Processing device and processing method for edge contour of wafer

Abstract

The invention discloses a wafer edge contour processing device and method, and the device comprises a rack and a lifting frame which is slidably disposed on the rack. A lifting driving module is further arranged on the rack; an adjusting frame is further arranged on the lifting frame in a sliding mode. A radial driving module is further arranged on the rack, and the radial driving module is in power connection with the adjusting frame; a grinding motor and a grinding disc which are in power connection are further arranged on the adjusting frame, and a grinding cutting edge of an arc-shaped structure is arranged on the peripheral face of the grinding disc. A vacuum disc is further arranged on the machine frame, a workbench is arranged on the top face of the vacuum disc, and a plurality of vacuum pipes communicated with the vacuum disc are arranged on the workbench. A vacuum generation module is arranged on the rack, and a rotary driving module is further arranged on the rack; the grinding cutting edge is arc-shaped, so that the notch is also of an arc-shaped structure, and a step-shaped notch in the prior art is transformed into the arc-shaped structure, so that a profit concentration area is prevented from appearing at the edge of the wafer, and the uniformity of stress distribution at the notch is adjusted.

Description

Technical Field

[0001] The present application relates to the technical field of elevator equipment, and in particular to a processing device and method for wafer edge contour. Background Art

[0002] Taiko ring is a ring structure formed during the wafer manufacturing process. In the TAIKO process, a ring of about 3mm is retained on the edge of the wafer during the grinding process. This ring is called Taiko ring. Its main function is to protect the edge of the wafer from further processing, while reducing the warping of the wafer and improving the mechanical strength of the wafer, so that ultra-thin wafers with a thickness of less than 100um can be smoothly processed in the subsequent process;

[0003] However, in the prior art, the stress at the intersection of the outer ring of the wafer and the grinding area at the edge of the Taiko ring is relatively concentrated, which causes the edge area of ​​the wafer to be more brittle and the yield of wafer processing to be low. Summary of the invention

[0004] The main purpose of the present application is to provide a processing device and a processing method for wafer edge profile, aiming to solve the defect of low wafer yield in the prior art.

[0005] This application achieves the above objectives through the following technical solutions:

[0006] A processing device for wafer edge profile includes a frame;

[0007] A lifting frame, the lifting frame is slidably arranged on the frame; the frame is also provided with a lifting drive module connected to the lifting frame power; the lifting frame is also slidably arranged with an adjustment frame;

[0008] A radial drive module, the radial drive module is arranged on the lifting frame, and the radial drive module is connected to the adjusting frame by power; the adjusting frame is also provided with a grinding motor and a grinding disc connected by power, and the outer peripheral surface of the grinding disc is provided with a grinding edge with an arc-shaped structure;

[0009] A vacuum plate, the vacuum plate is rotatably arranged on the frame, a workbench for placing wafers to be processed is arranged on the top surface of the vacuum plate, and a plurality of vacuum tubes connected to the vacuum plate are arranged on the workbench; a vacuum generating module connected to the vacuum plate is also arranged on the frame;

[0010] A rotation driving module is arranged on the frame, and the vacuum plate is connected to the rotation driving module by power.

[0011] Optionally, a sliding rod is provided on the frame, and the lifting frame is slidably connected to the sliding rod through a linear motion bearing; the lifting drive module includes a lifting motor and a driving screw connected in power, the driving screw is arranged parallel to the sliding rod, and the lifting frame is threadedly connected to the driving screw.

[0012] Optionally, an adjustment groove is provided on the lifting frame, and slide rails are provided on both sides of the adjustment groove along the sliding direction of the adjustment frame, and the adjustment frame is provided with a plurality of sliders respectively adapted to the two slide rails; the radial drive module includes a driving motor and an adjustment screw connected in power, and the adjustment screw is threadedly connected to the adjustment frame.

[0013] Optionally, the vacuum plate includes an upper plate body and a lower plate body which are hermetically connected to each other, the frame is provided with an annular slide rail coaxial with the vacuum plate, and the lower plate body is provided with a plurality of rotating sliders adapted to the annular slide rail; the rotation drive module includes a rotating motor, the lower plate body is provided with a rotating shaft with a hollow structure, and the rotating motor is dynamically connected to the rotating shaft.

[0014] Optionally, the vacuum generating module includes a vacuum pump and a rotary joint, and the vacuum pump is connected to the rotating shaft via the rotary joint.

[0015] Optionally, a plurality of plug holes are provided on the upper disk body, and each of the vacuum tubes passes through each of the plug holes to communicate with the vacuum disk.

[0016] Optionally, a filling ring is further provided on the top surface of the workbench, and a friction plate made of silicone is provided in each of the filling rings, and the top surface of the friction plate is tightly fitted with the bottom surface of the wafer to be processed.

[0017] Optionally, a guide plate is further provided in the upper disk body, and a plurality of guide holes are provided on the guide plate, and the guide holes are radially arranged around the axis of the upper disk body; a guide cover coaxially connected to the rotating shaft is also provided on the lower disk body, and the guide cover is a hemispherical structure, and a plurality of air inlet holes are provided on the guide cover.

[0018] Correspondingly, the present application also discloses a processing method based on the above processing device, comprising the following steps:

[0019] Setting a first processing parameter for a rough grinding process according to a wafer structure setting parameter;

[0020] Generating a rough grinding feed parameter according to the first processing parameter, and performing a rough grinding process on the wafer to be processed according to the rough grinding feed parameter;

[0021] Setting a second processing parameter for the fine grinding process according to the wafer structure setting parameter;

[0022] A fine grinding feed parameter is generated according to the second processing parameter, and a fine grinding process is performed on the wafer to be processed according to the fine grinding feed parameter.

[0023] Optionally, the rough grinding feed parameters include a first radial feed amount and a first cutting depth, and the first radial feed amount and the first cutting depth are both equal to the first processing parameters; the fine grinding feed parameters include a second radial feed amount and a second cutting depth, and the second radial feed amount and the second cutting depth are both equal to the second processing parameters.

[0024] Compared with the prior art, this application has the following beneficial effects:

[0025] The present application includes a frame and a lifting frame, wherein the lifting frame is slidably arranged on the frame; a lifting drive module connected to the power of the lifting frame is also arranged on the frame; an adjusting frame is also slidably arranged on the lifting frame; a radial drive module is also arranged on the frame, and the radial drive module is connected to the power of the adjusting frame; a grinding motor and a grinding disc connected to power are also arranged on the adjusting frame, and a grinding edge with an arc-shaped structure is arranged on the outer peripheral surface of the grinding disc; a vacuum disc is also rotatably arranged on the frame, a workbench for placing wafers to be processed is arranged on the top surface of the vacuum disc, and a plurality of vacuum tubes connected to the vacuum disc are arranged on the workbench; a vacuum generating module connected to the vacuum disc is also arranged on the frame, and a rotating drive module connected to the power of the vacuum disc is also arranged on the frame;

[0026] Correspondingly, the present application also discloses a processing method based on the above-mentioned processing device. First, the first processing parameters and the second processing parameters of the rough grinding processing are set according to the wafer structure setting parameters, and then the rough grinding feed parameters are generated according to the first processing parameters, and the wafer to be processed is rough ground according to the rough grinding feed parameters; finally, the fine grinding feed parameters are generated according to the second processing parameters, and the wafer to be processed is fine ground according to the fine grinding feed parameters.

[0027] In the actual processing process, the lifting frame controls the grinding edge to move toward the processing area, thereby realizing the control of the cutting depth, and then the radial driving module controls the grinding edge to move in the radial direction, thereby realizing the control of the radial cutting depth. Since the grinding edge of the grinding disc is arc-shaped, its incision is also an arc-shaped structure, thereby transforming the step-shaped incision in the prior art into an arc-shaped structure, thereby avoiding the occurrence of a profit concentration area at the edge of the wafer and adjusting the uniformity of the stress distribution at the incision;

[0028] Secondly, since the present application can effectively improve the stress distribution in the edge area of ​​the wafer, it can effectively improve the brittleness of the edge area of ​​the wafer, thereby improving the processing quality and yield rate of the wafer, which is conducive to improving the economic benefits of wafer processing;

[0029] Finally, since the present application can effectively improve the profit distribution in the edge area of ​​the wafer, when processing wafers with smaller thickness, such as wafers with a thickness of less than 100μm, it can effectively improve the processing quality and increase the yield rate, thereby improving the economic benefits of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic structural diagram of a wafer edge profile processing device provided in Embodiment 1 of the present application;

[0031] Figure 2 An exploded view of a processing device for wafer edge profile provided in Embodiment 1 of the present application;

[0032] Figure 3 A cross-sectional view of a wafer edge profile processing device provided in Embodiment 1 of the present application;

[0033] Figure 4 This is an exploded view of the vacuum disk;

[0034] Figure 5 is a cross-sectional view of a vacuum disk;

[0035] Figure 6 This is a flow chart of the processing method disclosed in Embodiment 2 of the present application;

[0036] Figure 7 This is the processing principle diagram;

[0037] Figure markings: 1-frame, 2-lifting frame, 3-adjusting frame, 4-grinding motor, 5-grinding disc, 6-grinding edge, 7-vacuum disc, 8-workbench, 9-vacuum tube, 10-slide rod, 11-linear motion bearing, 12-lifting motor, 13-driving screw, 14-adjusting groove, 15-slide rail, 16-slider, 17-driving motor, 18-adjusting screw, 19-annular slide rail, 20-rotating motor, 21-rotating shaft, 22-vacuum pump, 23-rotating joint, 24-plug hole, 25-filling ring, 26-friction plate, 27-guide plate, 28-guide hole, 29-guide cover, 30-air inlet, 101-wafer to be processed, 701-upper disc, 702-lower disc, 703-rotating slider.

[0038] The purpose, features and advantages of this application will be further described in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0043] Implementation Method 1

[0044] Reference Figures 1 to 5This embodiment is an optional embodiment of the present application, which discloses a processing device for wafer edge profile, including a frame 1 and a lifting frame 2, along the height direction of the frame 1, support columns are arranged on both sides of the frame 1, one of the support columns is rotatably provided with a slide bar 10, and the other support column is provided with a lifting drive module, the lifting drive module includes a lifting motor 12 and a driving screw 13, wherein the lifting motor 12 is arranged at the top of the support column, the inner part of the support column is rotatably provided with a driving screw 13, and the lifting motor 12 and the driving screw 13 are connected to each other by a coupling;

[0045] A lifting frame 2 is also provided between the two support columns. The lifting frame 2 is a beam as a whole. One end of the lifting frame 2 is slidably connected to the slide bar 10 through a linear motion bearing 11, and the other end is threadedly connected to the driving screw 13, so that the lifting frame 2 is controlled to rise or fall through the lifting motor 12;

[0046] Furthermore, a distance sensor is also provided at the top of the support column provided with the slide rod 10, and the distance sensor is used to detect the position of the lifting frame 2, thereby improving the accuracy of the position control of the lifting frame 2;

[0047] Furthermore, an adjustment slot 14 is arranged on the lifting frame 2 along the length direction of the lifting frame 2. The adjustment slot 14 is a rectangular structure as a whole. Slide rails 15 are arranged on both sides of the adjustment slot 14 along the length direction of the adjustment slot 14. The two slide rails 15 are parallel to each other. At least two sliders 16 that slide with the two slide rails 15 are arranged. The lifting frame 2 is also provided with an adjustment frame 3. The adjustment frame 3 is a flat plate with a rectangular structure. The adjustment frame 3 is respectively connected to each slider 16.

[0048] Furthermore, a radial drive module is also provided on the lifting frame 2, and the radial drive module includes a driving motor 17 and an adjusting screw 18 which are connected in power, and the adjusting screw 18 is threadedly connected to the adjusting frame 3;

[0049] The adjusting frame 3 is also provided with a grinding motor 4 and a grinding disc 5 which are connected to each other by power, and the outer peripheral surface of the grinding disc 5 is provided with a grinding edge 6 with an arc structure;

[0050] It should be noted that the grinding disc 5 is located at the bottom of the lifting frame 2, that is, the output shaft of the grinding motor 4 passes through the adjustment slot 14 and is connected to the grinding disc 5;

[0051] The adjusting groove 14 can provide sufficient space for the radial sliding of the adjusting frame 3 , and at the same time the entire radial driving module and the adjusting frame 3 are placed on the top surface of the lifting frame 2 , thereby improving the stability and reliability of the equipment connection.

[0052] Furthermore, a distance sensor is also provided on the adjustment frame 3, and the position of the adjustment frame 3 is detected in real time by the distance sensor to improve the accuracy of radial adjustment;

[0053] Preferably, the lifting motor 12 and the driving motor 17 are servo motors, which can effectively control the number of rotations of the driving screw 13 and the adjusting screw 18, thereby improving the accuracy of position control;

[0054] Furthermore, a vacuum plate 7 and an annular slide rail 19 are also provided on the frame 1, the annular slide rail 19 is coaxially arranged with the vacuum plate 7, a plurality of rotating sliders 703 are slidably arranged on the annular slide rail 19, the vacuum plate 7 comprises an upper plate body 701 and a lower plate body 702, and each of the rotating sliders 703 is connected to the bottom surface of the lower plate body 702 respectively; it should be noted that the vacuum plate 7 is located directly below the lifting frame 2, and the rotating axis 21 of the vacuum plate 7 is coaxially arranged with the grinding plate 5 in the origin state;

[0055] The end faces of the upper plate body 701 and the lower plate body 702 that cooperate with each other are provided with a plurality of sealing rings arranged in a concentric circle structure, and the end faces of the lower plate body 702 and the upper plate body 701 that face each other are provided with a plurality of sealing grooves arranged in a concentric circle structure, and each of the sealing rings is respectively inserted into each of the sealing grooves;

[0056] At the same time, a rubber sealing ring can be embedded in the sealing groove; a plurality of connecting bolts are also provided between the upper plate body 701 and the lower plate body 702;

[0057] The above-mentioned structural arrangement effectively reduces the difficulty of assembling and repairing the vacuum plate 7; at the same time, the sealing rings arranged in multiple concentric rings can also effectively improve the sealing between the upper plate body 701 and the lower plate body 702, thereby avoiding air leakage and ensuring the vacuum degree in the vacuum plate 7;

[0058] A connecting pipe is also provided at the bottom of the lower plate 702, and a rotating shaft 21 is connected to the connecting pipe. The rotating shaft 21 is a hollow pipe.

[0059] A vacuum generating module is also provided on the frame 1, and the vacuum generating module includes a vacuum pump 22 and a rotary joint 23. The vacuum pump 22 is connected to the rotating shaft 21 through the rotary joint 23, so that the vacuum plate 7 is evacuated by the vacuum pump 22.

[0060] The frame 1 is also provided with a rotation drive module, which includes a rotation motor 20. The output shaft of the rotation motor 20 and the rotation shaft 21 are both provided with synchronous wheels, and the two synchronous wheels are connected by a synchronous belt power.

[0061] In actual use, the vacuum plate 7 is controlled to rotate by the rotary motor 20, and the lifting frame 2 is mainly used to carry and drive the grinding plate 5. The above design separates the rotational motion of the grinding plate 5 from the rotational motion of the wafer to be processed, thereby reducing the difficulty of operating the equipment and effectively improving the stability and reliability of the equipment.

[0062] In the above structure, it is also possible to ensure that the vacuum plate 7 can rotate and stably connect with the external vacuum equipment, thereby ensuring that the vacuum degree of the vacuum plate 7 is always in a stable state;

[0063] Further, a plurality of plug holes 24 are provided on the top surface of the upper disk body 701, and each of the plug holes 24 runs through the entire upper disk body 701 along the axial direction of the upper disk body 701. The processing device also includes a workbench 8, and the workbench 8 is a circular ceramic plate. A plurality of vacuum tubes 9 and a plurality of through holes are provided on the workbench 8. Each of the vacuum tubes 9 is coaxial with each of the through holes, and the through holes run through the workbench 8. During installation, each of the vacuum tubes 9 is inserted into each of the plug holes 24, and a sealing ring is further provided between each of the vacuum tubes 9 and each of the plug holes 24.

[0064] At the same time, a plurality of filling rings 25 are arranged on the top surface of the workbench 8, each of which is in a circular ring structure and arranged concentrically; a friction plate 26 made of silicone is arranged in each of the filling rings 25, and the top surface of the friction plate 26 is tightly fitted with the bottom surface of the wafer to be processed;

[0065] When in use, the wafer to be processed is placed on the workbench 8, and the bottom surface of the wafer to be processed is closely attached to each of the friction plates 26, and the vacuum pump 22 is operated to extract the air inside the vacuum plate 7. Since the vacuum tube 9 connects the bottom space of the wafer to be processed with the vacuum plate 7, the external atmosphere squeezes the wafer to be processed and fixes it on the workbench 8; at the same time, the friction plate 26 is squeezed and deformed, which can improve the sealing performance and increase the stability and reliability of the installation of the wafer to be processed.

[0066] The above-mentioned vacuum structure can stably fix the wafer to be processed on the workbench 8 without causing any damage to the wafer, thereby ensuring the processing quality of the wafer;

[0067] Secondly, in the above structure, the workbench 8 and the vacuum plate 7 are in a detachable connection state, which not only makes equipment maintenance more convenient, but also allows the staff to replace different workbenches 8 according to the size of the wafer to meet different processing requirements;

[0068] Furthermore, a guide plate 27 is further provided in the upper disk body 701, and a plurality of guide holes 28 are provided on the guide plate 27. The guide holes 28 are radially arranged around the axis of the guide plate 27, and the aperture of each guide hole 28 gradually increases along the radial direction of the guide plate 27 extending outward.

[0069] At the same time, a flow guide cover 29 is threadedly connected to the inlet end of the connecting pipe. The flow guide cover 29 is coaxial with the rotating shaft 21 and has a hemispherical structure. A plurality of air inlet holes 30 are provided on the flow guide cover 29.

[0070] Since the rotating shaft 21 is coaxial with the vacuum plate 7, it is very easy to cause uneven force on various parts of the workbench 8 during the vacuuming process. The arrangement of the guide plate 27 and the guide cover 29 can effectively balance the airflow velocity in the vacuum plate 7, thereby adjusting the force at different positions of the workbench 8, ensuring the stability of the installation of the wafer to be processed, and avoiding shaking in the initial stage of vacuuming, thereby affecting the processing accuracy;

[0071] Secondly, while ensuring the force balance of the workbench 8, the wafer to be processed can be better fixed, especially the accuracy during the processing, thereby improving the processing quality.

[0072] Implementation Method 2

[0073] This embodiment is another optional embodiment of the present application, which discloses a method for processing a wafer edge profile, comprising the following steps:

[0074] S1, setting a first processing parameter of a rough grinding process according to a wafer structure setting parameter;

[0075] Reference Figure 4 , taking the height between the original height of the wafer and the Z1 step value as the reference radius, and using the reference radius as the first processing parameter;

[0076] S2, generating a rough grinding feed parameter according to the first processing parameter, and performing a rough grinding process on the wafer to be processed according to the rough grinding feed parameter;

[0077] The rough grinding feed parameter includes a first radial feed amount and a first cutting depth, and the first radial feed amount and the first cutting depth are both equal to the first machining parameter; therefore, the first radial feed amount and the first cutting depth in the rough grinding feed parameter are both equal to the first machining parameter;

[0078] It should be pointed out that in the actual operation process, the interval radius profile can also be specified according to the actual situation. As long as the overall arc profile is guaranteed, the step stress can be effectively offset, thereby increasing the strength of the ring, which can greatly reduce the fragmentation rate and avoid risks during transportation and processing.

[0079] S3, setting the second processing parameter of the fine grinding process according to the wafer structure setting parameter;

[0080] The radius of the Z2 arc depends on the actual grinding amount from Z1 to Z2, and the actual grinding amount is used as the second processing parameter;

[0081] S4. Generate a fine grinding feed parameter according to the second processing parameter, and perform fine grinding on the wafer to be processed according to the fine grinding feed parameter.

[0082] The second machining parameters include a second radial feed amount and a second cutting depth, and the second radial feed amount and the second cutting depth are both equal to the second machining parameters

[0083] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A processing device for wafer edge profile, characterized in that: comprising a frame (1); A lifting frame (2), the lifting frame (2) being slidably arranged on the frame (1); the frame (1) is also provided with a lifting drive module which is dynamically connected to the lifting frame (2); the lifting frame (2) is also slidably arranged with an adjustment frame (3); A radial drive module, the radial drive module is arranged on the lifting frame (2), and the radial drive module is dynamically connected to the adjustment frame (3); the adjustment frame (3) is also provided with a dynamically connected grinding motor (4) and a grinding disc (5), and the outer peripheral surface of the grinding disc (5) is provided with a grinding edge (6) in an arc-shaped structure; A vacuum plate (7), the vacuum plate (7) being rotatably arranged on the frame (1), a workbench (8) for placing wafers to be processed being arranged on the top surface of the vacuum plate (7), a plurality of vacuum tubes (9) being arranged on the workbench (8) being connected to the vacuum plate (7); a vacuum generating module being connected to the vacuum plate (7) is also arranged on the frame (1); A rotation driving module is provided on the frame (1), and the vacuum plate (7) is connected to the rotation driving module in a power manner.

2. The device for processing wafer edge profile according to claim 1, characterized in that: The frame (1) is provided with a slide bar (10), and the lifting frame (2) is slidably connected to the slide bar (10) via a linear motion bearing (11); the lifting drive module comprises a lifting motor (12) and a driving screw (13) which are connected in power, the driving screw (13) is arranged in parallel with the slide bar (10), and the lifting frame (2) is threadedly connected to the driving screw (13).

3. The device for processing wafer edge profile according to claim 1, characterized in that: The lifting frame (2) is provided with an adjustment groove (14), and along the sliding direction of the adjustment frame (3), slide rails (15) are provided on both sides of the adjustment groove (14), and the adjustment frame (3) is provided with a plurality of sliders (16) respectively adapted to the two slide rails (15); the radial drive module comprises a driving motor (17) and an adjustment screw (18) which are connected in a power manner, and the adjustment screw (18) is threadedly connected to the adjustment frame (3).

4. The device for processing wafer edge profile according to claim 1, characterized in that: The vacuum plate (7) comprises an upper plate body (701) and a lower plate body (702) which are hermetically connected to each other; the frame (1) is provided with an annular slide rail (19) which is coaxial with the vacuum plate (7); the lower plate body (702) is provided with a plurality of rotating sliders (703) which are adapted to the annular slide rail (19); the rotary drive module comprises a rotary motor (20); the lower plate body (702) is provided with a rotary shaft (21) which is a hollow structure; the rotary motor (20) is dynamically connected to the rotary shaft (21).

5. The device for processing wafer edge profile according to claim 4, characterized in that: The vacuum generating module comprises a vacuum pump (22) and a rotary joint (23), and the vacuum pump (22) is connected to the rotating shaft (21) via the rotary joint (23).

6. The device for processing wafer edge profile according to claim 4, characterized in that: The upper disk body (701) is provided with a plurality of plug holes (24), and each of the vacuum tubes (9) passes through each of the plug holes (24) to communicate with the vacuum disk (7).

7. The device for processing wafer edge profile according to claim 1, characterized in that: The top surface of the workbench (8) is also provided with a filling ring (25), and each of the filling rings (25) is provided with a friction plate (26) made of silicone rubber, and the top surface of the friction plate (26) is tightly fitted with the bottom surface of the wafer to be processed.

8. The device for processing wafer edge profile according to claim 4, characterized in that: A guide plate (27) is also provided in the upper disk body (701), and a plurality of guide holes (28) are provided on the guide plate (27), and the guide holes (28) are arranged radially around the axis of the upper disk body (701); a guide cover (29) coaxially connected to the rotating shaft (21) is also provided on the lower disk body (702), and the guide cover (29) is a hemispherical structure, and a plurality of air inlet holes (30) are provided on the guide cover (29).

9. A processing method based on the processing device according to any one of claims 1 to 8, characterized in that: The following steps are involved: Setting a first processing parameter for a rough grinding process according to a wafer structure setting parameter; Generating a rough grinding feed parameter according to the first processing parameter, and performing a rough grinding process on the wafer to be processed according to the rough grinding feed parameter; Setting a second processing parameter for the fine grinding process according to the wafer structure setting parameter; A fine grinding feed parameter is generated according to the second processing parameter, and a fine grinding process is performed on the wafer to be processed according to the fine grinding feed parameter.

10. The processing method according to claim 9, characterized in that: The first machining parameters include a first radial feed amount and a first cutting depth, and the first radial feed amount and the first cutting depth are both equal to the first machining parameters; the second machining parameters include a second radial feed amount and a second cutting depth, and the second radial feed amount and the second cutting depth are both equal to the second machining parameters.

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