transfer this heat to the heat pipe 22, and then to the heat sink base 26 via the heat pipe 22. The heat sink base 26 then transfers the heat to the heat sink 23. The fan 24 continuously blows air toward the chip 111 and the heat conducting sheet 21, which can accelerate the flow of gas, and the hot air flow can eventually be discharged from the air outlet 28. Through the solid heat conduction of the heat sink 23, the heat pipe 22, the heat sink base 26, and the heat sink 23, and the gas heat conduction blown by the fan 24, the heat dissipation can be accelerated, thereby improving the heat dissipation efficiency of the chip 111. The air outlet direction of the air outlet 28 is set away from or away from the above-mentioned air inlet ring 27 to further prevent heat backflow.

[0053] Referring to Figures 6 and 7 , in some embodiments, the PC built-in motherboard structure 100 further includes a thermally conductive silicone pad 50 disposed between the heat sink 26 and the motherboard 10. Supporting the heat sink 26 with the thermally conductive silicone pad 50 reduces frictional damage to the motherboard 10 caused by the heat sink 26. Furthermore, the thermally conductive silicone pad 50 directly transfers some of the heat from the heat sink 26 to the motherboard 10, which then dissipates the heat to the outside. The solid heat transfer channel formed by the thermally conductive silicone pad 50 and the motherboard 10 further reduces the temperature rise of the chip 111.

[0054] The heat pipe 22 is disposed between the heat sink base 26 and the thermally conductive silicone pad 50. For example, a first through hole 51 is formed between the thermally conductive silicone pad 50 and the heat sink base 26. The heat pipe 22 is partially inserted into the first through hole 51, allowing the thermally conductive silicone pad 50 and the heat sink base 26 to partially enclose the heat pipe 22. This increases the contact area between the heat pipe 22, the heat sink base 26, and the thermally conductive silicone pad 50, thereby improving heat conduction efficiency. Heat received by the thermally conductive silicone pad 50 is transferred to the heat sink base 26 and ultimately dissipated through the heat sink 23.

[0055] Referring to Figures 2 and 8 , in some embodiments, the PC built-in motherboard structure 100 further includes a reinforcing member 60 . The reinforcing member 60 is disposed on the second surface 10b of the motherboard 10 and defines a first reinforcing region 60a on the second surface 10b. When viewed from the direction from the first surface 10a to the second surface 10b (a first direction X), the projection of the chip 111 is located within the first reinforcing region 60a. The reinforcing member 60 reduces deformation of the motherboard 10, thereby preventing damage to the chip 111 or other electronic components caused by stress generated by the deformation of the motherboard 10.

[0056] The reinforcement component 60 can be a reinforcement plate or a reinforcement bracket. Taking the reinforcement bracket as an example, the reinforcement bracket includes four connecting rods 61. The four connecting rods 61 are interconnected and together enclose a rectangular first reinforcement area 60a on the second surface 10b. On the first surface 10a, the projection of the chip 111 is located in the first reinforcement area 60a. The reinforcement bracket can reduce the bending deformation of the mainboard 10, thereby reducing damage to the chip 111. It is understandable that in some other embodiments, the reinforcement bracket can also enclose a first reinforcement area 60a in a circular, elliptical or triangular shape, etc., and this application does not limit this. When the reinforcement component 60 is a reinforcement plate, the reinforcement plate is arranged on the second surface 10b, and the reinforcement plate itself forms the first reinforcement area 60a, which can reduce the bending deformation of the mainboard 10 to protect the chip 111.

[0057] Referring to Figures 9 to 11 , in some embodiments, the motherboard 10 is further provided with a plurality of studs 70. These studs 70 define a first integration area 70a on the first surface 10a, and the chip 111 is integrated into the first integration area 70a. For example, four studs 70 may be included, and each of the four studs 70 may be welded to the motherboard 10 via a welding process. The four studs 70 may define a square first integration area 70a on the first surface 10a of the motherboard 10, and the chip 111 may be directly disposed in the first integration area 70a.

[0058] Along the thickness direction (first direction X) of the mainboard 10, the stud 70 includes a first end face 71 and a second end face 72, which are oppositely disposed. The first end face 71 protrudes from the first surface 10a, and the second end face 72 protrudes from the second surface 10b. The first end face 71 defines a first threaded hole 73, which is configured to be fastened to the fan 24. For example, the fan bracket 25 is directly fastened to the first end face 71 of each stud 70 via screws, and the fan 24 is then mounted on the fan bracket 25. The second end face 72 defines a second threaded hole 74, which is configured to be fastened to the reinforcement assembly 60. For example, the reinforcement assembly 60 also defines a plurality of threaded holes (not shown) or through holes (not shown). Screws are inserted through the threaded holes or through holes of the reinforcement assembly 60 and threadedly connected to the second threaded holes 74, thereby fastening the reinforcement assembly 60 to the second end face 72 of each stud 70. The stud 70 structure with threaded holes on both sides can facilitate the installation of the fan 24 and the reinforcement component 60.

[0059] In the embodiment of the present application, PC module 11 is directly integrated into motherboard 10. This design makes the PC module 11 built into motherboard 10 simpler and more compact, reducing the space required to plug and unplug the PC module 11 and motherboard 10. Furthermore, solid heat conduction through heat sink 23, heat pipe 22, and heat sink 23, as well as gas heat conduction through fan 24, accelerates heat dissipation from chip 111, improving the chip 111's heat dissipation efficiency. Furthermore, the use of reinforcement assembly 60 reduces deformation of motherboard 10, thereby preventing damage to chip 111 caused by stress generated by deformation of motherboard 10.

[0060] In a second aspect, embodiments of the present application also provide an interactive smart tablet 1000. Referring to FIG. 12 , the interactive smart tablet 1000 includes a housing 200 and a PC built-in motherboard structure 100 as described in any of the embodiments of the first aspect. The PC built-in motherboard structure 100 is disposed within the housing 200, which defines an air inlet 210 and an air outlet 220. An air inlet ring 27 of the PC built-in motherboard structure 100 is affixed to the housing 200 and surrounds the air inlet 210, insulating the interior. When the fan 24 is operating, the air inlet ring 27 prevents hot air from flowing from within the housing 200 through the air inlet 210 due to the insulation provided by the air inlet ring 27. Instead, the fan 24 allows only cool air to enter from outside the housing 200 through the air inlet 210, preventing backflow of hot air. The air outlet 28 of the PC built-in motherboard structure 100 communicates with the air outlet 220. Heat from within the housing 200 is discharged through the air outlet 220 by the fan 24, thereby accelerating heat dissipation. The interactive smart tablet 1000 of the present embodiment has excellent heat dissipation. Furthermore, the air outlet 28 is positioned away from or facing away from the air inlet 210 to prevent hot air from being re-inhaled by the fan 24, further reducing hot air backflow. Furthermore, because the PC-based motherboard structure 100 utilizes a four-in-one motherboard 10 structure that integrates a TV module, power module, backlight module, and PC module 11, it further ensures a compact structure, thereby meeting the miniaturization design requirements of the interactive smart tablet 1000.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Based on the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present application as described above. For the sake of simplicity, they are not provided in detail. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A PC built-in motherboard structure, characterized in that: include: A mainboard, wherein a PC module is integrated on the mainboard, and the PC module includes a chip; The heat dissipation component includes a heat conductive sheet, a heat conductive pipe, a heat sink and a fan. The heat conductive sheet is attached to the chip, the heat conductive pipe is connected between the heat conductive sheet and the heat sink, and the fan is connected to the mainboard and arranged facing the chip.

2. The PC built-in motherboard structure according to claim 1, characterized in that: The PC built-in motherboard structure also includes a reinforcement component; The main board includes a first surface and a second surface arranged opposite to each other in a first direction; The PC module is integrated into the first surface; The reinforcement component encloses a first reinforcement area on the second surface; When viewed along the first direction, the projection of the chip is located within the first reinforcement region.

3. The PC built-in motherboard structure according to claim 1, characterized in that: The PC built-in motherboard structure also includes a number of buffer pads; The plurality of buffer pads are arranged on the mainboard, and the plurality of buffer pads define a first mounting area on the mainboard, and the chip is arranged in the first mounting area; The heat conducting sheet is attached to the chip, and the buffer pad is supported between the heat conducting sheet and the mainboard.

4. The PC built-in motherboard structure according to claim 1, characterized in that: The heat dissipation assembly further includes a heat dissipation base, the heat dissipation base is arranged on the mainboard, the heat conduction pipe is connected to the heat dissipation base, and the heat sink is arranged on the heat dissipation base.

5. The PC built-in motherboard structure according to claim 4, characterized in that: The PC built-in motherboard structure further includes a thermally conductive silicone pad, which is arranged between the heat dissipation base and the motherboard, and the heat pipe is arranged between the heat dissipation base and the thermally conductive silicone pad.

6. The PC built-in motherboard structure according to claim 1, characterized in that: A thermally conductive silicone grease layer is arranged between the thermally conductive sheet and the chip.

7. The PC built-in motherboard structure according to claim 1, characterized in that: The heat dissipation component also includes an air inlet ring, which is arranged on the fan and surrounds the air inlet of the fan.

8. The PC built-in motherboard structure according to claim 1, characterized in that: The PC built-in mainboard structure further includes an air outlet, and the air outlet is connected to the heat sink.

9. The PC built-in motherboard structure according to claim 2, characterized in that: The mainboard is further provided with a plurality of studs, the plurality of studs define a first integrated area on the first surface, and the chip is integrated in the first integrated area; The stud comprises a first end face and a second end face arranged opposite to each other in a first direction, the first end face protrudes from the first surface, and the second end face protrudes from the second surface; The first end surface is provided with a first threaded hole, and the first threaded hole is configured to be locked with the fan. The second end surface is provided with a second threaded hole, and the second threaded hole is configured to be locked with the reinforcement component.

10. An interactive smart tablet, characterized in that: A PC built-in mainboard structure comprising a housing and any one of claims 1 to 10; The PC built-in motherboard structure is arranged in the shell, the shell is provided with an air inlet hole and an air outlet hole, the air inlet ring of the PC built-in motherboard structure is attached to the shell and arranged around the air inlet hole, and the air outlet nozzle of the PC built-in motherboard structure is connected with the air outlet hole.

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