Micro-led laser mass transfer release material, preparation method and application thereof

Abstract

The application provides a Micro-LED laser mass transfer release material and a preparation method and application thereof.The Micro-LED laser mass transfer release material comprises the following components with mass percentage: a compound containing an azobenzene group 10-30%, an auxiliary resin 10-30%, a coupling agent 0.1-5%, and a leveling agent 0.05-2%.The application solves the technical problem of release defects caused by poor adhesion and poor high-temperature process resistance of the laser mass transfer release material used in the Micro-LED mass transfer process by designing the specific composition of the Micro-LED laser mass transfer release material and using the compound containing the azobenzene group.

Description

A Micro-LED Laser Mass Transfer Release Material, Its Preparation Method and Application Technical Field

[0001] This invention belongs to the field of Micro-LED laser mass transfer material technology, specifically relating to a Micro-LED laser mass transfer release material, its preparation method, and its application. Background Technology

[0002] With the rapid development of display technology, Micro LED, as a novel display technology, is widely considered a strong contender for next-generation display technology due to its advantages such as high brightness, low power consumption, long lifespan, and fast response time. Mass transfer is a crucial step in transferring Micro-LED chips from the growth substrate to the target substrate. This process requires highly stable and precise transfer technology, and its efficiency and accuracy directly affect the performance and cost of the final product.

[0003] Traditional Micro LED mass transfer technology faces several challenges. In Micro LED manufacturing processes, such as the LLO process, a laser illuminates the back of the substrate through a transparent sapphire substrate, absolving the tiny GaN layers and releasing the MicroLED chip. Following this step, a strong alkali is used for cleaning to remove residual metallic Ga. Due to the use of strong alkalis and other reagents for cleaning and treatment, the adhesion between the Micro-LED laser mass transfer material and the substrate under strongly alkaline conditions is subject to higher requirements. After the chip is transferred to the laser release layer, etching generates high temperatures, which can cause the chip on the release layer to shift. This not only affects the transfer accuracy but also reduces production efficiency.

[0004] Therefore, there is a need to develop Micro-LED laser mass transfer release materials that have high adhesion under strong alkaline conditions, high temperature resistance, strong adhesion to chips, defect-free bonding, and can achieve low energy threshold laser release. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a Micro-LED laser mass transfer release material, its preparation method, and its applications. This invention, through the design of the specific composition of the Micro-LED laser mass transfer release material and the use of compounds containing azophenyl groups, solves the technical problems of poor adhesion and inability to withstand high-temperature processes, which lead to release defects in the laser mass transfer release material used in the Micro-LED mass transfer process.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a Micro-LED laser mass transfer and release material, the Micro-LED laser mass transfer and release material comprising the following components in mass percentage:

[0008] Compounds containing azophenyl groups: 10-30%;

[0009] Auxiliary resin 10-30%;

[0010] Coupling agent 0.1-5%;

[0011] Leveling agent 0.05-2%.

[0012] This invention designs the specific composition of Micro-LED laser mass transfer release material and further prepares a Micro-LED laser mass transfer release material with high adhesion under strong alkaline conditions, high temperature resistance, strong adhesion to the chip, defect-free bonding, and low energy threshold laser release by using compounds containing azophenyl groups.

[0013] In this invention, compounds containing azophenyl groups are the main components of the material system, exhibiting strong absorption properties for ultraviolet lasers, thus enhancing the laser-induced release of micro-LED chips. The auxiliary resin is a thermoplastic resin with a high glass transition temperature, improving the stability of the material bonding system and enhancing its rheological properties. The coupling agent significantly improves the adhesion between the bonding material and the substrate, enhancing the bonding strength, durability, and resistance to damp heat aging. The leveling agent reduces the surface tension of the bonding material, ensuring a smooth and glossy surface after spin-coating onto the substrate, thus improving TTV (transfer-to-vitreous volume). Through the synergistic effect of these components, a high-performance Micro-LED laser mass transfer and release material is prepared in this invention.

[0014] In this invention, a high-performance Micro-LED laser mass transfer material was prepared by designing the amount of azophenyl-containing compounds in the Micro-LED laser mass transfer material within a specific range. If the amount of azophenyl-containing compounds is too small, the transfer driving force on the chip will be weak when using the Micro-LED laser mass transfer material for chip transfer, potentially resulting in the chip not being transferred. If the amount of azophenyl-containing compounds is too large, the laser response will be violent when using the Micro-LED laser mass transfer material for chip transfer, easily leading to chip misalignment, tilting, and other phenomena.

[0015] In this invention, the mass percentage of compounds containing azophenyl groups in the Micro-LED laser mass transfer release material can be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, or 30%, etc.

[0016] The mass percentage of excipient resin in Micro-LED laser mass transfer release materials can be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, or 30%, etc.

[0017] The mass percentage of coupling agent in Micro-LED laser mass transfer release materials can be 0.1%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, or 5%, etc.

[0018] The mass percentage of leveling agent in Micro-LED laser mass transfer release materials can be 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, 1.2%, 1.4%, 1.6%, 1.8%, or 2%, etc.

[0019] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. The purpose and beneficial effects of the present invention can be better achieved and realized through the following preferred technical solutions.

[0020] As a preferred embodiment of the present invention, the mass percentage of the azophenyl group in the compound is 30-100%, for example, it can be 30%, 40%, 50%, 60%, 70%, 80%, 90% or 100%.

[0021] Preferably, the compound containing the azophenyl group is selected from any one or a combination of at least two of the following: azobenzene, 4-aminoazobenzene, 4-hydroxyazobenzene, azobenzene oxide, 2,2'-dihydroxyazobenzene, 4,4'-dihydroxyazobenzene, 4,4'-dibromoazobenzene, 4,4'-diaminoazobenzene, 3,3'-dihydroxyazobenzene, 4-(methylamino)azobenzene, 4-bromo-4'-hydroxyazobenzene, N,N'-diethyl-4-aminoazobenzene, 4-methoxyazobenzene, 3,3'-dimethylazobenzene, N,N-dimethyl-4-(p-tolyldiazenyl)aniline, 4-(dimethylamino)-2-methylazobenzene, or 4-amino-4'-dimethylaminoazobenzene.

[0022] Preferably, the mass percentage of the compound containing azophenyl groups in the Micro-LED laser mass transfer release material is 15-25%, for example, it can be 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24% or 25%, etc.

[0023] As a preferred embodiment of the present invention, the excipient resin is selected from styrene-N-phenylmaleimide-maleic anhydride graft copolymer, styrene-maleic anhydride copolymer, polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polycarbonate (PC), polyimide (PI), polyetherimide (PEI), polyphenylene ether (PPE), polyethersulfone (PES), polytetrafluoroethylene (PTFE), polylactic acid (PLA), and AURUM. TM Any one or a combination of at least two of the resins.

[0024] Preferably, the glass transition temperature of the excipient resin is 80-160℃, for example, it can be 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, 150℃ or 160℃.

[0025] In this invention, the glass transition temperature (Tg) of the excipient resin is tested using differential scanning calorimetry (DSC) by measuring the change in the specific heat capacity of the material with temperature to determine the characteristic temperature of the glass transition. On the DSC curve, the glass transition is represented by an endothermic or exothermic step, and the average temperature of the two intersection points of the extrapolated baselines before and after the step with the tangent at the inflection point of the curve is taken as Tg.

[0026] Preferably, the mass percentage of the excipient resin in the Micro-LED laser mass transfer release material is 15-25%, for example, it can be 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, or 25%.

[0027] As a preferred embodiment of the present invention, the coupling agent is selected from silane coupling agents and / or borate ester coupling agents.

[0028] Preferably, the silane coupling agent is selected from any one or a combination of at least two of γ-aminopropyltriethoxysilane, vinyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrichlorosilane, phenyltriethoxysilane, 3-(2,3-epoxypropoxypropyl)trimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, or diphenyldimethoxysilane.

[0029] Preferably, the borate coupling agent is selected from any one or a combination of at least two of the following: trimethyl borate, triethyl borate, triphenyl borate, triisopropyl borate, tributyl borate, tri(2-ethylhexyl) borate, trialkyl borate, tri(2-hydroxyethyl) borate, tri(3-hydroxypropyl) borate, or tricyclohexyl borate.

[0030] Preferably, the mass percentage of coupling agent in the Micro-LED laser mass transfer release material is 0.5-3%, for example, it can be 0.5%, 0.8%, 1%, 1.2%, 1.5%, 1.8%, 2%, 2.3%, 2.5%, 2.7% or 3%, etc.

[0031] As a preferred embodiment of the present invention, the leveling agent is selected from any one or a combination of at least two of acrylic leveling agents, fluorocarbon leveling agents, or silicone leveling agents.

[0032] Preferably, the acrylic leveling agent comprises a polyester-modified polydimethylsiloxane solution with acrylate functional groups, and the solvent is xylene solvent.

[0033] Preferably, the fluorocarbon leveling agent comprises fluorocarbon-modified polyacrylic acid wax.

[0034] Preferably, the silicone leveling agent comprises polyether-modified siloxane and / or polyether-modified polydimethylsiloxane.

[0035] Preferably, the mass percentage of leveling agent in the Micro-LED laser mass transfer release material is 0.2-1.5%, for example, it can be 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, or 1.5%, etc.

[0036] As a preferred embodiment of the present invention, the Micro-LED laser mass transfer release material further includes a solvent 30-80.

[0037] Preferably, the solvent content in the Micro-LED laser mass transfer release material is 30-80% by mass, for example, it can be 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 60%, 75% or 80%, etc.

[0038] Preferably, the solvent is selected from any one or a combination of at least two of ketone solvents, aromatic solvents, ether solvents, amide solvents, dimethyl sulfoxide, or decahydronaphthalene.

[0039] Preferably, the ketone solvent includes any one or a combination of at least two of acetone, butanone, cyclohexanone, or isophorone.

[0040] Preferably, the aromatic solvent includes toluene and / or trimethylbenzene.

[0041] Preferably, the ether solvent includes any one or a combination of at least two of the following: dioxane, 1,3-dioxapentane, 2,2,4,4,5,5-hexamethyl-1,3-dioxopentane, 2,2-dimethoxy-4-(trifluoromethyl)-1,3-dioxopentane, tetrahydrofuran, or fluorinated hexacyclic coordination ethers.

[0042] Preferably, the amide solvent includes dimethylformamide and / or N,N-dimethylacetamide;

[0043] Preferably, the number of solvents is ≤4, for example, it can be 1, 2, 3 or 4.

[0044] Secondly, the present invention provides a method for preparing the Micro-LED laser mass transfer release material as described in the first aspect, the method comprising the following steps:

[0045] The components of the Micro-LED laser mass transfer release material are mixed evenly to obtain the Micro-LED laser mass transfer release material.

[0046] As a preferred embodiment of the present invention, the preparation method includes the following steps:

[0047] (1) Mix the compound containing azophenyl groups and the excipient resin evenly;

[0048] (2) Add some solvent to it and mix;

[0049] (3) Add coupling agent, leveling agent, solvent and remaining solvent to it, mix, and obtain the compound containing azophenyl group.

[0050] As a preferred technical solution of the present invention, the mixing method in step (1) includes stirring, and the stirring speed is 90-110 rpm, for example, it can be 90 rpm, 92 rpm, 94 rpm, 96 rpm, 98 rpm, 100 rpm, 102 rpm, 104 rpm, 106 rpm, 108 rpm or 110 rpm, etc.

[0051] Preferably, the mixing method in step (2) includes stirring, wherein the stirring speed is 120-220 rpm (e.g., 120 rpm, 130 rpm, 140 rpm, 150 rpm, 160 rpm, 170 rpm, 180 rpm, 190 rpm, 200 rpm, 210 rpm or 220 rpm, etc.), and the stirring time is 6-10 h (e.g., 6 h, 6.5 h, 7 h, 7.5 h, 8 h, 8.5 h, 9 h, 9.5 h or 10.5 h, etc.).

[0052] Preferably, the mixing method in step (3) includes stirring, wherein the stirring speed is 240-320 rpm (e.g., 240 rpm, 250 rpm, 260 rpm, 270 rpm, 280 rpm, 290 rpm, 300 rpm, 310 rpm or 320 rpm, etc.), and the stirring time is 45-55 h (e.g., 45 h, 46 h, 47 h, 48 h, 49 h, 50 h, 51 h, 52 h, 53 h, 54 h or 55 h, etc.).

[0053] Preferably, step (3) further includes a post-processing step after mixing, and the post-processing method includes settling and filtering.

[0054] Preferably, the filtration method includes sequential filtration using filter cartridges with pore sizes of 5μm, 1μm, 0.45μm, and 0.2μm.

[0055] It should be noted that the solvent added in step (2) accounts for 55-65% of the total mass of the solvent, for example, it can be 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64% or 65%, etc.

[0056] Thirdly, the present invention provides an application of the Micro-LED laser mass transfer release material as described in the first aspect, wherein the Micro-LED laser mass transfer release material is used for laser mass transfer of Micro-LEDs.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] (1) This invention designs the specific composition of the Micro-LED laser mass transfer release material and further solves the technical problem of poor adhesion and inability to withstand high temperature processes caused by the use of compounds containing azophenyl groups in the Micro-LED mass transfer process.

[0059] (2) In this invention, through the synergistic effect of each component, a high-performance Micro-LED laser mass transfer release material was prepared, with a glass transition temperature ≥49℃ and a cross-cutting grade of 5B after alkali soaking. After performing Micro-LED laser mass transfer with the Micro-LED laser mass transfer release material provided by this invention, the chip transfer yield is ≥0.9635. Detailed Implementation

[0060] To facilitate understanding of the present invention, the following embodiments are provided. Those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention.

[0061] The sources of some components in the examples and comparative examples are shown in Table 1 below:

[0062] Table 1

[0063]

[0064] Examples 1-11, Comparative Examples 1-5

[0065] Examples 1-11 and Comparative Examples 1-5 each provide a Micro-LED laser mass transfer release material. The composition of the Micro-LED laser mass transfer release material is shown in Tables 2 and 3 below. The amount of each component in Tables 2 and 3 is a mass percentage.

[0066] The preparation method of the above-mentioned Micro-LED laser mass transfer and release material is as follows:

[0067] (1) The compound containing azophenyl groups and the excipient resin were stirred and mixed evenly at a speed of 100 rpm.

[0068] (2) Add some solvent (the added solvent accounts for 60wt% of the total solvent volume), adjust the speed to 150rpm and stir for 4h, then adjust the speed to 200rpm and stir for 4h to mix evenly.

[0069] (3) Add coupling agent, leveling agent and remaining solvent to it, stir and mix at 250 rpm for 24 h, adjust the speed to 300 rpm and stir for 24 h, let stand for 24 h, and filter it in sequence using filter elements with pore sizes of 5 μm, 1 μm, 0.45 μm and 0.2 μm to obtain the Micro-LED laser mass transfer release material.

[0070] Table 2

[0071]

[0072]

[0073] Table 3

[0074]

[0075]

[0076] The performance of the Micro-LED laser mass transfer and release materials provided in the above embodiments and comparative examples was tested, and the specific test methods are as follows:

[0077] (I) Glass transition temperature:

[0078] The Micro-LED laser mass transfer release materials provided in the above embodiments and comparative examples were spin-coated onto a crystalline glass slide, dried, and scraped. The resulting film material was subjected to DSC testing. The spin-coating conditions were 2000 rpm @ 30 s and the drying conditions were 120 ℃ @ 10 min.

[0079] The glass transition temperature was tested according to the national standard GB / T 15022.2~5. The experimental conditions were set on the differential scanning calorimeter, including a heating rate of 5℃ / min, a nitrogen atmosphere, and a temperature range of -20 to 250℃.

[0080] (II) Scoring after basting:

[0081] Before the cross-cut adhesion test, the Micro-LED laser mass transfer and release materials provided in the above embodiments and comparative examples are first spin-coated onto a sapphire substrate and then dried. The spin-coating conditions can be 2000 rpm @ 30 s, and the drying conditions can be 120℃ @ 10 min. Then, the cross-cut adhesion test is performed. The cross-cut adhesion test is a test method used to evaluate the adhesion of materials to the surface (National Standard for Cross-cut Adhesion Test: GB / T 9286-2021). The specific steps are as follows:

[0082] (1) Scribing and soaking in alkali: Use a cross-cutting tool to scribble 10×10 small grids of 1mm×1mm on the surface of the test sample. Each scribing line should be deep enough to reach the bottom layer of the paint. Then immerse it in a 40% potassium hydroxide solution for 10 minutes.

[0083] (2) Cleaning: Use a brush to clean the debris from the test area;

[0084] (3) Tape test: Use 3M 600 tape or equivalent tape to firmly stick to the small grid to be tested, and rub the tape vigorously with an eraser to increase the contact area and force between the tape and the area to be tested.

[0085] (4) Peeling: After standing for 4 minutes, grab one end of the tape with your hand and quickly pull off the tape in a vertical direction (90°). Repeat the same test twice at the same position.

[0086] (5) Result Evaluation: Based on the degree of coating peeling, the adhesion grade is assessed according to standards. Typically, test results are expressed using numbers and letters to indicate the quality level of adhesion;

[0087] The evaluation criteria for the results of the 100-point test are as follows:

[0088] ISO Grade 0 / ASTM Grade 5B: The edges of the cut are completely smooth, and there is no peeling at the edges of the grid.

[0089] ISO Grade 1 / ASTM Grade 4B: Small pieces of material peel off at the intersection of the cuts, and the actual damage within the gridded area does not exceed 5%.

[0090] ISO Grade 2 / ASTM Grade 3B: There is peeling at the edges and / or intersections of the cut, covering an area greater than 5% but less than 15%.

[0091] ISO Grade 3 / ASTM Grade 2B: Partial or large-scale peeling along the cut edge, or partial peeling of a grid, with the peeled area exceeding 15% but less than 35%.

[0092] ISO Grade 4 / ASTM Grade 1B: Large areas of the cut edge are peeling off, or some squares are partially or completely peeled off, with an area greater than 35% but not more than 65% of the specification area.

[0093] ISO Class 5 / ASTM Class 0B: Above the previous class.

[0094] (III) Chip transfer yield:

[0095] The percentage of chips that can be lit after transfer is used to determine the total number of transferred chips. The chip transfer method refers to the chip mass transfer method provided in CN118366916A. The Micro-LED laser mass transfer release material provided in the above embodiments and comparative examples is used to prepare the laser-induced release layer.

[0096] The performance test results are shown in Table 4 below:

[0097] Table 4

[0098]

[0099]

[0100] As can be seen from the above, this invention, by designing the specific composition of the Micro-LED laser mass transfer release material and further by using compounds containing azophenyl groups, solves the technical problems of poor adhesion and inability to withstand high-temperature processes in the Micro-LED mass transfer process, which lead to release defects.

[0101] In this invention, a high-performance Micro-LED laser mass transfer release material was prepared through the synergistic effect of the components. The material has a glass transition temperature ≥49℃ and a cross-cutting grade of 5B after alkali soaking. After performing Micro-LED laser mass transfer using the Micro-LED laser mass transfer release material provided by this invention, the chip transfer yield is ≥0.9635.

[0102] As can be seen from Examples 1-4, Examples 8-11 and Comparative Examples 1-2, the present invention further optimizes the amount of compounds containing azophenyl groups to 15-25wt by controlling the amount of compounds containing azophenyl groups within a specific range, thereby improving the overall performance of the Micro-LED laser mass transfer release material, especially improving the chip transfer yield after Micro-LED laser mass transfer, with a yield ≥0.9986.

[0103] As can be seen from Examples 1-11 and Comparative Examples 1-5, the present invention has prepared a high-performance Micro-LED laser mass transfer and release material by designing the amount of each component in the Micro-LED laser mass transfer and release material within a specific range.

[0104] In summary, this invention designs the specific composition of Micro-LED laser mass transfer and release materials, and further prepares high-performance Micro-LED laser mass transfer and release materials by using compounds containing azophenyl groups.

[0105] The applicant declares that the detailed process flow of this invention is illustrated by the above embodiments, but this invention is not limited to the above detailed process flow, that is, it does not mean that this invention must rely on the above detailed process flow to be implemented. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of raw materials for the product of this invention, addition of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of this invention.

Claims

1. A Micro-LED laser mass transfer and release material, characterized in that, The Micro-LED laser mass transfer release material comprises the following components by mass percentage: 10-30% of azophenyl-containing compound; 10-30% of excipient resin; 0.1-5% of coupling agent; and 0.05-2% of leveling agent; wherein the azophenyl-containing compound contains 30-100% azophenyl groups by mass percentage.

2. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The compound containing the azophenyl group is selected from any one or a combination of at least two of the following: azobenzene, 4-aminoazobenzene, 4-hydroxyazobenzene, azobenzene oxide, 2,2'-dihydroxyazobenzene, 4,4'-dihydroxyazobenzene, 4,4'-dibromoazobenzene, 4,4'-diaminoazobenzene, 3,3'-dihydroxyazobenzene, 4-(methylamino)azobenzene, 4-bromo-4'-hydroxyazobenzene, N,N'-diethyl-4-aminoazobenzene, 4-methoxyazobenzene, 3,3'-dimethylazobenzene, N,N-dimethyl-4-(p-tolyldiazenyl)aniline, 4-(dimethylamino)-2-methylazobenzene, or 4-amino-4'-dimethylaminoazobenzene.

3. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The mass percentage of compounds containing azophenyl groups in the Micro-LED laser mass transfer release material is 15-25%.

4. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The excipient resin is selected from any one or a combination of at least two of the following: styrene-N-phenylmaleimide-maleic anhydride graft copolymer, styrene-maleic anhydride copolymer, polyetheretherketone, polyphenylene sulfide, polycarbonate, polyimide, polyetherimide, polyphenylene ether, polyethersulfone, polytetrafluoroethylene, and polylactic acid.

5. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The glass transition temperature of the auxiliary resin is 80-160℃.

6. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The mass percentage of the excipient resin in the Micro-LED laser mass transfer release material is 15-25%.

7. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The coupling agent is selected from silane coupling agents and / or borate ester coupling agents.

8. The Micro-LED laser mass transfer and release material according to claim 7, characterized in that, The silane coupling agent is selected from any one or a combination of at least two of γ-aminopropyltriethoxysilane, vinyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrichlorosilane, phenyltriethoxysilane, 3-(2,3-epoxypropoxypropyl)trimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, or diphenyldimethoxysilane.

9. The Micro-LED laser mass transfer and release material according to claim 7, characterized in that, The borate coupling agent is selected from any one or a combination of at least two of the following: trimethyl borate, triethyl borate, triphenyl borate, triisopropyl borate, tributyl borate, tri(2-ethylhexyl) borate, trialkyl borate, tri(2-hydroxyethyl) borate, tri(3-hydroxypropyl) borate, or tricyclohexyl borate.

10. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The coupling agent in the Micro-LED laser mass transfer release material has a mass percentage content of 0.5-3%.

11. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The leveling agent is selected from any one or a combination of at least two of acrylic leveling agents, fluorocarbon leveling agents, or silicone leveling agents.

12. The Micro-LED laser mass transfer and release material according to claim 11, characterized in that, The acrylic leveling agent comprises a polyester-modified polydimethylsiloxane solution with acrylate functional groups, and the solvent is xylene.

13. The Micro-LED laser mass transfer and release material according to claim 11, characterized in that, The fluorocarbon leveling agent includes fluorocarbon-modified polyacrylic wax.

14. The Micro-LED laser mass transfer and release material according to claim 11, characterized in that, The organosilicon leveling agent includes polyether-modified polydimethylsiloxane.

15. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The mass percentage of leveling agent in the Micro-LED laser mass transfer release material is 0.2-1.5%.

16. The Micro-LED laser mass transfer and release material according to claim 1, characterized in that, The Micro-LED laser mass transfer release material also includes a solvent.

17. The Micro-LED laser mass transfer and release material according to claim 16, characterized in that, The solvent content in the Micro-LED laser mass transfer release material is 30-80% by mass.

18. The Micro-LED laser mass transfer and release material according to claim 16, characterized in that, The solvent is selected from any one or a combination of at least two of the following: ketone solvents, aromatic solvents, ether solvents, amide solvents, dimethyl sulfoxide, or decahydronaphthalene.

19. A method for preparing a Micro-LED laser mass transfer and release material as described in any one of claims 1-18, characterized in that, The preparation method includes the following steps: mixing the components of the Micro-LED laser mass transfer release material evenly to obtain the Micro-LED laser mass transfer release material.

20. The preparation method according to claim 19, characterized in that, The preparation method includes the following steps: (1) mixing the compound containing azophenyl groups and the excipient resin; (2) adding a portion of the solvent to the mixture; (3) adding a coupling agent, leveling agent, solvent and the remaining solvent to the mixture to obtain the compound containing azophenyl groups.

21. The preparation method according to claim 20, characterized in that, The mixing method in step (1) includes stirring at a speed of 90-110 rpm.

22. The preparation method according to claim 20, characterized in that, The mixing method in step (2) includes stirring, wherein the stirring speed is 120-220 rpm and the stirring time is 6-10 h.

23. The preparation method according to claim 20, characterized in that, The mixing method in step (3) includes stirring, wherein the stirring speed is 240-320 rpm and the stirring time is 45-55 h.

24. The preparation method according to claim 20, characterized in that, Step (3) after mixing also includes a post-processing step, the post-processing method including settling and filtering.

25. An application of the Micro-LED laser mass transfer and release material as described in any one of claims 1-18, characterized in that, The Micro-LED laser mass transfer release material is used for laser mass transfer of Micro-LEDs.

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