An ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline

Abstract

The present invention belongs to the technical field of semiconductor pipeline cleaning, and particularly relates to an ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline. It includes a workbench, on which a stepping conveyor belt is installed. The workbench is connected to a cleaning box through a connecting table. A cylinder is installed on the cleaning box, and the output end of the cylinder is connected to a cleaning component. A tray is placed on the stepping conveyor belt, and a fixing seat and a rotating component are installed on the tray to fix the semiconductor pipeline on the fixing seat and the rotating component. In the present invention, the T-shaped plate drives the ultrasonic generating plate at its bottom to fit against the outer wall of the pipeline, and the ultrasonic generating plate drives the pipeline to vibrate, so that the dirt on the inner wall of the pipeline becomes loose. The L-shaped rod two drives the pipeline to tilt, and the high-pressure nozzle flushes from the inner wall of the pipeline at the end far from the high-pressure nozzle towards the inner wall of the pipeline at the end close to the high-pressure nozzle. At the same time, the belt drives the tilted pipeline to rotate, so that the high-pressure nozzle flushes each part of the inner wall of the pipeline, avoiding cleaning dead corners on the inner wall of the pipeline.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor pipeline cleaning, and particularly relates to an ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline. Background Art

[0002] A semiconductor pipeline is a pipeline system specifically used for transporting high-purity fluids during the semiconductor manufacturing process. As the pipeline is used for a long time, impurities and chemical substances will accumulate on the inner wall of the pipeline, corroding the pipe wall, resulting in problems such as thinning of the pipe wall and the appearance of holes. The prior art can reduce the residue of these harmful substances, reduce the corrosion rate of the pipeline, and extend the service life of the pipeline by flushing the pipeline.

[0003] Compared with other pipelines, semiconductor pipelines have extremely high requirements for manufacturing precision, and it is necessary to ensure the smoothness inside the pipeline. The surface roughness of its inner surface usually requires to reach the nanometer level; the diameter of semiconductor pipelines is relatively small. For example, the pipeline diameters of photoresist delivery pipelines and chemical mechanical polishing fluid pipelines are 1-2 inches.

[0004] Therefore, during the process of high-pressure flushing of semiconductor pipelines, it is difficult for the high-pressure water spray head to extend into the pipe for flushing. Even if the spray head extends into the pipe, in order to avoid scratching the inner wall of the pipeline, the adjustment direction of the spray head will be restricted, increasing the difficulty of pipeline cleaning and prone to cleaning dead corners in the pipeline. Summary of the Invention

[0005] The purpose of the present invention is to provide an ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline in view of the deficiencies of the prior art to solve the technical problems in the prior art.

[0006] The object of the present invention can be achieved by the following technical scheme: an ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline, which includes a workbench, a stepping conveyor belt is installed on the workbench, the workbench is connected to a cleaning box through a connecting table, a cylinder is installed on the cleaning box, and the output end of the cylinder is connected to a cleaning component, a tray is placed on the stepping conveyor belt, a fixed seat and a rotating component are installed on the tray, and the semiconductor pipeline is fixed on the fixed seat and the rotating component; the cleaning component includes a T-shaped plate, a motor is installed on the T-shaped plate, the motor drives the screw rod to rotate, the screw rod and the L-shaped rod are in transmission cooperation, the L-shaped rod is rotatably connected to one end of an ultrasonic generating plate, and the other end of the ultrasonic generating plate is connected to the T through a rotating shaft. The bottom of the T-shaped plate is connected; an inclined plate is slidably installed in the T-shaped plate, a high-pressure nozzle is installed on the inclined plate, and the cylinder drives the T-shaped plate to move downward, so that the ultrasonic generating plate at the bottom of the T-shaped plate fits the semiconductor pipeline; the rotating component includes a base and a press table, the base is installed on the tray, and a layout groove is provided on the press table, a driven roller group and an active roller are installed in the layout groove, a belt is installed on the driven roller group and the active roller, and a transmission gear is coaxially installed on the active roller; the press table is slidably matched with the base, the base is connected to the press table through a longitudinal spring, a rack is installed on the base, the rack is meshed with the transmission gear, one end of the semiconductor conduit is installed on the press table, so that the semiconductor conduit fits the belt.

[0007] As a further optimization or improvement of this solution, the screw rod is installed in a transmission manner with the L-shaped rod, a triangular frame is installed on the L-shaped rod, and the triangular frame fits the inclined surface of the inclined plate; when the L-shaped rod moves downward, the L-shaped rod pushes the inclined plate toward the semiconductor pipeline through the triangular frame.

[0008] As a further optimization or improvement of the present solution, a transverse groove is provided in the T-shaped plate, the inclined plate is slidably matched with the transverse groove, and the inclined plate is connected to the inner wall of the T-shaped plate via a transverse spring.

[0009] As a further optimization or improvement of this solution, the motor is connected to the lead screw via a reduction box, and the lead screw is respectively connected to the L-shaped rod 1 and the L-shaped rod 2 through transmission.

[0010] As a further optimization or improvement of the present solution, a slide groove is provided on the T-shaped plate, the L-shaped rod 2 and the L-shaped rod 1 are located in the slide groove and slide, and a screw rod is installed in the slide groove.

[0011] As a further optimization or improvement of this solution, a heat sink is installed on the cleaning box, an upper sliding pad is installed on the bottom of the ultrasonic generating plate, and a lower sliding pad is installed on the fixed seat.

[0012] As a further optimization or improvement of the present solution, a clearance groove and a guide groove are provided on the press platform, a guide rod is installed on the base, the guide rod is slidably matched with the guide groove, and the rack is matched with the clearance groove.

[0013] Beneficial effects of the present invention:

[0014] (1) In the present invention, the T-shaped plate is driven by a cylinder to move downward. The T-shaped plate drives the ultrasonic generating plate at its bottom to fit against the outer wall of the pipe. At the same time, the high-pressure nozzle on the T-shaped plate is aligned with the pipe. The ultrasonic generating plate drives the pipe to vibrate, loosening the dirt on the inner wall of the pipe. The second L-shaped rod pushes one end of the semiconductor pipe through the ultrasonic generating plate, causing the pipe to gradually tilt. During the tilting process of the pipe, high-pressure water flushes the pipe through the high-pressure nozzle. The high-pressure nozzle flushes from the inner wall of the pipe at the end far from the high-pressure nozzle towards the inner wall of the pipe at the end close to the high-pressure nozzle, cooperating with the ultrasonic generating plate to drive the vibration of the pipe body, improving the cleaning ability of the pipe.

[0015] Specifically, when the second L-shaped rod pushes the semiconductor pipe to tilt, one end of the pipe presses against the pressing platform. At this time, the longitudinal spring is compressed, and the pressing platform moves relative to the base, causing the rack on the base to drive the transmission gear to rotate. The transmission gear drives the belt to run through the driving roller, causing the belt to drive the tilted pipe to rotate, enabling the high-pressure nozzle to flush each part of the inner wall of the pipe, avoiding cleaning dead corners on the inner wall of the pipe.

[0016] (2) In the present invention, the second L-shaped rod drives the pipe to tilt, causing the high-pressure nozzle to flush from the inner wall of the pipe body towards the inner wall of the pipe orifice. At the same time, the triangular frame pushes the inclined plate and the high-pressure nozzle on it to move closer to the pipe orifice direction, increasing the water pressure of the high-pressure nozzle towards the pipe orifice direction gradually, improving the cleaning strength of the inner wall of the pipe orifice. Solving the problem that there are more impurities accumulated at the pipe orifice position of the semiconductor pipe compared to the pipe body position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the internal structure of the cleaning box.

[0020] Figure 3 It is a schematic diagram of the working state of the cleaning component.

[0021] Figure 4 It is a schematic diagram of the overall structure of the cleaning component.

[0022] Figure 5 It is a cross-sectional view of the overall structure of the cleaning component.

[0023] Figure 6 It is a schematic diagram of the structure of the ultrasonic generating plate.

[0024] Figure 7 It is a schematic diagram of the structure of the tray.

[0025] Figure 8 It is a schematic diagram of the overall structure of the rotating component.

[0026] Figure 9 It is a schematic diagram of the internal structure of the platen.

[0027] Figure 10 It is a connection diagram of the belt and the driving roller.

[0028] The labels in the figure are: 1. Workbench; 2. Stepping conveyor belt; 3. Connection table; 4. Cleaning box; 5. Cylinder; 6. Tray; 7. Fixed seat; 8. Rotating assembly; 801. Base; 802. Platen; 803. Belt; 804. Driven roller group; 805. Arrangement groove; 806. Driving roller; 807. Transmission gear; 808. Yielding groove; 809. Guide rod; 810. Rack; 811. Longitudinal spring; 812. Guide groove; 9. Cleaning assembly; 901. T-shaped plate; 902. Motor; 903. Chute; 904. Reduction box; 905. Lead screw; 906. L-shaped rod one; 907. L-shaped rod two; 908. Inner groove; 909. Rotating shaft; 910. Ultrasonic generating plate; 911. Triangular frame; 912. Inclined plate; 913. High-pressure nozzle; 914. Transverse spring; 915. Upper sliding pad; 10. Lower sliding pad; 11. Heat dissipation component. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0030] See Figures 1 - 10, an ultrasonic high-pressure washing device for the inner wall of a semiconductor pipeline, comprising a workbench 1, a stepping conveyor belt 2 is installed on the workbench 1, the workbench 1 is connected to a cleaning box 4 through a connecting platform 3, a cylinder 5 is installed on the cleaning box 4, the output end of the cylinder 5 is connected to a cleaning component 9, a tray 6 is placed on the stepping conveyor belt 2, a fixing seat 7 and a rotating component 8 are installed on the tray 6, and the semiconductor pipeline is fixed on the fixing seat 7 and the rotating component 8; the cleaning component 9 comprises a T-shaped plate 901, a motor 902 is installed on the T-shaped plate 901, the motor 902 drives a screw rod 905 to rotate, the screw rod 905 is in transmission cooperation with an L-shaped rod 907, the L-shaped rod 907 is rotatably connected to one end of an ultrasonic generating plate 910, and the other end of the ultrasonic generating plate 910 is connected to the bottom of the T-shaped plate 901 through a rotating shaft 909; an inclined plate 912 is slidably installed in the T-shaped plate 901, and the inclined plate 91 2, a high-pressure nozzle 913 is installed on the T-shaped plate 901, and the cylinder 5 drives the T-shaped plate 901 to move downward, so that the ultrasonic generating plate 910 at the bottom of the T-shaped plate 901 fits the semiconductor pipeline; the rotating component 8 includes a base 801 and a press table 802, the base 801 is installed on the tray 6, and the press table 802 is provided with a layout groove 805, and a driven roller group 804 and an active roller 806 are installed in the layout groove 805. The driven roller group 804 and the active roller 806 are installed with a belt 803, and the active roller 806 is coaxially installed with a transmission gear 807; the press table 802 is slidably matched with the base 801, and the base 801 is connected to the press table 802 through a longitudinal spring 811. A rack 810 is installed on the base 801, and the rack 810 is meshed with the transmission gear 807. One end of the semiconductor conduit is installed on the press table 802, so that the semiconductor conduit fits the belt 803.

[0031] Specifically, the motor 902 is connected to the screw rod 905 via the reduction box 904, and the screw rod 905 is respectively connected to the L-shaped rod 1 906 and the L-shaped rod 2 907 in transmission.

[0032] Specifically, a slide groove 903 is provided on the T-shaped plate 901 , and the second L-shaped rod 907 and the first L-shaped rod 906 are located in the slide groove 903 for sliding, and a screw rod 905 is installed in the slide groove 903 .

[0033] Specifically, the press platform 802 is provided with a clearance groove 808 and a guide groove 812 , the base 801 is provided with a guide rod 809 , the guide rod 809 is slidably matched with the guide groove 812 , and the rack 810 is matched with the clearance groove 808 .

[0034] It should be noted that a water pipe and a water pump connected to the high-pressure nozzle 913 are installed in the cleaning box 4. The connection method between the high-pressure nozzle 913 and the water pump is a prior art, which will not be reviewed in the present invention and does not affect the integrity of this solution. An inner groove 908 is provided at the bottom of the T-shaped plate 901, and the ultrasonic generating plate 910 is located inside the inner groove 908. The wiring harness of the ultrasonic generating plate 910 can be arranged inside the inner groove 908 to avoid water erosion.

[0035] It should be noted that see Figure 3 , place the semiconductor pipeline on the fixed seat 7 and the rotating assembly 8, convey the tray 6 to the bottom of the cleaning box 4 through the stepping conveyor belt 2, drive the T-shaped plate 901 to move downward through the cylinder 5, and the T-shaped plate 901 drives the ultrasonic generating plate 910 at the bottom thereof to fit the outer wall of the pipeline. At the same time, the high-pressure nozzle 913 on the T-shaped plate 901 is aimed at the pipeline, and the ultrasonic generating plate 910 is started. The ultrasonic generating plate 910 drives the pipeline to vibrate, so that the dirt on the inner wall of the pipeline is loosened.

[0036] The motor 902 drives the screw rod 905 to rotate. Figure 5 The screw rod 905 drives the L-shaped rod 1 906 and the L-shaped rod 2 907 to move synchronously. When the L-shaped rod 2 907 moves downward, the L-shaped rod 2 907 pushes one end of the semiconductor pipeline to move through the ultrasonic generating plate 910, so that the pipeline gradually tilts. In the process of the pipeline tilting, high-pressure water flushes the pipeline through the high-pressure nozzle 913. The high-pressure nozzle 913 flushes from the inner wall of the pipeline far away from the end of the high-pressure nozzle 913 to the inner wall of the pipeline close to the end of the high-pressure nozzle 913, and cooperates with the ultrasonic generating plate 910 to drive the pipeline body to vibrate, thereby improving the cleaning ability of the pipeline.

[0037] Specifically, when the L-shaped rod 907 pushes the semiconductor pipeline to tilt, see Figures 8 - 9 , one end of the pipeline presses the pressing platform 802, at this time the longitudinal spring 811 is compressed, the pressing platform 802 moves relative to the base 801, so that the rack 810 on the base 801 drives the transmission gear 807 to rotate, and the transmission gear 807 drives the belt 803 to run through the active roller 806, so that the belt 803 drives the inclined pipeline to rotate, so that the high-pressure nozzle 913 flushes various parts of the inner wall of the pipeline to avoid cleaning dead corners on the inner wall of the pipeline.

[0038] See also Figures 3 - 5 The screw rod 905 is installed in a transmission manner with an L-shaped rod 906, a triangular frame 911 is installed on the L-shaped rod 906, and the triangular frame 911 fits the inclined surface of the inclined plate 912; when the L-shaped rod 906 moves downward, the L-shaped rod 906 pushes the inclined plate 912 to move toward the semiconductor pipeline through the triangular frame 911.

[0039] Specifically, a transverse groove is provided in the T-shaped plate 901 , and the inclined plate 912 is slidably matched with the transverse groove. The inclined plate 912 is connected to the inner wall of the T-shaped plate 901 via a transverse spring 914 .

[0040] It should be noted that, due to the turbulence effect, more impurities are accumulated at the nozzle of the semiconductor pipeline than at the tube body. For example, when the liquid in the pipeline flows at a high speed, the tiny particles entrained in the liquid will frequently collide with the inner wall of the nozzle and adhere to it due to the turbulence at the nozzle.

[0041] Based on the above problems, when the lead screw 905 of the present invention is running, the lead screw 905 drives the first L-shaped rod 906 to move downward. The first L-shaped rod 906 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe orifice direction through the triangular frame 911, and the transverse spring 914 is compressed. At the same time, as the second L-shaped rod 907 drives the pipe to gradually tilt through the ultrasonic generating plate 910, the high-pressure nozzle 913 gradually flushes towards the position of the pipe orifice. As the high-pressure nozzle 913 gradually approaches the pipe orifice, the water pressure of the high-pressure nozzle 913 on the inner wall of the pipe gradually increases, and the flushing force of the high-pressure nozzle 913 gradually increases. When the high-pressure nozzle 913 flushes towards the inner wall of the pipe orifice, the flushing force of the high-pressure nozzle 913 on the inner wall of the pipe orifice is the greatest.

[0042] The present invention drives the pipe to tilt through the second L-shaped rod 907, so that the high-pressure nozzle 913 flushes from the inner wall of the pipe body towards the inner wall of the pipe orifice. At the same time, the triangular frame 911 is used to push the inclined plate 912 and the high-pressure nozzle 913 thereon to move closer to the pipe orifice direction, so that the water pressure of the high-pressure nozzle 913 towards the pipe orifice gradually increases, and the cleaning strength of the inner wall of the pipe orifice is improved.

[0043] Specifically, the present invention can perform secondary cleaning on the pipe. That is, after the cleaning of one end of the pipe orifice is completed, the tray 6 is sent back through the stepping conveyor belt 2. After the pipe is placed reversely on the fixed seat 7 and the rotating assembly 8, the pipe is then conveyed to the bottom of the cleaning assembly 9 through the stepping conveyor belt 2 for secondary cleaning.

[0044] See Figures 6 - 7 A heat dissipation member 11 is installed on the cleaning box 4, an upper sliding pad 915 is installed at the bottom of the ultrasonic generating plate 910, and a lower sliding pad 10 is installed on the fixed seat 7.

[0045] It should be noted that an upper sliding pad 915 is installed between the ultrasonic generating plate 910 and the pipe. The lower sliding pad 10 and the upper sliding pad 915 are made of graphite material, which has the functions of small friction and shock absorption. During the rotation of the pipe, the upper sliding pad 915 can reduce the friction of the pipe and enable the pipe to rotate smoothly.

[0046] The working principle of the present invention: When the present invention is in use, see Figure 3 . The semiconductor pipe is placed on the fixed seat 7 and the rotating assembly 8. The tray 6 is conveyed to the bottom of the cleaning box 4 through the stepping conveyor belt 2. The T-shaped plate 901 is driven to move downward by the air cylinder 5. The T-shaped plate 901 drives the ultrasonic generating plate 910 at its bottom to fit the outer wall of the pipe. At the same time, the high-pressure nozzle 913 on the T-shaped plate 901 is aligned with the pipe. The ultrasonic generating plate 910 is started, and the ultrasonic generating plate 910 drives the pipe to vibrate, so that the dirt on the inner wall of the pipe becomes loose.

[0047] The lead screw 905 is driven to rotate by the motor 902, see Figure 5, the lead screw 905 drives the first L-shaped rod 906 and the second L-shaped rod 907 to move up and down synchronously. When the second L-shaped rod 907 moves downward, the second L-shaped rod 907 pushes one end of the semiconductor pipeline through the ultrasonic generating plate 910 to move, causing the pipeline to gradually tilt. During the tilting process of the pipeline, high-pressure water flushes the pipeline through the high-pressure nozzle 913. The high-pressure nozzle 913 flushes from the inner wall of the pipeline at the end far from the high-pressure nozzle 913 towards the inner wall of the pipeline at the end close to the high-pressure nozzle 913, and cooperates with the ultrasonic generating plate 910 to drive the pipeline body to vibrate, improving the cleaning ability of the pipeline.

[0048] Specifically, when the second L-shaped rod 907 pushes the semiconductor pipeline to tilt, refer to Figures 8 - 9 , one end of the pipeline presses the pressing table 802. At this time, the longitudinal spring 811 is compressed, and the pressing table 802 moves relative to the base 801, causing the rack 810 on the base 801 to drive the transmission gear 807 to rotate. The transmission gear 807 drives the belt 803 to run through the driving roller 806, causing the belt 803 to drive the tilted pipeline to rotate, so that the high-pressure nozzle 913 flushes each part of the inner wall of the pipeline, avoiding cleaning dead corners on the inner wall of the pipeline.

[0049] Specifically, under the action of the turbulent flow effect, there are more impurities accumulated at the pipe orifice position of the semiconductor pipeline than at the pipe body position. For example, when the liquid inside the pipeline flows at a high speed, the tiny particles entrained in the liquid will frequently collide with the inner wall of the pipe orifice and adhere to it due to the turbulent flow at the pipe orifice.

[0050] Based on the above problems, when the lead screw 905 of the present invention is running, the lead screw 905 drives the first L-shaped rod 906 to move downward. The first L-shaped rod 906 pushes the inclined plate 912 and the high-pressure nozzle 913 thereon to move towards the pipe orifice direction through the triangular frame 911, and the transverse spring 914 is compressed. At the same time, as the second L-shaped rod 907 drives the pipeline to gradually tilt through the ultrasonic generating plate 910, the high-pressure nozzle 913 gradually flushes towards the pipe orifice position direction. As the high-pressure nozzle 913 gradually approaches the pipe orifice, the water pressure of the high-pressure nozzle 913 on the inner wall of the pipeline gradually increases, and the flushing force of the high-pressure nozzle 913 gradually increases. When the high-pressure nozzle 913 flushes towards the inner wall of the pipe orifice, the flushing force of the high-pressure nozzle 913 on the inner wall of the pipe orifice is the greatest.

[0051] The present invention drives the pipeline to tilt through the second L-shaped rod 907, so that the high-pressure nozzle 913 flushes from the inner wall of the pipe body towards the inner wall of the pipe orifice. At the same time, the triangular frame 911 is used to push the inclined plate 912 and the high-pressure nozzle 913 thereon to move towards the pipe orifice direction, so that the water pressure of the high-pressure nozzle 913 towards the pipe orifice direction gradually increases, improving the cleaning strength of the inner wall of the pipe orifice.

[0052] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. An ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline, characterized in that: It includes a workbench (1), on which a stepping conveyor belt (2) is installed. The workbench (1) is connected to a cleaning box (4) through a connecting platform (3). A cylinder (5) is installed on the cleaning box (4), and the output end of the cylinder (5) is connected to a cleaning component (9). A tray (6) is placed on the stepping conveyor belt (2), and a fixing seat (7) and a rotating component (8) are installed on the tray (6). The semiconductor pipe is fixed on the fixing seat (7) and the rotating component (8). The cleaning component (9) includes a T-shaped plate (901), on which a motor (902) is installed. The motor (902) drives a lead screw (905) to rotate. The lead screw (905) is in transmission cooperation with an L-shaped rod two (907). One end of the L-shaped rod two (907) is rotatably connected to an ultrasonic generating plate (910), and the other end of the ultrasonic generating plate (910) is connected to the bottom of the T-shaped plate (901) through a rotating shaft (909). An inclined plate (912) is slidably installed in the T-shaped plate (901), and a high-pressure spray head (913) is installed on the inclined plate (912). The cylinder (5) drives the T-shaped plate (901) to move downward, so that the ultrasonic generating plate (910) at the bottom of the T-shaped plate (901) fits the semiconductor pipe. The rotating component (8) includes a base (801) and a pressing table (802). The base (801) is installed on the tray (6). A layout groove (805) is opened on the pressing table (802), and a driven roller group (804) and a driving roller (806) are installed in the layout groove (805). A belt (803) is installed on the driven roller group (804) and the driving roller (806). A transmission gear (807) is coaxially installed on the driving roller (806). The pressing table (802) is slidably matched with the base (801). The base (801) is connected to the pressing table (802) through a longitudinal spring (811). A rack (810) is installed on the base (801), and the rack (810) is meshed with the transmission gear (807). One end of the semiconductor conduit is installed on the pressing table (802), so that the semiconductor pipe fits the belt (803). The lead screw (905) is in transmission installation with an L-shaped rod one (906). A triangular frame (911) is installed on the L-shaped rod one (906), and the triangular frame (911) fits the inclined surface of the inclined plate (912). When the L-shaped rod one (906) moves downward, the L-shaped rod one (906) pushes the inclined plate (912) to move towards the semiconductor pipe through the triangular frame (911).

2. The ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline according to claim 1, wherein: A transverse groove is opened in the T-shaped plate (901), and the inclined plate (912) is slidably matched with the transverse groove. The inclined plate (912) is connected to the inner wall of the T-shaped plate (901) through a transverse spring (914).

3. The ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline according to claim 1, wherein: The motor (902) is connected to the lead screw (905) through a reduction box (904), and the lead screw (905) is respectively in transmission connection with the L-shaped rod one (906) and the L-shaped rod two (907).

4. A semiconductor pipeline inner wall ultrasonic high-pressure flushing device according to claim 1, characterized in that: A sliding groove (903) is opened on the T-shaped plate (901), and the L-shaped rod two (907) and the L-shaped rod one (906) are located in the sliding groove (903) to slide, and the lead screw (905) is installed in the sliding groove (903).

5. A semiconductor pipeline inner wall ultrasonic high-pressure flushing device according to claim 1, characterized in that: A heat dissipation member (11) is installed on the cleaning box (4), an upper sliding pad (915) is installed at the bottom of the ultrasonic generating plate (910), and a lower sliding pad (10) is installed on the fixed seat (7).

6. The ultrasonic high-pressure flushing device for the inner wall of a semiconductor pipeline according to claim 1, wherein: A relief groove (808) and a guide groove (812) are formed in the pressing table (802), a guide rod (809) is installed on the base (801), the guide rod (809) is slidably engaged with the guide groove (812), and the rack (810) is engaged with the relief groove (808).

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