Wafer electroplating centering device

Abstract

The invention provides a wafer electroplating centering device which comprises a centering table and a centering mechanism, the centering mechanism comprises a driving mechanism and at least three sets of positioning assemblies evenly distributed around the driving mechanism, and the driving mechanism drives the multiple positioning assemblies to be relatively close to each other so as to synchronously abut against the edge of a wafer; the driving mechanism comprises a driving rotating disc, the positioning assembly comprises sliding seats and positioning pins connected to the upper surfaces of the sliding seats, the sliding seats are connected to the upper surface of the centering table in a sliding mode, and the driving assembly drives the multiple sliding seats to be relatively close to or away from each other so that the positioning pins assembled on the upper surfaces of the sliding seats can clamp or loosen wafers; the wafer centering device is used for solving the problems that in the prior art, the structure is complex, and the centering cost is high, and meanwhile wafer damage is not prone to being caused in the centering process.

Description

Technical Field

[0001] The invention relates to the field of semiconductor production processes, and in particular to a wafer electroplating centering device. Background Art

[0002] The wafer manufacturing process includes an electroplating process, in which the front side of the wafer forming device contacts the plating solution and a metal film layer is deposited on the front side of the wafer to achieve electrical interconnection between multiple devices formed on the front side of the wafer. The electroplating process includes vertical electroplating (i.e., rack plating) and horizontal electroplating (i.e., flat plating). The rack plating process requires the wafer to be immersed in the plating solution as a whole in a vertical posture, so it has the defects of large consumption of plating solution, large chamber required for the plating equipment, and high cost and manufacturing difficulty of the overall plating equipment. The flat plating process only requires the wafer to contact the plating solution in a horizontal posture, so the chamber depth required for the flat plating equipment is smaller, the consumption of plating solution is less, and the overall volume and manufacturing cost of the plating equipment are also lower, so it is becoming a mainstream electroplating equipment.

[0003] When performing wafer flat plating, the wafer is placed into the plating solution in a rotating posture. During the process of the wafer rotating into the plating solution, if there is an offset between the wafer and the rotation axis, it will cause abnormal disturbance of the plating solution during the wafer entering the plating solution, thereby affecting the plating effect of the wafer. Therefore, the wafer needs to be centered to ensure that the wafer can smoothly enter the plating solution for electroplating. The wafer electroplating centering device in the prior art usually adopts an optical centering method to avoid damage to the wafer surface. However, the structure of the optical centering device is relatively complex, which leads to a high cost for the wafer centering step. In view of this, it is necessary to improve the wafer electroplating centering device in the prior art to solve the above problems.

[0004] It should be noted that the above introduction to the background technology is only for the convenience of providing a clear and complete description of the technical solutions of this application and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of this application. Summary of the invention

[0005] The purpose of the present invention is to disclose a wafer electroplating centering device to solve the problems of complex structure and high centering cost in the prior art, while not easily causing wafer damage during the centering process.

[0006] To achieve the above-mentioned object, the present invention provides a wafer electroplating centering device, comprising: a centering platform and a centering mechanism, wherein the centering mechanism comprises a driving mechanism and at least three groups of positioning components evenly distributed around the driving mechanism, wherein the driving mechanism drives a plurality of the positioning components to be relatively close to each other so as to synchronously hold the edge of the wafer; The driving mechanism includes a driving turntable, the positioning assembly includes a sliding seat and a positioning pin connected to the upper surface of the sliding seat, the sliding seat is slidably connected to the upper surface of the centering platform, and the driving assembly drives a plurality of the sliding seats to move relatively close to or away from each other so that the positioning pins assembled on the upper surface of the sliding seat clamp or release the wafer.

[0007] As a further improvement of the present invention, the driving mechanism further includes: a driving assembly, the driving assembly including a driving motor and a driving gear, the driving motor is arranged below the centering platform and the driving end of the driving motor passes through the upper surface of the centering platform and is coaxially fixed with the driving gear; The edge of the driving turntable forms a convex tooth that meshes with the driving gear. A rotating shaft is vertically fixed at the center of the circle on the lower surface of the driving turntable. The rotating shaft is rotatably matched with the centering platform. The driving turntable is evenly distributed with a plurality of arc-shaped guide parts. The angles between the endpoints of each two adjacent guide parts away from the convex tooth and the center of the driving turntable are equal. A guide column is vertically fixed on one end of the upper surface of the sliding seat close to the rotating shaft, and the guide column is inserted into the guide part. The driving end of the driving motor drives the driving gear to rotate to drive the driving turntable to rotate around the rotating shaft. The guide part pushes the guide column to make the several sliding seats approach or move away from each other, and the positioning pin moves with the sliding seat to clamp or release the wafer.

[0008] As a further improvement of the present invention, the positioning pin includes a first positioning pin and a second positioning pin, and a plurality of first positioning pins installed on the upper surface of the sliding seat synchronously clamp the wafer of the first size; The distance between the first positioning pin installed on the upper surface of each sliding seat and the center of the driving turntable is smaller than the distance between the second positioning pin and the center of the driving turntable. The second positioning pins installed on the upper surfaces of multiple sliding seats synchronously clamp the second-size wafer, and the lower surface of the second-size wafer contacts the top of the first positioning pin.

[0009] As a further improvement of the present invention, the positioning pin also has a third positioning pin, and the distance between the second positioning pin installed on the upper surface of each sliding seat and the center of the driving turntable is smaller than the distance between the third positioning pin and the center of the driving turntable. The third positioning pins installed on the upper surfaces of multiple sliding seats synchronously clamp the third size wafer, and the lower surface of the third size wafer contacts the top of the second positioning pin.

[0010] As a further improvement of the present invention, the upper surface of the sliding seat is equipped with a first mounting seat for fixing the first locating pin, a second mounting seat for fixing the second locating pin, and a third mounting seat for fixing the third locating pin. The first locating pin, the second locating pin and the third locating pin are all composed of a locating column and a locating platform surrounding the periphery of the locating column. The top surfaces of the locating columns of the first locating pin and the second locating pin are both formed with round chamfers.

[0011] As a further improvement of the present invention, the positioning components are evenly distributed into six groups around the driving turntable, and the sliding seats of the six groups of positioning components are vertically fixed with a guide column, and the driving turntable forms six guide parts for the guide columns to be embedded in.

[0012] As a further improvement of the present invention, the first mounting seat, the second mounting seat and the third mounting seat are respectively equipped with two first positioning pins, two second positioning pins and two third positioning pins.

[0013] As a further improvement of the present invention, a sensor is arranged below the centering platform, and a clearance opening is provided above the centering platform and above the sensor.

[0014] As a further improvement of the present invention, the upper surface of the centering platform is evenly distributed with sliding blocks having the same number as the sliding seats around the driving turntable, and the lower surface of the sliding seat is fixedly connected with a sliding rail adapted to the sliding blocks along the length direction, and the sliding seat slides relative to the sliding blocks via the sliding rails to slide with the centering platform.

[0015] As a further improvement of the present invention, the sliding seat is equipped with a top column, and the top column is arranged on the upper surface of the sliding seat and is located on the side of the first positioning pin away from the second positioning pin.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: through the wafer electroplating centering device composed of a driving turntable and a plurality of groups of positioning components arranged around the driving turntable, and the positioning components include a sliding seat and a positioning pin, the wafer is placed above the driving turntable before the robot drives the wafer into the electroplating solution for electroplating, and at this time, there is a certain distance between the plurality of positioning pins connected to the sliding seat and the wafer. Then the driving turntable is rotated so that the plurality of sliding seats are relatively close to each other, and at this time, the plurality of sliding seats are relatively close to each other with the rotation of the driving turntable, so that the positioning pins connected to each sliding seat synchronously clamp the edge of the wafer, and the centering of the wafer is completed at this time, and then the driving turntable is rotated in the opposite direction, and the plurality of sliding seats simultaneously drive the positioning pins to loosen the edge of the wafer. Through the above steps, several positioning pins connected to the sliding seats are close to the wafer at the same time. When the wafer has an eccentricity problem, the positioning pins that approach the center synchronously can correct the position of the offset wafer. When multiple positioning pins clamp the edge of the wafer synchronously, the problem of wafer eccentricity can be effectively solved, thereby effectively avoiding the problem of abnormal disturbance of the plating solution during the process from the wafer being supported by the robot to entering the plating solution, thereby ensuring the electroplating effect of the wafer.

[0017] Secondly, the positioning pins include a first positioning pin, a second positioning pin, and a third positioning pin which are sequentially distributed along the length direction of the sliding seat, which can achieve the effect of centering wafers of three sizes, and when centering the first-size wafer, the top column connected to the upper surface of the sliding seat and located on the inner side of the first positioning pin supports the first-size wafer, and the first-size wafer is centered by the first positioning pin until the first-size wafer is taken out by a robot after the first-size wafer is centered. When centering the second-size wafer, the second-size wafer is centered by the second positioning pin, and the second-size wafer is supported by the top of the first-size wafer until the second-size wafer is taken out by a robot after the second-size wafer is centered. When centering the third-size wafer, the third-size wafer is supported by the top of the second positioning pin until the third-size wafer is taken out by a robot after the third-size wafer is centered. Through the above design, the adaptation range of the wafer electroplating centering device is effectively improved, and the centering effect of wafers of three sizes is achieved with a simple structure.

[0018] Finally, the driving mechanism also includes a driving assembly, which is composed of a driving motor and a driving gear. The driving end of the driving motor controls the rotation of the driving gear and then controls the rotation of the driving turntable that meshes with the driving gear. Since the driving gear has a smaller radius than the driving turntable, the rotation of the driving turntable can be more accurately controlled by controlling the rotation of the driving gear through the driving motor, so that the guide columns are forced by the guide parts formed on the driving turntable to control the sliding seats to move closer or farther from each other, thereby achieving the effect of centering the wafer with a relatively simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the wafer electroplating centering device of the present invention; Figure 2 The present invention is used to embody the wafer electroplating centering device and the schematic diagram of three sizes of wafers that are adapted accordingly; Figure 3 This is a schematic diagram of the present invention for reflecting the matching state of various components when the positioning pin is in the wafer centering state; Figure 4 It is a structural schematic diagram of the present invention for reflecting the position relationship between the driving mechanism, the positioning component and the sensor; Figure 5 This is a schematic diagram of the present invention for reflecting the matching state of various components when the positioning pin is in a wafer relaxed state; Figure 6 for Figure 4 Enlarged view of part A in the middle; Figure 7 This is a schematic diagram of the specific structure of the positioning component used in the present invention; Figure 8 for Figure 7 Enlarged view of part B in the middle. DETAILED DESCRIPTION

[0020] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0021] Ginseng Figures 1 to 8As shown, a wafer electroplating centering device disclosed by the present invention is provided. Compared with the prior art, the centering mechanism is composed of a driving mechanism 2 including a driving turntable 21 and a plurality of positioning components 3 arranged around the driving turntable 21, and the positioning components 3 include a sliding seat 31 and a positioning pin 32. Before the robot drives the wafer 4 into the electroplating solution for electroplating, the wafer 4 is first placed above the driving turntable 21. At this time, there is a certain distance between the plurality of positioning pins 32 connected to the sliding seat 31 and the wafer 4. Then the driving turntable 21 is rotated so that the plurality of sliding seats 31 are relatively close to each other. At this time, the plurality of sliding seats 31 are relatively close to each other with the rotation of the driving turntable 21, so that the positioning pins 32 connected to each sliding seat 31 synchronously clamp the edge of the wafer 4. At this time, the centering of the wafer 4 is completed, and then the driving turntable 21 is rotated in the opposite direction, and the plurality of sliding seats 31 simultaneously drive the positioning pins 32 to release the edge of the wafer 4. Through the above steps, the positioning pins 32 connected to the sliding seats 31 are close to the wafer 4 at the same time. When the wafer 4 has an eccentricity problem, the positioning pins 32 that are synchronously close to the center can correct the position of the offset wafer 4. When multiple positioning pins 32 synchronously clamp the edge of the wafer 4, the eccentricity problem of the wafer 4 can be effectively solved. Then the robot arm (not shown) removes the wafer 4 from the centering mechanism and transfers it to the supporting device of the wafer flat plating equipment, thereby effectively avoiding the problem of abnormal disturbance of the plating solution caused by the wafer 4 being supported by the supporting device of the wafer flat plating equipment and entering the plating solution in a rotating posture, thereby effectively ensuring the electroplating effect of the wafer 4.

[0022] Ginseng Figures 1 to 8 As shown, the wafer electroplating centering device (hereinafter referred to as the centering device) in this embodiment includes: a centering platform 1 and a centering mechanism, the centering mechanism includes a driving mechanism 2 and at least three groups of positioning components 3 evenly distributed around the driving mechanism 2, the driving mechanism 2 drives a number of positioning components 3 to be relatively close to each other so as to synchronously support the edge of the wafer 4; the driving mechanism 2 includes a driving turntable 21, the positioning component 3 includes a sliding seat 31 and a positioning pin 32 connected to the upper surface of the sliding seat 31, the sliding seat 31 is slidably connected to the upper surface of the centering platform 1, and the driving turntable 21 drives a number of sliding seats 31 to be relatively close to or away from each other so that the positioning pin 32 assembled on the upper surface of the sliding seat 31 clamps or releases the wafer 4.

[0023] Before the wafer 4 is electroplated, the wafer 4 is first placed on the centering mechanism by a robot. Specifically, the wafer 4 is located above the driving turntable 21. The wafer 4 is supported by a support device (described later) formed on the sliding seat 31 in a posture parallel to the plane where the driving turntable 21 is located. At this time, there is a certain distance between the positioning pin 32 connected to the sliding seat 31 and the edge of the wafer 4. After the wafer 4 is placed, the driving turntable 21 is rotated so that the plurality of sliding seats 31 distributed around the driving turntable 21 are synchronously displaced, and then the positioning pins 32 connected to the plurality of sliding seats 31 are moved to a position where they synchronously contact the edge of the wafer 4. Since the wafer 4 is only supported by the supporting device formed on the sliding seat 31 but not positioned, when the several positioning pins 32 approach the wafer 4, if the wafer 4 is eccentric, the contact between the several positioning pins 32 and the wafer 4 will occur in sequence, and the positioning pin 32 that first contacts the edge of the wafer 4 will apply a certain thrust to the wafer 4 to cause the wafer 4 to produce a certain displacement toward the center of the driving turntable 21, until the several positioning pins 32 synchronously contact the edge of the wafer 4, indicating that the correction of the wafer 4 is completed. The driving turntable 21 is then rotated in the opposite direction to displace the plurality of positioning pins 32 in a direction away from the center of the driving turntable 21 until the edge of the wafer 4 is released, and then a robot (not shown) disposed between the centering device and the wafer electroplating device (not shown) transfers the wafer to the supporting device of the wafer electroplating device (not shown). Since the wafer 4 has undergone the correction process of the aforementioned centering device, during the process in which the supporting device of the wafer electroplating device drives the wafer 4 to be immersed in the plating solution in a rotating posture, the wafer 4 can be in a state of coaxial rotation with the supporting device, thereby effectively avoiding the problem in the prior art that the plating solution is disturbed due to the offset between the wafer 4 and the rotation axis, thereby affecting the electroplating effect of the wafer 4.

[0024] Ginseng Figures 2 to 8As shown, the driving mechanism also includes: a driving assembly 22, the driving assembly 22 includes a driving motor 221 and a driving gear 222, the driving motor 221 is arranged below the centering platform 1, and the driving end of the driving motor 221 passes through the upper surface of the centering platform 1 and is coaxially fixed with the driving gear 222; the edge of the driving turntable 21 forms a convex tooth 213 that meshes with the driving gear 222, the center of the circle of the lower surface of the driving turntable 21 is vertically fixed with a rotating shaft 211, the rotating shaft 211 is rotatably matched with the centering platform 1, and the driving turntable 21 is evenly distributed with a plurality of arc-shaped guide portions 21 2, the included angles between the end points of each two adjacent guide parts 212 away from the convex teeth 213 and the line center of the driving turntable 21 are all equal; the upper surface of the sliding seat 31 is close to the end of the rotating shaft 211 to vertically fix the guide column 311, the guide column 311 is penetrated in the guide part 212, the driving end of the driving motor 221 drives the driving gear 222 to rotate to drive the driving turntable 21 to rotate with the rotating shaft 211 as the axis, the guide part 212 pushes the guide column 311 to make the plurality of sliding seats 31 approach or move away from each other, and the positioning pin 32 moves with the sliding seat 31 to clamp or release the wafer 4.

[0025] Ginseng Figures 1 to 5 As shown, the positioning components 3 are evenly distributed in six groups around the driving turntable 21. The sliding seats 31 of the six groups of positioning components 3 are all vertically fixed with a guide column 311, and the driving turntable 21 forms six guide parts 212 for the guide columns 311 to be embedded. The upper surface of the centering platform 1 is evenly distributed with the same number of sliding seats 31 around the driving turntable 21. The lower surface of the sliding seat 31 is fixedly connected to the sliding rail 312 adapted to the sliding seat 11 along the length direction. The sliding seat 31 slides relative to the sliding seat 11 through the sliding rail 312 to slide with the centering platform 1. A sensor 13 is set below the centering platform 1, and the centering platform 1 is provided with a clearance opening 12 above the sensor 13.

[0026] When the wafer 4 is placed on the driving turntable 21 in a posture parallel to the plane where the driving turntable 21 is located and the positioning pins 32 connected to the upper surfaces of the six groups of sliding seats 31 are all at positions away from the edge of the wafer 4 (see Figure 5As shown in the figure, the sensing area of ​​the sensor 13 disposed below the centering stage 1 senses that the wafer 4 is placed above the driving turntable 21 through the clearance opening 12, that is, the driving motor 221 is driven to drive the driving gear 222 coaxially fixed therewith to rotate, and the driving turntable 21 meshed with the driving gear 222 through the convex teeth 213 rotates with the rotating shaft 211 as the axis. The driving end of the driving motor 221 controls the rotation of the driving gear 222 and then controls the rotation of the driving turntable 21 meshed with the driving gear 222. Since the driving gear 222 has a smaller radius than the driving turntable 21, the driving motor 221 controls the rotation of the driving gear 222 to more accurately control the angle of rotation of the driving turntable 21, so that the guide portions 212 formed on the driving turntable 21 exert force on the guide column 311 to control the plurality of sliding seats 31 to move closer or farther from each other, thereby achieving the effect of centering the wafer 4 with a relatively simple structure.

[0027] It should be noted that, in this embodiment, the guide portion 212 is configured as an arc-shaped hollow portion that penetrates the driving turntable 21. Figure 5 The schematic diagram shows a state where the positioning pin 32 is in a state of releasing the edge of the wafer 4. In this state, the guide posts 311 of the six sliding seats 31 are respectively located at relatively central positions in the guide portion 212. When the wafer 4 is placed above the driving turntable 21, the sensing area of ​​the sensor 13 configured as an infrared sensor recognizes the presence of the wafer 4 and then drives the driving motor 221 electrically connected thereto to start, and the driving gear 222 coaxially fixed to the driving end of the driving motor 221 then drives the driving turntable 21 to rotate. Figure 5 Rotate in the direction of the arrow to Figure 3 See also Figure 1 and Figure 2 Shown with Figure 3 Schematic diagrams showing the guide post 311 being located at the same position in the guide portion 212 from different viewing angles.

[0028] It should be noted that when the driving turntable 21 is Figure 5 The state shown and turn in the direction indicated by the arrow to Figure 3During the process of the state shown, the guide portion 212 formed on the driving turntable 21 rotates together with the driving turntable 21, so that the guide portion 212 applies a thrust to the guide column 311 penetrating therein, and the guide column 311 further applies the thrust received to the sliding seat 31, so that the six sliding seats 31 are simultaneously pulled by the guide column 311 and guided by the slide rail 312 and the slider 11 along the radial direction of the driving turntable 21 toward the center of the driving turntable 21, until the six guide columns 311 respectively contact one end of the six guide portions 212 close to the rotating shaft 211, at which time the positioning pins 32 respectively connected to the six sliding seats 31 hold the edge of the wafer 4 after correcting the deviation and centering the wafer 4 as described above. After the centering is completed, the driving motor 221 is started again so that the driving gear 222 drives the driving turntable 21 to move from Figure 3 The status is shown and Figure 5 The guide portion 212 rotates in the opposite direction of the arrow shown in the figure, and in this process, the guide portion 212 rotates together with the driving rotary disk 21 again, and the hole wall opposite to the above-mentioned guide portion 212 applies a thrust to the other side of the guide column 311 during the rotation process, so that the sliding seat 31 moves in the radial direction of the driving rotary disk 21 away from the center of the driving rotary disk 21 under the thrust applied by the guide portion 212 and the guidance of the slide rail 312 and the slider 11, until the guide column 311 returns to the center of the driving rotary disk 21 again. Figure 5 As shown, the wafer 4 is located in a relatively centered position in the guide portion 212 , and a plurality of positioning pins 32 simultaneously release the edge of the wafer 4 so that the robot arm can remove the wafer 4 from the centering device.

[0029] Ginseng Figures 2 to 8 As shown, the positioning pins 32 include a first positioning pin 321 and a second positioning pin 322. The first positioning pins 321 installed on the upper surface of the plurality of sliding seats 31 synchronously clamp the first size wafer 41; the distance between the first positioning pin 321 installed on the upper surface of each sliding seat 31 and the center of the driving turntable 21 is smaller than the distance between the second positioning pin 322 and the center of the driving turntable 21; the second positioning pins 322 installed on the upper surface of the plurality of sliding seats 31 synchronously clamp the second size wafer 42, and the lower surface of the second size wafer 42 contacts the top of the first positioning pin 321. The positioning pins 32 also have a third positioning pin 323. The distance between the second positioning pin 322 installed on the upper surface of each sliding seat 31 and the center of the driving turntable 21 is smaller than the distance between the third positioning pin 323 and the center of the driving turntable 21; the third positioning pins 323 installed on the upper surface of the plurality of sliding seats 31 synchronously clamp the third size wafer 43, and the lower surface of the third size wafer 43 contacts the top of the second positioning pin 322.

[0030] Ginseng Figures 6 to 8As shown, the upper surface of the sliding seat 31 is equipped with a first mounting seat 313 for fixing the first positioning pin 321, a second mounting seat 314 for fixing the second positioning pin 322, and a third mounting seat 315 for fixing the third positioning pin 323. The first positioning pin 321, the second positioning pin 322, and the third positioning pin 323 are all composed of a positioning column 325 and a positioning platform 326 surrounding the periphery of the positioning column 325. The top surfaces of the positioning columns 325 of the first positioning pin 321 and the second positioning pin 322 are both formed with round chamfers 324. The first mounting seat 313, the second mounting seat 314, and the third mounting seat 315 are respectively equipped with two first positioning pins 321, two second positioning pins 322, and two third positioning pins 323. The sliding seat 31 is equipped with a top column 33, which is arranged on the upper surface of the sliding seat 31 and is located on the side of the first positioning pin 321 away from the second positioning pin 322.

[0031] It should be noted that the wafer 4 has various sizes ranging from 2 inches to 12 inches. In order to meet the centering needs of wafers 4 of various sizes, in this embodiment, the first positioning pin 321, the second positioning pin 322 and the third positioning pin 323 distributed along the length direction of the sliding seat 31 are used to clamp the three sizes of wafers 4. Specifically, the first size wafer 41, the second size wafer 42 and the third size wafer 43 recorded above are the three mainstream production sizes of wafers 4, namely 6 inches, 8 inches and 12 inches. When the first-size wafer 41 needs to be centered, the top columns 33 formed on the six sliding seats 31 are used as a supporting device to support the first-size wafer 41, and then the sliding seat 31 is displaced toward the center direction of the driving turntable 21 so that the first positioning pin 321 of each sliding seat 31 simultaneously clamps the edge of the first-size wafer 41, thereby achieving the purpose of centering the first-size wafer 41. For the specific process of driving the sliding seat 31 to move by the driving turntable 21, please refer to the above record and will not be repeated here.

[0032] When the second-size wafer 42 needs to be centered, the first positioning pins 321 formed on the six sliding seats 31 serve as supporting devices to support the second-size wafer 42. Since the first positioning pins 321 are mounted on the upper surface of the sliding seat 31 through the first mounting seat 313 and the top column 33 is directly mounted on the upper surface of the sliding seat 31, the top of the first positioning pins 321 is higher than the top column 33, so that the second-size wafer 42 supported by the first positioning pins 321 can be clamped by the second positioning pins 322. Then the sliding seat 31 is displaced toward the center direction of the driving turntable 21 so that the second positioning pins 322 of each sliding seat 31 can simultaneously clamp the edge of the second-size wafer 42, thereby achieving the purpose of centering the second-size wafer 42. For the specific process of driving the sliding seat 31 to move by the driving turntable 21, please refer to the above record, which will not be repeated here.

[0033] When the third-size wafer 43 needs to be centered, the second positioning pins 322 formed on the six sliding seats 31 are used as a supporting device to support the third-size wafer 43. Since the top of the second positioning pin 322 is higher than the first positioning pin 321, the third-size wafer 43 supported by the second positioning pin 322 can be clamped by the third positioning pin 323. Then the sliding seat 31 is displaced toward the center direction of the driving turntable 21 so that the third positioning pin 323 of each sliding seat 31 simultaneously clamps the edge of the third-size wafer 43, thereby achieving the purpose of centering the third-size wafer 43. For the specific process of driving the sliding seat 31 to move by the driving turntable 21, please refer to the above record, which will not be repeated here. By arranging the first positioning pin 321, the second positioning pin 322 and the third positioning pin 323, the first size wafer 41, the second size wafer 42 and the third size wafer 43 can be centered and positioned in the horizontal direction, and a height difference can be formed in the vertical direction to support the first size wafer 41, the second size wafer 42 and the third size wafer 43, thereby achieving the effect of centering the three sizes of wafers at the same time with a relatively compact and simple structure.

[0034] Furthermore, since the first positioning pin 321, the second positioning pin 322 and the third positioning pin 323 are all composed of the positioning column 325 and the positioning platform 326, when the first size wafer 41, the second size wafer 42 or the third size wafer is centered and positioned, the positioning column 325 is in contact with its side wall, and the top wall of the positioning platform 326 simultaneously plays a certain supporting role on the lower surface of the first size wafer 41, the second size wafer 42 or the third size wafer 43. In addition, the rounded chamfer 324 formed on the top of the positioning column 325 can effectively reduce the contact area during the support process of the first size wafer 41, the second size wafer 42 or the third size wafer 43, thereby reducing the possibility of scratching the bottom surface of the first size wafer 41, the second size wafer 42 or the third size wafer 43.

[0035] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0036] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0037] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer electroplating centering device, characterized in that: include: A centering platform and a centering mechanism, wherein the centering mechanism comprises a driving mechanism and at least three groups of positioning components uniformly distributed around the driving mechanism, wherein the driving mechanism drives a plurality of the positioning components to be relatively close to each other so as to synchronously hold the edge of the wafer; The driving mechanism includes a driving turntable, the positioning assembly includes a sliding seat and a positioning pin connected to the upper surface of the sliding seat, the sliding seat is slidably connected to the upper surface of the centering platform, and the driving assembly drives a plurality of the sliding seats to move relatively close to or away from each other so that the positioning pins assembled on the upper surface of the sliding seat clamp or release the wafer.

2. The wafer electroplating centering device according to claim 1, characterized in that: The driving mechanism further includes: a driving assembly, the driving assembly including a driving motor and a driving gear, the driving motor is arranged below the centering platform and the driving end of the driving motor passes through the upper surface of the centering platform and is coaxially fixed with the driving gear; The edge of the driving turntable forms a convex tooth that meshes with the driving gear. A rotating shaft is vertically fixed at the center of the circle on the lower surface of the driving turntable. The rotating shaft is rotatably matched with the centering platform. The driving turntable is evenly distributed with a plurality of arc-shaped guide parts. The angles between the endpoints of each two adjacent guide parts away from the convex tooth and the center of the driving turntable are equal. A guide column is vertically fixed on one end of the upper surface of the sliding seat close to the rotating shaft, and the guide column is inserted into the guide part. The driving end of the driving motor drives the driving gear to rotate to drive the driving turntable to rotate around the rotating shaft. The guide part pushes the guide column to make the several sliding seats approach or move away from each other, and the positioning pin moves with the sliding seat to clamp or release the wafer.

3. The wafer electroplating centering device according to claim 2, characterized in that: The positioning pins include a first positioning pin and a second positioning pin, and a plurality of first positioning pins installed on the upper surface of the sliding seat synchronously clamp a wafer of a first size; The distance between the first positioning pin installed on the upper surface of each sliding seat and the center of the driving turntable is smaller than the distance between the second positioning pin and the center of the driving turntable. The second positioning pins installed on the upper surfaces of multiple sliding seats synchronously clamp the second-size wafer, and the lower surface of the second-size wafer contacts the top of the first positioning pin.

4. The wafer electroplating centering device according to claim 3, characterized in that: The positioning pin also has a third positioning pin. The distance between the second positioning pin installed on the upper surface of each sliding seat and the center of the driving turntable is smaller than the distance between the third positioning pin and the center of the driving turntable. The third positioning pins installed on the upper surfaces of multiple sliding seats synchronously clamp the third-size wafer, and the lower surface of the third-size wafer contacts the top of the second positioning pin.

5. The wafer electroplating centering device according to claim 4, characterized in that: The upper surface of the sliding seat is equipped with a first mounting seat for fixing a first locating pin, a second mounting seat for fixing a second locating pin, and a third mounting seat for fixing a third locating pin. The first locating pin, the second locating pin, and the third locating pin are all composed of a locating column and a locating platform surrounding the periphery of the locating column. The top surfaces of the locating columns of the first locating pin and the second locating pin are both formed with round chamfers.

6. The wafer electroplating centering device according to claim 2, characterized in that: The positioning components are evenly distributed into six groups around the driving turntable. The sliding seats of the six groups of positioning components are vertically fixed with a guide column. The driving turntable forms six guide parts for the guide columns to be embedded in.

7. The wafer electroplating centering device according to claim 5, characterized in that: The first mounting seat, the second mounting seat and the third mounting seat are respectively equipped with two first positioning pins, two second positioning pins and two third positioning pins.

8. The wafer electroplating centering device according to claim 2, characterized in that: A sensor is arranged below the centering platform, and a yielding opening is arranged above the centering platform and above the sensor.

9. The wafer electroplating centering device according to claim 6, characterized in that: The upper surface of the centering platform is evenly distributed with sliding blocks having the same number as the sliding seat around the driving turntable, and the lower surface of the sliding seat is fixedly connected with a sliding rail adapted to the sliding block along the length direction. The sliding seat slides relative to the sliding block via the sliding rail to slide with the centering platform.

10. The wafer electroplating centering device according to claim 7, characterized in that: The sliding seat is equipped with a top column, and the top column is arranged on the upper surface of the sliding seat and is located on a side of the first positioning pin away from the second positioning pin.

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