A vacuum brazed low-pressure pollution-free air-cooled radiator

Abstract

The present invention relates to the technical field of air-cooled radiators, and particularly relates to an air-cooled radiator with vacuum brazing and low pollution, including: a mounting plate, the outer wall of the mounting plate is fixedly penetrated by a plurality of heat pipes, and the head and tail of every two adjacent heat pipes are staggered. The outer walls of the heat pipes below the mounting plate are commonly fixedly connected with heat absorption fins. The temperature difference between the heat absorption fins and the heat dissipation fins is detected by a semiconductor thermoelectric power generation rod. When the temperature inside the server is high and the temperature of the heat dissipation fins is relatively low, the temperature difference is large, and the semiconductor thermoelectric power generation rod generates a large current, indicating high heat dissipation efficiency. The PLC controller controls the first motor to reduce the speed, and the speeds of the intake fan and the exhaust fan decrease, reducing the ventilation volume; when the temperatures of both the heat absorption fins and the heat dissipation fins are relatively high and the temperature difference shrinks, the current generated by the semiconductor thermoelectric power generation rod decreases, indicating low heat dissipation efficiency. The PLC controller controls the first motor to increase the speed, and the speeds of the intake fan and the exhaust fan increase, increasing the ventilation volume.

Description

Technical Field

[0001] The invention relates to the technical field of air-cooled radiators, and in particular to a vacuum brazed, low-pressure, pollution-free air-cooled radiator. Background Art

[0002] Air-cooled radiator is a heat dissipation device that uses air flow to reduce the temperature of electronic equipment. It is mainly composed of heat conducting plates, fans and heat pipes. Its working principle is that the heat generated by the electronic equipment is transferred to the heat conducting plates through heat conducting pipes or directly. The fan draws in external cold air, allowing the cold air to flow through the surface of the heat conducting plates to take away the heat. The hot air is discharged, forming a continuous cycle process, thereby ensuring that the temperature of the equipment is maintained within a reasonable range.

[0003] Air-cooled radiators are suitable for various power equipment, such as servers. Air-cooled radiators are used in servers as key heat dissipation equipment to ensure the stable operation of servers. They effectively reduce the temperature of electronic components in the server through air flow. During the operation of the server, multiple high-performance processors, a large number of memory modules and complex integrated circuits continue to operate at high speed, generating considerable heat. If the heat cannot be dissipated in time, it will not only cause a significant decline in server performance, but may even cause hardware failures, resulting in serious consequences such as data loss. For example, a server air-cooled high-efficiency heat dissipation device disclosed in application number CN201811217685.X is an air-cooled radiator for servers.

[0004] When the existing air-cooled radiator dissipates heat inside the server, the heat generated by the server during operation is transferred to the heat conductive sheet. The speed of natural heat dissipation is slow. The fan can speed up the air flow so that the air can quickly take away the heat from the heat conductive sheet, thereby effectively improving the heat dissipation efficiency and ensuring the stable operation of the server. However, the fan usually only uses a constant speed to speed up the heat dissipation efficiency of the heat sink. Since the load of the server changes dynamically and the heat generated under different loads is different, the fan using a constant fan speed for heat dissipation will result in over-heating or under-heating. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a vacuum brazed low-pressure pollution-free air-cooled radiator, which can effectively solve the problem that the prior art cannot perform adaptive heat dissipation according to actual heat dissipation conditions.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0007] The present invention provides a vacuum brazing low-pressure pollution-free air-cooled radiator, comprising:

[0008] Installation plate, a plurality of heat pipes are fixedly penetrated through the outer wall of the installation plate, and the head and tail of every two adjacent heat pipes are arranged in a staggered manner. The outer walls of the heat pipes below the installation plate are fixedly connected with heat absorption fins together, and the outer walls of the heat pipes above the installation plate are fixedly connected with heat dissipation fins together. Heat dissipation fixing strips are fixedly connected to both side walls of the heat dissipation fins, and heat absorption fixing strips are fixedly connected to both side walls of the heat absorption fins;

[0009] Heat dissipation auxiliary mechanism, the heat dissipation auxiliary mechanism includes a semiconductor thermoelectric generation rod for detecting the temperature difference between the heat absorption fin and the heat dissipation fin. The heat dissipation auxiliary mechanism further includes an intake fan and an exhaust fan for assisting heat dissipation. Shafts are fixedly connected to the axles of the intake fan and the exhaust fan, and a driving source is fixedly connected to the other end of the shaft. The semiconductor thermoelectric generation rod is electrically connected to a current detector, the current detector is electrically connected to a PLC controller to form a detection circuit, and the PLC controller is electrically connected to the driving source to form a speed control circuit.

[0010] Preferably, a sealing groove is formed on one side of the installation plate close to the heat absorption fin, a sealing ring is arranged on the inner wall of the sealing groove, and a plurality of threaded holes for installation are formed on one side of the installation plate close to the sealing ring.

[0011] Preferably, the joints of the heat pipes with the installation plate, the heat dissipation fins and the heat absorption fins are all processed by vacuum brazing technology. Heat dissipation fixing plates are fixedly connected to both sides of the plurality of heat dissipation fins and the plurality of heat absorption fins.

[0012] Preferably, one end of the semiconductor thermoelectric generation rod is fixedly connected to the top of the lowermost heat absorption fin, and the other end of the semiconductor thermoelectric generation rod sequentially penetrates through the heat absorption fin, the installation plate and the heat dissipation fin from bottom to top and is fixedly connected to the uppermost heat dissipation fin.

[0013] Preferably, the heat dissipation auxiliary mechanism further includes a circular filter screen fixedly connected to the top end of the heat pipe. A first mounting ring is fixedly connected to the outer peripheral wall of the circular filter screen, a second mounting ring is fixedly connected to the top end of the installation plate, rotating grooves are formed on the opposite sides of the first mounting ring and the second mounting ring, and two symmetrically arranged arc-shaped filter meshes are rotatably connected in the rotating grooves. Two symmetrically arranged fan frames are fixedly connected between the two arc-shaped filter meshes.

[0014] Preferably, L-shaped plates are fixedly connected to the outer walls of the two fan frames close to the bottom ends. The outer wall of the L-shaped plate is fixedly connected to the driving source. The driving source is a first motor, the shaft is fixedly connected to the output end of the first motor, and a filter cover is fixedly connected to the outer wall of the fan frame.

[0015] Preferably, a toothed ring is fixedly connected to the inner peripheral walls of the arc-shaped filter screens. A second motor is fixedly connected to the outer wall of one of the heat absorption fins. The output end of the second motor is fixedly connected to a rotating rod. The output end of the rotating rod is fixedly connected to a gear, and the gear meshes with the toothed ring.

[0016] Preferably, infrared receiving plates are fixedly connected to the outer walls of the two heat dissipation fixing plates. An infrared emitting lamp is fixedly connected to the outer wall of the fan frame, and the infrared emitting lamp and the infrared receiving plates are on the same horizontal plane. The infrared emitting lamp, the infrared receiving plates and the PLC controller are electrically connected to form a detection circuit, and the PLC controller and the second motor are electrically connected to form an adjustment circuit.

[0017] The technical solution provided by the present invention has the following beneficial effects compared with the known prior art:

[0018] The temperature difference between the heat absorption fins and the heat dissipation fins is detected by the semiconductor thermoelectric generation rod. When the temperature inside the server is high and the temperature of the heat dissipation fins is relatively low, the temperature difference is large, and the semiconductor thermoelectric generation rod generates a large current, indicating high heat dissipation efficiency. The PLC controller controls the first motor to reduce the speed, and the speeds of the intake fan and the exhaust fan decrease, reducing the ventilation volume. When the temperatures of the heat absorption fins and the heat dissipation fins are both relatively high and the temperature difference shrinks, the current generated by the semiconductor thermoelectric generation rod decreases, indicating low heat dissipation efficiency. The PLC controller controls the first motor to increase the speed, and the speeds of the intake fan and the exhaust fan increase, increasing the ventilation volume. Thus, the fan speed can be intelligently adjusted according to the heat dissipation situation, enabling the server to obtain a suitable heat dissipation effect in different working states, and avoiding the problems of energy waste and insufficient heat dissipation.

[0019] The second motor is used to drive the gear to rotate. The gear drives the toothed ring to rotate, thereby driving the arc-shaped filter screen and the fan frame to rotate, realizing the synchronous rotation of the intake fan and the exhaust fan, and performing all-round heat dissipation on the heat dissipation fins. At the same time, through the cooperation of the infrared receiving plates and the infrared emitting lamp, the PLC controller controls the speed of the second motor to adjust the position of the fan frame, avoiding the heat dissipation fixing plates from blocking the air flow and ensuring the heat dissipation effect. Compared with the existing air-cooled radiators that can only dissipate heat from a fixed direction, the heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 Schematic three-dimensional structure of the present invention Figure 1 ;

[0022] Figure 2 Schematic diagram of the three-dimensional structure of the present invention Figure 2 ;

[0023] Figure 3 Schematic diagram of the internal three-dimensional structure of the present invention Figure 1 ;

[0024] Figure 4 Schematic diagram of the internal three-dimensional structure of the present invention Figure 2 ;

[0025] Figure 5 Schematic diagram of a partial three-dimensional structure of the present invention;

[0026] Figure 6 Schematic diagram of the three-dimensional structure of the present invention Figure 3 ;

[0027] Figure 7 For the present invention Figure 3 Schematic diagram of the three-dimensional structure of part A in

[0028] Reference numerals: 1, mounting plate; 2, heat pipe; 3, heat absorption fin; 4, heat dissipation fin; 5, heat dissipation fixing strip; 6, heat absorption fixing strip; 7, heat dissipation auxiliary mechanism; 71, semiconductor thermoelectric generation rod; 72, intake fan; 73, exhaust fan; 74, rotating shaft; 75, circular filter screen; 76, first mounting ring; 77, second mounting ring; 78, rotating groove; 79, arc-shaped filter screen; 710, fan frame; 711, L-shaped plate; 712, first motor; 713, filter cover; 714, toothed ring; 715, second motor; 716, rotating rod; 717, gear; 718, infrared receiving plate; 719, infrared emitting lamp; 8, sealing groove; 9, sealing ring; 10, threaded hole; 11, heat dissipation fixing plate. Detailed implementation manners

[0029] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] The present invention will be further described below with reference to the embodiments.

[0031] Embodiment: Refer to Figures 1 to 7 , an air-cooled radiator with vacuum brazing, low pressure and no pollution, comprising:

[0032] Installation plate 1, and a plurality of heat pipes 2 are fixedly penetrated through the outer wall of the installation plate 1. To ensure structural stability and uniform heat conduction, every two adjacent heat pipes 2 are arranged with their heads and tails staggered. The outer walls of the heat pipes 2 located below the installation plate 1 are fixedly connected to heat absorption fins 3 together. The outer walls of the heat pipes 2 located above the installation plate 1 are fixedly connected to heat dissipation fins 4 together. Heat dissipation fixing strips 5 are fixedly connected to both side walls of the heat dissipation fins 4, and heat absorption fixing strips 6 are fixedly connected to both side walls of the heat absorption fins 3. The outer walls of the heat pipes 2 located below the installation plate 1 are fixedly connected to the heat absorption fins 3 together to absorb heat, and the outer walls of the heat pipes 2 located above the installation plate 1 are fixedly connected to the heat dissipation fins 4 together to be responsible for dissipating heat to the outside.

[0033] A sealing groove 8 is formed on one side of the installation plate 1 close to the heat absorption fins 3. A sealing ring 9 is arranged on the inner wall of the sealing groove 8. A plurality of threaded holes 10 for installation are formed on one side of the installation plate 1 close to the sealing ring 9, and the threaded holes 10 are used for being installed and fixed on the top of the server.

[0034] The joints of the heat pipes 2 with the installation plate 1, the heat dissipation fins 4, and the heat absorption fins 3 are all processed by vacuum brazing technology. Heat dissipation fixing plates 11 are fixedly connected to both sides of the plurality of heat dissipation fins 4 and the plurality of heat absorption fins 3. This technology can ensure the high strength and good heat conductivity of the connection parts and avoid the increase of thermal resistance.

[0035] Temperature difference detection and control: The heat dissipation auxiliary mechanism 7 includes a semiconductor thermoelectric generation rod 71, one end of which is fixedly connected to the top of the lowermost heat absorption fin 3, and the other end sequentially penetrates through the heat absorption fin 3, the installation plate 1, and the heat dissipation fin 4 from bottom to top and is fixedly connected to the uppermost heat dissipation fin 4, and is used for detecting the temperature difference between the heat absorption fin 3 and the heat dissipation fin 4;

[0036] The semiconductor thermoelectric generation rod 71 is electrically connected to a current detector, the current detector is electrically connected to a PLC controller to form a detection circuit, and the PLC controller is further electrically connected to the power sources of the intake fan 72 and the exhaust fan 73 to form a speed control circuit, and automatically adjusts the fan speed according to the temperature difference to achieve intelligent heat dissipation.

[0037] The heat dissipation auxiliary mechanism 7 further includes a circular filter net 75 fixedly connected to the top end of the heat pipe 2. A first installation ring 76 is fixedly connected to the outer peripheral wall of the circular filter net 75. A second installation ring 77 is fixedly connected to the top end of the installation plate 1. Rotating grooves 78 are formed on the opposite sides of the first installation ring 76 and the second installation ring 77. Two symmetric arc-shaped filter nets 79 are rotatably connected in the rotating grooves 78. Two symmetric fan frames 710 are fixedly connected between the two arc-shaped filter nets 79.

[0038] On the outer wall near the bottom end of two fan brackets 710, there is an L-shaped plate 711 fixedly connected. The outer wall of the L-shaped plate 711 is fixedly connected to a drive source, and the drive source is a first motor 712. The rotating shaft 74 is fixedly connected to the output end of the first motor 712. A filter cover 713 is fixedly connected to the outer wall of the fan bracket 710.

[0039] A toothed ring 714 is fixedly connected to the inner peripheral walls of the arc-shaped filter screens 79 together. On the outer wall of one of the heat absorption fins 3, there is a second motor 715 fixedly connected. The output end of the second motor 715 is fixedly connected to a rotating rod 716. The output end of the rotating rod 716 is fixedly connected to a gear 717, and the gear 717 meshes with the toothed ring 714.

[0040] Infrared receiving plates 718 are fixedly connected to the outer walls of two heat dissipation fixing plates 11. An infrared emitting lamp 719 is fixedly connected to the outer wall of the fan bracket 710, and the infrared emitting lamp 719 and the infrared receiving plate 718 are on the same horizontal plane. The infrared emitting lamp 719, the infrared receiving plate 718 are electrically connected to a PLC controller to form a detection circuit, and the PLC controller is electrically connected to the second motor 715 to form an adjustment circuit.

[0041] The semiconductor thermoelectric power generation rod 71 works based on the Seebeck effect. When there is a temperature difference between the two ends of the rod, the internal carriers (electrons and holes) will move directionally. In the specific detection process, the end of the semiconductor thermoelectric power generation rod 71 in contact with the heat absorption fin 3 has a higher temperature, and the end in contact with the heat dissipation fin 4 has a lower temperature. The carriers in the high-temperature region have higher kinetic energy. The electrons in the N-type semiconductor and the holes in the P-type semiconductor both diffuse from the high-temperature region to the low-temperature region. As the carriers continue to diffuse, the high-temperature end accumulates positive charges (N-type semiconductor) or negative charges (P-type semiconductor) due to the outflow of carriers, and the low-temperature end accumulates opposite-polarity charges due to the inflow of carriers. Thus, an electric field is established at both ends. The electric field will hinder the further diffusion of carriers. When the hindering effect of the electric field force and the diffusion driving force caused by the temperature difference reach equilibrium, the net diffusion amount of carriers no longer increases, and the open-circuit voltage at both ends of the thermoelectric power generation rod reaches stability. At this time, both ends of the thermoelectric power generation rod are connected in series with a current detector through wires to form a closed circuit. Driven by the potential difference, the current generated in the circuit will flow through the current detector. Through the current detector, the magnitude of the current in the circuit can be monitored in real time, thereby feeding back the power generation state of the semiconductor thermoelectric power generation rod 71, and further feeding back the temperature difference change situation between the heat absorption fin 3 and the heat dissipation fin 4, and further feeding back the heat dissipation efficiency.

[0042] The working principle is as follows:

[0043] The mounting plate 1 serves as the basic support. The heat pipes 2 penetrate through its outer wall, and the adjacent heat pipes 2 are staggered head to tail to ensure structural stability and uniform heat conduction. The heat pipes 2 are connected to the mounting plate 1, the heat dissipation fins 4, and the heat absorption fins 3 by vacuum brazing to reduce the thermal resistance and improve the heat conduction efficiency. During operation, heat is absorbed by the heat absorption fins 3 and transferred to the heat dissipation fins 4 through the heat pipes 2. The sealing groove 8 and the sealing ring 9 on the side of the mounting plate 1 close to the heat absorption fins 3 prevent liquid or gas leakage and ensure stable heat conduction.

[0044] The semiconductor thermoelectric generator 71 can convert the temperature difference between the inside of the server and the heat dissipation fins 4 into electrical energy output based on the Seebeck effect. The amount of current generated by it can be used as a key indicator to quantify the heat dissipation efficiency of the heat dissipation fins 4.

[0045] When the temperature inside the server is at a high level: If the temperature of the heat dissipation fins 4 is relatively low, a significant temperature difference is formed between the two, and the semiconductor thermoelectric generator 71 will generate a large current due to the Seebeck effect. This indicates that the heat dissipation fins 4 can quickly and effectively export the heat inside the server, and the heat dissipation efficiency is at a high level; If the temperature of the heat dissipation fins 4 is also relatively high, the temperature difference between the inside of the server and the heat dissipation fins 4 decreases, and the current generated by the semiconductor thermoelectric generator 71 also decreases accordingly, meaning that the heat dissipation fins 4 fail to dissipate heat in a timely and sufficient manner, and the heat dissipation efficiency is low.

[0046] It should be emphasized that the heat dissipation fins 4 undertake the heat dissipation function. Based on the basic principles of thermodynamics, heat will spontaneously transfer from the high-temperature area to the low-temperature area. Therefore, the temperature of the heat dissipation fins 4 is always lower than the temperature of the heat absorption fins 3 inside the server. The semiconductor thermoelectric generator 71 uses the Seebeck effect to convert the temperature difference between the two into electrical energy output. By monitoring the current change generated by this generator, the temperature difference situation of the heat dissipation fins 4 can be obtained in real time. Given the continuous and stable temperature difference relationship between the heat dissipation fins 4 and the heat absorption fins 3 inside the server, the heat dissipation efficiency feedback by the semiconductor thermoelectric generator 71 always represents the heat dissipation efficiency of the heat dissipation fins 4.

[0047] The PLC controller can understand the heat dissipation efficiency of the heat dissipation fins 4 in real time by analyzing the current feedback by the current detector:

[0048] High heat dissipation efficiency: When the temperature of the heat absorption fins 3 is high (i.e., the temperature inside the server is high), but the temperature of the heat dissipation fins 4 is relatively low, the temperature difference at both ends of the semiconductor thermoelectric generator 71 is large, and the generated current is also large. This indicates that the heat dissipation fins 4 can quickly and effectively export the heat inside the server, and the heat dissipation efficiency is at a high level. At this time, the PLC controller will send an instruction to the first motor 712 to reduce its speed. When the speed of the first motor 712 decreases, it drives the speeds of the intake fan 72 and the exhaust fan 73 to decrease, reducing the ventilation volume. Because in the case of high heat dissipation efficiency, a large amount of ventilation is not required to meet the heat dissipation demand, and reducing the fan speed can reduce energy consumption and noise.

[0049] Low heat dissipation efficiency: If the temperature of the heat absorbing fins 3 and the temperature of the heat dissipating fins 4 are both high, the temperature difference between the two is reduced, and the current generated by the semiconductor temperature difference power generation rod 71 is reduced accordingly, which means that the heat dissipating fins 4 fail to dissipate heat in a timely and sufficient manner, and the heat dissipation efficiency is low. At this time, the PLC controller will send an instruction to the first motor 712 to increase its speed. The speed of the first motor 712 increases, driving the speed of the air intake fan 72 and the exhaust fan 73 to increase, increasing the ventilation volume. By increasing the ventilation volume, the air flow speed around the heat dissipating fins 4 can be accelerated, thereby taking away more heat, improving the heat dissipation efficiency, and meeting the heat dissipation requirements of the server.

[0050] In summary, through the heat dissipation efficiency fed back by the semiconductor temperature difference power generation rod 71, the PLC controller can accurately control the rotation speed of the first motor 712, realize the intelligent control of the heat dissipation system, and ensure that the server can obtain appropriate heat dissipation effect under different working conditions.

[0051] At the same time, the gear 717 is driven to rotate by the second motor 715, and the gear ring 714 is driven to rotate by the gear 717, thereby driving the arc filter 79 and the fan frame 710 to rotate, so that the inlet fan 72 and the exhaust fan 73 rotate synchronously, thereby dissipating heat to the heat dissipation fins 4 in all directions. Since the rotation of the fan frame 710 will drive the infrared transmitting lamp 719 to emit infrared rays, when the infrared rays are received by the infrared receiving board 718, it means that the fan frame 710 corresponds to the position of the heat dissipation fixing plate 11. Therefore, it is necessary to control the second motor 715 to speed up the speed through the PLC controller until the infrared receiving board 718 can no longer receive infrared rays. The reason is that the heat dissipation fixing plate 11 blocks the airflow of the inlet fan 72 and the exhaust fan 73, affecting the heat dissipation efficiency. However, when the infrared receiving board cannot receive infrared rays, there will be nothing to block the airflow, and the airflow can pass through between the heat dissipation fins 4 to accelerate the heat dissipation effect. At this time, the inlet fan 72 and the exhaust fan 73 need to be restored to the initial state to discharge more heat from the heat dissipation fins 4.

[0052] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum brazed low-pressure pollution-free air-cooled radiator, characterized in that, Including: An installation plate (1), the outer wall of the installation plate (1) is fixedly penetrated by a plurality of heat pipes (2), and every two adjacent heat pipes (2) are arranged with their heads and tails staggered. The outer walls of the heat pipes (2) located below the installation plate (1) are fixedly connected together with heat absorption fins (3), and the outer walls of the heat pipes (2) located above the installation plate (1) are fixedly connected together with heat dissipation fins (4). Both side walls of the heat dissipation fins (4) are fixedly connected with heat dissipation fixing strips (5), and both side walls of the heat absorption fins (3) are fixedly connected with heat absorption fixing strips (6); A heat dissipation auxiliary mechanism (7), the heat dissipation auxiliary mechanism (7) includes a semiconductor thermoelectric generation rod (71) for detecting the temperature difference between the heat absorption fins (3) and the heat dissipation fins (4). The heat dissipation auxiliary mechanism (7) further includes an intake fan (72) and an exhaust fan (73) for assisting heat dissipation. Shafts (74) are fixedly connected to the axles of the intake fan (72) and the exhaust fan (73), and the other ends of the shafts (74) are fixedly connected to a driving source. The semiconductor thermoelectric generation rod (71) is electrically connected to a current detector, the current detector is electrically connected to a PLC controller to form a detection circuit, and the PLC controller is electrically connected to the driving source to form a speed control circuit; The joints of the heat pipes (2) with the installation plate (1), the heat dissipation fins (4), and the heat absorption fins (3) are all processed by a vacuum brazing process. Heat dissipation fixing plates (11) are fixedly connected to both sides of the plurality of heat dissipation fins (4) and the plurality of heat absorption fins (3). The heat dissipation auxiliary mechanism (7) further includes a circular filter net (75) fixedly connected to the top end of the heat pipe (2). A first mounting ring (76) is fixedly connected to the outer peripheral wall of the circular filter net (75), a second mounting ring (77) is fixedly connected to the top end of the installation plate (1). Rotating grooves (78) are formed on the opposite sides of the first mounting ring (76) and the second mounting ring (77). Two symmetrically arranged arc-shaped filter nets (79) are rotatably connected in the rotating grooves (78). Two symmetrically arranged fan brackets (710) are fixedly connected together between the two arc-shaped filter nets (79); Infrared receiving plates (718) are fixedly connected to the outer walls of the two heat dissipation fixing plates (11). An infrared emitting lamp (719) is fixedly connected to the outer wall of the fan bracket (710), and the infrared emitting lamp (719) and the infrared receiving plate (718) are on the same horizontal plane. The infrared emitting lamp (719), the infrared receiving plate (718) are electrically connected to the PLC controller to form a detection circuit, and the PLC controller is electrically connected to a second motor (715) to form an adjustment circuit.

2. The air-cooled radiator with vacuum brazing, low pressure and no pollution according to claim 1, wherein A sealing groove (8) is formed on one side of the installation plate (1) close to the heat absorption fins (3). A sealing ring (9) is arranged on the inner wall of the sealing groove (8). A plurality of threaded holes (10) for installation are formed on one side of the installation plate (1) close to the sealing ring (9).

3. The air-cooled radiator with vacuum brazing, low pressure and no pollution according to claim 1, characterized in that, One end of the semiconductor thermoelectric power generation rod (71) is fixedly connected to the top of the lowermost heat absorption fin (3), and the other end of the semiconductor thermoelectric power generation rod (71) sequentially penetrates through the heat absorption fin (3), the mounting plate (1), and the heat dissipation fin (4) from bottom to top and is fixedly connected to the uppermost heat dissipation fin (4).

4. A vacuum brazed air-cooled radiator with low pressure and no pollution according to claim 1, characterized in that, L-shaped plates (711) are fixedly connected to the outer walls of the two fan frames (710) near the bottom ends, the outer walls of the L-shaped plates (711) are fixedly connected to a drive source, the drive source is a first motor (712), the rotating shaft (74) is fixedly connected to the output end of the first motor (712), and a filter cover (713) is fixedly connected to the outer wall of the fan frame (710).

5. The air-cooled radiator with vacuum brazing and low-pressure pollution-free according to claim 4, characterized in that, A toothed ring (714) is fixedly connected to the inner peripheral walls of the arc-shaped filter screens (79) together, a second motor (715) is fixedly connected to the outer wall of one of the heat absorption fins (3), a rotating rod (716) is fixedly connected to the output end of the second motor (715), a gear (717) is fixedly connected to the output end of the rotating rod (716), and the gear (717) meshes with the toothed ring (714).

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