Liquid cooling heat dissipation PCB and preparation method thereof
By designing a liquid-cooled heat dissipation PCB, using liquid-cooled channels and specific slots and plug-ins designs, the problem of insufficient heat dissipation of the optical module on the PCB in the 800G switch is solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202411976102.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-05-16
AI Technical Summary
In the prior art, the PCB optical module in the 800G switch has insufficient heat dissipation, resulting in heat exceeding the heat dissipation capacity of the cabinet.
A liquid-cooled cooling PCB is designed, including a removable connected PCB board and a heat dissipation assembly. The heat dissipation assembly is equipped with a liquid-cooled channel. By opening specific notches on the PCB board and designing plug-ins and slots on the heat dissipation assembly, the fixed and liquid-cooled channel path setting of the PCB board and the heat dissipation assembly is realized.
Through the design of liquid-cooled heat dissipation PCB, the problem of insufficient heat dissipation of optical modules on the PCB is effectively solved, and a more efficient heat dissipation effect is achieved, and the heat dissipation needs of high-power optical modules are able to face the heat dissipation needs of high-power optical modules.
Smart Images
Figure CN120018373A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of PCB board production process, and in particular to a liquid-cooled PCB and a preparation method thereof. Background Art
[0002] With the widespread application of big data, cloud computing and AI technologies, the market demand for broadband and data transmission rate is growing rapidly. The upgrade of 800G and 1.6T Ethernet is highly anticipated. 800G switches are ports for data transmission and exchange between the Internet and devices, and between devices. Therefore, the requirements for optical modules and PCBs that carry photoelectric conversion in 800G switches are getting higher and higher.
[0003] The PCB in the 800G switch serves as a support body, on which 32 optical modules are installed. The optical modules will emit a lot of heat in the process of photoelectric conversion, so heat dissipation design is required. The existing design is to install aluminum fins on the surface of the optical module and a fan on the back of the cabinet. The aluminum fins dissipate the heat of the optical module into the cabinet, and the fan takes away the hot air in the cabinet.
[0004] The power of existing optical modules is 5~10W, and the next generation is expected to be upgraded to 16W. The heat generated by the optical module will double. However, due to the limited space in the cabinet, the installation of aluminum fins and fans will also be restricted, so there is an upper limit to the heat dissipation, resulting in the heat generated by the optical module on the PCB exceeding the heat dissipation of the cabinet.
[0005] In view of the above problems, innovative design is needed on the PCB to solve the problem of insufficient heat dissipation of the optical module on the PCB. Summary of the invention
[0006] The purpose of the present application is to provide a liquid-cooled PCB and a preparation method thereof, so as to solve the problem of insufficient heat dissipation of optical modules on PCB in the prior art.
[0007] In order to achieve the above objectives, this application is implemented by adopting the following technical solutions: In a first aspect, the present application discloses a liquid-cooled heat dissipation PCB, which comprises a PCB board and a heat dissipation component, wherein the PCB board is detachably connected to the heat dissipation component, and a liquid cooling channel is provided in the heat dissipation component; A plurality of first notches are provided on one side of the PCB board, two groups of second notches are provided on the side wall of each of the first notches, and a convex body is formed on the PCB board between two second notches on the same side; The heat dissipation component is provided with a plurality of plug-ins, and the two opposite sides are provided with card slots, the card slots correspond to the convex bodies one by one, the card slots are matched and installed with the convex bodies, and the PCB board and the heat dissipation component are fixed.
[0008] According to a further solution of the present application, the paths of the liquid cooling channels are arranged in a reciprocating and overlapping manner in a plurality of the plug-ins.
[0009] According to a further solution of the present application, the heat dissipation assembly includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate is provided with a first half cold groove, the second heat dissipation plate is matched with a second half cold groove, the first heat dissipation plate and the second heat dissipation plate are fixed so that the first half cold groove and the second half cold groove match to form the liquid cooling channel.
[0010] According to a further solution of the present application, the first notch is opened on one side of the upper blank area of the PCB board.
[0011] According to a further solution of the present application, a plurality of the first notches are equidistantly arranged on one side of the PCB board.
[0012] In a second aspect, the present application discloses a method for preparing a liquid-cooled PCB, which comprises the following steps: Obtain PCB original data and optical module data; Modify the PCB data according to the original PCB data and the optical module data to obtain a blank area on the PCB; According to the original PCB data, a plurality of first notches are opened on the blank area, and second notches are opened at intervals on the side walls of each of the first notches to obtain a new PCB; According to the shape and size of the protrusion between the two second notches on the same side, the plug-in on the heat dissipation component is slotted to obtain a slot matching the protrusion; According to the optical module data, the heat dissipation component is slotted to obtain a cooling channel, and the cooling channel passes through the plug-in; The plurality of protrusions are placed in the plurality of slots in a one-to-one correspondence, so as to fix the heat dissipation assembly and the new PCB and obtain a liquid-cooled heat dissipation PCB.
[0013] A further solution, According to the original PCB data, the optical module area on the PCB is rewired and punched to reserve the blank area.
[0014] In a further solution, the optical module data includes the chip location and chip power; The first notch is positioned according to the location of the chip, and the first notch does not contact the optical module area.
[0015] A further solution, The thickness of the heat dissipation component is designed according to the thickness of the optical module area in the PCB original data, and the thickness of the heat dissipation component is the same as the thickness of the optical module area; The diameter and path of the liquid cooling channel inside the heat dissipation component are designed according to the power of the chip, and the heat dissipation value of the heat dissipation component is not less than the heat generation value of the chip.
[0016] A further solution, According to the power of the chip in the optical module data, set the heat dissipation target value; According to the heat dissipation target value, preliminary parameters of the liquid cooling channel are preliminarily calculated by software; Inputting the numerical value of the preliminary parameter into thermal simulation software for simulation to obtain the heat dissipation value of the preliminary parameter; If the heat dissipation value is not less than the heat dissipation target value, the preliminary parameter result is qualified; If the heat dissipation value is less than the heat dissipation target value, the preliminary parameters are modified, and the modified parameters are input into the simulation software for re-simulation until the heat dissipation value is not less than the heat dissipation target value. The parameters obtained by the last modification are qualified.
[0017] The beneficial effects of this application are: The present invention processes a first notch in the optical module area on the PCB, designs a heat dissipation component with a liquid cooling channel according to the size of the first notch, and assembles the two for use. When used by a client, the heat dissipation component is connected to the cooling water of a switch cabinet. The cooling water can exchange heat with the optical module through the liquid cooling channel of the heat dissipation component, thereby taking away the heat emitted from the bottom of the optical module. Combined with the heat dissipation of the aluminum fins on the surface of the optical module, the problem of insufficient heat dissipation of the optical module on the PCB is solved.
[0018] The heat dissipation component is composed of a first heat dissipation plate and a second heat dissipation plate, which are opened respectively on the first heat dissipation plate and the second heat dissipation plate, and then the two are matched and fixed. This method can address the disadvantage that when the liquid cooling channel structure is complex, the channel structure is not easy to produce, and the split design can speed up the production efficiency of the device and improve the production accuracy of the liquid cooling channel. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the structure of the liquid cooling PCB in the first embodiment of the present application; Figure 2 This is a schematic diagram of the structure of the PBC board in Example 1 of the present application; Figure 3 This is a schematic diagram for illustrating the second notch and the card slot in the first embodiment of the present application; Figure 4 This is a schematic diagram of the structure of the cold night channel in Example 1 of the present application; Figure 5 This is a schematic diagram of the process of the preparation method in Example 2 of the present application.
[0020] Wherein: 1. PCB board; 2. heat dissipation component; 11. first notch; 12. second notch; 21. card slot; 3. cold night channel. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use. Embodiment 1
[0022] like Figures 1 to 3 As shown, the present embodiment discloses a liquid-cooled heat dissipation PCB, which includes a PCB board 1 and a heat dissipation component 2. The PCB board 1 and the heat dissipation component 2 are detachably connected, and a liquid cooling channel is provided in the heat dissipation component 2; a plurality of first notches 11 are provided on one side of the PCB board 1, and two groups of second notches 12 are provided on the side wall of each first notch 11 at intervals, and a convex body is formed on the PCB board 1 between the two second notches 12 on the same side; a plurality of plug-ins are provided on the heat dissipation component 2, and card slots 21 are provided on opposite sides, and the card slots 21 correspond to the convex body one by one. The card slots 21 are installed in cooperation with the convex body, and the PCB board 1 and the heat dissipation component 2 are fixed. The device limits the movement of the PCB board 1 and the heat dissipation component 2 in one direction by plugging between the notch and the plug-in, and limits the relative movement of the PCB board 1 and the heat dissipation component 2 in another direction by combining the card slot 21 with the convex body.
[0023] As attached Figure 4 As shown, in this embodiment, the paths of the liquid cooling channels are arranged in a reciprocating and overlapping manner in several plug-ins, usually in an "S"-shaped reciprocating arrangement, and sometimes a circular arrangement can be selected. The arrangement methods are all for the purpose of expanding the heat dissipation capacity.
[0024] In some embodiments, the heat dissipation assembly 2 includes a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate is provided with a first half cold groove, and the second heat dissipation plate is matched with a second half cold groove. The first heat dissipation plate and the second heat dissipation plate are fixed so that the first half cold groove and the second half cold groove match to form a liquid cooling channel. Half grooves are opened on the two heat dissipation plates, and a liquid cooling channel is formed by combining them. This can ensure the manufacturing accuracy of the liquid cooling channel and reduce the difficulty of opening the arc bends on the channel, which helps to improve the manufacturing efficiency to a certain extent.
[0025] In this embodiment, the first notch 11 is opened on one side of the blank area on the PCB board 1. In this embodiment, the number of the first notches 11 is 12, and the 12 first notches 11 are equidistantly arranged in the blank area on the PCB board 1, wherein the blank area is an area on the PCB board 1 where no circuits, chips, and holes are arranged. Embodiment 2
[0026] This embodiment provides a method for preparing the liquid-cooled PCB in the first embodiment, which comprises the following steps: Obtain PCB original data and optical module data; Modify the PCB data according to the original PCB data and the optical module data to obtain a blank area on the PCB board 1; According to the original PCB data, 12 first notches 11 are opened on the blank area, and second notches 12 are opened at intervals on the side wall of each first notch 11 to obtain a new PCB; According to the shape and size of the protrusion between the two second notches 12 on the same side, the plug-in on the heat dissipation component 2 is slotted to obtain a slot 21 matching the protrusion; According to the optical module data, the heat dissipation component 2 is slotted to obtain a cold night channel 3, and the cold night channel 3 passes through the plug-in; The protrusions on the new PCB are installed in the card slots 21 one by one to fix the heat dissipation component 2 and the new PCB to obtain a liquid-cooled heat dissipation PCB.
[0027] In some embodiments, Figure 5 As shown, a method for preparing a liquid-cooled PCB, the basic implementation process is as follows: Step 1: Obtain the original PCB data and optical module data, including the following: 1) The thickness of the optical module area is 5mm, the size of a single optical module area is 25mm wide and 60mm long, the wiring is concentrated on one side, there is no hole design in the optical module area, the number of optical modules is 12 side by side along the short side of the PCB, and the length of the short side of the PCB is 400mm; 2) The optical module chip is located in the area corresponding to the PCB wiring concentration. In this embodiment, the power of the chip is 16W; Step 2: Modify the PCB data to ensure that the optical module area is blank except for the area where the wiring is concentrated. The other areas are blank areas, and the first slot 11 (SLOT) is designed in the blank area. Step 3: In this embodiment, the first slot 11 is designed to have a size of 15 mm wide and 50 mm long, with a total of 12 slots. The first slot 11 has a rectangular opening, and the style is as follows: Figure 2 As shown, a shallow groove with a depth of 1 mm and a width of 2.5 mm is provided on the upper and lower surfaces of the side walls of the first notch 11 as the second notch 12. The second notch 12 has a pattern as shown in FIG. Figure 3 As shown, at this time, the cross section of the side wall between two adjacent first notches 11 is in the shape of a "cross", or a "well", and finally a new PCB is obtained; Step 4, design the heat dissipation component 2, determine that the length of the heat dissipation component 2 is 400mm, and 12 plug-ins are integrally arranged on one side of the long side of the heat dissipation component 2. The 12 plug-ins are equidistant and parallel. The plug-in is formed by equidistant installation grooves on the long side of the heat dissipation component 2. The plug-in design size is 20mm wide and 50mm deep; there are 12 in total, each with a spacing of 5mm. The edge is designed as a card slot 21 structure, and the card slot 21 matches the convex body. The diameter of the liquid cooling channel inside the heat dissipation component 2 is defined as 3mm and is arranged in an S-shaped surround. It should be noted here that the liquid cooling channel setting route must pass through each plug-in to ensure the heat dissipation effect. The style is as follows Figure 4 As shown, the heat dissipation requirements can be met by simulating with Flotherm thermal simulation software; In this embodiment, the thickness of the heat dissipation component 2 is the same as the thickness of the optical module area; the diameter and path of the liquid cooling channel inside the heat dissipation component 2 are designed according to the power of the chip, and the heat dissipation value of the heat dissipation component 2 is not less than the heat generation value of the chip. When designing the diameter and path of the liquid cooling channel inside the heat dissipation component 2, set the heat dissipation target value according to the power of the chip in the optical module data; According to the heat dissipation target value, the preliminary parameters of the liquid cooling channel are preliminarily calculated through the software; Input the numerical values of the preliminary parameters into the thermal simulation software for simulation to obtain the heat dissipation values of the preliminary parameters. The thermal simulation software here is any one of Ansys ICEPAK, Flotherm, SINDA / FLUINT or other simulation software with thermal analysis; If the heat dissipation value is not less than the heat dissipation target value, the preliminary parameter result is qualified; the liquid cooling channel can be designed according to the preliminary parameters. If the heat dissipation value is less than the heat dissipation target value, the preliminary parameters are modified and the modified parameters are input into the simulation software for re-simulation. If the heat dissipation value is still less than the heat dissipation target value, the parameters are modified again until the heat dissipation value is not less than the heat dissipation target value. The parameters obtained by the last modification are qualified, and the liquid cooling channel is designed according to the parameters obtained by the last modification.
[0028] Step five, the PCB factory produces PCB according to the design, and the machining factory produces the heat dissipation component 2; when producing the heat dissipation component 2, in order to ensure the success rate of the liquid cooling channel production and reduce the difficulty of manufacturing, the heat dissipation component 2 is designed separately. In this embodiment, two heat dissipation plates, a first heat dissipation plate and a second heat dissipation plate, are designed. According to the final design parameters of the liquid cooling channel obtained in step four, a first half cold groove is engraved on the first heat dissipation plate, and a second half cold groove is engraved on the second heat dissipation plate by a machine. After machining is completed, the two heat dissipation plates are fixed together by stir friction welding or vacuum brazing, and the edges of the first half cold groove and the second half cold groove are matched to accurately form a liquid cooling channel.
[0029] Step six, assemble the new PCB and heat dissipation component 2, insert the plug-in on the heat dissipation component 2 into the first slot 11 on the new PCB, at this time, the card slot 21 on the plug-in and the protrusions on both sides of the first slot 11 are plugged and fixed, completing the mutual limitation of the new PCB and the heat dissipation component 2, and obtaining a liquid-cooled heat dissipation PCB.
[0030] When in use, the input and output ports of the liquid cooling channel in the heat dissipation component 2 are connected to the cooling water in the switch cabinet. The switch continuously circulates cooling water, which will take away the heat generated by the new PCB (optical module) when it is working, and can quickly achieve cooling.
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.
[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.
Claims
1. A liquid-cooled PCB, characterized in that: It comprises a PCB board (1) and a heat dissipation component (2), wherein the PCB board (1) and the heat dissipation component (2) are detachably connected, and a liquid cooling channel is provided in the heat dissipation component (2); A plurality of first notches (11) are provided on one side of the PCB board (1), two groups of second notches (12) are provided on the side wall of each first notch (11) at intervals, and a convex body is formed on the PCB board (1) between two second notches (12) on the same side; The heat dissipation component (2) is provided with a plurality of plug-ins, and the two opposite sides are provided with card slots (21), the card slots (21) correspond to the convex bodies one by one, the card slots (21) and the convex bodies are installed in cooperation, and the PCB board (1) and the heat dissipation component (2) are fixed.
2. The heat dissipation PCB according to claim 1, characterized in that: The paths of the liquid cooling channels are arranged in a reciprocating and overlapping manner in a plurality of the plug-ins.
3. The heat dissipation PCB according to claim 1, characterized in that: The heat dissipation assembly (2) comprises a first heat dissipation plate and a second heat dissipation plate, wherein the first heat dissipation plate is provided with a first half cold groove, and the second heat dissipation plate is matched with a second half cold groove, and the first heat dissipation plate and the second heat dissipation plate are fixed so that the first half cold groove and the second half cold groove match to form the liquid cooling channel.
4. The heat dissipation PCB according to claim 1, characterized in that: The first notch (11) is opened in a blank area of the PCB board (1).
5. The heat dissipation PCB according to claim 1, characterized in that: A plurality of the first notches (11) are arranged at equal distances on one side of the PCB board (1).
6. A method for preparing a liquid-cooled PCB according to any one of claims 1 to 5, characterized in that: include: Obtain original PCB data and optical module data; Modifying the PCB data according to the original PCB data and the optical module data to obtain a blank area on the PCB board (1); According to the original PCB data, a plurality of first notches (11) are opened on the blank area, and second notches (12) are opened at intervals on the side wall of each first notch (11), so as to obtain a new PCB; According to the shape and size of the protrusion between the two second notches (12) on the same side, a slot is formed on the plug-in on the heat dissipation component (2) to obtain a slot (21) matching the protrusion; According to the optical module data, the heat dissipation component (2) is slotted to obtain a cooling channel (3), and the cooling channel (3) passes through the plug-in; The plurality of protrusions are placed in a plurality of slots (21) in a one-to-one correspondence, thereby fixing the heat dissipation assembly (2) and the new PCB, thereby obtaining a liquid-cooled heat dissipation PCB.
7. The method for preparing a liquid-cooled PCB according to claim 6, characterized in that: According to the original PCB data, the optical module area on the PCB is rewired and punched to reserve the blank area.
8. The method for preparing a liquid-cooled PCB according to claim 7, characterized in that: The optical module data includes the chip location and chip power; The first notch (11) is positioned according to the location of the chip, and the first notch (11) does not contact the optical module area.
9. The method for preparing a liquid-cooled PCB according to claim 8, characterized in that: The thickness of the heat dissipation component (2) is designed according to the thickness of the optical module area in the PCB original data, and the thickness of the heat dissipation component (2) is the same as the thickness of the optical module area; The diameter and path of the liquid cooling channel inside the heat dissipation component (2) are designed according to the power of the chip, and the heat dissipation value of the heat dissipation component (2) is not less than the heat generation value of the chip.
10. The method for preparing a liquid-cooled PCB according to claim 7 or 8, characterized in that: According to the power of the chip in the optical module data, set the heat dissipation target value; According to the heat dissipation target value, preliminary parameters of the liquid cooling channel are preliminarily calculated by software; Inputting the numerical value of the preliminary parameter into thermal simulation software for simulation to obtain the heat dissipation value of the preliminary parameter; If the heat dissipation value is not less than the heat dissipation target value, the preliminary parameters are qualified; If the heat dissipation value is less than the heat dissipation target value, the preliminary parameters are modified, and the modified parameters are input into the simulation software for re-simulation until the heat dissipation value is not less than the heat dissipation target value. The parameters obtained by the last modification are qualified.