A preparation method of a piezoelectric micropump based on array processing segmentation and the obtained piezoelectric micropump

Abstract

The present invention discloses a preparation method of a piezoelectric micropump based on array processing and segmentation and the obtained piezoelectric micropump; the method is as follows: processing a sheet material to form a plurality of identical device units; multiple sheet materials respectively form single-layer array structures corresponding to different device layers of the piezoelectric micropump pump body. Aligning and bonding to form a whole-board array pump body structure including multiple pump bodies. Dicing to separate independent pump bodies. The present invention can obtain a single-layer array structure with array device units through chemical etching, photolithography and laser processing; by bonding and then dicing the single-layer array structures of different devices, multiple independent piezoelectric micropumps can be obtained synchronously. Such a preparation process can prepare piezoelectric micropumps in plates, effectively improving the production efficiency of piezoelectric micropumps and making the piezoelectric micropumps have higher stability and consistency.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric micropump production, and particularly relates to a preparation method of a piezoelectric micropump based on array processing and segmentation and the obtained piezoelectric micropump. Background Art

[0002] MEMS micropumps are highly integrated microfluidic delivery devices that achieve precise control of fluid flow through microelectromechanical system technology. Such pumps typically use silicon-based materials and utilize microfabrication techniques to create complex fluid channels and drive structures, such as piezoelectric, electrostatic, or thermal drive output contacts. The size of MEMS micropumps can range from a few millimeters to a few hundred micrometers, enabling precise metering and delivery of small amounts of fluid, which is very suitable for applications that require precise control of fluid volume. In the medical field, MEMS micropumps can be used in drug delivery systems to achieve timed and quantitative release of drugs, improving treatment efficacy and reducing side effects. In the field of chemical analysis, they can serve as key components in microfluidic chips for precise sample dispensing and mixing. In the field of biosensing, MEMS micropumps can be used to control the flow of biological samples and reagents, enhancing the sensitivity and accuracy of detection. The design and manufacture of MEMS micropumps is an interdisciplinary process involving multiple fields such as fluid mechanics, materials science, and microelectronic engineering. With technological advancements, the performance and application scope of MEMS micropumps are also continuously expanding, and they have broad application prospects in fields such as portable medical devices, environmental monitoring, and food safety detection.

[0003] The preparation process flow of MEMS piezoelectric micropumps is a complex process involving precision engineering and materials science. It usually starts with a detailed design phase, in which the structural and functional parameters of the micropump are determined according to its application requirements. Next, a suitable piezoelectric material is selected, such as lead zirconate titanate (PZT) or lead magnesium niobate (PMN), etc. Subsequently, advanced microfabrication techniques, such as photolithography, wet and dry etching, thin film deposition, etc., are used to precisely construct the microfluidic channels and piezoelectric drive structures of the micropump on a silicon substrate. The accuracy and quality of these structures directly affect the performance of the micropump. After that, the piezoelectric material is combined with the silicon substrate to form a piezoelectric drive unit, and this step requires precise control of the thickness of the piezoelectric material and the layout of the electrodes to ensure the best driving effect. The next step is the packaging process, which not only protects the internal structure of the micropump but also provides the necessary electrical connections and fluid interfaces. Finally, rigorous testing and verification are carried out, including functional testing, durability testing, and environmental adaptability testing, to ensure the reliability and stability of the micropump in actual applications. The entire preparation process flow requires interdisciplinary knowledge and skills, including mechanical engineering, electronic engineering, materials science, and chemical engineering, to ensure the high performance and long-term stable operation of the micropump. The electrical interface of the piezoelectric micropump is usually located outside the pump body for connecting to a power adapter or driver.

[0004] For example, in a Chinese patent with the patent number CN116887154A, a "Piezoelectric MEMS Transducer and Its Operating Method and Manufacturing Method" is disclosed. Paragraph 0018 of its specification specifically discloses the following content: "Etch the second piezoelectric composite layer to obtain a plurality of first piezoelectric composite structures on one side of the silicon support film; obtain a second silicon wafer with partial cavities; bond the plurality of first piezoelectric composite structures to the cavity side of the second silicon wafer; remove the first silicon wafer on the side of the first piezoelectric composite layer and etch the first piezoelectric composite layer to obtain a plurality of second piezoelectric composite structures on the other side of the silicon support film; etch the silicon support film to expose the first piezoelectric composite structures; etch the second silicon wafer to form a complete cavity in the second silicon wafer." It can be seen that due to the material limitations of the silicon-based MEMS micropump device in this Chinese patent, only chemical etching or dry etching methods can be used for structural processing of the first piezoelectric composite layer and the second piezoelectric composite layer. The method process is very complex, resulting in a slower processing speed and a low efficiency in batch processing.

[0005] Again, for example, in a Chinese patent with the patent number TWI616350B, a "Manufacturing Method of a Fluid Control Device" is disclosed. Paragraph 0013 of its specification specifically discloses the following content: "Sequentially stack the housing 26, the piezoelectric actuator 23, and the deformable base structure 20 and perform positioning bonding." It can be seen from the comparative document that after manufacturing the various components of the fluid control device, they are stacked and then positioned and bonded, and then the final assembly is carried out to manufacture a single fluid control device. Such a preparation process can only prepare a single fluid control device. That is to say, it is prepared one by one. If a large quantity is prepared, more machines are required, the time is longer, and the production efficiency is relatively low. The non-silicon micropump still uses the processes of precision machining and precision molds. The mold cost is high, the product consistency and repeatability are poor, the mass production cost is high, and the mass production efficiency is low.

[0006] For another example, in a Chinese patent with the patent number CN117923417A, a "Manufacturing Method of a Microfluidic Pump" is disclosed. Paragraph 0006 of the specification in its comparative document discloses the following content: "To achieve the above object, a more general implementation aspect of this case is to provide a manufacturing method of a microfluidic pump, including: Step 1. Prepare a first substrate; Step 2. Etch an upper surface of the first substrate to form at least one first groove; Step 3. Etch the upper surface of the first substrate to form a second groove, where the at least one first groove is located at the bottom of the second groove; Step 4. Deposit a first adhesive layer on the surfaces of the at least one first groove and the second groove of the first substrate; Step 5. Prepare a third substrate; Step 6. Deposit a second adhesive layer on the surface of the third substrate; Step 7. Pattern-etch the second adhesive layer; Step 8. Prepare a second substrate and bond the patterned-etched second adhesive layer of the second substrate and the third substrate to each other; Step 9. Remove a part of the second substrate; Step 10. Pattern-etch the second substrate; Step 11. Bond the surface of the first substrate having the at least one first groove and the second groove to the second substrate; Step 12. Remove a part of the third substrate; Step 13. Sequentially deposit a lower electrode layer and a piezoelectric layer on the third substrate; Step 14. Pattern-etch the lower electrode layer and the piezoelectric layer; Step 15. Deposit a flow channel layer and pattern-etch the flow channel layer; Step 16. Deposit an upper electrode layer and pattern-etch the upper electrode layer; Step 17. Pattern-etch the flow channel layer and the third substrate; Step 18. Pattern-etch a lower surface of the first substrate; Step 19. Etch the first adhesive layer"; It can be seen that this Chinese patent uses a semiconductor process to complete the structure of the microfluidic pump, and its manufacturing method is also based on a silicon-based semiconductor process. However, the silicon-based semiconductor process has a high wafer cost, and the materials compatible with the semiconductor process are all brittle, with high risks in the reliability, fatigue characteristics, drum test, and drop test of the prepared micropump, and poor performance, making it difficult to mass-produce at low cost and high efficiency.

[0007] In addition, a single conductive layer of an existing piezoelectric micropump can often only lead out one electrode interface of the actuating element. Therefore, it is necessary to provide a conductive layer on each side of the actuating element to achieve the lead-out of the power supply interface of the actuating element. The reason is that: if the same conductive layer is divided into two mutually independent conductive parts, it is very difficult to position and install the two conductive parts on the same layer. Moreover, there are also difficulties in connecting the two conductive parts on the same layer to the electrode interfaces on both sides of the actuating element respectively. Summary of the Invention

[0008] The object of the present invention is to solve the problem of low efficiency in the preparation process of existing piezoelectric micropumps, and to provide a method for preparing a piezoelectric micropump based on array processing and segmentation and the obtained piezoelectric micropump. An array processing scheme is used, and a composite process such as chemical etching, photolithography, and laser precision processing is adopted to process each layer of three-dimensional structure, and the array processing of the micropump is realized by using a whole-piece array bonding. Finally, the preparation process of integral one-time array dicing is adopted, which can achieve batch preparation and improve the efficiency and processing consistency of batch production of piezoelectric micropumps.

[0009] In a first aspect, the present invention provides a method for preparing a piezoelectric micropump based on array processing and segmentation, which includes the following steps:

[0010] Process a sheet material to form a plurality of identical device units; a plurality of sheet materials respectively form single-layer array structures corresponding to different device layers of the piezoelectric micropump pump body.

[0011] Precisely align and bond the single-layer array structures corresponding to different device layers of the piezoelectric micropump pump body in sequence to form a whole-board array pump body structure including a plurality of pump bodies.

[0012] Dice the whole-board array pump body structure to separate independent pump bodies.

[0013] Preferably, on the sheet material, the dicing segmentation path encloses to form a plurality of segmentation regions. The structure of a single device layer is processed on a single segmentation region. The device layer includes an electrode layer. The process of processing the single-layer array structure corresponding to the electrode layer is as follows: Process an electrode layer hollow-out structure in the segmentation region. The electrode layer hollow-out structure includes a central through groove, a first partition groove, and a second partition groove. One ends of the first partition groove and the second partition groove are respectively connected to different positions at the central through groove. Both the first partition groove and the second partition groove intersect with the dicing segmentation path. The first partition groove and the second partition groove divide the solid structure in the segmentation region into two conductive parts; the two conductive parts are respectively a first conductive part and a second conductive part. The first conductive part extends out a wiring terminal. Along the circumferential direction of the central through groove, the coverage range of the second conductive part is larger than that of the first conductive part. After dicing is completed, the first conductive part and the second conductive part are completely separated to avoid short circuit.

[0014] Preferably, a conductive region is provided on the single-layer array structure corresponding to the electrode layer; the conductive region passes through the second conductive parts of all the electrode layer hollow-out structures and is staggered from the first conductive parts of all the electrode layer hollow-out structures; before bonding, a conductive adhesive is applied to the conductive region, and an insulating adhesive is applied to the region outside the conductive region.

[0015] Therefore, after bonding, the second conductive part will be conducted with the adjacent connection layer or diaphragm layer, while the first conductive part will be insulated from the adjacent connection layer or diaphragm layer.

[0016] Preferably, the device units on the single-layer array structure are arranged in a matrix. The conductive regions include a plurality of rectangular regions corresponding to the number of columns of the electrode layer hollow-out structure; each rectangular region corresponds to one row of the electrode layer hollow-out structure.

[0017] This arrangement of the conductive regions makes the coating of the conductive adhesive and the insulating adhesive more convenient, only requiring a linear coating, thereby simplifying the complexity of the single-layer array structure corresponding to the electrode layer and then the coating of the conductive adhesive and the insulating adhesive.

[0018] Preferably, in addition to the piezoelectric micropump pump body, single-layer array structures corresponding to the valve body layer and the driving layer are also produced. The driving layer is provided with a circuit structure for driving the actuator. The single-layer array structures corresponding to the valve body layer and the driving layer are accurately aligned and bonded. Each pump body separated by dicing is inspected; the qualified pump bodies are bonded to different valve body layer units one by one.

[0019] Preferably, in addition to the piezoelectric micropump pump body, single-layer array structures corresponding to the valve body layer and the driving layer are also produced. The driving layer is provided with a circuit structure for driving the actuator. The different device layers of the valve body layer, the driving layer and the piezoelectric micropump pump body are accurately aligned and bonded in sequence together.

[0020] Preferably, when processing the single-layer array structure corresponding to the valve body layer, two via holes are opened on the valve body layer; two driving output contacts are provided on the driving layer; elastic conduction structure members are loaded into the two via holes; the two conduction structure members conduct the two conductive parts on the electrode layer and the two driving output contacts on the driving layer respectively through contact conduction.

[0021] Preferably, the conduction structure member uses a spring.

[0022] Preferably, the sheet material is cleaned and planarized; the process of planarization is to temporarily bond the sheet material and perform fine grinding or CMP (chemical mechanical polishing) treatment according to the actual flatness requirements. Specifically, the steps of temporary bonding include: first, cleaning and pre-treating the sheet material, then coating a layer of temporary bonding material on the sheet material, then aligning the sheet material with the substrate and applying pressure and temperature to cure the material to form a stable connection; performing grinding, CMP, cutting, and testing treatments in the bonded state; finally, separating the sheet material from the substrate by heating, solvent dissolution or UV irradiation, etc., and performing cleaning and inspection.

[0023] Preferably, the bonding method for the single-layer array structures corresponding to different device layers is adhesive bonding.

[0024] Preferably, the processing method for the sheet material includes any one or more of etching, laser processing, and photolithography processing.

[0025] Preferably, in the integrated array pump body structure obtained by bonding, through-hole and / or blind-hole structures are provided in each single-layer array structure, and a conductive structure is formed to achieve three-dimensional electrical conduction between layers. The forming methods of the conductive structure include, but are not limited to, in-hole metallization, silver paste perfusion, and conductor insertion.

[0026] Preferably, the dicing is performed by a dicing wheel or laser cutting.

[0027] Preferably, the sheet material can be stainless steel, carbon fiber, or a product obtained by primary chemical etching processing.

[0028] In a second aspect, the present invention provides a piezoelectric micropump prepared by the above-mentioned piezoelectric micropump preparation method; the piezoelectric micropump includes a flow channel layer, a resonant layer, a first connection layer, a diaphragm layer, a second connection layer, and an electrode layer stacked in sequence. A pump flow chamber is formed between the flow channel layer and the resonant layer. A resonant cavity is formed between the diaphragm layer and the resonant layer; a first through-flow hole is provided at the center position on the resonant layer, and a plurality of second through-flow holes surround the first through-flow hole. An actuating element is fixed on the diaphragm layer; one side of the actuating element is electrically connected to the first conductive part through a wiring terminal; the other side of the actuating element is electrically connected to the second conductive part through the diaphragm layer, the second connection layer, and conductive adhesive;

[0029] In a third aspect, the present invention provides a piezoelectric micropump prepared by the above-mentioned piezoelectric micropump preparation method; the piezoelectric micropump includes a pump body, a valve body layer, and a driving layer stacked in sequence; the pump body includes an end cover layer, a flow channel layer, a resonant layer, a diaphragm layer, and an electrode layer stacked in sequence. An actuating element is fixed on the diaphragm layer; the valve body layer is connected to the electrode layer; two driving output contacts on the driving layer are respectively connected to two conductive parts of the electrode layer through a conduction structure member in the valve body layer. An actuating element is fixed on the diaphragm layer; one side of the actuating element is electrically connected to the first conductive part through a wiring terminal; the other side of the actuating element is electrically connected to the second conductive part through the diaphragm layer and conductive adhesive;

[0030] The beneficial effects of the present invention are as follows:

[0031] 1. Through chemical etching, photolithography, and laser processing, the present invention can obtain a single-layer array structure with array device units; by bonding the single-layer array structures of different devices and then dicing the whole, multiple independent piezoelectric micropumps can be obtained synchronously. Such a preparation process can fabricate piezoelectric micropumps in plates, effectively improving the production efficiency of piezoelectric micropumps and making the piezoelectric micropumps have higher stability and consistency.

[0032] 2. In the electrode layer hollowed-out structure of the array processing of the present invention, two partition grooves intersecting the segmentation path are provided; before dicing and segmentation, the entities of the entire electrode array structure are connected as a whole, making the docking between the electrode array structure and other single-layer array structures very convenient; after dicing and segmentation, the solid parts of each electrode layer unit are divided into two independent conductive parts due to the partition grooves; based on this, the present invention realizes the same-layer integration of the two conductive parts while avoiding complex positioning and assembly, further reducing the production process complexity and cost of the piezoelectric micropump.

[0033] 3. The present invention sets multiple rectangles as conductive regions on the electrode array structure, coats conductive adhesive in the conductive regions, and coats insulating adhesive in the remaining regions; thus, while completing the bonding of the electrode array structure, the differential conduction of the two conductive parts on the same layer is achieved, which not only uses device layers such as the diaphragm layer for electrical connection of the actuating device, but also avoids short circuits between the two conductive parts due to device layers such as the diaphragm layer. At the same time, setting the conductive regions as rectangles enables the conductive adhesive and the insulating adhesive to be coated only along straight lines while realizing the function, improving the convenience of adhesive coating.

[0034] 4. The present invention uses a spring as a conduction structural member between the driving layer and the electrode layer, ensuring that the conductive path of the piezoelectric micropump does not fail under high-frequency vibration on the three-dimensional electrical level of the micropump, and at the same time realizing elastic contact on the mechanical level to reduce the kinetic energy loss of vibration.

[0035] 5. The preparation method of the piezoelectric micropump used in the present invention is based on a non-silicon MEMS process of metal materials and composite materials, combines the advantages of laser precision processing and some semiconductor processing processes, realizes flexible, high-yield, and low-cost mass production, and the micropump has high reliability and strong anti-drop ability. Description of the Drawings

[0036] Figure 1 is an exploded structural schematic diagram of the valve-less piezoelectric micropump prepared in Embodiment 1 of the present invention;

[0037] Figure 2 is a schematic diagram of the preparation process in Embodiment 1 of the present invention;

[0038] Figure 3 is a combined schematic diagram of the single-layer array structures prepared in Embodiment 1 of the present invention;

[0039] Figure 4 is a top view schematic diagram of the electrode array structure prepared in Embodiment 1 of the present invention;

[0040] Figure 5 is an exploded structural schematic diagram of the piezoelectric micropump prepared in Embodiment 2 of the present invention;

[0041] Figure 6It is a schematic installation diagram of the conduction structure member in the piezoelectric micropump prepared in Embodiment 2 of the present invention;

[0042] Figure 7 It is a schematic preparation process diagram of Embodiment 2 of the present invention;

[0043] Figure 8 It is a schematic top view of the array structure of the diaphragm layer prepared in Embodiment 2 of the present invention;

[0044] Figure 9 It is a schematic bottom view of the array structure of the diaphragm layer prepared in Embodiment 2 of the present invention;

[0045] Figure 10 It is a schematic top view of the array structure of the resonant layer prepared in Embodiment 2 of the present invention;

[0046] Figure 11 It is a schematic preparation process diagram of Embodiment 3 of the present invention.

[0047] Reference numerals: 100, flow channel layer; 200, resonant layer; 300, first connection layer; 400, diaphragm layer; 401, actuating element; 500, second connection layer; 600, electrode layer; 700, end cap layer; 800, valve body layer; 801, through hole; 802, conduction structure member; 900, driving layer; 901, driving output contact; 1, flow channel array structure; 2, resonant array structure; 3, first connection array structure; 4, diaphragm array structure; 5, second connection array structure; 6, electrode array structure; 6-1, central through groove; 6-2, air inlet channel; 6-3, first partition groove; 6-4, second partition groove; 6-5, terminal; 6-6, first conductive part; 6-7, second conductive part; 6-8, conductive area. Detailed implementation manners

[0048] The present invention will be further described below with reference to the accompanying drawings.

[0049] Embodiment 1

[0050] A preparation method of a piezoelectric micropump is used to prepare a special valve-less piezoelectric micropump.

[0051] As Figure 1 shown, the valve-less piezoelectric micropump includes a pump body, and the pump body includes a plurality of device layers, which are respectively the flow channel layer 100, the resonant layer 200, the first connection layer 300, the diaphragm layer 400, the second connection layer 500, and the electrode layer 600 stacked from top to bottom.

[0052] A pump flow chamber is formed between the flow channel layer 100 and the resonance layer 200. A resonance cavity is formed between the diaphragm layer 400 and the resonance layer 200; a first through-flow hole is provided at the center position of the resonance region of the resonance layer 200, and four second through-flow holes surrounding the first through-flow hole are provided around it. The first through-flow hole and the second through-flow holes are used for fluid exchange between the pump flow chamber and the resonance cavity. An actuating element 401 is fixed on the side of the diaphragm layer 400 facing away from the resonance layer 200; the actuating element 401 vibrates through the piezoelectric effect.

[0053] In this embodiment, the piezoelectric micropump as a whole is square; in some other embodiments, the piezoelectric micropump as a whole can also be circular, oval, or rectangular other than square.

[0054] An air outlet through-hole communicating with the pump flow chamber is provided at the center position of the flow channel layer 100; through-holes are provided at the four corners of all device layers except the flow channel layer 100; the through-holes at the four corners of each device layer are aligned with each other to form an air inlet channel 6-2. The flow channel layer 100 is provided with a flow channel structure for communicating the air inlet channel 6-2 with the pump flow chamber.

[0055] In this embodiment, the outer edge contour shapes and sizes of the flow channel layer 100, the resonance layer 200, the first connection layer 300, the diaphragm layer 400, the second connection layer 500, and the electrode layer 600 are the same, which is convenient for the overall preparation and dicing of the piezoelectric micropump during the preparation of the piezoelectric micropump. The actuating element 401 is a wafer.

[0056] The fluid transmission principle of this piezoelectric micropump is as follows:

[0057] The transmission principle is as follows: When the actuating element 401 drives the central part of the diaphragm layer 400 to vibrate and deform upward, the surrounding part of the diaphragm layer 400 bends downward; at the same time, the central part of the resonance layer 200 bends downward and deforms, so that the volume of the central region of the resonance cavity increases to form a low-pressure area; the part of the diaphragm layer 400 that bends downward around it approaches the part of the resonance layer 200 that bends upward around the four sides, so that the volume of the edge region of the resonance cavity decreases to form a high-pressure area. Since the flow resistance of the surrounding high-pressure area is larger than that of the central part, during the vibration stage, the air flow is sucked into the resonance cavity from the first through-flow hole in the center of the resonance layer 200, and the fluid in the high-pressure area is squeezed out from the second through-flow holes around the four sides of the resonance layer 200 and enters the flow channel cavity.

[0058] Similarly, when the central part of the diaphragm layer 400 is driven by the actuating element 401 to vibrate and deform downward, the air flow is squeezed and inhaled from the second through-holes around the resonant layer 200 into the edge area of the resonant cavity; the fluid in the central area of the resonant cavity flows out from the first through-hole in the center of the resonant layer 200; due to the high-speed vibration of the actuating element 401 and the resonant layer 200, the fluid ejected in the resonant layer 200 can be regarded as a continuous state. When the continuous fluid enters the resonant cavity, since the air pressure in the area where the gas flows at high speed is lower; the edge of the pumping chamber on the flow channel layer 100 is connected to the atmospheric environment through the air inlet channel 6-2, and the cold air flows through the entire pump body into the flow channel cavity, mixes with the high-speed jet to form a turbulent flow and is finally ejected from the air outlet through-hole in the center of the flow channel layer 100.

[0059] The preparation method provided in this embodiment performs array processing on each device layer on the same piece of sheet material, and integrally bonds the corresponding array structures of the obtained different device layers at one time. Such a method makes it faster to prepare the piezoelectric micropump, and thus the yield is also higher. Therefore, this embodiment is more suitable for the preparation process that requires a high yield.

[0060] As Figure 2 shown, the preparation method of the piezoelectric micropump includes the following steps:

[0061] S1: Clean the initial sheet material.

[0062] Each piece of sheet material corresponds to a device layer. The sheet material includes raw materials such as stainless steel and carbon fiber, or products that have undergone primary chemical etching processing. Except for the actuating element 401, the materials used for other pump body layers are whole stainless steel sheets, carbon fiber sheets, or other products that have undergone primary chemical etching processing. In this embodiment, the initial sheet material used is a carbon fiber sheet. In some other embodiments, a stainless steel sheet can also be used.

[0063] S2: Perform a planarization process on the sheet material.

[0064] In this embodiment, the initial material used is a carbon fiber sheet. In some other embodiments, a stainless steel sheet can also be used; first, the single carbon fiber sheet is flattened; in this embodiment, the flattening operation is achieved by using a temporary bonding method; the process of the temporary bonding method is: first, the carbon fiber sheet is pretreated, then a layer of glue is coated on the carbon fiber sheet, and then the carbon fiber sheet is aligned and pressurized to cure the material onto the glass substrate, thus achieving the state of temporary bonding. In some other embodiments, other feasible connection methods can be used for flattening.

[0065] S3: Perform array forming on the piezoelectric micropump device layer structure or body structure of the sheet material obtained in step S2 to form a whole-board array pump single-layer structure with a complete structure.

[0066] In this embodiment, the sheet material is rectangular, and a surface structure or a volume structure is formed by laser processing to obtain a single-layer array structure corresponding to each device layer. In some other embodiments, other processing techniques including etching and photolithography can also be used. Each single-layer array structure of the full-page array pump is pre-drawn. The flattened carbon fiber sheet is placed on the table of the laser processing machine and processed automatically according to the pre-drawn structure. In this embodiment, each single-layer array structure includes a plurality of identical device units arranged in a matrix. Each device unit corresponds to a device layer of a piezoelectric micropump. Thus, six different single-layer array structures corresponding to six types of device layers are formed, namely, a flow channel array structure 1, a resonance array structure 2, a first connection array structure 3, a diaphragm array structure 4, an insulation array structure, a second connection array structure 5, and an electrode array structure 6.

[0067] In this embodiment, the shape of each single-layer array structure after processing is as Figure 3 shown. It can be seen that there are 16 device units on each single-layer array structure. After all the single-layer structures of the full-page array pump are processed, step is completed. At this time, six carbon fiber sheets are obtained, which respectively contain 16 flow channel layers 100, resonance layers 200, first connection layers 300, diaphragm layers 400, second connection layers 500, and electrode layers 600. In some other embodiments, other feasible numbers of device units and arrangement forms can be set on each single-layer array structure.

[0068] In this embodiment, the electrode array structure 6 is specially designed to be able to automatically form two independent conductive parts by the splitting action after bonding. The processing process of the electrode array structure 6 is as follows:

[0069] As Figure 4 shown, a plurality of electrode layer hollow-out structures arranged in an n×n pattern are processed on the sheet material. Each electrode layer hollow-out structure is located in a splitting area (i.e., the rectangular area surrounded by the dotted line in Figure 4 ) divided by the sheet material along the target splitting path (corresponding to the dotted line in Figure 4 ). The electrode layer hollow-out structure includes a central through groove 6-1, an air inlet channel 6-2, a first dividing groove 6-3, and a second dividing groove 6-4. Four air inlet channels 6-2 surround the central through groove 6-1. One ends of the first dividing groove 6-3 and the second dividing groove 6-4 are connected to different positions at the central through groove 6-1. The other ends of the first dividing groove 6-3 and the second dividing groove 6-4 extend to the boundary of the splitting area.

[0070] The first partition groove 6-3 and the second partition groove 6-4 divide the physical structure within a partition area into a first conductive part 6-6 and a second conductive part 6-7. Specifically, the first conductive part 6-6 is formed between the adjacent side areas of the first partition groove 6-3 and the second partition groove 6-4; the second conductive part 6-7 of the entity is formed in the opposite side areas of the first partition groove 6-3 and the second partition groove 6-4. A wiring terminal 6-5 is reserved in the central through groove 6-1. One end of the wiring terminal 6-5 is connected to the first conductive part 6-6; the other end of the wiring terminal 6-5 is suspended and used to connect to the nodal position of the actuating element 401.

[0071] Before the electrode array structure 6 is partitioned, the first conductive part 6-6 and the second conductive part 6-7 in the same partition area are fixedly connected together through the physical structure on the adjacent partition area, so that the first conductive part 6-6 and the second conductive part 6-7 maintain a fixed relative position.

[0072] When the electrode array structure 6 is partitioned, since both the first partition groove 6-3 and the second partition groove 6-4 intersect the partition path, the first conductive part 6-6 and the second conductive part 6-7 are divided into two completely independent parts. However, since the partitioning step is performed after the bonding of each single-layer array structure, the first conductive part 6-6 and the second conductive part 6-7, although independent of each other, maintain a fixed relative position through the remaining single-layer array structures. Thus, two conductive parts for leading out the two poles of the actuating element 401 are automatically formed on the once-processed electrode array structure 6.

[0073] S4: Apply a bonding medium layer to each single-layer array structure respectively.

[0074] In this embodiment, a plurality of actuating elements 401 are respectively pasted on the diaphragm layer 400 units of the diaphragm array structure 4; and a bonding medium is coated on the side surfaces of all single-layer array structures. In this embodiment, the bonding method of glue bonding is adopted, so the applied bonding medium is glue, and the machines used are screen printers or dispensing machines; in some other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used, so the applied bonding medium can also be glass or metal.

[0075] The method of applying glue on the electrode array structure 6 is different from that on other single-layer array structures; specifically as follows: Only one kind of glue is applied on the outer frame areas of the flow channel array structure 1, the resonant array structure 2, the first connection array structure 3, the diaphragm array structure 4, the insulation array structure, and the second connection array structure 5. Two different kinds of glue are applied at different positions on the electrode array structure 6. Among them, each row of electrode layer hollow-out structures of the electrode array structure 6 corresponds to a rectangular (linear long strip-shaped) conductive area 6-8. The conductive area 6-8 only intersects with the second conductive part 6-7, and is staggered from the first conductive part 6-6 and the wiring terminal 6-5. When applying glue, conductive glue is applied on the conductive area 6-8 of the electrode array structure 6, and insulating glue is applied on other areas of the electrode array structure 6.

[0076] S5: Perform precise alignment on the seven single-layer array structures.

[0077] In this embodiment, an automatic alignment is performed using a CCD vision alignment system to completely align the flow channel array structure 1, the resonant array structure 2, the first connection array structure 3, the diaphragm array structure 4, and the second connection array structure 5, that is, the process of step S5 is completed.

[0078] S6: Bond the six single-layer array structures of the whole-board array pump to form a complete whole-board array pump structure.

[0079] Bond the six single-layer array structures of the whole-board array pump. In this embodiment, a glue bonding method is used for bonding; specifically, resin bonding can be used for glue bonding. In some other embodiments, bonding methods such as anodic bonding and eutectic bonding can also be used. In this embodiment, the glue bonding is completed using a method of heating, pressurizing, and evacuating. After step S6, the entire piezoelectric micro-pump array can be obtained.

[0080] S7: Complete three-dimensional electrical conduction for each layer structure and lead out the pump body terminals to the required positions.

[0081] Complete three-dimensional electrical conduction for each layer of electrode array structure and lead out the pump body terminals to the required positions. In this embodiment, three-dimensional electrical conduction between layers is completed by preparing through holes and / or blind hole structures for each layer and forming a flow channel layer and / or an electrode layer in the holes (the methods include but are not limited to in-hole metallization, silver paste perfusion, and insertion of conductors, etc.).

[0082] S8: Slice the piezoelectric micro-pump array to obtain a number of single piezoelectric micro-pumps.

[0083] Slice the complete whole-board array pump structure to obtain a number of single piezoelectric micro-pumps. During the slicing process, the connection between the first conductive part and the second conductive part of each electrode layer unit in the electrode array structure is cut off, thereby automatically leading out the two poles.

[0084] In this embodiment, a dicing machine is used for dicing with a cutting wheel. In some other embodiments, laser dicing can also be used. Dicing is performed according to the size of a single piezoelectric micropump into 16 single piezoelectric micropumps, and the preparation process is completed to obtain 16 piezoelectric micropumps. Generally, after the preparation is completed, calibration and testing of the piezoelectric micropumps are also required.

[0085] Embodiment 2

[0086] A method for preparing a piezoelectric micropump for preparing a piezoelectric micropump;

[0087] As Figure 5 shown, the piezoelectric micropump includes a stacked pump body, a valve body layer 800, and a driving layer 900; the pump body includes a stacked end cap layer 700, a flow channel layer 100, a resonance layer 200, a diaphragm layer 400, and an electrode layer 600 from top to bottom. On the side of the diaphragm layer 400 facing away from the resonance layer 200, an actuating element 401 is fixed; a reinforcing layer is provided between the actuating element 401 and the diaphragm layer 400. The actuating element 401 vibrates through the piezoelectric effect, driving the reinforcing layer and the diaphragm layer 400 to vibrate together.

[0088] In the piezoelectric micropump prepared in this embodiment, the driving part, i.e., the driving layer 900, is integrated into the piezoelectric micropump. Figure 9 is an isometric view of a piezoelectric micropump of the present invention, which specifically shows the shape and structure of the piezoelectric micropump in this embodiment, as Figure 9 shown; in this embodiment, the piezoelectric micropump is rectangular as a whole, a special square in this embodiment, and can also be circular in some other usage scenarios. And in this embodiment; the piezoelectric micropump has no redundant external circuit interfaces and has a very strong integrity. The shape, length, and width of each layer of the piezoelectric micropump as a whole are the same. When preparing the piezoelectric micropump, it is convenient for the overall preparation and dicing of the piezoelectric micropump. The size of the piezoelectric micropump in this embodiment is only 15*15*2.43 mm, and in some other implementation cases, the piezoelectric micropump can also be circular.

[0089] In this embodiment, the end cap layer 700, the flow channel layer 100, the resonance layer 200, the diaphragm layer 400, the electrode layer 600, the valve body layer 800, and the driving layer 900 have the same outer shape and size, all being special squares with the same side length.

[0090] In this embodiment, as Figure 5As shown, the end cap layer 700 is a square sheet-like structure, and four intake through-holes are distributed on the surface of the end cap layer 700; the four intake through-holes are distributed at the four corners of the edge of the end cap layer 700; the flow channel layer 100 is also a square sheet-like structure, and an intake chamber communicating with the intake through-holes is provided in the flow channel layer 100. The intake chamber includes a large round hole at the center and rectangular flow channel grooves distributed around; the resonance layer 200 is also a square sheet-like structure, and resonance holes corresponding to the diaphragm layer 400 and the flow channel layer 100 are distributed on the surface of the resonance layer 200.

[0091] In this embodiment, the reinforcing layer and the actuating element 401 have the same shape, both being circular; there is a circular oscillator in the middle of the diaphragm layer 400 with the same shape as the actuating element 401 and the reinforcing layer; the circular oscillator in the middle of the diaphragm layer 400 is connected to the surrounding support frames through an elastic structure; thus enabling the actuating element 401 to drive the circular oscillator in the middle of the diaphragm layer 400 to perform reciprocating vibrations.

[0092] In this embodiment, the electrode layer 600 is also a square sheet-like structure, and its specific structure is the same as that of the electrode layer 600 in Embodiment 1, and natural insulation between the first conductive part 6-6 and the second conductive part 6-7 is achieved through the partition groove and cutting after bonding. The first conductive part 6-6 is electrically connected to one side of the actuating element 401 through the terminal 6-5; the second conductive part 6-7 is electrically connected to the other side of the actuating element 401 through the conductive adhesive and the diaphragm layer 400.

[0093] As Figure 5 and Figure 6 shown, a drive circuit and an algorithm circuit are integrated on the drive layer 900; drive output contacts 901 are provided on the drive layer 900, and through-holes 801 are opened on the valve body layer 800 at positions corresponding to the drive output contacts 901 of the drive layer 900; two drive output contacts 901 are symmetrically distributed on one side of the drive layer 900, and the through-holes 801 corresponding to the drive output contacts 901 are also symmetrically distributed on one side of the valve body layer 800. One of the symmetrically distributed through-holes 801 is aligned with the first conductive part 6-6, and the other is aligned with the second conductive part 6-7; conduction structure members 802 are provided in both of the two through-holes 801. The two ends of the conduction structure member 802 respectively abut against the conductive part of the electrode layer 600 and the drive output contact 901 on the drive layer 900, realizing the conduction between the drive output contact 901 and the conductive part, and further realizing the drive of the actuating element 401 by the drive output contact 901.

[0094] As Figure 6 shown, the conduction structure member 802 passes through the through-hole 801. In this embodiment, the conduction structure member 802 is a metal material spring, which has good electrical conductivity characteristics. The spring is used because the spring has good shock absorption characteristics and can still maintain good strength under the high-frequency vibration of the piezoelectric micropump, which can not only ensure the electrical conductivity characteristics but also ensure the strength.

[0095] In this embodiment, the working principle of the fabricated piezoelectric micropump is as follows: The driving layer 900 controls the operation of the piezoelectric micropump. The driving output contact 901 of the driving layer is connected to the through hole 801 in the valve body layer 800. The bottom of the through hole 801 is connected to the driving output contact 901 of the driving layer 900, and the top of the through hole 801 is connected to the electrode layer 600. There is a spring conduction structure member 802 in the through hole 801. The top of the electrode layer 600 is connected to the diaphragm layer 400, the bottom of the electrode layer 600 is connected to the valve body layer 800, and there is a protruding cantilever inside the electrode layer 600, and the cantilever is connected to the actuating element 401, thereby driving the actuating element 401.

[0096] The fluid transmission principle of a piezoelectric micropump in this embodiment is as follows: When the actuating element 401 vibrates upward, the diaphragm layer 400 bends downward, the convex part of the reinforcing layer approaches the resonant layer 200 to form a high-pressure area, and the diaphragm layer 400 is far from the resonant layer 200 to form a low-pressure area. The fluid flows from the high-pressure area to the low-pressure area. Since the central position is the high-pressure area with the largest flow resistance and the surrounding areas are the low-pressure areas with the smallest flow resistance, the flow rate flowing out to the outside through the high-pressure area is much smaller than the flow rate flowing into the pump chamber through the surrounding areas, thus realizing the outflow of the fluid.

[0097] When the actuating element 401 vibrates downward, the diaphragm layer 400 bends upward, the diaphragm layer 400 approaches the resonant layer 200 to form a high-pressure area, while the reinforcing layer is far from the resonant layer 200 to form a low-pressure area. The high-pressure area has a large flow resistance and the low-pressure area has a small flow resistance, and the fluid surges in at high speed through the fluid channel.

[0098] In the piezoelectric micropump of this embodiment, the driving layer 900 and the electrode layer 600 are connected through the three-dimensional conduction structure member 802 to control the fluid delivery of the piezoelectric micropump, and at the same time, the terminals of the driving layer 900 and the electrode layer 600 are guided to appropriate positions, which not only makes the overall structure of the piezoelectric micropump simpler, reduces the volume and area of the piezoelectric micropump, but also makes the piezoelectric micropump an integral structure, facilitating the overall fabrication and dicing of the piezoelectric micropump.

[0099] As Figure 7 shown, a method for fabricating a piezoelectric micropump provided in this embodiment includes the following steps:

[0100] S1: Cleaning the initial sheet material.

[0101] Each sheet material corresponds to a device layer. The sheet material includes raw materials such as stainless steel and carbon fiber or products that have undergone primary chemical etching processing. Except for the actuating element 401, the materials used for other pump body layers are whole stainless steel sheets, carbon fiber sheets or products that have undergone primary chemical etching processing. In this embodiment, the initial sheet material used is a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used.

[0102] S2: Level the material;

[0103] In this embodiment, the initial material used is a stainless - steel sheet. In some other embodiments, a carbon - fiber sheet can also be used. First, the single stainless - steel sheet is flattened. In this embodiment, the method of temporary bonding is used for flattening. The steps of temporary bonding include: first, cleaning and pre - treating the stainless - steel sheet and the glass substrate, then coating a layer of temporary bonding material on the stainless - steel sheet and / or the glass substrate, then aligning the two and applying a certain pressure and temperature to cure the material to form a stable connection; performing process treatments such as grinding, cutting, and testing in the bonded state; finally, separating the stainless - steel sheet from the glass substrate by heating, solvent dissolution, or UV irradiation, and performing cleaning and inspection. In this embodiment, first, the stainless - steel sheet is pre - treated, then a layer of glue is coated on the stainless - steel sheet, and then the stainless - steel sheet is aligned and pressurized to cure the material onto the glass substrate, thus achieving the state of temporary bonding.

[0104] S3: Form the surface structure or body structure of each array of the pump to form a single - layer array structure with a complete structure;

[0105] In this embodiment, the sheet material is circular, and the method of laser processing is used. In some other embodiments, processes such as etching or photolithography can also be used. The structure of each layer is pre - drawn. The flattened sheet material is placed on the stage of the laser processing machine and processed automatically according to the pre - set structure. Figure 8 is the top view of a wafer of a preparation method of a piezoelectric micropump according to the present invention. Figure 9 is the bottom view of a wafer of a preparation method of a piezoelectric micropump according to the present invention. Figure 8 and Figure 9 is the structure of the wafer of the diaphragm layer 400 in this embodiment. It can be seen that there are 52 diaphragm layers 400. The flattened stainless - steel sheet is placed on the stage of the laser processing machine, and then the laser processing machine is used to process the pre - set structure. In this embodiment, since both sides of the diaphragm layer 400 need to be processed, first, the top - surface structure of the diaphragm layer 400 as shown in Figure 8 is processed. At this time, the bonding medium (i.e., glue) of the processed diaphragm layer 400 is dissolved, then the diaphragm layer 400 is flipped, and another temporary bonding is performed to process the bottom - surface structure of the diaphragm layer 400 as shown in Figure 7 , that is, the laser processing of the diaphragm layer 400 is completed.

[0106] In this embodiment, the single - layer array structure of each layer is processed separately. Figure 10It is a diagram of another wafer for the preparation method of a piezoelectric micropump, that is, the wafer of the diaphragm layer 400 in this embodiment. In this embodiment, except for the diaphragm layer 400, the remaining layers only need to be processed by laser once. Place another flattened stainless steel sheet on the machine table of the laser processing machine, and the structure of the diaphragm layer 400 can be processed. The processing processes of the end cap layer 700 and the flow channel layer 100 are the same as that of the diaphragm layer 400. The processing process of the electrode layer 600 is the same as that of the electrode layer 600 in Embodiment 1. After all the processing, use glue to stick the reinforcement layer and the actuator element 401 to the bottom of the diaphragm layer 400. The reinforcement layer and the actuator element 401 are pre-stuck together, that is, the processing of step 302 is completed; at this time, a five-layer single-layer array structure including 52 end cap layers 700, 52 flow channel layers 100, 52 diaphragm layers 400, 52 resonant layers 200, and 52 electrode layers 600 can be obtained.

[0107] S4: Apply a bonding medium layer to the single-layer array structure of the full-panel array pump;

[0108] In this embodiment, the bonding method of glue bonding is used for bonding, so the applied bonding medium is glue, and the machine used is a screen printer or a dispensing machine. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding, or resin bonding can also be used, so the applied bonding medium can also be glass or metal. The specific process is to apply glue to the flow channel layer 100, flow channel layer 100, diaphragm layer 400, resonant layer 200, and electrode layer 600 of the pump body. Specifically, for the flow channel layer 100 and the flow channel layer 100, the hollow parts, that is, the heat dissipation holes and the flow channel holes, are not filled with glue, and the rest of the parts need to be filled with glue. For the resonant layer 200, the resonant holes and the positions corresponding to the flow channel holes are not filled with glue, and the rest of the parts need to be filled with glue. For the diaphragm layer 400 and the electrode layer 600, only the outer circle needs to be filled with glue. In this way, the process of step S303 is completed.

[0109] In this embodiment, the process of applying conductive glue and insulating glue to the electrode layer 600 is the same as that in step S4 of Embodiment 1.

[0110] S5: Perform precise alignment on each layer structure of the full-panel array pump;

[0111] In this embodiment, a CCD vision alignment system is used for automatic alignment to completely align the five single-layer array structures of the full-panel array pump body.

[0112] S6: Bond each layer structure of the full-panel array pump to form a full-panel array pump body structure;

[0113] In this embodiment, the bonding is carried out by means of adhesive bonding. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding or resin bonding can also be used. In this embodiment, the adhesive bonding is completed by the method of heating, pressurizing and evacuating. At this time, a wafer including 52 pump bodies can be obtained.

[0114] S7: Dicing the whole array pump body structure to obtain a number of single pump bodies.

[0115] In this embodiment, dicing is carried out using a dicing machine. Dicing is performed into 52 single pump bodies according to the size of a single pump body. At this time, intermediate inspection can be carried out, and performance inspection is respectively carried out on each pump body obtained by dicing, and the pump bodies with abnormal performance are screened out. Since relatively speaking, the failure rate of the pump body is higher, this step can effectively improve the yield of the overall pump preparation.

[0116] S8: Forming each arrayed surface structure or body structure of the valve body layer 800.

[0117] In this embodiment, this step is similar to steps S1 and S2. First, the initial material is flattened. The initial material of the valve body also uses a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used. The flattening is carried out by means of temporary bonding. In this embodiment, first, the stainless steel sheet is pretreated, then a layer of glue is coated on the stainless steel sheet, and then the stainless steel sheet is aligned and pressurized to cure the material onto the glass substrate, thus achieving the state of temporary bonding. Then, the structure of each layer of the valve body (the structure of the valve body is not shown in the figure) is machined by laser. The structure of each layer is pre-drawn. The flattened stainless steel sheet is placed on the machine table of the laser processing machine and automatically processed according to the pre-set structure. After all the processing, the driving layer 900 is connected to the valve body. The driving layer 900 is a pre-processed PCB board.

[0118] S9: Applying a bonding medium to the valve body array structure and the driving array structure arranged in an array and carrying out bonding.

[0119] In this embodiment, this step is similar to steps S4, S5, and S6. In this embodiment, the bonding method of glue bonding is adopted, so the bonding medium applied is glue. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding, or resin bonding can also be used, so the bonding medium applied can also be glass or metal. Glue is applied to both the valve body and the driving layer 900. Specifically, only a layer of glue needs to be applied to the outer frame of the valve body and the driving layer 900, and then the CCD vision alignment system is used for automatic alignment to completely align the valve body and the driving layer 900. Finally, the valve body and the driving layer 900 are bonded. In this embodiment, the bonding method of glue bonding is adopted. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding, or resin bonding can also be used. In this embodiment, the glue bonding between the driving layer 900 and the valve body is completed by using the method of heating, pressurizing, and evacuating.

[0120] S10: Paste the single pump body obtained in step S8 onto the whole - plate valve body obtained in step S9 to obtain a whole - plate complete array pump structure.

[0121] In this embodiment, a pick - and - place machine or a wafer machine is used to paste the pump bodies qualified in inspection in step S7 one by one onto the whole - plate valve body. The pasting process also uses glue. After this step, the wafer - sheet array of the entire piezoelectric micropump can be obtained.

[0122] S11: Complete three - dimensional electrical conduction for each layer structure and lead out the pump body terminals to the required positions.

[0123] Two conductive parts on the electrode layer 600 are electrically connected and communicated with two driving output contacts 901 in the driving layer 900 through two conduction structure parts 802 in the valve body layer 800.

[0124] S12: Slice the whole - plate complete array pump structure to obtain several single piezoelectric micropumps.

[0125] In this embodiment, a dicing saw is used for dicing with a cutting wheel. In some other embodiments, laser dicing can also be used. It is diced into 52 single complete piezoelectric micropumps according to the size of a single piezoelectric micropump, and the preparation process is completed to obtain 52 piezoelectric micropumps. When preparing again, the same steps can be adopted to achieve batch preparation of piezoelectric micropumps. When the diced pump is a circular pump, only brackets need to be made around the circular pump, and then the brackets can be cut open. Generally speaking, after the preparation is completed, calibration and testing of the piezoelectric micropump are also required.

[0126] In this embodiment, the preparation method is for a kind of integrated piezoelectric micropump with a valve. An intermediate inspection process is added during the preparation of the pump body. Since the valve body and the driving layer 900 are of high value and high yield, inspecting the pump body effectively increases the yield of the piezoelectric micropump preparation.

[0127] Example 3

[0128] A method for preparing a piezoelectric micropump, which is different from Example 1 in that: instead of performing pre-dicing and inspection of the pump body in advance, the entire version of the pump body, valve body layer 800 and drive layer 900 are directly bonded to improve production efficiency.

[0129] Figure 11 It is the flowchart of this embodiment, which specifically shows the process of the third embodiment of the specific preparation method of the piezoelectric micropump in this embodiment.

[0130] A method for preparing a piezoelectric micropump provided in this embodiment includes the following steps:

[0131] Step S1: Clean the initial materials.

[0132] The initial materials include raw materials such as stainless steel and carbon fiber or products that have undergone primary chemical etching processing. Except for the actuating element 401, the materials used for other pump body layers are whole stainless steel sheets, carbon fiber sheets or products that have undergone primary chemical etching processing. In this embodiment, the initial material used is a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used.

[0133] Step S2: Perform planarization treatment on the materials.

[0134] In this embodiment, the initial material used is a stainless steel sheet. In some other embodiments, a carbon fiber sheet can also be used. First, the single stainless steel sheet is flattened. The method of temporary bonding is used for flattening. In this embodiment, the stainless steel sheet is first pretreated, then a layer of glue is coated on the stainless steel sheet, and then the stainless steel sheet is aligned and pressurized to cure the material onto the glass substrate, thus achieving the state of temporary bonding.

[0135] Step S3: Form the surface structure or body structure of each array of the pump body and the valve body layer 800.

[0136] In this embodiment, the method of laser processing is adopted. In some other embodiments, etching or photolithography and other processes can also be used. The structure of each layer is pre-drawn. The flattened stainless steel sheet is placed on the machine table of the laser processing machine and automatically processed according to the pre-set structure. After all layers of the valve body are processed, the step is completed.

[0137] Moreover, an array structure of the drive layer matching the pump body and the valve body layer 800 is processed on a whole circuit board; the array structure corresponding to the valve body layer 800 and the array structure corresponding to the drive layer are bonded (such as by pasting) together at mutually matching positions.

[0138] In some other embodiments, each driving layer can also be separately prepared and then arranged one by one or in an array and simultaneously bonded to the corresponding array structure of the valve body layer 800.

[0139] Step S4: Apply a bonding medium to each layer structure of the full-page array pump body and the valve body layer 800.

[0140] In this embodiment, the bonding method of glue bonding is adopted, so the applied bonding medium is glue, and the machine used is a screen printer or a dispensing machine. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding, or resin bonding can also be used, so the applied bonding medium can also be glass or metal. The specific process is to fill glue around the outside and at specified positions inside the pump body and the valve body.

[0141] Step S5: Perform precise alignment on each layer structure of the full-page array pump body and the valve body layer 800.

[0142] In this embodiment, a CCD vision alignment system is used for automatic alignment to completely align each layer of the pump body and the valve body layer 800.

[0143] Step S6: Bond each layer structure of the full-page array pump and valve.

[0144] In this embodiment, the bonding method of glue bonding is adopted. In some other embodiments, bonding methods such as anodic bonding, eutectic bonding, or resin bonding can also be used. In this embodiment, the glue bonding is completed by using the method of heating, pressurizing, and vacuumizing.

[0145] Step S7: Complete three-dimensional electrical conduction for each layer structure, and lead out the pump body terminals to the required positions.

[0146] In this embodiment, three-dimensional electrical conduction between each layer is completed by preparing through holes and / or blind hole structures in each layer and forming a flow channel layer 100 and / or an electrode layer 600 in the holes (the methods include but are not limited to in-hole metallization, silver paste perfusion, and insertion of conductors, etc.).

[0147] Step S8: Slice the full-page complete array piezoelectric micropump structure to obtain a number of single piezoelectric micropumps.

[0148] In this embodiment, a dicing machine is used for dicing with a cutting wheel. In some other embodiments, laser dicing can also be used. It is diced into single piezoelectric micropumps according to the size of a single piezoelectric micropump, and the preparation process is completed to obtain a number of piezoelectric micropumps. Generally speaking, after the preparation is completed, calibration and testing of the piezoelectric micropumps are also required.

[0149] This embodiment is substantially the same as Embodiment 1, but this embodiment is applicable to a piezoelectric micropump with a pump body and a valve body structure, directly bonding the pump body and the valve body at one time. Such a method makes the preparation of the piezoelectric micropump faster, and thus the yield is also higher. However, compared with Embodiment 2, in this embodiment, there is no intermediate inspection process in the steps of Embodiment 2, and the inspection of the pump cannot be carried out, which will lead to a decrease in the yield and thus an increase in the cost. Therefore, this embodiment is more suitable for the preparation process of a valved piezoelectric micropump that requires a high yield.

Claims

1. A preparation method of a piezoelectric micropump based on array processing and segmentation, characterized in that: The following steps are involved: The sheet material is processed to form a plurality of identical device units; the plurality of sheet materials respectively form a single-layer array structure corresponding to different device layers of the piezoelectric micropump body; Aligning and bonding the single-layer array structures corresponding to different device layers of the piezoelectric micropump body to form a full-page array pump body structure including multiple pump bodies; Slice the entire array pump body structure to separate the independent pump bodies; On a sheet material, a dicing segmentation path encloses a plurality of segmentation areas; a single device layer structure is processed on a single segmentation area; the device layer includes an electrode layer; the process of processing a single-layer array structure corresponding to the electrode layer is as follows: a hollow electrode layer structure is processed in the segmentation area; the hollow electrode layer structure includes a central through groove (6-1), a first separation groove (6-3) and a second separation groove (6-4); one end of the first separation groove (6-3) and the second separation groove (6-4) are respectively connected to different positions of the central through groove (6-1); the first separation groove (6-3) and the second separation groove (6-4) both intersect with the dicing segmentation path; the first separation groove (6-3) and the second separation groove (6-4) divide the entity structure in the segmentation area into two conductive parts; the two conductive parts are a first conductive part (6-6) and a second conductive part (6-7); and a connection terminal (6-5) extends from the first conductive part (6-6).

2. The preparation method of a piezoelectric micropump based on array machining segmentation according to claim 1, characterized in that: A conductive region (6-8) is provided on the single-layer array structure corresponding to the electrode layer; the conductive region (6-8) passes through the second conductive portion of the hollow structure of all electrode layers and is staggered with the first conductive portion of the hollow structure of all electrode layers; before bonding, a conductive glue is applied to the conductive region (6-8), and an insulating glue is applied to the region outside the conductive region (6-8).

3. A preparation method of a piezoelectric micropump based on array machining segmentation according to claim 2, characterized in that: The device units on the single-layer array structure are arranged in a matrix shape; the conductive regions (6-8) include a plurality of rectangular regions corresponding to the number of columns of the electrode layer hollow structures; and each rectangular region corresponds to a row of the electrode layer hollow structures.

4. A method for preparing a piezoelectric micropump based on array processing segmentation according to claim 2, characterized in that: In addition to the piezoelectric micro pump body, a single-layer array structure corresponding to the valve body layer and the driving layer is also produced; the driving layer is provided with a circuit structure of a driving actuator; the single-layer array structure corresponding to the valve body layer and the driving layer is aligned and bonded; Each pump body separated by dicing is inspected; the pump bodies that pass the inspection are bonded one by one to different valve body layer units.

5. A method for preparing a piezoelectric micropump based on array processing segmentation according to claim 2, characterized in that: In addition to the piezoelectric micropump body, a single-layer array structure corresponding to the valve body layer and the drive layer is also produced; the drive layer is provided with a circuit structure of a drive actuator; the different device layers of the valve body layer, the drive layer and the piezoelectric micropump body are aligned and bonded together.

6. A method for preparing a piezoelectric micropump based on array machining segmentation according to claim 4 or 5, characterized in that: When processing a single-layer array structure corresponding to the valve body layer, two conducting holes (801) are opened on the valve body layer; two driving output contacts (901) are provided on the driving layer; elastic conducting structural members (802) are installed in the two conducting holes (801); the two conducting structural members (802) respectively conduct the two conductive parts on the electrode layer and the two driving output contacts (901) on the driving layer.

7. A preparation method of a piezoelectric micropump based on array machining segmentation according to claim 1, characterized in that: The material of the sheet material is stainless steel or carbon fiber; the processing methods for the sheet material include any one or more of etching, laser processing, and photolithography processing; the scribing method is scribing by a dicing wheel or laser cutting.

8. A piezoelectric micropump, characterized in that: It is obtained by the piezoelectric micropump preparation method as described in claim 2; this piezoelectric micropump includes a flow channel layer (100), a resonance layer (200), a first connection layer (300), a diaphragm layer (400), a second connection layer (500), and an electrode layer (600) that are sequentially stacked; a pump flow chamber is formed between the flow channel layer (100) and the resonance layer (200); a resonance cavity is formed between the diaphragm layer (400) and the resonance layer (200); the resonance layer (200) is provided with a first through-hole at the central position and a plurality of second through-holes surrounding the first through-hole; an actuating element (401) is fixed on the diaphragm layer (400); one side of the actuating element (401) is electrically connected to a first conductive part (6-6) through a wiring terminal (6-5); the other side of the actuating element (401) is electrically connected to a second conductive part (6-7) through the diaphragm layer (400), the second connection layer (500), and conductive adhesive.

9. A piezoelectric micropump, characterized in that: It is obtained by the piezoelectric micropump preparation method as described in claim 2; this piezoelectric micropump includes a pump body, a valve body layer (800), and a driving layer (900) that are sequentially stacked; the pump body includes an end cover layer (700), a flow channel layer (100), a resonance layer (200), a diaphragm layer (400), and an electrode layer (600) that are sequentially stacked; an actuating element (401) is fixed on the diaphragm layer (400); the valve body layer (800) is connected to the electrode layer (600); two driving output contacts (901) on the driving layer (900) are respectively connected to two conductive parts of the electrode layer (600) through a conduction structure member (802) in the valve body layer (800); an actuating element (401) is fixed on the diaphragm layer (400); one side of the actuating element (401) is electrically connected to a first conductive part (6-6) through a wiring terminal (6-5); the other side of the actuating element (401) is electrically connected to a second conductive part (6-7) through the diaphragm layer (400) and conductive adhesive.

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