Wafer feeding and film pasting device

Abstract

The invention relates to a wafer feeding and film pasting device which comprises an upper grabbing and film pasting assembly which is used for centering and grabbing a wafer and is at least provided with an upper cutting cylinder and a vacuum bowl located in the upper cutting cylinder; the lower cutting and film pasting assembly is used for being matched with the upper grabbing and film pasting assembly to cut the film and being matched with the upper grabbing and film pasting assembly to extrude and attach the cut film to the wafer, and the lower cutting and film pasting assembly is at least provided with a lower cutting cylinder and an extrusion disc installed in the lower cutting cylinder; the driving assembly is used for driving the upper grabbing film pasting assembly to conduct feeding or discharging. After the vacuum bowl adsorbs the wafer, the upper cutting cylinder moves downwards and enables the wafer to abut against the extrusion disc, the upper cutting cylinder continues to move downwards and enables the extrusion disc to retreat into the lower cutting cylinder, and after the upper cutting cylinder and the lower cutting cylinder surround and cut the film, the film is attached to the wafer under the extrusion effect. According to the wafer feeding and film pasting device, automatic operation can be achieved in the whole wafer feeding, centering, film pasting, cutting and discharging processes, the requirement for manual intervention is greatly reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of loading devices, and in particular to a wafer loading and film laminating device. Background Art

[0002] In integrated circuit packaging, it is necessary to pick up the wafer chips from the wafer for core loading. Generally, the incoming wafers need to be pre-processed, such as filming, thinning, and dicing, and then sent to the core loading process. When the wafer leaves the factory, one side usually has a protective film. Filming is to paste a film on the other side. On the one hand, it is used to protect the wafer. On the other hand, it is convenient to still attach the chips together after the protective film is torn off, which is convenient for thinning and dicing after thinning. At present, when laminating, since one side of the wafer with the protective film is in contact with the carrier table, it is convenient to laminarize the other side. If a gripping mechanism is used to load the wafer to the carrier table, it is not convenient to directly act on the side without the protective film. Therefore, the factory mostly adopts manual wafer picking, and then loading it to the carrier table of the laminating machine, and then sending it to the laminating machine on the carrier table for laminating, and then manually rotating the cutter to cut the circular area of ​​the film, and manually pushing the cutter back and forth to cut the film. This method is time-consuming and labor-intensive, and it is necessary to improve it.

[0003] In the prior art, patent announcement number CN113327878A discloses a wafer loading device and a wafer film attaching device, wherein the wafer loading device comprises: a gripping mechanism, comprising a first vertical cylinder, a pneumatic suction cup disposed at the movable end of the first vertical cylinder, and a folding frame, wherein the fixed end of the first vertical cylinder is connected to one end of the folding frame, and the other end of the folding frame is connected to a rotating shaft, which is connected to the output shaft of the rotating motor and rotates to cooperate with a pair of support plates, wherein the support plates and the rotating motor are disposed on a slide seat, and the slide seat is disposed on the first linear mechanism; a transfer mechanism, comprising a second linear mechanism disposed above the gripping mechanism, a spacing adjustment mechanism disposed at the movable end of the second linear mechanism, a pair of second vertical cylinders connected to the spacing adjustment mechanism, and a transfer frame connected to the movable end of the second vertical cylinder; a bearing mechanism, comprising a bearing platform disposed on a base through a supporting column, for bearing wafers. The wafer film attaching device comprises a wafer loading device, a film attaching assembly, etc. Automatic wafer loading and automatic film attaching are realized, labor intensity is reduced, and automated operation is realized with high efficiency.

[0004] The above technical solution solves the problems raised by the above background technology, but the above technical solution requires multiple transfer operations on the wafer, and the film pasting process is relatively cumbersome, requiring manual or additional machinery to pull out the film roll and unload the wafer, which increases the workload and reduces production efficiency.

[0005] Therefore, a wafer loading and film attaching device is needed to solve the above problems. Summary of the invention

[0006] In view of the above problems, a wafer loading and film laminating device is now provided, aiming to effectively reduce workload and improve production efficiency.

[0007] The specific technical solutions are as follows:

[0008] A wafer loading and film laminating device, comprising:

[0009] An upper gripper and film sticking assembly is used for centering and gripping the wafer, and comprises at least an upper cutting cylinder and a vacuum bowl located in the upper cutting cylinder;

[0010] The lower film cutting and laminating assembly is used to cooperate with the upper film grabbing and laminating assembly to cut the film, and cooperate with the upper film grabbing and laminating assembly to squeeze and laminar the cut film onto the wafer, and at least comprises a lower cutting cylinder and a squeezing disk installed in the lower cutting cylinder; and

[0011] A driving component, used for driving the upper grabbing film laminating component to load or unload materials;

[0012] Among them, when the vacuum bowl absorbs the wafer, the upper cutting cylinder descends and makes the wafer abut against the extrusion plate, the upper cutting cylinder continues to descend and makes the extrusion plate retreat into the lower cutting cylinder, and the upper cutting cylinder and the upper cutting cylinder surround and cut the film so that the film is attached to the wafer under the extrusion effect.

[0013] Furthermore, the driving assembly includes a driving frame, a guide rod, a driving screw and a slider, the slider is installed on the guide rod, and the slider is also spirally installed on the driving screw, the driving screw is rotatably installed on the driving frame, and the upper grabbing film sticking assembly is installed on the slider.

[0014] Furthermore, the upper gripping film sticking assembly also includes:

[0015] A telescopic cylinder, the base of which is mounted on the slide block, and the upper cutting cylinder is mounted on the output shaft of the telescopic cylinder; and

[0016] At least three centering rods are installed on the periphery of the upper cutting cylinder along the circumferential direction of the upper cutting cylinder. The centering rods can rotate synchronously and push the wafer until the axis of the wafer coincides with the axis of the upper cutting cylinder.

[0017] Furthermore, the upper gripping film sticking assembly also includes:

[0018] A driving disc, mounted on the upper cutting cylinder;

[0019] At least three crank arms are rotatably mounted on the upper cutting cylinder, the crank arms are mounted on the driving disc through connecting rods, and the centering rod is mounted on the crank arms.

[0020] Furthermore, the upper grabbing and film sticking assembly also includes a plurality of negative pressure tubes installed on the upper cutting cylinder, and the bottom of the negative pressure tube passes through the top of the upper cutting cylinder and is installed on the vacuum bowl.

[0021] Furthermore, the crank arm is sleeved on the negative pressure tube.

[0022] Furthermore, the upper part of the centering rod is passed through the crank arm, and a return spring is passed through the upper part of the centering rod, and two ends of the return spring are correspondingly installed on the crank arm and the centering rod.

[0023] Furthermore, a centering wheel is rotatably mounted on the bottom of the centering rod.

[0024] Furthermore, the lower cutting film sticking assembly includes a lower cutting frame, a lower cutting cylinder is installed on the lower cutting frame, an extrusion disc is passed through a guide column in the lower cutting cylinder, a top spring is passed through the guide column, and two ends of the top spring are correspondingly installed on the extrusion disc and the lower cutting cylinder.

[0025] Furthermore, the outer diameters of the upper cutting cylinder and the lower cutting cylinder are smaller than the width of the film.

[0026] The beneficial effects of the above scheme are:

[0027] The wafer loading and film laminating device provided by the present invention can realize automatic operation in the entire wafer loading, centering, film laminating, cutting and unloading process, greatly reducing the need for manual intervention and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic structural diagram of a wafer loading and laminating device provided in an embodiment of the present invention;

[0029] Figure 2 It is a schematic diagram of the exploded structure of the wafer loading and laminating device provided in an embodiment of the present invention;

[0030] Figure 3 It is a schematic diagram of the exploded structure of the lower cutting and film sticking assembly provided in an embodiment of the present invention.

[0031] In the attached drawings: 100, upper film grabbing and laminating assembly; 110, upper cutting cylinder; 120, vacuum bowl; 130, telescopic cylinder; 140, centering rod; 141, centering wheel; 150, driving disk; 160, crank arm; 170, connecting rod; 180, negative pressure tube; 200, lower film cutting and laminating assembly; 210, lower cutting cylinder; 220, squeezing disk; 230, lower cutting frame; 240, top spring; 300, driving assembly; 310, driving frame; 320, guide rod; 330, driving screw; 340, slider; 400, film. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0034] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0035] like Figures 1 to 3 As shown, the wafer loading and film laminating device provided in the embodiment of the present invention includes: an upper gripping and film laminating assembly 100, a lower cutting and film laminating assembly 200 and a driving assembly 300; the upper gripping and film laminating assembly 100 is used for centering and gripping the wafer, and at least has an upper cutting cylinder 110 and a vacuum bowl 120 located in the upper cutting cylinder 110; the lower cutting and film laminating assembly 200 is used for cooperating with the upper gripping and film laminating assembly 100 to cut the film, and cooperating with the upper gripping and film laminating assembly 100 to squeeze and attach the cut film to the wafer, and at least has a lower cutting cylinder 210 and an extrusion disk 220 installed in the lower cutting cylinder 210; the driving assembly 300 is used for driving the upper gripping and film laminating assembly 100 to load or unload.

[0036] In the present invention, the upper grabbing and film sticking component 100 first centers the wafer and then uses the vacuum bowl 120 to absorb and grab the wafer. Then, the upper grabbing and film sticking component 100 transports the wafer to above the film 400. The upper cutting cylinder 110 descends and makes the wafer abut against the squeezing plate 220. The upper cutting cylinder 110 continues to descend and makes the squeezing plate 220 retreat into the lower cutting cylinder 210. The upper cutting cylinder 110 and the upper cutting cylinder 110 surround and cut the film 400 so that the film 400 is attached to the wafer under the extrusion action. Then, the upper cutting cylinder 110 ascends and unloads the wafer after film sticking.

[0037] As a specific example, Figure 1 As shown, the driving assembly 300 includes a driving frame 310, a guide rod 320, a driving screw 330 and a slider 340. The slider 340 is mounted on the guide rod 320, and the slider 340 is also spirally mounted on the driving screw 330. The driving screw 330 is rotatably mounted on the driving frame 310, and the upper grabbing film pasting assembly 100 is mounted on the slider 340, so that the slider 340 and the upper grabbing film pasting assembly 100 on the slider 340 are driven to move horizontally through the forward or reverse motion of the driving screw 330 to realize loading or unloading.

[0038] As a specific example, Figure 1 , Figure 2 As shown, the upper gripping film sticking assembly 100 may also include a telescopic cylinder 130 and three centering rods 140; the base of the telescopic cylinder 130 is mounted on the slider 340, and the upper cutting cylinder 110 is mounted on the output shaft of the telescopic cylinder 130; the three centering rods 140 are installed at intervals on the periphery of the upper cutting cylinder 110 along the circumferential direction of the upper cutting cylinder 110, and when the upper cutting cylinder 110 descends a certain distance under the action of the telescopic cylinder 130, the three centering rods 140 are located at the periphery of the wafer to be grasped (to prevent the centering rod 140 from damaging the wafer, a centering wheel 141 is rotatably installed at the bottom of the centering rod 140), and then the other ends of the three centering rods 140 rotate synchronously inward around the axis of the upper cutting cylinder 110 to push the wafer to the axis of the wafer to coincide with the axis of the upper cutting cylinder 110, and the vacuum bowl 120 adsorbs and grasps the wafer.

[0039] To synchronously drive the centering rod 140, as Figure 1 , Figure 2 As shown, the upper film grabbing and laminating assembly 100 may further include a driving disk 150 and three crank arms 160; the driving disk 150 is mounted on the upper cutting cylinder 110; the three crank arms 160 are hingedly mounted on the upper cutting cylinder 110, the crank arms 160 are also connected to the driving disk 150 through connecting rods 170, and the centering rod 140 is mounted on the crank arms 160; under the above structure, the centering rod 140 is synchronously pushed by the forward or reverse rotation of the driving disk 150, so that the wafer is moved by the centering rod 140, so that the axis of the wafer coincides with the axis of the upper cutting cylinder 110, thereby realizing the centering of the wafer.

[0040] To drive the vacuum bowl 120, as Figure 1 , Figure 2 As shown, the upper grabbing film sticking assembly 100 may also include a plurality of negative pressure tubes 180, which are installed on the upper cutting cylinder 110. The bottom of the negative pressure tube 180 passes through the top of the upper cutting cylinder 110 and is installed on the vacuum bowl 120, so as to realize the adsorption or breaking of the vacuum bowl 120 by using the negative pressure tube 180. It should be noted that when the negative pressure tube 180 is provided, the crank arm 160 may be directly sleeved on the negative pressure tube 180. Under the above structure, the crank arm 160 may directly rotate around the negative pressure tube 180 under the action of the driving disk 150, thereby driving the centering rod 140 to be centered.

[0041] In order to avoid the interference of the centering rod 140 to the existing structure during the subsequent film application process, Figure 1 , Figure 2As shown, in the present invention, the upper part of the centering rod 140 can also be passed through the crank arm 160, and the return spring 180 can be correspondingly passed through the upper part of the centering rod 140, and the two ends of the return spring 180 are correspondingly installed on the crank arm 160 and the centering rod 140; under the above structure, when the film is subsequently applied, the centering rod 140 can move upward under the action of the existing structure and compress the return spring 180 to reduce the volume occupied by the device.

[0042] As a specific example, Figure 1 , Figure 2 , Figure 3 As shown, the above-mentioned lower cutting and film pasting assembly 200 includes a lower cutting frame 230, a lower cutting cylinder 210 is installed on the lower cutting frame 230, an extrusion plate 220 is passed through a guide column 211 in the lower cutting cylinder 210, a top spring 240 is passed through the guide column 211, and two ends of the top spring 240 are correspondingly installed on the extrusion plate 220 and the lower cutting cylinder 210; under the above-mentioned structure, when the wafer abuts against the extrusion plate 220, the upper cutting cylinder 110 continues to descend and makes the extrusion plate 220 retreat into the lower cutting cylinder 210, and then the outer edge of the upper cutting cylinder 110 and the inner edge of the upper cutting cylinder 110 are surrounded and cut the film 400, and the film formed by cutting is adhered to the wafer under the extrusion action of the upper cutting cylinder 110 and the extrusion plate 220, and then the upper cutting cylinder 110 ascends to unload the wafer after film pasting.

[0043] In order to prevent the film from being cut directly and hindering the unwinding of the film by the matching unwinding device, the outer diameters of the upper cutting cylinder 110 and the lower cutting cylinder 210 in the present invention are smaller than the width of the film.

[0044] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer loading and film laminating device, characterized in that: include: An upper gripping film sticking assembly is used for centering and gripping the wafer, and comprises at least an upper cutting cylinder and a vacuum bowl located in the upper cutting cylinder; The lower film cutting and laminating assembly is used to cooperate with the upper film grabbing and laminating assembly to cut the film, and cooperate with the upper film grabbing and laminating assembly to squeeze and laminar the cut film onto the wafer, and at least comprises a lower cutting cylinder and an extrusion disc installed in the lower cutting cylinder; as well as A driving component, used for driving the upper grabbing film sticking component to load or unload materials; Among them, after the vacuum bowl absorbs the wafer, the upper cutting cylinder descends and makes the wafer abut against the extrusion plate, the upper cutting cylinder continues to descend and makes the extrusion plate retreat into the lower cutting cylinder, and the upper cutting cylinder and the upper cutting cylinder are combined to cut the film so that the film is attached to the wafer under the extrusion effect.

2. The wafer loading and film laminating device according to claim 1, characterized in that: The driving assembly includes a driving frame, a guide rod, a driving screw and a slider, the slider is installed on the guide rod, and the slider is also spirally installed on the driving screw, the driving screw is rotatably installed on the driving frame, and the upper grabbing film sticking assembly is installed on the slider.

3. The wafer loading and film laminating device according to claim 2, characterized in that: The upper grabbing film sticking assembly also includes: A telescopic cylinder, the base of which is mounted on the slide block, and the upper cutting cylinder is mounted on the output shaft of the telescopic cylinder; and At least three centering rods are installed on the periphery of the upper cutting cylinder along the circumferential direction of the upper cutting cylinder. The centering rods can rotate synchronously and push the wafer until the axis of the wafer coincides with the axis of the upper cutting cylinder.

4. The wafer loading and film laminating device according to claim 3, characterized in that: The upper grabbing film sticking assembly also includes: A driving disc, mounted on the upper cutting cylinder; At least three crank arms are rotatably mounted on the upper cutting cylinder, the crank arms are mounted on the driving disc through connecting rods, and the centering rod is mounted on the crank arms.

5. The wafer loading and film attaching device according to claim 3 or 4, characterized in that: The upper grabbing and film sticking assembly further comprises a plurality of negative pressure tubes installed on the upper cutting cylinder, wherein the bottom of the negative pressure tube passes through the top of the upper cutting cylinder and is installed on the vacuum bowl.

6. The wafer loading and film laminating device according to claim 5, characterized in that: The crank arm is sleeved on the negative pressure tube.

7. The wafer loading and film laminating device according to claim 5, characterized in that: The upper part of the centering rod is passed through the crank arm, and a return spring is passed through the upper part of the centering rod, and two ends of the return spring are correspondingly installed on the crank arm and the centering rod.

8. The wafer loading and film laminating device according to claim 5, characterized in that: A centering wheel is rotatably mounted on the bottom of the centering rod.

9. The wafer loading and film laminating device according to claim 1, characterized in that: The lower cutting film sticking assembly includes a lower cutting frame, the lower cutting cylinder is installed on the lower cutting frame, the extrusion disk is passed through the guide column in the lower cutting cylinder, the guide column is passed through a top spring, and the two ends of the top spring are correspondingly installed on the extrusion disk and the lower cutting cylinder.

10. The wafer loading and film attaching device according to claim 1, characterized in that: The outer diameters of the upper cutting cylinder and the lower cutting cylinder are smaller than the width of the film.

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