High overload high rotation high precision attitude measurement system

Abstract

This invention discloses a high-overload, high-rotation, and high-precision attitude measurement system, comprising a base, a top cover, an inertial measurement unit (IMU), a micro-hemispherical gyroscope, a support circuit, an inner base, and a frame. The inner base is mounted on the bottom of the base via rubber damping pads. The bottom of the frame passes through a channel in the inner base and is bonded and fixed to the rubber damping pads. The edge of the frame's upper end overlaps the upper end of the inner base and is connected to the inner base via a metal-rubber vibration damper. A stepped hole is formed in the frame; the IMU is mounted below the stepped hole and sealed and fixed, while the micro-hemispherical gyroscope is mounted above the stepped hole but below its upper surface. The support circuit is located above the micro-hemispherical gyroscope and fixedly mounted on the frame. The top cover is fastened onto the base, pressing the support circuit, frame, and inner base tightly between the top cover and the base. This invention can operate stably under high overload and high rotation conditions, providing continuous and accurate attitude data.

Description

Technical Field

[0001] This invention relates to attitude measurement, specifically to a high-precision attitude measurement system for high overload and high rotation environments, belonging to the field of inertial navigation technology. Background Technology

[0002] Traditional inertial navigation systems often suffer performance degradation when faced with extreme acceleration and vibration environments, leading to a decrease in the accuracy and precision of attitude information. This is particularly pronounced in high-dynamic applications such as aerospace, deep-sea exploration, and military equipment, where accelerations can reach 20,000g and rotational speeds can reach 30 r / s, making it difficult for traditional inertial navigation systems to cope. Therefore, developing an attitude measurement system capable of withstanding high overloads and high rotations while maintaining high accuracy is of significant practical importance. Summary of the Invention

[0003] To address the aforementioned shortcomings of existing technologies, the purpose of this invention is to provide a high-overload, high-rotation, and high-precision attitude measurement system. This invention can operate stably under high overload and high rotation conditions, providing continuous and accurate attitude data.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] A high-overload, high-rotation, high-precision attitude measurement system includes a base, a top cover, an inertial measurement unit, a micro-hemispherical gyroscope, and supporting circuitry. The top cover is fastened to the base, forming a mounting cavity between them. The inertial measurement unit, micro-hemispherical gyroscope, and supporting circuitry are installed within the mounting cavity. The system is characterized by further including an inner base and a frame. The base is a box-like structure with an open top. The inner base is mounted on the bottom of the box structure via rubber vibration damping pads. A vertically penetrating frame channel is provided in the middle of the inner base. The bottom of the frame passes through the frame channel and is bonded and fixed to the rubber vibration damping pads. The upper surface of the frame has a rim extending outwards, which overlaps the upper surface of the inner base and is elastically connected to the inner base via metal-rubber vibration dampers.

[0006] A stepped hole with an open top and a closed bottom is provided on the frame. The inertial measurement unit is installed below the step of the stepped hole and fixed by potting glue. The micro-hemispherical gyroscope is installed above the stepped hole and below the upper surface of the stepped hole through the step. The support circuit is located above the micro-hemispherical gyroscope and is fixedly installed on the frame. The top cover is pressed onto the base from top to bottom and presses the support circuit, the frame, and the inner base between the top cover and the base.

[0007] Furthermore, the inner base has a rectangular cross-section and an array of honeycomb structures around its perimeter, with highly elastic organosilicon gel material filling the honeycomb structures.

[0008] Similarly, the frame also has a rectangular cross-section and an array of honeycomb structures around its perimeter, filled with a highly elastic organosilicon gel material.

[0009] Furthermore, a positioning pin is provided at the bottom of the frame step hole, and the bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by cooperating with the positioning pin through the positioning hole.

[0010] Furthermore, the support circuit includes a control circuit, a signal circuit, and a power supply; a power supply bracket is mounted on the upper end of the frame, and the power supply is mounted on the power supply bracket; a signal circuit bracket is mounted on the power supply bracket, and the signal circuit is mounted on the signal circuit bracket; the control circuit is mounted on the power supply bracket via a control circuit bracket.

[0011] Furthermore, the power supply bracket has a flat bottom surface, which is fitted to the upper surface of the frame and covers the micro-hemispherical gyroscope.

[0012] Furthermore, the power supply bracket has a receiving cavity A on its surface, and the power supply is fixedly installed in the receiving cavity A via connectors; the power supply bracket has four signal circuit bracket connecting posts and four control circuit bracket connecting posts, the four signal circuit bracket connecting posts are located at the four corners of rectangle A, and the four control circuit bracket connecting posts are located at the four corners of rectangle B, with rectangle A centered within rectangle B; the signal circuit bracket is fixedly installed on the power supply bracket via the four signal circuit bracket connecting posts; the control circuit bracket is located above the signal circuit bracket and is fixedly installed on the power supply bracket via the four control circuit bracket connecting posts.

[0013] Furthermore, the signal circuit support has a receiving cavity B, and the signal circuit is encapsulated in the receiving cavity B with potting compound.

[0014] Furthermore, the control circuit bracket has a hollowed-out section in the middle; the control circuit is mounted on the lower surface of the control circuit bracket.

[0015] Furthermore, a rubber damping pad is provided on the upper surface of the control circuit bracket, and the rubber damping pad is pressed between the control circuit bracket and the inner top surface of the top cover.

[0016] Furthermore, the potting compound is a silicone gel.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The rubber vibration damping pad of this invention is made of a highly elastic material, which can effectively absorb external impact energy. Metal-rubber vibration dampers are installed on the inner base to dampen the frame. When the system suffers an external impact, the rubber vibration damping pad first absorbs part of the energy, part is dissipated through the honeycomb structure on the frame and inner base, and the remaining energy is further attenuated by the metal-rubber vibration dampers. In addition, this application also uses potting for vibration damping, that is, placing the inertial measurement unit in the stepped hole of the frame and potting it with silicone gel, using the silicone gel to further reduce the impact of vibration and impact on electronic components. Reliable vibration damping is achieved through a multi-stage structure of rubber vibration damping pads, honeycomb structure, metal-rubber vibration dampers, and potting vibration damping. Therefore, this invention can operate stably under high overload and high rotation conditions, providing continuous and accurate attitude data. Attached Figure Description

[0019] Figure 1 - A schematic diagram of the attitude measurement system of this invention. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] See Figure 1 As shown in the figure, the high overload, high rotation, and high-precision attitude measurement system of the present invention includes a base 1, a top cover 2, an inner base 3 with a honeycomb structure, a frame 4 with a honeycomb structure, a power supply bracket 5, a signal circuit bracket 6, a control circuit bracket 7, a rubber vibration damping pad 8, an inertial measurement unit 9, a micro-hemispherical gyroscope 10, a control circuit 11, a signal circuit 12, a power supply 13, a metal-rubber vibration damper 14, and a communication connector 15. The control circuit 11, the signal circuit 12, and the power supply 13 together constitute the support circuit.

[0022] In this invention, the top cover 2 is fastened to the base 1, forming an installation cavity between them. Other components, such as the inertial measurement unit 9, the micro-hemispherical gyroscope 10, the inner base 3, the frame 4, the control circuit 11, the signal circuit 12, and the power supply 13, along with their corresponding brackets, are installed within the installation cavity. The specific installation method is described below:

[0023] The base 1 is a box structure with an open top. The inner base 3 is installed at the bottom of the box structure via rubber damping pads 8. A vertically penetrating frame channel 16 is provided in the middle of the inner base 3. The bottom of the frame 4 passes through the frame channel 16 and is bonded and fixed to the rubber damping pads 8. The upper surface of the frame 4 has a flange 17 extending outwards. The flange 17 overlaps the upper surface of the inner base 3 and is elastically connected to the inner base 3 via metal rubber dampers 14. There are four metal rubber dampers 14, which are installed on the four sides to elastically connect the frame 4 and the inner base 3.

[0024] A stepped hole 18, open at the top and closed at the bottom, is provided on the frame 4. The inertial measurement unit 9 is installed below the step of the stepped hole 18 and fixed by potting compound (silicone gel). The micro-hemispherical gyroscope 10 is installed above the stepped hole 18 and below the upper surface of the stepped hole 18 through the step of the stepped hole. The support circuit is located above the micro-hemispherical gyroscope 10 and is fixedly installed on the frame 4. The top cover 2 is fastened onto the base 1 from top to bottom, pressing the support circuit, the frame 4, and the inner base 3 between the top cover 2 and the base 1.

[0025] To achieve vibration reduction, the inner base 3 has a rectangular cross-section and an array of honeycomb structures 19 around its perimeter, filled with a highly elastic silicone gel material. Similarly, the frame 4 has a rectangular cross-section and also an array of honeycomb structures 19 around its perimeter, filled with a highly elastic silicone gel material. The honeycomb structures 19 on opposite sides of the inner base 3 and frame 4 are one-to-one and open at both ends, while the honeycomb structures 19 on perpendicular sides are interconnected. The honeycomb array of this invention is composed of several honeycomb units arranged sequentially in the horizontal direction. Each honeycomb unit consists of four honeycombs arranged in a cross shape. Two adjacent honeycomb units in the horizontal direction are combined into one, that is, they share a single honeycomb.

[0026] To facilitate the installation and positioning of the inertial measurement unit, the present invention provides a positioning pin at the bottom of the frame step hole, and the bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by the positioning hole cooperating with the positioning pin.

[0027] The power supply bracket 5 of the present invention is mounted on the upper end of the frame 4, and the power supply 13 is mounted on the power supply bracket 5; a signal circuit bracket 6 is mounted on the power supply bracket, and the signal circuit 12 is mounted on the signal circuit bracket 6; the control circuit 11 is mounted on the power supply bracket 5 through the control circuit bracket 7.

[0028] The power supply bracket 5 has a flat bottom surface, and the bottom surface of the power supply bracket 5 is attached to the upper end surface of the frame 4 to cover the micro-hemispherical gyroscope 10.

[0029] During installation, the power supply bracket 5 has a receiving cavity A20 on its surface, and the power supply 13 is fixedly installed in the receiving cavity A20 by connectors (screws). The power supply bracket 5 has four signal circuit bracket connecting posts 21 and four control circuit bracket connecting posts 22. The four signal circuit bracket connecting posts 21 are located at the four corners of rectangle A, and the four control circuit bracket connecting posts 22 are located at the four corners of rectangle B. Rectangle A is centered within rectangle B. The signal circuit bracket 6 is fixedly installed on the power supply bracket 5 by the four signal circuit bracket connecting posts 21. The control circuit bracket 7 is located above the signal circuit bracket 6 and is fixedly installed on the power supply bracket 5 by the four control circuit bracket connecting posts 22.

[0030] During installation, the signal circuit bracket 6 has a receiving cavity B23, and the signal circuit 12 is encapsulated in the receiving cavity B23 using silicone gel. In actual fabrication, the receiving cavity B23 has a through hole in the center of its bottom. This through hole facilitates the routing of signal circuit traces and the placement of large components. Before encapsulating the signal circuit 12, the through hole is first filled and sealed with 704 glue. After sealing, the receiving cavity B23 is no longer open vertically. Only then is the signal circuit 12 encapsulated.

[0031] In actual installation, the control circuit 11 is mounted on the lower surface of the control circuit bracket 7. Because the control circuit bracket is relatively thin, resonance may occur in the middle. Therefore, the present invention cuts out the middle of the control circuit bracket 7 to form a hollow structure 24.

[0032] The specific installation method of the signal circuit, control circuit and power supply of the present invention is based on the application scenario of high rotation speed. The present invention overlaps the center of gravity of the circuit and large components along the rotation axis, which can prevent the center of gravity offset from affecting the vibration reduction effect of the system under high rotation and high impact.

[0033] Furthermore, a rubber damping pad is provided on the upper surface of the control circuit bracket 7, and the rubber damping pad is pressed between the control circuit bracket 7 and the inner top surface of the top cover 2.

[0034] It also includes a communication connector 15, which is mounted on the base 1 with screws. The communication connector 15 serves as a communication interface to connect with the user or control system, and is connected to the signal circuit, control circuit, and power supply 13.

[0035] After the system starts, the inertial measurement unit 9 and the micro-hemispherical gyroscope 10 begin to collect acceleration and angular velocity data. After receiving the raw data, the data processing module calculates the current attitude information through a fusion algorithm. The attitude information is transmitted to the user or control system through the communication interface (i.e., the communication connector mentioned above). This invention can provide more accurate and stable attitude measurement results.

[0036] Because the rubber vibration damping pad 8 of the present invention is located at the bottom of the frame 4 and the inner base 3 and is made of a highly elastic material, it can effectively absorb external impact energy. The metal rubber vibration damper 14 is installed on the inner base 3 to dampen the frame 4. When the system suffers an external impact, the rubber vibration damping pad 8 first absorbs part of the energy, part of it is dissipated through the honeycomb structure 19 on the frame 4 and the inner base 3, and the remaining energy is further attenuated by the metal rubber vibration damper 14.

[0037] In addition to vibration reduction through damping pads, honeycomb structures, and metal-rubber vibration dampers, this application also employs potting for vibration reduction. Specifically, the inertial measurement unit (IMU) is placed within the stepped holes of the frame and potted with 502 silicone gel. The cross-linked structure of the silicone gel gives it softness and elasticity, effectively absorbing and dispersing impact forces, thus effectively absorbing the energy of vibration and further reducing the impact of vibration and shock on electronic components.

[0038] The above embodiments of the present invention are merely illustrative examples and are not intended to limit the implementation of the invention. Those skilled in the art can make other variations and modifications based on the above description. It is impossible to exhaustively list all possible implementations here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A high-overload, high-rotation, high-precision attitude measurement system, comprising a base, a top cover, an inertial measurement unit, a micro-hemispherical gyroscope, and a support circuit, wherein the top cover is fastened to the base, forming a mounting cavity between the two, and the inertial measurement unit, the micro-hemispherical gyroscope, and the support circuit are mounted within the mounting cavity; characterized in that: It also includes an inner base and a frame. The base is a box structure with an opening at the top. The inner base is installed at the bottom of the box structure by a rubber damping pad A. A frame channel is provided in the middle of the inner base, and the bottom of the frame passes through the frame channel and is bonded and fixed to the rubber damping pad A. The upper surface of the frame has a disc edge extending in all directions. The disc edge overlaps the upper surface of the inner base and is elastically connected to the inner base by a metal rubber damper. A stepped hole with an open top and a closed bottom is provided on the frame. The inertial measurement unit is installed below the step of the stepped hole and fixed by potting compound. The micro-hemispherical gyroscope is installed above the stepped hole and below the upper surface of the stepped hole through the step. The support circuit is located above the micro-hemispherical gyroscope and is fixedly installed on the frame. The top cover is fastened onto the base from top to bottom, pressing the support circuit, the frame, and the inner base between the top cover and the base. The inner base has a rectangular cross-section and an array of honeycomb structures around it, with highly elastic organosilicon gel material filling the honeycomb structures. The frame has a rectangular cross-section and an array of honeycomb structures around its perimeter, filled with a highly elastic organosilicon gel material.

2. The high overload, high rotation, and high precision attitude measurement system according to claim 1, characterized in that: A positioning pin is provided at the bottom of the frame step hole, and the bottom of the inertial measurement unit has a positioning hole corresponding to the positioning pin. The inertial measurement unit is positioned and installed in the step hole by cooperating with the positioning pin through the positioning hole.

3. The high overload, high rotation, and high-precision attitude measurement system according to claim 1, characterized in that: The support circuit includes a control circuit, a signal circuit, and a power supply; a power supply bracket is mounted on the upper end of the frame, and the power supply is mounted on the power supply bracket; a signal circuit bracket is mounted on the power supply bracket, and the signal circuit is mounted on the signal circuit bracket; the control circuit is mounted on the power supply bracket via a control circuit bracket.

4. The high overload, high rotation, and high precision attitude measurement system according to claim 3, characterized in that: The power supply bracket has a flat bottom surface, which is fitted to the upper surface of the frame and covers the micro-hemispherical gyroscope.

5. The high overload, high rotation, and high-precision attitude measurement system according to claim 3, characterized in that: The power supply bracket has a receiving cavity A on its surface, and the power supply is fixedly installed in the receiving cavity A by a connector. The power supply bracket has four signal circuit bracket connecting posts and four control circuit bracket connecting posts. The four signal circuit bracket connecting posts are located at the four corners of rectangle A, and the four control circuit bracket connecting posts are located at the four corners of rectangle B. Rectangle A is centered within rectangle B. The signal circuit bracket is fixedly installed on the power supply bracket by the four signal circuit bracket connecting posts. The control circuit bracket is located above the signal circuit bracket and is fixedly installed on the power supply bracket by the four control circuit bracket connecting posts.

6. The high overload, high rotation, and high precision attitude measurement system according to claim 3, characterized in that: The signal circuit support has a receiving cavity B, and the signal circuit is encapsulated in the receiving cavity B with potting compound.

7. The high overload, high rotation, and high precision attitude measurement system according to claim 3, characterized in that: The control circuit bracket has a hollowed-out center; the control circuit is mounted on the lower surface of the control circuit bracket.

8. The high overload, high rotation, and high-precision attitude measurement system according to claim 3, characterized in that: A rubber damping pad B is provided on the upper surface of the control circuit bracket, and the rubber damping pad B is pressed between the control circuit bracket and the inner top surface of the top cover.

9. The high overload, high rotation, and high precision attitude measurement system according to claim 3, characterized in that: The potting compound is a silicone gel.

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