Rapid wafer feeding mechanism based on flame cracking process

Abstract

The invention discloses a wafer rapid feeding mechanism based on a flame cracking process, which comprises a processing box and a wafer, and further comprises an operation table fixedly arranged on the processing box and used for placing the wafer for flame cracking; and the multiple sets of L-shaped sliding rails are fixedly arranged on the lower surface of the operation table. According to the invention, the position and angle of the wafer can be accurately controlled by moving the wafer in the vertical direction and adopting positive and negative pressure adsorption, and the wafer is ensured to enter a cracking area in a correct posture, so that a uniform cracking effect is favorably obtained, each wafer in the cracking process can be subjected to the same heat treatment, and the cracking efficiency is improved. The device can be in butt joint with an airflow system more easily, so that airflow distribution is optimized, cracking efficiency is improved, cross contamination is avoided, thermal insulation treatment is carried out while cracking is carried out, temperature stability can be ensured, uniform deposition of a film is facilitated, and negative effects on film quality caused by local overheating or supercooling are avoided; therefore, the process consistency and the wafer performance are improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a wafer rapid feeding mechanism based on a flame cracking process. Background Art

[0002] Wafers are thin sheets used in the semiconductor manufacturing process, usually made of single crystal silicon or other materials. They are the basis of integrated circuits and other microelectronic devices. Wafers play an important role in multiple processes of semiconductor manufacturing. After a series of processing steps (such as photolithography, etching, doping, etc.), various microelectronic components will be formed on the wafer. In the semiconductor manufacturing process, flame cracking of wafers can clean or fine-tune the wafer surface and remove organic pollutants, oxides or other residues on the wafer surface.

[0003] When the wafer is flame-cracking, the wafer needs to be moved from a horizontal position to a processing table. During this process, the temperature of the flame cracking process may change the surface and edge morphology of the wafer, and the wafer may no longer be completely flat, which will affect the aerodynamic effect. In particular, when taking and placing the wafer, the wafer may be affected by the airflow, causing the wafer to tilt or slide. At the same time, during the process of taking out and placing the wafer, the wafer may be contaminated by dust, pollutants or chemicals in the environment. The placement time of the wafer also needs to be improved. Therefore, a wafer rapid loading mechanism based on the flame cracking process is urgently needed to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a wafer rapid feeding mechanism based on a flame cracking process to solve the above-mentioned deficiencies in the prior art.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A wafer rapid feeding mechanism based on flame cracking process, comprising a processing box and a wafer, and also comprising:

[0007] An operating table, which is fixedly arranged on the processing box and is used to place wafers for flame cracking;

[0008] Multiple sets of L-shaped slide rails, each of which is fixedly arranged on the lower surface of the operating table and located inside the processing box;

[0009] Two rotating shafts, both rotating shafts are rotatably arranged on the operating table;

[0010] A telescopic hole is provided on the operating table, and two rotating shafts are rotatably arranged in the telescopic hole;

[0011] The heat-insulating processing structure is installed between the operating table and the two rotating shafts to isolate the high temperature generated when the operating table processes the wafers and maintain the temperature in the processing box stable;

[0012] A plurality of rotating rods three are rotatably mounted in the processing box;

[0013] Two moving tubes, both of which are slidably arranged between the corresponding two groups of L-shaped slide rails, each of which is equipped with a stabilizing structure, which is used to maintain the stability of the wafer during movement, and both ends of the two moving tubes are fixedly equipped with a gear rod 1, a gear rod 2 and a gear rod 3;

[0014] A plurality of short shafts are rotatably arranged in a processing box, a pulley is fixedly installed at one end of each of the short shafts, a transmission structure is arranged between each two sets of pulleys, and the transmission structure is used to transmit the wafers to wait for subsequent flame cracking.

[0015] Preferably, the thermal insulation processing structure includes two rotating rings rotatably arranged on two rotating shafts respectively, and the two rotating rings are rotatably arranged in the telescopic hole, two pull ropes are fixedly installed on each of the rotating rings, a thermal insulation board is fixedly installed between every two pull ropes, two springs are commonly fixedly installed between the two thermal insulation boards, and the two thermal insulation boards are slidably arranged in the telescopic hole, and a separation component for pulling the two thermal insulation boards apart is provided in the processing box.

[0016] Preferably, the separation component comprises a rotating roller 1 respectively fixedly arranged at one end of a plurality of rotating rods 3, and a transmission belt 2 is arranged between the plurality of rotating rollers 1 and the corresponding rotating rings.

[0017] Preferably, two placement plates are slidably arranged in the telescopic hole, magnets are arranged inside the two placement plates, and the two magnets attract each other, displacement grooves are opened at positions where the two placement plates are close to each other, and two pull ropes are arranged between the two placement plates and the corresponding rotating shafts.

[0018] Preferably, each of the rotating rods three is rotatably provided with a one-way bearing two, and each of the one-way bearings two is rotatably installed on the outer side thereof, and each of the rotating rods three is fixedly provided with a gear two at one end thereof, and the gear two is engaged with the gear rod three for use. When the gear rod three slides upward in the L-shaped slide rail, the one-way bearing two rotates, and a transmission belt one is provided for rotating together between each of the rollers two and the corresponding rotating shaft.

[0019] Preferably, multiple rotating rods 2 are rotatably installed in the processing box, and a rotating roller 3 is fixedly installed at one end of each rotating rod 2. A one-way bearing 3 is rotatably installed on each rotating rod 2, and a gear 3 is rotatably installed on each one-way bearing 3. The gear 3 is engaged with the gear rod 2 for use. When the gear rod 2 slides downward in the L-shaped slide rail, the one-way bearing 3 rotates. A pulley 4 is fixedly installed on each rotating roller 3 and each rotating shaft, and a transmission belt 3 is rotatably sleeved between the corresponding two pulleys 4.

[0020] Preferably, the stabilizing structure comprises a suction cup fixedly connected to the upper end of the moving tube, two pistons are sealed and slidably disposed inside the moving tube, an elastic rope is fixedly installed between the two pistons, and push rods are fixedly installed on the sides of the two pistons away from each other.

[0021] Preferably, a guide groove is provided on the push rod, and a guide rod is fixedly installed on each of the L-shaped slide rails, the lower end of the guide rod is set at an angle and the upper end is in a vertical state, when the push rod moves from bottom to top to the guide rod position, the lower end of the guide rod slides in the guide groove, so that the two pistons move away from each other, and negative pressure is formed in the suction cup, when the push rod moves to the uppermost end of the L-shaped slide rail, the guide rod is separated from the guide groove, and the elastic rope drives the two pistons to move closer to each other, and positive pressure is formed in the suction cup. At this time, the wafer on the suction cup is located on the operating table.

[0022] Preferably, the conveying structure comprises a conveyor belt rotatably arranged between two pulleys, a plurality of placement rods are evenly and fixedly arranged on the conveyor belt, and the wafers are placed on two placement rods parallel to each other in each two groups of conveying structures.

[0023] Preferably, multiple rotating rods are rotatably arranged in the processing box, and one end of each of the multiple rotating rods is rotatably installed with a one-way bearing, and each of the one-way bearings is rotatably installed with a gear, which is engaged with a gear rod for use. When the gear rod slides downward in the L-shaped slide rail, the one-way bearing rotates, and short rods are fixedly installed on the multiple pulleys above, and a transmission component is installed between each of the short rods and the corresponding rotating rod.

[0024] In the above technical solution, the beneficial effects of the present invention are:

[0025] The wafer rapid loading mechanism based on the flame cracking process moves the wafer in the vertical direction and uses positive and negative pressure adsorption to accurately control the position and angle of the wafer, ensuring that the wafer enters the cracking area with the correct posture, which helps to obtain a uniform cracking effect and ensures that each wafer in the cracking process can receive the same heat treatment. It can be more easily connected to the airflow system to optimize the distribution of airflow, improve cracking efficiency, and avoid cross contamination. Thermal insulation treatment during cracking can ensure temperature stability, which helps to uniformly deposit the film and avoid local overheating or overcooling that has a negative impact on film quality, thereby improving process consistency and wafer performance.

[0026] Space saving: Vertical movement may be more compact and efficient in spatial layout, especially when processing multiple wafers. Vertical transportation may be more in line with process design requirements, thereby saving space and the complexity of mechanical design.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0028] This application document provides an overview of various implementations or examples of the technology described in the present disclosure, and is not a comprehensive disclosure of the entire scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0030] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0031] Figure 2 A schematic diagram of the structure inside a processing box provided by an embodiment of the present invention;

[0032] Figure 3 The embodiment of the present invention provides Figure 2 A top view of

[0033] Figure 4 The embodiment of the present invention provides Figure 3 Structural cross-sectional view along the AA direction;

[0034] Figure 5 A schematic diagram of the structure of a first roller and a second roller provided in an embodiment of the present invention;

[0035] Figure 6A schematic diagram of the structure of a guide rod and an L-shaped slide rail provided in an embodiment of the present invention;

[0036] Figure 7 A schematic diagram of the structure of a moving tube and a suction cup provided in an embodiment of the present invention;

[0037] Figure 8 The embodiment of the present invention provides Figure 7 A top view of

[0038] Fig. 9 The embodiment of the present invention provides Figure 8 Structural cross-sectional view along the BB direction.

[0039] Description of reference numerals:

[0040] 1. Processing box; 2. Operating table; 3. Placement plate; 4. Wafer; 5. Conveyor belt; 6. L-shaped slide rail; 7. Placement rod; 8. Pulley 1; 9. Transmission belt 1; 10. Transmission belt 2; 11. Heat insulation board; 12. Rotating rod 1; 13. Transmission belt 3; 14. Pull rope 1; 15. Conveying assembly; 16. Telescopic hole; 17. Rotating shaft; 18. Rotating ring; 19. Gear 1; 20. Roller 1; 21. Roller 2; 22. One-way bearing 1; 23. One-way bearing 2; 24. Gear 2; 25. Roller 3; 26. Gear 3; 27. Rotating rod 2; 28. Rotating rod 3; 29. ​​Guide rod; 30. Gear rod 1; 31. Gear rod 2; 32. Gear rod 3; 33. Moving tube; 34. Suction cup; 35. Push rod; 36. Guide groove; 37. Elastic rope; 38. Piston. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] See also Figure 1-Figure 5The embodiment of the present invention provides a wafer fast loading mechanism based on flame cracking process, including a processing box 1 and a wafer 4. The front side of the processing box 1 is open to facilitate the placement of the wafer 4. It also includes: an operating table 2, which is fixedly arranged on the processing box 1 and is used to place the wafer 4 for flame cracking; it also includes a plurality of groups of L-shaped slide rails 6, which are electric slide rails. When the power is turned on, the structure installed inside can be driven to slide inside. The plurality of groups of L-shaped slide rails 6 are all fixedly arranged on the lower surface of the operating table 2 and are located inside the processing box 1; it also includes two rotating shafts 17, which are both rotatably arranged in the operating table 2; it also includes a telescopic hole 16, which is opened on the operating table 2, and the two rotating shafts 17 are both rotatably arranged in the telescopic hole 16.

[0043] It also includes a heat-insulating processing structure, which is installed between the operating table 2 and the two rotating shafts 17, and is used to isolate the high temperature generated when the operating table 2 processes the wafer 4, so as to maintain the temperature in the processing box 1 stable; the heat-insulating processing structure includes two rotating rings 18 that are respectively rotatably arranged on the two rotating shafts 17, and the two rotating rings 18 are rotatably arranged in the telescopic hole 16, and each rotating ring 18 is fixedly installed with two pull ropes, and a heat insulation board 11 is fixedly installed between every two pull ropes, and two springs are fixedly installed between the two heat insulation boards 11, and a placement groove is opened on the side where the two heat insulation boards 11 are close to each other, and the two springs are located in the two placement grooves of the two heat insulation boards 11 when they are not stretched or compressed. At this time, the two insulation boards 11 can form a sealed state (without a gap therebetween), which can better insulate the heat. The insulation boards 11 can be made of graphene materials, rock wool and other materials, which can ensure that the unprocessed wafers 4 in the processing box 1 will not be affected by the temperature during the cracking process, and the two insulation boards 11 are slidably arranged in the telescopic hole 16. A separation component for pulling the two insulation boards 11 apart is arranged in the processing box 1. The separation component includes a roller 20 respectively fixed at one end of a plurality of rotating rods 3 28. A transmission belt 2 10 is rotatably sleeved between the plurality of rollers 20 and the corresponding rotating rings 18. The rotation of the roller 20 can drive the rotating ring 18 to rotate through the transmission belt 2 10.

[0044] Self-locking knobs are installed between the two rotating shafts 17 and the two rotating rings 18 and the operating table 2 (this is the prior art. The self-locking knob is a common rotation locking mechanism used in furniture, doors and windows or mechanical equipment. After rotating to a specific angle, the knob will self-lock to prevent misoperation or unauthorized rotation. Only when a certain rotational force is applied will it unlock and allow further operation. It will not be elaborated here). The self-locking knob can ensure the stability of the position of the placement plate 3 and the insulation board 11.

[0045] It also includes multiple rotating rods 3 28, which are rotatably installed in the processing box 1. Two placement plates 3 are slidably arranged in the telescopic hole 16. The parts of the two placement plates 3 close to each other are provided with magnets, and the two magnets are opposite-polarity magnets. The two placement plates 3 slide above the insulation board 11, and the placement plates 3 do not contact the insulation board 11, which can effectively reduce the heat conduction caused by direct contact. At the same time, the upper end of the processing box 1 and the operating table 2 are made of insulation materials to ensure safety during cracking. A displacement groove is provided at the position where the two placement plates 3 are close to each other, and two pull ropes 14 are provided between the two placement plates 3 and the corresponding rotating shafts 17. A one-way bearing 23 is rotatably provided on each rotating rod 3 28, and a roller 21 is rotatably installed on the outer side of each one-way bearing 23. A gear 24 is fixedly installed at one end of each rotating rod 3 28, and the gear 24 is meshed with a gear rod 3 32 for use. When the gear rod 3 32 slides upward in the L-shaped slide rail 6, the one-way bearing 23 rotates at this time, and a pulley 3 is fixedly installed on each roller 21 and the corresponding rotating shaft 17. A transmission belt 9 is provided between the two pulleys 3 for common rotation. When the one-way bearing 23 rotates, the roller 21 is driven to rotate, and the roller 21 drives the rotating shaft 17 to rotate through the transmission belt 9. The rotation of the rotating shaft 17 drives the placement plate 3 to move in the telescopic hole 16 through the pull rope 14, so that the two placement plates 3 are separated from each other, preparing for the subsequent rise of the wafer 4. A plurality of rotating rods 27 are rotatably installed in the processing box 1, and a rotating roller 3 25 is fixedly installed at one end of each rotating rod 27, and a gear 3 26 is rotatably installed on each one-way bearing 3, and the gear 3 26 is meshed with a gear rod 2 31 for use. A one-way bearing 3 is rotatably installed on each rotating rod 27. When the gear rod 2 31 slides downward in the L-shaped slide rail 6, the one-way bearing 3 rotates. A pulley 5 is fixedly installed on each rotating roller 3 25 and each rotating shaft 17, and a transmission belt 3 13 is rotatably sleeved between the corresponding two pulleys 5.

[0046] See also Figure 5-Figure 9, and also includes two moving tubes 33, which are arranged in an inverted "T" shape. The advantage of this shape setting is that when it moves upward to the highest point in the L-shaped slide rail 6, the highest point of the moving tube 33 can be located above the operating table 2, so that the wafer 4 can be smoothly placed on the upper surface of the operating table 2. The two moving tubes 33 are both slidably arranged between the corresponding two groups of L-shaped slide rails 6. A stabilizing structure is installed on each moving tube 33. The stabilizing structure is used to maintain the stability of the wafer 4 during the movement process. A gear rod 1 30, a gear rod 2 31 and a gear rod 3 32 are fixedly installed at both ends of the two moving tubes 33; the stabilizing structure includes a suction cup 34 fixedly connected to the upper end of the moving tube 33. Two pistons 38 are sealed and slidably arranged inside the moving tube 33. An elastic rope 37 is fixedly installed between the two pistons 38. A push rod 35 is fixedly installed on the side where the two pistons 38 are away from each other. A guide groove 36 is provided on the push rod 35. A guide rod 29 is fixedly installed on each L-shaped slide rail 6. The lower end of the guide rod 29 is angled and the upper end is vertical. By changing the inclination angle of the angled part at the lower end of the guide rod 29, the pressure of the suction cup 34 adsorbing the wafer 4 can be adjusted.

[0047] When the push rod 35 moves from bottom to top to the position of the guide rod 29, the lower end of the guide rod 29 slides in the guide groove 36, so that the two pistons 38 move away from each other. At this time, the air in the upper end of the moving tube 33 is sucked away, and the suction cup 34 just reaches the lower surface of the uppermost wafer 4, and a negative pressure is formed in the suction cup 34. When the push rod 35 moves to the uppermost end of the L-shaped slide rail 6, the guide rod 29 is separated from the guide groove 36, and the elastic rope 37 drives the two pistons 38 to move closer to each other, and a positive pressure is formed in the suction cup 34. At this time, the wafer 4 on the suction cup 34 rises to the top of the two placement plates 3 to ensure the stability of the wafer 4 when it moves. During the processing of the wafer 4, the surface of the wafer 4 is very It is easy to be contaminated, scratched or otherwise damaged. This process moves the wafer in the vertical direction, and the wafer is usually in a position perpendicular to the operating table 2, so as to avoid direct contact with the operating table 2 or other objects, thereby reducing the contamination and surface scratches caused by contact. When moving horizontally, the wafer 4 may directly contact the surface of other objects, increasing the risk of contamination and damage. At the same time, the wafer 4 is easier to remain stable under the action of gravity, avoiding vibration and pressure caused by horizontal rotation or movement, and vibration or pressure may affect the accuracy of the wafer 4, especially in precision processing at the micron level. Any slight deformation or vibration may lead to poor processing or equipment failure.

[0048] The conveyor belt 5 is provided with a plurality of short shafts, and the plurality of short shafts are rotatably arranged in the processing box 1. A pulley 8 is fixedly installed at one end of each short shaft. A conveying structure is provided between each two groups of pulleys 8. The conveying structure is used to convey the wafer 4 to wait for subsequent flame cracking. The conveying structure includes a conveyor belt 5 rotatably arranged between two pulleys 8. A plurality of placement rods 7 are evenly and fixedly arranged on the conveyor belt 5. The number and interval of wafers 4 placed can be changed by adjusting the length of the conveyor belt 5 and the spacing between the placement rods 7. The length of the conveyor belt 5 is changed according to the required number, and the wafer 4 is placed on two placement rods 7 parallel to each other in each two groups of conveying structures. Each placement rod 7 is provided with a bump, which can relatively limit the placement position of the wafer, ensure the accuracy of the wafer 4 picking position, and cooperate with the circular groove formed between the operating table 2 and the placement plate 3 (see for details). Figure 1 ), ensure the accuracy of the processing position of the wafer 4, and improve the accuracy of the flame cracking of the wafer 4. A plurality of rotating rods 12 are rotatably arranged in the processing box 1, and one end of the plurality of rotating rods 12 is rotatably installed with a one-way bearing 22, and a gear 19 is rotatably installed on each one-way bearing 22, and the gear 19 is meshed with a gear rod 30 for use. When the gear rod 30 slides downward in the L-shaped slide rail 6, the one-way bearing 22 rotates, and the gear 19 rotates accordingly. A short rod is fixedly installed on the plurality of pulleys 8 above, and a transmission assembly 15 is installed between each short rod and the corresponding rotating rod 12. The transmission assembly 15 includes two pulleys respectively fixedly installed on the short rod and the corresponding rotating rod 12, and a crawler belt is rotatably sleeved between the two pulleys 2. The gear 19 rotates through the transmission assembly 15 to drive the conveyor belt 5 to rotate, and the two adjacent conveyor belts 5 rotate in opposite directions. The rotation of the conveyor belt 5 drives the plurality of placement rods 7 to rotate, and the rotation of the placement rods 7 drives the plurality of wafers 4 to move upward in the vertical direction.

[0049] The specific operation steps of the present invention are as follows:

[0050] The wafer 4 to be processed is placed on multiple placement rods 7, and multiple groups of L-shaped slide rails 6 are opened. At this time, the two moving tubes 33 are close to each other, and the movement of the moving tube 33 drives the gear rod 3 32 to move to mesh with the gear 2 24. At this time, the roller 1 20 and the roller 2 21 will rotate. The rotation of the roller 1 20 drives the rotating ring 18 to rotate through the transmission belt 2 10. The rotation of the rotating ring 18 drives the pull rope 2 to be wound around the rotating ring 18, so that the two insulation boards 11 slide away from each other, ensuring that the wafer 4 can smoothly reach the operating table. 2, the rotating roller 21 rotates through the transmission belt 9 to drive the rotating shaft 17 to rotate, and the rotating shaft 17 rotates to drive the pull rope 14 to wrap around the rotating shaft 17, so that the two placing plates 3 slide in the direction away from each other, and at the same time, the relative positions are fixed under the action of the self-locking knob to ensure the opening of the telescopic hole 16, so that the upper and lower surfaces of the operating table 2 are in a connected state, and the wafer 4 can smoothly reach the operating table 2; then the moving tube 33 drives the gear rod 30 to mesh with the gear 19, but at this time, the one-way bearing 22 No rotation will occur (rotating rod 12 will not rotate), then the moving tube 33 moves to the vertical position of the L-shaped slide rail 6, at this time, under the cooperation of the guide groove 36 and the guide rod 29, the two push rods 35 in the same moving tube 33 are driven to move away from each other, at this time, the two pistons 38 connected thereto move away from each other, and the elastic rope 37 is stretched, so that a negative pressure state is formed in the suction cup 34, at the same time, the suction cup 34 is attached to the lower surface of the uppermost wafer 4 to adsorb the wafer 4, then the moving tube 33 continues to move upward, at this time the guide rod 29 is no longer in an inclined state, the two push rods 35 no longer move, and the negative pressure state in the suction cup 34 is kept stable, at this time the wafer 4 is stably adsorbed and moves upward accordingly, when the moving tube 33 reaches the uppermost part of the L-shaped slide rail 6, at this time the guide groove 36 is disengaged from the guide rod 29, and under the action of the elastic rope 37, the two pistons 38 return to the initial position, so that the air in the moving tube 33 is squeezed toward the suction cup 34, at this time the suction cup 34 is in a positive pressure state, and the wafer 4 is in a non-adsorbed state;

[0051] Then, the moving tube 33 in the L-shaped slide rail 6 is moved downward therein. At this time, the gear rod 2 31 is meshed with the gear 3 26, and drives the roller 3 25 to rotate. At this time, the transmission belt 3 13 drives the rotating shaft 17 to rotate in the opposite direction. At this time, under the suction force of the magnet in the placement plate 3, the two placement plates 3 are in a state of gapless attraction. At this time, as the downward movement proceeds, the wafer 4 on the suction cup 34 is placed between the two placement plates 3 and the operating table 2. At the same time, the displacement groove on the placement plate 3 can enable the suction cup 34 to be smoothly pulled downward from it. As the moving tube 33 moves downward, the moving tube 33 drives the gear rod 1 30 to mesh with the gear 19 again. At this time, the one-way bearing 1 22 rotates, and the pulley 1 8 is driven to rotate through the transmission component 15. The conveyor belt 5 is driven to rotate with the cooperation of another pulley 8. At this time, the two adjacent conveyor belts 5 rotate in the direction away from each other, so that the wafers 4 on the multiple placement rods 7 move upward as a whole, and wait for the next wafer 4 to be processed again. Finally, with the movement of the moving tube 33, under the meshing of the gear rod three 32 and the gear two 24, the one-way bearing two 23 will not rotate, and the gear two 24 will drive the roller one 20 to rotate in the opposite direction. At this time, under the setting of the spring, the two insulation plates 11 are driven to approach each other, and the bottom of the operating table 2 is blocked to ensure that the heat during the cracking of the wafer 4 on the placement plate 3 will not be transmitted to the processing box 1, to ensure that the wafer 4 in the processing box 1 will not be affected, and the processing speed of the wafer 4 can be increased.

[0052] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A wafer rapid feeding mechanism based on flame pyrolysis process, comprising a processing box (1) and a wafer (4), characterized in that: Also includes: An operating table (2) is fixedly arranged on the processing box (1) and is used to place the wafer (4) for flame cracking; A plurality of groups of L-shaped slide rails (6), wherein the plurality of groups of L-shaped slide rails (6) are fixedly arranged on the lower surface of the operating table (2) and are located inside the processing box (1); Two rotating shafts (17), both rotating shafts (17) are rotatably arranged on the operating table (2); A telescopic hole (16) is provided on the operating table (2), and two rotating shafts (17) are both rotatably arranged in the telescopic hole (16); A heat-insulating processing structure, which is installed between the operating table (2) and the two rotating shafts (17) and is used to isolate the high temperature generated when the operating table (2) processes the wafer (4) and maintain the temperature in the processing box (1) stable; A plurality of rotating rods (28), wherein the plurality of rotating rods (28) are rotatably mounted in the processing box (1); Two moving tubes (33), both of which are slidably arranged between the two corresponding groups of L-shaped slide rails (6), each of which is provided with a stabilizing structure, which is used to maintain the stability of the wafer (4) during movement, and both ends of the two moving tubes (33) are fixedly provided with a gear rod 1 (30), a gear rod 2 (31) and a gear rod 3 (32); A plurality of short shafts are rotatably arranged in a processing box (1), a pulley (8) is fixedly mounted on one end of each of the short shafts, a conveying structure is arranged between each two sets of pulleys (8), and the conveying structure is used to convey the wafer (4) to wait for subsequent flame cracking.

2. The wafer rapid feeding mechanism based on flame cracking process according to claim 1 is characterized in that: The heat insulation processing structure comprises two rotating rings (18) rotatably arranged on two rotating shafts (17) respectively, and the two rotating rings (18) are rotatably arranged in the telescopic hole (16), and two pull ropes are fixedly installed on each rotating ring (18), and a heat insulation board (11) is fixedly installed between every two pull ropes, and two springs are fixedly installed between the two heat insulation boards (11), and the two heat insulation boards (11) are slidably arranged in the telescopic hole (16), and a separation component for pulling the two heat insulation boards (11) apart is arranged in the processing box (1).

3. The wafer rapid feeding mechanism based on flame cracking process according to claim 2 is characterized in that: The separation component comprises a rotating roller (20) fixedly arranged at one end of a plurality of rotating rods (28), and a transmission belt (10) is arranged between the plurality of rotating rollers (20) and the corresponding rotating ring (18).

4. The wafer rapid feeding mechanism based on flame cracking process according to claim 1 is characterized in that: Two placement plates (3) are slidably arranged in the telescopic hole (16), magnets are arranged inside the two placement plates (3), and the two magnets attract each other, displacement grooves are provided at positions where the two placement plates (3) are close to each other, and two pull ropes (14) are arranged between the two placement plates (3) and the corresponding rotating shafts (17).

5. The wafer rapid feeding mechanism based on flame cracking process according to claim 4 is characterized in that: A one-way bearing (23) is rotatably arranged on each of the rotating rods (28), and a roller (21) is rotatably arranged on the outer side of each of the one-way bearings (23). A gear (24) is fixedly arranged on one end of each of the rotating rods (28), and the gear (24) is meshed with a gear rod (32) for use. When the gear rod (32) slides upward in the L-shaped slide rail (6), the one-way bearing (23) rotates, and a transmission belt (9) is rotatably arranged between each of the rollers (21) and the corresponding rotating shaft (17).

6. The wafer rapid feeding mechanism based on flame cracking process according to claim 1 is characterized in that: A plurality of rotating rods (27) are rotatably mounted in the processing box (1), one end of each rotating rod (27) being fixedly mounted with a rotating roller (25), each rotating rod (27) being rotatably mounted with a one-way bearing (3), each one-way bearing (3) being rotatably mounted with a gear (26), the gear (26) being meshed with the gear rod (31) for use, when the gear rod (31) slides downward in the L-shaped slide rail (6), the one-way bearing (3) is rotated, each rotating roller (25) and each rotating shaft (17) being fixedly mounted with a pulley (4), and a transmission belt (13) being rotatably sleeved between the two corresponding pulleys (4).

7. The wafer rapid feeding mechanism based on flame cracking process according to claim 1 is characterized in that: The stabilizing structure comprises a suction cup (34) fixedly connected to the upper end of the moving tube (33); two pistons (38) are sealed and slidably disposed inside the moving tube (33); an elastic rope (37) is fixedly mounted between the two pistons (38); and push rods (35) are fixedly mounted on the sides of the two pistons (38) that are away from each other.

8. The wafer rapid feeding mechanism based on flame cracking process according to claim 7 is characterized in that: The push rod (35) is provided with a guide groove (36), and each of the L-shaped slide rails (6) is fixedly mounted with a guide rod (29), the lower end of the guide rod (29) is angled and the upper end is vertical. When the push rod (35) moves from bottom to top to the position of the guide rod (29), the lower end of the guide rod (29) slides in the guide groove (36), so that the two pistons (38) move away from each other, and negative pressure is formed in the suction cup (34). When the push rod (35) moves to the uppermost end of the L-shaped slide rail (6), the guide rod (29) is separated from the guide groove (36), and the elastic rope (37) drives the two pistons (38) to move closer to each other, and positive pressure is formed in the suction cup (34). At this time, the wafer (4) on the suction cup (34) is located on the operating table (2).

9. The wafer rapid feeding mechanism based on flame cracking process according to claim 1, characterized in that: The conveying structure comprises a conveying belt (5) rotatably arranged between two pulleys (8), a plurality of placement rods (7) are evenly and fixedly arranged on the conveying belt (5), and the wafers (4) are placed on two placement rods (7) parallel to each other in each two groups of conveying structures.

10. The wafer rapid feeding mechanism based on flame cracking process according to claim 9, characterized in that: A plurality of rotating rods (12) are rotatably arranged in the processing box (1), and a one-way bearing (22) is rotatably mounted on one end of each of the rotating rods (12). A gear (19) is rotatably mounted on each of the one-way bearings (22). The gear (19) is meshed with a gear rod (30) for use. When the gear rod (30) slides downward in the L-shaped slide rail (6), the one-way bearing (22) rotates. A short rod is fixedly mounted on the plurality of pulleys (8) above, and a transmission assembly (15) is mounted between each of the short rods and the corresponding rotating rod (12).

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