Stripping equipment for crystal ingot processing

Abstract

The stripping equipment for crystal ingot processing comprises a processing table, a lifting seat arranged on the processing table in a lifting mode and a plurality of bonding blocks arranged in the circumferential direction of the lifting seat at intervals, the bonding blocks are used for bonding the to-be-stripped position of a crystal ingot, a push-type broach is arranged on the side, located on the crystal ingot, of the processing table, and the push-type broach can move in the radial direction of the crystal ingot. When the bonding block pulls the to-be-stripped part, the push broach is positioned between the to-be-stripped part and the crystal ingot; according to the invention, the convenience in the stripping process of crystal ingot processing is improved, the integrity in the stripping process is improved, and the stripping damage is reduced.

Description

Technical Field

[0001] The present invention relates to the field of crystal ingot processing equipment, and in particular to a stripping equipment for crystal ingot processing. Background Art

[0002] As the core material in the field of semiconductor technology, wafers directly determine the manufacturing level of semiconductor components to a certain extent. The method of directly obtaining wafers by cutting ingots with diamond tools has large material loss and severe tool wear. For hard and brittle materials, it is very easy to produce fatal microcracks and edge collapse defects, resulting in material scrap.

[0003] Laser processing technology can solve the above problems well. With the help of laser irradiation, a peeling layer is formed along a specific crystal plane at a depth equivalent to the thickness of the wafer from the surface to be peeled off in the ingot. Specifically, the focusing point of the laser beam with a wavelength that is transparent to the ingot is positioned at the corresponding depth, and the modified part and cracks extending from the modified part along the crystal plane in various directions are formed by laser irradiation. These cracks constitute the peeling layer.

[0004] When peeling off the peeling layer, the adhesive is usually heated to a melting temperature or above the glass transition temperature to form a liquid, and the surface of the crystal ingot to be peeled off is set on a solid substrate through the liquid adhesive layer. After the adhesive layer solidifies, the crystal ingot is fixed on the solid substrate through the adhesive layer. Then, the solid substrate is stretched and the relative position of the crystal ingot body is maintained to separate the layer to be peeled off from the crystal ingot body. The adhesive layer can be heated to decompose and melt it, or it can be irradiated with light to decompose it, thereby reducing the adhesion of the adhesive layer, and the generated chip is separated from the solid substrate to obtain a chip.

[0005] However, currently, when peeling the layer to be peeled off, it can only be pulled off by a simple tensioning method. During the process, it is very easy for the wafer to be damaged due to excessive peeling tension, and it is difficult to effectively maintain the integrity of the wafer. Summary of the invention

[0006] The object of the present invention is to provide a stripping device for processing a crystal ingot, which can improve the convenience of the crystal ingot stripping process, increase the integrity of the stripping process, and reduce the damage caused by stripping.

[0007] In order to solve the above technical problems, the present invention provides a stripping device for processing crystal ingots, comprising a processing table, a lifting seat lifted on the processing table, and a plurality of bonding blocks arranged at intervals along the circumference of the lifting seat, wherein the bonding blocks are used to bond the part to be stripped of the crystal ingot, and the processing table is provided with a push knife on the side of the crystal ingot, and the push knife can be moved along the radial direction of the crystal ingot, so that when the bonding block pulls the part to be stripped, the push knife is located between the part to be stripped and the crystal ingot.

[0008] Furthermore, a circular track is arranged on the outer periphery of the lifting seat, the moving seat is movably installed in the circular track, and a connecting column is connected to one side of the moving seat, and the push knife is installed on the side of the connecting column so that the push knife can perform circular peeling along the circular track with the moving seat.

[0009] Furthermore, a first telescopic rod is connected between the bonding block and the lifting seat, and a first elastic member is built into the first telescopic rod.

[0010] Furthermore, a lever is provided on the side of the first telescopic rod, and a top block is provided at the end of the movable seat, and the top block matches the lever. When the top block moves along the circular track with the movable seat, the top block pushes each lever in turn to make each first telescopic rod retract in turn.

[0011] Furthermore, the end of the connecting column is connected to a positioning frame, and the push knife is movably installed in the positioning frame, and a plurality of positioning grooves are spaced apart on both sides of the push knife. A tightening piece is passed through the side of the positioning frame and connected, and the end of the tightening piece close to the push knife is connected to a positioning bead matching the positioning groove through a second elastic piece, so that the positioning bead is buckled in one of the positioning grooves.

[0012] Furthermore, a support frame is provided on the processing table, and the lifting seat is connected to the support frame through a second telescopic rod, and a guide block is movably installed on the inner edge of the support frame, and the guide block has a guide bevel on the side close to the push knife, and the push knife matches the guide bevel so that when the side of the push knife contacts the guide bevel, the push knife moves along the radial direction of the ingot.

[0013] Furthermore, the guide block has a limiting plate extending from one side of the guiding inclined surface, the limiting plate is obliquely provided with a limiting groove, and the side of the push knife is provided with a limiting block matching the limiting groove, so that when the push knife moves along the guiding inclined surface, the limiting block moves along the limiting groove.

[0014] Furthermore, the end of the lever close to the top block has a curved surface structure, and a plurality of convex strips are arranged at intervals on the outside of the curved surface structure, and a plurality of convex points are arranged at intervals on the side of the top block that matches the lever, so that when the top block pushes the lever, the convex points and the convex strips contact each other.

[0015] Furthermore, a driving member is provided on the side of the support frame for lifting and lowering, and the driving member is connected to the guide block through a third telescopic rod. At least two screw rods are rotatably provided on the side of the support frame, and at least the two screw rods pass through both sides of the driving member. A first sensor is provided on the side of the driving member, and a second sensor matching the first sensor is provided on the side of the movable seat for detecting the relative position of the guide block and the push knife.

[0016] Furthermore, a plurality of movable grooves are provided on the side of the processing table, and positioning rods are symmetrically arranged in pairs in the movable grooves, and the positioning rods are movably matched with the movable grooves, so that the plurality of positioning rods can position the crystal ingot.

[0017] The beneficial effects of the present invention are as follows: a crystal ingot after laser processing is placed on a processing table, and the lifting platform is lowered so that the adhesive on the surface of a plurality of bonding blocks is bonded to the surface of the layer to be peeled off, and then the lifting platform is raised a certain distance so that a plurality of bonding blocks tension the layer to be peeled off, thereby causing a certain crack between the peeling layer and the crystal ingot body, and at this time, a push knife is pushed from the crack along the radial direction of the crystal ingot toward the depth of the peeling layer, so that the push knife can push and shovel the position between the crystal ingot and the layer to be peeled off, and the auxiliary bonding blocks perform peeling treatment on the tensioned layer to be peeled off, effectively reducing the situation where the layer to be peeled off is damaged due to forced tensioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a front view of the present invention.

[0020] Figure 3 The present invention Figure 2 Section view along line AA.

[0021] Figure 4 The present invention Figure 3 A partial enlarged view of point A in the middle.

[0022] Figure 5 It is a side view of the present invention.

[0023] Figure 6 The present invention Figure 5 A partial enlarged view of point B in the middle.

[0024] Figure 7 The present invention Figure 5 Section along line BB.

[0025] Figure 8 The present invention Figure 7 A partial enlarged view of point C in the middle.

[0026] Fig. 9 It is a structural schematic diagram of the top block in the present invention.

[0027] 1. Processing table; 2. Lifting seat; 3. Adhesive block; 4. Push knife; 5. Annular track; 6. Moving seat; 7. Connecting column; 8. First telescopic rod; 9. First elastic member; 10. Push rod; 11. Push block; 12. Positioning frame; 13. Positioning groove; 14. Pressing member; 15. Second elastic member; 16. Positioning bead; 17. Support frame; 18. Second telescopic rod; 19. Guide block; 20. Guide slope; 21. Limit plate; 22. Limit groove; 23. Limit block; 24. Raised strip; 25. Protruding point; 26. Driving member; 27. Third telescopic rod; 28. Screw rod; 29. ​​First sensor; 30. Second sensor; 31. Moving groove; 32. Positioning rod. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0029] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0030] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0031] like Figure 1-Figure 9 The present invention provides a stripping device for processing a crystal ingot, comprising a processing table 1, a lifting seat 2 lifted and lowered on the processing table 1, and a plurality of bonding blocks 3 arranged at intervals along the circumference of the lifting seat 2, wherein the bonding blocks 3 are used to bond the portion to be stripped of the crystal ingot, and a push knife 4 is arranged on the side of the crystal ingot on the processing table 1, and the push knife 4 can move along the radial direction of the crystal ingot, so that when the bonding block 3 pulls the portion to be stripped, the push knife 4 is located between the portion to be stripped and the crystal ingot.

[0032] The crystal ingot after laser processing is placed on the processing table, and the lifting platform is lowered to make the adhesive on the surface of several bonding blocks adhere to the surface of the layer to be peeled off. Then the lifting platform rises a certain distance, so that several bonding blocks stretch the layer to be peeled off, thereby causing a certain crack between the peeling layer and the crystal ingot body. At this time, the push knife pushes from the crack along the radial direction of the crystal ingot to the depth of the peeling layer, so that the push knife can push and shovel the position between the crystal ingot and the layer to be peeled off, and the auxiliary bonding blocks perform peeling treatment on the tensioned layer to be peeled off, effectively reducing the situation where the layer to be peeled off is damaged due to forced tensioning.

[0033] It is worth mentioning that before the bonding block pulls up the edge of the layer to be peeled off from the ingot, the push knife is located on the side of the ingot to avoid interference between the initial position of the push knife and the ingot.

[0034] The adhesive used in the bonding block is consistent with the prior art and will not be described in detail here.

[0035] Preferably, a circular track 5 is provided on the outer periphery of the lifting seat 2, a moving seat 6 is movably installed in the circular track 5, and a connecting column 7 is connected to one side of the moving seat 6, and the push knife 4 is installed on the side of the connecting column 7, so that the push knife 4 performs circular peeling along the circular track 5 with the moving seat 6.

[0036] Specifically, after the push knife enters the stripping layer position along the radial direction of the ingot, the moving seat moves in a circular motion along the circular track, thereby driving the push knife to move in a circular motion, so that the push knife performs circular pushing and stripping along the plane position of the stripping layer, and in conjunction with a number of circumferentially arranged bonding blocks, the stripping layer can be effectively stripped in sequence at various angles to avoid damage caused by large-scale tensioning.

[0037] Among them, the cooperation mode of the moving seat and the circular track can adopt the form of electric track.

[0038] Preferably, a first telescopic rod 8 is connected between the bonding block 3 and the lifting seat 2 , and a first elastic member 9 is built into the first telescopic rod 8 .

[0039] Specifically, after the bonding block is bonded to the layer to be peeled off, the lifting seat rises a certain distance so that the first telescopic rod remains in an extended state, so as to provide sufficient rising space for the bonding block, thereby facilitating the subsequent sequential oscillation of each first telescopic rod and the bonding block, thereby achieving the purpose of sequential tensioning along the circumference of the layer to be peeled off.

[0040] Wherein, the first elastic member may adopt a spring structure.

[0041] Preferably, a lever 10 is provided on the side of the first telescopic rod 8, and a top block 11 is provided at the end of the movable seat 6, and the top block 11 matches the lever 10. When the top block 11 moves along the annular track 5 with the movable seat 6, the top block 11 pushes each lever 10 in turn to make each first telescopic rod 8 retract in turn.

[0042] Specifically, in the process of the movable seat driving the push knife to perform circumferential rotation and pushing along the circular track, the push block pushes each lever position in turn in the circumferential direction, so that each lever pushes and contracts the first telescopic rod, and then each bonding block pulls the upper surface of the to-be-peeled layer in turn in the circumferential direction. Combined with the circumferential rotation and pushing of the push knife, the peeling layer and the crystal ingot can be pulled in the circumferential direction and gradually separated toward the inner radial position, thereby improving the peeling integrity of the wafer.

[0043] Preferably, the end of the connecting column 7 is connected to a positioning frame 12, the push knife 4 is movably installed in the positioning frame 12, and a plurality of positioning grooves 13 are spaced apart on both sides of the push knife 4, and a tightening member 14 is passed through the side of the positioning frame 12 and connected, and the end of the tightening member 14 close to the push knife 4 is connected to a positioning bead 16 matching the positioning groove 13 through a second elastic member 15, so that the positioning bead 16 is buckled in one of the positioning grooves 13.

[0044] Specifically, the horizontal position of the push knife is limited by the positioning frame to ensure that the push knife is located on the horizontal plane of the peeling layer. At the same time, in the process of the push knife radially entering the inner side of the peeling layer, the radial movement stability of the push knife is increased by the engagement of the positioning bead with the positioning groove, and the positioning bead is tightened by the tightening member and the second elastic member to ensure that the positioning bead can be stably buckled in the positioning groove, thereby avoiding the push knife from moving horizontally relative to the positioning frame.

[0045] Furthermore, since the direction of the force applied to the push knife is all lateral during the circumferential rotation of the push knife, the cooperation of the positioning beads and the positioning grooves can further ensure the accuracy of the horizontal position of the push knife.

[0046] The tightening member may be a locking bolt, and the second elastic member may be a spring structure.

[0047] Preferably, a support frame 17 is provided on the processing table 1, and the lifting seat 2 is connected to the support frame 17 through a second telescopic rod 18, and a guide block 19 is movably installed on the inner edge of the support frame 17, and the guide block 19 has a guide bevel 20 on the side close to the push knife 4, and the push knife 4 matches the guide bevel 20, so that when the side of the push knife 4 contacts the guide bevel 20, the push knife 4 moves along the radial direction of the ingot.

[0048] Specifically, the lifting and lowering operation of the lifting seat is controlled by the second telescopic rod. At the same time, through the setting of the guide block, when the push knife moves in a circular motion along the circular track, the guide block moves a certain distance toward the push knife, so that the end of the push knife contacts the guide slope, and then the push knife slides relative to the positioning frame along the guide slope, so that the push knife can be conveniently driven to move a certain distance along the radial direction of the crystal ingot, and then under the multiple movement and guiding action of the guide block, the push knife is gradually rotated and pushed toward the depth of the peeling layer.

[0049] The second telescopic rod is telescopically controlled by a hydraulic cylinder.

[0050] It is worth mentioning that the support frame in this scheme can be fixedly installed or slidably installed according to the specifications of the crystal ingot, the processing flow, etc. In the fixed installation form, the crystal ingot after laser processing needs to be moved to the processing table of this scheme; in the sliding installation form, another set of equipment for laser processing of the crystal ingot can be slidably installed on the processing table of this scheme, so that after the laser processing equipment completes processing of the crystal ingot, the laser processing equipment slides to the side of the processing table, and at the same time, the support frame drives the bonding block, push knife and other structures to move above the processed crystal ingot to reduce the time for transferring the crystal ingot.

[0051] Preferably, the guide block 19 has a limiting plate 21 extending from one side of the guiding inclined surface 20, and a limiting groove 22 is obliquely provided at the limiting plate 21, and the side of the push knife 4 has a limiting block 23 matching the limiting groove 22, so that when the push knife 4 moves along the guiding inclined surface 20, the limiting block 23 moves along the limiting groove 22.

[0052] Specifically, when the guide block radially guides the push knife through the guiding bevel, the limit block will pass through the position of the limit slot without being restricted. However, when the push knife is used and rotated to the side of the guide block, the limit block is located in the limit slot at this time. During the resetting movement, the guide block can pull the push knife to be reset and moved out radially along the ingot through the cooperation of the limit slot and the limit block. The push knife can be automatically and quickly reset to avoid the push knife getting stuck in the peeling layer.

[0053] In an embodiment of the present solution, the inclination angle of the limiting groove is consistent with the inclination angle of the guiding inclined surface to ensure that the limiting block slides out smoothly.

[0054] Preferably, the end of the lever 10 close to the top block 11 has a curved surface structure, and a plurality of convex strips 24 are arranged at intervals on the outside of the curved surface structure, and a plurality of protrusions 25 are arranged at intervals on the side of the top block 11 that matches the lever 10, so that when the top block 11 pushes the lever 10, the protrusions 25 and the convex strips 24 contact each other.

[0055] Specifically, by setting the convex strips and the convex points, when the top block passes through the lever, the contact between the convex strips and the convex points will cause a certain degree of vibration between the top block and the lever, thereby causing a certain degree of vibration between the push knife and the bonding block. The vibration can be generated during the pushing process of the push knife and the pulling action of the bonding block, thereby improving the efficiency and integrity of the peeling.

[0056] In one embodiment of the present solution, a side surface of the top block close to the lever is arranged in a semicircular structure, so that the semicircular structure of the top block matches the arc surface of the lever, thereby improving the wave action and smoothness of the top block on the lever.

[0057] Preferably, a driving member 26 is provided on the side of the support frame for lifting and lowering, and the driving member 26 is connected to the guide block 19 through a third telescopic rod 27. At least two screw rods 28 are rotatably provided on the side of the support frame 17, and at least two screw rods 28 pass through both sides of the driving member 26. A first sensor 29 is provided on the side of the driving member 26, and a second sensor 30 matching the first sensor 29 is provided on the side of the moving seat 6 for detecting the relative position of the guide block 19 and the push knife 4.

[0058] Specifically, the extension and retraction of the third telescopic rod is controlled by the driving member, thereby controlling the radial movement position of the guide block, and the setting of the two screws can effectively control the lifting and lowering of the driving member through the screw transmission method, thereby controlling the height of the guide block, so that when the height of the lifting seat changes, the guide block can change synchronously, thereby improving the adaptation range of the guide block and the push knife.

[0059] The matching setting of the first sensor and the second sensor is to detect whether the relative positions of the push knife and the guide block match, so as to improve the stability of the push knife in pushing along the radial direction of the crystal ingot.

[0060] Among them, the driving part can adopt a hydraulic cylinder, the third telescopic rod adopts a hydraulic rod structure, the screw rod is threadedly matched with the side of the driving part, and the screw rod is driven by a motor to rotate; the first sensor and the second sensor adopt infrared sensors, one of which is an infrared emitting end and the other is an infrared receiving end. When the two sensors receive infrared transmission, the relative position of the push knife and the guide block can be judged accurately.

[0061] Preferably, a plurality of movable grooves 31 are opened on the side of the processing table 1 , and positioning rods 32 are symmetrically arranged in pairs in the movable grooves 31 , and the positioning rods 32 are movably matched with the movable grooves 31 , so that the plurality of positioning rods 32 can position the ingot.

[0062] Specifically, by moving two positioning rods symmetrically arranged in the groove close to each other, the positioning rods push the bottom of the crystal ingot to the middle position of the processing table, and with the cooperation of the positioning rods in multiple moving grooves, the crystal ingot is maintained in the middle position of the processing table to ensure accurate positioning during laser processing and peeling.

[0063] In one embodiment of the present solution, the positioning rod may be driven by hydraulic pressure.

[0064] The present invention is not limited to the above-mentioned optimal implementation mode. Anyone can derive other various forms of products under the inspiration of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that are the same or similar to those of the present application fall within the protection scope of the present invention.

Claims

1. A stripping device for ingot processing, characterized in that: The invention comprises a processing table (1), a lifting seat (2) lifted and arranged on the processing table (1), and a plurality of bonding blocks (3) arranged at intervals along the circumference of the lifting seat (2), wherein the bonding blocks (3) are used to bond the part to be peeled off of the crystal ingot, and the processing table (1) is provided with a push knife (4) on the side of the crystal ingot, and the push knife (4) can move along the radial direction of the crystal ingot, so that when the bonding block (3) pulls the part to be peeled off, the push knife (4) is located between the part to be peeled off and the crystal ingot.

2. The stripping device for ingot processing according to claim 1, characterized in that: The outer periphery of the lifting seat (2) is provided with an annular track (5), the moving seat (6) is movably mounted in the annular track (5), and one side of the moving seat (6) is connected to a connecting column (7), and the push knife (4) is mounted on the side of the connecting column (7) so that the push knife (4) performs annular peeling along the annular track (5) along with the moving seat (6).

3. The stripping device for ingot processing according to claim 2, characterized in that: A first telescopic rod (8) is connected between the bonding block (3) and the lifting seat (2), and a first elastic member (9) is built into the first telescopic rod (8).

4. The stripping device for ingot processing according to claim 3, characterized in that: A lever (10) is arranged on the side of the first telescopic rod (8), and a top block (11) is provided at the end of the movable seat (6), and the top block (11) matches the lever (10). When the top block (11) moves along the annular track (5) with the movable seat (6), the top block (11) pushes each lever (10) in turn, so that each first telescopic rod (8) is retracted in turn.

5. The ingot processing stripping device according to claim 2, characterized in that: The end of the connecting column (7) is connected to a positioning frame (12), the push knife (4) is movably installed in the positioning frame (12), and a plurality of positioning grooves (13) are spaced apart on both sides of the push knife (4). A tightening member (14) is passed through the side of the positioning frame (12) and connected. The end of the tightening member (14) close to the push knife (4) is connected to a positioning bead (16) matching the positioning groove (13) through a second elastic member (15), so that the positioning bead (16) is buckled in one of the positioning grooves (13).

6. The ingot processing stripping device according to claim 2, characterized in that: A support frame (17) is provided on the processing table (1), and the lifting seat (2) is connected to the support frame (17) through a second telescopic rod (18). A guide block (19) is movably installed on the inner side edge of the support frame (17). The guide block (19) has a guide bevel (20) on the side close to the push knife (4). The push knife (4) matches the guide bevel (20) so that when the side of the push knife (4) contacts the guide bevel (20), the push knife (4) moves along the radial direction of the ingot.

7. The stripping device for ingot processing according to claim 6, characterized in that: The guide block (19) has a limiting plate (21) extending from one side of the guiding inclined surface (20), and a limiting groove (22) is obliquely provided on the limiting plate (21), and a limiting block (23) matching the limiting groove (22) is provided on the side of the push knife (4), so that when the push knife (4) moves along the guiding inclined surface (20), the limiting block (23) moves along the limiting groove (22).

8. The stripping device for ingot processing according to claim 4, characterized in that: The end of the lever (10) close to the top block (11) has a curved surface structure, and a plurality of convex strips (24) are arranged at intervals on the outer side of the curved surface structure. A plurality of convex points (25) are arranged at intervals on the side of the top block (11) that matches the lever (10), so that when the top block (11) pushes the lever (10), the convex points (25) and the convex strips (24) contact each other.

9. The ingot processing stripping device according to claim 6, characterized in that: The side of the support frame is provided with a driving member (26) for lifting, and the driving member (26) is connected to the guide block (19) through a third telescopic rod (27). The side of the support frame (17) is provided with at least two screw rods (28) for rotation, and the at least two screw rods (28) pass through the two sides of the driving member (26). The side of the driving member (26) has a first sensor (29), and the side of the movable seat (6) has a second sensor (30) matching the first sensor (29) for detecting the relative position of the guide block (19) and the push knife (4).

10. The ingot processing stripping device according to claim 1, characterized in that: A plurality of movable grooves (31) are provided on the side of the processing table (1), and positioning rods (32) are symmetrically arranged in pairs in the movable grooves (31), and the positioning rods (32) are movablely matched with the movable grooves (31), so that the plurality of positioning rods (32) can position the crystal ingot.

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