PCB etching equipment and etching method

Abstract

The invention relates to the technical field of circuit board etching, and discloses PCB etching equipment and an etching method.The PCB etching equipment comprises an etching assembly, the etching assembly comprises an etching chamber, a conveying assembly and two spraying assemblies are arranged in the etching chamber, the conveying assembly is arranged between the two spraying assemblies, the two spraying assemblies are symmetrically arranged, and the spraying assemblies are arranged in the etching chamber. Flow guide positioning assemblies are arranged on the two sides of the conveying assembly, and adjusting assemblies are arranged above the flow guide positioning assemblies. Through cooperation of the two symmetrically-arranged spraying assemblies and the conveying assembly, the purpose of double-sided etching of the PCB is achieved, meanwhile, the spraying amount of the two sides of the position of the PCB is adjusted through the adjusting assembly, the overall etching effect of the PCB is improved, and the problem that overall etching of the PCB is not uniform is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board etching, and in particular relates to a PCB board etching device and an etching method. Background Art

[0002] PCB board (printed circuit board or printed circuit board) is the provider of electrical connections for electronic components. Generally speaking, a printed circuit board is covered with one or two layers of copper foil (conductive layer) on a non-conductive substrate - called a single / double-sided circuit board, and then the lines to be retained for the designed circuit connection are printed (corrosion-resistant medium) on the copper foil by printing method, and then the unnecessary copper conductors on the surface of the copper-clad board are removed by a corrosive etching solution, leaving the copper conductors to form a circuit pattern. This subtractive process is the mainstream of current printed circuit board processing.

[0003] A Chinese patent with application number 202010439774X discloses a PCB board etching machine, including a liquid medicine barrel, a power box, a control console, and an etching mechanism. The etching mechanism is provided with a sprayer, a conveyor belt, a fixed table, and an etching device. The device fixes the PCB board through the sprayer, and the nozzle inside the sprayer etches the upper surface of the PCB board. Through the extension and retraction of the drug delivery device at the lower end of the etching device, the pressure plate compresses the force plate and etches the lower surface of the PCB board placed on the plate, so that the contact between the liquid medicine and the PCB board is more uniform, and the etching time of the PCB board by the liquid medicine is extended. However, the position of the PCB board is easily shifted during transportation, resulting in uneven etching, which affects the etching effect.

[0004] In addition, in the prior art, the etching liquid at the center of the top surface of the PCB board is prone to accumulation, and the flow of the etching liquid is restricted, while the etching liquid near the edge of the top surface of the PCB board is easy to flow away, so that the circuit etching effect at the center of the top surface of the PCB board is poor; and during the etching process, there will be gelatinous agglomerates accumulated on the copper surface, that is, the gelatinous agglomerates accumulated on the top surface of the PCB board will affect the flow of the etching liquid and hinder the replenishment of fresh etching liquid, so that the etching speed is reduced, thereby causing different etching degrees on the top and bottom surfaces of the PCB board.

[0005] In view of this, the present invention provides a PCB etching device and an etching method. Summary of the invention

[0006] In view of the above problems, the present invention provides a PCB board etching device and an etching method to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: a PCB etching device, comprising an etching component, the etching component comprising an etching chamber, a conveying component and two spraying components are arranged inside the etching chamber, the conveying component is arranged between the two spraying components, and the two spraying components are arranged symmetrically, both sides of the conveying component are provided with flow guiding and positioning components, and an adjusting component is arranged above the flow guiding and positioning component;

[0008] The flow guide positioning assembly comprises a positioning frame, the positioning frame is arranged inside the etching chamber, a fixing frame is arranged at one end of the positioning frame away from the inner wall of the etching chamber, an elastic sleeve is arranged at the center of the surface of the fixing frame, and a flow guide frame is arranged at one end of the elastic sleeve away from the fixing frame;

[0009] An air pump is arranged above the positioning frame, an air inlet pipe is arranged on the surface of the air pump, and a suction nozzle is arranged at one end of the air inlet pipe away from the air pump.

[0010] Preferably, a limiting column is provided in the middle of the surface of the fixing frame, a rotation groove is provided at the position where the guide frame is connected to the limiting column, shock-absorbing springs are provided at both ends of the fixing frame, and the end of the shock-absorbing spring away from the fixing frame is fixedly connected to the guide frame.

[0011] Preferably, a first air outlet pipe is provided on one side of the air pump, an air outlet branch pipe is provided on one side of the first air outlet pipe, an air outlet hose is provided at one end of the first air outlet pipe away from the air outlet branch pipe, and a gas switching valve is provided inside the first air outlet pipe;

[0012] The air pump is provided with a second air outlet pipe at one end away from the first air outlet pipe, a switch valve is provided at one end of the air pump close to the second air outlet pipe, and a connecting pipe is provided at one end of the second air outlet pipe away from the air pump, and the connecting pipe is connected to the elastic sleeve.

[0013] Preferably, the adjustment assembly comprises an adjustment plate, the adjustment plate is arranged above the positioning frame, an air passage is provided inside the adjustment plate, the air passage is communicated with an air outlet hose, a piston rod is provided inside the air passage, and a movable plate is provided at one end of the piston rod;

[0014] An elastic spring is arranged at one end of the movable plate close to the piston rod, and the movable plate is connected to the adjustment plate through the elastic spring. A limiting groove is arranged at the position where the adjustment plate and the movable plate are connected, and through holes and through grooves are arranged on the surfaces of the adjustment plate and the movable plate.

[0015] Preferably, an electric push rod is hingedly provided at the bottom of the adjustment plate, and one end of the electric push rod away from the adjustment plate is fixedly connected to the positioning frame, a rotating shaft is provided on one side of the adjustment plate, and a support frame is provided on the side of the adjustment plate away from the rotating shaft, and the side of the support frame away from the rotating shaft is fixedly connected to the positioning frame.

[0016] Preferably, the conveying assembly includes a main driving shaft, one end of the main driving shaft is equipped with a driving motor, a first gear is arranged on the surface of the main driving shaft, a second gear is arranged on one side of the first gear, a secondary driving shaft is arranged at the center position of the surface of the second gear, a rotating rod is arranged at the end of the secondary driving shaft away from the inner wall of the etching chamber, a plurality of conveying wheels are arranged at intervals on the surface of the rotating rod, and a support platform is arranged at the end of the rotating rod close to the second gear.

[0017] Preferably, a track is arranged above the support platform, a ball screw is arranged inside the track, a nut seat is arranged on the surface of the ball screw, the nut seat is fixedly connected to the surface of the positioning frame, a slide groove matching the nut seat is opened inside the track, a rotating motor is assembled at one end of the track, and one end of the output shaft of the rotating motor is fixedly connected to the ball screw.

[0018] Preferably, a feed end is provided at one end of the etching chamber, a discharge end is provided at the end of the etching chamber away from the feed end, a pipeline mounting frame is provided on one side of the etching chamber, and a pipeline mechanism is provided at the end of the pipeline mounting frame close to the etching chamber.

[0019] Preferably, the spray assembly includes a spray rack, which is arranged inside the etching chamber, and a plurality of spray pipes are linearly arranged on the spray rack, and a plurality of spray nozzles are arranged on the surface of the spray pipe. An infusion tube is arranged at one end of the spray pipe, and the end of the infusion tube away from the spray pipe is connected to the pipeline mechanism, and an installation hole is opened at the position where the etching chamber is connected to the infusion tube.

[0020] The present invention also provides a PCB etching method, and the specific etching method steps are as follows:

[0021] S1: First, under the action of the conveying component, the PCB board moves in the etching chamber, and the etching liquid is sprayed on it through the spraying component to achieve the purpose of double-sided etching of the PCB board;

[0022] S2: Then adjust the spray volume on both sides of the PCB board position by adjusting the components to improve the overall etching effect of the PCB board and avoid uneven etching of the PCB board as a whole;

[0023] S3: Finally, the moving PCB board is limited by the guide positioning component, and the suction nozzle is used to extract and drain air on both sides of the PCB board under the action of the air pump, so that the etching liquid on the PCB board is drained to the guide frame, thereby improving the fluidity of the etching liquid on the PCB board.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The present invention limits the moving PCB board through the guide positioning component, and under the action of the air pump, the suction nozzle performs air extraction and drainage on both sides of the PCB board, so that the etching liquid on the PCB board is drained to the guide frame, thereby improving the fluidity of the etching liquid on the PCB board, thereby avoiding the accumulation of the etching liquid at the center position of the top surface of the PCB board and the loss at the edge position, and improving the etching effect.

[0026] 2. The present invention cooperates with an air pump and a suction nozzle, and adjusts the tilt direction of an adjustment plate on one side of the PCB board to increase the impact force and spray volume on the top surface of the PCB board at that position, and washes the impurities on the top surface of the PCB board, thereby cleaning the impurities on the top surface of the PCB board, reducing the accumulation of gelatinous plate aggregates on the top surface of the PCB board, avoiding the substances from affecting the flow of etching solution and hindering the replenishment of fresh etching solution, thereby improving the etching speed and quality.

[0027] 3. The present invention reduces the spray volume on both sides of the top surface of the PCB board by adjusting the adjustment component, increases the fluidity of the etching solution in the middle position of the top surface, improves the exchange speed of the new and old etching solutions, increases the etching effect, and thus improves the overall etching efficiency.

[0028] 4. The present invention determines whether the PCB board is offset by the deflection angle of the guide frame, and uses the cooperation of the air pump and the elastic sleeve to correct the position offset of the PCB board, effectively solving the problem that the position of the PCB board is easily offset during horizontal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention from a first viewing angle;

[0030] Figure 2 It is a schematic diagram of the overall structure of the present invention from a second viewing angle;

[0031] Figure 3 For the present invention Figure 2 A magnified image of point A;

[0032] Figure 4 This is a schematic diagram of the structure of the etching assembly of the present invention;

[0033] Figure 5 It is a schematic diagram of the local structure of the transmission component of the present invention;

[0034] Figure 6 For the present invention Figure 5 A magnified view of point B;

[0035] Figure 7 This is a schematic diagram of the assembly structure of the diversion positioning component and the adjustment component of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of the flow diversion and positioning assembly of the present invention;

[0037] Fig. 9 It is a schematic cross-sectional view of the guide frame structure of the present invention;

[0038] Fig.10 This is a schematic diagram of the structure of the regulating component of the present invention;

[0039] Fig.11 It is a schematic cross-sectional view of the adjustment plate structure of the present invention.

[0040] In the figure: 1. Etching assembly; 101. Etching chamber; 102. Feed end; 103. Discharge end; 104. Pipeline mounting frame; 2. Transmission assembly; 201. Main drive shaft; 202. First gear; 203. Second gear; 204. Secondary drive shaft; 205. Rotating rod; 206. Transmission wheel; 207. Support platform; 208. Track; 209. Ball screw; 210. Nut seat; 3. Spray assembly; 301. Spray rack; 302. Spray pipe; 303. Spray nozzle; 4. Flow guide Positioning assembly; 401, positioning frame; 402, fixing frame; 403, limiting column; 404, guide frame; 405, elastic sleeve; 406, air pump; 407, first air outlet pipe; 4071, air outlet branch pipe; 4072, air outlet hose; 408, second air outlet pipe; 4081, connecting pipe; 409, air inlet pipe; 410, suction nozzle; 5, adjustment assembly; 501, adjustment plate; 502, air duct; 503, piston rod; 504, movable plate; 505, support frame; 506, electric push rod. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Embodiment 1

[0043] like Figures 1 to 11 As shown, this embodiment discloses a PCB board etching device, including an etching component 1, the etching component 1 includes an etching chamber 101, a conveying component 2 and two spray components 3 are arranged inside the etching chamber 101, the conveying component 2 is arranged between the two spray components 3, and the two spray components 3 are symmetrically arranged, and flow guide positioning components 4 are arranged on both sides of the conveying component 2, and an adjustment component 5 is arranged above the flow guide positioning component 4.

[0044] like Figure 4As shown, a feed end 102 is provided at one end of the etching chamber 101, a discharge end 103 is provided at the end of the etching chamber 101 away from the feed end 102, a pipeline mounting frame 104 is provided on one side of the etching chamber 101, and a pipeline mechanism is provided at the end of the pipeline mounting frame 104 close to the etching chamber 101.

[0045] like Figure 2 As shown, the spray assembly 3 includes a spray rack 301, which is arranged inside the etching chamber 101. A plurality of spray pipes 302 are linearly arranged on the spray rack 301, and a plurality of spray nozzles 303 are arranged on the surface of the spray pipe 302. An infusion tube is arranged at one end of the spray pipe 302, and the end of the infusion tube away from the spray pipe 302 is connected to the pipeline mechanism. A mounting hole is provided at the position where the etching chamber 101 is connected to the infusion tube, and the infusion tube is controlled by the pipeline mechanism to transport etching liquid to the spray pipe 302, so that the spray assembly 3 performs etching spraying.

[0046] like Figure 5 , Figure 6 As shown, the transmission component 2 includes a main driving shaft 201, one end of which is equipped with a driving motor, a first gear 202 is arranged on the surface of the main driving shaft 201, a second gear 203 is arranged on one side of the first gear 202, a secondary driving shaft 204 is arranged at the center position of the surface of the second gear 203, a rotating rod 205 is arranged at one end of the secondary driving shaft 204 away from the inner wall of the etching chamber 101, a plurality of transmission wheels 206 are arranged at intervals on the surface of the rotating rod 205, and a support platform 207 is arranged at one end of the rotating rod 205 close to the second gear 203.

[0047] When in use, the driving motor first drives the main driving shaft 201 and the first gear 202 to rotate together, the first gear 202 drives the second gear 203 to rotate together, and the second gear 203 drives the auxiliary driving shaft 204, the rotating rod 205 and the conveying wheel 206 to rotate together. In this process, under the joint action of the multiple rotating rods 205 and the conveying wheel 206, the PCB board on the conveying wheel 206 is horizontally conveyed. When the PCB board enters the etching chamber 101 from the feed end 102 for etching, the PCB board is sprayed through the multiple spray pipes 302 on the spray rack 301, so that the spray The nozzle 303 sprays etching liquid on the surface of the PCB board. Since there are two spray assemblies 3 and the two spray assemblies 3 are symmetrically arranged, the spray assembly 3 located above the conveying wheel 206 directly sprays and etches the top surface of the PCB board, and since there is a gap between the conveying wheels 206, the spray assembly 3 located below the conveying wheels 206 sprays and etches the bottom surface of the PCB board through the gap between the conveying wheels 206. The etched PCB board goes out from the discharge end 103. Under the joint action of the conveying assembly 2 and the spray assembly 3, the purpose of double-sided spray etching of the PCB board is achieved.

[0048] In the above process, the position of the PCB board is easily offset during horizontal transmission, resulting in changes in the etching area, which causes uneven etching of the PCB board during spraying; and the etching liquid at the center of the top surface of the PCB board is easily accumulated, and the flow of the etching liquid is restricted, while the etching liquid near the edge of the top surface of the PCB board is easy to flow away, so that the etching effect of the circuit at the center of the top surface of the PCB board is poor; and during the etching process, there will be gelatinous agglomerates accumulated on the copper surface, that is, the accumulation of gelatinous agglomerates on the top surface of the PCB board will affect the flow of the etching liquid and hinder the replenishment of fresh etching liquid, so that the etching speed is reduced, resulting in different etching degrees on the top and bottom surfaces of the PCB board.

[0049] In order to solve the above problems, the etching equipment also includes:

[0050] like Figure 6 As shown, a track 208 is arranged above the support platform 207, a ball screw 209 is arranged inside the track 208, a nut seat 210 is arranged on the surface of the ball screw 209, a slide groove matched with the nut seat 210 is opened inside the track 208, a rotating motor is assembled at one end of the track 208, and one end of the output shaft of the rotating motor is fixedly connected to the ball screw 209.

[0051] like Figures 7 to 9 As shown, the flow guide positioning assembly 4 includes a positioning frame 401, the positioning frame 401 is arranged inside the etching chamber 101, the nut seat 210 is fixedly connected to the surface of the positioning frame 401, a fixing frame 402 is arranged at the end of the positioning frame 401 away from the inner wall of the etching chamber 101, an elastic sleeve 405 is arranged at the center position of the surface of the fixing frame 402, a flow guide frame 404 is arranged at the end of the elastic sleeve 405 away from the fixing frame 402, a limiting column 403 is arranged at the middle position of the surface of the fixing frame 402, a rotating groove is opened at the position where the flow guide frame 404 is connected to the limiting column 403, shock-absorbing springs are arranged at both ends of the fixing frame 402, and the end of the shock-absorbing spring away from the fixing frame 402 is fixedly connected to the flow guide frame 404.

[0052] An air pump 406 is arranged above the positioning frame 401, and an air inlet pipe 409 is arranged on the surface of the air pump 406, and a suction nozzle 410 is arranged at the end of the air inlet pipe 409 away from the air pump 406, a first air outlet pipe 407 is arranged on one side of the air pump 406, an air outlet branch pipe 4071 is arranged on one side of the first air outlet pipe 407, an air outlet hose 4072 is arranged at the end of the first air outlet pipe 407 away from the air outlet branch pipe 4071, a gas switching valve is arranged inside the first air outlet pipe 407, a second air outlet pipe 408 is arranged at the end of the air pump 406 away from the first air outlet pipe 407, a switch valve is arranged at the end of the air pump 406 close to the second air outlet pipe 408, and a connecting pipe 4081 is arranged at the end of the second air outlet pipe 408 away from the air pump 406, and the connecting pipe 4081 is connected to the elastic sleeve 405.

[0053] like Fig.10 , Fig.11 As shown, the adjustment component 5 includes an adjustment plate 501, which is arranged above the positioning frame 401. An air duct 502 is opened inside the adjustment plate 501, and the air duct 502 is connected to the air outlet hose 4072. A piston rod 503 is arranged inside the air duct 502, and a movable plate 504 is arranged at one end of the piston rod 503. An electric push rod 506 is hingedly arranged below the adjustment plate 501, and the end of the electric push rod 506 away from the adjustment plate 501 is fixedly connected to the positioning frame 401. A rotating shaft is arranged on one side of the adjustment plate 501, and a supporting frame 505 is arranged on the side of the adjustment plate 501 away from the rotating shaft, and the side of the supporting frame 505 away from the rotating shaft is fixedly connected to the positioning frame 401.

[0054] An elastic spring is provided at one end of the movable plate 504 close to the piston rod 503. The movable plate 504 is connected to the adjustment plate 501 through the elastic spring. A limiting groove is provided at the position where the adjustment plate 501 and the movable plate 504 are connected. Through holes and through grooves are provided on the surfaces of the adjustment plate 501 and the movable plate 504.

[0055] When in use, when the PCB enters the etching chamber 101, it is positioned by the guide positioning components 4 on both sides of the PCB. At this time, the guide frame 404 is close to the side of the PCB and contacts the side of the PCB (such as Figure 3 As shown), the ball screw 209 is driven to rotate by the rotating motor, so that the nut seat 210 moves along the track 208 in the direction of the PCB board transmission, and the nut seat 210 drives the positioning frame 401 to move together. At this time, the guide positioning component 4 moves synchronously with the PCB board. At the same time, in order to reduce the difference in the etching degree between the edge position of the top surface of the PCB board and the middle position of the PCB board, and to increase the fluidity of the etching liquid in the middle position of the PCB board, at this time, under the action of the air pump 406, the air near the suction nozzle 410 is sucked into the interior of the air pump 406, and is discharged from the air outlet branch pipe 4071 through the first air outlet pipe 407, thereby increasing The flow rate of air near the suction nozzle 410 during this process facilitates the attraction of the etching liquid in the middle of the PCB board to one side of the PCB board, speeding up the movement of the etching liquid in the middle of the PCB board toward the side of the PCB board, thereby increasing the fluidity of the etching liquid in the middle of the PCB board, and preventing the etching liquid in the middle from accumulating and affecting the etching effect. The etching liquid near the side of the PCB board enters the interior along one side of the guide frame 404 and is discharged from both ends of the guide frame 404, preventing the etching liquid near the side of the PCB board from flowing directly along the side and partially gathering at the bottom of the PCB board, thereby over-etching the bottom surface of the PCB board.

[0056] Since the etching speed on both sides of the PCB board is greater than the etching speed in the middle of the PCB board, in order to improve the overall etching effect, the adjustment component 5 is set to reduce the spraying amount on both sides of the PCB board. First, the controller controls the electric push rod 506 to shrink, and the electric push rod 506 pulls one end of the adjustment plate 501 to make it in an inclined state, that is, the adjustment plate 501 is tilted around the rotation axis. At this time, the through holes and through slots on the adjustment plate 501 coincide with the through holes and through slots on the movable plate 504, and the movable plate 504 shrinks the inside of the adjustment plate 501. At this time, a part of the etching liquid sprayed by the spray nozzle 303 above the transmission wheel 206 passes through the through holes and through slots on the adjustment plate 501 and sprays to the top surface of the PCB board, while the other part falls obliquely along the surface of the adjustment plate 501. It is worth noting that the etching liquid falling obliquely will not fall on the PCB board to impact it. Under the action of the adjustment plate 501, the spraying amount on both sides of the top surface of the PCB board is reduced, and its etching speed is slowed down.

[0057] As the etching time increases, in order to increase the etching speed of the middle position of the PCB board, the controller controls the gas switching valve inside the first outlet pipe 407 to change the exhaust channel of the gas inside the air pump 406 from the outlet branch pipe 4071 to the outlet hose 4072. At this time, the gas inside the outlet hose 4072 enters the air passage 502 inside the adjustment plate 501. Under the action of the gas, the piston rod 503 in the air passage 502 is pushed to move away from the outlet hose 4072, so that the piston rod 503 drives the movable plate 504 along the adjustment plate 501. 1, the elastic spring is stretched, so that the movable plate 504 extends out of the preset distance of the adjusting plate 501, so that the through holes and through slots on the adjusting plate 501 are misaligned with the through holes and through slots on the movable plate 504, so that the spraying amount on both sides of the top surface of the PCB board is reduced, and the area of ​​the involved adjustment area is increased, that is, the spraying amount on both sides of the top surface of the PCB board is reduced, and the etching liquid in the middle position of the top surface of the PCB board will accelerate to move toward one side of the top surface of the PCB board, thereby improving the exchange speed of the new and old etching liquids in the middle position of the top surface of the PCB board and enhancing its etching effect.

[0058] It is worth noting that the amount of gas entering the air duct 502 is controlled by controlling the switching time of the gas switching valve, thereby controlling the preset distance that the movable plate 504 extends out of the adjustment plate 501. After the adjustment is completed, the controller controls the gas switching valve inside the first air outlet pipe 407, so that the exhaust channel of the gas inside the air pump 406 is changed from the exhaust hose 4072 to the exhaust branch pipe 4071.

[0059] On this basis, in order to prevent the gelatinous aggregate from accumulating on the top surface of the PCB board to affect the flow of the etching solution and hinder the replenishment of fresh etching solution, or to clean the impurities on the top surface of the PCB board at the end of etching, firstly, by adjusting the inclination direction of the adjustment plate 501 on one side of the PCB board, that is, the controller controls the electric push rod 506 to extend, and the electric push rod 506 pushes one end of the adjustment plate 501 to raise it, and the adjustment plate 501 rotates around the rotating shaft, and at this time, the inclination trend of the adjustment plate 501 is in an upward state, and at this time, the etching liquid sprayed by the spray nozzle 303 located above the transmission wheel 206 falls along the adjustment plate 501 to a position close to the middle position of the PCB board. In this process, the impact force and spray volume on the top surface of the PCB board at this position are increased, and the impurities on the surface of the top surface of the PCB board at this position are washed, and at the same time, the air pump 406 on this side is controlled to reduce the suction force of its suction nozzle 410, and under the suction action of the suction nozzle 410 on the other side, the etching liquid on the top surface of the PCB board is discharged toward one side of the PCB board.

[0060] After a period of time, the controller controls the above operation to return to the state before the operation, and then changes accordingly according to the operation steps, so as to adjust the adjustment plate 501 on the other side of the PCB board. The specific operation will not be described in detail, so that the etching liquid on the top surface of the PCB board is discharged to the other side of the PCB board, thereby realizing the cleaning of impurities on the top surface of the PCB board.

[0061] In the process of horizontal transmission of the PCB board, when the position of the PCB board is offset due to uneven force, if it is not corrected, it will not only affect its transmission speed, but also increase the risk of getting stuck, thereby affecting the etching effect. At this time, the deflection angle of the guide frame 404 is used to determine whether the PCB board is offset. When the PCB board is offset, the PCB board will squeeze the guide frames 404 on both sides, so that the guide frames 404 will be angularly offset with the limit column 403 as the center. At this time, the shock-absorbing springs at both ends of the guide frame 404 are deformed to different degrees, and the elastic sleeve 405 will also be squeezed by the guide frame 404. At this time, in order to solve this problem, the controller controls the air pumps 406 on both sides to open the switch valves at the same time, so that the air pumps 406 6, part of the gas inside is discharged from the second gas outlet pipe 408, and enters the elastic sleeve 405 through the connecting pipe 4081, so that the gas inside the elastic sleeve 405 increases to make its volume larger, and the elasticity of the elastic sleeve 405 decreases, thereby fixing the guide frame 404. In this process, the guide frame 404 is restored to a state parallel to the fixing frame 402, so that the deformation of the shock-absorbing springs at both ends of the fixing frame 402 is consistent, and the PCB board is limited under the action of the guide frame 404, so that the guide frame 404 can correct the position deviation of the PCB board in time, and effectively solve the problem that the position of the PCB board is easily offset during horizontal transmission, resulting in changes in the etching area, thereby causing uneven etching of the PCB board during spraying.

[0062] Embodiment 2

[0063] A PCB etching method, the specific etching method steps are as follows:

[0064] S1: First, under the action of the conveying component 2, the PCB board is moved in the etching chamber 101, and the etching liquid is sprayed on it by the spraying component 3 to achieve the purpose of double-sided etching of the PCB board;

[0065] S2: Then, the spraying amount on both sides of the PCB board is adjusted by adjusting the component 5 to improve the overall etching effect of the PCB board and avoid uneven etching of the PCB board;

[0066] S3: Finally, the moving PCB board is limited by the guide positioning component 4, and the suction nozzle 410 is used to evacuate and drain the two sides of the PCB board under the action of the air pump 406, so that the etching liquid on the PCB board is drained to the guide frame 404, thereby improving the fluidity of the etching liquid on the PCB board.

[0067] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB etching device, comprising an etching assembly (1), wherein the etching assembly (1) comprises an etching chamber (101), characterized in that: A conveying component (2) and two spraying components (3) are arranged inside the etching chamber (101); the conveying component (2) is arranged between the two spraying components (3), and the two spraying components (3) are arranged symmetrically; flow guiding and positioning components (4) are arranged on both sides of the conveying component (2); and an adjusting component (5) is arranged above the flow guiding and positioning components (4); The flow guiding and positioning assembly (4) comprises a positioning frame (401), the positioning frame (401) is arranged inside the etching chamber (101), a fixing frame (402) is arranged at one end of the positioning frame (401) away from the inner wall of the etching chamber (101), an elastic sleeve (405) is arranged at the center of the surface of the fixing frame (402), and a flow guiding frame (404) is arranged at one end of the elastic sleeve (405) away from the fixing frame (402); An air pump (406) is arranged above the positioning frame (401), an air inlet pipe (409) is arranged on the surface of the air pump (406), and a suction nozzle (410) is arranged at one end of the air inlet pipe (409) away from the air pump (406).

2. A PCB etching device according to claim 1, characterized in that: A limiting column (403) is arranged in the middle of the surface of the fixing frame (402), a rotation groove is provided at the position where the guide frame (404) is connected to the limiting column (403), shock absorbing springs are arranged at both ends of the fixing frame (402), and the end of the shock absorbing spring away from the fixing frame (402) is fixedly connected to the guide frame (404).

3. A PCB etching device according to claim 1, characterized in that: A first air outlet pipe (407) is disposed on one side of the air pump (406), an air outlet branch pipe (4071) is disposed on one side of the first air outlet pipe (407), an air outlet hose (4072) is disposed at one end of the first air outlet pipe (407) away from the air outlet branch pipe (4071), and a gas switching valve is disposed inside the first air outlet pipe (407); A second air outlet pipe (408) is provided at one end of the air pump (406) away from the first air outlet pipe (407), a switch valve is provided at one end of the air pump (406) close to the second air outlet pipe (408), and a connecting pipe (4081) is provided at one end of the second air outlet pipe (408) away from the air pump (406), and the connecting pipe (4081) is connected to the elastic sleeve (405).

4. A PCB etching device according to claim 1, characterized in that: The adjustment assembly (5) comprises an adjustment plate (501), the adjustment plate (501) is arranged above the positioning frame (401), an air passage (502) is provided inside the adjustment plate (501), the air passage (502) is connected to the air outlet hose (4072), a piston rod (503) is provided inside the air passage (502), and a movable plate (504) is provided at one end of the piston rod (503); An elastic spring is provided at one end of the movable plate (504) close to the piston rod (503), and the movable plate (504) is connected to the adjustment plate (501) via the elastic spring. A limiting groove is provided at the position where the adjustment plate (501) and the movable plate (504) are connected, and through holes and through grooves are provided on the surfaces of the adjustment plate (501) and the movable plate (504).

5. A PCB etching device according to claim 4, characterized in that: An electric push rod (506) is hingedly arranged below the adjustment plate (501), and one end of the electric push rod (506) away from the adjustment plate (501) is fixedly connected to the positioning frame (401). A rotating shaft is arranged on one side of the adjustment plate (501), and a supporting frame (505) is arranged on the side of the adjustment plate (501) away from the rotating shaft. The side of the supporting frame (505) away from the rotating shaft is fixedly connected to the positioning frame (401).

6. A PCB etching device according to claim 1, characterized in that: The transmission assembly (2) comprises a main drive shaft (201), one end of the main drive shaft (201) is equipped with a drive motor, a first gear (202) is arranged on the surface of the main drive shaft (201), a second gear (203) is arranged on one side of the first gear (202), a secondary drive shaft (204) is arranged at the center of the surface of the second gear (203), a rotating rod (205) is arranged at one end of the secondary drive shaft (204) away from the inner wall of the etching chamber (101), a plurality of transmission wheels (206) are arranged at intervals on the surface of the rotating rod (205), and a support platform (207) is arranged at one end of the rotating rod (205) close to the second gear (203).

7. A PCB etching device according to claim 6, characterized in that: A track (208) is arranged above the support platform (207), a ball screw (209) is arranged inside the track (208), a nut seat (210) is arranged on the surface of the ball screw (209), the nut seat (210) is fixedly connected to the surface of the positioning frame (401), a slide groove matching the nut seat (210) is opened inside the track (208), a rotating motor is installed at one end of the track (208), and one end of the output shaft of the rotating motor is fixedly connected to the ball screw (209).

8. A PCB etching device according to claim 1, characterized in that: A feed end (102) is provided at one end of the etching chamber (101), a discharge end (103) is provided at an end of the etching chamber (101) away from the feed end (102), a pipeline mounting frame (104) is provided on one side of the etching chamber (101), and a pipeline mechanism is provided at an end of the pipeline mounting frame (104) close to the etching chamber (101).

9. A PCB etching device according to claim 8, characterized in that: The spray assembly (3) comprises a spray rack (301), the spray rack (301) being arranged inside the etching chamber (101), a plurality of spray pipes (302) being arranged linearly on the spray rack (301), a plurality of spray nozzles (303) being arranged on the surface of the spray pipe (302), a liquid infusion tube being arranged at one end of the spray pipe (302), and an end of the liquid infusion tube away from the spray pipe (302) being connected to a pipeline mechanism, and a mounting hole being provided at a position where the etching chamber (101) is connected to the liquid infusion tube.

10. An etching method for a PCB etching device according to claim 1, characterized in that: The steps include: S1: First, under the action of the conveying component (2), the PCB board is moved in the etching chamber (101), and at the same time, the etching liquid is sprayed on it through the spraying component (3), so as to achieve the purpose of double-sided etching of the PCB board; S2: Then, the spraying amount on both sides of the PCB board is adjusted by adjusting the component (5) to improve the overall etching effect of the PCB board and avoid uneven etching of the PCB board; S3: Finally, the moving PCB board is limited by the guide positioning component (4), and the suction nozzle (410) is used to extract air and drain the two sides of the PCB board under the action of the air pump (406), so that the etching liquid on the PCB board is drained to the guide frame (404), thereby improving the fluidity of the etching liquid on the PCB board.

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