Pitch changing mechanism for taking and placing silicon wafers

Abstract

The invention discloses a pitch changing mechanism for taking and placing silicon wafers. The pitch changing mechanism comprises a first fixing plate, a transverse adjusting module, a longitudinal adjusting module and a gripper assembly. The two first fixing plates are symmetrically arranged on the two sides of the longitudinal adjusting module, the gripper assemblies are arranged on the side portions of the first fixing plates in pairs and used for taking and placing silicon wafers, and the two first fixing plates are driven by the longitudinal adjusting module to be away from or close to each other so as to adjust the longitudinal distance between the gripper assemblies. The silicon wafers with different sizes can be matched; the transverse adjusting module is arranged at one end of the first fixing plate and connected with one of the gripper assemblies, and the gripper assemblies are driven by the transverse adjusting module to transversely move along the first fixing plate so as to adjust the distance between the adjacent silicon wafers. The gripper device has the characteristics of compact structure, convenience in operation, accuracy in control, high stability and the like, and solves the problem that an existing gripper device is difficult to pick and place silicon wafers with different specifications and sizes.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer picking and placing equipment, and in particular to a variable distance mechanism for picking and placing silicon wafers. Background Art

[0002] In the photovoltaic industry, the process in the feeder is generally to grab the silicon wafer from the transmission line body first, and then put it on the carrier for processing. The process in the unloader is generally to grab the silicon wafer that has been processed on the carrier, and then put it on the transmission line body. At present, most of the existing silicon wafer picking and placing mechanisms use suction cups to pick up and place silicon wafers at a fixed position, or to grab silicon wafers by moving the left and right gripper assemblies relative to each other. Since the position between two adjacent silicon wafers on the same gripper assembly cannot be moved, the spacing between the front and rear silicon wafers will change after the same gripper grabs silicon wafers of different sizes and places them on the belt. When the spacing between the front and rear silicon wafers on the belt is too small, the sensor on the belt cannot detect it, which affects the operation of the equipment.

[0003] As the production capacity required for production increases, the size of silicon wafers is getting larger and larger, from the original 156mm to the current 230mm. The existing gripper components cannot grasp large-sized silicon wafers. Once the silicon wafers to be fed are replaced, the gripper components must also be replaced simultaneously, and the control program must be modified, which is time-consuming and labor-intensive, and can easily cause equipment instability. In addition, the use of suction cups to pick up and place silicon wafers requires a large amount of factory air pressure, is difficult to debug, and the suction cup easily produces suction cup marks when sucking silicon wafers, affecting the yield of silicon wafers. Summary of the invention

[0004] The technical problem to be solved by the present invention is to solve the problem that the existing silicon wafer picking and placing mechanism is difficult to meet the picking and placing requirements of silicon wafers of different specifications and sizes, and to provide a variable distance mechanism for picking and placing silicon wafers with a compact structure, precise control and high stability.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A variable distance mechanism for picking up and placing silicon wafers comprises a first fixed plate, a transverse adjustment module, a longitudinal adjustment module and a gripper assembly; two of the first fixed plates are symmetrically arranged on both sides of the longitudinal adjustment module, and the gripper assemblies are arranged in groups of two on the sides of the first fixed plate, and the gripper assemblies are used for picking up and placing silicon wafers. Under the drive of the longitudinal adjustment module, the two first fixed plates move away from or close to each other to adjust the longitudinal distance between the gripper assemblies, thereby matching silicon wafers of different sizes; the transverse adjustment module is arranged at one end of the first fixed plate and connected to one group of gripper assemblies, and under the drive of the transverse adjustment module, the gripper assembly moves laterally along the first fixed plate, thereby adjusting the spacing between adjacent silicon wafers.

[0007] As a further improvement of the present invention, the longitudinal adjustment module includes a second fixed plate, a driving motor, a longitudinal sliding assembly and a cam transmission assembly; the bottom of the longitudinal sliding assembly is respectively connected to the two first fixed plates, the second fixed plate is arranged on the top of the longitudinal sliding assembly, the driving motor is arranged on the second fixed plate, and the output end of the driving motor is connected to the cam transmission assembly, and the two ends of the cam transmission assembly are respectively connected to the two first fixed plates; under the drive of the driving motor, the cam transmission assembly rotates, thereby driving the first fixed plate to move along the longitudinal sliding assembly to adjust the longitudinal distance between the gripper assemblies.

[0008] As a further improvement of the present invention, the longitudinal sliding assembly includes a guide rail and a first slider, the two first fixed plates are each provided with a first slider, the top of the guide rail is connected to the second fixed plate, the guide rail spans the two first fixed plates and is slidably connected to the first slider.

[0009] As a further improvement of the present invention, the cam transmission assembly includes a guide groove, a transmission connecting rod and a cam follower; the output end of the driving motor is connected to the middle part of the transmission connecting rod, and cam followers are provided at both ends of the transmission connecting rod. The guide groove is arranged on the first fixed plate along the length direction of the first fixed plate, and the cam follower is nested in the guide groove; under the drive of the driving motor, the transmission connecting rod drives the cam follower to move along the guide groove to push the two first fixed plates away from or closer to each other.

[0010] As a further improvement of the present invention, a pad is provided at the bottom of the guide rail, and the first sliding block is slidably nested on the pad.

[0011] As a further improvement of the present invention, a third fixing plate is provided on the second fixing plate, the second fixing plate and the third fixing plate are perpendicular to each other, the third fixing plate is used to connect the gantry module, and the gantry module is used to drive the variable pitch mechanism to perform lifting and horizontal movement.

[0012] As a further improvement of the present invention, the lateral adjustment module includes a connecting plate, a linear slide rail, a second slider and a cylinder. The linear slide rail and the cylinder are both arranged at the bottom of the first fixed plate. The cylinder joint of the cylinder is connected to the connecting plate, the top of the connecting plate is connected to the second slider, and the side of the connecting plate is connected to a group of gripper assemblies. The second slider is slidably nested on the linear slide rail; driven by the cylinder, the connecting plate and the second slider move back and forth along the linear slide rail to drive the gripper assembly on the side of the connecting plate to move laterally along the first fixed plate.

[0013] As a further improvement of the present invention, the gripper assembly includes a fixed block and a hook that are perpendicular to each other, the top of the fixed block is connected to the outer side of the first fixed plate or the outer side of the connecting plate, the hook is arranged at the bottom of the fixed block, and the hook faces the inner side of the first fixed plate for supporting the silicon wafer.

[0014] As a further improvement of the present invention, a limit block is provided on the inner side of any one of the first fixing plates, and the limit block is used to limit the longitudinal displacement of the two first fixing plates.

[0015] As a further improvement of the present invention, the hook is in a straight short rod structure, and the hook is in linear contact with the silicon wafer.

[0016] As a further improvement of the present invention, the side of the fixing block is provided with reinforcing ribs.

[0017] Compared with the prior art, the advantages of the present invention are:

[0018] 1. The variable distance mechanism for picking up and placing silicon wafers of the present invention changes the distance between the two first fixed plates through the longitudinal adjustment mechanism, thereby changing the longitudinal distance between the gripper assemblies, which can meet the picking up and placing requirements of silicon wafers of different sizes and realize the picking up and placing of large and small silicon wafers; at the same time, the lateral distance between two adjacent groups of gripper assemblies on the same first fixed plate is changed through the lateral adjustment mechanism, thereby realizing the adjustment of the spacing between two adjacent silicon wafers, which can make the spacing between silicon wafers of different sizes in the transmission line body consistent, avoid the replacement of the silicon wafer gripper assembly and the silicon wafer conveying assembly due to the change of the silicon wafer size when the material is incoming, and modify the control program, which significantly improves the versatility and stability of the equipment and speeds up the production efficiency of the product line.

[0019] 2. The variable distance mechanism for taking and placing silicon wafers of the present invention comprises a gripper assembly through mutually perpendicular fixed blocks and hooks. The fixed blocks are arranged on the side of the first fixed plate or the side of the connecting plate, and the hooks are arranged at the bottom of the fixed blocks. The hooks support the silicon wafer under the silicon wafer by line contact, thereby eliminating defects such as suction cup marks and improving the overall yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structural principle of the variable distance mechanism for taking and placing silicon wafers in a specific embodiment of the present invention;

[0021] Figure 2 It is a schematic diagram of the partial structural principle of the variable distance mechanism for taking and placing silicon wafers in a specific embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the structural principle of supporting a silicon wafer in a specific embodiment of the present invention;

[0023] Legend: 1. Guide rail; 2. First slider; 3. Fixed block; 4. First fixed plate; 5. Second fixed plate; 6. Guide groove; 7. Pad; 8. First reinforcing rib; 9. Slider baffle; 10. Hook; 11. Oil cover; 12. Drive motor; 13. Silicon wafer; 14. Transmission connecting rod; 15. Limit block; 16. Cylinder joint; 17. Connecting plate; 18. Linear guide rail; 19. Second slider; 21. Exhaust throttle valve; 22. Cylinder; 23. Mounting plate; 24. Oil baffle; 25. Third fixed plate; 26. Second reinforcing rib; 27. Third reinforcing rib; 28. Cam follower. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0025] In the description of the present invention, it should be understood that the terms "side", "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] Example

[0028] like Figure 1 , Figure 2 and Figure 3As shown, the variable distance mechanism for taking and placing silicon wafers of the present invention comprises a first fixed plate 4, a lateral adjustment module, a longitudinal adjustment module and a gripper assembly; two first fixed plates 4 are symmetrically arranged on both sides of the longitudinal adjustment module, and the gripper assemblies are arranged in pairs on the side of the first fixed plate 4, and two groups of gripper assemblies are arranged on each first fixed plate 4. The gripper assembly is used to take and place silicon wafers 13. Under the drive of the longitudinal adjustment module, the two first fixed plates 4 move away from or close to each other to adjust the longitudinal distance between the gripper assemblies, thereby matching silicon wafers 13 of different sizes. The lateral adjustment module is arranged at one end of the first fixed plate 4 and connected to one group of gripper assemblies. Under the drive of the lateral adjustment module, the gripper assembly moves laterally along the first fixed plate 4, thereby adjusting the spacing between adjacent silicon wafers 13. It can be seen that the variable distance mechanism of this embodiment grabs the silicon wafer 13 on the transmission line body and places it in the carrier pocket when loading, and grabs the silicon wafer 13 in the carrier pocket and places it on the transmission line body when unloading.

[0029] In this embodiment, the distance between the two first fixed plates 4 is changed by the longitudinal adjustment mechanism, thereby changing the longitudinal distance between the gripper assemblies, which can meet the requirements of picking up and placing silicon wafers of different sizes, and realize the picking up and placing of large and small silicon wafers. At the same time, the lateral distance between two adjacent groups of gripper assemblies on the same first fixed plate 4 is changed by the lateral adjustment mechanism, thereby realizing the adjustment of the spacing between two adjacent silicon wafers 13, so that the spacing between silicon wafers 13 of different sizes in the transmission line body can be kept consistent, avoiding the need to replace the silicon wafer gripper assembly and the silicon wafer conveying assembly and modify the control program due to the change in the size of the silicon wafer when the material is incoming, significantly improving the versatility and stability of the equipment, and accelerating the production efficiency of the product line.

[0030] like Figure 1 and Figure 2 As shown, the longitudinal adjustment module includes a second fixed plate 5, a drive motor 12, a longitudinal sliding assembly and a cam transmission assembly. The bottom of the longitudinal sliding assembly is respectively connected to the two first fixed plates 4, the second fixed plate 5 is arranged on the top of the longitudinal sliding assembly, the drive motor 12 is arranged on the second fixed plate 5, and can be reversed, the output end of the drive motor 12 is connected to the cam transmission assembly, and the two ends of the cam transmission assembly are respectively connected to the two first fixed plates 4. Driven by the drive motor 12, the cam transmission assembly rotates, thereby driving the first fixed plate 4 to move along the longitudinal sliding assembly to adjust the longitudinal distance between the gripper assemblies.

[0031] like Figure 1 and Figure 2 As shown, the longitudinal sliding assembly includes a guide rail 1 and a first slider 2. The first slider 2 is provided on each of the two first fixed plates 4. The top of the guide rail 1 is connected to the second fixed plate 5. The guide rail 1 spans across the two first fixed plates 4 and is slidably connected to the first slider 2.

[0032] like Figure 1 and Figure 2 As shown, the cam transmission assembly includes a guide groove 6, a transmission connecting rod 14 and a cam follower 28. The output end of the driving motor 12 is connected to the middle of the transmission connecting rod 14, and the cam followers 28 are provided at both ends of the transmission connecting rod 14. The guide groove 6 is arranged on the first fixed plate 4 along the length direction of the first fixed plate 4, and the cam follower 28 is nested in the guide groove 6. Driven by the driving motor 12, the transmission connecting rod 14 drives the cam follower 28 to move along the guide groove 6, and the cam transmission assembly converts the rotational motion of the driving motor 12 into a linear reciprocating motion of the first fixed plate 4, so as to push the two first fixed plates 4 away from or close to each other. In other embodiments, the motor can also be used to change the spacing between the two first fixed plates 4 through a belt or a screw rod, a gear, etc., so as to meet the requirements of taking and placing silicon wafers 13 of different sizes.

[0033] Furthermore, a pad 7 is provided at the bottom of the guide rail 1, and the first slider 2 is slidably nested on the pad 7. The first slider 2 reciprocates along the pad 7 to improve the structural stability of the guide rail 1 and facilitate the replacement of the guide rail 1. At the same time, slider baffles 9 are provided at both ends of the guide rail 1 to limit the extreme position of the first slider 2 moving on the guide rail 1 to prevent the first fixing plate 4 from falling.

[0034] The driving motor 12 mounted on the third fixing plate 25 rotates, causing the transmission connecting rod 14 connected to the motor shaft and the cam follower 28 to rotate together, thereby pushing the guide groove 6 to perform linear motion, so that the first fixing plate 4 and the gripper assembly also perform linear motion, thereby realizing the opening and clamping of the gripper assembly. When the gripper assembly is opened, it grabs the silicon wafer 13 and supports the silicon wafer 13 so that the silicon wafer 13 does not fall, and then the gripper assembly clamps and moves the silicon wafer 13.

[0035] like Figure 1 As shown, the side of the second fixing plate 5 is provided with a first reinforcing rib 8 to improve the supporting strength of the second fixing plate 5. A third fixing plate 25 is provided on the second fixing plate 5, and the second fixing plate 5 and the third fixing plate 25 are perpendicular to each other. The third fixing plate 25 is used to connect a gantry module (not shown in the figure), and the gantry module is used to drive the pitch-changing mechanism to perform lifting and horizontal movement, so as to realize the pitch-changing mechanism to move to the position of the silicon wafer 13, and to take and place the silicon wafer 13.

[0036] like Figure 1 and Figure 2As shown, the lateral adjustment module includes a connecting plate 17, a linear slide 18, a second slider 19 and a cylinder 22. The cylinder 22 is arranged at the bottom of the first fixed plate 4 through a mounting plate 23 and screws, and an exhaust throttle valve 21 is arranged on the side of the cylinder 22. The cylinder joint 16 of the cylinder 22 is connected to the connecting plate 17, the top of the connecting plate 17 is connected to the second slider 19, and the side of the connecting plate 17 is connected to a group of gripper assemblies. The linear slide 18 is arranged at the bottom of the first fixed plate 4 along the length direction of the first fixed plate 4, and the second slider 19 is slidably nested on the linear slide 18. Driven by the cylinder 22, the connecting plate 17 and the second slider 19 reciprocate along the linear slide 18 to drive the gripper assembly on the side of the connecting plate 17 to move laterally along the first fixed plate 4, thereby adjusting the spacing between the two groups of gripper assemblies on the first fixed plate 4, and thus adjusting the spacing between the silicon wafers 13. In other embodiments, a motor may be used to change the spacing between the gripper assemblies on the first fixing plate 4 through a belt, a screw rod, a gear, etc., thereby adjusting the spacing between the silicon wafers 13 .

[0037] When the spacing between adjacent silicon wafers 13 of different sizes needs to be adjusted, the cylinder 22 installed under the first fixed plate 4 will extend through the cylinder joint 16 to push the connecting plate 17 to move linearly, so that the fixed block 3 and the hook 10 installed on the connecting plate 17 move together. Because the connecting plate 17 is installed under the first fixed plate 4 through the second slider 19, when the gripper assembly opens and clamps the silicon wafer 13, the center distance between adjacent silicon wafers 13 can also be changed, ensuring that when grabbing silicon wafers 13 of different sizes, the spacing between adjacent silicon wafers 13 is fixed and unchanged, and there is no need to change the gripper assembly and the silicon wafer transmission assembly, ensuring the versatility and stability of the equipment. It can be seen that the change in the distance between adjacent silicon wafers 13 in the gripper assembly is not limited to two adjacent silicon wafers 13. When grabbing multiple silicon wafers 13, the spacing between multiple silicon wafers 13 can also be changed.

[0038] like Figure 2 As shown, the gripper assembly includes a mutually perpendicular fixed block 3 and a hook 10, the top of the fixed block 3 is connected to the outer side of the first fixed plate 4 or the outer side of the connecting plate 17, and the hook 10 is arranged at the bottom of the fixed block 3, and the hook 10 faces the inner side of the first fixed plate 4. Figure 3 As shown, the hook 10 is a straight short rod structure, and the hook 10 makes linear contact with the silicon wafer 13, which not only realizes the stable support of the silicon wafer 13, but also reduces the contact with the silicon wafer 13, reduces the risk of contamination, and avoids the generation of marks. The four hooks 10 support the silicon wafer 13 from both sides of the silicon wafer 13 to prevent the silicon wafer 13 from falling, and then the driving motor 12 drives the first fixed plate 4 to move, so that the gripper assembly clamps the silicon wafer 13, and the gantry module drives the variable pitch mechanism to move as a whole to realize the movement of the silicon wafer 13.

[0039] Furthermore, a second reinforcing rib 26 and a third reinforcing rib 27 are provided on the side of the fixing block 3 to improve the structural strength of the fixing block 3 and improve the stability of taking and placing the silicon wafer 13 .

[0040] like Figure 1 As shown, the inner ends of one of the first fixing plates 4 are provided with stop blocks 15, which are used to limit the longitudinal displacement of the two first fixing plates 4 to prevent the two first fixing plates 4 from colliding. An oil cover 11 is provided on the first fixing plate 4 on the side away from the connecting plate 17, and an oil baffle 24 is provided between the bottom of the second fixing plate 5 and the first fixing plate 4 and the mounting plate 23 to prevent pollution caused by oil leakage from the cylinder 22.

[0041] In this embodiment, the variable distance mechanism for picking up and placing silicon wafers can be applied to the picking up and placing of silicon wafers of different sizes, and is not limited to a single silicon wafer size. Changing the size of the silicon wafer no longer requires synchronous replacement of the gripper assembly and the silicon wafer transfer assembly, thereby ensuring the versatility and stability of the equipment.

[0042] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A variable distance mechanism for picking up and placing silicon wafers, characterized in that: The invention comprises a first fixed plate (4), a transverse adjustment module, a longitudinal adjustment module and a gripper assembly; two of the first fixed plates (4) are symmetrically arranged on both sides of the longitudinal adjustment module; the gripper assemblies are arranged in groups of two on the side of the first fixed plate (4); the gripper assemblies are used to take and place silicon wafers (13); under the drive of the longitudinal adjustment module, the two first fixed plates (4) move away from or close to each other to adjust the longitudinal distance between the gripper assemblies, thereby matching silicon wafers (13) of different sizes; the transverse adjustment module is arranged at one end of the first fixed plate (4) and connected to one group of gripper assemblies; under the drive of the transverse adjustment module, the gripper assemblies move transversely along the first fixed plate (4), thereby adjusting the spacing between adjacent silicon wafers (13).

2. The variable distance mechanism for placing and picking up silicon wafers according to claim 1, characterized in that: The longitudinal adjustment module comprises a second fixed plate (5), a driving motor (12), a longitudinal sliding assembly and a cam transmission assembly; the bottom of the longitudinal sliding assembly is respectively connected to the two first fixed plates (4), the second fixed plate (5) is arranged on the top of the longitudinal sliding assembly, the driving motor (12) is arranged on the second fixed plate (5), and the output end of the driving motor (12) is connected to the cam transmission assembly, and the two ends of the cam transmission assembly are respectively connected to the two first fixed plates (4); under the drive of the driving motor (12), the cam transmission assembly rotates, thereby driving the first fixed plate (4) to move along the longitudinal sliding assembly to adjust the longitudinal distance between the gripper assemblies.

3. The variable distance mechanism for placing and picking up silicon wafers according to claim 2, characterized in that: The longitudinal sliding assembly comprises a guide rail (1) and a first sliding block (2). The first sliding block (2) is provided on each of the two first fixed plates (4). The top of the guide rail (1) is connected to the second fixed plate (5). The guide rail (1) spans the two first fixed plates (4) and is slidably connected to the first sliding block (2).

4. The variable distance mechanism for placing and picking up silicon wafers according to claim 3, characterized in that: The cam transmission assembly comprises a guide groove (6), a transmission connecting rod (14) and a cam follower (28); the output end of the driving motor (12) is connected to the middle part of the transmission connecting rod (14), and the two ends of the transmission connecting rod (14) are provided with cam followers (28); the guide groove (6) is arranged on the first fixed plate (4) along the length direction of the first fixed plate (4), and the cam follower (28) is nested in the guide groove (6); under the drive of the driving motor (12), the transmission connecting rod (14) drives the cam follower (28) to move along the guide groove (6) to push the two first fixed plates (4) away from or close to each other.

5. The variable distance mechanism for placing and picking up silicon wafers according to claim 3, characterized in that: A pad (7) is provided at the bottom of the guide rail (1), and the first sliding block (2) is slidably nested on the pad (7).

6. The variable distance mechanism for placing and picking up silicon wafers according to claim 3, characterized in that: A third fixing plate (25) is provided on the second fixing plate (5), the second fixing plate (5) and the third fixing plate (25) are perpendicular to each other, the third fixing plate (25) is used to connect the gantry module, and the gantry module is used to drive the variable pitch mechanism to perform lifting and horizontal movement.

7. The variable distance mechanism for placing and picking up silicon wafers according to any one of claims 1 to 6, characterized in that: The lateral adjustment module comprises a connecting plate (17), a linear slide rail (18), a second slider (19) and a cylinder (22); the linear slide rail (18) and the cylinder (22) are both arranged at the bottom of the first fixed plate (4); the cylinder joint (16) of the cylinder (22) is connected to the connecting plate (17); the top of the connecting plate (17) is connected to the second slider (19); the side of the connecting plate (17) is connected to a group of gripper assemblies; the second slider (19) is slidably nested on the linear slide rail (18); under the drive of the cylinder (22), the connecting plate (17) and the second slider (19) reciprocate along the linear slide rail (18) to drive the gripper assembly on the side of the connecting plate (17) to move laterally along the first fixed plate (4).

8. The variable distance mechanism for placing and picking up silicon wafers according to claim 7, characterized in that: The gripper assembly comprises a fixing block (3) and a hook (10) which are perpendicular to each other, the top of the fixing block (3) being connected to the outer side of a first fixing plate (4) or the outer side of a connecting plate (17), the hook (10) being arranged at the bottom of the fixing block (3), and the hook (10) facing the inner side of the first fixing plate (4), so as to support a silicon wafer (13).

9. The variable distance mechanism for taking and placing silicon wafers according to claim 8, characterized in that: A limiting block (15) is provided on the inner side of any one of the first fixing plates (4), and the limiting block (15) is used to limit the longitudinal displacement of the two first fixing plates (4).

10. The variable distance mechanism for placing and picking up silicon wafers according to claim 8, characterized in that: The hook (10) is in a straight short rod-shaped structure, and the hook (10) is in linear contact with the silicon wafer (13).

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