Chip dismantling method and device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of electronic processing, in particular to a chip dismounting method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring chip characteristics of a to-be-removed chip and a spot size of a laser spot of a laser; wherein the chip features comprise the chip position and the chip size of the chip to be dismantled; and under the condition that the chip size is larger than the spot size of the laser spot and the difference value between the chip size and the spot size is larger than a preset difference value threshold value, according to the chip position, the chip size and the first temperature curve, the laser spot is controlled to scan in a preset path and blow air, so that the to-be-dismantled chip is dismantled. Therefore, the technical problem that the spot size of the laser spot cannot adapt to the chip size in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the field of electronic processing technology, and in particular to a chip removal method, device, electronic equipment and storage medium. Background Art

[0002] In industries such as electronic processing and display panel manufacturing, after chips are welded, there will be a certain proportion of defects due to the chips themselves or welding reasons. In order to ensure product quality, the defective chips need to be repaired.

[0003] The existing repair method requires the laser to undergo energy homogenization processing, and the size of the laser spot after homogenization is difficult to change. The adaptability of the spot to chips of different sizes is poor, and the laser's light emission time is unreasonable, which can easily lead to problems such as the chip being unable to be removed or the pad being damaged. Summary of the invention

[0004] The present application provides a chip removal method, device, electronic device and storage medium, which are used to solve the technical problem that the spot size of the laser spot in the related art cannot adapt to the chip size.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a chip removal method, comprising: obtaining chip characteristics of a chip to be removed and a spot size of a laser spot of a laser; wherein the chip characteristics include a chip position and a chip size of the chip to be removed; when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is greater than a preset difference threshold, according to the chip position, chip size and a first temperature curve, controlling the laser spot to scan and blow along a preset path to remove the chip to be removed.

[0007] In one of the embodiments, before obtaining the chip features of the chip to be removed, the method further includes: obtaining a chip image of the chip to be removed; and determining the chip features of the chip to be removed based on the chip image.

[0008] In one of the embodiments, the method further includes: when the difference between the chip size of the chip to be removed and the spot size of the laser spot is less than a preset difference threshold, controlling the laser to emit light and blow air according to the chip position and the second temperature curve to remove the chip to be removed.

[0009] In one of the embodiments, controlling the laser spot to scan and blow air along a preset path also includes: acquiring a pad image; and determining that the chip to be removed has been successfully removed when the pad image includes pad features.

[0010] In the second aspect, the present application provides a chip removal device, comprising: an acquisition module, used to acquire chip characteristics of the chip to be removed; wherein the chip characteristics include the chip position and chip size of the chip to be removed; a processing module, used to control the laser spot to scan and blow along a preset path according to the chip position, chip size and a first temperature curve to remove the chip to be removed when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is greater than a preset difference threshold.

[0011] In a third aspect, the present application also provides an electronic device comprising: a processor and a memory configured to store processor executable instructions; wherein the processor is configured to execute the instructions to implement any one of the optional chip removal methods in the first aspect above.

[0012] In a fourth aspect, the present invention provides a computer-readable storage medium having instructions stored thereon. When the instructions in the computer-readable storage medium are executed by an electronic device, the electronic device is enabled to execute any one of the optional chip removal methods in the first aspect.

[0013] The present invention provides a chip removal method, device, electronic device and storage medium. By analyzing the relationship between the chip size of the chip to be removed and the spot size of the laser spot, when the chip size of the chip to be removed is larger than the spot size of the laser, the laser spot is controlled to scan and blow air along a preset path according to the chip position, chip size and first temperature curve of the chip to be removed. The fixed light emission time is not used, and the removal process of the chip to be removed is closed-loop controlled, which can effectively shorten the removal time, improve the removal efficiency, and avoid damage to the chip or pad due to excessive laser irradiation time. The technical problem of pad damage caused by unreasonable laser emission time in the related art is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 A schematic diagram of a chip removal system provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure of an optical path system provided in an embodiment of the present application;

[0017] Figure 3A schematic diagram of the connection relationship of an optical path system provided in an embodiment of the present application;

[0018] Figure 4 A schematic diagram of a method for changing the direction of a light beam provided in an embodiment of the present application;

[0019] Figure 5 A schematic diagram of another method of changing the direction of a light beam provided in an embodiment of the present application;

[0020] Figure 6 A schematic diagram of a laser scanning path provided in an embodiment of the present application;

[0021] Figure 7 A schematic diagram of the connection relationship of another optical path system provided in an embodiment of the present application;

[0022] Figure 8 A schematic diagram of a chip removal process provided in an embodiment of the present application;

[0023] Fig. 9 A schematic diagram of a process flow of another chip removal method provided in an embodiment of the present application;

[0024] Fig.10 A schematic diagram of a temperature curve provided in an embodiment of the present application;

[0025] Fig.11 A schematic flow chart of another chip removal method provided in an embodiment of the present application;

[0026] Fig.12 A schematic diagram of a pad image provided in an embodiment of the present application;

[0027] Fig.13 A schematic flow chart of another chip removal method provided in an embodiment of the present application;

[0028] Fig.14 A schematic diagram of the structure of a chip removal device provided in an embodiment of the present application;

[0029] Fig.15 A schematic structural diagram of another chip removal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] A chip removal method, device, electronic device and storage medium provided in an embodiment of the present application will be described in detail below in conjunction with the accompanying drawings.

[0031] The terms "first" and "second" in the specification and drawings of this application are used to distinguish different objects rather than to describe a specific order of objects. For example, the first distance and the second distance are used to distinguish different distances rather than to describe a specific order of distances.

[0032] In addition, the terms "including" and "having" and any variations thereof mentioned in the description of the present application are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment including a series of steps or units is not limited to the listed steps or units, but may optionally include other steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or equipment.

[0033] It should be noted that in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0034] The term "and / or" used in the present application includes using either or both of the two methods.

[0035] In the description of the present application, unless otherwise specified, “plurality” means two or more.

[0036] At present, the repair process of pads is generally to remove the defective chip first and then weld a new chip. For large and sparsely arranged chips, hot air, electric soldering iron and other methods can be used for heating and removal, while for micro-electronic chips with small volume and spacing, large number of reworks and high rework efficiency requirements, laser repair devices with high heating accuracy and fast heating speed are required for removal and welding.

[0037] However, since the laser needs to undergo energy homogenization, the spot size of the homogenized laser is difficult to change. The adaptability of the spot to chips of different sizes is poor. For example, using a large spot to heat a smaller chip may affect the surrounding good chips. When a small spot is used to heat a larger chip, the chip cannot be heated evenly because the heating area is too small, making it difficult to remove the chip. In addition, when removing chips with lasers in the prior art, a fixed laser emission time is generally used, and this emission time is generally given based on experience. If the given emission time is too short, the chip may be unable to be removed; if the emission time is too long, the overall work efficiency will be low, and the pad may be damaged due to the long-term laser irradiation.

[0038] Based on this, the embodiment of the present application provides a chip removal method, including: obtaining the chip characteristics of the chip to be removed and the spot size of the laser spot of the laser; wherein the chip characteristics include the chip position and chip size of the chip to be removed; when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is larger than a preset difference threshold, according to the chip position, chip size and first temperature curve, controlling the laser spot to scan and blow air along a preset path to remove the chip to be removed. In this way, the technical problem that the spot size of the laser spot cannot adapt to the chip size in the related art is solved.

[0039] Figure 1 A schematic diagram of a chip removal system provided in an embodiment of the present application. Figure 1 The chip removal system 100 includes a controller 1 , a temperature sensing system 2 , a laser system 3 , an imaging system 4 , an optical path system 5 , a gas path system 6 and a motion system 7 .

[0040] In some embodiments, the controller 1 is communicatively connected with the temperature sensing system 2 , the laser system 3 , the imaging system 4 , the gas path system 6 , and the motion system 7 .

[0041] In some embodiments, the controller 1 can receive and analyze data from the temperature sensing system 2, and adjust the output power of the laser in real time according to the difference between the working area temperature and the set temperature curve, thereby achieving closed-loop control of the working area temperature.

[0042] Optionally, the temperature sensing system 2 may be a temperature sensor for detecting the average temperature of the area, or an infrared camera for realizing infrared imaging in the area.

[0043] For example, a temperature sensor generally only obtains the average temperature value within a fixed-size area, while an infrared camera can obtain infrared images of the laser working area and its surroundings.

[0044] In some embodiments, when the temperature sensing system 2 uses an infrared camera, the controller 1 defines a temperature measurement range and obtains a temperature value according to the location and size of the chip to be removed or other set areas.

[0045] It should be noted that, in addition to the above functions, the temperature sensing system 2 can intuitively obtain the temperature change data of each position in the working area, and has the function of calculating the average temperature and obtaining the highest and lowest temperatures. Therefore, based on this, the optimal temperature curve of the chip to be removed can be obtained by referring to the chip removal effect.

[0046] In some embodiments, the controller 1 can determine the remaining state of the chip to be removed according to the image features, and complete the closed-loop control of the removal process.

[0047] In some embodiments, the controller 1 can also control the switch of the gas path system 6 and control the motion system 7 to achieve the alignment of the light spot of the optical path system 5 and the chip to be removed.

[0048] In some embodiments, the temperature sensing system 2 is used to detect and feedback the temperature of the working area in real time. The temperature sensing system in the embodiment of the present application can be a temperature sensor for detecting the average temperature of the area, or an infrared camera for realizing infrared imaging in the area. The present application does not limit the type of temperature sensing system.

[0049] In some embodiments, the laser system 3 is used to emit laser and heat the chip to be removed on the substrate.

[0050] In some embodiments, the imaging system 4 includes an imaging device for acquiring images of the working area and uploading them to the controller. The imaging device may be a camera or a video camera, and the present application does not limit the type of the imaging device.

[0051] In some embodiments, the optical path system 5 is communicatively connected with the temperature sensing system 2 , the laser system 3 , and the imaging system 4 .

[0052] It should be noted that the embodiments of the present application take the chips to be removed as miniature light-emitting diode (LED) chips and integrated circuit (IC) chips as examples. In the specific implementation, the present application does not limit the type of chip.

[0053] Figure 2 This is a schematic diagram of the structure of an optical path system provided in an embodiment of the present application. Figure 2 As shown, the optical path system 5 includes a reflector, a dichroic mirror, a collimating lens group, a focusing lens group, a beam homogenizing device and a two-dimensional scanning system.

[0054] Figure 3 A schematic diagram of the connection relationship of an optical path system provided in an embodiment of the present application. Figure 3 As shown, the reflector and dichroic mirror can realize the coaxial transmission of the laser optical path, the temperature measurement optical path and the imaging optical path; the collimating lens group, the focusing lens group and the beam homogenizing device can shape the laser into a rectangular spot with uniform energy distribution; the two-dimensional scanning system can quickly change the beam transmission path, and can realize the heating and removal of chips of different sizes.

[0055] It should be noted that the two-dimensional scanning system in the present device can be a galvanometer system with two unidirectional axes of motion, or a fast reflection mirror system that can move in two dimensions.

[0056] In some embodiments, the controller 1 may also receive and analyze images transmitted by the imaging system 4 to plan a scanning path, and control the two-dimensional scanning system to achieve rapid scanning of the laser spot on the chip surface.

[0057] In some embodiments, the gas system 6 is used to realize the generation and transmission of gas, and accurately blow the gas to the chip to be removed when receiving the gas outlet instruction.

[0058] In some embodiments, the motion system 7 is used to adjust the relative position of the optical system 5 and the chip to be removed.

[0059] In the embodiment shown in the present application, the controller 1 refers to a device that can generate an operation control signal according to an instruction operation code and a timing signal to instruct the chip removal system to execute a control instruction.

[0060] Exemplarily, the controller may be a central processing unit (CPU), a general-purpose processor, a network processor (NP), a digital signal processor (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof.

[0061] In some embodiments, the controller may also be other devices with processing functions, such as circuits, devices, or software modules, and the embodiments of the present application do not impose any limitations on this.

[0062] It should be noted that Figure 1 Only one example of the chip removal system is shown. In a specific implementation, the chip removal system 100 may include more or fewer types of devices, and each type may include more or fewer devices. This application does not limit this.

[0063] In some embodiments, Figure 3 As shown, the laser beam 9 - 1 emitted from the laser transmission optical fiber 10 is shaped into a nearly parallel laser beam by the collimating lens group 11 .

[0064] Furthermore, after the laser beam is reflected by the reflector 12 , it passes through the beam homogenization device 13 , and the laser beam is shaped into a beam with uniform energy distribution.

[0065] Subsequently, the laser beam 9 - 1 enters the two-dimensional scanning system after being reflected by the dichroic mirror. The two-dimensional scanning system can deflect the laser beam in two dimensions to achieve the purpose of changing the transmission direction.

[0066] Furthermore, after the laser beam passes through the dichroic mirror and the focusing lens group, the energy distribution changes from the initial Gaussian distribution circular spot to a uniformly distributed rectangular spot 9-2.

[0067] In some embodiments, the infrared light 14 generated when the laser is heated can enter the infrared temperature sensor 15 through the focusing lens group and the dichroic mirror. After the infrared temperature sensor 15 feeds back the temperature data to the controller 1, the controller can adjust the laser's light output power after comparing the temperature data with a preset temperature control curve, thereby realizing closed-loop control of the temperature of the working area.

[0068] In some embodiments, visible light 16 can enter camera 17 through a focusing lens group and a dichroic mirror. Camera 17 captures images and uploads them to controller 1. Controller 1 performs tasks such as position recognition, size recognition, scanning path planning, chip feature recognition, and determination of whether removal is successful.

[0069] It should be noted that in the above-mentioned coaxial optical path, the laser and the infrared temperature sensor optical path both pass through the two-dimensional scanning system. When the two-dimensional scanning system is working, the infrared temperature detection area is concentric with the laser action area, the light beam performs coaxial scanning, and the camera collection area is a static area and is not affected by the two-dimensional scanning system.

[0070] Figure 4 A schematic diagram of a method for changing the direction of a light beam provided in an embodiment of the present application. Figure 4 As shown, after the laser beam 18 passes through the one-dimensional galvanometer 6-1, the propagation direction of the beam changes from vertical to horizontal, and after being reflected to another one-dimensional galvanometer 6-2, the propagation direction of the beam is deflected 90 degrees on the same horizontal plane.

[0071] Furthermore, when the one-dimensional galvanometer is working, the motor drives the one-dimensional galvanometer 6-1 and the one-dimensional galvanometer 6-2 to deflect rapidly around the axis, and the light spot realizes two-dimensional motion on the horizontal working plane after reflection and focusing.

[0072] Figure 5 A schematic diagram of another method of changing the direction of a light beam provided in an embodiment of the present application. Figure 5 As shown, after the laser beam 18 is incident on the galvanometer lens 6-3, the propagation direction of the beam is deflected 90 degrees from vertical to horizontal.

[0073] Furthermore, when the one-dimensional galvanometer is working, the galvanometer lens 6-4 can drive the reflective lens to perform two-dimensional shaking, so that the light spot moves in an arbitrary trajectory on the vertical plane after reflection, and the light spot realizes two-dimensional movement on the horizontal working plane after reflection and focusing.

[0074] In some embodiments, when the focused light spot is irradiated onto the substrate 19, Figure 6As shown, the laser light passes through the laser head optical system to obtain a homogenized focused light spot 9-2. When the chip size of the chip to be removed is small, such as the chip to be removed 20, the light spot 9-2 can cover the chip to be removed. Therefore, the light spot can be directly used to irradiate the chip to be removed 20 without scanning.

[0075] Alternatively, when the chip size of the chip to be removed is relatively large, such as the chip to be removed 21 , it can be quickly scanned according to the scanning path 22 generated by the controller 1 so that the chip to be removed 21 is evenly heated.

[0076] It should be noted that the substrate 19 can be a printed circuit board substrate (PCB) or a glass substrate. The present application does not limit the type of substrate.

[0077] In some embodiments, while the laser is turned on, gas is blown toward the chip 20 or the chip 21 to be removed on the substrate 15 through the gas nozzle 23. After the laser heats the chip to be removed to melt the solder and reduce its viscosity, the gas can blow the chip to be removed off the surface of the substrate.

[0078] In some embodiments, the infrared temperature sensing optical path may not pass through the two-dimensional scanning system. Figure 7 A schematic diagram of the connection relationship of another optical path system provided in an embodiment of the present application, such as Figure 7 As shown, the laser beam 9 - 1 emitted from the laser transmission optical fiber 10 is shaped into a nearly parallel laser beam by the collimating lens group 11 .

[0079] Furthermore, after the laser beam 9-1 passes through the beam homogenizer 24, the homogenizer can shape the laser beam 9-1. The laser beam 9-1 enters the two-dimensional scanning system, and the two-dimensional scanning system can deflect the laser beam 9-1 in two dimensions to achieve the purpose of changing the transmission direction. After the laser beam 9-1 passes through the dichroic mirror and the focusing lens group, the energy distribution of the laser beam 9-1 changes from the initial Gaussian distribution circular spot to a uniformly distributed rectangular spot 9-2.

[0080] In some embodiments, the infrared light 14 generated by laser heating can enter the infrared temperature sensor 15 through the focusing lens group, the dichroic mirror, and the reflector 12. After the infrared temperature sensor 15 feeds back the temperature data to the controller 1, the controller 1 can adjust the laser output power after comparing the temperature data with the preset temperature control curve, thereby realizing closed-loop control of the temperature of the working area.

[0081] Furthermore, the visible light 16 can enter the camera 17 via the focusing lens group and the dichroic mirror. The camera 17 collects images and uploads them to the controller 1. The controller 1 performs tasks such as position recognition, size recognition, scanning path planning, chip feature recognition, and whether the removal is successful.

[0082] Optional, Figure 7 The chips to be removed are Mini LED chips and IC chips. The chip size of the Mini LED chip to be removed is 100*200um, the chip size of the IC chip to be removed is 400*400um, and the rectangular spot size of the laser after processing is 108*210um.

[0083] Figure 8 A schematic diagram of a chip removal method provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the method comprises the following steps:

[0084] S101, obtaining chip characteristics of the chip to be removed and the spot size of the laser spot of the laser.

[0085] The chip characteristics include the chip position and chip size of the chip to be removed.

[0086] In some embodiments, the chip features of the chip to be removed may be determined through a chip image of the chip to be removed. Fig. 9 A schematic flow chart of another chip removal method provided in an embodiment of the present application is used to determine the chip characteristics of the chip to be removed, such as Fig. 9 As shown, the method comprises the following steps:

[0087] S201, obtaining a chip image of a chip to be removed.

[0088] In some embodiments, when the task of removing the chip is initiated, the motion system drives the camera in the imaging system to move to the position of the chip to be removed (Mini LED chip or IC chip), ensuring that the chip to be removed is located in the center of the camera's field of view, and then obtains the chip image of the chip to be removed on the pad on the backlight panel.

[0089] S202: Determine chip features of the chip to be removed according to the chip image.

[0090] In some embodiments, after the chip image of the chip to be removed is acquired, the chip features of the chip to be removed may be determined according to the chip image of the chip to be removed.

[0091] In some embodiments, if the chip type of the chip to be removed is a Mini LED chip, the chip feature of the chip to be removed is that the difference between the chip size and the spot size of the laser spot is less than a preset difference threshold.

[0092] Exemplarily, if the chip type of the chip to be removed is an IC chip, the chip feature of the chip to be removed is that the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is larger than a preset difference threshold.

[0093] In some embodiments, the spot size of the laser spot of different lasers may be different. Usually, the difference between the spot size of the laser spot and the chip size of the Mini LED chip is less than a preset difference threshold, and the difference between the spot size of the laser spot and the chip size of the IC chip is greater than the preset difference threshold.

[0094] It should be noted that the spot size of the laser spot of the laser is set and stored in the memory of the laser, and after the chip removal work begins, the spot size can be directly obtained from the memory of the laser. This application does not limit the spot size of the laser spot.

[0095] S102, when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is larger than a preset difference threshold, control the laser spot to scan and blow air along a preset path according to the chip position, chip size and the first temperature curve.

[0096] In some embodiments, when determining the chip size S of the chip to be removed c Larger than the laser spot size S b And the chip size S c With spot size S b When the difference between them is greater than the preset difference threshold A, that is, when S c >S b And S c -S b >A, that is, when it is determined that the chip type of the chip to be removed is an IC chip, according to the chip position, average temperature and the first temperature curve, the controller controls the two-dimensional scanning system to realize rapid scanning of the laser spot on the surface of the chip to be removed, and at the same time controls the laser to scan and blow along a preset path to remove the chip to be removed.

[0097] Optionally, the temperature of each part of the area where the chip to be removed is located may be acquired through a temperature sensor, and the average temperature of the area where the chip to be removed is located may be calculated based on the temperature of each part of the area where the chip to be removed is located.

[0098] In some embodiments, the first temperature curve can change the light output temperature of the laser spot by adjusting the light output power of the laser, thereby controlling the average temperature of the area where the chip to be removed is located, and realizing closed-loop control of the temperature of the working area. In different situations, the various parameters of the first temperature curve may be different, and this application does not limit the first temperature curve.

[0099] Optional, Fig.10 A first temperature curve schematic diagram provided in an embodiment of the present application is shown in FIG. Fig.10As shown, the first temperature curve can be: control the laser to increase the power, so that the temperature of the laser light instantly rises from x℃ (T1) to 150℃ (T2), and linearly rises to 280℃ (T3) within 0.5 seconds (t1-t2), maintain the current power of the laser, keep the light temperature warm for 2 seconds (t3) and stop emitting light.

[0100] In some embodiments, the preset path is determined based on the chip size of the chip to be removed, the spot size of the laser and the shape of the chip to be removed. The controller controls the two-dimensional scanning system to enable the laser spot to quickly scan the surface of the chip to be removed along the preset path to ensure that the laser spot can emit light to every part of the chip to be removed without omission and evenly, so as to achieve uniform heating of the chip to be removed.

[0101] Optionally, the laser spot scanning path trajectory can be a 200*300 rectangle, and the scanning speed is 500 mm / s.

[0102] For example, when S c >S b And S c -S b When the temperature is higher than A, the controller controls the laser's scanning path trajectory to be a 200*300 rectangle based on the position of the chip to be removed and the average temperature of the area where the chip to be removed is located, and the scanning speed is 500 mm / s. At the same time, the laser is controlled to start blowing and the laser power is increased to make the temperature of the laser light rise to 150°C instantaneously, and rise linearly to 280°C within 0.5 seconds. The current power of the laser is maintained to keep the light temperature warm for 2 seconds and then stop emitting light to remove the chip to be removed.

[0103] In some embodiments, the chip size S of the chip to be removed c The laser spot size S b When the difference between the two is less than the preset difference threshold A, the laser is controlled to emit light and blow air according to the chip position and the second temperature curve to remove the chip to be removed.

[0104] In some embodiments, when determining the chip size S of the chip to be removed c The laser spot size S b When the difference between them is less than the preset difference threshold A, that is, |S c -S b |<A, that is, when it is determined that the chip type of the chip to be removed is a Mini LED chip, the laser is controlled to emit light and blow air according to the chip position and the second temperature curve to remove the chip to be removed.

[0105] It should be noted that the description of the second temperature curve is consistent with the above-mentioned first temperature curve, and will not be repeated here.

[0106] Optionally, the second temperature curve can be: controlling the laser to increase power so that the temperature of the laser light rises instantly from x°C to 155°C, and linearly rises to 290°C within 0.6 seconds, maintaining the current power of the laser, keeping the light output temperature warm for 1.9 seconds and then stopping the light output.

[0107] For example, when |S c -S b |<A, based on the position of the chip to be removed and the average temperature of the area where the chip to be removed is located, the controller controls the laser to start blowing and at the same time controls the laser to increase the power, so that the temperature of the laser light rises from x℃ to 155℃ instantly, and rises linearly to 290℃ within 0.6 seconds, maintaining the current power of the laser, keeping the light temperature warm for 1.9 seconds and then stopping the light to remove the chip to be removed.

[0108] In some embodiments, while the controller controls the laser spot to scan and blow air along a preset path, a pad image can be acquired through an imaging system, and whether the chip to be removed is successfully removed can be determined through the pad image. Fig.11 A schematic diagram of another chip removal method provided in an embodiment of the present application is shown in FIG. Fig.11 As shown, the method comprises the following steps:

[0109] S301, obtaining a pad image.

[0110] In some embodiments, after the chip to be removed is removed, the imaging system captures images of the pads and uploads the captured pad images to the controller. The controller determines whether the chip to be removed is successfully removed by identifying features of the pad images.

[0111] S302: When the pad image includes pad features, determine that the chip to be removed has been successfully removed.

[0112] Fig.12 A schematic diagram of a pad image provided in an embodiment of the present application, such as Fig.12 As shown, taking the chip to be removed as a Mini LED chip as an example, if the Mini LED chip 20 is not successfully removed, the feature on the pad image collected by the imaging system is the appearance feature A of the chip to be removed. If the Mini LED chip 20 has been successfully removed, that is, the chip to be removed has been blown off the pad, the appearance feature of the chip to be removed disappears on the pad image collected by the imaging system, and the pad feature B appears.

[0113] In some embodiments, if the chip to be removed is not successfully removed, the laser's light emission time is obtained. If the laser's light emission time is less than the preset light emission time, the controller controls the laser to continue to emit light and blow air according to the temperature curve; if the laser's light emission time is greater than or equal to the preset light emission time, the controller controls the laser to turn off and stop blowing air, and at the same time sends an alarm to the user, waiting for manual processing.

[0114] It should be noted that the preset light emission time is set by the chip removal system manufacturer and stored in the memory. The preset light emission time set by different chip removal system manufacturers may be different, and this application does not limit this.

[0115] In some embodiments, when the chip to be removed is successfully removed, the controller turns off the laser and stops blowing, completing the closed-loop removal of the chip.

[0116] The embodiment of the present invention analyzes the relationship between the chip size of the chip to be removed and the spot size of the laser spot. When the chip size of the chip to be removed is larger than the spot size of the laser and the difference between the chip size and the spot size is larger than the preset difference threshold, the laser spot is controlled to scan and blow air along a preset path according to the chip position, chip size and first temperature curve of the chip to be removed. The fixed light emission time is not used, and the removal process of the chip to be removed is closed-loop controlled, which can effectively shorten the removal time, improve the removal efficiency, and avoid damage to the chip or pad due to excessive laser irradiation time. The technical problem of pad damage caused by unreasonable laser light emission time in the related art is solved.

[0117] In some embodiments, the above steps can also be performed by Fig.13 The method shown is implemented as Fig.13 As shown, when the chip removal process begins, the optical path system moves into place to ensure that the chip to be removed is in the center of the camera's field of view to collect the chip image of the chip to be removed.

[0118] Furthermore, the controller identifies the chip position and chip size of the chip to be removed, plans the scanning path of the laser and starts scanning the chip to be removed. At the same time, the controller obtains the temperature of the area where the chip to be removed is located to calculate the average temperature of the area where the chip to be removed is located.

[0119] Next, the controller adjusts the laser's light output frequency according to the set temperature curve to change the light output temperature of the laser spot, thereby changing the average temperature of the area where the chip to be removed is located, and at the same time, starts blowing to remove the chip to be removed.

[0120] Furthermore, the pad image is captured by the camera, and whether the chip to be removed has been successfully removed is determined based on the pad image. If it has not been successfully removed, when the laser's light emission time is less than the preset light emission time, the controller controls the laser to continue to emit light and blow air according to the temperature curve; if the laser's light emission time is greater than or equal to the preset light emission time, the controller controls the laser to turn off and stop blowing air, and at the same time sends an alarm to the user, waiting for manual processing.

[0121] Optionally, manual processing includes checking the cleanliness of the optical lens, the accuracy of the light spot landing point, the accuracy of the blowing position, and whether the temperature curve parameters are correct.

[0122] Alternatively, if the chip to be removed has been successfully removed, the controller turns off the laser and stops blowing, completing the chip removal process.

[0123] The embodiment of the present invention can divide the functional modules of the electronic device etc. according to the above method example. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiment of the present invention is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0124] In the case of dividing each functional module into corresponding functional modules, Fig.14 A schematic diagram of the structure of a chip removal device provided in an embodiment of the present application is shown in FIG. Fig.14 As shown, the chip removal device 200 may include: an acquisition module 201 and a processing module 202 .

[0125] In some embodiments, the acquisition module 201 is used to acquire chip features of the chip to be removed; wherein the chip features include the chip position and chip size of the chip to be removed.

[0126] In some embodiments, the processing module 202 is used to control the laser spot to scan and blow air along a preset path to remove the chip to be removed according to the chip position, chip size and the first temperature curve when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is greater than a preset difference threshold.

[0127] In some embodiments, the acquisition module 201 is further used to acquire a chip image of the chip to be removed.

[0128] In some embodiments, the processing module 202 is further configured to determine chip features of the chip to be removed according to the chip image.

[0129] In some embodiments, the processing module 202 is also used to control the laser to emit light and blow air to remove the chip to be removed according to the chip position and the second temperature curve when the difference between the chip size of the chip to be removed and the spot size of the laser spot is less than a preset difference threshold.

[0130] In some embodiments, the acquisition module 201 is further used to acquire a pad image.

[0131] In some embodiments, the processing module 202 is further configured to determine that the chip to be removed has been successfully removed when the pad image includes pad features.

[0132] In the case of an integrated unit, Fig.15 FIG. 1 shows a possible structural diagram of the chip removal device involved in the above embodiment. Fig.15 As shown, the chip removal device 200 may further include: a storage module 203 and a communication module 204. The communication module 204 may be used to support the communication between the chip removal device and other entities. The storage module 203 is used to store program codes and data of the chip removal device.

[0133] In some embodiments, the processing module 202 may be a processor or a controller. The storage module 203 may be a memory. The communication module 204 may be a transceiver, a transceiver circuit or a communication interface.

[0134] When the processing module 202 is a processor, the storage module 203 is a memory, and the communication module 204 is a transceiver, the processor, the transceiver, and the memory may be connected via a bus. The bus may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc.

[0135] It should be understood that in various embodiments of the present invention, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0136] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0137] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0138] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0139] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using a software program, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, data center, etc. that contains one or more media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a DVD), or a semiconductor medium (eg, a solid state disk (SSD)).

[0140] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A chip removal method, characterized in that: include: Acquire the chip characteristics of the chip to be removed and the spot size of the laser spot of the laser; wherein the chip characteristics include the chip position and chip size of the chip to be removed; When the chip size is larger than the spot size and the difference between the chip size and the spot size is larger than a preset difference threshold, the laser spot is controlled to scan and blow along a preset path according to the chip position, the chip size and the first temperature curve to remove the chip to be removed.

2. The method according to claim 1, characterized in that Before obtaining the chip characteristics of the chip to be removed, the method further includes: Acquire a chip image of the chip to be removed; The chip features of the chip to be removed are determined according to the chip image.

3. The method according to claim 1, characterized in that The method further comprises: When the difference between the chip size of the chip to be removed and the spot size of the laser spot is less than the preset difference threshold, the laser is controlled to emit light and blow air according to the chip position and the second temperature curve to remove the chip to be removed.

4. The method according to claim 1 or 3, characterized in that: The controlling the laser spot to scan and blow air along a preset path also includes: Get pad image; In a case where the pad image includes a pad feature, it is determined that the chip to be removed has been successfully removed.

5. A chip removal device, characterized in that: include: An acquisition module, used to acquire chip features of the chip to be removed and the spot size of the laser spot of the laser; wherein the chip features include the chip position and chip size of the chip to be removed; The processing module controls the laser spot to scan and blow along a preset path according to the chip position, the chip size and the first temperature curve when the chip size is larger than the spot size of the laser spot and the difference between the chip size and the spot size is larger than a preset difference threshold so as to remove the chip to be removed.

6. The device according to claim 5, characterized in that The acquisition module is further used to acquire the chip image of the chip to be removed; The processing module is further used to determine chip features of the chip to be removed according to the chip image.

7. The device according to claim 5, characterized in that The processing module is also used to control the laser to emit light and blow air according to the chip position and the second temperature curve to remove the chip to be removed when the difference between the chip size of the chip to be removed and the spot size of the laser spot is less than the preset difference threshold, so as to remove the chip to be removed.

8. The device according to claim 5 or 7, characterized in that The acquisition module is also used to acquire the pad image; The processing module is further configured to determine that the chip to be removed has been successfully removed when the pad feature is included in the pad image.

9. An electronic device, characterized in that: The electronic device comprises: processor; a memory configured to store instructions executable by the processor; The processor is configured to execute the instructions to implement the chip removal method according to any one of claims 1 to 4.

10. A computer-readable storage medium having instructions stored thereon, characterized in that: When the instructions in the computer-readable storage medium are executed by an electronic device, the electronic device is enabled to execute the chip removal method according to any one of claims 1 to 4.

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