Radio frequency chip plastic package assembly line and method thereof

Abstract

The invention discloses a plastic packaging assembly line for radio frequency chips. The plastic packaging assembly line sequentially comprises a plastic packaging frame shearing workbench, a first cleaning workbench, a chip mounting workbench, a second cleaning workbench, a bonding workbench, a dispensing workbench, a laser marking workbench and a cutting and dividing workbench, the plastic package frame shearing workbench shears the plastic package frame into single plastic package frames; the first cleaning workbench and the second cleaning workbench are used for plasma cleaning; the chip mounting workbench is used for mounting a plurality of chips of various types on the plastic package frame; the bonding workbench is in bonding connection through a semi-automatic bonding machine; the dispensing workbench is used for dispensing dam glue, underfill glue and pouring sealant through a manual and / or semi-automatic dispensing machine; the laser marking workbench carries out laser marking; and the cutting and dividing workbench cuts the packaged plastic packaging frame. The method is suitable for a product research and development stage, the packaging time is shortened by half compared with the packaging period of automatic quick packaging of a packaging factory, and the packaging cost is only 1 / 10 of that of quick packaging of the packaging factory.

Description

Technical Field

[0001] The invention relates to the technical field of plastic packaging, and in particular to a radio frequency chip plastic packaging assembly line and method thereof. Background Art

[0002] In the field of RF chip plastic packaging, the performance of the packaged product is closely related to the material characteristics of the package, the design and processing accuracy of the plastic package frame port, the chip and bonding wire arrangement position and bonding method, etc. This determines that most new product developments require performance confirmation before batch production. The packaging factory can provide this kind of plastic packaging and quick packaging service, and the packaged products are mainly used for performance verification.

[0003] The plastic packaging factory carries out the plastic packaging process based on automated equipment, in which the quick sealing method used simply reduces process control and lowers quality standards to quickly complete the packaging.

[0004] From the perspective of the actual needs of a chip design company, the current packaging factory's quick packaging business has the following problems:

[0005] (1) Plastic encapsulation is charged on a per-time basis. It is common in the industry for quick-seal encapsulation samples to be one or two hundred. Even if only a few dozen samples need to be encapsulated, a one-time engineering fee is required. In addition, if multiple products need to be packaged and verified at the same time, and a chip needs to undergo a single plastic encapsulation process, then the charge standard is the single-time single-item fee × the number of chip types. For design companies that need to develop multiple packaged products, the R&D costs for plastic encapsulation are obviously too high;

[0006] (2) Based on the objective reality of automation and large-scale production, packaging plants cannot provide mixed-type services in their quick-sealing business, that is, services for packaging multiple types of chips on a packaging frame. This is because plastic packaging plants are based on automated equipment for production. Packaging different types of chips at the same time requires reprogramming of the packaging process, which disrupts their existing production system, increases labor costs and the risk of mixing materials, so plastic packaging plants will not package multiple types of chips at the same time.

[0007] For chip design companies, the above factors lead to high R&D costs for plastic packaging and long packaging cycles, as well as problems such as chip material waste. Summary of the invention

[0008] In view of the deficiencies in the prior art, the present invention provides a radio frequency chip plastic packaging assembly line and method thereof to solve the technical problem in the prior art that a small number of multiple chips cannot be packaged simultaneously.

[0009] The present invention provides a radio frequency chip plastic packaging assembly line, which comprises: a plastic packaging frame cutting workbench, a first cleaning workbench, a patch workbench, a second cleaning workbench, a bonding workbench, a dispensing workbench, a laser marking workbench, and a dicing and segmenting workbench;

[0010] The plastic packaging frame cutting workbench is used to cut a version of the plastic packaging frame into a single plastic packaging frame; the first cleaning workbench is used to perform plasma cleaning on the plastic packaging frame; the patch workbench is used to attach multiple chips of various types to the plastic packaging frame; the second cleaning workbench is used to perform plasma cleaning on the plastic packaging frame with the patch; the bonding workbench performs bonding connection through a semi-automatic bonding machine; the glue dispensing workbench performs manual and / or semi-automatic glue dispensing to apply dam glue, bottom filling glue and potting glue; the laser marking workbench performs laser marking on each chip through a laser marking machine; the scribing and dividing workbench is used to cut the packaged plastic packaging frame to obtain a single packaged chip.

[0011] Furthermore, the model of the plastic-sealed frame shearing workbench is: 8011 steel shearing workbench.

[0012] Furthermore, the model of the patch workbench is: DBS3001E semi-automatic dispensing patch machine.

[0013] Furthermore, the model of the bonding workbench is: WB3001W manual wedge bonding machine or WB3001B manual and automatic ball bonding machine.

[0014] Furthermore, the model of the dispensing workbench is: MS-1D dispensing machine or JSZ6 stereo microscope.

[0015] The present invention also provides a radio frequency chip plastic packaging method, which is applicable to the radio frequency chip plastic packaging assembly line, and comprises the following steps:

[0016] Step 1: Cut and obtain a single Block plastic frame and clean it;

[0017] Step 2: According to the assembly drawing, attach multiple chips to the Block plastic frame and clean it;

[0018] Step 3: Wire bonding of multiple chips that have been completed;

[0019] Step 4: Apply dam glue on the Block plastic frame and cure it;

[0020] Step 5: Apply underfill glue on the Block plastic frame and cure it;

[0021] Step 6: Apply potting glue on the Block plastic frame and cure it;

[0022] Step 7: Mark and cut each packaged chip to complete the packaging process.

[0023] Furthermore, the specific process of step 4 is as follows:

[0024] Use a dispensing machine with a 3cc syringe and a 22-27G needle to evenly apply the dam glue along the interface between the Block plastic frame and the transfer tooling. The dam height range is: 1.6mm-2.5mm. After dispensing, use an oven to dry at 125℃ for 20 minutes for curing.

[0025] Furthermore, the specific process of step 5 is as follows:

[0026] Use a dispensing machine with a 3cc syringe and a 22-27G needle. Insert the needle into the gap between the pins of the Block plastic frame under a microscope to apply the primer, so that the glue flows fully and evenly in the gap between the pins. After dispensing, use an oven to dry at 150°C for 60 minutes for curing.

[0027] Furthermore, the specific process of step 6 is as follows:

[0028] Use a dispensing machine with a 10cc syringe and an 18-22G needle to apply potting glue on the chip surface within the dam. The thickness of the potting glue should be half of the dam height. After dispensing, let it stand for 30 minutes and then use an oven to dry at 150°C for 90 minutes for curing.

[0029] Beneficial effects of the present invention:

[0030] The entire production line of the present invention does not entirely use automated equipment, especially on the glue dispensing workbench, manual and / or semi-automatic glue dispensing machines are used to perform the glue dispensing process, which completely simulates the automated equipment and does not require program writing during the glue dispensing process. It is fully adaptable to different types of chip packaging. Although the automated process is turned into a manual and / or semi-automatic process, the benefits obtained are far greater than the benefits of automation, and it is suitable for rapid confirmation and design iteration in the product development stage; flexible and rapid packaging, the packaging time is shortened by half compared to the automated quick packaging cycle of the packaging factory; in the research and development stage, the packaging cost is only 1 / 10 of that of the quick packaging of the packaging factory.

[0031] The dispensing method proposed by the present invention can replace the automated packaging of the packaging factory and effectively solves the problems of glue control and potting glue thickness control in the manual mode. At the same time, the use of bottom filling glue and potting glue also effectively solves the problem of void control in the semi-automatic assembly mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0033] Figure 1 It is a schematic diagram of a pipeline of a specific embodiment of the present invention;

[0034] Figure 2 It is a schematic diagram of the plastic sealing frame of the Block before assembly of a specific embodiment of the present invention;

[0035] Figure 3 This is a sample example diagram of a chip assembly completed by plastic packaging frame assembly according to a specific embodiment of the present invention;

[0036] Figure 4 It is a front view of a fixture according to a specific embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0038] The present invention is further illustrated below in conjunction with specific embodiments. Those skilled in the art should understand that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention, and modifications to various equivalent forms of the present invention fall within the scope defined by the appended claims of this application.

[0039] like Figure 1 As shown, the present invention provides a radio frequency chip plastic packaging assembly line, which includes: a plastic packaging frame cutting workbench, a first cleaning workbench, a patch workbench, a second cleaning workbench, a bonding workbench, a dispensing workbench, a laser marking workbench, and a dicing and segmenting workbench;

[0040] The plastic frame cutting workbench is used to cut a plastic frame into a single plastic frame; the first cleaning workbench uses a plasma cleaning agent to plasma clean the plastic frame; the patch workbench uses a desktop semi-automatic glue dispensing machine or chip tweezers to stick multiple chips on the plastic frame, where the preferred model of the conductive glue used for the patch is: EPO-TEK H20E; the second cleaning workbench uses a plasma cleaning agent to plasma clean the plastic frame with the patch; the bonding workbench uses a semi-automatic bonding machine to perform wire bonding; the glue dispensing workbench uses manual and / or semi-automatic glue dispensing machines to dispense dam glue, bottom filling glue and potting glue, where the preferred model of the dam glue is: Techspray 2211-8SQ, the preferred model of the bottom filling glue is: HHCK 6663, and the preferred model of the liquid potting glue is: HHCK 6556; The laser marking workbench uses a laser marking machine to laser mark each chip; the scribing and dividing workbench is used to cut the packaged plastic packaging frame to obtain a single packaged chip.

[0041] The present invention also provides a radio frequency chip plastic packaging method, which is applicable to the radio frequency chip plastic packaging assembly line, and comprises the following steps:

[0042] Step 1: Cut and obtain a single Block plastic frame, and use a plasma cleaning machine to perform plasma cleaning. A single Block plastic frame has multiple array-arranged pads, which can be used for chip placement of different models;

[0043] like Figure 3 , 4 As shown, a single Block plastic sealing frame is clamped on a transfer tool. The transfer tool includes: a bottom plate and a frame. The bottom plate area is larger than the area of ​​a single Block plastic sealing frame. The frame can press the single Block plastic sealing frame onto the bottom plate. The four corners of the frame are fixed to the bottom plate by bolts. The single Block plastic sealing frame is clamped on the transfer tool. The use of the transfer tool can facilitate transfer and subsequent process operations.

[0044] Step 2: According to the assembly drawing, attach multiple chips to the corresponding pads in the Block plastic frame using a desktop semi-automatic glue dispenser or chip tweezers, and perform plasma cleaning using a plasma cleaning machine;

[0045] Step 3: Wire bond multiple chips that have been completed by using a semi-automatic bonding machine;

[0046] like Figure 2 , 3As shown, step 4: Use the Musashi MS-1D dispensing machine, with a 3cc syringe and a 22-27G needle to evenly apply the dam glue along the interface between the Block plastic frame and the transfer tooling. The entire dam height range is 1.6mm-2.5mm. The dam height can be adjusted according to the packaging height requirements to prevent the subsequent liquid potting glue from overflowing to the connection position between the frame and the fixture and affecting the subsequent separation. After applying the dam glue, it needs to be fully cured in an oven at 125℃ / 20min.

[0047] Step 5: Use the Musashi MS-1D dispensing machine, a 3cc syringe and a 22-27G needle. Insert the needle into the gap of the Block plastic frame under a microscope to dispense glue to ensure that the glue flows fully and evenly in the gap. The role of the bottom filling glue is to reduce the void problem caused by insufficient flow of the potting glue in the gap in the subsequent process under manual operation. After the gap of the entire Block plastic frame is filled with the bottom filling glue, it needs to be fully cured in an oven at 150℃ / 60min.

[0048] Step 6: Use the Musashi MS-1D dispensing machine, a 10cc syringe and a 18-22G needle to evenly apply the potting glue on the Block plastic frame and allow the glue to flow fully and evenly within the dam. The thickness of the potting glue is about 1mm, which is half the height of the dam, and is also easy to identify and control during manual operation. After the glue is filled, it needs to be left to stand for 30 minutes before being placed in an oven at 150℃ / 90 minutes for full curing.

[0049] Step 7: Laser mark each packaged chip for product identification, then cut and divide it into single packaged products to complete the packaging process.

[0050] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A radio frequency chip plastic packaging production line, characterized in that: It includes: plastic packaging frame cutting workbench, first cleaning workbench, patch workbench, second cleaning workbench, bonding workbench, dispensing workbench, laser marking workbench, and dicing and segmenting workbench. The plastic packaging frame cutting workbench is used to cut a version of the plastic packaging frame into a single plastic packaging frame; the first cleaning workbench is used to perform plasma cleaning on the plastic packaging frame; the patch workbench is used to attach multiple chips of various types to the plastic packaging frame; the second cleaning workbench is used to perform plasma cleaning on the plastic packaging frame with the patch; the bonding workbench performs bonding connection through a semi-automatic bonding machine; the glue dispensing workbench performs manual and / or semi-automatic glue dispensing to apply dam glue, bottom filling glue and potting glue; the laser marking workbench performs laser marking on each chip through a laser marking machine; the scribing and dividing workbench is used to cut the packaged plastic packaging frame to obtain a single packaged chip.

2. The RF chip plastic packaging assembly line according to claim 1, characterized in that: The model of the plastic-sealed frame shearing workbench is: 8011 steel shearing workbench.

3. The RF chip plastic packaging assembly line according to claim 1, characterized in that: The model of the patch workbench is: DBS3001E semi-automatic dispensing patch machine.

4. The RF chip plastic packaging assembly line according to claim 1, characterized in that: The model of the bonding workbench is: WB3001W manual wedge bonding machine or WB3001B manual and automatic ball bonding machine.

5. The RF chip plastic packaging assembly line according to claim 1, characterized in that: The models of the dispensing workbench are: MS-1D dispensing machine and JSZ6 stereo microscope.

6. A radio frequency chip plastic packaging method, applicable to the radio frequency chip plastic packaging line as claimed in any one of claims 1 to 5, characterized in that: The method comprises the following steps: Step 1: Cut and obtain a single Block plastic frame and clean it; Step 2: According to the assembly drawing, attach multiple chips to the Block plastic frame and clean it; Step 3: Wire bonding of multiple chips that have been completed; Step 4: Apply dam glue on the Block plastic frame and cure it; Step 5: Apply underfill glue on the Block plastic frame and cure it; Step 6: Apply potting glue on the Block plastic frame and cure it; Step 7: Mark and cut each packaged chip to complete the packaging process.

7. The RF chip plastic packaging method according to claim 6, characterized in that: The specific process of step 4 is as follows: Use a dispensing machine with a 3cc syringe and a 22-27G needle to evenly apply the dam glue along the interface between the Block plastic frame and the transfer tooling. The dam height range is: 1.6mm-2.5mm. After dispensing, use an oven to dry at 125℃ for 20 minutes for curing.

8. The RF chip plastic packaging method according to claim 6, characterized in that: The specific process of step 5 is as follows: Use a dispensing machine with a 3cc syringe and a 22-27G needle. Insert the needle into the gap between the pins of the Block plastic frame under a microscope to apply the primer, so that the glue flows fully and evenly in the gap between the pins. After dispensing, use an oven to dry at 150°C for 60 minutes for curing.

9. The RF chip plastic packaging method according to claim 6, characterized in that: The specific process of step 6 is as follows: Use a dispensing machine with a 10cc syringe and an 18-22G needle to apply potting glue on the chip surface within the dam range. The thickness of the potting glue should be half of the dam height. After dispensing, let it stand for 30 minutes and then use an oven to dry at 150°C for 90 minutes for curing.

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