Metering method and device, equipment and storage medium

Abstract

The invention relates to a metering method, device and equipment and a storage medium, the metering method is used for a display, the display comprises a substrate, a first metal layer, a first insulating layer and a second metal layer which are stacked in sequence, the first insulating layer is stacked on the first metal layer and forms a first climbing angle, and the second insulating layer is stacked on the second metal layer. The second metal layer is laminated on the first insulating layer and forms a second climbing angle, and the metering method comprises the following steps: determining a first climbing angle based on the first thickness of the first metal layer and the first length of the first metal layer, determining a first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer and the first thickness, determining a second climbing thickness based on the first thickness, a third thickness of the first insulating layer, a fourth thickness of the second metal layer and a second climbing angle, and determining a risk value based on the first climbing angle, a preset angle fluctuation value, the first climbing thickness and the second climbing thickness, the cost for measuring the explosion risk at the climbing position of the gate drive circuit of the array substrate is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a measurement method, device, equipment and storage medium. Background Art

[0002] At present, thin film transistor liquid crystal displays have the advantage of high resolution and are loved by a large number of users. The thin film transistor liquid crystal display uses an array substrate gate drive circuit, which can achieve the high-resolution display effect of the thin film transistor liquid crystal display. However, there is a risk of explosion at the climbing part of the array substrate gate drive circuit. In the prior art, a large number of experiments are used to measure the risk of explosion at the climbing part of the array substrate gate drive circuit, which is costly. Summary of the invention

[0003] The object of the present invention is to provide a measurement method, device, equipment and storage medium to reduce the cost of measuring the risk of explosion at the climbing point of the array substrate gate drive circuit.

[0004] To achieve the purpose of the present invention, the present invention provides the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a measurement method for a display, wherein the display comprises a substrate, a first metal layer, a first insulating layer, and a second metal layer stacked in sequence, the first insulating layer being stacked on the first metal layer and forming a first climbing angle, the second metal layer being stacked on the first insulating layer and forming a second climbing angle, the method comprising: determining the first climbing angle based on the first thickness of the first metal layer and the first length of the first metal layer; determining the first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness; determining the second climbing thickness based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle; determining a risk value based on the first climbing angle, a preset angle fluctuation value, the first climbing thickness, and the second climbing thickness.

[0006] In this embodiment, the risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, so that the user can obtain the risk value through measurement and calculation, without the need to conduct a large number of experiments to measure the risk of explosion at the climbing point, thereby reducing costs.

[0007] In a possible example, the first climbing angle is determined based on the first thickness of the first metal layer and the first length of the first metal layer, using the following formula: A=arc[tan(d1 / l1)], where A is the first climbing angle, d1 is the first thickness, and l1 is the first length.

[0008] In this embodiment, the formula A=arc[tan(d1 / l1)] is used to determine the first climbing angle, and the first climbing angle can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the first climbing angle.

[0009] In a possible example, the first climbing thickness is determined based on the first climbing angle, the second thickness of the first insulating layer and the first thickness, using the following formula: B=0.773d2-0.156d2cosA-0.061d1+813, where B is the first climbing thickness and d2 is the second thickness.

[0010] In this embodiment, the formula B=0.773d2-0.156d2cosA-0.061d1+813 is used to determine the first climbing thickness, and the first climbing thickness can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the first climbing thickness.

[0011] In a possible example, the second climbing thickness is determined based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer and the second climbing angle, using the following formula: D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, where C is the second climbing angle, d3 is the third thickness, d4 is the fourth thickness, and D is the second climbing thickness.

[0012] In this embodiment, the second climbing thickness is determined using the formula D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, and the second climbing thickness can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the second climbing thickness.

[0013] In a possible example, the risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, using the following formula: E=A / (B*D), where E is the risk value; the risk value includes a first sub-value and a second sub-value, the first sub-value is E1, the second sub-value is E2, and the preset angle fluctuation value is F, satisfying: E1=(AF) / (B*D), E2=(A+F) / (B*D), E1≤E≤E2; when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the climbing part of the array substrate gate drive circuit of the display is not damaged.

[0014] In this embodiment, the risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, and the range of the risk value is determined. The normal range of the risk value can be obtained through measurement and calculation, which improves the efficiency and accuracy of obtaining the risk value, and also improves the accuracy of measuring the explosion risk at the climbing point of the array substrate gate drive circuit.

[0015] In a possible example, a normal value is calculated based on the first climbing angle and the first climbing thickness, and the normal value includes a first sub-normal value and a second sub-normal value. When the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specifications are normal.

[0016] In this embodiment, the normal value is calculated according to the first climbing angle and the first climbing thickness, and the first sub-normal value and the second sub-normal value are used to determine the normal range of the display specifications, thereby improving the efficiency and accuracy of measuring the normality of the display specifications.

[0017] In a possible example, the normal value is G, the first sub-normal value is G1, and the second sub-normal value is G2, satisfying: G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2.

[0018] In this embodiment, the formula G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2 is used to measure whether the display specifications are normal, thereby improving the efficiency and accuracy of measuring whether the display specifications are normal.

[0019] In a second aspect, an embodiment of the present application provides a metering device, including a device for executing the method provided in the first aspect or any implementation scheme of the first aspect.

[0020] In a third aspect, an embodiment of the present application provides a metering device, comprising a memory and a processor, wherein the memory is used to store computer instructions, and the processor is used to call the computer instructions to execute a module of the method provided in the first aspect or any embodiment of the first aspect.

[0021] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program enables a computer to execute to implement the method provided in the first aspect or any embodiment of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of an application scenario of a metering method provided in an embodiment of the present application;

[0024] Figure 2 It is a flow chart of a measurement method provided in an embodiment of the present application;

[0025] Figure 3 It is a structural schematic diagram of a metering device provided in an embodiment of the present application;

[0026] Figure 4 It is a structural schematic diagram of a metering device provided in an embodiment of the present application;

[0027] Figure 5 It is a partial structural schematic diagram of a display provided in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 10-display, 101-operator, 102-first display, 103-measuring device, 104-computing device, 105-server, 11-substrate, 12-first metal layer, 13-first insulating layer, 14-second metal layer, d1-first thickness, l1-first length, A-first climbing angle, B-first climbing thickness, d2-second thickness, C-second climbing angle, d3-third thickness, d4-fourth thickness, D-second climbing thickness, E-risk value, E1-first sub-value, E2-second sub-value, F-preset angle fluctuation value, G-normal value, G1-first sub-normal value, G2-second sub-normal value, 300-measuring device, 301-acquisition module, 302-processing module, 400-measuring device, 401-processor, 402-memory. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0032] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0033] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0034] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] The terms "1" and "2" etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] See also Figure 1 , Figure 1 Schematic diagram of an application scenario of a measurement method provided in an embodiment of the present application. Figure 1As shown, the application scenario schematic diagram includes an operator 101, a first display 102, a measuring device 103, a computing device 104, and a server 105. Optionally, the first display 102 may be a thin film transistor liquid crystal display, and the present application does not limit the structure of the first display 102. Optionally, one operator 101 may use multiple measuring devices 103. Optionally, one operator 101 may use multiple computing devices 104. Optionally, multiple computing devices 104 may perform data transmission with one server 105.

[0038] Optionally, the server 105 can be an independent server 105, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content distribution networks (CDNs), and big data and artificial intelligence platforms. The server 105 may be implemented by a server cluster consisting of multiple sub-servers. The computing device 104, such as a computer, may have an operating system including but not limited to a Linux system, a Unix system, a Windows series system (such as Windows XP, Windows 7, etc.) and the like.

[0039] It should be noted that Figure 1 The number and form of each device in the system shown, as well as the number of operators 101 are for illustrative purposes only and do not constitute a limitation on the embodiments of the present application.

[0040] The following describes a metering method provided in an embodiment of the present application. The method may be executed by a metering device, which may be implemented by software and / or hardware and may generally be integrated in a metering device or server 105 .

[0041] Please refer to Figure 2 , Figure 2 This is a flow chart of a measurement method provided by an embodiment of the present application. The measurement method uses an inline monitoring mechanism and an inline characteristic value to measure the risk of explosion at the climbing point of the array substrate gate drive circuit. The measurement method is applied to a display as an example. The measurement device may include a server or an electronic device. Please refer to the structure of the display. Figure 5 , Figure 5It is a partial structural schematic diagram of a display provided by an embodiment of the present application, wherein the second metal layer includes a first area, a second area and a third area, one end of the second area is connected to the first area, and the other end is connected to the third area, the orthographic projection of the third area on the substrate overlaps with the orthographic projection of the first metal layer on the substrate at least partially, the orthographic projection of the first area on the substrate does not overlap with the orthographic projection of the first metal layer on the substrate, the first area, the second area and the third area form a bent structure, the second area is a climbing area, the second area and the first area form a second climbing angle, and the fourth thickness is the thickness of the first area. The first insulating layer includes a fourth area, a fifth area and a sixth area, one end of the fifth area is connected to the fourth area, and the other end is connected to the sixth area, the orthographic projection of the sixth area on the substrate overlaps with the orthographic projection of the first metal layer on the substrate at least partially, the orthographic projection of the fourth area on the substrate does not overlap with the orthographic projection of the first metal layer on the substrate, the fourth area, the fifth area and the sixth area form a bent structure, the second thickness of the first insulating layer is the thickness of the fourth area, and the third thickness of the first insulating layer is the thickness of the sixth area.

[0042] The method comprises the following steps S201-S204, combining Figure 5 To explain,

[0043] S201: Determine a first climbing angle based on a first thickness of a first metal layer and a first length of the first metal layer.

[0044] For example, a thin film transistor liquid crystal display is composed of a color film substrate and an array substrate sandwiching liquid crystal, wherein the deflection of the liquid crystal is controlled by the circuit of the substrate. In most cases, the two sides of the liquid crystal display are array substrate gate drive circuits, which are used to control the switching of the thin film transistor.

[0045] For example, the first thickness and other thicknesses that need to be measured in this application can be collected using various thickness measuring devices, which are not limited in this application. For example, the first length and other lengths that need to be measured in this application can be collected using various length measuring devices, which are not limited in this application.

[0046] In one implementation, the first climbing angle is determined based on the first thickness of the first metal layer and the first length of the first metal layer, using the following formula:

[0047] A=arc[tan(d1 / l1)], A is the first climbing angle, d1 is the first thickness, and l1 is the first length.

[0048] In this embodiment, the formula A=arc[tan(d1 / l1)] is used to determine the first climbing angle, and the first climbing angle can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the first climbing angle.

[0049] S202: Determine a first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness.

[0050] In one implementation, the first climbing thickness is determined based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness, using the following formula:

[0051] B=0.773d2-0.156d2cosA-0.061d1+813, B is the first climbing thickness, d2 is the second thickness.

[0052] In this embodiment, the formula B=0.773d2-0.156d2cosA-0.061d1+813 is used to determine the first climbing thickness, and the first climbing thickness can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the first climbing thickness.

[0053] S203: Determine a second climbing thickness based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle.

[0054] In one implementation, the second climbing thickness is determined based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle, using the following formula:

[0055] D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, C is the second climbing angle, d3 is the third thickness, d4 is the fourth thickness, and D is the second climbing thickness.

[0056] In this embodiment, the second climbing thickness is determined using the formula D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, and the second climbing thickness can be quickly obtained through measurement and calculation, thereby improving the efficiency and accuracy of obtaining the second climbing thickness.

[0057] S204: Determine a risk value based on the first climbing angle, a preset angle fluctuation value, the first climbing thickness, and the second climbing thickness.

[0058] Optionally, the risk value may be determined in combination with the actual production conditions (including RA verification and GDL-related items and high temperature and high humidity, etc.).

[0059] In one embodiment, a risk value is determined based on a first climbing angle, a preset angle fluctuation value, a first climbing thickness, and a second climbing thickness, using the following formula: E=A / (B*D), where E is the risk value; the risk value includes a first sub-value and a second sub-value, the first sub-value is E1, the second sub-value is E2, and the preset angle fluctuation value is F, satisfying: E1=(AF) / (B*D), E2=(A+F) / (B*D), E1≤E≤E2; when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the climbing part of the array substrate gate drive circuit of the display is not damaged.

[0060] For example, when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the explosion risk at the climbing point of the array substrate gate driving circuit is within a normal range, and no explosion will occur at the climbing point of the array substrate gate driving circuit.

[0061] In this embodiment, the risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, and the range of the risk value is determined. The normal range of the risk value can be obtained through measurement and calculation, which improves the efficiency and accuracy of obtaining the risk value, and also improves the accuracy of measuring the explosion risk at the climbing point of the array substrate gate drive circuit.

[0062] In one embodiment, a normal value is calculated based on the first climbing angle and the first climbing thickness, and the normal value includes a first sub-normal value and a second sub-normal value. When the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specifications are normal.

[0063] In this embodiment, the normal value is calculated according to the first climbing angle and the first climbing thickness, and the first sub-normal value and the second sub-normal value are used to determine the normal range of the display specifications, thereby improving the efficiency and accuracy of measuring the normality of the display specifications.

[0064] In one implementation, a normal value is calculated according to the first climbing angle and the first climbing thickness, the normal value includes a first sub-normal value and a second sub-normal value, and when the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specification is normal. The normal value is G, the first sub-normal value is G1, and the second sub-normal value is G2, satisfying: G = A / B, G1 = (AF) / B, G2 = (A+F) / B, G1≤G≤G2.

[0065] Optionally, the difference in film layers between the normal sheet and the scrapped sheet can be divided using the average first climbing angle and the thickness of each film layer of the normal sheet and the scrapped sheet.

[0066] In this embodiment, the formula G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2 is used to measure whether the display specifications are normal, thereby improving the efficiency and accuracy of measuring whether the display specifications are normal.

[0067] In this embodiment, the risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, so that the user can obtain the risk value through measurement and calculation, without the need to conduct a large number of experiments to measure the risk of explosion at the climbing point, thereby reducing costs.

[0068] See also Figure 3 , Figure 3 300 is a schematic diagram of a metering device provided in an embodiment of the present application. Based on the above system architecture, the metering device 300 can be a server or a device, or a module in a server. The metering device 300 includes at least: a collection module 301 and a processing module 302, wherein:

[0069] The acquisition module 301 is used to obtain the first thickness of the first metal layer, the first length of the first metal layer, the second thickness of the first insulating layer, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, the second climbing angle and the preset angle fluctuation value.

[0070] The processing module 302 is used to determine the first climbing angle based on the first thickness of the first metal layer and the first length of the first metal layer; the processing module 302 is also used to determine the first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer and the first thickness; the processing module 302 is also used to determine the second climbing thickness based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer and the second climbing angle; the processing module 302 is also used to determine the risk value based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness.

[0071] In a possible example, the processing module 302 is configured to determine the first climbing angle based on the first thickness of the first metal layer and the first length of the first metal layer, using the following formula:

[0072] A=arc[tan(d1 / l1)], A is the first climbing angle, d1 is the first thickness, and l1 is the first length.

[0073] In a possible example, the processing module 302 is configured to determine the first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness, using the following formula:

[0074] B=0.773d2-0.156d2cosA-0.061d1+813, B is the first climbing thickness, d2 is the second thickness.

[0075] In a possible example, the processing module 302 is configured to determine the second climbing thickness based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle, using the following formula:

[0076] D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, C is the second climbing angle, d3 is the third thickness, d4 is the fourth thickness, and D is the second climbing thickness.

[0077] In one possible example, the processing module 302 is used to determine the risk value based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, using the following formula: E=A / (B*D), E is the risk value; the risk value includes a first sub-value and a second sub-value, the first sub-value is E1, the second sub-value is E2, the preset angle fluctuation value is F, and the processing module 302 is also used to perform data processing according to the following formula: E1=(AF) / (B*D), E2=(A+F) / (B*D), E1≤E≤E2; when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the climbing part of the array substrate gate drive circuit of the display is not damaged.

[0078] In one possible example, the processing module 302 is used to calculate a normal value based on a first climbing angle and a first climbing thickness, where the normal value includes a first sub-normal value and a second sub-normal value. When the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specifications are normal.

[0079] In a possible example, the normal value is G, the first sub-normal value is G1, and the second sub-normal value is G2. The processing module 302 is used to perform data processing according to the following formula: G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2.

[0080] See also Figure 4 , Figure 4 Schematic diagram of a metering device provided in an embodiment of the present application. Figure 4 As shown, the metering device 400 includes a processor 401 and a memory 402. The memory 402 is used to store computer instructions, and the processor 401 is used to call the computer instructions to execute the following steps:

[0081] determining a first climbing angle based on a first thickness of the first metal layer and a first length of the first metal layer;

[0082] determining a first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness;

[0083] determining a second climbing thickness based on the first thickness, a third thickness of the first insulating layer, a fourth thickness of the second metal layer, and a second climbing angle;

[0084] The risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness, and the second climbing thickness.

[0085] In a possible example, the processor 401 is specifically configured to execute instructions of the following steps:

[0086] The first climbing angle is determined based on the first thickness of the first metal layer and the first length of the first metal layer, using the following formula:

[0087] A=arc[tan(d1 / l1)], A is the first climbing angle, d1 is the first thickness, and l1 is the first length.

[0088] In a possible example, the processor 401 is specifically configured to execute instructions of the following steps:

[0089] The first climbing thickness is determined based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness, using the following formula:

[0090] B=0.773d2-0.156d2cosA-0.061d1+813, B is the first climbing thickness, d2 is the second thickness.

[0091] In a possible example, the processor 401 is specifically configured to execute instructions of the following steps:

[0092] The second climbing thickness is determined based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle, using the following formula:

[0093] D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, C is the second climbing angle, d3 is the third thickness, d4 is the fourth thickness, and D is the second climbing thickness.

[0094] In a possible example, the processor 401 is specifically configured to execute instructions of the following steps:

[0095] The risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, using the following formula: E=A / (B*D), E is the risk value; the risk value includes a first sub-value and a second sub-value, the first sub-value is E1, the second sub-value is E2, the preset angle fluctuation value is F, satisfying: E1=(AF) / (B*D), E2=(A+F) / (B*D), E1≤E≤E2; when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the climbing part of the array substrate gate drive circuit of the display will not be damaged.

[0096] In a possible example, the processor 401 is specifically configured to execute instructions of the following steps:

[0097] A normal value is calculated according to the first climbing angle and the first climbing thickness. The normal value includes a first sub-normal value and a second sub-normal value. When the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specifications are normal.

[0098] In a possible example, the processor 401 is specifically configured to execute instructions of the calculation step according to the following formula:

[0099] The normal value is G, the first sub-normal value is G1, and the second sub-normal value is G2, satisfying: G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2.

[0100] Those skilled in the art will appreciate that for ease of description, Figure 4 Only one memory 402 and processor 401 are shown. In an actual terminal or server, there may be multiple processors 401 and memories 402. The memory 402 may also be referred to as a storage medium or a storage device, etc., which is not limited in the embodiment of the present application.

[0101] It should be understood that in the present application, the processor 401 may be a central processing unit (CPU), and the processor 401 may also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor 401 may also be a general-purpose microprocessor, a graphics processing unit (GPU), or one or more integrated circuits to execute related programs to implement the functions required to be executed in the embodiments of the present application.

[0102] The processor 401 can also be an integrated circuit chip with signal processing capabilities. In the implementation process, the various steps of the present application can be completed by the integrated logic circuit of the hardware in the processor 401 or the instructions in the form of software. The above-mentioned processor 401 can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present application. The steps of the method disclosed in the embodiments of the present application can be directly embodied as a hardware decoding processor to be executed, or the hardware and software modules in the decoding processor are combined and executed. The software module can be located in a mature storage medium in the field such as a random access memory, a flash memory and a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 402, and the processor 401 reads the information in the memory 402, and completes the functions required to be performed by the unit included in the method, device and storage medium of the embodiment of the present application in combination with its hardware.

[0103] It should also be understood that the memory 402 mentioned in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct RAM bus random access memory (DR RAM). The memory may also be a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to this. The memory may be independent and connected to the processor via a bus. The memory 402 may also be integrated with the processor 401. The memory 402 may store programs. When the programs stored in the memory are executed by the processor 401, the processor 401 is used to execute the various steps of the determination method in the above embodiment of the present application.

[0104] It should be noted that when the processor 401 is a general-purpose processor, DSP, ASIC, FPGA or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, the memory 402 (storage module) is integrated into the processor. It should be noted that the memory 402 described herein is intended to include but is not limited to these and any other suitable types of memory.

[0105] It should be understood that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0106] In the implementation process, each step of the above method can be completed by an integrated logic circuit of hardware in the processor 401 or an instruction in the form of software. The steps of the method disclosed in conjunction with the embodiment of the present application can be directly embodied as a hardware processor for execution, or a combination of hardware and software modules in the processor 401 for execution. The software module can be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 402, and the processor reads the information in the memory 402, and completes the steps of the above method in conjunction with its hardware. To avoid repetition, it is not described in detail here.

[0107] Those skilled in the art will appreciate that the various illustrative logic blocks (ILBs) and steps described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or in a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0108] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a program product of computer programming. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on the processor 401, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center, or can be transmitted from one website site, computer, server or data center to the mobile phone processor by wired mode. The computer-readable storage medium can be any available medium that can be accessed by the computer or a data storage device such as a server or data center that contains one or more available media integrated. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state hard disk), etc.

[0109] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be covered by the protection scope of the present application.

Claims

1. A measuring method, characterized in that: For a display, the display comprises a substrate, a first metal layer, a first insulating layer, and a second metal layer stacked in sequence, the first insulating layer is stacked on the first metal layer and forms a first climbing angle, the second metal layer is stacked on the first insulating layer and forms a second climbing angle, the method comprises: determining the first climbing angle based on a first thickness of the first metal layer and a first length of the first metal layer; determining a first climbing thickness based on the first climbing angle, the second thickness of the first insulating layer, and the first thickness; determining a second climbing thickness based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer, and the second climbing angle; A risk value is determined based on the first climbing angle, a preset angle fluctuation value, the first climbing thickness, and the second climbing thickness.

2. The measuring method according to claim 1, characterized in that: The first climbing angle is determined based on the first thickness of the first metal layer and the first length of the first metal layer, using the following formula: A=arc[tan(d1 / l1)], where A is the first climbing angle, d1 is the first thickness, and l1 is the first length.

3. The measuring method according to claim 2, characterized in that: The first climbing thickness is determined based on the first climbing angle, the second thickness of the first insulating layer and the first thickness, using the following formula: B=0.773d2-0.156d2cosA-0.061d1+813, B is the first climbing thickness, and d2 is the second thickness.

4. The measuring method according to claim 3, characterized in that: The second climbing thickness is determined based on the first thickness, the third thickness of the first insulating layer, the fourth thickness of the second metal layer and the second climbing angle, using the following formula: D=0.773d4-0.156d4cosC-0.061(d1+d3)+813, C is the second climbing angle, d3 is the third thickness, d4 is the fourth thickness, and D is the second climbing thickness.

5. The measuring method according to claim 4, characterized in that: The risk value is determined based on the first climbing angle, the preset angle fluctuation value, the first climbing thickness and the second climbing thickness, using the following formula: E=A / (B*D), where E is the risk value; the risk value includes a first sub-value and a second sub-value, the first sub-value is E1, the second sub-value is E2, and the preset angle fluctuation value is F, satisfying: E1=(AF) / (B*D), E2=(A+F) / (B*D), E1≤E≤E2; when the risk value is greater than or equal to the first sub-value and less than or equal to the second sub-value, the climbing part of the array substrate gate drive circuit of the display is not damaged.

6. The measuring method according to claim 5, characterized in that: A normal value is calculated according to the first climbing angle and the first climbing thickness, the normal value including a first sub-normal value and a second sub-normal value, and when the normal value is greater than or equal to the first sub-normal value and less than or equal to the second sub-normal value, the display specification is normal.

7. The measuring method according to claim 6, characterized in that: The normal value is G, the first sub-normal value is G1, and the second sub-normal value is G2, satisfying: G=A / B, G1=(AF) / B, G2=(A+F) / B, G1≤G≤G2.

8. A metering device, characterized in that: The method comprises executing the method as claimed in any one of claims 1 to 7.

9. A measuring device, characterized in that: The method comprises a memory and a processor, wherein the memory is used to store computer instructions, and the processor is used to call the computer instructions to execute the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, which enables a computer to execute to implement the method according to any one of claims 1 to 7.

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