Laser cutting device for semiconductor chip processing

Abstract

The invention discloses a laser cutting device for semiconductor chip processing, which comprises a mounting rack, a feeding device for controlling a chip wafer to move is arranged on the mounting rack, a discharging device is arranged on the feeding device, a tray for supporting the bottom end of the chip wafer is arranged on the discharging device, and a laser cutting device is arranged on the mounting rack. When the feeding device drives the tray to rotate, the discharging device enables the tray to incline, chips which are cut and separated from the chip wafers are discharged, and the feeding device is provided with a clamping device for clamping the side ends of the chip wafers. Batch discharging is achieved through the discharging device, workers can detect the cut chips in time when each row of chips are cut and discharged, once problems are found, follow-up cutting work can be stopped rapidly, adjustment and correction are carried out, the problems are prevented from being found until the whole wafer is cut, and the working efficiency is improved. Therefore, the situation that the whole chip wafer is scrapped due to the cutting quality problem is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting equipment, in particular to a laser cutting device for semiconductor chip processing. Background Art

[0002] Chip wafers are key materials in the semiconductor manufacturing industry. They are usually made of highly pure single-crystal silicon in the form of round thin sheets. They are the basis for the production of various types of semiconductor chips. Semiconductor chips are integrated circuits containing microelectronic components. They are widely used in modern electronic devices such as computers, mobile phones, home appliances, automobiles and medical equipment, playing a core role. In the semiconductor manufacturing process, wafer cutting is the process of separating individual chips from a complete wafer. This step is usually completed using a laser cutting machine to ensure that the chip is accurately cut from the wafer and ready for packaging to form the final semiconductor device.

[0003] A Chinese patent with publication number CN218426272U discloses a laser cutting device for light-emitting diode chips, the structure of which includes a fixed box, an opening is provided at the upper end of the fixed box and a placement plate is rotatably connected to the opening through a rotating shaft, one end of the fixed box is fixedly connected to a fixed plate, the upper surface of the fixed plate is fixedly connected to a hydraulic gas rod, the lower surface of the placement plate is fixedly connected to a trapezoidal block, the output end of the hydraulic rod is fixedly connected to an extrusion block, and the extrusion block is abutted against the trapezoidal block. The patent has the following beneficial effects: the light-emitting diode chip is cut by a laser cutting machine, the hydraulic cylinder is started to drive the extrusion block to retract, the counterweight block drives the placement plate and the carrier plate to rotate downward, the chip slides down from the carrier plate and falls on the conveyor belt, the drive motor is started to drive the conveyor belt to rotate, and the chip is conveyed to the storage box, there is no need for personnel to place the chip, the chip is automatically unloaded, and the work efficiency is improved.

[0004] However, the above-mentioned prior art has the following shortcomings: during the cutting process, it is usually necessary to completely cut an entire chip wafer before collecting the semiconductor chips, resulting in that if size deviation or insufficient cutting accuracy occurs during the cutting process, it cannot be detected and corrected in time, resulting in the waste of the entire chip wafer. This waste will not only significantly increase production costs, but also affect production efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a laser cutting device for semiconductor chip processing to solve the problem that during the cutting process, a whole chip wafer usually needs to be completely cut before the semiconductor chips can be collected. If size deviation or insufficient cutting accuracy occurs during the cutting process, it cannot be detected and corrected in time, resulting in waste of the whole chip wafer. Such waste will not only significantly increase production costs but also affect production efficiency.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A laser cutting device for semiconductor chip processing, comprising: a mounting frame, a feeding device for controlling the movement of chip wafers is arranged on the mounting frame, a discharge device is arranged on the feeding device, a tray for supporting the bottom end of the chip wafer is arranged on the discharge device, when the feeding device drives the tray to rotate, the discharge device causes the tray to tilt, and discharges the chips separated from the chip wafer after cutting, and a clamping device for clamping the side end of the chip wafer is arranged on the feeding device; The discharging device comprises a support rod rotatably connected to the feeding device, a support tube is fixedly connected to the support rod, a spring 1 is fixedly connected inside the support tube, and one end of the spring 1 is fixedly connected to the bottom end of the tray, a discharging groove is provided at the side end of the tray, a lifting guide bar is fixedly connected to the side end of the tray, a limiting block 1 is fixedly connected to the clamping device, the lifting guide bar is slidably plugged with the limiting block 1, a lowering guide bar is fixedly connected to the side end of the tray, and a limiting block 2 is fixedly connected to the clamping device, and the lowering guide bar is slidably plugged with the limiting block 2; Among them, after a row of chips in the chip wafer are cut and separated, the feeding device drives the tray to rotate. During the rotation, the lifting guide bar passes through the limiting block one, and the lowering guide bar passes through the limiting block two, so that the tray is tilted under the restriction of the lifting guide bar and the lowering guide bar, and the spring one is compressed, causing the discharge chute to be at the lowest point. At this time, since the chip wafer is clamped by the clamping device, its position will not change, causing the cut chips of the chip wafer to detach from the chip wafer and be discharged from the discharge chute.

[0007] As a further solution of the present invention: the feeding device includes a sliding rod fixedly connected to the mounting frame, a sliding block is slidably connected to the sliding rod, the top of the sliding block is fixedly connected to the chassis, the bottom end of the mounting frame is fixedly connected to a motor 1, the output end of the motor 1 is fixedly connected to a winding column, and the top of the winding column passes through the chassis.

[0008] As a further solution of the present invention: a fixing plate is fixedly connected to the bottom end of the chassis, and the fixing plate is arranged on one side of the winding column, a through groove is opened on the fixing plate, a pull rope is fixedly connected to the winding column, one end of the pull rope passes through the through groove and is fixedly connected to the mounting frame, a spring 2 is fixedly connected to one side of the fixing plate, and one end of the spring 2 is fixedly connected to the mounting frame.

[0009] As a further solution of the present invention: a rotating groove is opened at the side end of the chassis, the support rod is slidably inserted into the rotating groove, the support rod is fixedly connected to the winding column, a ball is embedded in the bottom end of the support tube, and the ball is rotatably connected to the support tube, and one end of the ball abuts against the top of the chassis.

[0010] As a further solution of the present invention: the clamping device includes a connecting rod fixedly connected to the side end of the chassis, one end of the connecting rod is fixedly connected to telescopic rod 1, a spring 3 is arranged inside the telescopic rod 1, the two ends of the spring 3 are respectively fixedly connected to the two ends inside the telescopic rod 1, one end of the telescopic rod 1 is fixedly connected to a clamping block, and the side end of the clamping block is fixedly connected to telescopic rod 2.

[0011] As a further solution of the present invention: a lifting device is arranged on the mounting frame, a moving device is arranged on the lifting device, and a cutting head is fixedly connected to a movable end of the moving device.

[0012] As a further solution of the present invention: the lifting device includes a second motor fixedly connected to the mounting frame, the output end of the second motor is fixedly connected to a threaded rod, one end of the threaded rod is rotatably connected to the mounting frame, the mounting frame is fixedly connected to a guide column, and one end of the guide column is fixedly connected to the mounting frame.

[0013] As a further solution of the present invention: the moving device includes a fixed frame threadedly connected to the threaded rod, and the fixed frame is slidably connected to the guide column, one side of the fixed frame is rotatably connected to a transmission wheel, the outer side of the transmission wheel is meshingly connected to a transmission belt, the other side of the fixed frame is fixedly connected to motor three, the output end of motor three passes through the fixed frame and is fixedly connected to the transmission wheel, a cutting head is slidably connected to the fixed frame, and the cutting head is fixedly connected to the transmission belt.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the winding column is driven to rotate by the motor 1 in the feeding device, and the pull rope is evenly rolled up by the spiral groove on the winding column, so that the chassis can slide smoothly on the sliding rod, and the next row of chips to be cut of the chip wafer is accurately sent to the cutting area of ​​the cutting head, ensuring the accuracy of the cutting position. The cooperation between the sliding block and the sliding rod and the support of the chassis to the entire device ensure the stability of the chip wafer during the feeding process, reduce shaking and deviation, and are conducive to improving the cutting quality. The setting of the second spring can also buffer the possible impact force to a certain extent, further enhancing the stability; 2. In the present invention, by setting the telescopic rod 2 in the clamping device, when one group of clamping blocks is pushed, other clamping blocks can be driven to move synchronously, and the clamping spacing can be adjusted conveniently and quickly to adapt to chip wafers of different diameters, thereby improving the versatility of the device. The spring 3 in the telescopic rod 1 opens the telescopic rod 1 in the initial state, so that the clamping block can stably abut the side end of the chip wafer. During the cutting and discharge process, the chip wafer is effectively fixed to prevent it from moving or shaking, thereby ensuring the cutting accuracy and discharge accuracy. Multiple groups of evenly distributed connecting rods and clamping blocks can make the chip wafer in the center position on the tray, which is conducive to the cutting head to accurately cut the chip and avoid cutting errors caused by position offset. 3. In the present invention, by lifting the guide bar and pressing down the guide bar in the discharge device and slidingly plugging in the limiting block 1 and the limiting block 2, and the expansion and contraction of the spring 1, the tray is automatically tilted, and the discharge groove is at the lowest point, so that the chips separated from the chip wafer after cutting can be smoothly discharged, thereby realizing automatic discharge and improving processing efficiency. The discharge device is used to realize batch discharge, so that the staff can timely detect the cut chips in each row of chips when they are cut and discharged. Once a problem is found, the subsequent cutting work can be stopped quickly, and adjustments and corrections can be made to avoid the problem from accumulating and being discovered only after the entire wafer is cut, thereby reducing the situation where the entire chip wafer is scrapped due to cutting quality problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of a laser cutting device for semiconductor chip processing according to the present invention; Figure 2 It is a schematic structural diagram of a moving device in a laser cutting device for semiconductor chip processing according to the present invention; Figure 3 It is a structural schematic diagram of a sliding rod in a laser cutting device for semiconductor chip processing according to the present invention; Figure 4 It is a schematic structural diagram of a winding column in a laser cutting device for semiconductor chip processing according to the present invention; Figure 5 The invention relates to a laser cutting device for semiconductor chip processing. Figure 4 A schematic diagram of the structure at A; Figure 6 It is a schematic structural diagram of a clamping device in a laser cutting device for semiconductor chip processing according to the present invention; Figure 7 The invention relates to a laser cutting device for semiconductor chip processing. Figure 6 Schematic diagram of the structure at B; Figure 8 It is a structural schematic diagram of a chassis in a laser cutting device for semiconductor chip processing according to the present invention; Fig. 9 The invention relates to a laser cutting device for semiconductor chip processing. Figure 8 Schematic diagram of the structure at C; Fig.10 It is a schematic structural diagram of a limiting block 1 in a laser cutting device for semiconductor chip processing according to the present invention; Fig.11 The present invention is a laser cutting device for semiconductor chip processing Fig.10 Schematic diagram of the structure at D in the figure.

[0016] In the figure: 1. mounting frame; 2. feeding device; 21. sliding rod; 22. sliding block; 23. chassis; 24. motor 1; 25. winding column; 26. fixing plate; 27. through slot; 28. pull rope; 29. ​​spring 2; 3. clamping device; 31. connecting rod; 32. telescopic rod 1; 33. spring 3; 34. clamping block; 35. telescopic rod 2; 4. discharging device; 41. rotating slot; 42. supporting rod; 43. ball bearing; 44. supporting cylinder; 45. spring 1; 46. discharging slot; 47. raising guide bar; 48. limiting block 1; 49. lowering guide bar; 410. limiting block 2; 5. tray; 6. lifting device; 61. motor 2; 62. threaded rod; 63. guide column; 7. moving device; 71. fixing frame; 72. transmission wheel; 73. transmission belt; 74. motor 3; 8. cutting head. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0019] Reference Figures 1 to 11In an embodiment of the present invention, a laser cutting device for semiconductor chip processing includes: a mounting frame 1, on which a feeding device 2 for controlling the movement of chip wafers is provided, so that after a row is cut, the chips in the next row can be moved to the cutting range of the laser cutting machine. The feeding device 2 is provided with a discharge device 4, and the discharge device 4 is provided with a tray 5 for supporting the bottom end of the chip wafer. When the feeding device 2 drives the tray 5 to rotate, the discharge device 4 causes the tray 5 to tilt, and discharges the chips separated from the chip wafer after cutting. The feeding device 2 is provided with a clamping device 3 for clamping the side end of the chip wafer, so that the chip wafer does not contact the cut chip in the discharge state; The discharge device 4 includes a support rod 42 rotatably connected to the feeding device 2, the support rod 42 is J-shaped, and five groups of support rods 42 are arranged, which are evenly distributed on the feeding device 2, and each group of support rods 42 is fixedly connected to a group of support cylinders 44, and each group of support cylinders 44 is fixedly connected to a group of springs 45, and one end of the spring 45 is fixedly connected to the bottom end of the tray 5, and a discharge groove 46 is opened at the side end of the tray 5, and a lifting guide bar 47 is fixedly connected to the side end of the tray 5, and a limiting block 48 is fixedly connected to the clamping device 3. The guide bar 47 is slidably connected with the limiting block 1 48, the side end of the tray 5 is fixedly connected with a lowering guide bar 49, and the clamping device 3 is fixedly connected with a limiting block 2 410, and the lowering guide bar 49 is slidably connected with the limiting block 2 410, the raising guide bar 47 and the lowering guide bar 49 are both spiral, and the raising guide bar 47 and the lowering guide bar 49 are distributed in an eight-shaped shape, and the cross-sections of the raising guide bar 47 and the lowering guide bar 49 are both triangular, and the lowering guide bar 49 is arranged above the discharge groove 46, and the length of the lowering guide bar 49 is greater than the length of the raising guide bar 47; Among them, after a row of chips in the chip wafer are cut and separated, the feeding device 2 drives the tray 5 to rotate. During the rotation, the lifting guide bar 47 passes through the limiting block 48, and the lowering guide bar 49 passes through the limiting block 410. Through the limitation of the limiting block and the guide bar, the lifting guide bar 47 side of the tray 5 is lifted, and the lowering guide bar 49 side of the tray 5 is lowered, and the spring 45 on the lowering guide bar 49 side is compressed, and the spring 45 on the lifting guide bar 47 side is stretched, finally causing the tray 5 to tilt and the discharge slot 46 to be at the lowest point. At this time, since the chip wafer is clamped by the clamping device 3, its position will not change, resulting in the cut chip being separated from the chip wafer and not in contact with the chip wafer. At this time, due to the inertia of the rotation of the tray 5 and the gravity of the chip, the cut chip is discharged from the discharge slot 46.

[0020] Reference Figures 3 to 5The feeding device 2 includes a sliding rod 21 fixedly connected to the mounting frame 1. The sliding rod 21 is arranged in two groups and symmetrically distributed at the bottom end of the mounting frame 1. Two groups of sliding blocks 22 are slidably connected to each group of sliding rods 21. The top of the sliding block 22 is fixedly connected to a chassis 23. The bottom end of the mounting frame 1 is fixedly connected to a motor 24. The output end of the motor 24 is fixedly connected to a winding column 25. A spiral groove is provided on the surface of the winding column 25. The top of the winding column 25 passes through the chassis 23. The bottom end of the chassis 23 is fixedly connected to a fixing plate 26, and the fixing plate 26 is arranged on one side of the winding column 25. A through groove 27 is provided on the fixing plate 26. A pull rope 28 is fixedly connected to the winding column 25. One end of the pull rope 28 passes through the through groove 27 and is fixedly connected to the mounting frame 1. The pull rope 28 can be wound up by the spiral groove on the winding column 25. With each rotation of the winding column 25, the length of the wound pull rope 28 is consistent. A spring 29 is fixedly connected to one side of the fixed plate 26, and one end of the spring 29 is fixedly connected to the mounting frame 1. There are six groups of springs 29, which are symmetrically distributed on both sides of the through groove 27. When the motor 24 in the feeding device 2 is started, its output end drives the winding column 25 to rotate. A spiral groove is provided on the surface of the winding column 25, which can orderly wind up the pull rope 28. One end of the pull rope 28 penetrates the through groove 27 on the fixed plate 26 and is fixedly connected to the mounting frame 1. Under the action of the pull rope 28, the fixed plate 26 at the bottom of the chassis 23 keeps the length of the wound pull rope 28 consistent with each rotation of the winding column 25, so that the chassis 23 slides on the sliding rod 21, moves the chip wafer placed on the tray 5, and sends the next row of chips to be cut to the cutting area of ​​the cutting head 8.

[0021] The above scheme is adopted: the pull rope 28 is wound up by the spiral groove on the winding column 25, so that the length of the wound pull rope 28 is consistent every time the winding column 25 rotates one circle, so that the chassis 23 drives the chip wafer to move accurately, ensuring that the next row of chips to be cut are accurately delivered to the cutting area of ​​the cutting head 8, thereby improving the accuracy and efficiency of cutting. The cooperation between the sliding rod 21 and the sliding block 22 provides stable support and guidance for the movement of the chassis 23, ensuring the smooth movement of the chassis 23, and ensuring the stability and reliability of the entire feeding and discharging process.

[0022] Reference Figures 8 to 9A rotating groove 41 is provided at the side end of the chassis 23, and the support rod 42 is slidably plugged into the rotating groove 41. The intersection center point of the five groups of support rods 42 is fixedly connected to the winding column 25. A ball 43 is embedded at the bottom end of the support cylinder 44, and the ball 43 is rotatably connected to the support cylinder 44. One end of the ball 43 abuts against the top of the chassis 23. When a row of chips in the chip wafer is cut and separated, the feeding device 2 drives the tray 5 to rotate, and the support rod 42 of the discharge device 4 is rotatably connected to the feeding device 2, and will rotate synchronously with the tray 5. During the process, the lifting guide bar 47 and the lowering guide bar 49 at the side end of the tray 5 interact with the limiting block 1 48 and the limiting block 2 410 on the clamping device 3 respectively. Since the lowering guide bar 49 is longer than the lifting guide bar 47, the lowering guide bar 49 will be inserted into the limiting block 2 410 first, pressing down the tray 5 as a whole, so that the spring 1 45 at the bottom of the tray 5 is compressed. At the same time, the chip wafer is clamped by the clamping device 3 and the position remains unchanged. The chip that has been cut off from the wafer and falls on the tray 5 will move down with the tray 5 and contact with the wafer. The circle is further separated, and then the lifting guide bar 47 is inserted into the limiting block 1 48 to lift one side of the tray 5, so that the tray 5 is tilted, and the discharge slot 46 is at the lowest point. The motor 1 24 stops running to keep the tray 5 tilted. Due to the inertia of the rotation of the tray 5 and the gravity of the chip, the cut chip is discharged from the discharge slot 46. When the cut chip is completely discharged, the motor 1 24 continues to drive the tray 5 to rotate, and the lifting guide bar 47 and the lowering guide bar 49 are respectively removed from the limiting block 1 48 and the limiting block 2 410 Disengagement, under the action of spring 1 45, tray 5 quickly resets, during the reset process, the top of the interior of tray 5 abuts against the bottom of clamping block 34, so that tray 5 quickly recovers stability, when tray 5 rotates one circle, the lifting guide bar 47 and the lowering guide bar 49 are reset, during the reset process, the lowering guide bar 49 will abut against the bottom of limiting block 48, under the action of spring 1 45, tray 5 tilts again to allow lowering guide bar 49 to pass, and under the abutment between the top of the interior of tray 5 and the bottom of clamping block 34, it quickly recovers stability.

[0023] The above scheme is adopted: the tray 5 is driven to rotate by the feeding device 2, and the automatic tilting and resetting of the tray 5 are realized by utilizing the cooperation of the lifting guide bar 47, the lowering guide bar 49 and the limiting block as well as the elastic effect of the spring 45, so that the cut chips can be quickly discharged from the discharge slot 46, thereby improving the discharge efficiency and reducing manual operation.

[0024] Reference Figure 6 to Figure 7The clamping device 3 includes a connecting rod 31 fixedly connected to the side end of the chassis 23, the connecting rod 31 is L-shaped, and five groups of connecting rods 31 are evenly distributed on the side end of the chassis 23. One end of the connecting rod 31 is fixedly connected to a telescopic rod 1 32, and a spring 33 is arranged in the telescopic rod 1 32. The two ends of the spring 33 are respectively fixedly connected to the two ends inside the telescopic rod 1 32. Three groups of springs 33 are evenly distributed in the telescopic rod 1 32, so that in the initial state, the spring 33 stretches the telescopic rod 1 32 to keep the telescopic rod 1 32 in an extended state. One end of each group of telescopic rods 1 32 is fixedly connected to a clamping block 34, and the side end of the clamping block 34 is fixedly connected to a telescopic rod 2 35. The telescopic rod 2 35 is C-shaped, and each end of the clamping block 34 is respectively provided with a group of telescopic rods 2 35. Through the five groups of telescopic rods 2 35, the five groups The clamping blocks 34 move synchronously. When one group of clamping blocks 34 is pushed, the other clamping blocks 34 are driven to move synchronously through the telescopic rod 2 35. As the spacing between the clamping blocks 34 continues to increase, the telescopic rod 2 35 is stretched. At the same time, the clamping blocks 34 push the telescopic rod 1 32 to contract and squeeze the spring 33 in the telescopic rod 1 32, so that the spring 33 contracts synchronously until the spacing between the clamping blocks 34 is greater than the diameter of the wafer. Then, the wafer is placed between the clamping blocks 34, and the external force is slowly withdrawn. As the external force is withdrawn, the spring 33 in the telescopic rod 1 32 returns to its original length and expands the compressed telescopic rod 1 32, so that the telescopic rod 1 32 pushes the clamping block 34 to move inward until the clamping block 34 abuts against the side end of the wafer. Under the synchronous action of multiple groups of clamping blocks 34, the wafer is placed in the center position of the tray 5.

[0025] The above scheme is adopted: through the synchronous action of multiple groups of clamping blocks 34, the wafer can be accurately placed at the center position of the tray 5, ensuring the accuracy and stability of cutting, which is beneficial to improving the cutting quality and avoiding cutting deviation caused by wafer position offset. During the resetting process of the tray 5, the top of the inside of the tray 5 will abut against the bottom of the clamping block 34, so that the tray 5 can quickly restore stability, avoiding collision or damage to the wafer that may be caused during the resetting process of the tray 5, and playing a role in protecting the wafer. During discharge, due to the effective clamping of the wafer by the clamping device 3, the position of the wafer is fixed during the tilting discharge process of the tray 5, ensuring that the cut chip can be discharged smoothly from the discharge slot 46 without contacting the wafer, realizing the smooth connection between the cutting and discharge processes, and improving the efficiency and automation of the entire processing process.

[0026] Reference Figure 1 to Figure 2A lifting device 6 is provided on the mounting frame 1, and a moving device 7 is provided on the lifting device 6. A cutting head 8 is fixedly connected to the movable end of the moving device 7. The lifting device 6 is provided with two groups, which are symmetrically distributed on both sides of the mounting frame 1. The lifting device 6 includes a second motor 61 fixedly connected to the mounting frame 1, and a threaded rod 62 is fixedly connected to the output end of the second motor 61. One end of the threaded rod 62 is rotatably connected to the mounting frame 1. A guide column 63 is fixedly connected to the mounting frame 1, and one end of the guide column 63 is fixedly connected to the mounting frame 1. The moving device 7 includes a fixed frame 71 threadedly connected to the threaded rod 62, and the fixed frame 71 is slidably connected to the guide column 63. One side of the fixed frame 71 is rotatably connected to a transmission wheel 72. The transmission wheel 72 is provided with two groups, which are symmetrically distributed on one side of the fixed frame 71. The outer sides of the two groups of transmission wheels 72 are meshed and connected with a transmission belt 73. The other side of the fixed frame 71 is fixedly connected to the motor Three 74, the output end of the motor three 74 passes through the fixed frame 71 and is fixedly connected to the transmission wheel 72. The fixed frame 71 is slidably connected with a cutting head 8, and the cutting head 8 is fixedly connected to the transmission belt 73. When the motor two 61 is started, its output end drives the threaded rod 62 to rotate. The fixed frame 71, which is threadedly connected to the threaded rod 62, can only move up and down along the guide column 63 under the guidance of the guide column 63, so that the cutting head 8 connected to the movable end of the fixed frame 71 is adjusted to a suitable cutting height to adapt to chip wafers of different thicknesses or different processing requirements. When the motor three 74 is started, the output end of the motor three 74 passes through the fixed frame 71 and drives a group of transmission wheels 72 connected thereto to rotate. This transmission wheel 72 drives the transmission belt 73 meshed on the outside to move, and then drives another group of transmission wheels 72 to rotate synchronously, so that the transmission belt 73 circulates on the two groups of transmission wheels 72. Since the cutting head 8 is fixedly connected to the transmission belt 73, the movement of the transmission belt 73 will drive the cutting head 8 to move horizontally on the fixed frame 71, so as to cut the chips on the same row.

[0027] By adopting the above scheme: through the cooperation between the threaded rod 62 and the guide column 63 in the lifting device 6, and the meshing transmission between the transmission wheel 72 and the transmission belt 73 in the moving device 7, the cutting head 8 can be accurately moved and positioned in the height and horizontal directions, the accuracy of the cutting position is ensured, and the accuracy and quality of chip cutting are improved. The operation of the lifting device 6 and the moving device 7 are respectively controlled by the motor 2 61 and the motor 3 74. The operation is relatively simple and convenient, easy for the staff to master and control, which can improve the work efficiency of chip cutting and reduce the labor intensity of the operator.

[0028] The working principle of the present invention is as follows: when in use, a group of clamping blocks 34 are pushed first, and when the clamping blocks 34 are pushed, the other clamping blocks 34 are driven to move synchronously through the telescopic rod 2 35. During the movement, since the spacing between the clamping blocks 34 continues to increase, the telescopic rod 2 35 is stretched. While the clamping blocks 34 are pushed, the clamping blocks 34 push the telescopic rod 1 32 to contract, and squeeze the spring 33 in the telescopic rod 1 32, so that the spring 33 contracts synchronously until the spacing between the clamping blocks 34 is greater than the diameter of the wafer, and then the wafer is placed between the clamping blocks 34, and the external force is slowly withdrawn. As the external force is withdrawn, the spring 33 in the telescopic rod 1 32 returns to its original length, and the compressed telescopic rod 1 32 is stretched open, so that the telescopic rod 1 32 pushes the clamping blocks 34 to move inward. The wafer is moved until the clamping block 34 abuts against the side end of the wafer. Under the synchronous action of the multiple groups of clamping blocks 34, the wafer is placed in the center position of the tray 5. After that, the motor 2 61 is started to rotate the threaded rod 62, so that the fixed frame 71 moves up and down on the guide column 63, and the cutting head 8 is adjusted to a suitable height. Then, the cutting head 8 is started to cut the wafer. During the cutting process, the motor 3 74 is started to drive the motor 3 74 to drive a group of transmission wheels 72 connected thereto to rotate. When this group of transmission wheels 72 rotates, the transmission belt 73 thereon is driven to move, so that the other group of transmission wheels 72 rotates synchronously, and the transmission belt 73 rotates on the two groups of transmission wheels 72. When the transmission belt 73 moves, it drives the cutting head 8 to move on the fixed frame 71, and the core on this row is The chips in the next row are cut. After all the chips in this row are cut, the motor 24 is started to drive the winding column 25 to rotate, and the pull rope 28 is rolled up into the groove on the winding column 25, so that the chassis 23 slides on the sliding rod 21, and the chips to be cut in the next row are sent to the cutting area of ​​the cutting head 8. When the winding column 25 rotates, the support rod 42 is driven to rotate synchronously, so that the tray 5 rotates. During the rotation of the tray 5, the lifting guide bar 47 and the lowering guide bar 49 will be inserted into the limiting block 1 48 and the limiting block 2 410 respectively. Since the length of the lowering guide bar 49 is greater than the length of the lifting guide bar 47, the lowering guide bar 49 will be inserted into the limiting block 2 410 first, thereby pressing down the tray 5 as a whole, so that the spring 1 45 at the bottom of the tray 5 is The force is compressed. Due to the clamping of the wafer by the clamping device 3, the wafer will not move with the tray 5. The chip that is cut and separated from the wafer as a whole and falls on the tray 5 will move downward with the tray 5, thereby separating from the wafer and not contacting the wafer. After that, due to the insertion of the lifting guide bar 47 into the limiting block 1 48, one side of the tray 5 is lifted, causing the tray 5 to tilt and the discharge chute 46 to be at the lowest point. Then the motor 1 24 stops running and maintains this state. Due to the inertia of the rotation of the tray 5 and the gravity of the chip, the cut chip is discharged from the discharge chute 46. When the cut chip is completely discharged, the motor continues to drive the tray 5 to rotate, causing the lifting guide bar 47 and the lowering guide bar 49 to separate from the limiting block 1 48 and the limiting block 2 410 respectively. When the separation is completed,Under the action of spring 145, the tray 5 is quickly reset. During the reset process, the top of the tray 5 will abut against the bottom of the clamping block 34, so that the tray 5 quickly recovers stability. After the tray 5 rotates one circle, the next row of wafers moves to the cutting head 8, and the lifting guide bar 47 and the lowering guide bar 49 are reset. During the reset process of the lifting guide bar 47 and the lowering guide bar 49, the lowering guide bar 49 will abut against the bottom of the limiting block 48. Under the action of spring 145, the tray 5 is tilted, allowing the lowering guide bar 49 to pass through the limiting block 48, and under the abutment between the top of the tray 5 and the bottom of the clamping block 34, the tray 5 quickly recovers stability again; the winding column 25 is driven to rotate by the motor 124 in the feeding device 2, and the spiral groove on the winding column 25 is used. The pull rope 28 is wound evenly, so that the chassis 23 can slide smoothly on the sliding rod 21, and the next row of chips to be cut of the chip wafer can be accurately sent to the cutting area of ​​the cutting head 8, ensuring the accuracy of the cutting position. The cooperation between the sliding block 22 and the sliding rod 21 and the support of the chassis 23 to the entire device ensure the stability of the chip wafer during the feeding process, reduce shaking and deviation, and are conducive to improving the cutting quality. The setting of the spring 29 can also buffer the possible impact force to a certain extent, further enhancing the stability. Through the setting of the telescopic rod 235 in the clamping device 3, when a group of clamping blocks 34 are pushed, other clamping blocks 34 can be driven to move synchronously, so that the clamping spacing can be adjusted conveniently and quickly to adapt to chip wafers of different diameters, thereby improving the versatility of the device. The spring three 33 in the telescopic rod one 32 opens the telescopic rod one 32 in the initial state, so that the clamping block 34 can stably abut the side end of the chip wafer. During the cutting and discharging process, the chip wafer is effectively fixed to prevent it from moving or shaking, ensuring the cutting accuracy and the accuracy of discharging. Multiple groups of evenly distributed connecting rods 31 and clamping blocks 34 can make the chip wafer in the center position on the tray 5, which is conducive to the cutting head 8 to accurately cut the chip and avoid cutting errors caused by position offset. Through the sliding connection between the lifting guide bar 47 and the lowering guide bar 49 in the discharging device 4 and the limiting block one 48 and the limiting block two 410, as well as the telescopic effect of the spring one 45, the tray 5 is automatically tilted, and the discharging groove 46 is at the lowest point, which can smoothly complete the cutting and The chip discharge of the chip wafer separation realizes automatic discharge and improves the processing efficiency. After the lifting guide bar 47 and the pressing guide bar 49 are separated from the limiting block 1 48 and the limiting block 2 410, the tray 5 can be quickly reset under the action of the spring 1 45, and the top of the tray 5 abuts against the bottom of the clamping block 34, so that the tray 5 can quickly restore stability and prepare for the next discharge and cutting, thereby improving the working efficiency and stability of the device. The discharge device 4 realizes batch discharge, so that the staff can timely detect the cut chips in each row of chips when they are cut and discharged. Once a problem is found, the subsequent cutting work can be quickly stopped, and adjustments and corrections can be made to avoid the problem from accumulating until the entire wafer is cut.This reduces the chances of the entire chip wafer being scrapped due to cutting quality issues.

[0029] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A laser cutting device for semiconductor chip processing, comprising: The mounting frame (1) is characterized in that the mounting frame (1) is provided with a feeding device (2) for controlling the movement of chip wafers, the feeding device (2) is provided with a discharging device (4), the discharging device (4) is provided with a tray (5) for supporting the bottom end of the chip wafer, the discharging device (4) causes the tray (5) to tilt when the feeding device (2) drives the tray (5) to rotate, and discharges the chips that have been cut and separated from the chip wafers, and the feeding device (2) is provided with a clamping device (3) for clamping the side end of the chip wafer; The discharging device (4) comprises a support rod (42) rotatably connected to the feeding device (2), a support tube (44) being fixedly connected to the support rod (42), a spring 1 (45) being fixedly connected inside the support tube (44), and one end of the spring 1 (45) being fixedly connected to the bottom end of the tray (5), a discharging groove (46) being provided at the side end of the tray (5), a lifting guide bar (47) being fixedly connected to the side end of the tray (5), a limiting block 1 (48) being fixedly connected to the clamping device (3), the lifting guide bar (47) being slidably plugged with the limiting block 1 (48), a lowering guide bar (49) being fixedly connected to the side end of the tray (5), a limiting block 2 (410) being fixedly connected to the clamping device (3), the lowering guide bar (49) being slidably plugged with the limiting block 2 (410); When a row of chips in the chip wafer is cut and separated, the feeding device (2) drives the tray (5) to rotate. During the rotation, the lifting guide bar (47) passes through the limiting block 1 (48), and the lowering guide bar (49) passes through the limiting block 2 (410), so that the tray (5) is tilted under the restriction of the lifting guide bar (47) and the lowering guide bar (49), and the spring 1 (45) is compressed, so that the discharge groove (46) is at the lowest point. At this time, since the chip wafer is clamped by the clamping device (3), its position will not change, so that the cut chips of the chip wafer are separated from the chip wafer and discharged from the discharge groove (46).

2. A laser cutting device for semiconductor chip processing according to claim 1, characterized in that: The feeding device (2) comprises a sliding rod (21) fixedly connected to the mounting frame (1), a sliding block (22) being slidably connected to the sliding rod (21), a bottom end of the sliding block (22) being fixedly connected to a chassis (23), a motor 1 (24) being fixedly connected to the bottom end of the mounting frame (1), a winding column (25) being fixedly connected to the output end of the motor 1 (24), and a top end of the winding column (25) passing through the chassis (23).

3. A laser cutting device for semiconductor chip processing according to claim 2, characterized in that: A fixing plate (26) is fixedly connected to the bottom end of the chassis (23), and the fixing plate (26) is arranged on one side of the winding column (25). A through slot (27) is formed through the fixing plate (26). A pull rope (28) is fixedly connected to the winding column (25), and one end of the pull rope (28) passes through the through slot (27) and is fixedly connected to the mounting frame (1). A second spring (29) is fixedly connected to one side of the fixing plate (26), and one end of the second spring (29) is fixedly connected to the mounting frame (1).

4. A laser cutting device for semiconductor chip processing according to claim 3, characterized in that: A rotation groove (41) is provided at a side end of the chassis (23), the support rod (42) is slidably plugged into the rotation groove (41), the support rod (42) is fixedly connected to the winding column (25), a ball (43) is embedded at the bottom end of the support tube (44), and the ball (43) is rotationally connected to the support tube (44), and one end of the ball (43) is in contact with the top end of the chassis (23).

5. A laser cutting device for semiconductor chip processing according to claim 4, characterized in that: The clamping device (3) comprises a connecting rod (31) fixedly connected to a side end of the chassis (23); one end of the connecting rod (31) is fixedly connected to a telescopic rod (32); a spring (33) is arranged inside the telescopic rod (32); two ends of the spring (33) are respectively fixedly connected to two ends inside the telescopic rod (32); one end of the telescopic rod (32) is fixedly connected to a clamping block (34); and a side end of the clamping block (34) is fixedly connected to a telescopic rod (35).

6. A laser cutting device for semiconductor chip processing according to claim 5, characterized in that: A lifting device (6) is provided on the mounting frame (1), a moving device (7) is provided on the lifting device (6), and a cutting head (8) is fixedly connected to a movable end of the moving device (7).

7. A laser cutting device for semiconductor chip processing according to claim 6, characterized in that: The lifting device (6) comprises a second motor (61) fixedly connected to the mounting frame (1); a threaded rod (62) is fixedly connected to the output end of the second motor (61); one end of the threaded rod (62) is rotatably connected to the mounting frame (1); a guide column (63) is fixedly connected to the mounting frame (1); one end of the guide column (63) is fixedly connected to the mounting frame (1).

8. The laser cutting device for semiconductor chip processing according to claim 7, characterized in that: The moving device (7) comprises a fixing frame (71) threadedly connected to the threaded rod (62), and the fixing frame (71) is slidably connected to the guide column (63); one side of the fixing frame (71) is rotatably connected to a transmission wheel (72), the outer side of the transmission wheel (72) is meshingly connected to a transmission belt (73); the other side of the fixing frame (71) is fixedly connected to a motor three (74); the output end of the motor three (74) passes through the fixing frame (71) and is fixedly connected to the transmission wheel (72); a cutting head (8) is slidably connected to the fixing frame (71), and the cutting head (8) is fixedly connected to the transmission belt (73).

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