Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and internal electrodes with the dielectric layer interposed between the internal electrodes; and an external electrode disposed on the body, in which the external electrode includes: a lower electrode layer including copper (Cu) and in contact with the internal electrode; an upper electrode layer including silver (Ag) and disposed on the lower electrode layer; an alloy layer including a copper (Cu)-silver (Ag) alloy and disposed at an interface between the lower electrode layer and the upper electrode layer; and an oxidized region including copper oxide and disposed on at least a portion of an outer surface of the lower electrode layer.

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