Chip with heat dissipation structure and preparation process

Abstract

The invention relates to the technical field of semiconductors, and particularly discloses a chip with a heat dissipation structure and a preparation technology, the chip comprises a component, a circuit board and a radiator, the component and the circuit board are respectively connected with the radiator; the circuit board is provided with an accommodating hole, the component is correspondingly arranged at the accommodating hole, and the component is connected with at least one part of the radiator. The heat conductivity coefficient of the circuit board is larger than that of a traditional PCB, the circuit board and the components are connected with the radiator, heat conduction through the circuit board is not needed during heat dissipation of the components, the heat dissipation effect of the components can be greatly improved, meanwhile, heat accumulation on the circuit board can be reduced, and the service life of the components is prolonged. And the heat dissipation capability of the whole chip is further improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a chip with a heat dissipation structure and a preparation process thereof. Background Art

[0002] With the rapid development of science and technology, the power of various electronic devices is getting higher and higher, especially the power modules, which are getting smaller and smaller. Because the electronic components are arranged too closely, the heat of the equipment is relatively concentrated. If the heat cannot be effectively diffused outward in time, the electronic equipment will work at high temperature for a long time and cause various forms of failure, which greatly limits the scope of use, service life and performance stability of electronic equipment.

[0003] The most effective way to conduct heat generated by chip devices is to exchange heat with the outside world through the bottom of the pad, PCB circuit board, interface material, and heat sink in sequence. The thermal conductivity of traditional PCB circuit boards is 0.2-5W / m·K, and the heat of chip devices is transferred to the heat sink through the PCB circuit board and the thermal interface material.

[0004] When the heat sink is magnified, it can be clearly seen that its surface is obviously uneven. When the PCB circuit board contacts the heat sink, there is a certain gap between the two contact surfaces. Since the air heat transfer performance is very poor, contact thermal resistance is generated. When a large amount of heat passes through the contact surface, a large temperature difference will be generated. At present, thermal interface materials are used to fill the contact surface to squeeze the air out of the contact surface, thereby reducing the contact thermal resistance. However, thermal interface materials such as thermal grease (thermal conductivity 1-8W / m·K) have limited thermal conductivity. Due to the influence of vibration between the power device and the housing, the gap between the contact surfaces changes slightly. The thermal grease will increase the thermal resistance as the gap changes.

[0005] For heat dissipation applications of high-power devices such as IGBT (insulated gate bipolar transistor), the heat flux density tends to develop towards high power and high integration. The module also generates a large amount of heat due to its high-frequency conduction and opening and closing. The weakness of IGBT power semiconductor modules is overheating, and thermal management issues become the key. The thermal conductivity of PCB circuit board materials and thermal interface materials have become the bottleneck of thermal management of power devices.

[0006] Therefore, it is necessary to propose a chip with a heat dissipation structure and a preparation process to at least partially solve the problems existing in the prior art. Summary of the invention

[0007] A series of simplified concepts are introduced in the Summary of the Invention, which will be further described in detail in the Detailed Description of the Invention. The Summary of the Invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the scope of protection of the claimed technical solution.

[0008] In order to at least partially solve the above-mentioned problems, the present invention provides a chip with a heat dissipation structure, including: components, a circuit board and a heat sink, wherein the components and the circuit board are respectively connected to the heat sink; the circuit board is provided with a receiving hole, the components are correspondingly arranged at the receiving hole, and the components are connected to at least a part of the heat sink.

[0009] Preferably, the circuit board comprises: an insulating layer and a circuit layer connected to each other, the components are electrically connected to the circuit layer, and the heat sink is connected to the insulating layer.

[0010] Preferably, the radiator is provided with a heat dissipation channel, and the heat dissipation medium passing through the heat dissipation channel is gas or liquid.

[0011] Preferably, a boss is extended from the heat sink, the boss is arranged in the receiving hole, and the boss is connected to the component.

[0012] Preferably, the component is arranged in the accommodating hole, which is connected to the heat sink.

[0013] The present invention also provides a process for preparing a chip with a heat dissipation structure, comprising: Covering the target area of ​​the heat sink surface where the boss is to be made with a dry film; According to the thickness of the circuit board and the size of the components, the surface of the heat sink is etched to produce a boss; According to the size of the boss, a receiving hole is made on the circuit board; Positioning and sleeve-fitting the boss of the heat sink into the receiving hole of the circuit board, and pressing the heat sink and the circuit board together; The components are fitted to the bosses and the components are electrically connected to the circuit layer of the circuit board.

[0014] Preferably, the boss of the heat sink is positioned and sleeved in the receiving hole of the circuit board, and the heat sink and the circuit board are pressed together, including: Insert the positioning plate on the positioning and clamping mechanism into the accommodating hole to clamp the circuit board; The circuit board is positioned and moved to the top of the boss by using a moving mechanism connected to the positioning and clamping mechanism; The circuit board is driven downward by the moving mechanism so that the boss is inserted into the receiving hole, and the positioning plate is inserted into the gap between the boss and the receiving hole; The moving mechanism is disconnected from the positioning and clamping mechanism, and the circuit board and the heat sink are pressed together; After the pressing is completed, the moving mechanism is connected to the positioning and clamping mechanism, and the positioning and clamping mechanism is controlled to be separated from the circuit board and the heat sink.

[0015] Preferably, before laminating the component with the boss, the method further comprises: After the circuit board is pressed and connected with the heat sink, a gap is formed between the boss and the receiving hole, and the gap is filled with insulating material to form an insulating isolation layer.

[0016] The present invention also provides another process for preparing a chip with a heat dissipation structure, comprising: Making accommodation holes on the circuit board according to the size of the components; Connect the circuit board to the heat sink; The components are positioned in the receiving holes and bonded to the heat sink by thermally conductive solder.

[0017] Preferably, the components are positioned and placed in the receiving holes, and the components are bonded to the heat sink by thermally conductive solder, including: Components are clamped using the positioning plate on the positioning and clamping mechanism; The components are positioned and moved above the circuit board using a moving mechanism connected to the positioning and clamping mechanism; The components are driven downward by the moving mechanism so that the components are placed in the receiving hole, and the positioning plate is inserted into the gap between the components and the receiving hole; wherein the receiving hole is pre-arranged with thermal conductive solder; Heat the thermally conductive solder to connect the components to the heat sink; After the components are connected to the heat sink, the positioning and clamping mechanism is separated from the circuit board and the components, and a gap is formed between the components and the receiving hole; The gap is filled with insulating material to form an insulating isolation layer.

[0018] Compared with the prior art, the present invention has at least the following beneficial effects: The chip with a heat dissipation structure and the preparation process described in the present invention have a circuit board with a greater thermal conductivity than a traditional PCB circuit board, and the circuit board and components are respectively connected to the heat sink, so that the components do not need to be heat-conducted through the circuit board when dissipating heat, which can greatly improve the heat dissipation effect of the components and also reduce heat accumulation on the circuit board, further improving the heat dissipation capacity of the entire chip.

[0019] The chip with heat dissipation structure and the preparation process described in the present invention, and other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by technicians in this field through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the connection structure between the heat dissipation structure and the chip in the prior art; Figure 2 This is a schematic diagram of the structure of the chip with a heat dissipation structure according to the present invention using a boss and air cooling for heat dissipation; Figure 3 This is a schematic diagram of the structure of the chip with a heat dissipation structure according to the present invention using a boss and liquid cooling for heat dissipation; Figure 4 It is a schematic diagram of the structure of the chip with heat dissipation structure of the present invention, in which components are placed in the receiving holes and the heat is dissipated by air cooling; Figure 5 It is a schematic diagram of the structure of the chip with heat dissipation structure of the present invention, in which components are placed in the receiving holes and liquid cooling is used for heat dissipation; Figure 6 It is a schematic diagram of a structure in which a circuit board is clamped and located above a boss in the first preparation process of a chip with a heat dissipation structure according to the present invention; Figure 7 It is a structural schematic diagram of the positioning and clamping mechanism limiting the boss and the accommodation hole in the first preparation process of the chip with the heat dissipation structure of the present invention; Figure 8 It is a schematic diagram of the gap formed between the boss and the accommodation hole in the first preparation process of the chip with the heat dissipation structure of the present invention; Fig. 9 It is a schematic structural diagram of an insulating isolation layer between a boss and a receiving hole in a first preparation process of a chip with a heat dissipation structure according to the present invention; Fig.10 It is a schematic structural diagram of the press-fitting of a circuit board without a receiving hole and a heat sink in the second preparation process of the chip with a heat dissipation structure according to the present invention; Fig.11 It is a structural schematic diagram of making a receiving hole after the circuit board and the heat sink are pressed together in the second preparation process of the chip with the heat dissipation structure of the present invention; Fig.12 It is a structural schematic diagram of clamping a circuit board with accommodation holes formed therein to the top of a heat sink in the second preparation process of a chip with a heat dissipation structure according to the present invention; Fig.13 It is a structural schematic diagram of pressing a circuit board with accommodation holes and a heat sink in the second preparation process of the chip with heat dissipation structure of the present invention; Fig.14 It is a structural schematic diagram of clamping components in the second preparation process of the chip with a heat dissipation structure according to the present invention; Fig.15 It is a structural schematic diagram of the positioning and clamping mechanism limiting the components and the accommodation holes in the second preparation process of the chip with the heat dissipation structure of the present invention; Fig.16 A schematic diagram of the gap formed by components and accommodating holes in the second preparation process of the chip with a heat dissipation structure according to the present invention; Fig.17 It is a schematic diagram of an insulating isolation layer between components and accommodation holes in the second preparation process of a chip with a heat dissipation structure according to the present invention; Fig.18 It is a schematic diagram of the internal structure of the positioning and clamping mechanism in the preparation process of the chip with the heat dissipation structure of the present invention; Fig.19 It is a schematic diagram of the bottom structure of the positioning and clamping mechanism in the preparation process of the chip with the heat dissipation structure of the present invention; Fig. 20 It is a schematic diagram of the internal structure of the positioning clamping mechanism and the moving mechanism in the preparation process of the chip with the heat dissipation structure described in the present invention. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0022] It should be understood that the terms such as “having”, “including” and “comprising” used herein do not exclude the existence or addition of one or more other elements or combinations thereof.

[0023] like Figure 1 As shown, in the prior art, the PCB circuit board includes a circuit layer 22, a PCB thermal insulation layer 10 and a PCB metal base 11, the component 1 is connected to the PCB circuit board through a solder paste layer 12, and the PCB circuit board is connected to the heat sink 3 through an interface material 13. The interface material 13 is generally made of thermal conductive silicone grease. The disadvantage of this connection method is that gaps are easily generated on the contact surface between the radiator 3 and the PCB circuit board, thereby increasing the thermal resistance and affecting the heat dissipation effect of the component 1.

[0024] like Figure 2-Figure 5 As shown, the present invention provides a chip with a heat dissipation structure, including: a component 1, a circuit board 2 and a heat sink 3, wherein the component 1 and the circuit board 2 are respectively connected to the heat sink 3; a receiving hole 4 is provided on the circuit board 2, and the component 1 is correspondingly arranged at the receiving hole 4, and the component 1 is connected to at least a portion of the heat sink 3.

[0025] The circuit board 2 includes single-layer, double-layer or multi-layer circuits, and the material of the circuit board 2 includes one or more of flame-resistant material FR4 (grade code of flame-resistant material), IMS (insulated metal substrate), ceramic board and glass substrate; the thermal conductivity of the circuit board 2 is 0.2-200 W / m·K.

[0026] In the present invention, the receiving hole 4 on the circuit board 2 is used to connect the component 1 and the heat sink 3, so that the heat generated by the component 1 can be directly dissipated by the heat sink 3, and the heat generated by the circuit board 2 during operation is also dissipated through the heat sink 3; The heat sink 3 can be made of copper, aluminum or a composite material of copper and aluminum. The heat sink 3 made of copper has a thermal conductivity of 400 W / m·K, which can improve the heat dissipation effect of the component 1 and the circuit board 2.

[0027] The circuit board 2 and the heat sink 3 are connected as a whole by pressing, such as hot pressing or cold pressing, which can improve the bonding ability between the two and reduce the gap between the two, thereby reducing thermal resistance.

[0028] In the above technical solution, the thermal conductivity of the circuit board 2 is greater than that of the traditional PCB circuit board, and the circuit board 2 and the component 1 are respectively connected to the heat sink 3, so the component 1 does not need to be heat-conducted through the circuit board 2 when dissipating heat, which can greatly improve the heat dissipation effect of the component 1, and at the same time can also reduce the heat accumulation on the circuit board 2, further improving the heat dissipation capacity of the entire chip.

[0029] In one embodiment, the circuit board 2 includes: an insulating layer 21 and a circuit layer 22 connected to each other, the component 1 is electrically connected to the circuit layer 22 , and the heat sink 3 is connected to the insulating layer 21 .

[0030] The insulating layer 21 preferably has an IMS (insulated metal substrate) with a higher thermal conductivity, and the circuit layer 22 is a PCB copper foil layer, which is a single-layer, double-layer or multi-layer circuit. The component 1 is electrically connected to the circuit layer 22. For example, the component 1 can be electrically connected to the pad on the circuit layer 22 by wire bonding.

[0031] In one embodiment, a heat dissipation channel 31 is provided on the radiator 3 , and the heat dissipation medium passing through the heat dissipation channel 31 is gas or liquid.

[0032] The radiator 3 can be cooled by air or liquid. Figure 2 and Figure 4 The air cooling method is shown as an example, and the side of the heat dissipation channel 31 away from the circuit board 2 is opened; Figure 3 and Figure 5The figure shows the selected liquid cooling heat dissipation method, the heat dissipation channel 31 is closed on the side away from the circuit board 2, and the heat dissipation channel 31 is formed inside the radiator 3 to facilitate liquid flow to achieve heat dissipation.

[0033] Two connection structures between the component 1 and the heat sink 3 are provided below: like Figure 2 and Figure 3 The first connection structure is shown, in which a boss 5 is extended from the heat sink 3 , and the boss 5 is arranged in the receiving hole 4 , and the boss 5 is connected to the component 1 .

[0034] A boss 5 is made on the heat sink 3 (for example, by etching), and a receiving hole 4 is made on the component 1 (for example, by laser cutting), and then the boss 5 is inserted into the receiving hole 4. The top surface of the boss 5 is flush with the top surface of the circuit board 2. The circuit board 2 and the heat sink 3 are connected by pressing. After the two are connected, the component 1 is fitted with the heat sink 3, and then the component 1 is electrically connected to the circuit board 2 by wire bonding.

[0035] Through the above technical solution, the boss 5 is arranged in the accommodating hole 4 of the circuit board 2, and the boss 5 is fitted with the component 1. When the chip is working, the heat generated by the circuit board 2 can be dissipated through the radiator 3. At the same time, the circuit board 2 can also transfer the heat to the boss 5 for heat dissipation, thereby improving the heat dissipation capacity of the circuit board 2. The part where the component 1 is fitted with the boss 5 can effectively dissipate the heat, so that the component 1 can dissipate the heat directly through the radiator 3 without passing through the circuit board 2, thereby improving the heat dissipation effect.

[0036] like Figure 4 and Figure 5 The second connection structure is shown, where the component 1 is arranged in the receiving hole 4 , which is connected to the heat sink 3 .

[0037] The circuit board 2 is pressed and connected with the heat sink 3, and then the insulating layer 21 of the circuit board 2 is burned or reamed by laser or machine depth control to form the receiving hole 4, so that the heat sink 3 is exposed; or, the receiving hole 4 is first made on the circuit board 2, and then the circuit board 2 and the heat sink 3 are pressed and connected; it should be noted that the receiving hole 4 is made on the insulating layer 21 not covered by the circuit layer 22 on the circuit board 2; The component 1 is positioned and placed in the receiving hole 4 , and the component 1 is attached to the heat sink 3 by means of thermally conductive solder, thereby reducing the interface thermal resistance and eliminating the heat conduction process of the insulating layer 21 .

[0038] For the two connection structures between the component 1 and the heat sink 3, the present invention provides two corresponding preparation processes as follows: like Figure 6-Figure 9Shown is the first preparation process provided by the present invention: A process for preparing a chip with a heat dissipation structure, comprising: Covering the target area on the surface of the heat sink 3 where the boss 5 is to be made with a dry film; According to the thickness of the circuit board 2 and the size of the component 1, the surface of the heat sink 3 is etched to produce a boss 5; According to the size of the boss 5, a receiving hole 4 is made on the circuit board 2; The boss 5 of the heat sink 3 is positioned and sleeved into the receiving hole 4 of the circuit board 2, and the heat sink 3 and the circuit board 2 are pressed together; The component 1 is attached to the boss 5 , and the component 1 is electrically connected to the circuit layer 22 of the circuit board 2 .

[0039] The heat sink 3 is preferably made of copper material; the size of the receiving hole 4 is such that the boss 5 can be inserted.

[0040] The target area covered by the dry film will not be etched, and the rest of the area will be etched to a set depth to obtain a boss 5; the height of the boss 5 and the thickness of the circuit board 2 need to satisfy: the component 1 can be fitted and connected to the boss 5, and the component 1 can be electrically connected to the circuit board 2; the length and width of the boss 5 are both smaller than the length and width of the component 1 so as not to affect the wire bonding between the component 1 and the circuit board 2.

[0041] The circuit board 2 is cut by laser cutting to obtain a receiving hole 4 whose size allows the boss 5 to be inserted.

[0042] The manufactured heat sink 3 and circuit board 2 are sleeved together and connected by pressing, which can improve the bonding ability of the two and reduce the thermal resistance between the two. After the two are connected, the component 1 is fitted and connected to the boss 5, and the component 1 is cooled by the heat sink 3 to improve its heat dissipation effect.

[0043] Furthermore, the boss 5 of the heat sink 3 is positioned and sleeved in the receiving hole 4 of the circuit board 2, and the heat sink 3 and the circuit board 2 are pressed together, including: Insert the positioning plate 61 on the positioning and clamping mechanism 6 into the accommodating hole 4 to clamp the circuit board 2; The circuit board 2 is positioned and moved to the top of the boss 5 by using the moving mechanism 7 connected to the positioning and clamping mechanism 6; The circuit board 2 is driven downward by the moving mechanism 7, so that the boss 5 is inserted into the receiving hole 4, and the positioning plate 61 is inserted into the gap 8 between the boss 5 and the receiving hole 4; The moving mechanism 7 is disconnected from the positioning and clamping mechanism 6, and the circuit board 2 and the heat sink 3 are pressed together; After the pressing is completed, the moving mechanism 7 is connected to the positioning and clamping mechanism 6 , and the positioning and clamping mechanism 6 is controlled to be separated from the circuit board 2 and the heat sink 3 .

[0044] Furthermore, before the component 1 is attached to the boss 5, the process further includes: After the circuit board 2 and the heat sink 3 are pressed together, a gap 8 is formed between the boss 5 and the receiving hole 4 , and an insulating material is filled into the gap 8 to form an insulating isolation layer 9 .

[0045] like Figure 6 As shown, the multiple positioning plates 61 on the positioning and clamping mechanism 6 are first close to each other so that they can be inserted into the receiving hole 4, and then the multiple positioning plates 61 are in close contact with the side wall of the receiving hole 4, so as to clamp the circuit board 2, and then the positioning and clamping mechanism 6 is controlled to move by the moving mechanism 7, and the circuit board 2 is driven to move so that it is located above the boss 5, and the circuit board 2 moves downward, so that the boss 5 can be inserted into the receiving hole 4; like Figure 7 As shown, the size of the boss 5 is set to be smaller than the size of the receiving hole 4. A plurality of positioning plates 61 can ensure that when the boss 5 is inserted into the receiving hole 4, a gap 8 can be formed between the two in each direction to prevent the boss 5 from directly contacting the side wall of the receiving hole 4. Since the boss 5 is made of copper, aluminum or a copper-aluminum composite material and has a certain conductivity, it contacts the inner wall of the receiving hole 4, which easily causes the distance between the circuit layer 22 of the circuit board 2 and the heat sink 3 to exceed the safe distance, affecting the normal use of the chip; of course, when making the receiving hole 4, the circuit layer 22 will not be exposed in the receiving hole 4, but it is necessary to ensure that the side wall of the receiving hole 4 is at a safe distance from the circuit layer 22 in the horizontal direction to ensure the working stability of the circuit board 2. However, when making the receiving hole 4, processing errors are inevitable. Therefore, in order to improve the working stability of the circuit board 2, a gap 8 is reserved between the boss 5 and the receiving hole 4 for filling with insulating material to completely isolate the boss 5 from the circuit layer 22 to prevent the boss 5 from conducting electricity with the circuit layer 22; like Figure 7 As shown, when the heat sink 3 and the circuit board 2 are pressed together, the moving mechanism 7 is completely separated from the positioning and clamping mechanism 6, and the position of the positioning and clamping mechanism 6 remains unchanged. When pressing together, pressure is applied to the upper part of the positioning and clamping mechanism 6. During this process, the positioning plate 61 is always located at the gap 8, ensuring that the position of the boss 5 and the accommodating hole 4 does not deviate; like Figure 8 As shown, after the heat sink 3 and the circuit board 2 are pressed together, the two are tightly combined, and then the moving mechanism 7 is connected to the positioning clamping mechanism 6, and the positioning clamping mechanism 6 is removed to form a gap 8 between the boss 5 and the receiving hole 4, so as to ensure the accuracy of the relative position of the boss 5 and the receiving hole 4 during the pressing process, and prevent the boss 5 from contacting the receiving hole 4; like Fig. 9 As shown, the gap 8 is filled with insulating material, which may be a thermally conductive insulating material, to form an insulating isolation layer 9, which effectively isolates the boss 5 from the circuit board 2, and then the component 1 is attached to the boss 5, and the component 1 is electrically connected to the circuit board 2.

[0046] like Figure 10-Figure 17 As shown, it is the second preparation process provided by the present invention: A process for preparing a chip with a heat dissipation structure, comprising: A receiving hole 4 is made on the circuit board 2 according to the size of the component 1; Connect the circuit board 2 to the heat sink 3; The component 1 is positioned and placed in the receiving hole 4 , and the component 1 is bonded to the heat sink 3 by means of thermally conductive solder.

[0047] In this preparation process, the circuit board 2 can be connected to the heat sink 3 first, and then the receiving hole 4 can be made, or the receiving hole 4 can be made first, and then the circuit board 2 can be connected to the heat sink 3; like Fig.10 and Fig.11 As shown, the circuit board 2 and the heat sink 3 are first connected by pressing, and then a receiving hole 4 is made on the circuit board 2. The insulating layer 21 of the circuit board 2 can be burned or reamed by laser or machine depth control to form the receiving hole 4, so that the heat sink 3 is exposed; like Fig.12 and Fig.13 As shown, firstly, a receiving hole 4 is made on the circuit board 2, and then the positioning clamping mechanism 6 is driven by the moving mechanism 7 to move the circuit board 2 and place it above the heat sink 3, and then the circuit board 2 and the heat sink 3 are pressed together. When the pressing connection is performed, the positioning clamping mechanism 6 does not need to be removed, and the pressure can be directly applied to the positioning clamping mechanism 6; Then, the component 1 is positioned and moved into the receiving hole 4 so that the component 1 and the heat sink 3 are connected by thermal conductive solder.

[0048] Further, the component 1 is positioned and placed in the receiving hole 4, and the component 1 is bonded to the heat sink 3 by means of a thermally conductive solder, including: The component 1 is clamped by using the positioning plate 61 on the positioning and clamping mechanism 6; The component 1 is positioned and moved to the top of the circuit board 2 by using the moving mechanism 7 connected to the positioning and clamping mechanism 6; The component 1 is driven downward by the moving mechanism 7 so that the component 1 is placed in the receiving hole 4, and the positioning plate 61 is inserted into the gap 8 between the component 1 and the receiving hole 4; wherein the receiving hole 4 is pre-arranged with thermal conductive solder; The thermally conductive solder is heated to connect the component 1 to the heat sink 3; After the component 1 is connected to the heat sink 3, the positioning and clamping mechanism 6 is separated from the circuit board 2 and the component 1, and a gap 8 is formed between the component 1 and the receiving hole 4; The gap 8 is filled with insulating material to form an insulating isolation layer 9 .

[0049] like Fig.14 As shown, the multiple positioning plates 61 of the positioning and clamping mechanism 6 are controlled to move away from each other so that the multiple positioning plates 61 can be sleeved on the outside of the component 1, and then the multiple positioning plates 61 are controlled to move closer to each other to clamp the component 1; like Fig.15 As shown, the component 1 is moved and placed in the receiving hole 4 by the moving mechanism 7, and the thermal conductive solder is pre-arranged in the receiving hole 4. After the component 1 is placed in place, the positioning plate 61 is located at the gap 8 between the component 1 and the receiving hole 4 to achieve the installation and positioning of the component 1. Then, the thermal conductive solder is heated, and the component 1 is welded to the heat sink 3. During the welding process, the positioning plate 61 limits the position of the component 1, and the position of the component 1 remains unchanged, ensuring the formation of the gap 8. like Fig.16 As shown, after the heat-conductive solder is solidified, the positioning clamping mechanism 6 is removed, and a gap 8 is formed; like Fig.17 As shown, an insulating material, which may be a thermally conductive insulating material, is filled into the gap 8 to form an insulating isolation layer 9; and then the component 1 is electrically connected to the circuit board 2 by wire bonding (or other electrical connection methods). The formed insulating isolation layer 9 can prevent the solder used in the electrical connection between the component 1 and the circuit board 2 from entering between the component 1 and the receiving hole 4, thereby causing the circuit board 2 and the heat sink 3 to form a conductive state, thereby ensuring the stability of the chip operation.

[0050] like Figure 18-Figure 20 As shown, in the two preparation processes of the present invention, the positioning clamping mechanism 6 includes: a positioning block 62, one side of which is provided with a plurality of slide grooves 63, a positioning plate 61 is slidably connected in the slide groove 63, the positioning plate 61 is connected to one side of the slide groove 63 through an elastic member 64, the other side opposite to the slide groove 63 is provided with a first electromagnet 65, and the surface of the positioning plate 61 is provided with a first permanent magnet that acts on the first electromagnet 65; The thickness of the positioning plate 61 corresponds to the gap 8 formed by inserting the component into the accommodating hole 4, and a guide surface is provided at the bottom end of the positioning plate 61; wherein the component is a boss 5 or a component 1; A groove 66 is provided on one side of the positioning block 62 connected to the moving mechanism 7, a second permanent magnet 67 is provided in the groove 66, a connecting block 71 corresponding to the groove 66 is provided on the moving mechanism 7, and a second electromagnet 72 corresponding to the second permanent magnet 67 is provided on the connecting block 71, and the connection and separation of the positioning and clamping mechanism 6 and the moving mechanism 7 are realized by controlling the second electromagnet 72; For example, when the second electromagnet 72 is energized, it attracts the second permanent magnet 67 to realize the connection between the positioning and clamping mechanism 6 and the moving mechanism 7. When the second electromagnet 72 is energized, it repels the second permanent magnet 67 (or when the second electromagnet 72 is de-energized, it has no effect on the second permanent magnet 67), realizing the separation of the positioning and clamping mechanism 6 and the moving mechanism 7.

[0051] A plurality of first magnetic sheets 68 are further provided on one side of the positioning block 62 connected to the moving mechanism 7. A second magnetic sheet 73 that is attracted to the first magnetic sheet 68 is provided on the moving mechanism 7. The first magnetic sheet 68 is electrically connected to the first electromagnet 65. After the first magnetic sheet 68 and the second magnetic sheet 73 are in contact, the first electromagnet 65 can be controlled to work by the built-in control module of the moving mechanism 7. The first electromagnet 65 is controlled by a control module built into the moving mechanism 7 , and the electrical connection between the two is achieved through the contact between the first magnetic attraction sheet 68 and the second magnetic attraction sheet 73 .

[0052] The positioning block 62 is also provided with a plurality of pressure sensors 69 on one side away from the moving mechanism 7, which are used to detect the contact pressure between the circuit board 2 or the component 1 and the positioning block 62; the pressure sensors 69 can detect whether the circuit board 2 or the component 1 is clamped or placed in place when the positioning clamping mechanism 6 clamps or places the circuit board 2 or the component 1; For example, when clamping, when the pressure values ​​detected by the multiple pressure sensors 69 are all greater than the first set value, it indicates effective clamping, otherwise, the position is adjusted to clamp again; During placement, when the pressure values ​​detected by the multiple pressure sensors 69 are all greater than the second set value, it indicates that it is placed in place, otherwise, the position is adjusted and placed again; the second set value is greater than the first set value.

[0053] In the first preparation process, the elastic member 64 is a tension spring, and the first electromagnet 65 has an adsorption effect on the positioning plate 61 after being energized, so that the multiple positioning plates 61 are close to each other and then inserted into the receiving hole 4 of the circuit board 2; when the first electromagnet 65 is powered off, there is no adsorption effect on the positioning plate 61, and under the action of the tension spring, the multiple positioning plates 61 are in close contact with the inner wall of the receiving hole 4 to achieve clamping of the circuit board 2.

[0054] In the second preparation process, when only the component 1 is clamped (first the circuit board 2 and the heat sink 3 are pressed together, and then the receiving hole 4 is made), the elastic member 64 is a compression spring, and the first electromagnet 65 is energized to produce a repulsive effect on the positioning plates 61, so that the multiple positioning plates 61 are separated from each other, and then the component 1 is placed between the multiple positioning plates 61; when the first electromagnet 65 is powered off, it has no effect on the positioning plates 61, and under the action of the compression spring, the multiple positioning plates 61 are in close contact with the side of the component 1 to achieve the clamping of the component 1; In the second preparation process, when both the circuit board 2 and the component 1 need to be clamped (first make the accommodating hole 4, and then press the circuit board 2 and the heat sink 3), when the elastic member 64 is a tension spring, the principle of clamping the circuit board 2 is the same as above; when clamping the component 1, first place a plurality of positioning plates 61 outside the component 1, and then the first electromagnet 65 is energized to produce an adsorption effect on the positioning plates 61, so that the plurality of positioning plates 61 are close to each other, and the component 1 is clamped; In the second preparation process, when both the circuit board 2 and the component 1 need to be clamped (first make the accommodating hole 4, and then press the circuit board 2 and the heat sink 3), when the elastic member 64 is a compression spring, the principle of clamping the component 1 is the same as above; when clamping the circuit board 2, first place a plurality of positioning plates 61 in the accommodating hole 4, and then the first electromagnet 65 is energized to generate a repulsive effect on the positioning plates 61, so that the plurality of positioning plates 61 move away from each other, and the circuit board 2 is clamped.

[0055] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and implementation modes. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the present invention, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A chip with a heat dissipation structure, characterized in that: include: A component (1), a circuit board (2) and a heat sink (3), wherein the component (1) and the circuit board (2) are respectively connected to the heat sink (3); a receiving hole (4) is provided on the circuit board (2), the component (1) is correspondingly arranged at the receiving hole (4), and the component (1) is connected to at least a portion of the heat sink (3).

2. The chip with a heat dissipation structure according to claim 1, characterized in that: The circuit board (2) comprises: an insulating layer (21) and a circuit layer (22) connected to each other, the component (1) is electrically connected to the circuit layer (22), and the heat sink (3) is connected to the insulating layer (21).

3. The chip with a heat dissipation structure according to claim 1, characterized in that: The radiator (3) is provided with a heat dissipation channel (31), and the heat dissipation medium passing through the heat dissipation channel (31) is gas or liquid.

4. The chip with a heat dissipation structure according to claim 1, characterized in that: A boss (5) is extended from the heat sink (3), the boss (5) is arranged in the receiving hole (4), and the boss (5) is connected to the component (1).

5. The chip with a heat dissipation structure according to claim 1, characterized in that: The component (1) is arranged in the accommodating hole (4), and is connected to the heat sink (3).

6. A process for preparing a chip with a heat dissipation structure, characterized in that: A method for preparing a chip with a heat dissipation structure according to claim 4, comprising: Covering the target area on the surface of the heat sink (3) where the boss (5) is to be formed with a dry film; According to the thickness of the circuit board (2) and the size of the component (1), the surface of the heat sink (3) is etched to produce a boss (5); According to the size of the boss (5), a receiving hole (4) is made on the circuit board (2); The boss (5) of the heat sink (3) is positioned and sleeved into the receiving hole (4) of the circuit board (2), and the heat sink (3) and the circuit board (2) are pressed together; The component (1) is bonded to the boss (5), and the component (1) is electrically connected to the circuit layer (22) of the circuit board (2).

7. The process for preparing a chip with a heat dissipation structure according to claim 6, characterized in that: The boss (5) of the heat sink (3) is positioned and sleeved into the receiving hole (4) of the circuit board (2), and the heat sink (3) and the circuit board (2) are pressed together, including: Inserting the positioning plate (61) on the positioning and clamping mechanism (6) into the accommodating hole (4) to clamp the circuit board (2); Using a moving mechanism (7) connected to a positioning and clamping mechanism (6) to position and move the circuit board (2) to above the boss (5); The circuit board (2) is driven downward by the moving mechanism (7), so that the boss (5) is inserted into the receiving hole (4), and the positioning plate (61) is inserted into the gap (8) between the boss (5) and the receiving hole (4); The moving mechanism (7) is disconnected from the positioning and clamping mechanism (6), and the circuit board (2) and the heat sink (3) are pressed together; After the pressing is completed, the moving mechanism (7) is connected to the positioning and clamping mechanism (6), and the positioning and clamping mechanism (6) is controlled to be separated from the circuit board (2) and the heat sink (3).

8. The process for preparing a chip with a heat dissipation structure according to claim 7, characterized in that: Before the component (1) is bonded to the boss (5), the method further includes: After the circuit board (2) and the heat sink (3) are pressed together, a gap (8) is formed between the boss (5) and the receiving hole (4), and an insulating material is filled into the gap (8) to form an insulating isolation layer (9).

9. A process for preparing a chip with a heat dissipation structure, characterized in that: A method for preparing a chip with a heat dissipation structure according to claim 5, comprising: Making a receiving hole (4) on the circuit board (2) according to the size of the component (1); Connecting the circuit board (2) to the heat sink (3); The component (1) is positioned and placed in the receiving hole (4), and the component (1) is bonded to the heat sink (3) by means of thermally conductive solder.

10. The process for preparing a chip with a heat dissipation structure according to claim 9, characterized in that: Positioning the component (1) in the receiving hole (4), and bonding the component (1) to the heat sink (3) by means of thermally conductive solder, including: Using a positioning plate (61) on a positioning and clamping mechanism (6) to clamp the component (1); Using a moving mechanism (7) connected to the positioning and clamping mechanism (6) to position and move the component (1) to above the circuit board (2); The component (1) is driven downward by the moving mechanism (7) so that the component (1) is placed in the receiving hole (4), and the positioning plate (61) is inserted into the gap (8) between the component (1) and the receiving hole (4); wherein heat-conducting solder is pre-arranged in the receiving hole (4); Heating the thermally conductive solder to connect the component (1) to the heat sink (3); After the component (1) is connected to the heat sink (3), the positioning clamping mechanism (6) is separated from the circuit board (2) and the component (1), so that a gap (8) is formed between the component (1) and the receiving hole (4); The gap (8) is filled with insulating material to form an insulating isolation layer (9).

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