A microwave chip packaging device welding equipment and method

Abstract

This invention discloses a microwave chip packaging device welding equipment and method, relating to the field of microwave chip welding technology. It aims to solve the technical problem that circuit boards are easily affected by the temperature of the conveyor track itself, leading to inconsistent temperatures between the bottom and top of the circuit board, thus affecting the quality of the solder joints. The equipment includes a reflow oven body, which comprises a conveyor mechanism. The conveyor mechanism includes a conveyor belt, with fixed side plates arranged on the sides of the conveyor belt. Multiple sets of device support frames are arranged on the conveyor belt. Forward and reverse guide plates are arranged on the sidewalls of the fixed side plates. Each set of device support frames consists of a front frame and a rear frame. The front frame includes a lifting and positioning frame and multiple clamping components. This invention has the advantages of ensuring a relatively stable position of the circuit board inside the reflow oven, raising the circuit board body and keeping it above the conveyor belt, ensuring uniform heating from all angles, and improving welding quality.

Description

Technical Field

[0001] This invention relates to the field of microwave chip welding technology, and more specifically, to a microwave chip packaging device welding equipment and method. Background Technology

[0002] Reflow soldering is primarily used in surface mount technology. It involves heating microwave chip packages pre-placed on a circuit board to melt the solder paste, which is then cooled and solidified to achieve soldering. In the soldering of microwave chip packages, the reflow oven achieves soldering through precise temperature control of the soldering area. It typically has multiple temperature zones, each with independently set temperature and heating time. During operation, the circuit board enters from one end of the oven and passes through the preheating zone, reflow zone, and cooling zone sequentially along the conveyor track. In the preheating zone, the temperature gradually increases, causing the solvent in the solder paste to evaporate and reducing spatter and voids in the subsequent soldering process. In the reflow zone, the temperature reaches above the melting point of the solder alloy, causing the solder to melt and form a good connection between the component leads and the circuit board pads. The cooling zone then solidifies the molten solder, completing the soldering process.

[0003] In the soldering of microwave chip packaging devices, circuit boards are typically placed directly on a conveyor belt and transported to a reflow oven for heating. During transport, the circuit boards may shift due to vibrations from the conveyor equipment itself, potentially causing uneven heating across different temperature zones within the reflow oven and affecting the quality of the solder joints. Furthermore, as the conveyor belt continues to operate, its own temperature gradually increases due to the high temperature of the reflow oven, which may lead to temperature discrepancies between the bottom and top of the circuit board, resulting in uneven solder melting and further impacting the solder joint quality. Therefore, we propose a soldering equipment and method for microwave chip packaging devices. Summary of the Invention

[0004] The purpose of this invention is to provide a microwave chip packaging device welding equipment and method to solve the technical problem that the circuit board is easily affected by the temperature of the conveyor track itself, resulting in an inconsistency between the temperature at the bottom and top of the circuit board, which affects the quality of the welding points.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a microwave chip packaging device welding equipment, comprising a reflow oven body, the reflow oven body including a conveying mechanism, the conveying mechanism including a conveyor belt, fixed side plates symmetrically arranged on both sides of the conveyor belt, and multiple sets of arrayed device carriers arranged on the conveyor belt; wherein, the sidewalls of the fixed side plates are provided with forward guide plates and reverse guide plates; each set of device carriers consists of a front frame and a rear frame; the front frame includes a base frame connected to the top surface of the conveyor belt, a cover plate connected to the top of the base frame, a transmission assembly arranged inside the base frame, and a movably connected top of the cover plate to the transmission assembly. A movable lifting and positioning frame 1 has multiple clamping components arranged on its top; multiple device placement plates are arranged on one side wall of the lifting and positioning frame 1; multiple slots are opened from top to bottom on the sides of the device placement plates; the clamping components are arranged above the slots; multiple insert plates corresponding to the slots are connected to the top surface of the cover plate; the insert plates are used to control the clamping action of the clamping components through the extension and descent movement of the lifting and positioning frame 1; the forward guide plate is used to drive the transmission component pair to perform an upward operation of the lifting and positioning frame 1; and the reverse guide plate is used to drive the transmission component pair to perform a downward operation of the lifting and positioning frame 1.

[0006] Preferably, the forward guide plate is arranged at the lower end of the side wall of the fixed side plate, and the reverse guide plate is arranged above the forward guide plate; the top surface of the forward guide plate is provided with an outer rack and an inner rack, which are offset from each other; the bottom surface of the reverse guide plate is provided with an outer rack and an inner rack, which are offset from each other.

[0007] Preferably, the bottom surface of the base frame is connected to multiple fixed frames; the transmission assembly includes a rotating rod rotatably arranged among the multiple fixed frames, with each end of the rotating rod passing through the side wall of the base frame and connected to a gear; two worm gears are arranged on the outer circumference of the rotating rod; two worm wheels are rotatably connected to the bottom surface of the base frame, and the worm gears mesh with the worm wheels.

[0008] Preferably, a rotating cylinder is coaxially connected above the worm gear, and an arc-shaped groove is formed on the side wall of the rotating cylinder; multiple support cylinders are connected to the top surface of the cover plate, and the rotating cylinder is movably arranged in the inner cavity of the support cylinder, with multiple sliding protrusions arranged on the inner circumference of the support cylinder; a lifting column is movably arranged in the inner cavity of the rotating cylinder, and a sliding column is connected to the outer circumference of the lifting column, which is movably arranged in the arc-shaped groove; multiple sliding grooves that fit the shape of the sliding protrusions are formed on the outer circumference of the lifting column, and the lifting column slides in conjunction with the inner cavity of the support cylinder through the sliding grooves.

[0009] Preferably, the rear frame is arranged with the same structural components as the front frame; wherein, the rear frame includes a second lifting and positioning frame and a second transmission component; the second lifting and positioning frame and the first lifting and positioning frame are mutually symmetrical structural components; the second transmission component includes a second gear with the same structural components as the first gear, and the rotation directions of the second gear and the first gear are staggered.

[0010] Preferably, the outer rack one is used to mesh with the bottom of the gear one, driving the gear one to rotate in the forward direction; the inner rack one is used to mesh with the bottom of the gear two, driving the gear two to rotate in the forward direction; the outer rack two is used to mesh with the top of the gear one, driving the gear one to rotate in the reverse direction; the inner rack two is used to mesh with the top of the gear two, driving the gear two to rotate in the reverse direction.

[0011] Preferably, the bottom surface of the lifting positioning frame one is connected to the top surface of the lifting column; every two device placement plates form a group, the lifting positioning frame one and the lifting positioning frame two cooperate with each other, and the circuit board body is supported by the top of the two sets of mutually symmetrical device placement plates, the two sets of mutually symmetrical device placement plates position the four corners of the circuit board body, and the side wall of the device placement plate is set as a curved panel structure.

[0012] Preferably, the clamping assembly includes a clamping plate rotatably arranged on the inner sidewall of the slot and two arc-shaped columns connected to the top surface of the lifting positioning frame. The two arc-shaped columns are symmetrically distributed on both sides of the clamping plate. Slide cylinders are slidably sleeved on the arc-shaped columns. The slide cylinders on the two arc-shaped columns are connected by a connecting rod. The connecting rod is connected to the sidewall of the clamping plate. An arc-shaped spring is also sleeved on the arc-shaped column. The arc-shaped spring is arranged between the slide cylinder and the lifting positioning frame.

[0013] Preferably, a rotating cylinder is rotatably connected to the top of the insert plate, the rotating cylinder is arranged below the clamping plate, and the side wall of the clamping plate is configured as an arc surface structure.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. This invention designs a support frame with lifting and clamping positioning functions. When the circuit board body enters the reflow oven body for soldering, the circuit board body can be clamped and fixed by the clamping components of the support frame. This ensures that the position of the circuit board body inside the reflow oven body is relatively stable, avoiding uneven heating caused by positional displacement of the circuit board body, which would affect the quality of the solder joints. At the same time, the circuit board body can be lifted by the support frame to above the conveyor belt inside the reflow oven body, keeping the circuit board body away from the conveyor belt. This avoids the circuit board body being easily affected by the conveyor belt, which could cause uneven temperature at the bottom and top of the circuit board body, resulting in uneven solder melting and affecting the quality of the solder joints. In addition, being above the conveyor belt ensures that the circuit board body is heated evenly from all angles, improving the soldering quality.

[0016] 2. In this invention, when gear one rotates in the forward direction, gear one drives the rotating rod to rotate. The rotating rod drives the worm wheel to rotate through the worm gear. The worm wheel drives the rotating cylinder to rotate inside the support cylinder. The arc groove of the rotating cylinder drives the sliding column to move upward, further driving the lifting column to slide upward along the sliding protrusion of the support cylinder, thereby driving the lifting positioning frame one to rise. This causes the circuit board body on the top of the device placement board to rise, and the circuit board body moves away from the conveyor belt and enters the space above the conveyor belt. Since the worm wheel is difficult to drive the worm gear to rotate, the lifting column can maintain a stable state after rising, making it difficult for it to fall due to its own gravity. This achieves the function of locking the state after rising, further enabling the circuit board body to maintain a relatively stable state after rising, thereby improving the stability of welding.

[0017] 3. This invention further includes an outer rack and an inner rack arranged in a staggered manner on the top surface of the forward guide plate, and an outer rack and an inner rack arranged in a staggered manner on the bottom surface of the reverse guide plate. The rotation directions of the second gear and the first gear are staggered, allowing the device support frame to simultaneously engage with the outer rack and inner rack on the top surface of the forward guide plate after entering the reflow oven body. The outer rack drives the first gear to rotate forward, and the inner rack drives the second gear to rotate forward, enabling the lifting and positioning frames one and two to rise simultaneously, placing the device on the top of the plate. The circuit board body rises and moves away from the conveyor belt. After the welding operation is completed, the conveyor belt transports the component carrier to the output end of the reflow oven body. This allows the gear one of the front frame and the gear two of the rear frame to mesh with the outer rack two and the inner rack two on the bottom surface of the reverse guide plate, respectively. The outer rack two drives the gear one to rotate in the opposite direction, and the inner rack two drives the gear two to rotate in the opposite direction. This enables the lifting and positioning frame one and the lifting and positioning frame two to descend simultaneously. This allows the circuit board body to be automatically lifted and lowered during the forward transport of the carrier inside the reflow oven body, making the entire welding process more convenient.

[0018] 4. This invention, through the design of the clamping assembly, utilizes the upward movement of lifting positioning frame one and lifting positioning frame two to allow the insert plate to gradually leave the slot, causing the bottom surface of the clamping plate to lose the support of the insert plate. The sliding cylinder, under the elastic force of the arc spring, slides along the arc column, and further drives the clamping plate to rotate via the connecting rod, causing the clamping plate to gradually press down on the top surface of the circuit board body. The four clamping plates form a clamping effect at the four corners of the top surface of the circuit board body. When lifting positioning frame one and lifting positioning frame two descend, the insert plate can be gradually inserted into the slot. The rotating cylinder at the top of the insert plate pushes the clamping plate to rotate and open, causing the four clamping plates to lose their clamping effect on the circuit board body. This not only realizes the linkage function with lifting positioning frame one and lifting positioning frame two, enabling the clamping assembly to automatically clamp or release, providing convenience for the welding process, but also ensures the stability and reliability of welding through the clamping effect at the four corners of the top surface of the circuit board body.

[0019] 5. This invention uses two sets of mutually symmetrical device placement plates to position the four corners of the circuit board body, so that the circuit board body can remain stable on the top surface of the device placement plate and is not prone to shaking or positional displacement. Furthermore, by setting the side wall of the device placement plate to a curved panel structure, when the device placement plate rotates with the conveyor belt during the unloading process, it is less likely to scratch the circuit board body when it is detached from the circuit board body through the curved panel structure, thus protecting the circuit board body. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the top structure of the conveyor belt of the present invention;

[0022] Figure 3 This is a schematic diagram of the fixed side plate structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the device support frame and forward guide plate structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the device support frame and reverse guide plate structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the top of the forward guide plate and the bottom of the reverse guide plate of the present invention;

[0026] Figure 7 This is a schematic diagram of the front frame structure of the present invention;

[0027] Figure 8 This is a schematic diagram of the lifting and positioning frame of the present invention;

[0028] Figure 9This is a schematic diagram of the disassembled front frame structure of the present invention;

[0029] Figure 10 This is an enlarged schematic diagram of the transmission component of the present invention;

[0030] Figure 11 This is an enlarged schematic diagram of a disassembled structure of the transmission component of the present invention;

[0031] Figure 12 This is a schematic diagram of the bottom structure of the lifting column of the present invention;

[0032] Figure 13 This is a schematic diagram of the support cylinder and insert plate structure of the present invention;

[0033] Figure 14 This is a schematic diagram of the clamping component structure of the present invention;

[0034] Figure 15 This is a schematic diagram of one usage state of the present invention.

[0035] Explanation of the labels in the diagram:

[0036] 1. Reflow oven body; 2. Conveying mechanism; 3. Conveyor belt; 4. Fixed side plate; 5. Component support frame; 6. Front frame; 7. Rear frame; 8. Circuit board body;

[0037] 41. Forward guide plate; 42. Reverse guide plate;

[0038] 4101 External rack one; 4102 Internal rack one; 4201 External rack two; 4202 Internal rack two;

[0039] 61. Base frame; 62. Cover plate; 63. Transmission assembly 1; 64. Lifting and positioning frame 1; 65. Clamping assembly; 66. Insert plate;

[0040] 6101, Fixing frame; 6201, Support cylinder; 6202, Sliding protrusion; 6301, Rotating rod; 6302, Gear 1; 6303, Worm gear; 6304, Worm wheel; 6305, Rotating cylinder; 63051, Arc groove; 6306, Lifting column; 6307, Sliding column; 6308, Sliding groove; 6401, Component placement plate; 6402, Slot; 6501, Clamping plate; 6502, Arc column; 6503, Sliding cylinder; 6504, Connecting rod; 6505, Arc spring; 6601, Rotating cylinder;

[0041] 71. Lifting and positioning frame two; 72. Transmission assembly two; 7201. Gear two. Detailed Implementation

[0042] Example 1, as Figures 1 to 15As shown, the present invention relates to a microwave chip packaging device welding equipment, including a reflow oven body 1, the reflow oven body 1 including a conveying mechanism 2, the conveying mechanism 2 including a conveyor belt 3, fixed side plates 4 symmetrically arranged on both sides of the conveyor belt 3, the fixed side plates 4 being fixed to the top of the conveying mechanism 2 by screws, and multiple sets of arrayed device carriers 5 arranged on the conveyor belt 3. The reflow oven body 1 and the conveying mechanism 2 are both existing technologies in the example.

[0043] In an embodiment of the present invention, a forward guide plate 41 and a reverse guide plate 42 are arranged on the side wall of the fixed side plate 4; each set of device support frame 5 consists of a front frame 6 and a rear frame 7; the front frame 6 includes a base frame 61 connected to the top surface of the conveyor belt 3, a cover plate 62 is connected to the top of the base frame 61, a transmission assembly 63 is arranged inside the base frame 61, and a lifting and positioning frame 64 that is linked with the transmission assembly 63 is movably connected to the top of the cover plate 62, and a plurality of clamping assemblies 65 are arranged on the top of the lifting and positioning frame 64; the lifting and positioning frame 64 is used for lifting and positioning. The side wall of the lifting positioning frame 64 is provided with multiple device placement plates 6401. The lifting positioning frame 64 has multiple slots 6402 arranged on the sides of the device placement plates 6401 from top to bottom. A clamping assembly 65 is arranged above the slots 6402. The top surface of the cover plate 62 is connected to multiple insert plates 66 corresponding to the slots 6402. The insert plates 66 are used to control the clamping action of the clamping assembly 65 through the extension and descent movement of the lifting positioning frame 64. A forward guide plate 41 is used to drive the transmission assembly 63 to move the lifting positioning frame... The lifting and positioning frame 64 is raised, and the reverse guide plate 42 is used to drive the transmission component 63 to lower the lifting and positioning frame 64. This invention, by designing a support frame 5 with both lifting and clamping / positioning functions, ensures that when the circuit board body 8 enters the reflow oven body 1 for soldering, the circuit board body 8 can be clamped and fixed by the clamping component 65 of the support frame 5. This ensures a relatively stable position of the circuit board body 8 inside the reflow oven body 1, preventing positional displacement that could lead to uneven heating and affect the quality of the solder joints. Simultaneously, the circuit board body 8 can be raised above the conveyor belt 3 by the support frame 5 inside the reflow oven body 1, moving it away from the conveyor belt 3. This prevents the circuit board body 8 from being easily affected by the conveyor belt 3, which could cause uneven temperature distribution between the bottom and top of the circuit board body 8, resulting in uneven solder melting and affecting the quality of the solder joints. Furthermore, being above the conveyor belt 3 ensures uniform heating from all angles, improving the soldering quality.

[0044] In another embodiment of the present invention, a plurality of fixed frames 6101 are connected to the inner bottom surface of the base frame 61; the transmission assembly 63 includes a rotating rod 6301 rotatably arranged among the plurality of fixed frames 6101, with both ends of the rotating rod 6301 passing through the side wall of the base frame 61 and connected to gears 6302; two worm gears 6303 are arranged on the outer circumference of the rotating rod 6301; two worm wheels 6304 are rotatably connected to the inner bottom surface of the base frame 61, and the worm gears 6303 are meshed with the worm wheels 6304; on the worm wheels 6304 A rotating cylinder 6305 is coaxially connected to a cover plate 62. The rotating cylinder 6305 has an arc-shaped groove 63051 on its side wall. Multiple support cylinders 6201 are connected to the top surface of the cover plate 62. The rotating cylinder 6305 is movably arranged within the cavity of the support cylinders 6201. Multiple sliding protrusions 6202 are arranged on the inner circumference of the support cylinders 6201. A lifting column 6306 is movably arranged within the cavity of the rotating cylinder 6305. A sliding column 6307 is connected to the outer circumference of the lifting column 6306. The sliding column 6307 is movably arranged within the arc-shaped groove 63051. The outer wall of the 6-circumference column is provided with multiple sliding grooves 6308 that fit the shape of the sliding protrusion 6202. The lifting column 6306 slides in contact with the inner cavity of the support cylinder 6201 through the sliding grooves 6308. When the gear 6302 rotates in the forward direction, the gear 6302 drives the rotating rod 6301 to rotate. The rotating rod 6301 drives the worm wheel 6304 to rotate through the worm gear 6303. The worm wheel 6304 drives the rotating cylinder 6305 to rotate inside the support cylinder 6201. The arc-shaped groove 63051 of the rotating cylinder 6305... The sliding column 6307 moves upward, which in turn drives the lifting column 6306 to slide upward along the sliding protrusion 6202 of the support cylinder 6201. Since the worm gear 6304 has difficulty driving the worm 6303 to rotate, the lifting column 6306 can maintain a stable state after rising, and it is difficult for it to fall due to its own gravity, thus realizing the function of locking the state after rising. When the gear 6302 rotates in the opposite direction, it drives the lifting column 6306 to slide downward along the sliding protrusion 6202 of the support cylinder 6201.

[0045] In another embodiment of the present invention, the rear frame 7 is arranged with the same structural components as the front frame 6; wherein, the rear frame 7 includes a second lifting positioning frame 71 and a second transmission assembly 72; the second lifting positioning frame 71 and the first lifting positioning frame 64 are mutually symmetrical structural components; the second transmission assembly 72 includes a second gear 7201 arranged with the same structural components as the first gear 6302, and the rotation directions of the second gear 7201 and the first gear 6302 are staggered; the forward guide plate 41 is arranged at the bottom end of the side wall of the fixed side plate 4, and the reverse guide plate 42 is arranged on the upper side of the forward guide plate 41; the top surface of the forward guide plate 41 is staggered with an outer rack 4101 and an inner rack 4102; the bottom surface of the reverse guide plate 42 is staggered with an outer rack 4101 and an inner rack 4102. An outer rack 4201 and an inner rack 4202 are arranged in a staggered manner. The outer rack 4101 is used to mesh with the bottom of the gear 6302, driving the gear 6302 to rotate in the forward direction. The inner rack 4102 is used to mesh with the bottom of the gear 7201, driving the gear 7201 to rotate in the forward direction. The outer rack 4201 is used to mesh with the top of the gear 6302, driving the gear 6302 to rotate in the reverse direction. The inner rack 4202 is used to mesh with the top of the gear 7201, driving the gear 7201 to rotate in the reverse direction. The invention also includes an outer rack 4101 and an inner rack 4102 staggered on the top surface of the forward guide plate 41 and a reverse guide plate 42 staggered on the bottom surface of the reverse guide plate 42. The device has an outer rack 4201 and an inner rack 4202. Gear 7201 and gear 6302 are arranged in a staggered rotation direction, allowing gear 6302 of the front rack 6 and gear 7201 of the rear rack 7 to simultaneously mesh with the outer rack 4101 and inner rack 4102 on the top surface of the forward guide plate 41, respectively, after the device carrier 5 enters the reflow oven body 1. The outer rack 4101 drives gear 6302 to rotate forward, and the inner rack 4102 drives gear 7201 to rotate forward, enabling the lifting positioning frame 64 and lifting positioning frame 71 to rise simultaneously. This lifts the circuit board body 8 on top of the device placement plate 6401, moving it away from the conveyor belt. After the welding operation is completed, conveyor belt 3 transports the component carrier 5 to the output end of the reflow oven body 1, so that the gear 6302 of the front frame 6 and the gear 7201 of the rear frame 7 simultaneously mesh with the outer rack 4201 and the inner rack 4202 on the bottom surface of the reverse guide plate 42, respectively. The outer rack 4201 drives the gear 6302 to rotate in the opposite direction, and the inner rack 4202 drives the gear 7201 to rotate in the opposite direction, so that the lifting positioning frame 64 and the lifting positioning frame 71 can descend at the same time. This enables the carrier 5 to automatically lift the circuit board body 8 during the forward transport inside the reflow oven body 1, making the entire welding process more convenient.

[0046] In another embodiment of the present invention, the bottom surface of the lifting positioning frame 64 is connected to the top surface of the lifting column 6306; every two device placement plates 6401 form a group, and the lifting positioning frame 64 and the lifting positioning frame 71 cooperate with each other. The circuit board body 8 is supported by the top of the two sets of mutually symmetrical device placement plates 6401. The two sets of mutually symmetrical device placement plates 6401 position the four corners of the circuit board body 8. The side walls of the device placement plates 6401 are set as curved panel structures. The present invention positions the four corners of the circuit board body 8 by the two sets of mutually symmetrical device placement plates 6401, so that the circuit board body 8 can remain stable on the top surface of the device placement plates 6401 and is not prone to shaking or positional displacement. Furthermore, by setting the side walls of the device placement plates 6401 as curved panel structures, when the device placement plates 6401 rotate with the conveyor belt 3 during the unloading process, they can detach from the circuit board body 8 through the curved panel structure without scratching the circuit board body 8, thus playing a protective role for the circuit board body 8.

[0047] In another embodiment of the present invention, the clamping assembly 65 includes a clamping plate 6501 rotatably arranged on the inner sidewall of the slot 6402, and two arc-shaped columns 6502 connected to the top surface of the lifting positioning frame 64. The two arc-shaped columns 6502 are symmetrically distributed on both sides of the clamping plate 6501. A sliding cylinder 6503 is slidably sleeved on the arc-shaped columns 6502. The sliding cylinders 6503 on the two arc-shaped columns 6502 are connected by a connecting rod 6504. The connecting rod 6504 is connected to the sidewall of the clamping plate 6501. A sliding cylinder 6503 is also sleeved on the arc-shaped columns 6502. An arc-shaped spring 6505 is arranged between the slide cylinder 6503 and the lifting positioning frame 64. A rotating cylinder 6601 is rotatably connected to the top of the insert plate 66, and the rotating cylinder 6601 is arranged below the clamping plate 6501. The side wall of the clamping plate 6501 is set with an arc surface structure to avoid possible scratches on the circuit board body 8 by the clamping plate 6501. The present invention, by designing the clamping component 65, utilizes the lifting positioning frame 64 and the lifting positioning frame 71 during the upward movement to enable the insert plate to... As plate 66 gradually moves away from slot 6402, the bottom surface of clamping plate 6501 loses the support of plate 66. Slide cylinder 6503, under the elastic force of arc spring 6505, slides along arc column 6502. This further drives clamping plate 6501 to rotate via connecting rod 6504, causing clamping plate 6501 to gradually press down on the top surface of circuit board body 8. The four clamping plates 6501 create a clamping effect at the four corners of the top surface of circuit board body 8. When lifting positioning frame one 64 and lifting positioning frame two 71 descend... When lowered, the insert plate 66 is gradually inserted into the slot 6402. The rotating cylinder 6601 on the top of the insert plate 66 pushes the clamping plate 6501 to rotate and open, so that the four clamping plates 6501 lose their clamping effect on the circuit board body 8. This realizes the linkage function with the lifting positioning frame 1 64 and the lifting positioning frame 2 71, so that the clamping component 65 can automatically clamp or release, providing convenience for the welding process. At the same time, the clamping effect formed at the four corners of the top surface of the circuit board body 8 can ensure the stability and reliability of the welding.

[0048] Example 2: This example provides a method for using a microwave chip packaging device welding equipment, including the following steps:

[0049] S1. Loading operation: The circuit board body 8 with microwave chip packaging devices pre-arranged on the top surface is placed on the top of the two sets of mutually symmetrical device placement plates 6401 of the device carrier 5 on the conveying end of the conveying mechanism 2, and the device carrier 5 is conveyed into the reflow oven body 1 by the conveyor belt 3.

[0050] S2. Lifting Operation: After the device support frame 5 enters the reflow oven body 1, the gear 6302 of the front frame 6 and the gear 7201 of the rear frame 7 simultaneously mesh with the outer rack 4101 and the inner rack 4102 on the top surface of the forward guide plate 41, respectively. As the device support frame 5 continues to move forward, the outer rack 4101 drives the gear 6302 to rotate forward, the gear 6302 drives the rotating rod 6301 to rotate, the rotating rod 6301 drives the worm wheel 6304 to rotate through the worm gear 6303, the worm wheel 6304 drives the rotating cylinder 6305 to rotate inside the support cylinder 6201, the arc groove 63051 of the rotating cylinder 6305 drives the sliding column 6307 to move upward, further driving the lifting column 6... 306 slides upward along the sliding protrusion 6202 of the support cylinder 6201, thereby driving the lifting positioning frame 64 to rise. Similarly, the internal rack 4102 drives the lifting positioning frame 71 to rise simultaneously with the lifting positioning frame 64 through the gear 7201, so that the circuit board body 8 on the top of the device placement board 6401 rises. The circuit board body 8 moves away from the conveyor belt 3 and enters the space above the conveyor belt 3. The reflow oven body 1 heats the circuit board body 8, causing the solder paste on the circuit board body 8 to melt. Under the action of surface tension, the solder will wrap around the solder joint between the microwave chip package device and the circuit board body 8. Finally, in the cooling zone of the reflow oven body 1, the solder cools and solidifies rapidly, completing the welding process.

[0051] S3. Clamping operation: During the lifting operation, as the lifting positioning frame 1 64 and the lifting positioning frame 2 71 rise, the insert plate 66 will gradually leave the slot 6402, causing the bottom surface of the clamping plate 6501 to lose the support of the insert plate 66. The slide cylinder 6503 is subjected to the elastic force of the arc spring 6505, causing the slide cylinder 6503 to slide along the arc column 6502. Furthermore, the clamping plate 6501 is rotated through the connecting rod 6504, causing the clamping plate 6501 to gradually press down on the top surface of the circuit board body 8. The four clamping plates 6501 form a clamping effect at the four corners of the top surface of the circuit board body 8.

[0052] S4. Unloading Operation: After the welding operation is completed, the conveyor belt 3 transports the component carrier 5 to the output end of the reflow oven body 1, so that the gear 6302 of the front frame 6 and the gear 7201 of the rear frame 7 simultaneously mesh with the outer rack 4201 and the inner rack 4202 on the bottom surface of the reverse guide plate 42, respectively. As the component carrier 5 continues to move forward, the outer rack 4201 drives the gear 6302 to rotate in the opposite direction. The reverse rotation of the gear 6302 causes the lifting positioning frame 64 to descend. Similarly, the inner rack 4202 simultaneously drives the gear 7201 to rotate in the opposite direction, so that the lifting positioning frame 71 descends along with the lifting positioning frame 64. This further allows the insert plate 66 to be gradually inserted into the slot 6402. The rotating cylinder 6601 at the top of the insert plate 66 pushes the clamping plate 6501 to rotate and open, so that the four clamping plates 6501 lose their clamping effect on the circuit board body 8. Finally, the circuit board body 8 can be removed at the output end of the reflow oven body 1.

[0053] The embodiments disclosed in this invention are preferred embodiments, but are not limited thereto. Those skilled in the art can easily understand the spirit of this invention based on the above embodiments and make different extensions and variations, but as long as they do not depart from the spirit of this invention, they are all within the protection scope of this invention.

Claims

1. A microwave chip packaging device welding equipment, comprising a reflow oven body (1), wherein the reflow oven body (1) includes a conveying mechanism (2), and the conveying mechanism (2) includes a conveyor belt (3), characterized in that, Fixed side plates (4) are symmetrically arranged on both sides of the conveyor belt (3), and multiple arrays of device carriers (5) are arranged on the conveyor belt (3). The fixed side plate (4) has a forward guide plate (41) and a reverse guide plate (42) arranged on its side wall. Each of the device carrier frames (5) consists of a front frame (6) and a rear frame (7); The front frame (6) includes a base frame (61) connected to the top surface of the conveyor belt (3), a cover plate (62) connected to the top of the base frame (61), a transmission assembly (63) arranged inside the base frame (61), a lifting and positioning frame (64) that is linked with the transmission assembly (63) is movably connected to the top of the cover plate (62), and a plurality of clamping assemblies (65) are arranged on the top of the lifting and positioning frame (64). The bottom surface of the base frame (61) is connected to multiple fixing brackets (6101). The transmission assembly (63) includes a rotating rod (6301) rotatably arranged among the plurality of fixed frames (6101), and the two ends of the rotating rod (6301) pass through the side wall of the base frame (61) and are connected to a gear (6302). Two worm gears (6303) are arranged on the outer circumference of the rotating rod (6301). Two worm gears (6304) are rotatably connected to the bottom surface of the base frame (61), and the worm (6303) is meshed with the worm gears (6304); A rotating cylinder (6305) is coaxially connected above the worm gear (6304), and an arc-shaped groove (63051) is provided on the side wall of the rotating cylinder (6305). The top surface of the cover plate (62) is connected to a plurality of support cylinders (6201), the rotating cylinder (6305) is movably arranged in the inner cavity of the support cylinder (6201), and a plurality of sliding protrusions (6202) are arranged on the inner circumference of the support cylinder (6201). A lifting column (6306) is movably arranged inside the rotating drum (6305), and a sliding column (6307) is connected to the outer circumference of the lifting column (6306). The sliding column (6307) is movably arranged in the arc-shaped groove (63051). The outer circumference of the lifting column (6306) is provided with a plurality of sliding grooves (6308) that match the shape of the sliding protrusion (6202). The lifting column (6306) slides in cooperation with the inner cavity of the support cylinder (6201) through the sliding grooves (6308). The bottom surface of the lifting positioning frame (64) is connected to the top surface of the lifting column (6306); When the gear one (6302) rotates in the forward direction, it can make the lifting column (6306) rise and maintain a stable state. When the gear one (6302) rotates in the reverse direction, it will drive the lifting column (6306) to slide downward along the sliding protrusion (6202) of the support cylinder (6201). The lifting positioning frame (64) has multiple device placement plates (6401) arranged on its side wall, and the lifting positioning frame (64) has multiple slots (6402) arranged on the side of the device placement plates (6401) from top to bottom. The clamping assembly (65) is arranged above the slot (6402); The top surface of the cover plate (62) is connected to a plurality of insert plates (66) corresponding to the slot (6402). The insert plates (66) are used to control the clamping action of the clamping assembly (65) by the extension and descent movement of the lifting positioning frame (64). The forward guide plate (41) is used to drive the transmission assembly (63) to raise the lifting positioning frame (64), and the reverse guide plate (42) is used to drive the transmission assembly (63) to lower the lifting positioning frame (64).

2. The microwave chip packaging device welding equipment according to claim 1, characterized in that, The forward guide plate (41) is arranged at the lower end of the side wall of the fixed side plate (4), and the reverse guide plate (42) is arranged on the upper side of the forward guide plate (41); The top surface of the forward guide plate (41) is provided with an outer rack (4101) and an inner rack (4102) arranged in a staggered manner. The bottom surface of the reverse guide plate (42) is provided with an outer rack 2 (4201) and an inner rack 2 (4202) arranged in a staggered manner.

3. The microwave chip packaging device welding equipment according to claim 2, characterized in that, The rear frame (7) is equipped with the same structural components as the front frame (6); The rear frame (7) includes a second lifting and positioning frame (71) and a second transmission assembly (72). The second lifting positioning frame (71) and the first lifting positioning frame (64) are mutually symmetrical structural components; The transmission assembly 2 (72) includes a gear 2 (7201) with the same structural components as the gear 1 (6302), and the rotation directions of the gear 2 (7201) and the gear 1 (6302) are offset.

4. The microwave chip packaging device welding equipment according to claim 3, characterized in that, The first external rack (4101) is used to mesh with the bottom of the first gear (6302) to drive the first gear (6302) to rotate in the forward direction. The first internal rack (4102) is used to mesh with the bottom of the second gear (7201) to drive the second gear (7201) to rotate in the forward direction. The second external rack (4201) is used to mesh with the top of the first gear (6302) to drive the first gear (6302) to rotate in the reverse direction. The second internal rack (4202) is used to mesh with the top of the second gear (7201) to drive the second gear (7201) to rotate in the reverse direction.

5. The microwave chip packaging device welding equipment according to claim 4, characterized in that, Each pair of device placement plates (6401) forms a group. The first lifting positioning frame (64) and the second lifting positioning frame (71) cooperate with each other to support the circuit board body (8) through the top of the two sets of mutually symmetrical device placement plates (6401). The two sets of mutually symmetrical device placement plates (6401) position the four corners of the circuit board body (8). The side wall of the device placement plate (6401) is set as a curved panel structure.

6. The microwave chip packaging device welding equipment according to claim 5, characterized in that, The clamping assembly (65) includes a clamping plate (6501) rotatably arranged on the inner sidewall of the slot (6402) and two arc-shaped columns (6502) connected to the top surface of the lifting positioning frame (64). The two arc-shaped columns (6502) are symmetrically distributed on both sides of the clamping plate (6501). A slide cylinder (6503) is slidably sleeved on the arc-shaped column (6502). The slide cylinders (6503) on the two arc-shaped columns (6502) are connected by a connecting rod (6504). The connecting rod (6504) is connected to the sidewall of the clamping plate (6501). An arc-shaped spring (6505) is also sleeved on the arc-shaped column (6502). The arc-shaped spring (6505) is arranged between the slide cylinder (6503) and the lifting positioning frame (64).

7. The microwave chip packaging device welding equipment according to claim 6, characterized in that, The top of the insert plate (66) is rotatably connected to a rotating cylinder (6601), which is arranged below the clamping plate (6501). The side wall of the clamping plate (6501) is set as an arc surface structure.

8. A method of using a microwave chip packaging device welding equipment, applicable to the microwave chip packaging device welding equipment described in claim 7, characterized in that, Includes the following steps: S1. Loading operation: The circuit board body (8) with microwave chip packaging devices pre-arranged on the top surface is placed on the top of the two sets of mutually symmetrical device placement plates (6401) of the device carrier (5) on the conveying end of the conveying mechanism (2), and the device carrier (5) is conveyed into the reflow oven body (1) by the conveyor belt (3). S2. Lifting operation: After the device support frame (5) enters the reflow oven body (1), the gear 1 (6302) of the front frame (6) and the gear 2 (7201) of the rear frame (7) simultaneously mesh with the outer rack 1 (4101) and the inner rack 1 (4102) on the top surface of the forward guide plate (41), respectively. As the device support frame (5) continues to move forward, the outer rack 1 (4101) drives the gear 1 (6302) to rotate in the forward direction. The gear 1 (6302) drives the rotating rod (6301) to rotate. The rotating rod (6301) drives the worm wheel (6304) to rotate through the worm gear (6303). The worm wheel (6304) drives the rotating cylinder (6305) to rotate inside the support cylinder (6201). The arc groove (63051) of the rotating cylinder (6305) drives the sliding column (6307) to move upward, further driving... The moving lifting column (6306) slides upward along the sliding protrusion (6202) of the support cylinder (6201), thereby driving the lifting positioning frame one (64) to rise. Similarly, the internal rack one (4102) drives the lifting positioning frame two (71) to rise simultaneously with the lifting positioning frame one (64) through the gear two (7201), so that the circuit board body (8) on the top of the device placement board (6401) rises. The circuit board body (8) moves away from the conveyor belt (3) and enters the space above the conveyor belt (3). The reflow oven body (1) heats the circuit board body (8) to melt the solder paste on the circuit board body (8). Under the action of surface tension, the solder will wrap the solder joint between the microwave chip packaging device and the circuit board body (8). Finally, in the cooling zone of the reflow oven body (1), the solder cools and solidifies rapidly, completing the welding process. S3. Clamping operation: During the lifting operation, as the lifting positioning frame one (64) and the lifting positioning frame two (71) rise, the insert plate (66) will gradually leave the slot (6402), so that the bottom surface of the clamping plate (6501) loses the support of the insert plate (66). The slide cylinder (6503) is subjected to the elastic force of the arc spring (6505), so that the slide cylinder (6503) slides along the arc column (6502). Furthermore, the clamping plate (6501) is rotated through the connecting rod (6504), so that the clamping plate (6501) is gradually pressed down on the top surface of the circuit board body (8). The four clamping plates (6501) form a clamping effect on the four corners of the top surface of the circuit board body (8). S4. Unloading operation: After the welding operation is completed, the conveyor belt (3) transports the device carrier (5) to the output end of the reflow oven body (1), so that the gear 1 (6302) of the front frame (6) and the gear 2 (7201) of the rear frame (7) simultaneously mesh with the outer rack 2 (4201) and the inner rack 2 (4202) on the bottom surface of the reverse guide plate (42), respectively. As the device carrier (5) continues to move forward, the outer rack 2 (4201) drives the gear 1 (6302) to rotate in the opposite direction. The reverse rotation of the gear 1 (6302) causes the lifting... As the lowering positioning frame 1 (64) descends, the internal rack 2 (4202) simultaneously drives the gear 2 (7201) to rotate in the opposite direction, causing the lifting positioning frame 2 (71) to descend simultaneously with the lifting positioning frame 1 (64), further causing the insert plate (66) to gradually insert into the slot (6402). The rotating cylinder (6601) at the top of the insert plate (66) pushes the clamping plate (6501) to rotate and open, so that the four clamping plates (6501) lose their clamping effect on the circuit board body (8). Finally, the circuit board body (8) can be removed at the output end of the reflow oven body (1).

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