Packaging monomer, packaging structure, electronic product and preparation method

Abstract

The invention discloses a packaging monomer, a packaging structure, an electronic product and a preparation method, and the packaging monomer comprises a substrate; the wiring layer is arranged on the substrate, and the wiring layer is provided with electric connection point positions; the chips are arranged on the wiring layer and are electrically connected through the electric connection points; the chip and the wiring layer can be grounded through the grounding layer; and the shielding layer is arranged on the outer surface of the chip, and the shielding layer is connected with the outer edge of the grounding layer. The wiring layer is rearranged, and the wiring layer and the chip are grounded through the grounding layer, so that connection of the shielding layer and the grounding layer is facilitated, cavity-divided shielding is not needed, or shielding treatment is carried out in manners of slotting, filling conductive silver paste and the like, electronic shielding of the packaging monomer can be realized, and cavity-divided shielding is not needed; the size of the packaging structure does not need to be increased, the manufacturing process is simpler, and the product competitiveness is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and more specifically, to a packaging monomer, a packaging structure, an electronic product and a preparation method thereof. Background Art

[0002] As the functional requirements of consumer electronic products increase day by day, the design of SiP products (packaged products) has also become more complicated. In order to meet the diverse functional requirements, chips with different functions need to be integrated into one SiP module.

[0003] At present, in order to avoid signal interference, it is usually adopted to shield different functional chips by cavity. Commonly used cavity shielding methods mainly include setting shielding cover and laser slot plus conductive silver paste filling method. No matter which method is used, it will increase the production process of packaged products and increase costs. At the same time, it will also cause the product size to increase. In addition, after the packaged product is sputtered, cracks and other defects are easy to occur on the surface of the silver paste. Summary of the invention

[0004] An object of the present invention is to provide a new technical solution for a packaging unit, a packaging structure, an electronic product and a preparation method, which can at least solve one technical problem in the prior art.

[0005] According to a first aspect of the present invention, a packaging unit is provided, comprising: a substrate; a wiring layer, the wiring layer being arranged on the substrate and having electrical connection points; a chip, the chip being arranged on the wiring layer and being electrically connected through the electrical connection points; the chip and the wiring layer being able to be grounded through a grounding layer; and a shielding layer, the shielding layer being arranged on the outer surface of the chip and being connected to the outer edge of the grounding layer.

[0006] Optionally, the wiring layer is a multi-layer structure, and one of the layers of the wiring layer is the ground layer.

[0007] Optionally, the ground layer is provided between the wiring layer and the chip.

[0008] Optionally, the ground layer is provided with point holes corresponding to the electrical connection points on the wiring layer.

[0009] Optionally, the ground layer is provided on a surface of the wiring layer facing the chip or on a surface of the wiring layer facing away from the chip.

[0010] Optionally, the outer edge of the ground layer is in a sawtooth shape.

[0011] A second aspect of the present invention provides a packaging structure, comprising a plurality of packaging units described in the above embodiments, wherein a cutting path is provided on the wiring layer of two adjacent packaging units, and the position of the cutting path corresponds to the outer edge position of the ground layer of the two adjacent packaging units.

[0012] A third aspect of the present invention provides a method for preparing an encapsulation monomer, which is used to prepare the encapsulation monomer described in the above embodiment, and the preparation method comprises:

[0013] A substrate is provided, and a wiring layer is arranged on the substrate, wherein a cutting path is arranged on the wiring layer;

[0014] A plurality of chips are arranged on the wiring layer, and the chips and the wiring layer can be grounded through a ground layer;

[0015] Disposing a shielding layer on the outer surface of each chip;

[0016] Cutting is performed along the cutting road to cut the package into a plurality of the package units.

[0017] Optionally, the outer edge of the grounding layer is in a sawtooth shape, the wiring layer has electrical connection points, and the grounding layer is provided with point holes corresponding to the electrical connection points on the wiring layer.

[0018] A fourth aspect of the present invention provides an electronic product, comprising the packaging unit described in the above embodiment.

[0019] The packaging monomer of the present invention is convenient for connecting the shielding layer and the grounding layer by rearranging the wiring layer and grounding the wiring layer and the chip through the grounding layer, thereby eliminating the need for cavity shielding or shielding treatment by methods such as grooving and filling with conductive silver paste. It can achieve electronic shielding of the packaging monomer without cavity shielding and increasing the size of the packaging structure, making the process simpler and effectively improving product competitiveness.

[0020] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0022] Figure 1 is a schematic structural diagram of a packaging unit according to an embodiment of the present invention;

[0023] Figure 2 is a schematic structural diagram of a packaging structure according to an embodiment of the present invention;

[0024] Figure 3 is a plan view of a packaging structure according to an embodiment of the present invention;

[0025] Figure 4 yes Figure 3 A partial enlargement of the midline AA.

[0026] Reference numerals:

[0027] 100. Encapsulation monomer;

[0028] 200. Packaging structure;

[0029] 10. Wiring layer; 11. Electrical connection points;

[0030] 20. Shielding layer;

[0031] 30. Ground layer;

[0032] 40. Chip;

[0033] 50. Cutting road;

[0034] 60. Substrate;

[0035] 70. Packaging materials. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0039] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0040] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0041] In the specification and claims of the present invention, if the term "first" or "second" is involved, it may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the related objects are in an "or" relationship.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" involved should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] The encapsulation unit according to the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0045] like Figure 1 As shown, the package unit 100 according to the embodiment of the present invention includes a substrate 60 , a wiring layer 10 , a chip 40 , a ground layer 30 and a shielding layer 20 .

[0046] Specifically, the wiring layer 10 is provided on the substrate 60, and the wiring layer 10 has an electrical connection point 11. The chip 40 is provided on the wiring layer 10, and is electrically connected through the electrical connection point 11. The chip 40 and the grounding layer 30 can be grounded through the grounding layer 30. The shielding layer 20 is provided on the outer surface of the chip 40, and the shielding layer 20 is connected to the outer edge of the grounding layer 30.

[0047] In other words, if Figure 1As shown, the package monomer 100 according to the embodiment of the present invention is mainly composed of a substrate 60, a wiring layer 10, a chip 40, a ground layer 30 and a shielding layer 20. The wiring layer 10 can be arranged on the substrate 60, and the wiring layer 10 has an electrical connection point 11 (see Figure 4 ). The chip 40 can be mounted on the wiring layer 10, and the chip 40 is electrically connected to the wiring layer 10 through the electrical connection point 11. The wiring layer 10 and the chip 40 can be grounded through the grounding layer 30. The shielding layer 20 can be sputtered on the outer surface of the chip 40 and packaged by the packaging material 70 to form a package monomer 100. By providing the grounding layer 30, it is convenient to connect the outer edge of the shielding layer 20 with the grounding layer 30, prevent the shielding layer 20 and the grounding layer 30 from cracking at the connection position, and effectively achieve the shielding effect of the package monomer 100.

[0048] It should be noted that in the prior art, in order to avoid signal interference, it is usually adopted to perform cavity shielding on the chips 40 with different functions. Common cavity shielding methods mainly include setting a shielding cover and a laser slot plus a conductive silver paste filling method. Either method will increase the production process of the packaged product, resulting in increased costs. At the same time, it will also cause the product size to increase. In addition, after the packaged product is sputtered, defects such as cracks are easily generated on the surface of the silver paste.

[0049] Therefore, according to the packaging monomer 100 of the embodiment of the present invention, by rearranging the wiring layer 10, and the wiring layer 10 and the chip 40 can be grounded through the ground layer 30, it is convenient to connect the shielding layer 20 and the ground layer 30, so there is no need to perform cavity shielding, or shielding treatment by grooving and filling with conductive silver paste, etc., which can achieve electronic shielding of the packaging monomer 100 without performing cavity shielding and increasing the size of the packaging structure 200, and the process manufacturing process is simpler, which effectively improves the competitiveness of the product.

[0050] According to one embodiment of the present invention, the wiring layer 10 may adopt a multi-layer structure, one of the layers of the wiring layer 10 may be set as a grounding layer 30, and the wiring layer 10 and the chip 40 may be grounded through the grounding layer 30. The shielding layer 20 may be sputtered on the outer surface of the chip 40 and packaged by the packaging material 70 to form a package monomer 100. By providing the grounding layer 30, it is convenient to connect the outer edge of the shielding layer 20 with the grounding layer 30, prevent the shielding layer 20 and the grounding layer 30 from cracking at the connection position, and effectively achieve the shielding effect of the package monomer 100.

[0051] According to an embodiment of the present invention, the grounding layer 30 may be a separately provided structural layer, and the grounding layer 30 may be provided between the wiring layer 10 and the chip 40. The shielding layer 20 may be sputtered on the outer surface of the chip 40, and encapsulated by the encapsulation material 70 to form the encapsulation monomer 100. By providing the grounding layer 30, it is convenient to connect the outer edge of the shielding layer 20 with the grounding layer 30, prevent the shielding layer 20 and the grounding layer 30 from cracking at the connection position, and effectively achieve the shielding effect of the encapsulation monomer 100.

[0052] According to one embodiment of the present invention, the grounding layer 30 is provided with point holes corresponding to the electrical connection points 11 on the wiring layer 10. In other words, the grounding layer 30 may be provided with point holes, and the potential holes on the grounding layer 30 correspond to the electrical connection points 11 on the wiring layer 10, so as to facilitate the grounding of the package monomer 100.

[0053] According to an embodiment of the present invention, the ground layer 30 is disposed on a surface of the wiring layer 10 facing the chip 40 or on a surface of the wiring layer 10 facing away from the chip 40. Figure 1 As shown, the ground layer 30 can be mounted on the upper surface of the wiring layer 10 or on the lower surface of the wiring layer 10 , as long as the grounding of the package unit 100 can be achieved.

[0054] According to one embodiment of the present invention, the ground layer 30 is disposed in the wiring layer 10 to separate the wiring layer 10 into at least two layers. In other words, the ground layer 30 can also be disposed in the wiring layer 10, and the ground layer 30 can be provided with one or more layers to separate the wiring layer 10 into at least two layers. After the package structure 200 is cut into individual package monomers 100, the ground layer 30 can be exposed on the side, so that the outer edge of the zigzag-shaped ground layer 30 is connected to the shielding layer 20 to achieve shielding of the package monomer 100.

[0055] According to one embodiment of the present invention, Figure 4 As shown, the outer edge of the grounding layer 30 is in a sawtooth shape. That is, the outer edge of the grounding layer 30 can be set in a sawtooth shape, for example, the outer edge of the grounding layer 30 can be set in a continuous groove shape or a triangular groove shape, which is convenient for connecting the shielding layer 20 with the outer edge of the grounding layer 30, preventing the shielding layer 20 and the grounding layer 30 from cracking at the connection position, and effectively achieving the shielding effect of the package monomer 100. Of course, the specific shape of the outer edge of the grounding layer 30 can be specifically set according to actual needs, and will not be described in detail in the present invention.

[0056] In summary, according to the packaging monomer 100 of the embodiment of the present invention, by rearranging the wiring layer 10 and setting the grounding layer 30 between the wiring layer 10 and the chip 40, the outer edge of the grounding layer 30 is set to a serrated shape, which is convenient for the connection between the shielding layer 20 and the grounding layer 30, thereby eliminating the need for cavity shielding, or shielding treatment by grooving and filling with conductive silver paste, etc., which can achieve electronic shielding of the packaging monomer 100 without cavity shielding and increasing the size of the packaging structure 200, and the process manufacturing process is simpler, effectively improving the competitiveness of the product.

[0057] Of course, for those skilled in the art, other structures and working principles of the packaging unit 100 are understandable and achievable, and will not be described in detail in the present invention.

[0058] According to a second aspect of the present invention, Figure 2 and Figure 3 As shown, a packaging structure 200 is provided, including a plurality of packaging units 100 of the above-mentioned embodiments, a cutting path 50 is provided on the wiring layer 10 of two adjacent packaging units 100 , and the position of the cutting path 50 corresponds to the outer edge position of the ground layer 30 of the two adjacent packaging units 100 .

[0059] In other words, if Figure 2 and Figure 3 As shown, the package structure 200 according to the embodiment of the present invention is mainly composed of a plurality of package monomers 100 of the above-mentioned embodiments, and a cutting path 50 is provided on the wiring layer 10 of two adjacent package monomers 100, and the cutting path 50 is a straight line (such as Figure 4 The position of the cutting path 50 corresponds to the outer edge position of the grounding layer 30 of two adjacent package monomers 100. The package structure 200 can be cut into multiple package monomers 100 along the cutting path 50, and packaged by the packaging material 70 to form the package structure 200. After the cutting is completed, the outer edge of the grounding layer 30 of each package monomer 100 is exposed and distributed in a zigzag shape, which facilitates the connection between the shielding layer 20 of each package monomer 100 and the outer edge of the grounding layer 30, preventing the shielding layer 20 and the grounding layer 30 from cracking at the connection position, effectively achieving the shielding effect of the package monomer 100, and solving the problem of defects such as cracks easily generated on the surface of the silver paste after the package product is sputtered.

[0060] According to the packaging structure 200 of the embodiment of the present invention, by rearranging the wiring layer 10 and setting the grounding layer 30 between the wiring layer 10 and the chip 40, the outer edge of the grounding layer 30 is set to a serrated shape, which is convenient for the connection between the shielding layer 20 and the grounding layer 30, thereby eliminating the need for cavity shielding, or shielding treatment such as grooving and filling with conductive silver paste, etc., which can achieve electronic shielding of the packaging monomer 100 without cavity shielding and increasing the size of the packaging structure 200, and the process manufacturing process is simpler, effectively improving the competitiveness of the product.

[0061] Of course, for those skilled in the art, other structures and working principles of the packaging structure 200 are understandable and achievable, and will not be described in detail in the present invention.

[0062] According to a third aspect of the present invention, a method for preparing a package monomer 100 is provided, which is used to prepare the package monomer 100 in the above embodiment. The method for preparing the package monomer 100 according to the embodiment of the present invention includes:

[0063] A substrate 60 is provided, and a wiring layer 10 is disposed on the substrate 60, wherein a cutting path 50 is disposed on the wiring layer 10;

[0064] A plurality of chips 40 are arranged on the wiring layer 10, and the chips 40 and the wiring layer 10 can be grounded through the ground layer 30;

[0065] A shielding layer 20 is provided on the outer surface of each chip 40;

[0066] The wafer is cut along the dicing streets 50 to form a plurality of package units 100 .

[0067] That is to say, Figures 1 to 4 As shown, in the preparation method of the package monomer 100 of the embodiment of the present invention, first, a substrate 60 can be provided, and the wiring layer 10 can be rearranged on the substrate 60. Among them, a cutting path 50 is set on the wiring layer 10. Then, the wiring layer 10 and the chip 40 can be grounded through the ground layer 30. The wiring layer 10 can adopt a multi-layer structure, and one layer of the wiring layer 10 can be set as the ground layer 30. Of course, the ground layer 30 can also be set on the wiring layer 10, and the ground layer 30 can be set on the upper surface or the lower surface of the wiring layer 10, or it can be set in the middle of the wiring layer 10. The outer edge of the ground layer 30 is exposed and set in a zigzag shape. Then, a plurality of chips 40 can be mounted on the wiring layer 10 provided with the ground layer 30. The shielding layer 20 can be sputtered on the outer surface of each chip 40. Finally, it can be cut along the cutting path 50 and encapsulated by the encapsulation material 70 to form the package monomer 100.

[0068] According to the method for preparing the package monomer 100 of the embodiment of the present invention, the wiring layer 10 is rearranged, and a ground layer 30 is provided between the wiring layer 10 and the chip 40, and the outer edge of the ground layer 30 is provided in a sawtooth shape (see Figure 4 ), which facilitates the connection between the shielding layer 20 and the grounding layer 30, thereby eliminating the need for cavity shielding or shielding treatment by means of grooving and filling with conductive silver paste, etc., which can achieve electronic shielding of the package monomer 100 without cavity shielding and without increasing the size of the package structure 200, making the process manufacturing process simpler and effectively improving product competitiveness.

[0069] According to one embodiment of the present invention, Figure 4 As shown, the wiring layer 10 has an electrical connection point 11, and the grounding layer 30 is provided with a point hole corresponding to the electrical connection point 11 on the wiring layer 10. In other words, the wiring layer 10 has an electrical connection point 11, and the grounding layer 30 may have a point hole, and the potential hole on the grounding layer 30 corresponds to the electrical connection point 11 on the wiring layer 10, so as to facilitate the grounding of the package monomer 100.

[0070] According to an embodiment of the present invention, the method for preparing the package monomer 100 further includes: performing a thinning process before cutting along the cutting path 50. That is, in the method for preparing the package structure 200, a thinning process can also be performed before cutting along the cutting path 50 to further reduce the size of the package structure 200, so as to meet the requirements of miniaturization and lightweight.

[0071] According to the third aspect of the present invention, an electronic product is provided, comprising the packaging monomer 100 in the above embodiment. Since the packaging monomer 100 according to the embodiment of the present invention has the above technical effects, the electronic product according to the embodiment of the present invention should also have the corresponding technical effects, that is, the electronic product of the present invention can achieve electronic shielding of the packaging structure 200 through the packaging monomer 100, without the need for cavity shielding, without increasing the size of the packaging structure 200, and the process manufacturing process is simpler, effectively improving the product competitiveness.

[0072] Of course, for those skilled in the art, other structures and working principles of the electronic product are understandable and achievable, and will not be described in detail in the present invention.

[0073] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A packaging monomer, characterized in that: include: substrate; A wiring layer (10), the wiring layer (10) being arranged on the substrate, and having electrical connection points on the wiring layer (10); A chip (40), the chip (40) being arranged on the wiring layer (10) and being electrically connected via the electrical connection point, and the chip (40) and the wiring layer (10) being grounded via a ground layer (30); A shielding layer (20), the shielding layer (20) being arranged on the outer surface of the chip (40), and the shielding layer (20) being connected to the outer edge of the grounding layer (30).

2. The packaging unit according to claim 1, characterized in that: The wiring layer (10) is a multi-layer structure, and one layer of the wiring layer (10) is the ground layer (30).

3. The packaging unit according to claim 1, characterized in that: The ground layer (30) is provided between the wiring layer (10) and the chip (40).

4. The packaging unit according to claim 1, characterized in that: The grounding layer (30) is provided with point holes corresponding to the electrical connection points on the wiring layer (10).

5. The packaging unit according to claim 3, characterized in that: The ground layer (30) is provided on a side surface of the wiring layer (10) facing the chip (40) or a side surface facing away from the chip (40).

6. The packaging unit according to claim 1, characterized in that: The outer edge of the grounding layer (30) is in a sawtooth shape.

7. A packaging structure, characterized in that: The invention comprises a plurality of packaging monomers according to any one of claims 1 to 6, wherein a cutting path (50) is provided on the wiring layer (10) of two adjacent packaging monomers, and the position of the cutting path (50) corresponds to the outer edge position of the ground layer (30) of the two adjacent packaging monomers.

8. A method for preparing a packaged monomer, used for preparing the packaged monomer according to any one of claims 1 to 6, characterized in that: The preparation method comprises: A substrate is provided, and a wiring layer (10) is arranged on the substrate, wherein a cutting path (50) is provided on the wiring layer (10); A plurality of chips (40) are arranged on the wiring layer (10), and the chips (40) and the wiring layer (10) can be grounded via a ground layer (30); A shielding layer (20) is provided on the outer surface of each chip (40); Cutting is performed along the cutting path (50) to cut into a plurality of the packaging units.

9. The method for preparing a packaged monomer according to claim 8, characterized in that: The outer edge of the grounding layer (30) is in a sawtooth shape, the wiring layer (10) has electrical connection points, and the grounding layer (30) is provided with point holes corresponding to the electrical connection points on the wiring layer (10).

10. An electronic product, characterized in that: The encapsulation unit comprises the encapsulation unit described in any one of claims 1 to 6.

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