Turnover mechanism applied to turnover of silicon wafer

Abstract

The invention relates to the technical field of silicon wafer processing, in particular to a turnover mechanism applied to turnover of a silicon wafer. The device comprises a device shell, a rotating unit arranged on a platform of the device shell, a jacking mechanism arranged in the device shell and in the middle of the rotating unit, and a clamping mechanism arranged above the jacking mechanism and used for clamping a silicon wafer. Compared with the prior art, the silicon wafer overturning device has the advantages that according to the technical scheme, the silicon wafers inside are ejected out and separated from the wafer basket through the jacking mechanism, then the wafer basket is rotated and overturned by 180 degrees, and then the silicon wafers are placed into the overturned wafer basket, so that overturning of the silicon wafers is achieved, compared with the prior art, all the silicon wafers are overturned at a time, efficiency is improved, and machining time is greatly saved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a turning mechanism used for turning over a silicon wafer. Background Art

[0002] At present, the silicon wafer process must use carriers such as flower baskets and graphite boats to switch between different process steps. Generally, there are two automation requirements for transferring silicon wafers from flower baskets to graphite boats and from graphite boats to flower baskets. With the industrial production of silicon wafers, the requirements for automated pick-and-place capacity are getting higher and higher.

[0003] Prior art, application number: CN2020213798129 A silicon wafer picking and placing mechanism, which adopts a clamping method for transfer, flips the silicon wafers in the wafer basket one by one, and places them in another set of wafer baskets to perform lower work, which is inefficient and time-consuming.

[0004] Therefore, it is necessary to design a flipping mechanism for turning over silicon wafers to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a flipping mechanism for turning over a silicon wafer to overcome the above-mentioned deficiencies in the prior art.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A flipping mechanism used for flipping silicon wafers, which includes a device shell and is characterized in that it also includes a rotating unit arranged on the device shell platform, a lifting mechanism placed in the device shell and in the middle of the rotating unit, and a clamping mechanism arranged above the lifting mechanism for clamping the silicon wafer, the clamping mechanism includes a driving slide rail, a driving block slidably installed on the driving slide rail through a slider, a clamping screw module threadedly connected to the driving block, a driving motor driving the clamping screw module, connecting rods rotatably arranged at both ends of the driving block through an axis, a driving rod one end of which is rotatably installed on the rear surface of the device shell through an axis and the other end is connected to the connecting rod, and a clamping block that is interconnected with the driving rod and driven to flip by the driving rod.

[0008] Preferably, the rotating unit includes a motor mounting base installed on the bottom surface of the equipment housing, a rotating motor installed on the motor mounting base, a main transmission roller driven to rotate by the rotating motor, a driven transmission roller arranged corresponding to the main transmission roller and intertwined with each other through a transmission belt, a rotating shaft connected to the driven transmission roller through a connecting shaft, and a rotating plate cooperating with the rotating installation.

[0009] Preferably, a plurality of groups of limit blocks are arranged on the rotating plate, and sensors are also arranged on the sides of the limit blocks.

[0010] Preferably, an avoidance groove for cooperating with the jacking mechanism is provided on the rotating plate.

[0011] Preferably, the lifting mechanism includes a lifting mounting block arranged in the equipment housing, a slide rail arranged on the side of the lifting mounting block, a screw module arranged on the lifting mounting block and corresponding to the slide rail, a sliding block threadedly mounted on the screw module and slidably mounted on the slide rail on the side through a slider, a driving unit that drives the screw module to rotate, and a lifting block installed on the sliding block.

[0012] Preferably, the lifting block is composed of two vertical plates, which are arranged symmetrically on the left and right, and the tops of the vertical plates are arranged at an inclined angle.

[0013] Preferably, a clamping mounting seat is further provided outside the clamping block, the other end of the clamping block is mounted on the clamping mounting seat via a rotating shaft, a clamping fixture is provided on the inner wall of the clamping block, and a clamping groove for mounting the silicon wafer is provided on the clamping fixture.

[0014] The beneficial effect of the present invention is that the present technical solution uses a lifting mechanism to push out the silicon wafers inside and separate them from the wafer basket, and then rotates the wafer basket and flips it 180 degrees, and then puts the silicon wafers into the flipped wafer basket, thereby realizing the flipping of the silicon wafers. Compared with the prior art, the present invention flips all the silicon wafers at one time, thereby improving efficiency and greatly saving processing time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a flipping mechanism used for turning over a silicon wafer according to the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of a flipping mechanism used for flipping a silicon wafer according to the present invention;

[0017] Figure 3 A schematic diagram of a clamping mechanism of a flipping mechanism used for turning over a silicon wafer according to the present invention;

[0018] Figure 4 It is a schematic diagram of a rotating unit of a flipping mechanism used for turning over a silicon wafer according to the present invention;

[0019] In the figure: 1. Equipment housing; 2. Rotating unit; 3. Lifting mechanism; 4. Clamping mechanism; 21. Motor mounting seat; 22. Rotating motor; 23. Main drive roller; 24. Conveyor belt; 25. Driven drive roller; 26. Rotating shaft; 27. Rotating plate; 28. Limit block; 29. ​​Sensor; 271. Avoidance groove; 31. Lifting mounting block; 32. Slide rail; 33. Screw module; 34. Sliding block; 36. Lifting block; 41. Driving slide rail; 42. Driving block; 43. Clamping screw module; 44. Connecting rod; 45. Driving rod; 46. Clamping block; 47. Clamping mounting seat; 48. Clamping fixture. DETAILED DESCRIPTION

[0020] Reference Figures 1 to 4 A flipping mechanism for turning over a silicon wafer, comprising a device housing 1, a rotating unit 2 arranged on a platform of the device housing, a lifting mechanism 3 arranged in the device housing and in the middle of the rotating unit, and a clamping mechanism 4 arranged above the lifting mechanism for clamping the silicon wafer;

[0021] The rotating unit 2 includes a motor mounting seat 21 mounted on the bottom surface of the device housing, a rotating motor 22 mounted on the motor mounting seat, a main transmission roller 23 driven to rotate by the rotating motor, a driven transmission roller 25 arranged corresponding to the main transmission roller and wound with each other through a transmission belt 24, a rotating shaft 26 connected to the driven transmission roller through a coupling shaft, and a rotating plate 27 mounted to cooperate with the rotating installation;

[0022] In order to facilitate the installation and positioning of the film basket, a plurality of groups of limit blocks 28 are arranged on the rotating plate, and a sensor 29 is also arranged on the side of the limit block. The sensor senses whether the corresponding film basket is installed in place, thereby ensuring the installation position of the film basket and avoiding errors in the cooperation with the lifting mechanism or the rotation.

[0023] As there are two protruding strip blocks at the bottom of the film basket, it is only necessary to limit the bottom strip blocks to limit and fix the entire film basket. Specifically, strip limit blocks are arranged on the left and right sides of the rotating plate to cooperate with the side edges of the strip blocks on both sides for limiting, and trapezoidal blocks are arranged on the front and back sides of the rotating plate, and the grooves on both sides of the trapezoidal blocks are used to cooperate with one side of the strip block for limiting, and at the same time, the end of the strip block is limited, and then the strip limit blocks on both sides cooperate with each other to limit the surrounding areas of the strip block, thereby achieving fixation, and the sensor is arranged on one side of the strip limit block and close to the film basket. When the film basket is placed in place, the sensor will be released, thereby sensing that the film basket is installed in place; the strip limit block and the trapezoidal block are both fixed to the mounting plate by nuts, and the limit module can be replaced and selected according to the film basket model.

[0024] In order to cooperate with the lifting mechanism, an avoidance groove 271 for use with the lifting mechanism is opened on the rotating plate 27; an empty groove for avoidance is also opened at the corresponding position of the equipment housing;

[0025] The lifting mechanism 3 includes a lifting installation block 31 arranged in the device housing, a slide rail 32 arranged on the side of the lifting installation block, a screw module 33 arranged on the lifting installation block and corresponding to the slide rail, a sliding block 34 threadedly mounted on the screw module and slidably mounted on the slide rail through a slider, a driving unit driving the screw module to rotate, and a lifting block 36 installed on the sliding block;

[0026] Specifically, the driving unit drives the screw module 33 to rotate, so that the sliding block 34 moves along the screw module 33, and the slide rail 32 assists in the movement, driving the lifting block 36 to move up and down, thereby achieving lifting or downward movement.

[0027] The lifting block is composed of two vertical plates, which are symmetrically arranged on both sides. In order to effectively support the silicon wafer, the top of the vertical plate is arranged at an inclined angle to limit the silicon wafer;

[0028] The clamping mechanism 4 includes a driving rail 41, a driving block 42 slidably mounted on the driving rail through a slider, a clamping screw module 43 threadedly connected to the driving block, a driving motor driving the clamping screw module, connecting rods 44 rotatably arranged at both ends of the driving block through an axis, a driving rod 45 one end of which is rotatably mounted on the rear surface of the device housing 1 through an axis and the other end is connected to the connecting rod, and a clamping block 46 connected to the driving rod and driven to flip by the driving rod;

[0029] Specifically, the driving motor drives the clamping screw module 43 to rotate, thereby driving the driving block 42 to move up and down along the driving slide rail 41. When the driving block 42 moves up, the connecting rod 44 is driven to move up, which will drive one end of the driving rod 45 to move. Since one end of the driving rod 45 is installed through an axis and is placed in the side plate, it is flipped around the axis to achieve clockwise rotation, thereby driving the matching connected clamping block to flip clockwise synchronously. Similarly, when it moves downward, it rotates counterclockwise. By synchronously driving the clamping blocks on both sides to flip, the silicon wafer is clamped. When the clamping blocks on both sides are relatively set, the gap between them is the smallest, and the clamping is maximum. The clamping force is different at different angles.

[0030] In order to facilitate the flipping of the clamping block, a clamping mounting seat 47 is provided outside the clamping block, and the other end of the clamping block is mounted on the clamping mounting seat through a rotating shaft, so as to realize the rotation of the clamping block;

[0031] In order to clamp and limit the silicon wafers one by one, a clamping fixture 48 is provided on the inner wall of the clamping block, and a clamping groove for mounting the silicon wafer is provided on the clamping fixture to prevent the silicon wafers from contacting each other.

[0032] In this embodiment, the wafer basket containing silicon wafers is moved to the housing of the device by a manipulator, and is placed on the rotating unit 2 as required, and is installed in place with the limit block. After the sensor detects that it is in place, the manipulator moves away. After the wafer basket is placed, the lifting mechanism 3 at the bottom is driven, and the screw module 33 is driven by the driving unit to rotate, so that the sliding block 34 moves upward along the screw module 33. At the same time, the slide rail 32 assists in moving, driving the lifting block 36 to move upward, and the lifting block passes through the rotating plate to lift up all the silicon wafers inside the wafer basket and leave the wafer basket. At the same time, the clamping mechanism 4 is driven synchronously, and the driving motor drives the rotation of the clamping screw module 43, thereby driving the driving block 42 to move upward along the driving slide rail 41. At the same time, the connecting rod 44 moves upward, driving one end of the driving rod 45 to move, and one end of the driving rod 45 flips around the axis, thereby realizing the clamping of the matching connection. The blocks are synchronously flipped clockwise, and the spacing between the clamping blocks on both sides is reduced after synchronous flipping, so as to clamp the silicon wafer. Each silicon wafer is placed in the clamping groove of the clamping fixture 48. After the silicon wafer is ejected and clamped, the rotating unit 2 is driven to drive the main drive roller 23 through the rotating motor 22, and the driven drive roller 25 is driven to rotate through the transmission belt 24, thereby driving the entire rotating plate 27 to rotate. Since the sheet basket is placed on the rotating plate 27, the sheet basket rotates synchronously and rotates 180° to turn the entire sheet basket over. The clamping mechanism is driven, and the clamping block rotates counterclockwise to reset, releases the silicon wafer, and places the silicon wafer on the lifting block. The lifting block moves down and resets, and the silicon wafer is placed back in the sheet basket. Since the sheet basket is turned over, the silicon wafer is normally placed in the turned-over sheet basket, and then re-grabbed by the robot, the sheet basket is taken away and placed normally according to the front side, so that the silicon wafer inside is in a turned-over state.

[0033] The benefits of the present invention are that the present technical solution uses a lifting mechanism to push out the silicon wafers inside and separate them from the wafer basket, then rotates the wafer basket and flips it 180 degrees, and then puts the silicon wafers into the flipped wafer basket, thereby realizing the flipping of the silicon wafers. Compared with the prior art, the present invention flips all silicon wafers at one time, thereby improving efficiency and greatly saving processing time.

[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A flipping mechanism for turning over a silicon wafer, comprising a device housing, characterized in that: It also includes a rotating unit arranged on the platform of the device housing, a lifting mechanism placed in the device housing and in the middle of the rotating unit, and a clamping mechanism arranged above the lifting mechanism for clamping the silicon wafer, the clamping mechanism includes a driving slide rail, a driving block slidably installed on the driving slide rail through a slider, a clamping screw module threadedly connected to the driving block, a driving motor driving the clamping screw module, connecting rods rotatably arranged at both ends of the driving block through an axis, a driving rod one end of which is rotatably installed on the rear surface of the device housing through an axis and the other end is connected to the connecting rod, and a clamping block that is interconnected with the driving rod and driven to flip by the driving rod.

2. The flipping mechanism for turning over a silicon wafer according to claim 1, characterized in that: The rotating unit includes a motor mounting seat installed on the bottom surface of the equipment housing, a rotating motor installed on the motor mounting seat, a main transmission roller driven to rotate by the rotating motor, a driven transmission roller arranged corresponding to the main transmission roller and intertwined with each other through a transmission belt, a rotating shaft connected to the driven transmission roller through a coupling shaft, and a rotating plate cooperating with the rotating installation.

3. The flipping mechanism for turning over a silicon wafer according to claim 2, characterized in that: A plurality of groups of limit blocks are arranged on the rotating plate, and sensors are also arranged on the sides of the limit blocks.

4. The flipping mechanism for turning over a silicon wafer according to claim 2, characterized in that: The rotating plate is provided with an avoidance groove for cooperating with the jacking mechanism.

5. The flipping mechanism for turning over a silicon wafer according to claim 1, characterized in that: The lifting mechanism includes a lifting mounting block arranged in the equipment housing, a slide rail arranged on the side of the lifting mounting block, a screw module arranged on the lifting mounting block and corresponding to the slide rail, a sliding block threadedly mounted on the screw module and slidably mounted on the slide rail through a slider on the side, a driving unit that drives the screw module to rotate, and a lifting block mounted on the sliding block.

6. The flipping mechanism for turning over a silicon wafer according to claim 5, characterized in that: The lifting block is composed of two vertical plates, which are arranged symmetrically on the left and right, and the tops of the vertical plates are arranged at an inclined angle.

7. The flipping mechanism for turning over a silicon wafer according to claim 1, characterized in that: A clamping mounting seat is also arranged outside the clamping block, and the other end of the clamping block is installed with the clamping mounting seat through a rotating shaft. A clamping fixture is arranged on the inner wall of the clamping block, and a clamping groove for matching the installation of the silicon wafer is opened on the clamping fixture.

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