Copper-iron bimetallic part for electromagnetic shielding and additive manufacturing method thereof

Abstract

The invention discloses a copper-iron bimetallic part for electromagnetic shielding and an additive manufacturing method of the copper-iron bimetallic part, and relates to the technical field of alloy plates. The copper-iron bimetallic part comprises a bottom layer, a core layer and a top layer which are arranged in a stacked mode. The bottom layer and the top layer are copper plates; the core layer comprises copper plates and copper-iron alloy plates which are alternately stacked; the copper-iron alloy plate is provided with a groove; a storage device is arranged in the groove; and a sensor is arranged in the storage device. The copper-iron bimetallic part has good heat dissipation performance, real-time gradient monitoring of electromagnetic wave signals and temperature states can be achieved, the properties of high electric conductivity, high heat conductivity, high elasticity, abrasion resistance, tensile strength, hardness, ferromagnetism and the like of the copper-iron alloy are reserved, and the copper-iron bimetallic part is suitable for being used as an electromagnetic shielding material or an electronic packaging material.

Description

Technical Field

[0001] The present invention relates to the technical field of metal materials, and in particular to a copper-iron bimetallic part for electromagnetic shielding and an additive manufacturing method thereof. Background Art

[0002] Copper-iron alloy has the high electrical conductivity, high thermal conductivity, high elasticity of copper and the wear resistance, tensile strength, hardness, and ferromagnetism of iron, and has a wide range of application scenarios. In terms of electromagnetic shielding, it combines the shielding effect of copper on high-frequency electromagnetic fields and iron on low-frequency electromagnetic fields, and has good application prospects in the fields of electromagnetic shielding materials and electronic packaging materials. In the process of using it as an electromagnetic shielding material or electronic packaging material, monitoring the internal conditions, electromagnetic wave signals, and temperature of the copper-iron alloy plate can understand the status of electronic devices and take effective measures in time to avoid damage to electronic devices. However, although the current technology takes into account the real-time monitoring of the internal conditions of the plate, it still cannot meet the monitoring of the electromagnetic wave signals and temperature status of the copper-iron alloy plate. When the electromagnetic shielding effect and temperature status of the copper-iron alloy plate during service cannot be monitored in real time, it will bring about the problem of not being able to effectively avoid damage to electronic devices in a timely manner.

[0003] Although the prior art attempts to prepare copper-iron alloy plates containing sensors by hot rolling to solve the problem of being unable to monitor electromagnetic shielding effects and temperature conditions in real time, the hot rolling method will have adverse effects on temperature-sensitive internal sensors and circuits, and the effect is not ideal. In addition, the working conditions of copper-iron alloy plates often have high requirements for heat dissipation, so the heat dissipation performance of copper-iron alloy plates needs to be improved. Summary of the invention

[0004] The present invention aims to solve at least one of the above-mentioned technical problems existing in the prior art. To this end, the purpose of the present invention is to provide a copper-iron bimetallic part, by arranging a copper plate as an interlayer and a covering layer, and arranging a sensing device in a groove opened in the copper-iron alloy plate, so as to realize the monitoring of the electromagnetic wave signal and temperature state of the copper-iron bimetallic part.

[0005] A second aspect of the present invention is to provide an additive manufacturing method for copper-iron bimetallic parts.

[0006] A third aspect of the present invention is to provide an application of a copper-iron bimetallic part.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is:

[0008] The first aspect of the present invention provides a copper-iron bimetallic part, comprising a stacked bottom layer, a core layer and a top layer; the bottom layer and the top layer are copper plates; the core layer comprises copper plates and copper-iron alloy plates alternately stacked; the copper-iron alloy plates are provided with grooves; a storage device is provided in the grooves; and a sensor is provided in the storage device.

[0009] The copper-iron bimetallic part according to the embodiment of the present invention has at least the following beneficial effects:

[0010] The present invention arranges a bottom layer and a top layer of copper plates as covering layers in the copper-iron bimetallic parts, and alternately arranges copper plates as interlayers in the core layer of the copper-iron bimetallic parts, thereby improving the heat dissipation performance of the copper-iron bimetallic parts and the shielding performance of the high-frequency electromagnetic field. A sensor is placed in the groove opened in the copper-iron alloy plate through a storage device, so that the sensor can be protected during the preparation process of the copper-iron bimetallic parts. The sensor is arranged in the copper-iron alloy plate, and through the alternating stacking of multiple layers of copper plates and copper-iron alloy plates, gradient detection of the state parameters of the copper-iron bimetallic parts can be achieved, and the state of the copper-iron bimetallic parts can be monitored in real time.

[0011] In some embodiments of the present invention, the copper plates of the bottom layer, the core layer and the top layer are all pure copper plates.

[0012] In some embodiments of the present invention, the copper plate and the copper-iron alloy plate in the core layer are both provided with positioning holes; positioning pins are provided in the positioning holes; and both ends of the positioning pins are respectively connected to the bottom layer and the top layer.

[0013] In some embodiments of the present invention, the size of the positioning pin matches the size of the positioning hole.

[0014] In some embodiments of the present invention, the positioning pin is a copper positioning pin.

[0015] In some embodiments of the present invention, the positioning pin is a pure copper positioning pin.

[0016] In some embodiments of the present invention, the gap between the positioning pin and the positioning hole is filled with a high thermal conductivity material.

[0017] In some embodiments of the present invention, the storage device is provided with a wire conduit and two cavities; a connecting hole is provided between the two cavities.

[0018] In some embodiments of the present invention, the storage device is made of copper-iron alloy.

[0019] In some embodiments of the present invention, the size of the storage device matches the groove on the copper-iron alloy plate.

[0020] In some embodiments of the present invention, the sensor includes a temperature sensor and an electromagnetic wave detection sensor, which are respectively disposed in the two cavities.

[0021] In some embodiments of the present invention, the sensor is connected to the outside through the through hole and the wire duct.

[0022] In some embodiments of the present invention, in the copper-iron alloy plate and the storage device made of the copper-iron alloy, the mass content of the iron element in the copper-iron alloy is 5-50%.

[0023] In some embodiments of the present invention, the copper plate has a thickness of 0.1 to 1 mm.

[0024] In some embodiments of the present invention, the copper-iron alloy plate has a thickness of 2 to 5 mm.

[0025] In some embodiments of the present invention, the number of the copper plates and the copper-iron alloy plates in the core layer is independently 2 to 13.

[0026] In some embodiments of the present invention, in the core layer, the plates close to the bottom layer and the top layer are copper-iron alloy plates.

[0027] The second aspect of the present invention provides an additive manufacturing method for the copper-iron bimetallic part according to the first aspect of the present invention, comprising the following steps:

[0028] The sensor is fixed in the storage device; a groove is formed in the copper-iron alloy plate, and the storage device containing the sensor is installed in the groove;

[0029] The copper plate of the bottom layer, the copper plate of the core layer, the copper-iron alloy plate containing the storage device and the copper plate of the top layer are stacked, wherein the copper plate of the core layer and the copper-iron alloy plate are alternately stacked, and metallurgical bonding is formed between the bottom layer, the core layer and the top layer, and between the copper plate of the core layer and the copper-iron alloy plate by ultrasonic additive to obtain the copper-iron bimetallic part.

[0030] The additive manufacturing method according to the embodiment of the present invention has at least the following beneficial effects:

[0031] The present invention uses an ultrasonic additive manufacturing method to prepare copper-iron bimetallic parts, which can achieve good metallurgical bonding between the copper plate and the copper-iron alloy plate. In addition, ultrasonic additive manufacturing can achieve metallurgical bonding at a relatively low temperature, which is beneficial to avoid damage to sensors and circuits at high temperatures, resulting in reduced or lost functions.

[0032] In some embodiments of the present invention, the lamination and ultrasonic material addition processes include the following steps:

[0033] S1. The bottom copper plate and the positioning pin are fixed by ultrasonic welding to form a bottom bracket; the core layer of the copper-iron alloy plate and the copper plate are provided with positioning holes;

[0034] S2. The copper-iron alloy plate of the core layer is stacked on the bottom bracket through the positioning hole, a metallurgical bond is formed by ultrasonic additive, and a high thermal conductivity material is filled in the gap between the positioning hole and the positioning pin;

[0035] S3. stacking the copper plate of the core layer on the copper-iron alloy plate of step S2 through the positioning hole, forming a metallurgical bond by ultrasonic additive, and filling the gap between the positioning hole and the positioning pin with a high thermal conductivity material;

[0036] S4. Repeat steps S2 and S3 until the cumulative stacking thickness is equal to the length of the positioning pin, and the last stacked sheet is a copper-iron alloy sheet, to obtain a core layer containing multiple layers of copper sheets and copper-iron alloy sheets; the core layer is in contact with the bottom layer and the top layer, all of which are copper-iron alloy sheets;

[0037] S5. The top copper plate is stacked on the last copper-iron alloy plate stacked in step S4, and a metallurgical bond is formed by ultrasonic additive manufacturing to obtain the copper-iron bimetallic part.

[0038] The third aspect of the present invention provides an application of the copper-iron bimetallic part described in the first aspect of the present invention or the copper-iron bimetallic part prepared by the additive manufacturing method described in the second aspect of the present invention in the field of electromagnetic shielding or electronic packaging.

[0039] As a part of electronic components, electromagnetic shielding materials or electronic packaging materials are often required to have high heat dissipation performance. At the same time, in order to timely understand the working status of electronic devices, it is necessary to be able to monitor state parameters in real time. The copper-iron bimetallic parts of the present invention not only have good heat dissipation performance and can realize real-time gradient monitoring of electromagnetic wave signals and temperature states, but also retain the high electrical conductivity, high thermal conductivity, high elasticity, wear resistance, tensile strength, hardness and ferromagnetism of copper-iron alloys. It is suitable for preparing electromagnetic shielding materials or electronic packaging materials and is used in the field of electromagnetic shielding or electronic packaging.

[0040] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematic diagram of the bottom layer and top layer of the copper-iron bimetallic part in an embodiment of the present invention.

[0042] Figure 2 Schematic diagram of the copper plate structure of the core layer of the copper-iron bimetallic part in an embodiment of the present invention.

[0043] Figure 3 This is a schematic diagram of the structure of the copper-iron alloy plate of the core layer of the copper-iron bimetallic part in an embodiment of the present invention.

[0044] Figure 4 Schematic diagram of the structure of the storage device for copper-iron bimetallic parts in an embodiment of the present invention.

[0045] Figure 5 Schematic diagram of the internal structure of the storage device for copper-iron bimetallic parts in an embodiment of the present invention.

[0046] Figure 6 Schematic diagram of the positioning pin of the copper-iron bimetallic part in the embodiment of the present invention.

[0047] Figure 7 It is a schematic diagram of the structure of the bottom layer of the copper-iron bimetallic part after being connected to the positioning pin in an embodiment of the present invention.

[0048] Figure 8 Schematic diagram of the stacked structure of the copper-iron bimetallic parts in an embodiment of the present invention.

[0049] Figures 1 to 8 The numbers in are as follows:

[0050] 100-covering layer, 200-core copper plate, 210-positioning hole A, 300-core copper-iron alloy plate, 310-positioning hole B, 320-groove, 400-storage device, 410-conducting tube, 420-cavity, 430-connecting hole, 500-positioning pin. DETAILED DESCRIPTION

[0051] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary and are only used to explain the present invention, but should not be construed as limiting the present invention.

[0052] In the description of this specification, the description with reference to the terms "some embodiments", "some examples", "some specific embodiments", "some examples" or "some specific examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0053] The implementation method of the first aspect of the present invention provides a copper-iron bimetallic part, including a stacked bottom layer, a core layer and a top layer; the bottom layer and the top layer are copper plates; the core layer includes copper plates and copper-iron alloy plates alternately stacked; the copper-iron alloy plates are provided with grooves; a storage device is provided in the groove; and a sensor is provided in the storage device.

[0054] According to an embodiment of the present invention, the copper-iron bimetallic part of the present invention is provided with copper plates as the bottom layer and the top layer, i.e., as the covering layer, and copper plates are alternately stacked in the core layer, i.e., the copper plate interlayer. The heat dissipation performance and high-frequency electromagnetic field shielding performance of the copper-iron bimetallic part are enhanced by the arrangement of the copper plate covering layer and the interlayer. At the same time, a storage device containing a sensor is arranged in the alternately stacked copper-iron alloy plates, and the storage device can provide certain protection to the sensor during the preparation process of the copper-iron bimetallic part. The alternately stacked copper plates and copper-iron alloy plates are used to realize the gradient monitoring of the state parameters of the copper-iron bimetallic part, and the state information of the copper-iron bimetallic part can be obtained in real time, thereby understanding the state of the electronic device.

[0055] It is understandable that the bottom layer and the top layer in the copper-iron bimetallic part of the present invention are not strictly in the order of upper and lower, and both are located above and below the core layer, belong to the same copper plate, and both serve as covering layers. In some specific embodiments of the present invention, the bottom layer and the top layer are collectively referred to as covering layers.

[0056] In some embodiments of the present invention, the copper plate and the copper-iron alloy plate in the core layer are both provided with positioning holes; positioning pins are provided in the positioning holes; and both ends of the positioning pins are respectively connected to the bottom layer and the top layer.

[0057] It should be understood that the two ends of the locating pin connect the bottom layer and the top layer, and the copper plates of the bottom layer and the top layer are not provided with locating holes. Therefore, the length of the locating pin is actually equivalent to the thickness of the copper plate and the copper-iron alloy plate of the core layer after superposition, that is, equivalent to the thickness of the core layer, and the locating pin is used to position and fix the copper-iron alloy plate and copper plate of the core layer, and to ensure that no serious misalignment occurs during the superposition of the bottom layer, core layer and top layer.

[0058] In some specific embodiments of the present invention, the copper plate and the copper-iron alloy plate in the core layer are provided with positioning holes at the four corners of the plate; positioning pins are provided in the positioning holes; the positioning pins penetrate the copper plate and the copper-iron alloy plate, and the two ends are connected to the bottom layer and the top layer respectively. Specifically, the positioning hole in the copper plate can be called positioning hole A, and the positioning hole in the copper-iron alloy plate can be called positioning hole B, positioning hole A and positioning hole B have the same size, and the copper plate and the copper-iron alloy plate have the same size, and the positioning holes are in the same position.

[0059] It should be understood that the positioning holes are through-type positioning holes, and the board sizes of the bottom layer, the core layer and the top layer are the same.

[0060] In some embodiments of the present invention, the size of the positioning pin matches the size of the positioning hole.

[0061] In some embodiments of the present invention, the positioning pin is a pure copper positioning pin.

[0062] The pure copper positioning pins penetrate the copper plate in the core layer and connect the bottom and top copper plate covering layers. The pure copper material is beneficial to enhancing the heat dissipation performance of the copper-iron bimetallic parts and the shielding performance of high-frequency electromagnetic fields.

[0063] In some embodiments of the present invention, the gap between the positioning pin and the positioning hole is filled with a high thermal conductivity material. In order to avoid the situation where the positioning pin cannot pass through the positioning hole, the positioning pin is generally slightly smaller than the positioning hole while matching the positioning hole, so a gap is inevitably left. In order to avoid damage to the heat dissipation performance, the present invention further fills the gap with a high thermal conductivity material, which is a high thermal conductivity material that can be conventionally obtained in the art, such as at least one of thermal grease, thermal gel, and graphene filler.

[0064] In some embodiments of the present invention, the storage device is provided with a wire duct and two cavities; a connecting hole is provided between the two cavities.

[0065] The grooves of the copper-iron alloy plate, the wire conduit of the storage device and the connecting holes of the two internal cavities ensure the reliability of the wire service and the stability of the signal output of the state parameter of the copper-iron bimetallic part.

[0066] In the present invention, the purpose of setting the groove on the copper-iron alloy plate is mainly to provide storage space for the storage device, and setting two cavities in the storage device is conducive to fully utilizing the limited space resources of the plate.

[0067] In some embodiments of the present invention, the storage device is made of copper-iron alloy.

[0068] The copper-iron alloy material has better strength than pure copper material and is less susceptible to damage as a storage device. In addition, the storage device and the copper-iron alloy plate are set to be the same material, which can more truly and accurately reflect the detection status of the entire copper-iron bimetallic part and reduce interference.

[0069] In some embodiments of the present invention, the size of the storage device matches the groove on the copper-iron alloy plate.

[0070] In some embodiments of the present invention, the sensor includes a temperature sensor and an electromagnetic wave detection sensor, which are respectively disposed in the two cavities. It is understandable that the temperature sensor and the electromagnetic wave detection sensor are respectively disposed in the two cavities, but the positions are not limited.

[0071] In some embodiments of the present invention, the sensor is connected to the outside through the through hole and the wire conduit. The sensor in the storage device can realize line transmission of signals through the gap or the connecting hole between the two cavities and the wire conduit.

[0072] In some embodiments of the present invention, in the copper-iron alloy plate and the storage device made of the copper-iron alloy, the mass content of the iron element in the copper-iron alloy is 5-50%.

[0073] Specifically, the mass content of iron in the copper-iron alloy may be 5%, 10%, 15%, 20%, 25%, 30%, 40% or 50%. In some specific embodiments of the present invention, the mass content of iron in the copper-iron alloy is 10-30%.

[0074] In some embodiments of the present invention, the copper plate has a thickness of 0.1 to 1 mm. It is understood that the copper plate here refers to the copper plates in the top layer, the bottom layer and the core layer, and the thickness thereof is within the range of 0.1 to 1 mm, and in some specific embodiments of the present invention, the thickness of the copper plates in the bottom layer and the top layer may be different from that of the copper plate in the core layer.

[0075] Specifically, in some examples of the present invention, the thickness of the copper plates of the bottom layer and the top layer is 0.6-1 mm; the thickness of the copper plate of the core layer is 0.2-0.5 mm. For example, the thickness of the copper plates of the bottom layer and the top layer may be 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1 mm, and the thickness of the copper plate of the core layer may be 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm.

[0076] In some embodiments of the present invention, the copper-iron alloy plate has a thickness of 2 to 5 mm. In some specific embodiments of the present invention, the copper-iron alloy plate has a thickness of 2 to 3 mm.

[0077] In some embodiments of the present invention, the number of copper plates and copper-iron alloy plates in the core layer is independently 2 to 13. The alternating stacking of multiple layers of copper plates and copper-iron alloy plates is conducive to realizing gradient monitoring of state parameters.

[0078] It should be understood that the number of copper plates and copper-iron alloy plates in the core layer is not to stack 2 to 13 copper plates and then stack 2 to 13 copper-iron alloy plates, but to alternately stack one copper plate and one copper-iron alloy plate until there are 2 to 13 copper plates and copper-iron alloy plates respectively after the alternating stacking is completed. The number of copper plates and copper-iron alloy plates affects the electromagnetic shielding effect. The higher the number, the better the electromagnetic shielding effect. In some specific embodiments of the present invention, the number of copper plates and copper-iron alloy plates in the core layer is independently 2 to 5.

[0079] In some embodiments of the present invention, the plates in the core layer close to the bottom layer and the top layer are copper-iron alloy plates. In the present invention, the bottom layer is a copper plate, and the plates in the core layer in contact with the bottom layer are copper-iron alloy plates. In the process of alternating stacking, the last plate is a copper-iron alloy plate, and then the top copper plate is stacked to contact the copper-iron alloy plate.

[0080] The embodiment of the second aspect of the present invention provides an additive manufacturing method for the copper-iron bimetallic part according to the first aspect of the present invention, comprising the following steps:

[0081] The sensor is fixed in the storage device; a groove is formed in the copper-iron alloy plate, and the storage device containing the sensor is installed in the groove;

[0082] The copper plate of the bottom layer, the copper plate of the core layer, the copper-iron alloy plate containing the storage device and the copper plate of the top layer are stacked, wherein the copper plate of the core layer and the copper-iron alloy plate are alternately stacked, and metallurgical bonding is formed between the bottom layer, the core layer and the top layer, and between the copper plate of the core layer and the copper-iron alloy plate by ultrasonic additive to obtain the copper-iron bimetallic part.

[0083] Ultrasonic welding technology is a welding method that uses the energy generated by ultrasonic vibration to make the surfaces of two plates to be welded rub against each other, and finally form intermolecular fusion. Ultrasonic additive manufacturing (UAM) is based on this welding method and applied to 3D printers to form a new 3D printing process. The metal plates are connected by ultrasonic energy to achieve a metallurgical effect, and the plates are stacked layer by layer until they are finally formed. A major advantage of ultrasonic additive manufacturing is that compared to other 3D printing technologies that usually require heating the metal to the melting point, ultrasonic additive manufacturing can achieve metallurgy at a lower temperature. Therefore, the present invention uses ultrasonic additive manufacturing to manufacture copper-iron bimetallic parts, which can not only connect multiple plates and locating pins together through metallurgical bonding, but also embed temperature-sensitive sensors therein. At the same time, the surface of the copper-iron bimetallic parts obtained by ultrasonic additive manufacturing has a higher degree of smoothness.

[0084] In some embodiments of the present invention, the lamination and ultrasonic material addition processes include the following steps:

[0085] S1. The bottom copper plate and the positioning pin are fixed by ultrasonic welding to form a bottom bracket; the core layer of the copper-iron alloy plate and the copper plate are provided with positioning holes;

[0086] S2. The copper-iron alloy plate of the core layer is stacked on the bottom bracket through the positioning hole, a metallurgical bond is formed by ultrasonic additive, and a high thermal conductivity material is filled in the gap between the positioning hole and the positioning pin;

[0087] S3. stacking the copper plate of the core layer on the copper-iron alloy plate of step S2 through the positioning hole, forming a metallurgical bond by ultrasonic additive, and filling the gap between the positioning hole and the positioning pin with a high thermal conductivity material;

[0088] S4. Repeat steps S2 and S3 until the cumulative stacking thickness is equal to the length of the positioning pin, and the last stacked sheet is a copper-iron alloy sheet, to obtain a core layer containing multiple layers of copper sheets and copper-iron alloy sheets; the core layer is in contact with the bottom layer and the top layer, all of which are copper-iron alloy sheets;

[0089] S5. The top copper plate is stacked on the last copper-iron alloy plate stacked in step S4, and a metallurgical bond is formed by ultrasonic additive manufacturing to obtain the copper-iron bimetallic part.

[0090] It is understandable that in step S4, in order to ensure that the plate material of the core layer in contact with the top layer is a copper-iron alloy plate, when repeating steps S2 and S3, the last plate material to be stacked is a copper-iron alloy plate, that is, the last step of the repeated steps is step S2. In step S5, the copper plate of the top layer is stacked on the last copper-iron alloy plate stacked in step S4. In addition, in step S2, the copper-iron alloy plate is stacked on the bottom bracket, while in the repetition process of step S4, the copper-iron alloy plate is stacked on the copper plate. Those skilled in the art can understand that this is the only way to achieve the alternating stacking of copper plates and copper-iron alloy plates.

[0091] In some specific embodiments of the present invention, the sensors are placed in two cavities of the storage device and connected through a through passage with a wire, that is, the sensor in the storage device is connected to an external receiver of the copper-iron bimetallic part through a connecting hole and a wire conduit.

[0092] In some specific embodiments of the present invention, the storage device is fixed in the groove by brazing and / or gluing.

[0093] In some specific embodiments of the present invention, in step S1, the vibration frequency of the ultrasonic welding is 10-30 kHz; the pressure of the ultrasonic welding is 0.2-0.4 MPa.

[0094] In some specific embodiments of the present invention, in step S2, the vibration frequency of the ultrasonic material addition is 10-20 kHz; the pressure of the ultrasonic material addition is 0.4-0.6 MPa.

[0095] In some specific embodiments of the present invention, in step S3, the vibration frequency of the ultrasonic material addition is 10-30 kHz; the pressure of the ultrasonic material addition is 0.1-0.3 MPa.

[0096] In some specific embodiments of the present invention, the vibration frequency of the ultrasonic additive is 10-30 kHz; the pressure of the ultrasonic welding is 0.2-0.4 MPa.

[0097] An embodiment of the third aspect of the present invention provides an application of the copper-iron bimetallic part described in the first aspect of the present invention or the copper-iron bimetallic part prepared by the additive manufacturing method described in the second aspect of the present invention in electromagnetic shielding materials or electronic packaging materials.

[0098] The copper-iron bimetallic part of the present invention not only has good heat dissipation performance and can realize real-time gradient monitoring of electromagnetic wave signals and temperature states, but also retains the high electrical conductivity, high thermal conductivity, high elasticity, wear resistance, tensile strength, hardness and ferromagnetism of the copper-iron alloy, and is suitable for use as an electromagnetic shielding material or electronic packaging material.

[0099] The following is combined with specific embodiments and appendix Figures 1 to 8 The content of the present invention is further described in detail.

[0100] Unless otherwise specified, the raw materials, reagents or devices used in the examples can be obtained from conventional commercial sources or can be obtained by prior art methods. Unless otherwise specified, the experiments or test methods are conventional methods in the art.

[0101] In the following embodiments of the present invention, the copper-iron alloy plate 300 and the storage device 400 made of copper-iron alloy have an Fe element content of 20% in the copper-iron alloy; the copper plate thickness of the covering layer 100 (i.e., the bottom layer and the top layer) is 0.8 mm, the copper plate thickness of the core layer 200 is 0.4 mm, and the copper-iron alloy plate 300 is 2.5 mm.

[0102] Example 1

[0103] Embodiment 1 provides a copper-iron bimetallic part, such as Figures 1 to 8 As shown, the copper-iron bimetallic part includes a covering layer 100 and a core layer;

[0104] The covering layer 100 is a copper plate, which is located at the bottom layer and the top layer of the copper-iron bimetallic part, and is therefore also referred to as the bottom layer and the top layer;

[0105] The core layer is obtained by alternately stacking a copper plate 200 having a positioning hole A 210 and a copper-iron alloy plate 300 having a positioning hole B 310 and a groove 320; wherein the total number of copper plates 200 after alternate stacking is 3, and the total number of copper-iron alloy plates 300 after alternate stacking is 4, that is, the core layer contains 3 layers of copper plates 200 and 4 layers of copper-iron alloy plates 300, and the copper-iron alloy plates 300 are in contact with the cover layer 100;

[0106] The storage device 400 comprises a wire conduit 410 and two cavities 420, a connecting hole 430 is provided between the two cavities 420, the storage device 400 matches the size of the groove 320 of the copper-iron alloy plate 300 of the core layer, and is made of copper-iron alloy (Fe mass content 20%), and is fixed in the groove 320 by gluing;

[0107] The micro sensor is a temperature sensor and an electromagnetic wave detection sensor, which are respectively located in two cavities 420 in the storage device 400, and are placed in the groove 320 of the copper-iron alloy plate 300 through the storage device 400. The sensor realizes line transmission of signals through the connecting hole 430 of the storage device (400) and the wire conduit 410;

[0108] The groove 320 of the copper-iron alloy plate 300 is located in the central area of ​​the copper-iron alloy plate 300. The purpose of providing the groove 320 is to provide a storage space for the storage device 400, so that the sensor in the storage device 400 can be arranged between the copper plate 200 and the copper-iron alloy plate 300 through the storage device 400 and fixed in the core layer of the copper-iron bimetallic part; the sensors are arranged in different thickness areas to realize the gradient detection of the state of the copper-iron bimetallic part;

[0109] The pure copper positioning pin 500 penetrates the positioning hole A 210 of the core copper plate 200 and the positioning hole B 310 of the copper-iron alloy plate 300 to fix the core copper plate 200 and the copper-iron alloy plate 300, and the two ends of the positioning pin 500 are connected to the cover layer 100, that is, the bottom layer and the core layer are connected; the diameter of the positioning pin 500 matches the diameter size of the positioning hole A 210 and the positioning hole B 310; the length of the positioning pin 500 is equivalent to the thickness of the core copper plate 200 and the copper-iron alloy plate 300 after being superimposed, that is, equivalent to the thickness of the core layer;

[0110] The length and width of the covering layer 100, the core copper plate 200 and the core copper-iron alloy plate 300 are the same, the diameters of the positioning holes A 210 and B 310 are consistent and located at the same positions in the four corners of the plate; the copper plates of the covering layer and the core layer are all pure copper plates.

[0111] This embodiment also provides an ultrasonic additive manufacturing method for copper-iron bimetallic parts, comprising the following steps:

[0112] S1. A storage device 400 is manufactured and a sensor is placed in two cavities 420 opened therein; the sensors located in the two cavities 320 are connected by wires provided through a through passage, and are connected to an external receiver of a copper-iron bimetallic part through a wire provided in the cavity 420 and a wire conduit 410 in the storage device 400;

[0113] S2. A copper-iron alloy plate 300 is produced containing a positioning hole B 310 and a groove 320, and the storage device 400 is fixed to the groove 320 opened in the copper-iron alloy plate 300 by gluing;

[0114] S3. The bottom cover layer 100 and the pure copper positioning pin 500 are fixed together by ultrasonic welding to form a bottom bracket, such as Figure 7 As shown; the ultrasonic welding vibration frequency is 20kHz and the pressure is 0.3Mpa;

[0115] S4. The copper-iron alloy plate 300 of step S2 is stacked on the bottom bracket through the positioning hole B 310, and is metallurgically bonded to the bottom cover layer 100 by an ultrasonic additive manufacturing device; the vibration frequency of the ultrasonic additive manufacturing is 15 kHz and the pressure is 0.5 MPa;

[0116] S5. Use commercially available thermal grease as a high thermal conductivity material to fill the gap between the through-type positioning hole B 310 and the pure copper positioning pin 500;

[0117] S6. The core copper plate 200 is stacked on the copper-iron alloy plate 300 of step S4 through the through-type positioning hole A 210, and the core copper plate 200 is metallurgically bonded with the copper-iron alloy plate 300 of step S4 by ultrasonic additive; the vibration frequency of the ultrasonic additive is 20kHz and the pressure is 0.2MPa;

[0118] S7. Use a high thermal conductive material to fill the gap between the through-type positioning hole A 210 and the pure copper positioning pin 500;

[0119] S8. The copper-iron alloy plate 300 of step S2 is stacked on the copper plate 200 of step S6 through the positioning hole B 310, and is metallurgically bonded with the copper plate 200 of the previous layer by ultrasonic additive; the vibration frequency of the ultrasonic additive is 15kHz and the pressure is 0.5MPa;

[0120] S9. Use a high thermal conductive material to fill the gap between the through-type positioning hole B 310 and the pure copper positioning pin 500;

[0121] S10. Repeat steps S4 to S9 to form a metallurgical bond by ultrasonic additive, alternately stacking layer by layer, and the last stacked plate is a copper-iron alloy plate 300, and the cumulative thickness is equivalent to the length of the pure copper positioning pin 500;

[0122] S11. The top cover layer 100 is metallurgically bonded with the last copper-iron alloy plate 300 in step S10 by ultrasonic additive manufacturing to complete the production of the copper-iron bimetallic part; the vibration frequency of the ultrasonic additive manufacturing is 20 kHz and the pressure is 0.3 MPa.

[0123] The copper-iron bimetallic part of Example 1 of the present invention is provided with a copper plate as a sandwich layer between the covering layer and the core layer, and a sensor is placed in the groove opened in the copper-iron alloy plate through a storage device for monitoring the state parameters. The copper plate and the copper-iron alloy plate in the core layer are alternately stacked, and the heat dissipation performance is good, and the state parameters of the copper-iron bimetallic part can be gradient detected; the copper plate in the core layer and the copper plate in the covering layer are connected by a pure copper locating pin, which can enhance the heat dissipation performance of the copper-iron bimetallic part and the shielding performance of the high-frequency electromagnetic field; the groove of the copper-iron alloy plate, the wire conduit of the storage device and the connecting hole of the two internal cavities ensure the reliability of the wire service and the stability of the signal output of the state parameter of the copper-iron composite plate. Example 1 of the present invention further uses an ultrasonic additive method to achieve good bonding between the plates of the copper-iron bimetallic part. Since the ultrasonic additive is metallurgical bonding at a relatively low temperature (temperature range below the melting point of the processed material), the sensor and circuit in the copper-iron bimetallic part can be prevented from being damaged at high temperature.

[0124] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A copper-iron bimetallic part, characterized in that: It comprises a bottom layer, a core layer and a top layer which are stacked; the bottom layer and the top layer are copper plates; the core layer comprises copper plates and copper-iron alloy plates which are alternately stacked; the copper-iron alloy plates are provided with grooves; a storage device is provided in the grooves; and a sensor is provided in the storage device.

2. The copper-iron bimetallic part according to claim 1, characterized in that: The copper plate and the copper-iron alloy plate in the core layer are both provided with positioning holes; positioning pins are provided in the positioning holes; and both ends of the positioning pins are respectively connected to the bottom layer and the top layer.

3. The copper-iron bimetallic part according to claim 2, characterized in that: The size of the positioning pin matches the size of the positioning hole; And / or, the positioning pin is a copper positioning pin; And / or, the gap between the positioning pin and the positioning hole is filled with a high thermal conductive material.

4. The copper-iron bimetallic part according to claim 1, characterized in that: The storage device is provided with a wire conduit and two cavities; a communication hole is provided between the two cavities; And / or, the storage device is made of copper-iron alloy; And / or, the storage device has a size matching the groove on the copper-iron alloy plate.

5. The copper-iron bimetallic part according to claim 4, characterized in that: The sensors include a temperature sensor and an electromagnetic wave detection sensor, which are respectively arranged in the two cavities; And / or, the sensor is connected to the outside through the through hole and the wire duct.

6. The copper-iron bimetallic part according to claim 4, characterized in that: In the copper-iron alloy plate and the storage device made of the copper-iron alloy, the mass content of iron in the copper-iron alloy is 5-50%.

7. The copper-iron bimetallic part according to claim 1, characterized in that: The thickness of the copper plate is 0.1 to 1 mm; And / or, the copper-iron alloy plate has a thickness of 2 to 5 mm; and / or, the number of the copper plates and the copper-iron alloy plates in the core layer is independently 2 to 13; And / or, in the core layer, the plates close to the bottom layer and the top layer are both copper-iron alloy plates.

8. An additive manufacturing method for a copper-iron bimetallic part according to any one of claims 1 to 7, characterized in that: The following steps are involved: The sensor is fixed in the storage device; a groove is formed in the copper-iron alloy plate, and the storage device containing the sensor is installed in the groove; The copper plate of the bottom layer, the copper plate of the core layer, the copper-iron alloy plate containing the storage device and the copper plate of the top layer are stacked, wherein the copper plate of the core layer and the copper-iron alloy plate are alternately stacked, and metallurgical bonding is formed between the bottom layer, the core layer and the top layer, and between the copper plate of the core layer and the copper-iron alloy plate by ultrasonic additive to obtain the copper-iron bimetallic part.

9. The additive manufacturing method according to claim 8, characterized in that: The process of lamination and ultrasonic material addition comprises the following steps: S1. The bottom copper plate and the positioning pin are fixed by ultrasonic welding to form a bottom bracket; the core layer of the copper-iron alloy plate and the copper plate are provided with positioning holes; S2. The copper-iron alloy plate of the core layer is stacked on the bottom bracket through the positioning hole, a metallurgical bond is formed by ultrasonic additive, and a high thermal conductivity material is filled in the gap between the positioning hole and the positioning pin; S3. stacking the copper plate of the core layer on the copper-iron alloy plate of step S2 through the positioning hole, forming a metallurgical bond by ultrasonic additive, and filling the gap between the positioning hole and the positioning pin with a high thermal conductivity material; S4. Repeat steps S2 and S3 until the cumulative stacking thickness is equal to the length of the positioning pin, and the last stacked sheet is a copper-iron alloy sheet, to obtain a core layer containing multiple layers of copper sheets and copper-iron alloy sheets; the core layer is in contact with the bottom layer and the top layer, all of which are copper-iron alloy sheets; S5. The top copper plate is stacked on the last copper-iron alloy plate stacked in step S4, and a metallurgical bond is formed by ultrasonic additive manufacturing to obtain the copper-iron bimetallic part.

10. Use of the copper-iron bimetallic part according to any one of claims 1 to 7 or the copper-iron bimetallic part prepared by the additive manufacturing method according to any one of claims 8 to 9 in the field of electromagnetic shielding or electronic packaging.

Images