Substrate processing apparatus and substrate processing method

Abstract

The present invention discloses a substrate processing apparatus and a substrate processing method, and specifically, the apparatus for processing a substrate comprises: a cup-shaped member provided with a processing space; a support unit provided in the processing space and configured to support the substrate; a liquid supply unit including a nozzle for discharging a liquid to the substrate; a position adjuster coupled to the nozzle and configured to adjust a position of the nozzle; and an adjustment unit coupled to the support unit and configured to detect pressure data when the liquid discharged from the nozzle encounters the adjustment unit and to detect position information at which the pressure data is generated.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0158065 filed in the Korean Intellectual Property Office on November 15, 2023, the entire contents of which are incorporated into this application by reference. Technical Field

[0003] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate. Background Art

[0004] In order to manufacture semiconductor devices or flat panel display panels, various processes such as deposition, photography, etching and cleaning are performed. Among these processes, the photography process includes a coating process of applying a photosensitive liquid such as photoresist to the surface of a substrate to form a film, an exposure process of transferring a circuit pattern to the film formed on the substrate, and a development process of selectively removing the film formed on the substrate from the exposed area or the opposite area of ​​the exposed area. Further, a heat treatment process is performed before and after the coating process, the exposure process and the development process.

[0005] The etching process generally utilizes a dry etching process and a wet etching process, and there is a substrate processing apparatus that etches the edge of the substrate by using wet etching. The substrate processing apparatus is generally called a bevel etcher or a bevel etching device.

[0006] These bevel etching tools usually use plasma for dry etching, but there are also wet bevel etching tools that use wet etching.

[0007] The wet bevel etching apparatus positions a nozzle at an edge of a substrate and then discharges a processing solution onto the edge of a rotating substrate to etch the edge of the substrate.

[0008] In this case, the wet bevel etching equipment requires that the discharge position of the processing solution be precisely located at the target point to accurately etch the edge of the substrate. In order to accurately determine the discharge position, the discharge position is adjusted by visually checking the actual discharge point or by discharging the liquid on a test plate having a deposited film that reacts with the liquid.

[0009] However, this method of determining the emission position by visual inspection or using a test plate has a problem that it is difficult to accurately determine the emission point and it varies depending on the measurement method and the skills of the measurement personnel. Summary of the invention

[0010] The present invention is directed to providing a substrate processing apparatus and a substrate processing method capable of quantitatively determining a discharge position of a nozzle and adjusting the position of the nozzle without visually determining the discharge position of the nozzle or using a test plate.

[0011] Problems to be solved by the present invention are not limited to the above-mentioned problems, and unmentioned problems will be clearly understood by those skilled in the art from the following description.

[0012] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a cup-shaped member provided with a processing space; a supporting unit provided in the processing space and used to support the substrate; a liquid supply unit comprising a nozzle for discharging liquid to the substrate; a position regulator coupled to the nozzle and used to adjust the position of the nozzle; and an adjusting unit coupled to the supporting unit and used to detect pressure data when liquid discharged from the nozzle meets the adjusting unit and detect position information at which the pressure data is generated.

[0013] According to an exemplary embodiment, the adjustment unit may include: a base part, which is placed on the supporting unit instead of the substrate; a sensing part, which is coupled to the top surface of the base and includes a plurality of pressure detection elements, which generate pressure data when receiving pressure; and a mapping part, which interacts with the sensing part and maps position information to pressure data detected by each of the pressure detection elements constituting the sensing part.

[0014] According to an exemplary embodiment, the base may be formed in a disk shape like a substrate.

[0015] According to an exemplary embodiment, the sensing part may be formed in a ring shape when viewed from above.

[0016] According to an exemplary embodiment, an outer diameter of the sensing part may be formed to have an outer diameter smaller than that of the base part, and the outer diameter of the sensing part is spaced apart from the outer diameter of the base part by a predetermined distance.

[0017] According to an exemplary embodiment, the mapping part may calculate a data center value of the mapped pressure data.

[0018] According to the exemplary embodiment, the mapping section may filter the pressure data so that only pressure data above a predetermined value is mapped among the pressure data.

[0019] According to this exemplary embodiment, the position information of each of the filtered mapping data may be arithmetically averaged and calculated as a data center value.

[0020] According to an exemplary embodiment, the adjustment unit may further include a display unit that interacts with the mapping unit to receive pressure data and position information matching the pressure data, generate mapping data based on the pressure data and position information input from the mapping unit, and display the input pressure data and position information as mapping data.

[0021] According to an exemplary embodiment, the adjusting unit may further include a position control part which interacts with the position adjuster and sends a position adjustment signal to the position adjuster to adjust the position of the nozzle.

[0022] According to an exemplary embodiment, the nozzle may include a plurality of nozzles, at least one of the plurality of nozzles is a nozzle for spraying a processing solution to process a substrate, and at least another one of the plurality of nozzles may be a nozzle for spraying a cleaning liquid to clean the substrate, and the adjustment unit may detect pressure data and position information for the plurality of nozzles.

[0023] According to an exemplary embodiment, the device may further include a scattering preventing guide disposed in an upper space of the support unit and formed with a nozzle insertion groove into which the nozzle is inserted, and the nozzle insertion groove is formed by a side surface toward the center.

[0024] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method including: an adjustment unit insertion operation of placing the adjustment unit on a support unit located in a processing space of a housing; an adjustment unit adjustment operation of moving the adjustment unit placed on the support unit by a centering unit so that the center of the adjustment unit is aligned with the center of the support unit; a liquid spraying operation of discharging liquid from a nozzle to the adjustment unit; a spraying position detection operation of detecting pressure data generated when the liquid discharged from the nozzle contacts the adjustment unit and detecting position information at which the liquid contacts the adjustment unit by the adjustment unit; a spraying position adjustment operation of outputting the pressure data and the position information detected by the adjustment unit as mapping data and adjusting the position of the nozzle by a travel distance from the output mapping data to a target discharge position; an adjustment unit discharge operation of releasing the adjustment unit to the outside of the processing space of the housing; and a substrate processing operation of loading a substrate into the support unit and processing the substrate by spraying a processing solution from the nozzle while the loaded substrate is rotated.

[0025] According to an exemplary embodiment, the spraying position detecting operation may include, when detecting the pressure data, detecting the pressure data within a region having a ring shape as viewed from above.

[0026] According to an exemplary embodiment, the spraying location detection operation may include displaying the mapping data.

[0027] According to an exemplary embodiment, the spraying position detection operation may include calculating a data center value of the mapping data.

[0028] According to example embodiments, a substrate processing operation may include adjusting a position of a nozzle by a difference between a data center value of mapping data and a target discharge position in a tilted region of the substrate.

[0029] According to an exemplary embodiment, the spraying position detection operation may include calculating a data center value in a state of filtering pressure data for a pressure below a predetermined value of the mapping data.

[0030] According to an exemplary embodiment, a substrate processing operation may include discharging a treatment solution and bevel etching an edge of a substrate.

[0031] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a cup-shaped member provided with a processing space; a supporting unit provided in the processing space and used to support the substrate; a liquid supply unit comprising a nozzle for discharging liquid onto the substrate; a position regulator coupled to the nozzle and used to adjust the position of the nozzle; and an adjusting unit located on the supporting unit and used to detect pressure data generated when the liquid discharged from the nozzle contacts the adjusting unit and detect position information at the location where the pressure data is generated, wherein the adjusting unit comprises: a base portion, which is placed on the supporting unit instead of the substrate and is formed in a disc shape; a sensing portion, which is coupled to an upper surface of the base The surface includes a plurality of pressure sensing elements which generate pressure data when receiving pressure, and the sensing portion is formed in an annular shape and has an outer diameter which is smaller than the outer diameter of the base; a mapping portion which interacts with the sensing portion and maps position information to pressure data detected by each of the pressure sensing elements constituting the sensing portion; a display portion which interacts with the mapping portion to receive pressure data and position information matching the pressure data, generates mapping data based on the pressure data and position information input from the mapping portion, and displays the input pressure data and position information as mapping data; and a position control portion which interacts with the position regulator and sends a position adjustment signal to the position regulator to adjust the position of the nozzle.

[0032] The present invention has the effect of quantitatively determining the discharge position of a nozzle and adjusting the position of the nozzle without visually determining the discharge position of the nozzle or using a test plate.

[0033] The effects of the inventive concept are not limited to the above-mentioned effects, and those skilled in the art will clearly understand unmentioned effects from the specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Various features and advantages of the non-limiting example embodiments of the present specification may become apparent upon reviewing the detailed description in conjunction with the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not to be considered drawn to scale. Various dimensions in the drawings may be exaggerated for clarity and understanding.

[0035] Figure 1 is a perspective view showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 for Figure 1 A perspective view of a substrate processing apparatus with the nozzle and the clamp removed as shown in FIG.

[0037] Figure 3 for Figure 2 A top view of the centering unit is shown in FIG.

[0038] Figure 4 for Figure 1 A three-dimensional view of a substrate processing device with a nozzle and a clamp removed is shown in FIG.

[0039] Figure 5 for Figure 4 An enlarged view of the sensing portion shown in FIG.

[0040] Figure 6 For record Figure 4 A graphical representation of the mapping data on the mapping portion is shown in FIG.

[0041] Figure 7 is a flow chart of a substrate processing method according to an exemplary embodiment of the present invention.

[0042] Figure 8 for Figure 1 Schematic cross-sectional view of the lifting and lowering state of the cover-shaped member and the outer cup-shaped member shown in FIG.

[0043] Fig. 9 is a cross-sectional view of a substrate in a liquid processing state.

[0044] Fig.10 for Fig. 9 An enlarged partial cross-sectional view of the first nozzle and its surroundings shown in FIG. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, equipment, and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures, and known technologies are not described in detail.

[0046] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" may be intended to also include plural forms. The terms "comprises", "comprising", "including" and "having" are inclusive and therefore specifically refer to the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0047] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, engaged to, connected to, or coupled to the other element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on another element or layer," "directly engaged to another element or layer," "directly connected to another element or layer," or "directly coupled to another element or layer," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0048] Although the terms first, second, third, etc. can be used to describe different elements, components, regions, layers and / or sections in this article, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0049] For ease of description, spatially relative terms such as "inside", "outside", "below", "beneath", "below", "above", "above" and the like may be used herein to describe the relationship of one element or feature to another element or elements or another feature or features, as shown in the figures. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" is able to cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0050] When the terms "same" or "identical" are used in the description of example embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0051] When the term "about" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in connection with geometric shapes, it should be understood that the precision of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0053] In such exemplary embodiments, a wafer is described as an example of an object to be processed. However, in addition to a wafer, the technical spirit of the present invention can also be applied to an apparatus for processing other types of substrates.

[0054] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view showing a substrate processing apparatus according to an exemplary embodiment of the present invention. Figure 2 for Figure 1 A top plan view of the splash guide and nozzle shown in FIG. Figure 3 for Figure 2 A top view of the centering unit is shown in FIG. Figure 4 for Figure 1 A three-dimensional view of a substrate processing device with a nozzle and a clamp removed is shown in FIG. Figure 5 for Figure 4 An enlarged view of the sensing portion shown in FIG. Figure 6 For record Figure 4 A graphical representation of the mapping data on the mapping portion is shown in FIG.

[0056] like Figures 1 to 6 As shown, a substrate processing apparatus according to an exemplary embodiment of the present invention may include a housing 10, a supporting unit 20, an external cup 30, a liquid supply unit 40, positioning adjusters 51 and 52, a lifting and lowering unit 60, a centering unit 70, an adjusting unit 80, and a process controller 90.

[0057] The housing 10 is arranged in a rectangular cylindrical shape with an inner space. An opening 10 is formed in one side of the housing 11. The opening 11 is used as a passage through which the substrate W enters and leaves. A door (not shown) is installed in the opening 11, which opens and closes the opening. The inner space of the housing 10 is provided with an outer cup 30. The outer cup 30 has a processing space 10a with an open top. On the top wall of the housing 10, a fan filter unit 12 is arranged to supply downward airflow to the inner space. The fan filter unit 12 includes a fan that introduces air from the outside into the inner space and a filter that filters the outer air.

[0058] The support unit 20 supports the substrate W in the processing space 10a of the external cup 30. The support unit 20 includes a support plate 21, a rotation shaft 22, and a driver 23. The support plate 21 is provided with a circular top surface. The support plate 422 has a smaller diameter than the substrate W. The support plate 21 is provided to support the substrate W under vacuum pressure. The rotation shaft 22 is coupled to the center of the bottom surface of the support plate 21, and the rotation shaft 22 is provided with a driver 1460 that provides a rotational force to the rotation shaft 22. The driver 23 may be a motor. Further, a lifting driver (not shown) may be provided to adjust the relative height of the support plate 21 and the external cup 30.

[0059] The outer cup 30 has a bottom wall 30a, a side wall 30b and a top wall 30c. The interior of the outer cup 30 is provided as the above-mentioned inner space. The inner space includes a processing space 10a at the top and an exhaust space at the bottom.

[0060] The bottom wall 30a is provided in a circular shape and has an opening in the center. The side wall 30b extends upward from the outer end of the bottom wall 30a. The side wall 30b is provided in an annular shape and is provided perpendicular to the bottom wall 30a. In one example, the side wall 30b extends to the same height as the top surface of the support plate 21, or extends to a height slightly lower than the top surface of the support plate 21. The top wall 30c has an annular shape and has an opening in the center. The top wall 30c is provided to be inclined upward from the top end of the side wall 30b toward the central axis of the outer cup-shaped member 30.

[0061] The guide cup 34 is located at the inner side of the outer cup 30. The guide cup 34 has an inner wall 34a, an outer wall 34b and a top wall 34c. The inner wall 34a has a through hole that runs through in the vertical direction. The inner wall 34a is arranged to surround the driver 23. The inner wall 34a minimizes the exposure of the driver 23 to the airflow in the processing space. The rotating shaft 22 or / and the driver 23 of the support unit 20 extend in the upward and downward directions through the through hole. The outer wall 34b is spaced apart from the inner wall 34a and is arranged to be encapsulated around the inner wall 34a. The outer wall 34b is spaced apart from the side wall 30b of the outer cup 30. The inner wall 34b is spaced apart upward from the bottom wall 30a of the outer cup 30. The top wall 34c connects the top end of the outer wall 34b to the top end of the inner wall 34a. The top wall 34c has an annular shape and is arranged to be encapsulated around the support plate 21. In one example, the upper wall 34c has an upwardly convex shape.

[0062] The space below the support plate 21 in the processing space 10a can be set as a discharge space. In one example, the discharge space can be defined by the guide cup 34. The space enclosed by the outer wall 34b, the top wall 34c and the inner wall 34a of the guide cup 34 and / or the space below the above space can be set as the discharge space.

[0063] The outer cup 30 may be provided with a gas-liquid separation plate 35. The gas-liquid separation plate 35 may be provided to extend upward from the bottom wall 30a of the outer cup 30. The gas-liquid separation plate 35 may be provided in an annular shape. When viewed from above, the gas-liquid separation plate 35 may be positioned between the side wall 30b of the outer cup 30 and the outer wall 34b of the guide cup 34. The top end of the gas-liquid separation plate 35 may be positioned at a lower level than the bottom end of the outer wall 34b of the guide cup 34.

[0064] The bottom wall 30a of the outer cup 30 is connected to a discharge outlet pipe 38 for discharging the treatment solution, a discharge pipe 39, and a driver 39a. The discharge outlet pipe 38 may be connected to the outer cup 30 from the outside of the gas-liquid separation plate 35. The discharge pipe 39 may be connected to the outer cup 30 from the inside of the gas-liquid separation plate 35. The driver 39a may lift and lower the outer cup 30.

[0065] The liquid supply unit 40 supplies the processing solution onto the substrate W.

[0066] The liquid supply unit 40 may include a first nozzle 41 and a second nozzle 42 .

[0067] The first nozzle 41 may be a treatment solution supply nozzle that receives the treatment solution from the treatment solution supply source 41a and discharges the treatment solution. The first nozzle 41 may be located in a space above the sensing portion 82 and may distribute the treatment solution to the sensing portion 82. In one example, the treatment solution may include hydrofluoric acid.

[0068] The second nozzle 42 may be a cleaning solution supply nozzle that receives cleaning solution from a cleaning solution supply source 42a and discharges the cleaning solution. The second nozzle 42 may be located in a space above the sensing portion 82 and may discharge the cleaning solution to the sensing portion 82. In one example, the cleaning solution may be pure water.

[0069] Meanwhile, the first nozzle 41 and the second nozzle 42 may be formed such that the spraying direction of the outlet port is directed downward toward the upper surface of the base 81 but is inclined at a predetermined angle in a direction perpendicular to the upper surface of the substrate W. As a result, when the liquid comes into contact with the base 81, the liquid discharged from the first nozzle 41 and the second nozzle 42 is less likely to splash.

[0070] The position regulators 51 and 52 may include a first position regulator 51 and a second position regulator 52 .

[0071] The first position regulator 51 may be formed by a driver that is driven in-line or in-plane. Here, the driver may be formed by a linear motor or actuator for positioning. The first position regulator 51 may be coupled to a portion of the body of the first nozzle 41 to adjust the position of the first nozzle 41. Further, the first position regulator 51 may automatically or manually adjust the position of the first nozzle 41. When the first position regulator 51 automatically adjusts the position of the first nozzle 41, the drive is controlled by the position control unit 85 to adjust the position of the first nozzle 41.

[0072] The second position regulator 52 may be formed by a driver that is driven in-line or in-plane. The second position regulator 52 may be coupled to a portion of the body of the second nozzle 42 to adjust the position of the second nozzle 42. Further, the second position regulator 52 may automatically or manually adjust the position of the second nozzle 41. When the second position regulator 52 automatically adjusts the position of the second nozzle 42, the drive is controlled by the position control unit 85 to adjust the position of the second nozzle 42.

[0073] The lifting and lowering unit 60 may include a lifting and lowering cover 61 , a lifting and lowering driver 62 , and a splash prevention guide 63 .

[0074] The lifting and lowering cover 61 is disposed in the upper space of the support unit 20 and the outer cup 30. The lifting and lowering cover 61 may provide an area for coupling the first position adjuster 51 and the second position adjuster 52. The lifting and lowering cover 61 may form a hollow area 61a near the center to reduce weight.

[0075] The lifting and lowering driver 62 is coupled to the lifting and lowering cover 61. The lifting and lowering driver 62 lifts the lifting and lowering cover 61 to the first position during upward driving, and lowers the lifting and lowering cover 61 to the second position during downward driving.

[0076] The splash-proof guide 63 is coupled to the lifting and lowering cover-like member 61. When viewed from above, the splash-proof guide 63 can be formed in an annular shape. The splash-proof guide 63 can also be formed with a nozzle insertion groove 43a, into which the first nozzle 41 and the second nozzle 42 are inserted. The nozzle insertion groove 43a can be formed to extend from the top to the bottom. In addition, the nozzle insertion groove 43a can be formed in a shape that is recessed from the side of the splash-proof guide 63 toward the central axis. Therefore, the nozzle insertion groove 43a prevents the liquid scattered back from the base 81 when the first nozzle 41 and the second nozzle 42 discharge liquid from splashing toward the center side of the base 81, thereby preventing detection errors due to the splashing of the liquid.

[0077] The centering unit 70 is disposed in the processing space 10a of the housing 10. The centering unit 70 may include a contact plate 71 and a pressurizing plate 72. The contact plate 71 has an arcuate surface that is in close contact with one side of the base 81 and may be formed into a plurality of arcuate surfaces. The pressurizing plate 72 is disposed opposite to the contact plate 71 relative to the center of the base 81 and pressurizes the base 81 so that the base 81 is in close contact with the arcuate surface of the contact plate 71. The pressurizing plate 72 may also include a pressure sensor or a position sensor in an area in close contact with the base 81 to pressurize the base 81 to a predetermined pressure or a predetermined position. When the adjustment unit 80 is placed on the support unit 20, the centering unit 70 performs an operation of aligning the center of the adjustment unit 80 with the center of the support unit 20 by moving the contact plate 71 and the pressurizing plate 72 disposed in the processing space 10a or the outer side of the housing 10 to the side of the base 81 and pressurizing the base 81 to the arcuate surface of the contact plate 71 by the pressurizing plate 72. The driving of the centering unit 70 may be controlled by the process controller 90 .

[0078] The adjustment unit 80 may include a base portion 81 , a sensing portion 82 , a mapping portion 83 , a display portion 84 , and a position control portion 85 .

[0079] The base 81 may be formed in a shape schematically similar to the substrate W. In one example, the base 81 may be formed in a disk shape when viewed from above. The base 81 may be placed on the support unit 20. Further, the position of the base 81 may be adjusted by a placement plate of the centering unit 70.

[0080] The sensing portion 82 is coupled to the upper surface of the housing 81. When viewed from above, the sensing portion 82 may be formed as an annular membrane. The outer diameter of the sensing portion 82 is formed to be smaller than the outer diameter of the base 81, and the separation distance from the outer diameter to the outer diameter of the base 81 is formed to be constant. Therefore, the sensing portion 82 accurately senses the discharge position of the liquid to achieve simple mapping, and the sensing portion is configured as a small area to reduce manufacturing costs. The sensing portion 82 may be composed of a pressure detection element 82a for detecting pressure, which is integrated into the form of a unit. Each of the pressure detection elements 82a constituting the sensing portion 82 may be a capacitive sensor. In this case, the sensing portion 82 may map position information (X, Y) to each of the pressure detection elements 82a, and the mapped position information (X, Y) may be stored in the mapping portion 83. When each of the pressure detection elements 82a receives pressure, the sensing portion 82 may output pressure data P1 proportional to the input pressure.

[0081] Since the base portion 81 and the sensing portion 82 are inserted in place of the substrate W, there is no need to install a separate component or remove a pre-installed peripheral component to detect the position of the nozzle.

[0082] The mapping section 83 is a calculation processing unit having a signal processing function, and interacts with the sensing section 82 through wired or wireless communication. The mapping section 83 can map the position information (X, Y) for each of the pressure sensing elements 82a constituting the sensing section 82. When the mapping section 83 outputs the pressure data P1 from each of the pressure sensing elements 82a of the sensing section 82, the mapping section 83 transmits the position information (X, Y) matching the output pressure data P1 to the display section 84 and the position control section 85. In addition, the mapping section 83 can calculate the data center value CD1 of the mapping data, and transmit the calculated data center value CD1 to the display section 84 and the position control section 85.

[0083] The display unit 84 receives the pressure data P1 and the position information (X, Y) matched with the pressure data P1 together with the mapping unit 83, generates the mapping data MD1 based on the pressure data P1 and the position information (X, Y) input from the mapping unit 83, and displays the input pressure data P1 and the position information (X, Y) as the mapping data MD1. The display unit 84 may receive the pressure data P1 and the position information (X, Y) by performing wired or wireless communication with the mapping unit 83. Further, the display unit 84 may display the nozzle position value for the current discharge position of the first nozzle 41 and the second nozzle 42.

[0084] The position control part 85 is capable of adjusting the positions of the first nozzle 41 and the second nozzle 42 to the target discharge position SP1 by interacting with the first position regulator 51 and the second position regulator 52. In this case, the position control part 85 may receive the data center value CD1 of the mapping data MD1 from the mapping part 83 and transmit the position control value PC1 to the first position regulator 51 and the second position regulator 52 to move the positions of the first nozzle 41 and the second nozzle 42 from the data center value CD1 to the target discharge position SP1, thereby adjusting the positions of the first nozzle 41 and the second nozzle 42. Here, the position control value PC1 may be a value that the operator directly inputs into the position control part 85 by viewing the mapping data MD1 output to the display part 84. Alternatively, the position control value PC1 may be a value automatically input into the position control part 85 from the mapping part 83.

[0085] The process controller 90 sequentially controls the substrate processing process. Therefore, the process controller 90 can control the transfer process of loading and unloading the substrate W. Further, the process controller 90 can control the process of rotating the support unit 20. Further, the process controller 90 can control the etching process and the cleaning process by controlling the liquid supply unit to discharge the liquid.

[0086] Hereinafter, a substrate processing method will be described.

[0087] Figure 7is a flow chart of a substrate processing method according to an exemplary embodiment of the present invention. Figure 8 for Figure 1 Schematic cross-sectional view of the lifting and lowering state of the cover-shaped member and the outer cup-shaped member shown in FIG. Fig. 9 is a cross-sectional view of a substrate in a liquid processing state. Fig.10 for Fig. 9 An enlarged partial cross-sectional view of the first nozzle and its surroundings shown in FIG.

[0088] Further references Figure 7 , the substrate processing method according to the exemplary embodiment of the present invention includes a regulating unit inserting operation S10, a regulating unit adjusting operation S20, a liquid spraying operation S30, a spraying position detecting operation S40, a spraying position adjusting operation S50, a regulating unit releasing operation S60, and a substrate processing operation S70.

[0089] In the adjusting unit inserting operation S10, the adjusting unit 80 is placed on the supporting unit 20 located inside the processing space 10a of the housing 10. In this case, the adjusting unit 80 may be transferred by a transfer robot (not shown).

[0090] In the adjusting unit adjusting operation S20, the centering unit 70 as described above moves the adjusting unit 80 placed on the supporting unit 20 so that the center of the adjusting unit 80 is aligned with the center of the supporting unit 20. In this case, the adjusting unit 80 may be pressed against the contact plate 71 by the pressing plate 72, as shown in FIG. Figure 3 As shown, their centers are aligned. Therefore, the center of the adjustment unit 80 can be aligned with the process center (not shown) in the mapping data MD1. In the case of performing the adjustment unit adjustment operation S20, as shown in FIG. Figure 8 As shown, the lifting and lowering cover 61 can be lifted upward by the lifting and lowering driver 62, and the outer cup 30 can be lowered by the driver 39a.

[0091] In the liquid spraying operation S30, the liquid is discharged from each of the first nozzle 41 and the second nozzle 42 to the sensing part 82 of the adjustment unit 80. In this case, the first nozzle 41 and the second nozzle 42 may discharge pure water as the liquid.

[0092] In the spray position detection operation S40, when the liquid discharged from the first nozzle 41 and the second nozzle 42 meets the sensing part 82, the sensing part 82 detects the pressure data P1 and the position information (X, Y) of the contact position of the liquid, and the mapping part 83 transmits the pressure data P1 and the position information (X, Y) to the display part 84 and the position control part 85.

[0093] In the spray position adjustment operation S50, the display unit 84 can output the pressure data P1 and the position information (X, Y) input from the mapping unit 83 as the mapping data MD1. In this case, the operator can adjust the positions of the first nozzle 41 and the second nozzle 42 as follows: by visually checking the mapping data MD1 output on the display unit 84, and inputting the position control value PC1 to the position control unit 85 to adjust the position regulator by the travel distance to the target discharge position SP1. As described above, the pressure data P1 and the position information (X, Y) correspond to a plurality of values ​​distributed over a predetermined area, and in this case, the mapping unit 83 can calculate the data center value CD1 of the mapping data MD1 when the pressure data P1 is distributed over a predetermined area as the mapping data MD1. In this case, the position control unit 85 can adjust the positions of the first nozzle 41 and the second nozzle 42 by adjusting each of the first position regulator 51 and the second position regulator 52 using the calculated data center value CD1. Now refer to the accompanying drawings for a more detailed explanation, as shown in FIG. Figures 4 to 6 As shown, when the liquid is discharged from the first nozzle 41 to the sensing part 82, the pressure data P1 and the position information X, Y input from the mapping part 83 are recorded as the mapping data MD1 by the mapping part 83. In this case, the mapping part 83 calculates the data center value CD1 from the mapping data MD1, and transmits the position control value PC1 for the difference between the calculated center value CD1 and the target discharge position SP1 to the first position regulator 51 to adjust the position of the first nozzle 41. At this time, the method of calculating the center value CD1 by the mapping part 83 may be to filter the pressure data P1 so that only the pressure data P1 above the predetermined value is mapped, and then calculate the arithmetic mean of the position information of the filtered mapping data MD1 to calculate the average coordinate value as the center value CD1. That is, the discharge position of the nozzle can be detected by detecting the area where the strongest pressure is generated in the liquid discharge area. In the same way, the position of the second nozzle 42 can be adjusted by transmitting the position control value PC1 between the center value of the mapping data MD1 and the target discharge position SP1 to the second position regulator 52 to adjust the position of the second nozzle 42.

[0094] In the adjusting unit releasing operation S60, the adjusting unit 80 is released to the outside of the processing space 10a of the housing 10. In this case, the adjusting unit 80 may be transferred to the outside by a transfer robot (not shown) or by a manual worker. Figure 8 As shown, the lifting and lowering cover 61 can be driven by a lifting and lowering driver 62 to be lifted to the top.

[0095] The substrate processing operation S70 may include a substrate loading operation S71 , a substrate centering operation S72 , a liquid processing operation S73 , a substrate cleaning operation S74 , and a substrate releasing operation S75 .

[0096] The substrate loading operation S71 is an operation in which a transfer robot (not shown) places a substrate W on the supporting unit 20 located in the processing space 10 a.

[0097] The substrate centering operation S72 is an operation in which the centering unit 70 moves the substrate W placed on the supporting unit 20 so that the center of the substrate W is aligned with the center of the supporting unit 20. In this case, the centering operation of the substrate W can be performed in a state in which the lifting and lowering cover 61 is lifted upward by the lifting and lowering driver 62 and the outer cup 30 is lowered downward by the driver 39a.

[0098] The liquid processing operation S73 is performed after the support unit 20 has rotated the substrate W (eg, Fig. 9 In the case of (as shown in FIG. 5 ), the operation of processing the substrate W by supplying the processing solution from the first nozzle 41 to the edge of the substrate W is performed, as shown in FIG. Fig.10 In this case, the treatment solution may be a liquid for etching the substrate W, and as described above, the treatment solution may be hydrofluoric acid. In the liquid treatment operation S73, the treatment solution may be discharged to perform oblique etching on the edge of the substrate W.

[0099] The substrate cleaning operation S74 is an operation in which the second nozzle 42 supplies a cleaning solution to the edge of the substrate W while the support unit 20 rotates the substrate W. In this case, the cleaning solution may be pure water. After the substrate cleaning operation S74 is completed, the support unit 20 stops the rotation of the substrate W.

[0100] The substrate releasing operation S75 is an operation in which the transfer robot releases the cleaned substrate W to the outside of the housing 10. In this case, the substrate W released from the outside of the housing 10 may be placed in a tail (not shown) and transferred to a processing device for subsequent processing operations.

[0101] It should be understood that exemplary embodiments are disclosed herein, and other variations are possible. Individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable where applicable, and may be used in a selected exemplary embodiment even if not specifically shown or described. Modifications should not be considered as departing from the spirit and scope of the present invention, and all such modifications apparent to those of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A device for processing a substrate, the device comprising: A cup-shaped member, wherein the cup-shaped member is provided with a processing space; a supporting unit, the supporting unit being arranged in the processing space and used for supporting a substrate; a liquid supply unit including a nozzle for discharging liquid onto the substrate; a position regulator coupled to the nozzle and configured to adjust a position of the nozzle; as well as A regulating unit is coupled to the supporting unit and is used to detect pressure data when the liquid discharged from the nozzle meets the regulating unit and detect position information where the pressure data is generated.

2. The device according to claim 1, wherein: The adjustment unit comprises: a base, the base replacing the substrate and placed on the supporting unit; a sensing portion coupled to a top surface of the base and comprising a plurality of pressure sensing elements that generate the pressure data when receiving pressure; A mapping section interacts with the sensing section and maps position information to pressure data detected by each of the pressure detection elements constituting the sensing section.

3. The device according to claim 2, wherein: The base is formed in a disk shape similar to the substrate.

4. The device according to claim 2, wherein: The sensing portion is formed in a ring shape when viewed from above.

5. The device according to claim 4, wherein: The outer diameter of the sensing portion is formed to have an outer diameter smaller than the outer diameter of the base portion, and An outer diameter of the sensing portion is spaced apart from an outer diameter of the base portion by a predetermined distance.

6. The device according to claim 2, wherein: The mapping unit calculates a data center value of the mapped pressure data.

7. The device according to claim 6, wherein: The mapping unit filters the pressure data so as to map only pressure data having a value greater than or equal to a predetermined value in the pressure data.

8. The device according to claim 7, wherein: The position information of each of the filtered mapping data is arithmetically averaged and calculated as a data center value.

9. The device according to claim 2, wherein: The adjustment unit also includes a display unit, which interacts with the mapping unit to receive pressure data and position information matching the pressure data, generate mapping data based on the pressure data and the position information input from the mapping unit, and display the input pressure data and position information as the mapping data.

10. The device according to claim 2, wherein: The adjusting unit further includes a position control part which interacts with the position adjuster and sends a position adjustment signal to the position adjuster to adjust the position of the nozzle.

11. The device according to claim 1, wherein: The nozzle comprises a plurality of nozzles, At least one of the plurality of nozzles is a nozzle for spraying a treatment solution to process the substrate, and at least another one of the plurality of nozzles is a nozzle for spraying a cleaning liquid to clean the substrate, and The adjustment unit detects the pressure data and the position information for the plurality of nozzles.

12. The device according to claim 1, wherein: The device also includes: A splash prevention guide is provided in an upper space of the support unit and is formed with a nozzle insertion groove into which the nozzle is inserted, and the nozzle insertion groove is formed by a side surface toward a center.

13. A method for processing a substrate, the method comprising: an adjustment unit insertion operation, wherein the adjustment unit is placed on a support unit located in a processing space of the housing; an adjusting unit adjusting operation, wherein the adjusting unit is moved by a centering unit placed on the supporting unit so that the center of the adjusting unit is aligned with the center of the supporting unit; a liquid spraying operation of discharging liquid from a nozzle to the regulating unit; a spraying position detecting operation of detecting, by the regulating unit, pressure data generated when the liquid discharged from the nozzle contacts the regulating unit and detecting position information where the liquid contacts the regulating unit; a spraying position adjustment operation of outputting the pressure data and the position information detected by the adjustment unit as map data and adjusting the position of the nozzle by a travel distance from the output map data to a target discharge position; an adjusting unit releasing operation, wherein the adjusting unit releasing operation releases the adjusting unit to the outside of the processing space of the housing; as well as A substrate processing operation of loading a substrate into the supporting unit and processing the substrate by spraying a processing solution from the nozzle in a state where the loaded substrate is rotated.

14. The method according to claim 13, wherein: The spraying position detection operation includes, when detecting the pressure data, detecting the pressure data within a region having a ring shape as viewed from above.

15. The method according to claim 13, wherein: The spraying position detection operation includes displaying the mapping data.

16. The method according to claim 13, wherein: The spraying position detection operation includes calculating a data center value of the mapping data.

17. The method according to claim 16, wherein: The substrate processing operation includes adjusting the position of the nozzle by a difference between the data center value of the mapping data and the target discharge position in the tilted region of the substrate.

18. The method according to claim 16, wherein: The spraying position detection operation includes calculating the center center value in a state of filtering pressure data, the pressure data being for pressures below a predetermined value of the map data.

19. The method according to claim 18, wherein: The substrate processing operation includes draining the processing solution and bevel etching the edge of the substrate.

20. An apparatus for processing a substrate, the apparatus comprising: A cup-shaped member, wherein the cup-shaped member is provided with a processing space; a supporting unit, the supporting unit being arranged in the processing space and used for supporting a substrate; a liquid supply unit, the liquid supply unit comprising a nozzle for discharging liquid onto the substrate; a position regulator coupled to the nozzle and configured to adjust a position of the nozzle; as well as an adjusting unit, the adjusting unit being located on the supporting unit and being used to detect pressure data generated when the liquid discharged from the nozzle contacts the adjusting unit and to detect position information where the pressure data is generated, Wherein, the adjustment unit comprises: a base which is placed on the supporting unit instead of the substrate and is formed into a disk shape; a sensing portion coupled to an upper surface of the base portion and including a plurality of pressure sensing elements that generate pressure data when receiving pressure, and the sensing portion is formed in an annular shape and has an outer diameter smaller than an outer diameter of the base portion; a mapping section that interacts with the sensing section and maps position information to the pressure data detected by each of the pressure detection elements constituting the sensing section; a display unit that interacts with the mapping unit to receive pressure data and position information matched with the pressure data, generates mapping data based on the pressure data and the position information input from the mapping unit, and displays the input pressure data and the position information as the mapping data; and A position control unit interacts with the position regulator and sends a position adjustment signal to the position regulator to adjust the position of the nozzle.

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