An electronic device test fixture and method based on phase change energy storage

Abstract

The present invention relates to the field of electronic device testing, and particularly relates to a testing fixture and method for electronic devices based on phase change energy storage, including: a base provided with an installation part for installing an electronic device; a heat storage chamber disposed inside the base; a guide slide plate horizontally placed in the heat storage chamber and dividing the inner cavity of the heat storage chamber into an upper sub-chamber and a lower sub-chamber. At least one side of the guide slide plate is provided with a guide slide inclined surface and extends towards the inner wall of the heat storage chamber adjacent to the installation part at an inclination angle. A communication channel for communicating the upper sub-chamber and the lower sub-chamber is provided between the end of the guide slide inclined surface and the inner wall of the heat storage chamber; a phase change energy storage body is encapsulated in the upper sub-chamber in a solid prefabricated form. The present invention can absorb and release heat through the phase change energy storage body, can perform transient heat dissipation buffering to maintain the temperature stability of the test environment and electronic components, can dissipate heat efficiently, and can provide a quiet working environment at the same time.

Description

Technical Field

[0001] The present invention relates to the field of electronic device testing, and particularly to an electronic device testing fixture and method based on phase change energy storage. Background Art

[0002] With the rapid development of avionics technology, integrated modular avionics equipment has become a core component of modern aircraft. Such equipment, with its efficient and flexible characteristics, has greatly improved the combat performance and mission adaptability of aircraft. However, during its development process, the problems of thermal power consumption and heat flux density of modules have gradually emerged, becoming one of the key factors restricting the improvement of equipment performance. During the development stage of modules, in order to ensure the correct programming, debugging, and comprehensive testing of their functions, special testing fixtures usually need to be made. These fixtures are often simplified versions of the rack in design, mainly composed of components such as liquid cooling plates, side plates, and handles. The testing fixtures also need to be equipped with corresponding air-cooling or liquid-cooling systems, power supplies, and cables. However, there are many problems in the use of existing testing fixtures. First, the assembly process is cumbersome and complex, requiring multiple people to cooperate to complete various pipeline assembly tasks, which not only increases labor costs but also reduces work efficiency. Second, the testing desktop is often messy, with various cables and tools mixed together, which not only affects the aesthetics of the working environment but also increases safety hazards and is not convenient for transfer between different workstations. During the testing process, its working states include standby state and different power states. At peak power, a supporting system with strong heat dissipation performance is required, and it is required to quickly respond to the heat dissipation requirements of peak power. However, during the testing process, there is also a long low-power working state or even a standby state. In terms of the average working power, the heat dissipation design of the entire fixture needs to be designed according to peak power, resulting in over-performance and higher fixture costs. Finally, the testing preparation stage takes a long time, and the cold source startup, pipeline leak detection, and temperature stabilization take a long time, affecting the testing efficiency and seriously restricting the testing progress of the equipment. Summary of the Invention

[0003] The purpose of the present invention is to provide an electronic device testing fixture and method based on phase change energy storage for the deficiencies of the prior art, which can absorb and release heat through a phase change energy storage body, can perform transient heat dissipation buffering to maintain the temperature stability of the testing environment and electronic components, can dissipate heat efficiently, and can provide a quiet working environment.

[0004] The purpose of the present invention is achieved as follows: An electronic device testing fixture based on phase change energy storage, comprising:

[0005] A base, provided with an installation part for installing an electronic device;

[0006] A heat storage bin, arranged inside the base;

[0007] The guide slide plate is horizontally placed in the heat storage bin and divides the inner cavity of the heat storage bin into an upper sub-cavity and a lower sub-cavity. At least one side of the guide slide plate is provided with a guide slide inclined surface and extends towards the inner wall of the heat storage bin adjacent to the installation part at an inclination angle. A communication channel for communicating the upper sub-cavity and the lower sub-cavity is provided between the end of the guide slide inclined surface and the inner wall of the heat storage bin;

[0008] The phase change energy storage body is encapsulated in the upper sub-cavity in a solid prefabricated form.

[0009] There is an open cavity between the upper and lower side walls of the base. Installation parts are provided on both side walls of the open cavity. Two insulated heat storage bins are provided on both the upper and lower side walls of the base; Guide slide inclined surfaces are provided on both sides of the guide slide plate, and the two guide slide inclined surfaces converge and extend towards the distal end.

[0010] The upper and lower side walls of the base have concave cavities. The concave cavities are divided into left and right two heat storage bins by an intermediate partition. The mouth ends of the concave cavities are detachably connected with cover plates, and a sealing ring is used for sealing between the cover plates and the mouth edges of the concave cavities.

[0011] The installation part includes a strip-shaped groove provided on the side wall of the open cavity. The cross section of the guide slide plate is triangular or a gradually shrinking cone; The two ends in the length direction of the guide slide plate are connected to the side walls of the heat storage bin.

[0012] A plurality of rib plates are arrayed on both side walls in the up and down direction of the guide slide plate in the length direction of the guide slide plate. The rib plates extend in the width direction, and the distal ends in the up and down direction of the rib plates are abutted against the inner walls of the corresponding heat storage chambers.

[0013] The base is rotatably connected to the bracket through a rotating shaft to form a flipping mechanism. The axis of the rotating shaft is horizontally arranged, so that the base can perform up and down flipping movement around the rotating shaft; The guide slide plate and the rib plates are made of heat-conducting metal materials.

[0014] Heat dissipation fins are arranged on the outer side wall in the transverse direction of the base.

[0015] The distal end of the guide slide plate is abutted against the side wall of the corresponding heat storage bin. Grooves or mesh holes arranged along the length direction of the guide slide plate are provided at the edge of the distal end of the guide slide plate, and the grooves or mesh holes form a communication channel;

[0016] Or, a gap is left between the distal end of the guide slide plate and the side wall of the adjacent heat storage bin, and the gap forms a communication channel.

[0017] Temperature sensors are buried in the heat storage bin, and the temperature sensors are electrically connected to an external display device.

[0018] An electronic device testing method based on phase change energy storage includes the following steps:

[0019] Install the electronic device on any one of the test fixtures, and ensure that the locking strip of the electronic device is in close contact with the fixture;

[0020] After the installation of the electronic device is completed, apply preset test conditions to the electronic device, start a preset test program, perform tests on the electronic device, and continuously dissipate heat from the electronic device through the phase change of the phase change energy storage body of the fixture during the test, and record the test data;

[0021] After the test is completed, remove the electronic device from the fixture;

[0022] After the electronic device is removed, actively cool the fixture until the phase change material of the fixture turns into a solid phase;

[0023] After the cooling is completed, flip the fixture, and the fixture enters the state of waiting for testing, ready to receive the next electronic device for testing.

[0024] By adopting the present invention, it is possible to dissipate heat from the electronic device during simulation work. The phase change energy storage system is relatively simple and does not require complex circulation equipment and pipeline systems. During use, it is not necessary to dock and install facilities such as air cooling, liquid cooling systems, power supplies, and cables, and start work, which simplifies the installation preparation work during testing and improves work efficiency. At the same time, due to the reduction in the number of various pipelines and cables, the aesthetics of the working environment is improved, and potential safety hazards are reduced. The present invention provides a test fixture for an electronic device based on phase change energy storage. By absorbing and releasing heat through the phase change energy storage body, the phase change material has a relatively small temperature change during the phase change process, and can provide a relatively stable temperature environment. When the device temperature rises, the phase change material absorbs heat and undergoes a phase change, but the temperature will not rise rapidly like traditional liquid cooling. At the same time, through the design of the guide slide plate and the heat storage chamber, efficient heat dissipation is achieved, and a quiet working environment is provided, reducing the hearing damage of personnel performing long-term tests. At the same time, it is also suitable for test scenarios for noise testing of electronic devices.

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0026] Figure 1 is a structural schematic diagram of the present invention;

[0027] Figure 2 is an installation structural schematic diagram of the rear end cover plate of the present invention;

[0028] Figure 3 is a layout schematic diagram of the phase change energy storage body;

[0029] Figure 4 is a layout schematic diagram of the heat storage chamber;

[0030] Figure 5 Schematic structural diagram of a guide slide plate;

[0031] Figure 6 Schematic structural diagram of an electronic device.

[0032] In the accompanying drawings, 1 is a base, 2 is a phase change energy storage body, 3 is an electronic device, 12 is a heat storage chamber, 13 is a guide slide plate, 16 is a cover plate, 121 is an upper sub-chamber, 122 is a lower sub-chamber, 131 is a guide sliding slope, 132 is a rib plate, 141 is a communication channel, 161 is a sealing ring, and 11a is a mounting portion. Specific embodiments

[0033] Referring to the accompanying drawings, specific implementation manners of the present invention will be described in detail.

[0034] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0035] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms center, upper, lower, front, rear, left, right, vertical, horizontal, top, bottom, inner, outer, etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In the description of the present application, the terms first and second are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with the first and second can be explicitly or implicitly included one or more of such features. In the description of the present application, unless otherwise stated, the meaning of plurality is two or more. It should be noted that in actual applications, due to the limitations of device accuracy or installation errors, it is difficult to achieve absolute parallel or perpendicular effects. In the present application, the descriptions of perpendicular, parallel or in the same direction are not absolute limiting conditions, but indicate that the vertical or parallel structural settings can be achieved within a preset error range and the corresponding preset effects can be achieved. In this way, the technical effects of the defined features can be maximized, and the corresponding technical solutions are easy to implement and have high feasibility.

[0036] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0037] See Figures 1 to 6 , an embodiment of a test fixture for an electronic device based on phase change energy storage, including a base 1, the base 1 is provided with an installation part 11a for installing an electronic device, and a heat storage chamber 12, which is arranged inside the base 1; it can be arranged on the upper side wall, lower side wall, etc.; a guide slide plate 13 is horizontally placed in the heat storage chamber 12 and divides the inner cavity of the heat storage chamber 12 into an upper sub-chamber 121 and a lower sub-chamber 122, wherein the phase change energy storage body 2 is located in one of the sub-chambers, and the overall proportion of the cavity volume is small, and it can adapt to expansion. At least one side of the guide slide plate 13 is provided with a guide slide inclined surface 131 and extends towards the inner wall of the heat storage chamber 12 adjacent to the installation part 11a at an inclination angle. A communication channel 141 for communicating the upper sub-chamber 121 and the lower sub-chamber 122 is provided between the end of the guide slide inclined surface 131 and the inner wall of the heat storage chamber 12; the phase change energy storage body 2 is encapsulated in the upper sub-chamber 121 in a solid prefabricated form, and the phase change energy storage body 2 can be made of a paraffin-based phase change material.

[0038] It can be understood that the base 1 is the main structure of the test fixture or for installing a heating module, and is provided with an installation part 11a for installing an electronic device, for installing an electronic device, for fixing and conducting heat. The electronic device can be an avionics module or a PCB board, and can also be a power module, a communication module, a sensor module, etc. The base 1 provides a mechanical support and electrical connection basis for the entire test fixture, ensuring the stability and reliability of the test fixture. The avionics module is installed on the base 1 through the installation part 11a to simulate the installation environment of the avionics module.

[0039] The heat storage chamber 12 provides a packaging space for the phase change energy storage body 2 to ensure that it can effectively absorb and release heat during the test process, so as to achieve precise temperature control. The heat storage chamber 12 is divided into an upper sub-chamber 121 and a lower sub-chamber 122 by the guide slide plate 13, and the phase change energy storage body 2 is encapsulated in the upper sub-chamber 121. Heat is transferred to the heat storage chamber 12, and it can be understood that the heat transfer path of the side wall of the heat storage chamber 12 close to the installation part 11a is the shortest.

[0040] The guide slide plate 13, through its inclined guide sliding surface 131 and the communication channel 141, gives the phase change energy storage body 2 on the guide slide plate 13 a sliding tendency. Especially during the phase change of the solid phase, due to the presence of a small amount of liquid phase, it is more likely to slide. When the electronic device 3 is working, it heats the heat storage chamber 12, and the phase change energy storage body 2 undergoes a phase change in the upper sub-chamber 121, such as changing from a solid state to a liquid state, absorbing a large amount of heat; the liquid phase flows into the lower sub-chamber 122 through the communication channel 141, realizing the transfer of the liquid phase to the lower sub-chamber 122. Since the density difference between the solid state and the liquid state of the phase change material, especially paraffin, is relatively small, through the transfer of the liquid phase, the buoyancy effect on the solid phase on the guide slide plate 13 is reduced, making the solid phase have a more significant sliding tendency, getting closer to the mounting part 11a, capable of rapid response, realizing transient heat dissipation buffering, and continuously sliding along the guide slide plate 13, always contacting the side wall of the adjacent heat storage chamber 12, forming a phase change working area where the solid phase contacts the side wall. This working area continuously dissipates heat through latent heat changes; avoiding the phenomenon in the conventional situation where the position of the phase change material is different, the phase change interface changes continuously in the phase change material during the phase change process, the solid phase close to the heat source undergoes phase change first, the heat transfer path gradually increases, the heat transfer effect is not good, and the path is gradually farther during the whole heat transfer process, resulting in a lower heat transfer efficiency, etc.

[0041] During the heating stage, the electronic device transfers heat through the mounting part 11a, and the heat is transferred to the entire heat storage chamber 12 and the upper sub-chamber 121. The phase change energy storage body 2 absorbs heat and undergoes a phase change, such as changing from a solid state to a liquid state. The phase change energy storage body 2 slides, gets close to the side wall at the distal end of the guide slide plate 13, and contacts the side wall there. The liquid phase after the phase change flows away, and the solid phase always tends to fit the wall surface of the heat storage chamber 12 there. The phase change interface is continuously maintained there, having a shorter heat transfer path and a higher heat transfer rate, capable of rapid heat dissipation and temperature reduction. The temperature difference between the electronic device 3 and the mounting part 11a in contact is small, capable of responding to the temperature rise, and avoiding damage to the electronic device 3 caused by a sharp temperature increase.

[0042] To better adapt to the installation of the electronic device 3 and simulate its installation environment, in some embodiments, there is an open cavity between the upper and lower side walls of the base 1. The two side walls of the open cavity are provided with mounting parts 11a, and two isolated heat storage chambers 12 are provided on both the upper and lower side walls of the base 1. Both sides of the guide slide plate 13 are provided with guide sliding surfaces 131, and the two guide sliding surfaces 131 converge and extend towards the distal end. Further, the mounting part 11a includes a strip-shaped groove provided on the side wall of the open cavity. Through the strip-shaped groove, the rapid assembly of the locking strip can be adapted, and it can be adapted to the basic form of the current electronic device 3, facilitating rapid testing. The cross-section of the guide slide plate 13 can be triangular or a gradually tapered cone, providing a tendency for the solid-phase phase change material to slide; the two ends in the length direction of the guide slide plate 13 can be connected to the side wall of the heat storage chamber 12 by means of abutting or clamping, etc.

[0043] With this structure, the open cavity is used to accommodate the electronic device 3 to be tested. The two sides of the electronic device 3 are connected to the installation part 11a through connecting parts such as locking strips. The heat of the electronic device 3 is transferred to the installation part 11a through both sides, and then transferred to the heat storage bin 12. Since the heat has two transfer routes, a corresponding heat storage bin 12 is arranged on each side wall, so that it can absorb the heat transferred in two directions on any side wall in the up and down direction. Guide sliding slopes 131 are arranged on both sides of the guide sliding plate 13, and the two guide sliding slopes 131 converge and extend towards the distal end. After the whole device is turned over, the upper and lower sub-cavities can be switched in the height direction. In the previous use process, the liquid phase was in the lower sub-cavity 122. After heat dissipation was achieved through methods such as standing at room temperature, water cooling, or air cooling, water cooling can be carried out by water spraying or immersion to form a solid phase change material. After the up and down orientation is changed, it is used as the upper sub-cavity 121 for the next round of testing. The solid phase change material is located on the guide sliding slope 131 of the guide sliding plate 13 and has a sliding tendency.

[0044] In some embodiments, a gap is reserved between the distal end of the guide sliding plate 13 and the side wall of the adjacent heat storage bin 12, and a communication channel 141 is formed through the gap. This channel can realize the transfer of the liquid phase change material. After the transfer, the liquid phase can also absorb heat according to the sensible heat change of the phase change material. The solid phase change material always abuts against the side wall for phase change and absorbs heat through the latent heat change. Alternatively, the distal end of the guide sliding plate 13 abuts against the side wall of the corresponding heat storage bin 12. Grooves or mesh holes arranged along the length direction of the guide sliding plate 13 are provided at the edge of the distal end of the guide sliding plate 13. The grooves or mesh holes form a communication channel 141, and this gap forms a communication channel 141. The solid phase change material in the distal end of the guide sliding plate 13 and the side wall of the adjacent heat storage bin 12 always abuts against the area. The communication channel 141 and its nearby areas, such as the side wall of the heat storage bin 12, continuously undergo phase change, and the liquid phase after the phase change enters the lower sub-cavity 122 from this communication channel 141.

[0045] In some embodiments, specifically, concave cavities are provided on the upper and lower side walls of the base 1. The concave cavities are separated into left and right heat storage bins 12 by an intermediate partition. The mouth end of the concave cavity is detachably connected to a cover plate 16. The detachable connection structure includes methods such as bolt connection and snap connection. A sealing ring 161 is provided between the cover plate 16 and the edge of the concave cavity for sealing. By detachably connecting the cover plate 16, it is convenient for the processing and assembly of the heat storage bin 12 and the installation of the guide sliding plate 13, and it is convenient for the initial assembly of the phase change material. Heat dissipation fins are provided on the outer side wall of the base 1 in the transverse direction. The provision of heat dissipation fins can dissipate heat and save phase change energy. In the case where the electronic device 3 is in a low-power state, such as the standby state, heat dissipation through the fins can meet the requirements, which can slow down the phase change state of the phase change material, and thus can significantly extend the service life of the device.

[0046] In some embodiments, a plurality of rib plates 132 are arrayed on both side walls of the guide slide plate 13 in the up-and-down direction along the length direction of the guide slide plate 13. The guide slide plate 13 and the rib plates 132 are made of a heat-conducting metal material. Preferably, it can be aluminum, aluminum alloy, copper, copper alloy, etc., which have a lower cost and a higher heat-conductivity coefficient, are easy to process, and can transfer part of the heat in the heat storage chamber 12. The rib plates 132 extend in the width direction, and the distal ends of the rib plates 132 in the up-and-down direction abut against the corresponding inner wall of the heat storage chamber. With this structure, the rib plates 132 can make the arrangement of the phase change material more uniform in its length direction, so that the regions separated in the length direction can all undergo phase change, and the liquid phase can flow into the lower sub-chamber in the corresponding region; at the same time, the rib plates 132 can play a role in supporting and positioning the guide slide plate 13. The rib plates 132 and the guide slide plate 13 can be integrally placed into the heat storage chamber 12, and the installation of the guide slide plate 13 can be realized without setting a complex installation structure in the heat storage chamber 12.

[0047] In some embodiments, a temperature sensor is buried in the heat storage chamber 12, and the temperature sensor is electrically connected to an external display device. The temperature sensor and the external display device can be electrically connected to a mobile battery. Preferably, the temperature sensor can be an integrated digital display temperature sensor, which is convenient and flexible in practice, reduces the workload such as wiring, and is convenient for transfer.

[0048] The whole device can be turned over up and down manually or by a hoisting device to realize the inverted cyclic use of the lower sub-chamber 122 and the upper sub-chamber 121. Of course, in some embodiments, to reduce the operation burden, the base 1 is rotatably connected to the bracket through a rotating shaft to form a turning mechanism; the axis of the rotating shaft is horizontally arranged, so that the base 1 can perform up-and-down turning motion around the rotating shaft. Through the turning mechanism, convenient turning can be realized. For example, when operating on a production line, the turning mechanism is delivered along with the fixture and reaches the same position as the electronic device 3. At this place, it is tested. After the test is completed, when the lower sub-chamber 122 is in the liquid phase, it can be turned over 180°, so that it returns to the original upper sub-chamber 121. In this sub-chamber, heat is released to form a solid phase, and then it is turned over 180°. Or after the phase change material in the lower sub-chamber 122 releases heat and forms a solid phase, after use, the whole device is turned over 180° and directly used.

[0049] The present invention also provides an embodiment of a method for testing an electronic device based on phase change energy storage, including the following steps:

[0050] Install the electronic device 3 on the above-mentioned test fixture, and ensure that the locking strip of the electronic device 3 is in close contact with the fixture;

[0051] After the installation of the electronic device 3 is completed, apply preset test conditions to the electronic device 3, start a preset test program, perform tests on the electronic device 3, and continuously dissipate heat from the electronic device 3 through the phase change of the phase change energy storage body 2 of the fixture during the test, and record the test data;

[0052] After the test is completed, remove the electronic device 3 from the fixture;

[0053] After the electronic device 3 is removed, actively cool the fixture until the phase change material of the fixture turns into a solid phase;

[0054] After the cooling is completed, flip the fixture, and the fixture enters the state to be tested, ready to receive the next electronic device 3 for testing.

[0055] The structure of the present invention is simple, easy to assemble and maintain, and is suitable for the test requirements of various avionics devices 3. By using the phase change energy storage body 2, the present invention can achieve effective thermal management of the electronic device. The phase change energy storage body 2 can absorb heat at high temperatures and release heat at low temperatures, thereby maintaining the temperature stability of the test environment. This design not only improves the test efficiency, but also reduces energy consumption and potential safety hazards. During the use of the present invention, there is no need for the docking installation and startup of facilities such as air cooling, liquid cooling systems, power supplies, and cables, and no additional power devices and control systems are required. The installation preparation work during the test is simplified, and the work efficiency is improved. At the same time, due to the reduction in the number of various pipelines and cables, the aesthetics of the working environment is improved, and potential safety hazards are reduced. Since the present invention does not require the participation of a heat dissipation fan, etc. during the process, the phase change energy storage process does not require external energy input and relies on the phase change characteristics of the material itself to absorb and release heat, so no additional energy consumption is generated. Moreover, the phase change process is relatively quiet and does not produce obvious noise, which is suitable for noise-sensitive application scenarios, can provide a quiet working environment, reduce the hearing damage phenomenon of personnel performing long-term tests, and is also suitable for test scenarios for noise testing of electronic devices 3. The phase change material has a relatively small temperature change during the phase change process and can provide a relatively stable temperature environment. When the device temperature rises, the phase change material absorbs heat and undergoes a phase change, but the temperature does not rise rapidly like traditional liquid cooling. This characteristic makes phase change energy storage have advantages in maintaining the temperature stability of electronic devices.

[0056] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. An electronic equipment test fixture based on phase change energy storage, characterized in that: include: A base (1) provided with a mounting portion (11a) for mounting an electronic device; A heat storage bin (12) is arranged inside the base (1); a guide slide plate (13) disposed transversely in the heat storage bin (12) and dividing the inner cavity of the heat storage bin (12) into an upper sub-cavity (121) and a lower sub-cavity (122); a guide slide slope (131) is provided on at least one side of the guide slide plate (13) and extends at an inclination angle toward the inner wall of the heat storage bin (12) adjacent to the mounting portion (11a); and a communication channel for connecting the upper sub-cavity (121) and the lower sub-cavity (122) is provided between the end of the guide slide slope (131) and the inner wall of the heat storage bin (12); A phase-change energy storage body (2) is packaged in the upper sub-cavity (121) in a solid prefabricated form; There is an open cavity between the upper and lower side walls of the base (1), and mounting portions (11a) are provided on both side walls of the open cavity. Two isolated heat storage bins (12) are provided on the upper and lower side walls of the base (1); The base (1) is rotatably connected to the bracket via a rotating shaft to form a flipping mechanism, and the axis of the rotating shaft is arranged horizontally, so that the base (1) can perform an upside-down flipping movement around the rotating shaft.

2. The electronic device test fixture based on phase change energy storage according to claim 1, characterized in that: Sliding guide slopes (131) are provided on both sides of the guide slide plate (13), and the two guiding guide slopes (131) converge and extend toward the far end.

3. The electronic device test fixture based on phase change energy storage according to claim 2, characterized in that: The upper and lower side walls of the base (1) are provided with a concave cavity, the concave cavity being divided into two left and right heat storage bins (12) by a middle partition, the mouth end of the concave cavity being detachably connected to a cover plate (16), and the cover plate (16) and the concave cavity mouth edge are sealed by a sealing ring (161).

4. The electronic device test fixture based on phase change energy storage according to claim 2, characterized in that: The mounting portion (11a) comprises a strip-shaped groove arranged on the side wall of the opening cavity; the cross section of the guide slide plate (13) is triangular or tapered; and the two ends of the guide slide plate (13) in the length direction are connected to the side wall of the heat storage bin (12).

5. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: A plurality of ribs (132) are arranged on both side walls of the guide slide plate (13) in the length direction of the guide slide plate (13), the ribs (132) extending in the width direction, and the distal ends of the ribs (132) in the vertical direction abut against the corresponding inner walls of the heat storage chamber.

6. The electronic device test fixture based on phase change energy storage according to claim 5, characterized in that: The guide slide plate (13) and the rib plate (132) are made of heat-conducting metal material.

7. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: The outer side wall of the base (1) in the transverse direction is provided with heat dissipation fins.

8. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: The distal end of the guide slide plate (13) abuts against the side wall of the corresponding heat storage bin (12), and the edge of the distal end of the guide slide plate (13) is provided with grooves or mesh holes arranged along the length direction of the guide slide plate (13), and the grooves or mesh holes form a communication channel; Alternatively, a gap is left between the distal end of the guide slide plate (13) and the adjacent side wall of the heat storage bin (12), and the gap forms a communication channel.

9. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: A temperature sensor is embedded in the heat storage bin (12), and the temperature sensor is electrically connected to an external display device.

10. An electronic device testing method based on phase change energy storage, characterized in that: The following steps are involved: Installing the electronic device (3) onto the test fixture of any one of claims 1 to 9, and ensuring that the locking strip of the electronic device (3) is in close contact with the fixture; After the electronic device (3) is installed, a preset test condition is applied to the electronic device (3), a preset test program is started, the electronic device (3) is tested, and during the test, the electronic device (3) is continuously cooled by the phase change of the phase change energy storage body (2) of the fixture, and the test data is recorded; After the test is completed, the electronic device (3) is removed from the fixture; After the electronic device (3) is taken out, actively cooling the fixture until the phase change material of the fixture is transformed into a solid phase; After cooling is completed, the fixture is turned over and enters a state ready for testing, ready to receive the next electronic device (3) for testing.

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