A chip loading device and loading method

Abstract

This application discloses a chip loading device and method. The loading device includes a hopper, a tray placement assembly, a moving assembly, and a negative pressure assembly. The moving assembly includes a tray support, and the negative pressure assembly is connected to the tray support. During the process of the tray support carrying and moving the tray from the hopper to the tray placement assembly, the negative pressure assembly provides negative pressure to the tray support, fixing the tray to the tray support. The tray has multiple clearance holes at its bottom to further secure the chip under test within the tray under the negative pressure. Through the cooperation of the negative pressure assembly, the tray support, and the tray, the chip in the tray does not shift during the movement of the tray by the moving assembly, improving the efficiency of tray movement and chip testing in the loading device, and enhancing the user experience.

Description

Technical Field

[0001] This application relates to the field of chips, and in particular to a chip loading device and loading method. Background Technology

[0002] In existing chip testing equipment, chips are typically pre-arranged neatly in a tray, and then the tray is moved to its designated position before testing. However, during this movement, the chips may shift due to jolting, making it difficult to align them during testing and impacting testing efficiency. To address this issue, chips can be positioned and corrected during the movement to the testing location, adding a testing step and further reducing the equipment's operational efficiency. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides a chip loading device to reduce chip displacement during tray movement and improve chip inspection efficiency. The loading device includes:

[0004] A hopper is used to store multiple trays, wherein the multiple trays are stacked sequentially along the height direction of the hopper, and each tray is used to load a chip to be tested;

[0005] A tray placement assembly is disposed above the hopper along the height direction of the feeding device, and is used to place the tray containing the chip under test so as to expose the chip under test on the tray.

[0006] A movable component, spaced apart from the hopper and the tray placement component, is used to carry the tray and move the tray from the hopper to the tray placement component;

[0007] The feeding device further includes a negative pressure component, and the moving component includes a tray support. The negative pressure component is connected to the tray support and is used to provide negative pressure to the tray support during the process of the tray support carrying and moving the tray, so as to fix the tray on the tray support.

[0008] The bottom of the tray is provided with multiple air-proof holes so that the chip under test in the tray is fixed on the tray under negative pressure.

[0009] The material tray support is provided with a pneumatic connection port, which is connected to the negative pressure component. The negative pressure component provides negative pressure to the material tray support through the pneumatic connection port.

[0010] The side of the tray support that contacts the tray is provided with at least one air pressure through hole, which is connected to the air pressure connection port so that the negative pressure provided by the negative pressure component acts on the tray placed on the tray support through the air pressure through hole.

[0011] The tray placement assembly includes a positioning component, which comprises a base, a limiting ring, and four moving parts.

[0012] The limiting ring is disposed on the base, and the four moving parts are slidably disposed on the base. The limiting ring is provided with four limiting grooves, and the distance between any limiting groove and the adjacent limiting groove is equal. Each limiting groove extends toward the center of the limiting ring. Each moving part is provided with a limiting rod, and the limiting rod is disposed in the limiting groove.

[0013] When the moving component moves the tray from the hopper to the tray placement component, the tray is located in the limiting ring. The limiting ring rotates to drive the four moving parts to abut against the sides of the tray to position the tray.

[0014] The tray placement assembly also includes a placement frame with an inner frame for exposing the chip under test on the tray. The size of the inner frame is smaller than the size of the tray. The placement frame is mounted on the base, and in the height direction of the tray placement assembly, the projection of the center of the limiting ring overlaps with the projection of the center of the inner frame. The limiting grooves are respectively provided with corresponding sides of the placement frame.

[0015] When the tray is located in the tray placement assembly, the side of the tray containing the chip under test abuts against the placement frame. The limiting ring and the moving part cooperate to center the tray. In the height direction of the tray placement assembly, the projection of the center of the inner frame overlaps with the projection of the center of the tray.

[0016] The hopper includes a limiting strip extending along the height direction of the hopper. The limiting strip is disposed at the edge of the hopper to limit the movement of the trays stacked in the hopper.

[0017] The hopper also includes at least two receiving components, which are disposed at the bottom of the hopper and located on opposite sides of the hopper, and are used to receive the material trays in the hopper.

[0018] When the tray support is located below the hopper, the receiving plate of the receiving member moves away from the opposite receiving member to release the first tray, so that the first tray moves onto the tray support under its own weight. After the first tray leaves the hopper, the receiving plate moves towards the opposite receiving member to receive the second tray.

[0019] Wherein, the first material tray is the material tray closest to the bottom of the material hopper, and the second material tray is the material tray stacked on the first material tray in the material hopper.

[0020] The receiving component includes a receiving base, a receiving plate, and a drive motor. The receiving base is located at the bottom of the hopper and on the side of the hopper. The receiving plate is slidably disposed on the receiving base. The drive motor is connected to the receiving plate and is used to drive the receiving plate to slide relative to the receiving base.

[0021] To address the aforementioned technical problems, this application also provides a chip loading method, applied to the loading apparatus described above, comprising:

[0022] The control tray support is moved to the bottom of the hopper, and the receiving plate of the receiving component is retracted so that the tray in the hopper falls onto the tray support.

[0023] The system controls the tray support to move the tray to the tray placement component and controls the negative pressure component to provide negative pressure to the tray support.

[0024] After the tray is moved to the tray placement assembly, the positioning component is controlled to position the tray.

[0025] The beneficial effects of this application are as follows: Unlike existing technologies, the feeding device of this application includes a hopper, a tray placement assembly, a moving assembly, and a negative pressure assembly. The hopper stores multiple trays, which are stacked sequentially along the height of the hopper, and each tray is used to load a chip under test (DUT). The tray placement assembly is positioned above the hopper along the height of the feeding device and is used to place the tray containing the DUT, thus exposing the DUT on the tray. The moving assembly is spaced apart from the hopper and the tray placement assembly and is used to carry the tray and move it from the hopper to the tray placement assembly. The moving assembly includes a tray support, and the negative pressure assembly is connected to the tray support. During the process of the tray support carrying and moving the tray, the negative pressure assembly provides negative pressure to the tray support to fix the tray to the tray support. The bottom of the tray has multiple clearance holes to ensure that the DUT in the tray is fixed to the tray under the negative pressure. By cooperating with the negative pressure component, the material tray support, and the material tray, the chips in the material tray do not shift during the movement of the material tray by the moving component. This improves the efficiency of material tray movement and chip detection in the feeding device, and enhances the user experience of the feeding device. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] in:

[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the feeding device of this application;

[0029] Figure 2 This is a schematic diagram of the structure of an embodiment of the mobile component of this application;

[0030] Figure 3 This is a schematic diagram of the structure of an embodiment of the material tray support of this application;

[0031] Figure 4 This is a schematic diagram of the structure of an embodiment of the material tray of this application;

[0032] Figure 5 This is a schematic diagram of the structure of the first embodiment of the material tray placement component of this application;

[0033] Figure 6 This is a structural schematic diagram of an embodiment of the positioning component of this application;

[0034] Figure 7 This is a schematic diagram of the structure of the second embodiment of the material tray placement component of this application;

[0035] Figure 8 yes Figure 7 Another structural diagram of the material tray placement component;

[0036] Figure 9 This is a structural schematic diagram of an embodiment of the silo in this application;

[0037] Figure 10 This is a schematic diagram of the structure of one embodiment of the receiving part of this application.

[0038] Reference numerals: 1. Feeding device; 11. Hopper; 111. Limiting strip; 112. Receiving component; 1121. Receiving base; 1122. Receiving plate; 12. Tray placement assembly; 121. Positioning component; 1211. Base; 1212. Limiting ring; 12121. Limiting groove; 1213. Moving component; 12131. Placement frame; 1221. Inner frame; 1221. Moving assembly; 13. Tray support seat; 131. Air pressure connection port; 132. Tray; 21. Clearance hole. Detailed Implementation

[0039] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0040] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0041] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, the character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Furthermore, "many" in this application means two or more. Moreover, the term "at least one" in this application means any combination of at least two of any one or more of a plurality of objects. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C. Furthermore, the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0043] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an embodiment of the feeding device of this application. The feeding device 1 for chips provided in this application includes a hopper 11, a tray placement assembly 12, and a moving assembly 13.

[0044] The hopper 11 is used to store multiple trays, which are stacked sequentially along the height of the hopper 11. Each tray is used to load the chip to be tested. The tray placement component 12 is positioned above the hopper 11 along the height of the feeding device 1. It is used to place the trays loaded with the chips to be tested, so as to expose the chips on the trays and facilitate subsequent chip clamping and testing. The moving component 13 is spaced apart from the hopper 11 and the tray placement component 12. It is used to carry the trays and move the trays from the hopper 11 to the tray placement component 12.

[0045] By cooperating with the hopper 11, the tray placement component 12 and the moving component 13, the tray loaded with the chip to be tested is automatically fed, thereby improving the operating efficiency of the feeding device 1 and enhancing the user experience of the feeding device 1.

[0046] For further details, please refer to the following: Figures 2-4 , Figure 2 This is a schematic diagram of the structure of an embodiment of the mobile component of this application. Figure 3 This is a schematic diagram of the structure of an embodiment of the material tray support of this application; Figure 4 This is a schematic diagram of the structure of an embodiment of the material tray of this application.

[0047] The feeding device 1 also includes a negative pressure component (not shown in the figure), and the moving component 13 includes a tray support 131. The negative pressure component is connected to the tray support 131 and is used to provide negative pressure to the tray support 131 during the process of the tray support 131 carrying and moving the tray 2, so as to fix the tray 2 on the tray support 131. The bottom of the tray 2 is provided with multiple clearance holes 21, which can correspond to the placement position of the chip under test. The negative pressure provided by the negative pressure component can be applied to the chip under test on the tray 2 through the clearance holes 21, so that the chip under test in the tray 2 is fixed on the tray 2 under the action of negative pressure.

[0048] The negative pressure provided by the negative pressure component, in conjunction with the tray support 131 and the tray 2, fixes the tray 2 on the tray support 131, and the chip under test in the tray 2 is fixed on the tray 2, preventing the chip under test in the tray 2 from shifting during movement, thus improving the efficiency of moving the tray 2 and the chip under test, and improving the operating efficiency of the feeding device 1.

[0049] In one embodiment, the tray support 131 may further include a limiting clip disposed on the edge of the surface of the tray support 131 that contacts the tray 2. When the tray 2 is located on the tray support 131, the limiting clip may be disposed on the side of the tray 2 to center the relative position of the tray 2 and the tray support 131, so that the negative pressure energy through the tray support 131 can be uniformly applied to the tray 2, further improving the fixing efficiency of the tray 2 and the chip under test.

[0050] Optionally, please refer to Figure 3 The material tray support 131 is provided with a pneumatic connection port 132, which is connected to a negative pressure component. The negative pressure component provides negative pressure to the material tray support 131 through the pneumatic connection port 132.

[0051] The side of the tray support 131 that contacts the tray 2 is provided with at least one air pressure through hole (not shown in the figure). The air pressure through hole is connected to the air pressure connection port 132 so that the negative pressure provided by the negative pressure component can act on the tray 2 placed on the tray support 131 through the air pressure through hole.

[0052] Specifically, the negative pressure generated by the negative pressure component acts on the material tray 2 through the air pressure connection port 132 and the air pressure through hole. That is, the air pressure connection port 132 and the air pressure through hole guide the negative pressure. The user can set the position of the negative pressure on the material tray 2 by setting the position of the air pressure through hole, thereby improving the fixing efficiency of the negative pressure component on the material tray 2 and the chip under test.

[0053] In summary, the tray support 131 can be moved below the hopper 11, allowing the tray 2 in the hopper 11 to fall onto the tray support 131 under its own weight. After the tray 2 is placed on the tray support 131, during the process of the tray support 131 moving the tray 2 to the tray placement component 12, the negative pressure component provides negative pressure to the tray support 131 through the air pressure connection port 132. The negative pressure acts on the tray 2 through the air pressure through-hole to fix the tray 2 onto the tray support 131, and at the same time fixes the chip under test on the tray 2 onto the tray 2, preventing the chip under test in the tray 2 from shifting during the movement of the tray support 131. This improves the moving efficiency of the tray support 131 on the tray 2, increases the operating efficiency of the feeding device 1, and enhances the user experience of the feeding device 1.

[0054] In one embodiment, the feeding device 1 may be equipped with a control module (not shown). The control module can control the negative pressure component to provide negative pressure to the tray support 131 when a tray 2 is placed on the tray support 131, thereby fixing the tray 2 on the tray support 131. Furthermore, when the tray support 131 moves the tray 2 to the tray placement component 12, and when no tray 2 is placed on the tray support 131, during the process of the tray placement component 12 returning to the hopper 11 to support the tray 2, the negative pressure component can be controlled to stop providing negative pressure to the tray support 131. This reduces the energy consumption of the negative pressure component and prevents other components in the feeding device 1 from malfunctioning under negative pressure, thereby improving the operating efficiency of the feeding device 1.

[0055] Alternatively, please continue reading Figures 5-6 , Figure 5 This is a schematic diagram of the structure of the first embodiment of the material tray placement component of this application. Figure 6 This is a structural schematic diagram of an embodiment of the positioning component of this application.

[0056] The positioning component 121 is disposed at the tray placement position on the tray placement assembly 12 and is used to position the tray 2. The positioning component 121 includes a base 1211, a limiting ring 1212 and four moving parts 1213.

[0057] The base 1211 is located at the material tray placement position, the limiting ring 1212 is located on the base 1211, and four moving parts 1213 are slidably located on the base 1211. The limiting ring 1212 is provided with four limiting grooves 12121. The distance between any limiting groove 12121 and the adjacent limiting groove 12121 is equal, and each limiting groove 12121 extends towards the center of the limiting ring 1212. Each moving part 1213 is provided with a limiting rod 12131, which is located in the limiting groove 12121.

[0058] Then, when the moving component 13 moves the tray 2 from the hopper 11 to the tray placement component 12, the tray support 131 can place the tray 2 in the limiting ring 1212. The limiting ring 1212 can rotate relative to the base, and the limiting rod 12131 in the limiting groove 12121 will move accordingly. That is, the moving part 1213 will slide relative to the base 1211. Since all four moving parts 1213 are connected to the limiting ring 1212 through the limiting rod, the four moving parts 1213 will slide synchronously and abut against the four sides of the tray 2 respectively to position the tray 2.

[0059] Specifically, with Figure 6 Taking the structure shown as an example, after the material tray 2 is placed in the limiting ring 1212 by the material tray support 131, the limiting ring 1212 will... Figure 6The view shown rotates counterclockwise, and the limiting rod 12131 in the limiting groove 12121 will move from the first end of the limiting groove 12121 to the second end of the limiting groove 12121. The moving part 1213 will move closer to the material tray 2 under the drive of the limiting rod 12131. Since the four moving parts 1213 respectively abut against the side of the material tray 2, the four moving parts 1213 can position and fix the material tray 2. The chip clamping assembly (not shown) can clamp the chip to be tested on the material tray 2.

[0060] Furthermore, after the chip to be tested on the tray 2 has been clamped, the limiting ring 1212 can rotate clockwise, and then the limiting rod 12131 in the limiting groove 12121 will move from the second end of the limiting groove 12121 to the first end of the limiting groove 12121. The four moving parts 1213 move away from the tray 2 to release the empty tray 2.

[0061] In one embodiment, such as Figure 6 As shown, the positioning element 121 may also include a motor, which can provide power for the rotation of the limiting ring 1212.

[0062] Furthermore, the control module can control the motor to rotate the limiting ring 1212 counterclockwise in response to the material tray 2 being located in the limiting ring 1212, so as to position the material tray 2. And in response to the chip to be tested on the material tray 2 being picked up, the control module can control the motor to rotate the limiting ring 1212 clockwise to release the material tray 2.

[0063] Alternatively, please continue reading Figures 7-8 , Figure 7 This is a schematic diagram of the structure of the second embodiment of the material tray placement component of this application. Figure 8 yes Figure 7 A schematic diagram of the material tray placement assembly from another perspective. The material tray placement assembly 12 provided in this embodiment of the application is further provided with a placement frame 122, the placement frame 122 having an inner frame 1221, the inner frame 1221 being used to expose the chip under test on the material tray 2.

[0064] The inner frame 1221 is smaller than the material tray 2. The placement frame 122 is set on the base 1211. In the height direction of the material tray placement component 12, the projection of the center of the limiting ring 1212 overlaps with the projection of the center of the inner frame 1221. The limiting grooves 12121 are respectively set with corresponding sides of the placement frame 122.

[0065] Since the inner frame 1221 is smaller than the tray 2, when the tray 2 is located in the tray placement assembly 12, the side of the tray 2 containing the chip under test abuts against the placement frame 122. Specifically, when the tray support 131 moves the tray 2 to the tray placement assembly 12, the tray support 131 can move the tray 2 upwards, pushing the tray 2 into the limiting ring 1212. Since the inner frame 1221 is smaller than the tray 2, after the tray support 131 lifts the tray 2 to a certain height, the side of the tray 2 containing the chip under test will abut against the placement frame 122. At this time, the tray support 131 can respond to the tray 2 being lifted into position, preventing the tray support 131 from lifting the tray 2 excessively.

[0066] The limiting ring 1212 and the moving parts 1213 cooperate to position the tray 2. The four moving parts 1213 simultaneously abut against the side of the tray 2, so that the center of the tray 2 overlaps with the center of the limiting ring 1212. Since the projection of the center of the limiting ring 1212 overlaps with the projection of the center of the inner frame 1221 in the height direction of the tray placement assembly 12, after the positioning part 121 positions the tray 2, the projection of the center of the inner frame 1221 overlaps with the projection of the center of the tray 2 in the height direction of the tray placement assembly 12, thus centering the tray 2 to expose all the chips under test on the tray 2.

[0067] In summary, through the cooperation of the positioning component 121 and the placement frame 122, after the material tray support 131 moves the material tray 2 to the material tray placement component 12, the placement frame 122 limits the movement of the material tray support 131 lifting the material tray 2, while the positioning component 121 centers the material tray 2 to expose all the chips to be tested on the material tray 2, avoiding the placement frame 122 from blocking some of the chips to be tested in the material tray 2, thereby improving the operating efficiency of the material tray placement component 12 and enhancing the user's experience with the feeding device 1.

[0068] Optionally, please refer to the following: Figures 9-10 , Figure 9 This is a structural schematic diagram of an embodiment of the silo in this application. Figure 10 This is a structural schematic diagram of an embodiment of the receiving part of this application. The hopper 11 provided in this application embodiment includes a limiting strip 111 extending along the height direction of the hopper 11. The limiting strip 111 is disposed at the edge of the hopper 11 to limit the material trays 2 stacked in the hopper 11.

[0069] Multiple trays 2 are stacked sequentially in the silo 11 along the height direction. A limiting strip 111 extends along the height direction of the silo 11 and is set at the edge of the silo 11. The limiting strip 111 can restrict the stacked trays 2, preventing the upper trays 2 from falling into the silo 11 when the stacking is too high, thus improving the safety of the trays 2 stacked in the silo 11.

[0070] Furthermore, the hopper 11 also includes at least two receiving parts 112, which are disposed at the bottom of the hopper 11 and located on opposite sides of the hopper 11. The receiving parts 112 are used to receive the material trays 2 in the hopper 11.

[0071] Specifically, when the tray support 131 is located below the hopper 11, the receiving plate 1122 of the receiving member 112 moves away from the opposite receiving member 112 to release the tray closest to the bottom of the hopper 11 (hereinafter referred to as the first tray). Then, without the receiving member 112 supporting it, the first tray will fall onto the tray support 131 under its own weight to detach from the hopper 11.

[0072] The tray stacked on the first tray in the hopper 11 (hereinafter referred to as the second tray) will also fall down. Therefore, after the first tray leaves the hopper 11, the receiving plate 1122 can move in the direction close to the opposite receiving member 112 to receive the second tray.

[0073] Understandably, during the movement of the receiving plate 1122, the material tray support 131 does not move temporarily and remains located below the material hopper 11. Only after the receiving plate 1122 moves to receive the second material tray does the material tray support 131 move the supported material tray 2 to the material tray placement component 2.

[0074] If the tray support 131 moves simultaneously during the movement of the receiving plate 1122, the second tray will fall to the bottom of the hopper 11. Since the receiving plate 1122 has not completed its movement, it cannot receive the second tray. The second tray will continue to fall due to its own weight, detach from the hopper 11, and cause the tray 2 to fall into the hopper 11, or even collide with the receiving plate 1122, causing damage to the receiving plate 1122. Therefore, during the movement of the receiving plate 1122, the tray support 131 does not move. Specifically, the distance between the bearing surface of the tray support 131 and the bottom of the hopper 11 can be equal to the thickness of one tray 2. Thus, when the first tray falls onto the tray support 131, the second tray directly stacked on the first tray will fall along with it. Due to the presence of the first tray, the second tray falls exactly to the bottom of the hopper 11. At this time, the receiving plate 1122 moves to receive the second tray, preventing the receiving part 112 from failing to receive the second tray and causing it to fall outside the hopper 11, affecting the operation of other components around the hopper 11. This improves the orderly bearing of the trays 2 in the hopper 11 by the tray support 131 and improves the operating efficiency of the feeding device 1.

[0075] Optionally, such as Figure 10 As shown, the receiving component 112 includes a receiving base 1121, a receiving plate 1122, and a drive motor (not shown). The receiving base 1121 is located at the bottom of the hopper 11 and on the side of the hopper 11. The receiving plate 1122 is slidably disposed on the receiving base 1121. The drive motor is connected to the receiving plate 1122 and is used to drive the receiving plate 1122 to slide relative to the receiving base 1121.

[0076] Specifically, when the tray support 131 moves below the hopper 11, the drive motor can drive the receiving plate 1122 to move closer to the receiving base 1121 to release the support of the tray 2. The tray 2 will then fall onto the tray support 131 under its own weight. After one tray 2 leaves the hopper 11, the drive motor drives the receiving plate 1122 to move away from the receiving base 1121 to receive the tray 2 in the hopper 11 again, preventing the tray 2 from falling out of the hopper 11 and improving the safety of the tray 2.

[0077] In one embodiment, the bottom of the tray 2 is provided with a groove corresponding to the receiving plate 1122, so that when the receiving plate 1122 receives the tray 2, the receiving plate 1122 can cooperate with the groove to improve the receiving efficiency of the receiving member 112 on the tray 2.

[0078] By setting a receiving component 112 at the bottom of the hopper 11 to receive the material tray 2, the safety of the material tray 2 in the hopper 11 is improved and the operating efficiency of the feeding device 1 is increased without affecting the material tray support seat 131 supporting the material tray 2.

[0079] In summary, the feeding device 1 provided in this application achieves automatic feeding of a tray loaded with a chip under test through the cooperation of the hopper 11, the tray placement component 12 and the moving component 13, thereby improving the operating efficiency of the feeding device 1 and enhancing the user's experience with the feeding device 1.

[0080] Furthermore, the feeding device 1 includes a negative pressure component. The negative pressure provided by the negative pressure component, in conjunction with the tray support 131 and the tray 2, fixes the tray 2 on the tray support 131, and fixes the chip under test in the tray 2 on the tray 2, thereby preventing the chip under test in the tray 2 from shifting during the movement process and improving the efficiency of moving the tray 2 and the chip under test.

[0081] Meanwhile, through the cooperation of the positioning component 121 and the placement frame 122 of the tray placement component 12, after the tray support 131 moves the tray 2 to the tray placement component 12, the placement frame 122 limits the movement of the tray support 131 lifting the tray 2, while the positioning component 121 centers the tray 2 to expose all the chips to be tested on the tray 2, avoiding the placement frame 122 from blocking some of the chips to be tested in the tray 2, thus improving the operating efficiency of the tray placement component 12.

[0082] Furthermore, by setting a receiving component 112 at the bottom of the hopper 11 to receive the material tray 2, the safety of the material tray 2 in the hopper 11 is improved and the operating efficiency of the feeding device 1 is increased without affecting the material tray support seat 131 supporting the material tray 2.

[0083] This application also provides a chip loading method, applied to the loading device 1 described above, comprising: controlling the tray support 131 to move below the hopper 11, and controlling the receiving plate 1122 of the receiving member 112 to retract so that the tray 2 in the hopper 11 falls onto the tray support 131; controlling the tray support 131 to move the tray 2 to the tray placement assembly 12, and controlling the negative pressure assembly to provide negative pressure to the tray support 131; after the tray 2 moves to the tray placement assembly 12, controlling the positioning member 121 to position the tray 2.

[0084] Specifically, considering the detailed structure of the feeding device 1 in the above-described embodiments, the specific steps of the feeding method provided in this application embodiment are as follows:

[0085] The control module controls the material tray support 131 to move below the material bin 11, and after the material tray support 131 moves into place, it controls the receiving plate 1122 of the receiving component 112 to retract, so that the material tray 2 in the material bin 11 falls onto the material tray support 131 under its own gravity.

[0086] After the material tray 2 falls onto the material tray support 131, the control module controls the receiving plate 1122 of the receiving component 112 to move away from the receiving base 1121, at which time the material tray 2 located at the bottom of the hopper 11 receives it.

[0087] After the receiving plate 1122 has moved, the control module controls the tray support 131 to move the tray 2 to the tray placement component 12. At the same time, during this process, the control negative pressure component provides negative pressure to the tray support 131 through the air pressure connection port 132 to fix the tray 2 on the tray support 131 and the chip under test in the tray 2.

[0088] After moving to below the tray placement assembly 12, the tray support 131 drives the tray 2 to move upward until the tray 2 abuts against the placement frame 122. Then, the limiting ring 1212 rotates, driving the four moving parts 1213 to move closer to the tray 2. The four moving parts 1213 abut against the four sides of the tray 2 to position the tray 2.

[0089] In summary, the above-described chip loading method improves the orderliness of moving the tray 2 containing the chip under test from the hopper 11 to the tray placement assembly 12, enhances the security of the tray 2 stored in the hopper 11, improves the stability of the tray 2 and the chip under test in the tray 2 during the movement process, and enhances the practicality of the loading method.

[0090] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A chip loading device, characterized in that, include: A hopper is used to store multiple trays, wherein the multiple trays are stacked sequentially along the height direction of the hopper, and each tray is used to load a chip to be tested; A tray placement assembly is disposed above the hopper along the height direction of the feeding device, and is used to place the tray containing the chip under test so as to expose the chip under test on the tray. A movable component, spaced apart from the hopper and the tray placement component, is used to carry the tray and move the tray from the hopper to the tray placement component; The feeding device further includes a negative pressure component, and the moving component includes a tray support. The negative pressure component is connected to the tray support and is used to provide negative pressure to the tray support during the process of the tray support carrying and moving the tray, so as to fix the tray on the tray support. The bottom of the material tray is provided with multiple clearance holes so that the chip under test in the material tray is fixed on the material tray under the action of negative pressure; The tray placement assembly includes a positioning component, which comprises a base, a limiting ring, and four moving parts. The limiting ring is disposed on the base, the four moving parts are slidably disposed on the base, and the limiting ring is provided with four limiting grooves, the distance between any limiting groove and the adjacent limiting groove is equal, and each limiting groove extends toward the center of the limiting ring; each moving part is provided with a limiting rod, and the limiting rod is disposed in the limiting groove. When the moving component moves the tray from the hopper to the tray placement component, the tray is located in the limiting ring. The limiting ring rotates to drive the four moving parts to abut against the side of the tray respectively, so as to position the tray. The hopper includes a limiting strip extending along the height direction of the hopper, and the limiting strip is disposed at the edge of the hopper to limit the material trays stacked in the hopper; The hopper also includes at least two receiving components, which are disposed at the bottom of the hopper and located on opposite sides of the hopper, and are used to receive the material trays in the hopper.

2. The feeding device according to claim 1, characterized in that, The material tray support is provided with a pneumatic connection port, which is connected to the negative pressure component. The negative pressure component provides negative pressure to the material tray support through the pneumatic connection port. The side of the tray support that contacts the tray is provided with at least one air pressure through hole, which is connected to the air pressure connection port so that the negative pressure provided by the negative pressure component acts on the tray placed on the tray support through the air pressure through hole.

3. The feeding device according to claim 1, characterized in that, The tray placement assembly also includes a placement frame, which has an inner frame for exposing the chip under test on the tray. The size of the inner frame is smaller than the size of the tray. The placement frame is disposed on the base, and in the height direction of the tray placement assembly, the projection of the center of the limiting ring overlaps with the projection of the center of the inner frame. The limiting grooves are respectively disposed corresponding to the sides of the placement frame.

4. The feeding device according to claim 3, characterized in that, When the tray is located in the tray placement assembly, the side of the tray containing the chip under test abuts against the placement frame. The limiting ring and the moving part cooperate to center the tray. In the height direction of the tray placement assembly, the projection of the center of the inner frame overlaps with the projection of the center of the tray.

5. The feeding device according to claim 1, characterized in that, When the tray support is located below the hopper, the receiving plate of the receiving member moves away from the opposite receiving member to release the first tray, so that the first tray moves onto the tray support under its own weight. After the first tray leaves the hopper, the receiving plate moves towards the opposite receiving member to receive the second tray. Wherein, the first material tray is the material tray closest to the bottom of the material hopper, and the second material tray is the material tray stacked on the first material tray in the material hopper.

6. The feeding device according to claim 1, characterized in that, The receiving component includes a receiving base, a receiving plate, and a drive motor. The receiving base is located at the bottom of the hopper and on the side of the hopper. The receiving plate is slidably disposed on the receiving base. The drive motor is connected to the receiving plate and is used to drive the receiving plate to slide relative to the receiving base.

7. A method for loading chips, characterized in that, The feeding device as described in any one of claims 1-6 comprises: The control tray support is moved to the bottom of the hopper, and the receiving plate of the receiving component is retracted so that the tray in the hopper falls onto the tray support. The system controls the tray support to move the tray to the tray placement component and controls the negative pressure component to provide negative pressure to the tray support. After the tray is moved to the tray placement assembly, the positioning component is controlled to position the tray.

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