Automatic semiconductor material packaging machine

Abstract

The invention discloses an automatic semiconductor material packaging machine, which belongs to the field of semiconductor processing, and comprises a box body, and a feeding assembly is arranged on the box body. According to the scheme, a feeding box is arranged, a push plate is driven to move through a second rack, a gear and a first rack in the moving process of a conveying plate, and then a semiconductor material is driven to move into a containing groove through a feeding opening in the moving process of the push plate; then an electric sliding rail drives the semiconductor material to move towards the upper portion of the bottom plate through a mounting block, an electric telescopic rod and a conveying plate, meanwhile, a first spring shrinks and drives a push plate to reset in the process that the conveying plate is away from the feeding box, a first rack is driven to reset in the reset process of the push plate, and therefore automatic feeding can be achieved; manual feeding of a user is not needed, the labor intensity of workers is reduced, meanwhile, the packaging efficiency is improved, the semiconductor materials can be prevented from being polluted, and the effect of improving the packaging efficiency and the using effect of the semiconductor materials is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and more particularly to an automatic semiconductor material packaging machine. Background Art

[0002] Semiconductor materials are a type of electronic material that has semiconductor properties (the electrical conductivity is between that of conductors and insulators, and the resistivity is approximately in the range of 1mΩ·cm to 1GΩ·cm) and can be used to make semiconductor devices and integrated circuits.

[0003] Semiconductor parts are the basic components of semiconductor devices. They are tiny electronic components made of semiconductor materials. Semiconductor materials have special electrical properties. They can conduct electrons under certain conditions and prevent the flow of current under other conditions. Therefore, they are widely used in the electronics field. Therefore, the manufacture and application of semiconductor parts have played an important role in modern scientific and technological progress and social development. Since semiconductor parts are relatively precise, and semiconductor parts are prone to oxidation reactions when in contact with oxygen, which may cause the parts to lose function or performance degradation, and semiconductor parts are very sensitive, moisture and pollutants in the air may have a negative impact on their performance and reliability. Existing semiconductor parts lack a vacuum environment when packaged, which makes it impossible for the parts to effectively remove moisture and pollutants, resulting in the parts being easily damaged during manufacturing, transportation and storage, seriously affecting the use of semiconductor parts.

[0004] In view of the above problems, some solutions are also provided in the prior art. For example, the Chinese utility model patent with announcement number CN221367694U discloses a semiconductor parts vacuum packaging machine, which extracts the air in the device through a vacuum box to form a vacuum state inside the device, so that the semiconductor parts can be processed in a vacuum state, effectively avoiding the oxidation of semiconductor materials and affecting the use effect of semiconductor materials. Although the prior art can package semiconductor materials in a vacuum environment, the prior art requires users to place the semiconductor materials on a pallet, which not only wastes manpower but also seriously affects the packaging efficiency of semiconductor materials. At the same time, when the user places the semiconductor materials on the pallet, stains are easily adhered to the surface of the semiconductor materials, which makes it easy for stains to adhere to the surface of the semiconductor materials during packaging, thereby causing the semiconductor materials to lose their functions or performance degradation, seriously affecting the use effect of the semiconductor materials. Summary of the invention

[0005] In view of the problems existing in the prior art, the object of the present invention is to provide an automated semiconductor material packaging machine, which can achieve the purpose of improving the use effect of semiconductor materials.

[0006] To solve the above problems, the present invention adopts the following technical solutions.

[0007] An automated semiconductor material packaging machine comprises a box body, on which a feeding assembly is provided;

[0008] The feeding assembly includes a feeding box detachably mounted on the side wall of the box body, a feeding port is provided on the bottom wall of the feeding box, a push plate is slidably mounted on the feeding box, a first spring is commonly installed between the push plate and the feeding box, a gear is rotatably mounted on the feeding box, a first rack meshing with the gear is fixedly mounted on the push plate, an electric slide rail is fixedly mounted on the side wall of the box body, a mounting block is slidably mounted on the electric slide rail, an electric telescopic rod is fixedly mounted on the mounting block, a transport plate is fixedly mounted on the output end of the electric telescopic rod, a placement groove is provided on the top wall of the transport plate, a second rack meshing with the gear is provided on the transport plate, and a packaging assembly for packaging semiconductor materials is provided in the box body.

[0009] Furthermore, the packaging assembly includes a bottom plate installed on the bottom wall of the box body, and a first aluminum foil packaging box and a second aluminum foil packaging box are symmetrically installed on the top wall of the bottom plate, and the first aluminum foil packaging box and the second aluminum foil packaging box are both provided with aluminum foil outlets, and a guide plate is fixedly installed on the first aluminum foil packaging box, a vacuum box connected to the box body is fixedly installed on the box body, an electric push rod is fixedly installed on the inner top wall of the box body, and an electric suction cup is provided on the output end of the electric push rod.

[0010] Furthermore, a discharge port is provided on the bottom plate, a mounting groove is provided on the bottom plate, a rotating rod is rotatably installed in the mounting groove, a sealing plate for sealing the discharge port is fixedly installed on the rotating rod, a first magnet block is embedded in the sealing plate, a collecting box cooperating with the discharge port is detachably installed on the bottom wall of the box body, a rotating spring is jointly installed between the rotating rod and the mounting groove, and a linkage assembly cooperating with the sealing plate is provided on the electric push rod.

[0011] Furthermore, the linkage assembly includes a hot pressing frame fixedly mounted on the output end of the electric push rod, a sleeve fixedly mounted on the bottom wall of the hot pressing frame, a vertical rod slidably mounted in the sleeve, a second spring is commonly installed between the top wall of the vertical rod and the sleeve, and the electric suction cup is fixedly mounted on the output end of the vertical rod, an electromagnet that repel each other with the first magnet block is fixedly mounted on the hot pressing frame, a first switch electrically connected to the electromagnet is provided in the sleeve, and a second switch electrically connected to the electromagnet is installed on the inner top wall of the box.

[0012] Furthermore, the transport plate is provided with L rows of grooves, in which L rows of baffles are slidably installed, a return spring is installed between the baffles and the grooves, and a second magnet block that attracts the first magnet block is embedded on the baffle.

[0013] Furthermore, a vertical groove is provided on the feeding box, a vertical plate is slidably installed in the vertical groove, a third spring is installed between the vertical plate and the vertical groove, a connecting rod is fixedly installed on the side wall of the vertical plate, and the end of the connecting rod away from the vertical plate is an inclined surface.

[0014] Furthermore, a heating wire is provided on the heating frame, and a heat insulating layer is provided between the heating wire and the electromagnet.

[0015] Furthermore, balls are evenly and rotatably mounted on the top wall of the push plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) This solution sets a feeding box. During the movement of the transport plate, the second rack, the gear, and the first rack drive the push plate to move. During the movement of the push plate, the semiconductor material is driven to move through the feeding port into the placement slot. Then, the electric slide rail drives the semiconductor material to move above the bottom plate through the mounting block, the electric telescopic rod, and the transport plate. At the same time, during the process of the transport plate moving away from the feeding box, the first spring contracts and drives the push plate to reset. During the process of the push plate resetting, the first rack is driven to reset. Thus, automatic loading can be achieved without manual loading by personnel. This reduces the labor intensity of workers and improves packaging efficiency. It can also prevent the semiconductor material from being contaminated, thereby improving packaging efficiency and the use effect of semiconductor materials.

[0018] (2) In this solution, the first magnet cooperates with the electromagnet. During the downward movement of the hot press frame, the semiconductor material drives the vertical rod to move upward along the sleeve and squeezes the second spring. When the second spring reaches the maximum compression degree, the vertical rod presses the first switch. At this time, the electromagnet is energized and generates a magnetic field. Then, under the action of the electromagnet magnetic field, the first magnet block drives the sealing plate to rotate around the rotating rod. At this time, the rotating spring begins to accumulate force. During the downward rotation of the sealing plate, the packaged semiconductor material enters the collection box through the discharge port, thereby eliminating the need for users to manually collect the packaged semiconductor material, further improving the packaging efficiency of the semiconductor material.

[0019] (3) This solution sets a baffle plate. When the transport plate drives the semiconductor material to move, the baffle plate can be set to prevent the semiconductor material from falling. Then, when the transport plate drives the semiconductor material to move toward the bottom plate, the first magnet block drives the baffle plate to move downward through the second magnet block. After the transport plate is separated from the semiconductor material, the return spring drives the baffle plate to return to its original position. That is, the baffle plate can be set to prevent the semiconductor material from falling, causing damage to the semiconductor material, and requiring the user to spend time to remove the fallen semiconductor material, thereby further improving the packaging efficiency of the semiconductor material and the use effect of the semiconductor material.

[0020] (4) In this scheme, a vertical plate is set. When the transport plate approaches the feeding box, the side wall of the transport plate gradually contacts the inclined surface of the connecting rod and applies a thrust to the inclined surface of the connecting rod. Then, the connecting rod drives the vertical plate to move downward under the action of the thrust. During the downward movement of the vertical plate, the vertical plate gradually loses contact with the feeding port. At this time, the semiconductor material can normally enter the placement groove through the feeding port. When the transport plate is away from the feeding box, the third spring stretches and drives the vertical plate to move upward. During the upward movement of the vertical plate, the feeding port is blocked again, thereby further preventing the semiconductor material from falling into the outside through the feeding port when the box shakes, thereby further improving the packaging efficiency of the semiconductor material and the use effect of the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 is a cross-sectional view of the present invention;

[0023] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 For the present invention Figure 2 Enlarged view of point B in the middle;

[0025] Figure 5 It is a combined diagram of the feed box, push plate and gear of the present invention;

[0026] Figure 6 It is a combined diagram of the transport plate, baffle plate and second rack of the present invention;

[0027] Figure 7 It is a combined diagram of the bottom plate, the sealing plate, the first magnet block and the rotating rod of the present invention;

[0028] Figure 8 It is a combined diagram of the sleeve and the vertical rod of the present invention.

[0029] Description of the numbers in the figure:

[0030] 1. Box body;

[0031] 2. Feeding assembly; 201. Feeding box; 202. Push plate; 203. First spring; 204. Gear; 205. First rack; 206. Electric slide rail; 207. Mounting block; 208. Electric telescopic rod; 209. Transport plate; 210. Second rack;

[0032] 3. Packaging components; 301. Bottom plate; 302. First aluminum foil packaging box; 303. Second aluminum foil packaging box; 304. Aluminum foil outlet; 305. Guide plate; 306. Vacuum box; 307. Electric push rod; 308. Electric suction cup;

[0033] 401, rotating rod; 402, sealing plate; 403, first magnet block; 404, collecting box; 202, push plate; 406, rotating spring;

[0034] 5. Linkage assembly; 501. Hot pressing frame; 502. Sleeve; 503. Vertical rod; 504. Second spring; 505. Electromagnet; 506. First switch; 507. Second switch;

[0035] 601, baffle; 602, return spring; 603, second magnet;

[0036] 701, vertical plate; 702, third spring; 703, connecting rod;

[0037] 8. Heating wire; 9. Thermal insulation layer; 10. Ball bearing. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0039] See also Figures 1 to 8 , an automated semiconductor material packaging machine, comprising a box body 1, on which a feeding assembly 2 is provided;

[0040] The feeding assembly 2 includes a feeding box 201 detachably mounted on the side wall of the box body 1, a feeding port is provided on the bottom wall of the feeding box 201, a push plate 202 is slidably mounted on the feeding box 201, a first spring 203 is commonly installed between the push plate 202 and the feeding box 201, a gear 204 is rotatably mounted on the feeding box 201, a first rack 205 meshing with the gear 204 is fixedly mounted on the push plate 202, an electric slide rail 206 is fixedly mounted on the side wall of the box body 1, a mounting block 207 is slidably mounted on the electric slide rail 206, an electric telescopic rod 208 is fixedly mounted on the mounting block 207, a transport plate 209 is fixedly mounted on the output end of the electric telescopic rod 208, a placement groove is provided on the top wall of the transport plate 209, a second rack 210 meshing with the gear 204 is provided on the transport plate 209, and a packaging assembly 3 for packaging semiconductor materials is provided in the box body 1.

[0041] like Figure 2 , Figure 4 , Figure 7 , Figure 8 As shown, the packaging assembly 3 includes a bottom plate 301 installed on the bottom wall of the box body 1, and a first aluminum foil packaging box 302 and a second aluminum foil packaging box 303 are symmetrically installed on the top wall of the bottom plate 301, and the first aluminum foil packaging box 302 and the second aluminum foil packaging box 303 are both provided with an aluminum foil outlet 304, and a guide plate 305 is fixedly installed on the first aluminum foil packaging box 302, and a vacuum box 306 connected to the box body 1 is fixedly installed on the box body 1, and an electric push rod 307 is fixedly installed on the inner top wall of the box body 1, and an electric suction cup 308 is provided on the output end of the electric push rod 307.

[0042] The bottom plate 301 is provided with a discharge port, the bottom plate 301 is provided with a mounting groove, a rotating rod 401 is rotatably mounted in the mounting groove, a sealing plate 402 for blocking the discharge port is fixedly mounted on the rotating rod 401, a first magnet block 403 is embedded on the sealing plate 402, a collecting box 404 cooperating with the discharge port is detachably mounted on the bottom wall of the box body 1, a rotating spring 406 is installed between the rotating rod 401 and the mounting groove, and a linkage assembly 5 cooperating with the sealing plate 402 is provided on the electric push rod 307.

[0043] The linkage assembly 5 includes a hot pressing frame 501 fixedly mounted on the output end of the electric push rod 307, a sleeve 502 fixedly mounted on the bottom wall of the hot pressing frame 501, a vertical rod 503 slidably mounted in the sleeve 502, a second spring 504 is commonly installed between the top wall of the vertical rod 503 and the sleeve 502, and the electric suction cup 308 is fixedly mounted on the output end of the vertical rod 503, an electromagnet 505 that repel each other with the first magnet block 403 is fixedly mounted on the hot pressing frame 501, a first switch 506 electrically connected to the electromagnet 505 is provided in the sleeve 502, and a second switch 507 electrically connected to the electromagnet 505 is installed on the inner top wall of the box body 1.

[0044] By adopting the above technical solution, when in use, the semiconductor material is first placed in the feeding box 201, and then the electric slide rail 206 drives the electric telescopic rod 208 to move through the mounting block 207, and in the process of the electric telescopic rod 208 moving, the transport plate 209 is driven to move toward the feeding port. At the same time, in the process of the transport plate 209 moving, the second rack 210 is driven to gradually engage with the gear 204, and the gear 204 is driven to rotate, and then in the process of the gear 204 rotating, the push plate 202 is driven to move through the first rack 205, and the first spring 203 is stretched, and then in the process of the push plate 202 moving, the semiconductor material is driven to pass through. It moves through the feeding port into the placement slot, and then the electric slide rail 206 drives the semiconductor material to move above the bottom plate 301 through the mounting block 207, the electric telescopic rod 208, and the transport plate 209. At the same time, when the transport plate 209 moves away from the feeding box 201, the first spring 203 contracts and drives the push plate 202 to reset. When the push plate 202 resets, it drives the first rack 205 to reset, so that automatic loading can be achieved without manual loading by personnel, which reduces the labor intensity of workers and improves the packaging efficiency. It can also avoid the contamination of semiconductor materials, thereby improving the packaging efficiency and the use effect of semiconductor materials.

[0045] When the semiconductor material moves to the top of the bottom plate 301, the output end of the electric push rod 307 extends and drives the electric suction cup 308 to move downward. In the process of the electric suction cup 308 moving downward, it gradually contacts the semiconductor material, and then the electric suction cup 308 starts to absorb the semiconductor material. At this time, the output end of the electric telescopic rod 208 contracts and drives the transport plate 209 to break contact with the semiconductor material. Then the vacuum box 306 starts to work and absorbs the air in the box body 1, so that the box body 1 is in a vacuum state. Then the second aluminum foil packaging box 303 spits out aluminum foil through the aluminum foil outlet 304, and makes the aluminum foil fall onto the top wall of the bottom plate 301. When the aluminum foil falls onto the top wall of the bottom plate 301, the output end of the electric push rod 307 extends and drives the semiconductor material gradually through the electric suction cup 308. The electric suction cup 308 comes into contact with the aluminum foil, and then the semiconductor material falls onto the top wall of the aluminum foil. Subsequently, the output end of the electric push rod 307 contracts and drives the electric suction cup 308 to reset upward, and the first aluminum foil packaging box 302 spits out the aluminum foil through the aluminum foil outlet 304, and then the aluminum foil moves toward the top of the semiconductor material through the guide plate 305. At this time, the output end of the electric push rod 307 extends and drives the hot pressing frame 501 to move downward. In the process of the hot pressing frame 501 moving downward, it gradually contacts the aluminum foil above, and drives the aluminum foil above to contact the semiconductor material. Then the hot pressing frame 501 can perform hot pressing on the upper and lower layers of aluminum foil, thereby realizing the packaging of the semiconductor material in a vacuum environment, avoiding oxidation of the semiconductor material, and further improving the use effect of the semiconductor material.

[0046] In the process of the electric push rod 307 driving the hot pressing frame 501 to move downward, the hot pressing frame 501 drives the suction cup to press the aluminum foil and the semiconductor material together through the sleeve 502 and the vertical rod 503, so as to avoid the aluminum foil from being offset during the hot pressing process of the hot pressing frame 501, which affects the packaging effect of the semiconductor material. At the same time, in the process of the hot pressing frame 501 moving downward, the semiconductor material drives the vertical rod 503 to move upward along the sleeve 502 and squeeze the second spring 504. When the second spring 504 reaches the maximum compression degree, the vertical rod 503 presses the first switch 506. At this time, the electromagnet 505 is energized and generates a magnetic field. Then, under the action of the magnetic field of the electromagnet 505, the first magnet block 403 drives the sealing plate 402 to rotate around the rotating rod 401. At this time, the rotating spring 406 begins to accumulate force. In the process of the sealing plate 402 rotating downward, the packaged semiconductor material enters the collecting box 404 through the discharge port, so that the user does not need to manually collect the packaged semiconductor material, which further improves the packaging efficiency of the semiconductor material.

[0047] After the packaged semiconductor material enters the collecting box 404, the output end of the electric push rod 307 contracts and drives the hot pressing frame 501 to move upward, and in the process of the hot pressing frame 501 moving upward, it drives the sleeve 502 to move upward. At this time, the second spring 504 stretches and drives the vertical rod 503 to reset. At the same time, in the process of the hot pressing frame 501 moving upward, it drives the electromagnet 505 and the first magnet block 403 to gradually move away. At this time, the rotating spring 406 drives the sealing plate 402 to reset through the rotating rod 401, and presses the second switch 507 in the process of the hot pressing frame 501 resetting. At this time, the electromagnet 505 is powered off, which serves to prepare for work again.

[0048] like Figure 2 , Figure 3 , Figure 4 , Figure 6 As shown, the transport plate 209 is provided with L rows of grooves, in which L rows of baffles 601 are slidably installed, a return spring 602 is installed between the baffles 601 and the grooves, and a second magnet block 603 that attracts the first magnet block 403 is embedded on the baffle 601.

[0049] A vertical groove is provided on the feeding box 201, a vertical plate 701 is slidably installed in the vertical groove, a third spring 702 is installed between the vertical plate 701 and the vertical groove, a connecting rod 703 is fixedly installed on the side wall of the vertical plate 701, and the end of the connecting rod 703 away from the vertical plate 701 is an inclined surface.

[0050] By adopting the above technical solution, in the process of the transport plate 209 driving the semiconductor material to move, the baffle 601 can be set to prevent the semiconductor material from falling. Then, in the process of the transport plate 209 driving the semiconductor material to move toward the bottom plate 301, the second magnet block 603 gradually approaches the first magnet block 403. Then, under the action of the magnetic force between the first magnet block 403 and the second magnet block 603, the second magnet block 603 drives the baffle 601 to move downward. At this time, the return spring 602 is compressed and has a tendency to recover. Then, when the electric suction cup 308 is pressed against the semiconductor material, the semiconductor material is prevented from falling. After the material is adsorbed, the output end of the electric telescopic rod 208 contracts and drives the transport plate 209 to separate from the semiconductor material. After the separation, the magnetic force between the first magnet block 403 and the second magnet block 603 is less than the elastic force of the reset spring 602. At this time, the reset spring 602 extends and drives the baffle 601 to move upward. That is, by setting the baffle 601, it is possible to prevent the semiconductor material from falling, causing damage to the semiconductor material, and requiring users to spend time to remove the fallen semiconductor material, thereby improving the packaging efficiency of the semiconductor material and the use effect of the semiconductor material.

[0051] In the process of the transport plate 209 approaching the feeding box 201, the side wall of the transport plate 209 gradually contacts with the inclined surface of the connecting rod 703 and applies a thrust to the inclined surface of the connecting rod 703. Then, under the action of the thrust, the connecting rod 703 drives the vertical plate 701 to move downward, and gradually loses contact with the feeding port during the downward movement of the vertical plate 701. At this time, the semiconductor material can normally enter the placement groove through the feeding port. When the transport plate 209 is away from the feeding box 201, the third spring 702 extends and drives the vertical plate 701 to move upward. During the upward movement of the vertical plate 701, the feeding port is blocked again, thereby further preventing the semiconductor material from falling into the outside through the feeding port when the box body 1 shakes, thereby further improving the packaging efficiency of the semiconductor material and the use effect of the semiconductor material.

[0052] like Figure 4 As shown, a heating wire 8 is provided on the hot pressing frame 501 , and a heat insulating layer 9 is provided between the heating wire 8 and the electromagnet 505 .

[0053] By adopting the above technical solution and setting the heat insulation layer 9, it is possible to prevent the temperature of the heating wire 8 from being transferred to the electromagnet 505, and cause the electromagnet 505 to eliminate the influence of the first magnet block 403 on the normal movement of the sealing plate 402, thereby ensuring that the first magnet block 403 drives the sealing plate 402 to move normally.

[0054] like Figure 3 As shown, the top wall of the push plate 202 is evenly and rotatably mounted with balls 10.

[0055] By adopting the above technical solution, in the process of the push plate 202 pushing the semiconductor material to move out of the placement groove, the friction between the top wall of the push plate 202 and the semiconductor material can be reduced by setting the ball 10, thereby reducing the wear of the semiconductor material and improving the use effect of the semiconductor material.

[0056] Instructions for use: When in use, first put the semiconductor material into the feed box 201, then the electric slide rail 206 drives the electric telescopic rod 208 to move through the mounting block 207, and in the process of the electric telescopic rod 208 moving, the transport plate 209 is driven to move toward the feed port. At the same time, in the process of the transport plate 209 moving, the second rack 210 is driven to gradually mesh with the gear 204, and the gear 204 is driven to rotate, and then in the process of the gear 204 rotating, the push plate 202 is driven to move through the first rack 205, and the first spring 203 is stretched, and then in the process of the push plate 202 moving, the semiconductor material is driven to pass through the feed box. The opening moves into the placement groove, and then the electric slide rail 206 drives the semiconductor material to move above the bottom plate 301 through the mounting block 207, the electric telescopic rod 208, and the transport plate 209. At the same time, when the transport plate 209 is away from the feeding box 201, the first spring 203 contracts and drives the push plate 202 to reset. During the reset of the push plate 202, it drives the first rack 205 to reset, so that automatic loading can be achieved without manual loading by personnel; when the semiconductor material moves to the top of the bottom plate 301, the output end of the electric push rod 307 extends and drives the electric suction cup 308 to move downward. When the electric suction cup 308 moves downward During the process, the electric suction cup 308 gradually contacts the semiconductor material, and then the electric push rod 307 starts to absorb the semiconductor material. At this time, the output end of the electric telescopic rod 208 contracts and drives the transport plate 209 to break contact with the semiconductor material. Then the vacuum box 306 starts to work and absorbs the air in the box body 1, so that the box body 1 is in a vacuum state. Then the second aluminum foil packaging box 303 spits out the aluminum foil through the aluminum foil outlet 304, and makes the aluminum foil fall on the top wall of the bottom plate 301. When the aluminum foil falls on the top wall of the bottom plate 301, the output end of the electric push rod 307 extends and drives the semiconductor material to gradually contact the aluminum foil through the electric suction cup 308. The electric suction cup 308 is closed, and then the semiconductor material falls onto the top wall of the aluminum foil. Then the output end of the electric push rod 307 contracts and drives the electric suction cup 308 to reset upward, and the first aluminum foil packaging box 302 spits out the aluminum foil through the aluminum foil outlet 304, and then the aluminum foil moves above the semiconductor material through the guide plate 305. At this time, the output end of the electric push rod 307 extends and drives the hot pressing frame 501 to move downward. In the process of the hot pressing frame 501 moving downward, it gradually contacts the upper aluminum foil and drives the upper aluminum foil to contact the semiconductor material. Then the hot pressing frame 501 can perform hot pressing on the upper and lower layers of aluminum foil.During the process of the electric push rod 307 driving the hot pressing frame 501 to move downward, the hot pressing frame 501 drives the suction cup to press the aluminum foil and the semiconductor material together through the sleeve 502 and the vertical rod 503, thereby preventing the aluminum foil from deviating during the hot pressing process of the hot pressing frame 501 and affecting the packaging effect of the semiconductor material. At the same time, during the process of the hot pressing frame 501 moving downward, the semiconductor material drives the vertical rod 503 to move upward along the sleeve 502 and squeeze the second spring 504. When the second spring 504 reaches the maximum compression degree, the vertical rod 503 presses the first switch 506. At this time, the electromagnet 505 is energized and generates a magnetic field. Then, under the action of the magnetic field of the electromagnet 505, the first magnet block 403 drives the sealing plate 402 to rotate around the rotating rod 401. At this time, the rotating spring 406 begins to accumulate force. During the process of the sealing plate 402 rotating downward, the packaged semiconductor material enters the collection box 404 through the discharge port. ;

[0057] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automated semiconductor material packaging machine, comprising a box (1), wherein a feeding assembly (2) is provided on the box (1); Features: The feeding assembly (2) comprises a feeding box (201) detachably mounted on the side wall of the box body (1); a feeding port is provided on the bottom wall of the feeding box (201); a push plate (202) is slidably mounted on the feeding box (201); a first spring (203) is installed between the push plate (202) and the feeding box (201); a gear (204) is rotatably mounted on the feeding box (201); a first rack (205) meshing with the gear (204) is fixedly mounted on the push plate (202); and the box body (1) is provided with a plurality of gears. An electric slide rail (206) is fixedly mounted on the side wall, a mounting block (207) is slidably mounted on the electric slide rail (206), an electric telescopic rod (208) is fixedly mounted on the mounting block (207), a transport plate (209) is fixedly mounted on the output end of the electric telescopic rod (208), a placement groove is provided on the top wall of the transport plate (209), a second rack (210) meshing with the gear (204) is provided on the transport plate (209), and a packaging assembly (3) for packaging semiconductor materials is provided in the box body (1).

2. The automatic semiconductor material packaging machine according to claim 1, characterized in that: The packaging assembly (3) comprises a bottom plate (301) mounted on the bottom wall of a box body (1); a first aluminum foil packaging box (302) and a second aluminum foil packaging box (303) are symmetrically mounted on the top wall of the bottom plate (301); the first aluminum foil packaging box (302) and the second aluminum foil packaging box (303) are both provided with an aluminum foil outlet (304); a guide plate (305) is fixedly mounted on the first aluminum foil packaging box (302); a vacuum box (306) connected to the box body (1) is fixedly mounted on the box body (1); an electric push rod (307) is fixedly mounted on the inner top wall of the box body (1); an electric suction cup (308) is provided on the output end of the electric push rod (307).

3. The automatic semiconductor material packaging machine according to claim 2, characterized in that: The bottom plate (301) is provided with a discharge port, the bottom plate (301) is provided with a mounting groove, a rotating rod (401) is rotatably mounted in the mounting groove, a sealing plate (402) for sealing the discharge port is fixedly mounted on the rotating rod (401), a first magnet block (403) is embedded on the sealing plate (402), a collecting box (404) cooperating with the discharge port is detachably mounted on the bottom wall of the box body (1), a rotating spring (406) is installed between the rotating rod (401) and the mounting groove, and a linkage assembly (5) cooperating with the sealing plate (402) is provided on the electric push rod (307).

4. The automatic semiconductor material packaging machine according to claim 3, characterized in that: The linkage assembly (5) comprises a hot pressing frame (501) fixedly mounted on the output end of the electric push rod (307), a sleeve (502) fixedly mounted on the bottom wall of the hot pressing frame (501), a vertical rod (503) slidably mounted in the sleeve (502), a second spring (504) being installed between the top wall of the vertical rod (503) and the sleeve (502), and the electric suction cup (308) being fixedly mounted on the output end of the vertical rod (503), an electromagnet (505) which repel each other with the first magnet block (403) being fixedly mounted on the hot pressing frame (501), a first switch (506) electrically connected to the electromagnet (505) being provided in the sleeve (502), and a second switch (507) electrically connected to the electromagnet (505) being installed on the inner top wall of the box body (1).

5. The automatic semiconductor material packaging machine according to claim 4, characterized in that: The transport plate (209) is provided with L rows of grooves, in which L rows of baffles (601) are slidably installed, a return spring (602) is installed between the baffles (601) and the grooves, and a second magnet block (603) is embedded in the baffle (601) and attracts the first magnet block (403).

6. The automatic semiconductor material packaging machine according to claim 5, characterized in that: The feeding box (201) is provided with a vertical groove, a vertical plate (701) is slidably installed in the vertical groove, a third spring (702) is installed between the vertical plate (701) and the vertical groove, a connecting rod (703) is fixedly installed on the side wall of the vertical plate (701), and the end of the connecting rod (703) away from the vertical plate (701) is an inclined surface.

7. The automatic semiconductor material packaging machine according to claim 6, characterized in that: The hot pressing frame (501) is provided with a heating wire (8), and a heat insulating layer (9) is provided between the heating wire (8) and the electromagnet (505).

8. The automatic semiconductor material packaging machine according to claim 7, characterized in that: A ball (10) is evenly and rotatably mounted on the top wall of the push plate (202).

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