Immersed heat dissipation structure based on porous film evaporation phase change

Abstract

The invention discloses an immersed heat dissipation structure based on porous film evaporation phase change, and belongs to the field of chip heat dissipation, and the structure comprises a heat dissipation module which is used for bearing a server assembly and providing a heat exchange environment; the condensation module is used for converting electronic fluorinated liquid steam generated by partial heat dissipation of the case into electronic fluorinated liquid; the filtering module is used for filtering and purifying the electronic fluorination liquid converted by the condensing module to remove impurities in the electronic fluorination liquid; the liquid storage module is used for storing the electronic fluorination liquid purified by the filtering module and providing the electronic fluorination liquid for a heat dissipation loop; the pressurizing module is used for providing power for the electronic fluorinated liquid; and the control module is used for collecting and processing parameter data of temperature, pressure and flow in the heat dissipation loop and adjusting the parameter data according to preset values. By the adoption of the structure, the problems that the cost is high due to the fact that the heat dissipation critical heat flux density of an existing two-phase immersed server case is low and the demanded quantity of fluorinated liquid is large, and the operation reliability of a server is affected by pressure fluctuation are solved.

Description

Technical Field

[0001] The invention relates to the technical field of chip heat dissipation, and in particular to an immersion heat dissipation structure based on porous film evaporation phase change. Background Art

[0002] With the continuous development of artificial intelligence and big models, the demand for computing power by enterprises and society has increased exponentially. The increase in server chip power has led to higher requirements for data center thermal management. At the same time, as a large energy consumer, data centers account for nearly 3% of the total social electricity consumption, of which 30-40% is used for data center thermal management. Reducing the energy consumption of data center thermal management by improving chip heat dissipation technology has become one of the keys to achieving energy conservation and emission reduction in data centers.

[0003] Two-phase immersion cooling technology is a highly efficient cooling technology that immerses the server host device in a low-boiling point insulating liquid (electronic fluorinated liquid) and uses the latent heat of the liquid during phase change to effectively remove the heat from the chip to achieve heat dissipation. Compared with traditional single-phase liquid cooling and air cooling technology, its heat dissipation efficiency is more efficient, which can reduce the dependence on fans and air conditioning systems, and has high power density, which can reduce the cooling energy consumption of data centers by up to 90%, and has attracted much attention in data center thermal management.

[0004] At present, the two-phase immersion cooling technology mainly uses boiling phase change for heat dissipation. The critical heat flux density of boiling heat exchange is relatively small and cannot meet the heat dissipation requirements of high-power chips (such as AI chips). The latent heat of vaporization of most fluorinated liquids is only about 3% to 10% of that of water, which makes the data center have a huge demand for coolant. The price of fluorinated liquids currently used in data centers is generally 200 to 500 yuan per kilogram, which also has a great impact on the operation and maintenance costs of data centers. At the same time, when using two-phase immersion cooling technology for server thermal management, the internal pressure of the chassis fluctuates due to the constant changes in server load, which affects the reliability of server operation. Summary of the invention

[0005] The purpose of the present invention is to provide an immersion heat dissipation structure based on porous film evaporation phase change, so as to solve the problems of low critical heat flux density of two-phase immersion server chassis heat dissipation, high cost caused by large demand for fluorinated liquid, and pressure fluctuation affecting the reliability of server operation.

[0006] To achieve the above-mentioned purpose, the present invention provides an immersion heat dissipation structure based on porous film evaporation phase change, including a heat dissipation module for carrying server components and providing a heat exchange environment;

[0007] A condensation module, used to convert the electronic fluoride liquid vapor generated by the heat dissipation of the chassis into electronic fluoride liquid;

[0008] The filter module filters and purifies the electronic fluorine liquid converted by the condensation module to remove impurities therein;

[0009] The liquid storage module stores the electronic fluorine liquid purified by the filter module and provides the electronic fluorine liquid for the heat dissipation circuit;

[0010] Booster module, providing power for electronic fluorine fluid;

[0011] The control module collects and processes the parameter data of temperature, pressure and flow in the heat dissipation circuit, and adjusts the parameter data according to the preset values.

[0012] Preferably, the heat dissipation module includes a server chassis, a chip heat dissipation module and a server component are arranged inside the server chassis, a pressure sensor three and a temperature sensor three are arranged on the server chassis, an output end of the server chassis is connected to a steam pipe one, a pressure sensor one and a temperature sensor one are arranged on the steam pipe one, an output end of the chip heat dissipation module is connected to a steam pipe two, the steam pipe two extends from the server chassis, and a pressure sensor two and a temperature sensor two are arranged on the part of the steam pipe two extending out of the server chassis.

[0013] Preferably, the condensation module includes a condenser, a heat exchanger is arranged on the condenser, a temperature sensor 4 is arranged on the liquid pipeline at the output end of the condenser, and the output ends of the steam pipe 1 and the steam pipe 2 are connected to the input end of the condenser.

[0014] Preferably, the filter module includes a filter and a solenoid valve, the output end of the condenser is connected to the input end of the filter through a liquid pipeline, and the output end of the filter is connected to the input end of the solenoid valve.

[0015] Preferably, the liquid storage module includes a liquid storage tank, and the output end of the solenoid valve is connected to the input end of the liquid storage tank.

[0016] Preferably, the boost module includes a micro gear pump and a flow meter, the output end of the liquid storage tank is connected to the input end of the micro gear pump, the output end of the micro gear pump is connected to the input end of the flow meter, and the output end of the flow meter is connected to the input end of the chip heat dissipation module.

[0017] Preferably, the chip heat dissipation module includes a server chip, an interface material is arranged on the top of the server chip, a chip packaging shell is arranged on the top of the interface material, a capillary core block is installed on the top of the chip packaging shell, an upper cover plate is arranged above the chip packaging shell, and the chip packaging shell is fixedly connected to the upper cover plate.

[0018] Preferably, a liquid inlet pipeline and a steam pipeline are provided on the upper cover plate, and side holes are provided on both sides of the upper cover plate, the liquid inlet pipeline is connected to the liquid pipeline, and the steam pipeline is connected to the steam pipeline 2.

[0019] Preferably, the control module is a PID control system, which collects parameters in pressure sensor 1, pressure sensor 2, pressure sensor 3, temperature parameters in temperature sensor 1, temperature sensor 2, temperature sensor 3, temperature sensor 4 and flow parameters in the flow meter, and controls the pump power of the micro gear pump and the opening of the solenoid valve according to the processing results after processing.

[0020] Therefore, the present invention adopts the above-mentioned structure of an immersion heat dissipation structure based on porous film evaporation phase change, which has the following beneficial effects:

[0021] (1) The capillary core is used to suck the fluorinated liquid and remove the heat through evaporation phase change, which increases the critical heat flux density of heat dissipation and reduces the demand for fluorinated liquid in a single chassis.

[0022] (2) The steam generated by the chip heat dissipation is isolated from the chassis through a pipe, and after being cooled outside, it flows back to the inside of the chassis for circulation to prevent pressure fluctuations inside the chassis.

[0023] (3) Utilize the PID control system to link the chassis power consumption with the cooling system feedback to ensure the stability of the fluorine liquid level inside the chassis and prevent the capillary wick from drying out, thereby reducing the cooling power consumption of the fluorine liquid and the energy consumption of the data center thermal management.

[0024] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a heat dissipation circuit structure of an immersion heat dissipation structure based on porous thin film evaporation phase change of the present invention;

[0026] Figure 2 A top view of a server chassis of an immersion heat dissipation structure based on porous thin film evaporation phase change according to the present invention;

[0027] Figure 3 This is a schematic diagram of the chip heat dissipation module structure of an immersion heat dissipation structure based on porous thin film evaporation phase change of the present invention;

[0028] Figure 4 It is a schematic diagram of the connection between the capillary core block and the chip packaging shell of an immersion heat dissipation structure based on porous thin film evaporation phase change of the present invention;

[0029] Figure 5 The present invention is a schematic diagram of the process of an immersion heat dissipation structure PID system based on porous film evaporation phase change.

[0030] Reference numerals

[0031] 1. Server chassis; 11. Chip cooling module; 12. Liquid pipeline; 13. Steam pipeline 2; 14. Steam pipeline 1; 111. Upper cover; 112. Capillary core block; 113. Chip packaging shell; 114. Interface material; 115. Server chip; 2. Condenser; 21. Heat exchanger; 3. Filter; 4. Solenoid valve; 5. Liquid storage tank; 6. Micro gear pump; 7. Flow meter; 811. Pressure sensor 2; 812. Pressure sensor 1; 813. Pressure sensor 3; 821. Temperature sensor 2; 822. Temperature sensor 1; 823. Temperature sensor 3; 824. Temperature sensor 4. DETAILED DESCRIPTION

[0032] Example

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0037] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0039] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0040] The specific model specifications need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0041] like Figures 1 to 4 As shown, an immersion heat dissipation structure based on porous film evaporation phase change includes a heat dissipation module for carrying server components and providing a heat exchange environment. A condensation module is used to convert the electronic fluorine liquid vapor generated by the heat dissipation of the chassis into electronic fluorine liquid. A filter module filters and purifies the electronic fluorine liquid converted by the condensation module to remove impurities. A liquid storage module stores the electronic fluorine liquid purified by the filter module and provides the electronic fluorine liquid when the heat dissipation circuit needs it. A boost module provides power for the electronic fluorine liquid. A control module collects and processes the parameter data of temperature, pressure and flow in the heat dissipation circuit, and adjusts the parameter data according to preset values.

[0042] The relative dielectric constant of the electronic fluoride liquid is lower than 2.5, and it has excellent electrical insulation properties; the boiling point is between 20 and 70° C., which can ensure that the chip temperature works at a lower temperature, and it has good material compatibility with various metal and non-metal materials inside the server chassis 1.

[0043] The heat dissipation module includes a server chassis 1, a chip heat dissipation module 11 and a server component are arranged inside the server chassis 1, a pressure sensor 3 813 and a temperature sensor 4 824 are arranged on the server chassis 1, the output end of the server chassis 1 is connected to a steam pipe 14, a pressure sensor 1 812 and a temperature sensor 1 822 are arranged on the steam pipe 14, the output end of the chip heat dissipation module 11 is connected to a steam pipe 2 13, the steam pipe 2 13 extends from the server chassis 1, and the part of the steam pipe 2 13 extending from the server chassis 1 is provided with a pressure sensor 2 811 and a temperature sensor 2 821. The chip heat dissipation module 11 includes a server chip 115, an interface material 114 is arranged on the top of the server chip 115, a chip packaging shell 113 is arranged on the top of the interface material 114, a capillary core block 112 is installed on the top of the chip packaging shell 113, a liquid storage tank and a guide groove are arranged around the capillary core block 112 on the chip packaging shell 113, an upper cover plate 111 is arranged above the chip packaging shell 113, and the chip packaging shell 113 is connected to the upper cover plate 111 by welding.

[0044] The capillary core block 112 and the chip package shell 113 are combined together through an integrated sintering process. The capillary core block 112 adopts a double-layer powder sintering structure. The specific structure is as follows Figure 4 As shown. The bottom liquid absorption layer is sintered with small-particle dendritic copper powder to form a porous structure with an effective pore size less than 2μm, providing greater capillary force, increasing the climbing rate of the liquid in the capillary core block 112, and ensuring that the fluorinated liquid with low surface tension can still provide sufficient capillary pressure head to meet the liquid supply demand. The top evaporation layer is sintered with large-particle spherical copper powder, and a concave structure is formed on the surface through a mold. After the large-particle copper powder is sintered, the effective pore size increases, providing more channels for steam escape, and enhancing the evaporation heat transfer coefficient of the capillary core block 112. At the same time, the concave surface structure can further increase the liquid evaporation heat transfer area and steam escape channel, thereby increasing the evaporation heat transfer of the capillary core block 112, overcoming the disadvantage of low vaporization latent heat of the fluorinated liquid. The interface material 114 is placed between the server chip 115 and the chip packaging shell 113 to reduce thermal resistance. The upper cover 111 and the chip packaging shell 113 are assembled by welding technology to ensure the airtightness of the chip heat dissipation module 11, and are connected to the PCB board where the server chip 115 is located by bolts to fix the chip heat dissipation module 11 as a whole above the server chip 115.

[0045] The upper cover plate 111 is provided with a liquid inlet pipeline and a steam pipeline, and side holes are provided on both sides of the upper cover plate 111. The liquid inlet pipeline is connected to the liquid pipeline 12, and the steam pipeline is connected to the steam pipeline 13. The side holes can replenish liquid for other parts in the server chassis 1 for cooling.

[0046] The shell of the server chassis 1 is made of metal, and the main heating element inside is the server chip 115. The heat dissipation of the server chip 115 is separated from the heat dissipation of other chassis components through the chip heat dissipation module 11. The fluorine liquid directly enters the chip heat dissipation module 11 from the liquid pipeline 12 to replenish the capillary core block 112. The remaining fluorine liquid enters the server chassis 1 from the side holes of the upper cover plate 111 to dissipate heat for the other components of the server chassis 1. During installation, ensure that the side holes on the upper cover plate 111 can be immersed in the fluorine liquid to prevent steam generated by evaporation from entering the server chassis 1 from the side holes. The steam generated by the heat dissipation of the server chip 115 is discharged from the chassis through the steam pipe 2 13 to avoid pressure fluctuations inside the server chassis 1 caused by changes in chip load.

[0047] The condensation module includes a condenser 2, on which a heat exchanger 21 is provided, a temperature sensor 3 823 is provided on the liquid pipeline at the output end of the condenser 2, and the output ends of the steam pipe 1 14 and the steam pipe 2 13 are connected to the input end of the condenser 2. The condenser 2 cools the fluorinated liquid gas after phase change into liquid, and adjusts the temperature of the fluorinated liquid through the heat exchanger 21 to ensure sufficient liquid supply in the loop.

[0048] The filter module includes a filter 3 and a solenoid valve 4. The output end of the condenser 2 is connected to the input end of the filter 3 through a liquid pipeline 12, and the output end of the filter 3 is connected to the input end of the solenoid valve 4. The filter 3 filters impurity particles larger than 50 μm in the cooling liquid to prevent the circuit from being blocked.

[0049] The liquid storage module includes a liquid storage tank 5, and the output end of the solenoid valve 4 is connected to the input end of the liquid storage tank 5. The solenoid valve 4 is connected in series in the heat dissipation circuit, and the opening of the solenoid valve 4 is controlled by the control module, thereby controlling the liquid flow in the circuit. The liquid storage tank 5 is made of a material that does not react with the fluorinated liquid to ensure that there is sufficient liquid in the circuit.

[0050] The boost module includes a micro gear pump 6 and a flow meter 7, the output end of the liquid storage tank 5 is connected to the input end of the micro gear pump 6, the output end of the micro gear pump 6 is connected to the input end of the flow meter 7, and the output end of the flow meter 7 is connected to the input end of the chip heat dissipation module 11. The micro gear pump 6 does work on the liquid, increases the pressure and flow rate of the liquid in the heat dissipation circuit, enables the fluorinated liquid to overcome the resistance loss in the pipeline and complete the entire cycle. The flow meter 7 uses a mass flow meter 7 connected in series in the heat dissipation circuit to detect the mass flow of the working fluid in the liquid pipeline 12, and feeds the result back to the control module, and further adjusts the flow of the fluorinated liquid in the heat dissipation circuit by adjusting the opening of the solenoid valve 4 and the pump power of the micro gear pump 6.

[0051] When the server chip 115 in the server chassis 1 is working, it generates heat. The capillary core block 112 and the chip packaging shell 113 in the chip heat dissipation module 11 take away the heat through the evaporation phase change of the fluorinated liquid. The generated steam flows out of the chassis through the steam pipe 2 13. At the same time, a small amount of steam generated by the heat dissipation of other devices in the chassis environment flows out of the chassis through the steam pipe 1 14. The two parts of steam finally converge in the condenser 2 and condense into liquid. The temperature of the fluorinated liquid is adjusted by the heat exchanger 21. Then the fluorinated liquid flows through the filter 3 to filter out tiny impurities in the fluorinated liquid to avoid pipeline blockage. The filtered fluorinated liquid flows through the solenoid valve 4 and then enters the liquid storage tank 5. After flowing out from the outlet of the liquid storage tank 5, it enters the micro gear pump 6. After the micro gear pump 6 does work on the fluorinated liquid, the flow rate of the working fluid in the circuit is measured by the flowmeter 7. The fluorinated liquid flows into the server chassis 1 driven by the micro gear pump 6 to complete the cycle.

[0052] The control module is a PID control system, which collects parameters from pressure sensor 1 812, pressure sensor 2 811, pressure sensor 3 813, temperature parameters from temperature sensor 1 822, temperature sensor 2 821, temperature sensor 4 824, temperature sensor 3 823, and flow parameters from flow meter 7, and controls the pump power of micro gear pump 6 and the opening of solenoid valve 4 according to the processing results after processing.

[0053] The steam pipe 13 is provided with a pressure sensor 811 for monitoring the pressure at the steam output end of the chip heat dissipation module 11. The steam pipe 14 is provided with a pressure sensor 812 for monitoring the steam pressure in the server chassis 1. The pressure measurement interface of the cavity of the server chassis 1 is provided with a pressure sensor 3 813 to realize real-time monitoring of the pressure of the chassis cavity. The steam pipe 14 is provided with a temperature sensor 822, and the steam pipe 13 is provided with a temperature sensor 2 821 for monitoring the steam temperature at the output end of the server chassis 1 and the output end of the chip heat dissipation module 11, so as to facilitate real-time regulation of the heat dissipation circuit. The outlet of the condenser 2 is provided with a temperature sensor 3 823 for monitoring the initial temperature of the liquid in the heat dissipation circuit. The temperature measurement interface of the server chassis 1 is provided with a temperature sensor 4 824 for real-time monitoring of the cavity temperature of the server chassis 1 to prevent system damage caused by excessive temperature.

[0054] The control module uses the PID controller to adjust the flow rate of the fluorinated liquid in the heat dissipation circuit and the level of the fluorinated liquid in the server chassis 1 at different server chip 115 powers, so as to save energy and prevent the capillary core block 112 from being dry-burned. The specific adjustment strategy is as follows: Figure 5As shown. In order to enable the control module to effectively respond to different needs in different situations, the control logic of the control module is mainly divided into two types. One is to change the mass flow rate of the fluorinated liquid in the heat dissipation circuit by adjusting the pump power of the micro gear pump 6, and the other is to adjust the mass flow rate by adjusting the valve opening of the solenoid valve 4. The control module selects a suitable adjustment method according to the power of the server chip 115 to achieve the adjustment. When the power consumption is low, it is preferred to control the opening of the solenoid valve 4 to adjust the flow rate of the fluorinated liquid in the circuit. When the power consumption is high, the solenoid valve 4 door opening and the pump power of the micro gear pump 6 are controlled at the same time to adjust the flow rate, reducing energy consumption while ensuring sufficient liquid supply to the capillary core block 112. At the same time, the two adjustment methods can also increase the system fault tolerance.

[0055] First, determine the relationship between the chip power and the mass flow rate of the fluorinated liquid that meets the heat dissipation requirements. According to the chip power, the mass flow rate of the fluorinated liquid required for chip heat dissipation can be calculated as follows: The deviation of PID adjustment is defined as:

[0056] Error=R S -R C .

[0057] Among them are the parameters monitored by flow meter 7 in real time.

[0058] It can be obtained that the adjustment formula of the pump power of the micro gear pump 6 is:

[0059]

[0060] Correspondingly, the adjustment formula for the opening of the solenoid valve 4 can be obtained as follows:

[0061]

[0062] Among them, is the proportional gain, is the integral gain, is the differential gain, pump is the micro gear pump 6, valve is the solenoid valve 4, and t is the time.

[0063] By using an adaptive PID controller to automatically adjust the proportional, integral and differential gains of the PID controller according to the system dynamic characteristics and external conditions, more precise control can be achieved. By adjusting the variable proportional gain, the system can respond quickly to the power consumption of the server chip 115, increase or decrease the pump power of the micro gear pump 6, ensure the normal heat dissipation of the server chip 115 when the power consumption is high, and ensure the system operation power consumption is reduced when the power consumption is low. The variable integral gain adjustment can gradually increase the flow rate of the fluorinated liquid when the high power consumption lasts for a long time, ensure that the system quickly adapts to the power consumption change, and gradually reduce the flow rate of the fluorinated liquid when the power is low, so as to avoid excessive adjustment and cause the fluorinated liquid level in the chassis to change. Using the variable differential gain adjustment, the system change trend can be predicted, and the excessive increase of the mass flow rate of the fluorinated liquid at high power consumption, excessive response at low power consumption, reduce system oscillation and overshoot, and improve system stability.

[0064] Therefore, the utility model adopts an immersion heat dissipation structure based on porous film evaporation phase change of the above structure, which solves the problems of low critical heat flux density of two-phase immersion server chassis heat dissipation, high cost caused by large demand for fluorinated liquid, and pressure fluctuation affecting the reliability of server operation.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. An immersion heat dissipation structure based on porous film evaporation phase change, characterized in that: It includes a heat dissipation module for carrying server components and providing a heat exchange environment; A condensation module, used to convert the electronic fluoride liquid vapor generated by the heat dissipation of the chassis into electronic fluoride liquid; The filter module filters and purifies the electronic fluorine liquid converted by the condensation module to remove impurities therein; The liquid storage module stores the electronic fluorine liquid purified by the filter module and provides the electronic fluorine liquid for the heat dissipation circuit; Booster module, providing power for electronic fluorine fluid; The control module collects and processes the parameter data of temperature, pressure and flow in the heat dissipation circuit, and adjusts the parameter data according to the preset values.

2. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 1, characterized in that: The heat dissipation module includes a server chassis, a chip heat dissipation module and a server component are arranged inside the server chassis, a pressure sensor three and a temperature sensor three are arranged on the server chassis, an output end of the server chassis is connected to a steam pipe one, a pressure sensor one and a temperature sensor one are arranged on the steam pipe one, an output end of the chip heat dissipation module is connected to a steam pipe two, the steam pipe two extends from the server chassis, and a pressure sensor two and a temperature sensor two are arranged on the part of the steam pipe two extending from the server chassis.

3. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 2, characterized in that: The condensation module comprises a condenser, on which a heat exchanger is arranged, a temperature sensor 4 is arranged on the liquid pipeline at the output end of the condenser, and the output ends of the steam pipe 1 and the steam pipe 2 are connected to the input end of the condenser.

4. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 3, characterized in that: The filter module comprises a filter and a solenoid valve. The output end of the condenser is connected to the input end of the filter through a liquid pipeline, and the output end of the filter is connected to the input end of the solenoid valve.

5. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 4, characterized in that: The liquid storage module comprises a liquid storage tank, and the output end of the solenoid valve is connected to the input end of the liquid storage tank.

6. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 1, characterized in that: The boost module includes a micro gear pump and a flow meter. The output end of the liquid storage tank is connected to the input end of the micro gear pump, the output end of the micro gear pump is connected to the input end of the flow meter, and the output end of the flow meter is connected to the input end of the chip cooling module.

7. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 2, characterized in that: The chip heat dissipation module includes a server chip, an interface material is arranged on the top of the server chip, a chip packaging shell is arranged on the top of the interface material, a capillary core block is installed on the top of the chip packaging shell, an upper cover plate is arranged above the chip packaging shell, and the chip packaging shell is fixedly connected to the upper cover plate.

8. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 7, characterized in that: A liquid inlet pipeline and a steam pipeline are arranged on the upper cover plate, and side holes are arranged on both sides of the upper cover plate. The liquid inlet pipeline is connected to the liquid pipeline, and the steam pipeline is connected to the steam pipeline 2.

9. The immersion heat dissipation structure based on porous film evaporation phase change according to claim 1, characterized in that: The control module is a PID control system. The PID control system collects parameters from pressure sensor 1, pressure sensor 2, pressure sensor 3, temperature parameters from temperature sensor 1, temperature sensor 2, temperature sensor 3, temperature sensor 4 and flow parameters from the flow meter, and after processing, controls the pump power of the micro gear pump and the opening of the solenoid valve according to the processing results.

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