Single-wafer electroplating equipment with multi-process capability

Abstract

The single-wafer electroplating equipment with the multi-process capability comprises a workbench, the workbench is of a circular structure, a rotating disc is arranged in the center of the workbench and driven by a motor, a mechanical arm is arranged on the rotating disc, a suction cup is arranged on the mechanical arm, and the suction cup is arranged on the workbench. An electroplating station, a cleaning station, a drying station and a discharging station are arranged on the workbench in the clockwise or anticlockwise direction and distributed around the rotary disc in an annular array mode. The mechanical arm adsorbs the single wafers on the electroplating station through the suction cup and then sequentially passes through the cleaning station to be cleaned, the drying station to be dried and the discharging station to be output. According to the invention, electroplating, cleaning, drying and discharging are reasonably combined, the process requirements are met, the transfer time of the wafer between different devices is reduced, and the production efficiency is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating equipment, and in particular to a single wafer electroplating equipment with multi-process capabilities. Background Art

[0002] In the semiconductor manufacturing process, the electroplating process is a key step in forming structures such as metal interconnect layers, bumps, and redistribution layers (RDL). With the continuous development of semiconductor technology, the wafer size has gradually increased, and the process complexity has continued to increase. Traditional batch electroplating equipment has been unable to meet the needs of high precision, high efficiency, and multi-process compatibility. Single-wafer electroplating equipment has gradually become mainstream because it can achieve higher process control accuracy and flexibility.

[0003] However, existing single-wafer electroplating equipment can usually only support a single electroplating process, and it is difficult to switch between multiple electroplating processes in the same equipment, resulting in low production efficiency and increased equipment costs. Therefore, it is of great practical significance to develop a single-wafer electroplating equipment with multi-process capabilities that can achieve rapid switching between multiple electroplating processes in the same equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a single wafer electroplating device combining multiple processes in order to address the defects and shortcomings of the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a single-wafer electroplating equipment with multi-process capabilities, including a workbench, and its innovation lies in: the workbench is a circular structure, and a turntable is arranged in the center, the turntable is driven by a motor, a robotic arm is arranged on the turntable, and a suction cup is arranged on the robotic arm. The workbench is respectively provided with an electroplating station, a cleaning station, a drying station and a discharge station in a clockwise or counterclockwise direction, and distributed in a circular array around the turntable; the robotic arm absorbs the single wafer on the electroplating station through the suction cup, and then passes through the cleaning station for cleaning, the drying station for drying, and the discharge station for output in turn.

[0006] Furthermore, the electroplating station includes an electroplating tank, and an electroplating plate is arranged at the bottom of the electroplating tank.

[0007] Furthermore, the cleaning station includes a cleaning tank, a plurality of support rods are arrayed inside the cleaning tank, a water tank is opened at the bottom of the cleaning tank, the water tank and the cleaning tank are connected by a plurality of water outlets, a water inlet is opened on one side of the water tank, and the water inlet is connected to an external water source and a water pump.

[0008] Furthermore, some of the water outlet holes extend to the side wall of the cleaning tank.

[0009] Furthermore, a drain outlet is arranged on the side of the cleaning tank, and the drain outlet is staggered with the water outlet.

[0010] Furthermore, the drying station comprises a drying tank, a plurality of support columns and heating tubes are arranged in an array at the bottom of the drying tank, an air inlet channel is opened on the side of the drying tank, and the air inlet channel is connected to an external hot air source.

[0011] Furthermore, a drainage channel is provided on the side of the drying tank, and the drainage channel is located on a side away from the air inlet channel.

[0012] Furthermore, the discharging station includes a positioning groove, a conveyor belt is arranged inside the positioning groove, and a material tray is placed on the conveyor belt.

[0013] After adopting the above structure, the beneficial effects of the present invention are:

[0014] The present invention reasonably combines electroplating, cleaning, drying and discharging to meet process requirements, reduce the transfer time of wafers between different equipment, and further improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the top view of the structure of the present invention;

[0016] Figure 2 It is a structural schematic diagram of the electroplating station in the present invention;

[0017] Figure 3 It is a structural schematic diagram of the cleaning station in the present invention;

[0018] Figure 4 It is a structural schematic diagram of the drying station in the present invention.

[0019] Description of reference numerals:

[0020] 1 workbench, 2 turntable, 3 robotic arm, 4 suction cup, 5 electroplating station, 51 electroplating tank, 52 electroplating plate, 6 cleaning station, 61 cleaning tank, 62 support rod, 63 water tank, 64 water outlet, 65 water inlet, 66 drain outlet, 7 drying station, 71 drying tank, 72 support column, 73 heating tube, 74 air inlet channel, 75 drain channel, 8 discharging station, 81 positioning slot, 82 conveyor belt, 83 material tray. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] See also Figure 1-4 A single wafer electroplating equipment with multi-process capabilities includes a workbench 1, which is a circular structure with a turntable 2 arranged in the center. The turntable 2 is driven by a motor, a mechanical arm 3 is arranged on the turntable 2, and a suction cup 4 is arranged on the mechanical arm 3. The workbench 1 is respectively provided with an electroplating station 5, a cleaning station 6, a drying station 7 and a discharge station 8 in a clockwise or counterclockwise direction, and are distributed in a circular array around the turntable 2; the mechanical arm 3 absorbs the single wafer on the electroplating station through the suction cup 4, and then passes through the cleaning station for cleaning, the drying station for drying, and the discharge station for output. Specifically, the wafer is first placed on the electroplating station 5 for electroplating operation. After the electroplating is completed, the robot arm 3 adsorbs the wafer through the suction cup 4, and then rotates through the turntable 2 and faces the cleaning station 6. The suction cup is released, and the wafer is placed in the cleaning station 6 for cleaning. After the cleaning is completed, the wafer is adsorbed by the suction cup 4 again, and rotated to the drying station 7 through the turntable 2. The suction cup is released, and the wafer is placed on the drying station 7 for drying. After the drying is completed, the wafer is adsorbed by the suction cup 4 again, and rotated to the unloading station 8 through the turntable 2. The suction cup is released, and the wafer is placed on the unloading station 8 for output. Therefore, the present application reasonably combines multiple processes, shortens the transfer time between processes, and improves work efficiency; the driving motor of the turntable 2 is preferably a stepper motor or a servo motor, and is directly connected or connected by a reduction gear transmission; the suction cup 4 adopts a vacuum suction cup to avoid damage to the wafer and enhance the adsorption force.

[0024] See also Figure 2 The electroplating station 5 comprises an electroplating tank 51, and an electroplating plate 52 is arranged at the bottom of the electroplating tank 51. The wafer is placed in the electroplating tank 51, and the bottom is in contact with the electroplating plate 52, and the bottom of the wafer is electroplated.

[0025] See also Figure 3 The cleaning station 6 includes a cleaning tank 61, and a plurality of support rods 62 are arranged in an array inside the cleaning tank 61. A water tank 63 is provided at the bottom of the cleaning tank 61, and the water tank 63 is connected to the cleaning tank 61 by a plurality of water outlets 64. A water inlet 65 is provided on one side of the water tank 63, and the water inlet is connected to an external water source and a water pump. The support rods 62 are used to support the wafers. After the cleaning liquid enters from the water inlet 65, it cleans the wafers through the water tank 63 and the water outlet 64. The support rods 62 are made of silicone, and the top is an arc-shaped structure to avoid damage to the wafers. The support rods 62 are preferably distributed in a circular array.

[0026] In this embodiment, some of the water outlet holes 64 extend to the side wall of the cleaning tank, and the upper surface of the wafer can be cleaned at the same time.

[0027] In this embodiment, a drain port 66 is disposed on the side of the cleaning tank 61, and the drain port 66 is staggered with the water outlet 64. The drain port 66 can discharge sewage.

[0028] See also Figure 4 The drying station 7 includes a drying tank 71. A plurality of support columns 72 and a heating tube 73 are arranged in an array at the bottom of the drying tank 71. An air inlet channel 74 is provided on the side of the drying tank 71. The air inlet channel 74 is connected to an external hot air source. The support columns 72 are used to support the wafers. The heating tube 73 generates heat. The air inlet channel 74 inputs hot air to dry the upper and lower surfaces of the wafers respectively. The support columns 72 are made of silicone and have an arc-shaped structure at the top to avoid damage to the wafers. The support columns 72 are preferably distributed in a rectangular array to facilitate the heating tubes.

[0029] In this embodiment, a drainage channel 75 is further provided on the side of the drying tank 71, and the drainage channel 75 is located on a side away from the air inlet channel. The drainage channel 75 is also convenient for draining liquid.

[0030] In this embodiment, the unloading station 8 includes a positioning groove 81, a conveyor belt 82 is arranged inside the positioning groove 81, and a material tray 83 is placed on the conveyor belt 82. The positioning groove 81 installs and positions the conveyor belt 82, and the material tray 83 is used to place wafers; the conveyor belt 82 is driven by a servo motor.

[0031] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A single wafer electroplating device with multi-process capabilities, comprising a workbench, characterized in that: The workbench is a circular structure, and a turntable is arranged in the center. The turntable is driven by a motor. A robotic arm is arranged on the turntable, and a suction cup is arranged on the robotic arm. The workbench is respectively provided with an electroplating station, a cleaning station, a drying station and a discharge station in a clockwise or counterclockwise direction, and are distributed in a circular array around the turntable; the robotic arm absorbs the single wafer on the electroplating station through the suction cup, and then passes through the cleaning station for cleaning, the drying station for drying, and the discharge station for output in sequence.

2. The single wafer electroplating equipment with multi-process capability according to claim 1, characterized in that: The electroplating station comprises an electroplating tank, and an electroplating plate is arranged at the bottom of the electroplating tank.

3. The single wafer electroplating equipment with multi-process capability according to claim 1, characterized in that: The cleaning station includes a cleaning tank, a plurality of support rods are arrayed inside the cleaning tank, a water tank is provided at the bottom of the cleaning tank, the water tank and the cleaning tank are connected by a plurality of water outlets, a water inlet is provided on one side of the water tank, and the water inlet is connected to an external water source and a water pump.

4. The single wafer electroplating equipment with multi-process capability according to claim 3, characterized in that: Some of the water outlet holes extend to the side wall of the cleaning tank.

5. The single wafer electroplating equipment with multi-process capability according to claim 3, characterized in that: A drainage port is arranged on the side of the cleaning tank, and the drainage port is staggered with the water outlet.

6. The single wafer electroplating equipment with multi-process capability according to claim 1, characterized in that: The drying station comprises a drying tank, a plurality of supporting columns and heating tubes are arranged in an array at the bottom of the drying tank, an air inlet channel is provided on the side of the drying tank, and the air inlet channel is connected to an external hot air source.

7. The single wafer electroplating equipment with multi-process capability according to claim 6, characterized in that: A drainage channel is also arranged on the side of the drying tank, and the drainage channel is located on a side away from the air inlet channel.

8. The single wafer electroplating equipment with multi-process capability according to claim 1, characterized in that: The discharging station comprises a positioning groove, a conveyor belt is arranged inside the positioning groove, and a material tray is placed on the conveyor belt.

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