Pressing performance detection method and pressing performance detection device

Abstract

The invention belongs to the technical field of semiconductor preparation, and relates to a lamination performance detection method, which comprises the following steps: setting preset parameters for a bonding head control mechanism, the preset parameters comprising a detection threshold value; the pressing mechanism is used for pressing the lead frame; the bonding head control mechanism controls the bonding head to apply first pressure to the lead frame, and after pressurization is stable, the current encoder reading is recorded as a first detection value; the bonding head control mechanism controls the bonding head to apply second pressure to the lead frame, and the current encoder reading is recorded as a second detection value; calculating a detection difference value between the first detection value and the second detection value; judging whether the detection threshold value is greater than the detection difference value; if yes, the pressing performance of the lead frame is qualified. The invention further relates to a pressing performance detection device. According to the technical scheme provided by the invention, the detection precision and the detection efficiency of the pressing performance of the wire bonder can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and more specifically, to a method and device for detecting pressing performance. Background Art

[0002] In the field of semiconductor packaging and testing, fully automatic wire bonding machines use a hot-compression ultrasonic ball bonding process to connect important locations in semiconductors with metal wires. The quality of the solder ball at one end of the wire is crucial, and the pressing performance of the wire bonding machine plays a key role in product quality.

[0003] At present, the wire bonding performance detection of wire bonding equipment is mainly through the operator manually pressing the lead frame to be tested, and the operator observes the shaking of the lead frame through a microscope to make a judgment. Since the operator manually applies force to the lead frame, it cannot be guaranteed that the same force is used every time, and there are differences in the operator's judgment, resulting in inconsistent testing standards for pressing performance and slow testing efficiency. In addition, since the thickness of the solder ball of the semiconductor chip is usually in the micron level, even with a microscope, it is difficult to observe micron-level disturbances in the lead frame, resulting in poor detection accuracy of the pressing performance. Summary of the invention

[0004] The technical problem to be solved by the embodiments of the present application is that the existing pressing performance detection method has low detection efficiency, inconsistent detection standards, and poor detection accuracy, resulting in a low product yield.

[0005] In order to solve the above technical problems, the present application provides a method for detecting lamination performance, which adopts the following technical solution: A method for testing pressing performance comprises the following steps: Setting preset parameters for the bungee control mechanism, wherein the preset parameters include a detection threshold; The pressing mechanism performs pressing processing on the lead frame; The binding head control mechanism controls the binding head to apply a first pressure to the lead frame, and after the pressure is stabilized, records the current encoder reading as a first detection value; The bunding head control mechanism controls the bunding head to apply a second pressure to the lead frame, and records the current encoder reading as a second detection value; Calculating a detection difference between the first detection value and the second detection value; Determining whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the lead frame is qualified.

[0006] Furthermore, the step of the pressing mechanism pressing the lead frame comprises the following steps: Setting an initial pressing stroke in the pressing mechanism, wherein the initial pressing stroke is 5 mm to 10 mm; The pressing mechanism controls the pressing plate to move the initial pressing stroke to perform a pressing process on the lead frame; After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, thereby completing the pressing process of the lead frame.

[0007] Further, when the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and the pressing mechanism performs a secondary pressing process on the lead frame, wherein the secondary pressing process includes the following steps: Correcting the pressing stroke of the pressing mechanism, wherein the corrected stroke is the sum of the initial pressing stroke and the compensation stroke, and the range of the compensation stroke is 2 μm to 1 mm; The pressing mechanism controls the pressing plate to move the correction stroke to perform a secondary pressing process on the lead frame; After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, completing the secondary pressing process of the lead frame.

[0008] Furthermore, the preset parameters also include a set deviation value, wherein the range of the set deviation value is 2 μm to 3 μm; The pressurization stability is tested by the following steps: After the bunding head control mechanism controls the bunding head to complete applying the first pressure to the lead frame, the bunding head control mechanism records the current encoder reading as a third detection value; After the first pressure is maintained for a second set time, the bungee control mechanism records the current encoder reading as a fourth detection value, wherein the second set time ranges from 100ms to 200ms; Calculate the difference between the third detection value and the fourth detection value to determine whether the difference is less than the set deviation value. If yes, proceed to the next step; if not, the bungee control mechanism controls the bungee to reset.

[0009] Furthermore, the lead frame includes a frame and at least two detection sub-units distributed in the frame in a matrix array structure, and the preset parameters also include movement parameters; After the step of laminating the lead wire by the laminating mechanism, the following steps are included: The bun head control mechanism controls the bun head to move to the target detection subunit based on the movement parameter; The binding head control mechanism controls the binding head to apply a first pressure to the target detection subunit, and after the pressure is stabilized, records the current encoder reading as a first detection value; The binding head control mechanism controls the binding head to apply a second pressure to the target detection subunit, and records the current encoder reading as a second detection value; Calculating a detection difference between the first detection value and the second detection value; Determining whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the target detection subunit is qualified, and the next step is entered; The bunting head control mechanism controls the bunting head to move to the next detection subunit for detection based on the movement parameters.

[0010] Furthermore, after the bungee control mechanism controls the bungee to complete the pressure performance test of all the test subunits of the lead frame, the method further includes the following steps: Normalizing the detection difference of each detection subunit; A pressing performance cloud diagram of the lead frame is drawn.

[0011] Furthermore, the pressure range of the first pressure is 25g / mm 2 ~35g / mm 2 and / or, The pressure range of the second pressure is 80g / mm 2 ~120g / mm 2 and / or, The detection threshold ranges from 18 μm to 20 μm.

[0012] In order to solve the above technical problems, the present application also provides a pressing performance detection device, which adopts the following technical solution: A pressing performance detection device, used to perform the pressing performance detection method as described above, wherein the pressing performance detection device comprises a bundling control mechanism and a pressing mechanism, the pressing mechanism is used to carry a lead frame, and the bundling control mechanism is used to detect the pressing performance of the lead frame; The pressing mechanism comprises a workbench, a lifting assembly and a pressing plate, wherein the lifting assembly is mounted on the workbench, the pressing plate is mounted on the lifting assembly, and the workbench is used to carry the lead frame; The bungee control mechanism comprises a bungee mounting seat, a bungee and an encoder. The bungee is rotatably mounted on the bungee mounting seat. The encoder is mounted on the bungee mounting seat. The encoder is used to detect position data of the bungee.

[0013] Furthermore, the bun head control mechanism also includes a controller, and the controller is connected to the bun head mounting seat and the encoder respectively; The controller has built-in preset parameters, which include a detection threshold and a set deviation value.

[0014] Furthermore, the bun head control mechanism also includes a translation component, the bun head mounting seat is installed on the translation component, and the translation component is connected to the controller, wherein the preset parameters also include movement parameters; The translation assembly is used to control the horizontal movement of the bundling head mounting seat relative to the pressing mechanism, so as to adjust the position correspondence between the bundling head and each detection sub-unit of the lead frame.

[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects: The method for detecting the pressing performance provided in the present application applies a quantitative pressure to the lead frame for detection through the bunging head, unifies the detection standard of the pressing performance, and based on the comparison of the detection difference between the first detection value and the second detection value and the detection threshold, can quickly judge whether the pressing performance is qualified, thereby improving the detection efficiency of the pressing performance; because the encoder reading is used to read the first detection value and the second detection value, it is possible to monitor the disturbance at the micron level, improve the detection accuracy of the pressing performance, and further improve the yield rate of the product; in addition, by applying pressure to the lead frame twice through the bunging head, and ensuring that the first pressure is stable before recording the first detection value, it is possible to ensure stable contact between the bunging head and the lead frame, avoid affecting the detection accuracy of the pressing performance due to the position deviation between the bunging head and the lead frame, and improve the detection accuracy of the pressing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the scheme of the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 is a flow chart of a method for detecting lamination performance according to the first embodiment of the present application; Figure 2 is a flow chart of a method for detecting lamination performance according to a second embodiment of the present application; Figure 3 is a schematic structural diagram of a lead frame according to an embodiment of the present application; Figure 4 is a structural schematic diagram of a pressing performance detection device according to an embodiment of the present application; Figure 5 It is a pressing performance cloud chart drawn by the first pressing performance test in the embodiment of the present application.

[0018] Reference numerals: 1. Bang head control mechanism; 11. Bang head mounting seat; 12. Bang head; 13. Encoder; 14. Cantilever; 15. Translation assembly; 2. Pressing mechanism; 21. Workbench; 22. Lifting assembly; 23. Pressing plate; 3. Lead frame; 31. Frame; 32. Detection subunit. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] Embodiment 1 of the method for testing the lamination performance of the present application See also Figure 1 As shown, an embodiment of the present application provides a method for detecting pressing performance. In this embodiment, a pressing performance detection device performs pressing performance detection on the lead frame as a whole.

[0022] In some embodiments, the method for detecting the lamination performance comprises the following steps: Step S101, setting preset parameters for the bungee control mechanism.

[0023] In some embodiments, the bungee control mechanism includes a controller, which has the preset parameters built in, wherein the preset parameters include a detection threshold, and the detection threshold is used to determine whether the pressing performance of the lead frame is qualified. In some embodiments, the detection threshold ranges from 18μm to 20μm. Specifically, the detection threshold can be set to any one of 18μm, 19μm, 20μm or a range formed between any two values.

[0024] Step S102 : a pressing mechanism performs a pressing process on the lead frame.

[0025] In some embodiments, the pressing mechanism includes a workbench, a lifting assembly and a pressing plate, the lifting assembly is installed on the workbench, the pressing plate is installed on the lifting assembly, and the workbench is used to carry the lead frame; the lifting assembly controls the pressing plate to press the lead frame, and then the lifting assembly controls the pressing plate to rise to facilitate subsequent pressing performance testing of the lead frame.

[0026] Step S103, the bunding head control mechanism controls the bunding head to apply a first pressure to the lead frame, and after the pressure is stabilized, records the current encoder reading as a first detection value.

[0027] In some embodiments, the bungee control mechanism also includes a bungee mounting seat, a bungee and an encoder. The bungee is rotatably mounted on the bungee mounting seat, and the encoder is mounted on the bungee mounting seat. The encoder is used to detect the position data of the bungee. In an initial state, the bungee rests against the surface of the lead frame. When working, the bungee mounting seat controls the bungee to rotate a certain angle to apply a first pressure to the lead frame. The encoder records the moving distance of the bungee and inputs the encoder reading into the controller.

[0028] In some embodiments, the pressure range of the first pressure is 25g / mm 2 ~35g / mm 2 Specifically, the first pressure can be set to 25 g / mm 2 、30 g / mm 2 , 35 g / mm 2 Any value or the range between any two values ​​in .

[0029] Step S104 , the bunding head control mechanism controls the bunding head to apply a second pressure to the lead frame, and records the current encoder reading as a second detection value.

[0030] In some embodiments, the second pressure is greater than the first pressure, wherein the pressure range of the second pressure is 80 g / mm 2 ~120g / mm 2 Specifically, the first pressure can be set to 80 g / mm 2 , 90 g / mm 2 , 100g / mm 2 , 110g / mm 2 , 120g / mm 2 Any value or the range between any two values ​​in .

[0031] Step S105, calculating a detection difference between the first detection value and the second detection value.

[0032] Step S106, determining whether the detection threshold is greater than the detection difference.

[0033] Step S1061: when the detection threshold is greater than the detection difference, the pressing performance of the lead frame is qualified, and the pressing performance detection of the lead frame is ended.

[0034] Step S1062: when the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and the process returns to step S102, where the pressing mechanism performs secondary pressing on the lead frame.

[0035] In this embodiment, after the pressing mechanism completes the pressing of the lead frame, the pressing head control mechanism controls the pressing head to press the lead frame twice. The first pressing is used to position the pressing head and the lead frame, and the second pressing is used to detect the pressing performance of the lead frame.

[0036] The method for detecting the pressing performance provided in the present application applies a quantitative pressure to the lead frame for detection through the bunging head, unifies the detection standard of the pressing performance, and based on the comparison of the detection difference between the first detection value and the second detection value and the detection threshold, can quickly judge whether the pressing performance is qualified, thereby improving the detection efficiency of the pressing performance; because the encoder reading is used to read the first detection value and the second detection value, it is possible to monitor the disturbance at the micron level, improve the detection accuracy of the pressing performance, and further improve the yield rate of the product; in addition, by applying pressure to the lead frame twice through the bunging head, and ensuring that the first pressure is stable before recording the first detection value, it is possible to ensure stable contact between the bunging head and the lead frame, avoid affecting the detection accuracy of the pressing performance due to the position deviation between the bunging head and the lead frame, and improve the detection accuracy of the pressing performance.

[0037] In some embodiments, in step S102, the step of laminating the lead frame by the laminating mechanism specifically includes the following steps: An initial pressing stroke is set in the pressing mechanism.

[0038] In some embodiments, the initial pressing stroke is set to 5mm to 10mm. Specifically, the initial pressing stroke is set to any value of 5mm, 6mm, 7mm, 8mm, 9mm, 10mm or a range formed between any two values. In this embodiment, the initial pressing stroke is preferably 5mm.

[0039] The pressing mechanism controls the pressing plate to move the initial pressing stroke to perform a pressing process on the lead frame.

[0040] After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, thereby completing the pressing process of the lead frame.

[0041] In this embodiment, the first set time is set to 2s to 3s. Specifically, the pressing mechanism sets the pressing time of the lead frame to any one of 2s and 3s or a range formed between any two values.

[0042] Based on the initial pressing stroke having been set in the pressing mechanism in step S102, after the judgment in step S106, entering step S1062, when the detection threshold is less than the detection difference and the pressing performance of the lead frame is unqualified, the pressing mechanism performs a secondary pressing process on the lead frame, wherein the secondary pressing process includes the following steps: The pressing stroke of the pressing mechanism is corrected.

[0043] In some embodiments, the correction stroke is the sum of the initial pressing stroke and the compensation stroke. The range of the compensation stroke is 2μm to 1mm. Specifically, the range of the compensation stroke is any one of 2μm, 5μm, 10μm, 20μm, 50μm, 100μm, 200μm, 500μm, 1mm, or a range formed between any two values. In order to improve the pressing efficiency of the lead frame and avoid damage to the lead frame by the pressing plate, in this embodiment, the compensation stroke is set to 2μm.

[0044] The pressing mechanism controls the pressing plate to move the correction stroke to perform a secondary pressing process on the lead frame.

[0045] After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, completing the secondary pressing process of the lead frame.

[0046] In this embodiment, after the steps of the secondary pressing process as described above, steps S103 to S106 are used to further test the pressing performance of the lead frame after the secondary pressing process. If the requirements of step S1061 are met, the pressing performance of the lead frame after the secondary pressing process is qualified, the testing of the pressing performance is stopped, and the correction stroke corrected in the steps of the secondary pressing process as described above is used as the initial pressing stroke for the subsequent pressing process; if step S1062 is entered, the correction stroke corrected in the steps of the secondary pressing process as described above is further corrected, and further pressing is performed with the corrected pressing stroke until the pressing performance of the lead frame after the pressing process meets the requirements of step S1061.

[0047] The embodiment of the present application presets a compensation stroke. When the current pressing performance test fails, the initial pressing stroke is increased by at least one set stroke, so that the lead frame meets the pressing test standard after a second or multiple pressings, so as to obtain the optimal pressing stroke distance that meets the pressing test standard, thereby improving the detection efficiency and processing efficiency of subsequent lead frame pressing.

[0048] In some embodiments, the preset parameters also include a set deviation value, and the set deviation value is used to determine whether the relative position of the bungee and the lead frame in step S103 is stable, wherein the range of the set deviation value is 2μm to 3μm, specifically, the range of the set deviation value can be set to any value between 2μm, 2.5μm, 3μm or a range formed between any two values.

[0049] In some embodiments, the pressurization in step S103 is stable, which is detected by the following steps: After the bunding head control mechanism controls the bunding head to complete applying the first pressure to the lead frame, the bunding head control mechanism records the current encoder reading as the third detection value.

[0050] After the first pressure is maintained for a second set time, the binding head control mechanism records the current encoder reading as a fourth detection value.

[0051] In some embodiments, the range of the second set time is 100 ms to 200 ms. Specifically, the range of the second set time can be set to any value between 100 ms, 150 ms, and 200 ms or a range formed between any two values.

[0052] Calculate the difference between the third detection value and the fourth detection value to determine whether the difference is less than the set deviation value. If yes, proceed to step S104; if not, the bungee control mechanism controls the bungee to reset, and the relative position between the bungee and the lead frame is unstable, requiring repositioning and pressure application.

[0053] The embodiment of the present application determines the relative displacement between the bunking head and the lead frame after the first pressure is applied by the difference in encoder readings, so as to ensure that the relative position between the bunking head and the lead frame tends to be stable, thereby avoiding the influence of position deviation on the detection accuracy of the pressing performance and improving the detection accuracy of the pressing performance; in addition, the difference in encoder readings can detect micron-level disturbances between the bunking head and the lead frame, thereby improving the detection accuracy.

[0054] Embodiment 2 of the method for testing the lamination performance of the present application Since the pressing plate usually contacts and applies pressure to the frame of the lead frame during the pressing process of the lead frame, the pressing performance of the periphery of the lead frame is better than the pressing performance of the center of the lead frame. Therefore, a single pressing performance test of the lead frame is not sufficient to fully reflect the pressing performance test of each area of ​​the lead frame.

[0055] In order to improve the detection accuracy of the pressing performance of each area of ​​the lead frame, the difference between this embodiment and Example 1 is that the lead frame provided in this embodiment includes a frame and at least two detection sub-units distributed in the frame in a matrix array structure. The pressing performance of each detection sub-unit is respectively detected by a pressing performance detection device to obtain the pressing performance detection of each area of ​​the lead frame. Compared with Example 1, the detection method of this embodiment has better detection accuracy.

[0056] In some embodiments, the lead frame includes a frame and a plurality of detection sub-units distributed in the frame in a row-column array structure, wherein the plurality of detection sub-units are arranged in an 8×5 manner, such as Figure 3 shown.

[0057] See also Figure 2 As shown, based on the lead frame as described above, the method for detecting the pressing performance provided in the embodiment of the present application specifically includes the following steps: Step S201, setting preset parameters for the bungee control mechanism.

[0058] In some embodiments, the preset parameters include a detection threshold and a movement parameter, wherein the detection threshold is used to determine whether the pressing performance of the lead frame is qualified, and the movement parameter is used to control the movement of the bungee from the target detection subunit to the next detection subunit; the range of the detection threshold is 18μm to 20μm, specifically, the detection threshold can be set to any one of 18μm, 19μm, 20μm or a range formed between any two values.

[0059] Step S202: The pressing mechanism performs pressing processing on the lead frame.

[0060] Step S203, the bunning head control mechanism controls the bunning head to move to the target detection subunit based on the movement parameters.

[0061] Step S204, the binding head control mechanism controls the binding head to apply a first pressure to the target detection subunit, and after the pressure is stabilized, the current encoder reading is recorded as a first detection value.

[0062] In some embodiments, the pressure range of the first pressure is 25g / mm 2 ~35g / mm 2Specifically, the first pressure can be set to 25 g / mm 2 、30 g / mm 2 , 35 g / mm 2 Any value or the range between any two values ​​in .

[0063] Step S205, the binding head control mechanism controls the binding head to apply a second pressure to the target detection subunit, and records the current encoder reading as a second detection value.

[0064] In some embodiments, the second pressure is greater than the first pressure, wherein the pressure range of the second pressure is 80 g / mm 2 ~120g / mm 2 Specifically, the first pressure can be set to 80 g / mm 2 , 90 g / mm 2 , 100g / mm 2 , 110g / mm 2 , 120g / mm 2 Any value or the range between any two values ​​in .

[0065] Step S206, calculating a detection difference between the first detection value and the second detection value.

[0066] Step S207, determining whether the detection threshold is greater than the detection difference.

[0067] Step S2071, when the detection threshold is greater than the detection difference, the pressing performance of the target detection subunit is qualified, the pressing performance detection of the current target detection subunit is ended, and the process proceeds to step S208.

[0068] Step S2072: when the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and the process proceeds to step S208.

[0069] Step S208, the bunting control mechanism controls the bunting to move to the next detection subunit for detection based on the movement parameters, and returns to step S204.

[0070] The embodiment of the present application divides the lead frame into several detection sub-units and performs pressure detection on each detection sub-unit respectively, so that the operator can understand the pressing performance information of the specific area of ​​the lead frame, and based on the pressing performance of each area, timely adjust the pressing stroke of the pressing plate and the relative position of the pressing plate and the lead frame, thereby improving the pressing accuracy of the pressing plate on the lead frame and improving the yield rate of the product.

[0071] In some embodiments, before step S208, the following steps are also included: The bungee control mechanism determines whether there is a next detection subunit; If yes, then execute step S208; if no, then stop the pressing performance test.

[0072] In some embodiments, after the bunding head control mechanism controls the bunding head to complete the pressure performance test of all the detection subunits of the lead frame, the judgment results of step S207 of each detection subunit and the detection differences of each detection subunit are summarized.

[0073] In this embodiment, when all the detection sub-units meet the requirements of step S2071, the overall pressing performance of the lead frame is qualified, and the performance detection of the lead frame is completed; When the judgment result of at least one detection subunit meets step S2072, the following steps are also included: The detection difference of each detection subunit is normalized.

[0074] In this embodiment, the formula for the normalization process is as follows: ; Among them, x is the detection difference of the target detection subunit, x max is the maximum detection difference of the detection sub-unit in the lead frame, x min is the minimum detection difference of the detection sub-unit in the lead frame, x norm It is the detection difference after normalization of the target detection subunit.

[0075] A pressing performance cloud diagram of the lead frame is drawn.

[0076] The embodiment of the present application uses normalization processing to process the detection difference, which can eliminate the data scale difference and map the data to a unified range, ensuring that the contribution of each dimensional feature to the cloud map is balanced, so that the operator can intuitively compare and analyze the pressing performance of each area of ​​the lead frame, and adjust the pressing stroke of the pressing plate according to the cloud map, thereby improving the pressing quality of the lead frame by the pressing mechanism.

[0077] Based on the above-mentioned method for detecting the lamination performance, an embodiment of the present application provides a lamination performance detection device, which is used to execute the above-mentioned method for detecting the lamination performance.

[0078] See also Figure 4 As shown, in some embodiments, the pressing performance detection device provided in the present application includes a bundling control mechanism 1 and a pressing mechanism 2, wherein the pressing mechanism 2 is used to carry a lead frame 3, and the bundling control mechanism 1 is used to detect the pressing performance of the lead frame 3.

[0079] In some embodiments, the pressing mechanism 2 includes a workbench 21 , a lifting assembly 22 and a pressing plate 23 . The lifting assembly 22 is installed on the workbench 21 , the pressing plate 23 is installed on the lifting assembly 22 , and the workbench 21 is used to support the lead frame 3 .

[0080] In this embodiment, the lead frame 3 is rigidly connected to the workbench 21 through solder balls. In other embodiments, the workbench 21 is further provided with a plurality of vacuum adsorption holes, and the lead frame 3 is fixed to the workbench 21 through the rigid connection of the solder balls and the vacuum adsorption effect of the vacuum adsorption holes.

[0081] The bungee control mechanism 1 includes a bungee mounting seat 11 , a bungee 12 and an encoder 13 . The bungee 12 is rotatably mounted on the bungee mounting seat 11 . The encoder 13 is mounted on the bungee mounting seat 11 . The encoder 13 is used to detect position data of the bungee 12 .

[0082] In this embodiment, the said bang head control mechanism 1 further comprises a cantilever 14, the said cantilever 14 is rotatably mounted on the output end of the said bang head mounting seat 11, the said bang head 12 is mounted on one end of the said bang head mounting seat 11 in principle of the said cantilever 14, the said bang head mounting seat 11 drives the said bang head 12 to move by controlling the rotation of the cantilever 14, see Figure 4 As shown, in this embodiment, the rotation angle α of the cantilever 14 ranges from -1° to 6°, wherein the counterclockwise rotation direction of the cantilever 14 is the positive direction; specifically, the rotation angle α of the cantilever 14 can be set to any one of -1°, 0°, 1°, 2°, 3°, 4°, 5°, 6° or a range formed between any two values.

[0083] In the embodiment of the present application, the rotation angle of the cantilever 14 is controlled to drive the bunker 12 to move, thereby applying different pressures to the lead frame 3 through the bunker 12 , so as to facilitate pressure performance testing of the lead frame 3 .

[0084] The pressing performance detection device provided in the embodiment of the present application controls the moving distance of the bundling head 12, thereby applying a quantitative pressure to the lead frame 3 for detection, unifies the detection standard of the pressing performance, and can quickly determine whether the pressing performance is qualified, thereby improving the detection efficiency of the pressing performance; by adopting the encoder 13 reading to read the detection degree of the pressing performance, it is possible to monitor the disturbance at the micron level, thereby improving the detection accuracy of the pressing performance and further improving the yield rate of the product.

[0085] In some embodiments, the bun head control mechanism 1 further includes a controller (not shown in the figure), and the controller is connected to the bun head mounting seat 11 and the encoder 13 respectively; The controller has built-in preset parameters, which include a detection threshold and a set deviation value.

[0086] In some embodiments, the lead frame 3 includes a frame 31 and a plurality of detection subunits 32 distributed in the frame 31 in a matrix array structure, wherein the plurality of detection subunits 32 are arranged in an 8×5 manner, such as Figure 3 shown.

[0087] The bun head control mechanism 1 further includes a translation component 15, the bun head mounting seat 11 is mounted on the translation component 15, and the translation component 15 is connected to the controller, wherein the preset parameters also include movement parameters; The translation assembly 15 is used to control the horizontal movement of the bundling head mounting seat 11 relative to the pressing mechanism 2 to adjust the position correspondence between the bundling head 12 and each detection sub-unit 32 of the lead frame 3 .

[0088] The embodiment of the present application divides the lead frame 3 into a plurality of detection sub-units 32 and performs pressure detection on each detection sub-unit 32 respectively, so that the operator can understand the pressing performance information of the specific area of ​​the lead frame 3, and timely adjust the pressing stroke of the pressing plate 23 and the relative position of the pressing plate 23 and the lead frame 3 based on the pressing performance of each area, thereby improving the pressing accuracy of the pressing plate 23 on the lead frame 3 and improving the yield rate of the product.

[0089] The present application is described in detail below through specific embodiments. The following embodiments are only partial embodiments of the present application and are not limitations of the present application. Example

[0090] Step (1), setting preset parameters for the bungee control mechanism, wherein the preset parameters include a detection threshold, a set deviation value and a movement parameter, the detection threshold is 18 μm, and the set deviation value is 2 μm.

[0091] Step (2), a pressing mechanism performs pressing processing on the lead frame, wherein the initial pressing stroke of the pressing processing is 5 μm.

[0092] In step (3), the bungee control mechanism controls the bungee to move to the target detection subunit based on the movement parameters.

[0093] Step (4), the binding head control mechanism controls the binding head to apply a first pressure of 30 g / mm to the target detection subunit 2 After the pressure stabilizes, record the current encoder reading as the first detection value.

[0094] Step (5), the binding head control mechanism controls the binding head to apply a second pressure of 100g / mm2 to the target detection subunit 2 , record the current encoder reading as the second detection value.

[0095] Step (6), calculating the detection difference between the first detection value and the second detection value.

[0096] Step (7), determine whether the detection threshold is greater than the detection difference, and record the detection difference.

[0097] Step (8), the bungee control mechanism controls the movement to the next detection subunit for detection based on the movement parameters.

[0098] Step (9), after the bungee control mechanism controls the bungee to complete the pressure performance test of all the detection subunits of the lead frame, the detection difference of each detection subunit is summarized and made into a table, as shown in Table 1: .

[0099] As shown in Table 1, after the pressing performance test of step (4) to step (8), it can be known that the detection differences of the detection sub-units of four columns and three rows, four columns and four rows, four columns and five rows, four columns and six rows, five columns and two rows, five columns and three rows, five columns and four rows, five columns and five rows, five columns and six rows, five columns and seven rows, six columns and three rows, six columns and four rows, six columns and five rows, and six columns and six rows located in the middle of the lead frame are all greater than the detection threshold. Therefore, the pressing performance of the above detection sub-units is unqualified, and the pressing performance of the lead frame is unqualified, and a secondary pressing process is required.

[0100] Step (⑽), normalizing the detection differences of each detection sub-unit, and drawing a compression performance cloud diagram of the lead frame.

[0101] like Figure 5 As shown, according to the pressing performance cloud map produced after the normalization processing of the detection differences of each detection sub-unit recorded in Table 1, it can be intuitively seen that the pressing performance in the middle area of ​​the lead frame is unqualified.

[0102] Step (⑾), correcting the pressing stroke of the pressing mechanism. Specifically, the compensation stroke is 2 μm, and the correction stroke of the pressing mechanism is 5+2=7 μm.

[0103] Step (⑿), the pressing mechanism presses the lead frame based on the correction stroke.

[0104] Step ⒀, the bundling head control mechanism controls the bundling head to perform secondary pressing performance detection on each detection sub-unit in the lead frame, wherein the steps of the secondary pressing performance detection are the same as steps ⑷ to ⑻. After the bundling head control mechanism controls the bundling head to complete the secondary pressure performance detection of all the detection sub-units of the lead frame, the detection difference of each detection sub-unit is summarized and made into a table, as shown in Table 2: .

[0105] As shown in Table 2, the detection differences of the detection sub-units of the lead frame after the secondary pressing process are all smaller than the detection threshold value. Therefore, the pressing performance of the lead frame is qualified, and the pressing performance test of the lead frame is completed.

[0106] In summary, the method for detecting the pressing performance provided by the embodiment of the present application applies a quantitative pressure to the lead frame for detection through the bunging head, unifies the detection standard of the pressing performance, and based on the comparison of the detection difference between the first detection value and the second detection value and the detection threshold, can quickly judge whether the pressing performance is qualified, thereby improving the detection efficiency of the pressing performance; because the encoder reading is used to read the first detection value and the second detection value, it is possible to monitor the disturbance at the micron level, improve the detection accuracy of the pressing performance, and further improve the yield rate of the product; in addition, by applying pressure to the lead frame twice through the bunging head, and ensuring that the first pressure is stable before recording the first detection value, it is possible to ensure stable contact between the bunging head and the lead frame, avoid the position deviation between the bunging head and the lead frame affecting the detection accuracy of the pressing performance, and improve the detection accuracy of the pressing performance.

[0107] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A method for testing pressing performance, characterized in that: The following steps are involved: Setting preset parameters for the bungee control mechanism, wherein the preset parameters include a detection threshold; The pressing mechanism performs pressing processing on the lead frame; The binding head control mechanism controls the binding head to apply a first pressure to the lead frame, and after the pressure is stabilized, records the current encoder reading as a first detection value; The bunding head control mechanism controls the bunding head to apply a second pressure to the lead frame, and records the current encoder reading as a second detection value; Calculating a detection difference between the first detection value and the second detection value; Determining whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the lead frame is qualified.

2. The method for detecting the pressing performance according to claim 1, characterized in that: The step of the pressing mechanism pressing the lead frame comprises the following steps: Setting an initial pressing stroke in the pressing mechanism, wherein the initial pressing stroke is 5 mm to 10 mm; The pressing mechanism controls the pressing plate to move the initial pressing stroke to perform a pressing process on the lead frame; After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, thereby completing the pressing process of the lead frame.

3. The method for detecting the pressing performance according to claim 2, characterized in that: When the detection threshold is less than the detection difference, the pressing performance of the lead frame is unqualified, and the pressing mechanism performs a secondary pressing process on the lead frame, wherein the secondary pressing process includes the following steps: Correcting the pressing stroke of the pressing mechanism, wherein the corrected stroke is the sum of the initial pressing stroke and the compensation stroke, and the range of the compensation stroke is 2 μm to 1 mm; The pressing mechanism controls the pressing plate to move the correction stroke to perform a secondary pressing process on the lead frame; After maintaining the first set time, the pressing mechanism controls the pressing plate to reset, completing the secondary pressing process of the lead frame.

4. The method for detecting the pressing performance according to claim 1, characterized in that: The preset parameters also include a set deviation value, wherein the range of the set deviation value is 2 μm to 3 μm; The pressurization stability is tested by the following steps: After the bunding head control mechanism controls the bunding head to complete applying the first pressure to the lead frame, the bunding head control mechanism records the current encoder reading as the third detection value; After the first pressure is maintained for a second set time, the bungee control mechanism records the current encoder reading as a fourth detection value, wherein the second set time ranges from 100ms to 200ms; Calculate the difference between the third detection value and the fourth detection value to determine whether the difference is less than the set deviation value. If yes, proceed to the next step; if not, the bungee control mechanism controls the bungee to reset.

5. The method for detecting the pressing performance according to claim 1, characterized in that: The lead frame includes a frame and at least two detection sub-units distributed in the frame in a row-column array structure, and the preset parameters also include movement parameters; After the step of laminating the lead wire by the laminating mechanism, the following steps are included: The bun head control mechanism controls the bun head to move to the target detection subunit based on the movement parameter; The binding head control mechanism controls the binding head to apply a first pressure to the target detection subunit, and after the pressure is stabilized, records the current encoder reading as a first detection value; The binding head control mechanism controls the binding head to apply a second pressure to the target detection subunit, and records the current encoder reading as a second detection value; Calculating a detection difference between the first detection value and the second detection value; Determining whether the detection threshold is greater than the detection difference; If yes, the pressing performance of the target detection subunit is qualified, and the next step is entered; The bunting head control mechanism controls the bunting head to move to the next detection subunit for detection based on the movement parameters.

6. The method for detecting the pressing performance according to claim 5, characterized in that: When the bunding head control mechanism controls the bunding head to complete the pressure performance test of all the detection sub-units of the lead frame, the following steps are also included: Normalizing the detection difference of each detection subunit; A pressing performance cloud diagram of the lead frame is drawn.

7. The method for testing the pressing performance according to any one of claims 1 to 6, characterized in that: The pressure range of the first pressure is 25g / mm 2 ~35g / mm 2 and / or, The pressure range of the second pressure is 80g / mm 2 ~120g / mm 2 and / or, The detection threshold ranges from 18 μm to 20 μm.

8. A pressing performance detection device, characterized in that: Used to perform the method for testing the pressing performance according to any one of claims 1 to 7, wherein the pressing performance testing device comprises a bundling control mechanism and a pressing mechanism, the pressing mechanism is used to carry a lead frame, and the bundling control mechanism is used to test the pressing performance of the lead frame; The pressing mechanism comprises a workbench, a lifting assembly and a pressing plate, wherein the lifting assembly is mounted on the workbench, the pressing plate is mounted on the lifting assembly, and the workbench is used to carry the lead frame; The bungee control mechanism comprises a bungee mounting seat, a bungee and an encoder. The bungee is rotatably mounted on the bungee mounting seat. The encoder is mounted on the bungee mounting seat. The encoder is used to detect position data of the bungee.

9. The pressing performance detection device according to claim 8, characterized in that: The bun head control mechanism also includes a controller, and the controller is connected to the bun head mounting seat and the encoder respectively; The controller has built-in preset parameters, which include a detection threshold and a set deviation value.

10. The pressing performance detection device according to claim 9, characterized in that: The bun head control mechanism further comprises a translation component, the bun head mounting seat is mounted on the translation component, the translation component is connected to the controller, wherein the preset parameters further comprise movement parameters; The translation assembly is used to control the horizontal movement of the bundling head mounting seat relative to the pressing mechanism, so as to adjust the position correspondence between the bundling head and each detection sub-unit of the lead frame.

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