Manufacturing method of metal-based circuit board and metal-based circuit board

Abstract

The invention discloses a manufacturing method of a metal-based circuit board and the metal-based circuit board. The metal-based circuit board comprises a main board and an outer board, the mainboard comprises a signal transmission layer located on the uppermost layer and a wiring part located on the inner layer. The outer plate is arranged on the signal transmission layer and comprises a first bonding pad part and a second bonding pad part, and the first bonding pad part is used for welding a chip; the signal transmission layer is provided with a chip guide column and an output part, the chip guide column is electrically connected with the first bonding pad part, and the output part is electrically connected with the second bonding pad part; the output part comprises a ring block and an output block which are connected, the ring block is sleeved outside the chip guide pillar at an interval, the output block is electrically connected with the second bonding pad part, and the chip guide pillar is electrically connected with the ring block through the wiring part. On one hand, when the chip works, heat at the bottom of the chip can be transmitted to the ring block and transmitted to the second bonding pad part through the output part for heat dissipation so as to improve the overall heat dissipation capability, and on the other hand, the ring block is equivalent to an external shielding layer of a chip guide pillar, so that external electromagnetic interference is reduced, and the stability of signal transmission is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board structures, and in particular to a method for manufacturing a metal-based circuit board and a metal-based circuit board. Background Art

[0002] Metal-based circuit boards are a type of circuit board that adds a metal substrate to an ordinary printed circuit board to enhance thermal conductivity. Compared with traditional non-metallic substrate circuit boards, metal-based circuit boards usually use aluminum, copper or other metals with high thermal conductivity as substrates to improve heat dissipation capabilities. They are widely used in high-power LEDs, power electronic modules, radio frequency communication equipment and other fields. At the same time, in conventional metal-based circuit board designs, metal is usually used as the bottom substrate, and an insulating layer and a signal transmission layer are laid on top of it, so that the circuit can be laid on the metal substrate, and the signal transmission layer is protected by an insulating medium to ensure signal integrity and reduce electromagnetic interference.

[0003] In the actual operation of high-power LEDs, power electronic modules, and radio frequency communication equipment, their high-power devices will generate a large amount of heat, especially the contact surface between the circuit board and the high-power device, which is very easy to accumulate heat and the heat dissipation efficiency is still limited; at the same time, in the existing metal-based circuit board design, a shielding layer is usually added to reduce electromagnetic interference, but the introduction of the shielding layer is often difficult to take into account the heat dissipation requirements, and the simultaneous use of both is not conducive to the miniaturization of the above structure.

[0004] Therefore, existing metal-based circuit boards face the technical problem of having difficulty balancing heat dissipation and signal stability in practical applications. Summary of the invention

[0005] The object of the present invention is to provide a method for manufacturing a metal-based circuit board and a metal-based circuit board, so as to solve the problem that the existing metal-based circuit boards are difficult to balance heat dissipation and signal stability in practical applications.

[0006] To achieve this object, the present invention adopts the following technical solutions: A metal-based circuit board, comprising: A mainboard, the mainboard comprising a signal transmission layer located at the top layer and a wiring portion located at the inner layer; An outer plate, the outer plate is arranged on the signal transmission layer, and comprises a first pad portion and a second pad portion, the first pad portion is used for welding a chip, and the second pad portion is used for outputting a signal; The signal transmission layer is provided with a chip guide column and an output portion, the chip guide column is electrically connected to the first pad portion, and the output portion is electrically connected to the second pad portion; The output part includes a ring block and an output block connected to each other. The ring block is sleeved outside the chip guide column at intervals. The output block is electrically connected to the second pad part. The chip guide column is electrically connected to the ring block through the routing part.

[0007] Optionally, the outer plate includes an insulating layer and a metal layer sequentially arranged in a direction away from the signal transmission layer, and the first pad portion and the second pad portion are arranged on the metal layer; The insulating layer is provided with a first metal connection portion at a position corresponding to the first pad portion and the chip guide column, and the insulating layer is provided with a second metal connection portion at a position corresponding to the output block and the second pad portion; the first metal connection portion is electrically connected to the first pad portion and the chip guide column respectively; the second metal connection portion is electrically connected to the output block and the second pad portion respectively.

[0008] Optionally, the lower surface area of ​​the first metal connection portion is smaller than the upper surface area of ​​the chip guide column, and the lower surface area of ​​the second metal connection portion is smaller than the upper surface area of ​​the output block.

[0009] Optionally, the end of the first metal connection portion close to the first pad portion is the first end, and the end of the first metal connection portion close to the chip guide column is the second end; the area of ​​the second end is smaller than the area of ​​the first end.

[0010] Optionally, the first metal connection portion includes a first metal block and a second metal block, the thermal expansion coefficient of the first metal block is greater than the thermal expansion coefficient of the second metal block, and the first pad portion and the first metal block are integrally formed and have the same thermal expansion coefficient; Along the direction close to the chip guide column, the first pad portion, the first metal block and the second metal block are arranged in sequence.

[0011] Optionally, the end of the second metal connection portion close to the output block is the third end, and the end of the second metal connection portion close to the second pad portion is the fourth end; the area of ​​the fourth end is smaller than the area of ​​the third end.

[0012] Optionally, the second metal connection portion includes a third metal block and a fourth metal block, the thermal expansion coefficient of the fourth metal block is greater than the thermal expansion coefficient of the third metal block, and the fourth metal block and the second pad portion are integrally formed and have the same thermal expansion coefficient; The third metal block is electrically connected to the output block and to the fourth metal block.

[0013] Optionally, a first pad filling groove is opened in the metal layer at a position corresponding to the first pad portion, the first pad filling groove is filled with a first insulating ring, and the first pad portion is arranged in the first insulating ring; A second pad filling groove is formed on the metal layer at a position corresponding to the second pad portion, the second pad filling groove is filled with a second insulating ring, and the second pad portion is arranged in the second insulating ring.

[0014] A method for manufacturing a metal-based circuit board, used for preparing the metal-based circuit board as described above, comprising: A mainboard is provided, the mainboard comprising a signal transmission layer located at the top layer and a wiring part located at the inner layer; a chip guide column and an output part are arranged on the signal transmission layer, the output part comprises a ring block and an output block connected to each other, and the ring block is sleeved outside the chip guide column at intervals; Providing an external board, the external board comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal; The outer plate is arranged on the signal transmission layer, the chip guide column is electrically connected to the first pad portion, and the output block is electrically connected to the second pad portion.

[0015] Optionally, providing a mainboard includes: A first groove is formed in the signal transmission layer corresponding to the chip guide column, and a second groove is formed in the signal transmission layer corresponding to the output portion; The first groove is filled with conductive material to form a chip guide column; the second groove is filled with conductive material to form an output portion.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The manufacturing method of the metal-based circuit board and the metal-based circuit board provided by the present invention are achieved by arranging an outer plate above the main board, and arranging a chip guide column and an output part on the signal transmission layer, and the output part includes a connected ring block and an output block, and the ring block is arranged outside the chip guide column at intervals. On the one hand, when the chip is working, the heat at the bottom of the chip can be transferred to the ring block, and then transferred to the second pad part through the output part for heat dissipation, so as to improve the overall heat dissipation capacity. On the other hand, the ring block is arranged outside the chip guide column, and the ring block is equivalent to the external shielding layer of the chip guide column, which can reduce external electromagnetic interference, isolate the chip guide column from the surrounding circuit, so as to reduce crosstalk, so as to improve the stability of signal transmission. In summary, the manufacturing method of the metal-based circuit board and the metal-based circuit board provided by the present invention have the advantages of strong heat dissipation and high signal stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 is a schematic diagram of a first processing structure of an outer plate in an embodiment of the present invention; Figure 2 is a schematic diagram of a second processing structure of an outer plate in an embodiment of the present invention; Figure 3 is a schematic diagram of a third processing structure of an outer plate in an embodiment of the present invention; Figure 4 is a schematic diagram of a fourth processing structure of an outer plate in an embodiment of the present invention; Figure 5 is a schematic diagram of a fifth processing structure of an outer plate in an embodiment of the present invention; Figure 6 is a schematic diagram of a sixth processing structure of an outer plate in an embodiment of the present invention; Figure 7 is a schematic diagram of the overall structure of the outer plate in an embodiment of the present invention; Figure 8 A schematic diagram of the overall structure of a metal-based circuit board provided in an embodiment of the present invention; Fig. 9 for Figure 8 Schematic diagram of the cross-sectional structure along AA; Illustration: 100, main board; 110, signal transmission layer; 120, chip guide pillar; 130, output part; 131, ring block; 132, output block; 200, outer plate; 201, insulating layer; 202, metal layer; 203, first pad filling groove; 204, second pad filling groove; 205, laser hole; 206, etched hole; 207, through hole; 210, first pad portion; 220, second pad portion; 230, first metal connection part; 231, first end part; 232, second end part; 233, first metal block; 234, second metal block; 240, second metal connection part; 241, third end part; 242, fourth end part; 243, third metal block; 244, fourth metal block; 300, chip. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: The present invention provides a metal-based circuit board, aiming to solve the technical problem that the metal-based circuit board in the prior art is difficult to balance in terms of heat dissipation and signal stability. Through the improvement of the technical solution of the present invention, the metal-based circuit board can not only significantly improve the heat dissipation efficiency, but also effectively reduce electromagnetic interference and improve the stability of signal transmission.

[0024] like Figure 8 and Fig. 9As shown, the metal-based circuit board provided in this embodiment includes a main board 100 and an outer board 200; the main board 100 includes a signal transmission layer 110 located at the top layer and a routing portion located at the inner layer; wherein the routing portion may include routing layers and substrate layers arranged alternately, the material of the substrate layer is not limited, including but not limited to resin, metal, etc., the routing layer may be selected from metals such as copper wire and silver wire, and the lines between different routing layers may be electrically connected through a via structure when they need to be connected, the signal transmission layer 110 is the top layer of the main board 100, which is arranged on the substrate layer, and is specifically provided with a chip guide column 120 and an output portion 130, the output portion 130 includes a ring block 131 and an output block 132 connected to each other, and the ring block 131 is sleeved on the chip guide column 120 at intervals. In addition, there is no restriction on the forming method of the chip guide pillar 120 and the output part 130, which can be formed by opening a groove on the signal transmission layer 110 and then filling it with conductive material; it should be noted that the chip guide pillar 120 is used as the signal input of the chip 300, the wiring layer is used to process the signal of the chip 300, and the output part 130 can output the processed signal, and the output object is determined according to the design, for example: in the power circuit board application, the output part 130 can be used to drive power switching devices such as MOSFET or IGBT to ensure efficient control of current; the output part 130 can also be used in a high-frequency signal transmission system, and the output part 130 is connected to a high-speed signal channel to reduce signal loss and increase the transmission rate.

[0025] The outer plate 200 is arranged on the signal transmission layer 110, and includes a first pad portion 210 and a second pad portion 220. The first pad portion 210 is used to weld the chip 300, and the second pad portion 220 is used to output signals; correspondingly, the chip guide column 120 is electrically connected to the first pad portion 210, the chip guide column 120 is electrically connected to the ring block 131 through the routing portion, and the output block 132 is electrically connected to the second pad portion 220, that is, the output portion 130 is electrically connected to the second pad portion 220.

[0026] Specifically, an outer plate 200 is arranged above the main board 100, and a chip guide column 120 and an output part 130 are arranged on the signal transmission layer 110, and the output part 130 includes a connected ring block 131 and an output block 132, and the ring block 131 is arranged at intervals outside the chip guide column 120. On the one hand, when the chip is working, the heat at the bottom can be transferred to the ring block 131, and then transferred to the second pad part 220 through the output part 130 for heat dissipation, so as to improve the overall heat dissipation capacity. On the other hand, the ring block 131 is arranged outside the chip guide column 120, and the ring block 131 is equivalent to the external shielding layer of the chip guide column 120, which can reduce external electromagnetic interference and isolate the chip guide column 120 from the surrounding circuits to reduce crosstalk, so as to improve the stability of signal transmission. In summary, the metal-based circuit board provided in the embodiment of the present invention has the advantages of strong heat dissipation and high signal stability.

[0027] Furthermore, if Figures 1 to 8 As shown, the outer plate 200 includes an insulating layer 201 and a metal layer 202 which are sequentially arranged in a direction away from the signal transmission layer 110, and a first pad portion 210 and a second pad portion 220 are arranged on the metal layer 202; a first metal connecting portion 230 is arranged on the insulating layer 201 at a position corresponding to the first pad portion 210 and the chip guide column 120, and a second metal connecting portion 240 is arranged on the insulating layer 201 at a position corresponding to the output block 132 and the second pad portion 220; the first metal connecting portion 230 is electrically connected to the first pad portion 210 and the chip guide column 120, respectively; and the second metal connecting portion 240 is electrically connected to the output block 132 and the second pad portion 220, respectively.

[0028] It can be understood that the metal layer 202, as an important component of the heat dissipation path, enhances the overall heat dissipation capacity. The high thermal conductivity of the metal material itself ensures that the heat generated by the chip 300 or other high-power components can be quickly transferred to the outside; at the same time, with the arrangement of the first metal connection part 230, the chip guide column 120, the output part 130 and the second metal connection part 240 and other structures, the heat can be effectively transferred from the inside of the circuit board to the outside, especially the heat accumulated on the bonding surface of the chip 300 and the outer plate 200, thereby improving the overall heat dissipation performance of the circuit board and ensuring the stability of the chip 300 when working at high power.

[0029] Furthermore, the lower surface area of ​​the first metal connection part 230 is smaller than the upper surface area of ​​the chip guide pillar 120, and the lower surface area of ​​the second metal connection part 240 is smaller than the upper surface area of ​​the output block 132. It can be understood that in the process of mounting the outer plate 200 on the main board 100, the smaller metal connection part helps to reduce electromagnetic radiation by reducing the area of ​​the current path, and at the same time, under the action of the ring block 131, it further shields external electromagnetic interference, effectively improves electromagnetic compatibility, reduces the impact of external interference on circuit board signal transmission, and ensures high stability and high quality signal transmission.

[0030] As an optional implementation, Figure 7 As shown, the end of the first metal connection part 230 close to the first pad part 210 is the first end 231, and the end of the first metal connection part 230 close to the chip guide pillar 120 is the second end 232; the area of ​​the second end 232 is smaller than the area of ​​the first end 231. When the temperature rises, the smaller area of ​​the second end 232 can reduce the stress concentration caused by expansion, prevent the damage or deformation between the first metal connection part 230 and the chip guide pillar 120, thereby improving the reliability of the metal-based circuit board.

[0031] More specifically, the first metal connection part 230 includes a first metal block 233 and a second metal block 234. The thermal expansion coefficient of the first metal block 233 is greater than that of the second metal block 234, and the first pad part 210 and the first metal block 233 are integrally formed and have the same thermal expansion coefficient. In the direction close to the chip guide column 120, the first pad part 210, the first metal block 233 and the second metal block 234 are sequentially arranged. At this time, the first metal block 233 is equivalent to the first end 231, and the second metal block 234 is equivalent to the second end 232. It can be understood that since the thermal expansion coefficient of the first metal block 233 is greater than that of the second metal block 234, the first metal block 233 will produce a greater volume expansion when the temperature rises, so that in a high-temperature operating environment, the first metal block 233 can apply extrusion stress to the direction of the second metal block 234, which helps to maintain close contact of the metal connection parts and prevent loosening or poor contact due to temperature changes. Furthermore, the first pad portion 210 and the first metal block 233 are integrally formed and have the same thermal expansion coefficient, thereby reducing the stress difference caused by thermal expansion and preventing interface fracture between the pad and the metal block.

[0032] As an optional implementation, Figure 7 As shown, the end of the second metal connection part 240 close to the output block 132 is the third end 241, and the end of the second metal connection part 240 close to the second pad part 220 is the fourth end 242; the area of ​​the fourth end 242 is smaller than the area of ​​the third end 241. The smaller fourth end 242 can form a finer current density at the contact point, which helps to reduce the contact resistance and improve the stability of the contact, especially in the process of high-frequency signal transmission, reducing signal loss.

[0033] In addition, on the basis that both the first metal connection part 230 and the second metal connection part 240 adopt the above-mentioned special-shaped structure, in this embodiment, the heat is transferred along the direction of the first pad part 210, the first metal connection part 230, the chip guide column 120, the output part 130, the second metal connection part 240, and the second pad part 220. With the setting of the first metal connection part 230 being "wide at the top and narrow at the bottom" and the second metal connection part 240 being "narrow at the top and wide at the bottom", the first metal connection part 230 can provide a larger contact area, thereby enhancing the heat conduction capability to the chip 300, especially near the chip guide column 120 and the first pad part 2 The portion 10 can better guide the heat generated by the chip to transfer outward; the second metal connection part 240 optimizes the heat dissipation. For the heat accumulated on the bottom of the chip 300, the first part can be directly dissipated through the metal layer 202, and the second part is transferred in the direction of the first pad part 210, the first metal connection part 230, the chip guide column 120, the output part 130, the second metal connection part 240, and the second pad part 220. The heat of the second part is lower than that of the first part. The setting of the second metal connection part 240 helps to concentrate the distribution of heat, thereby balancing the overall heat distribution and improving the stability of the metal-based circuit board.

[0034] More specifically, the second metal connection part 240 includes a third metal block 243 and a fourth metal block 244. The thermal expansion coefficient of the fourth metal block 244 is greater than that of the third metal block 243, and the fourth metal block 244 is integrally formed with the second pad part 220 and has the same thermal expansion coefficient. The third metal block 243 is electrically connected to the output block 132 and to the fourth metal block 244. Exemplarily, there are two third metal blocks 243, which are arranged at intervals. The cross section of the third metal block 243 is a regular trapezoid. The fourth metal block 244 is arranged between the two third metal blocks 243, and the cross section of the fourth metal block 244 is an inverted trapezoid. At this time, the wide part of the third metal block 243 is equivalent to the third end 241, and the wide part of the fourth metal block 244 and the narrow part of the third metal block 243 are equivalent to the fourth end 242. Specific analysis: the fourth metal block 244 will expand more when the temperature rises. In addition, the contact surface between the fourth metal block 244 and the third metal block 243 is an inclined surface, so that the third metal block 243 is squeezed by the fourth metal block 244 in both the horizontal and vertical directions. The second pad part 220 squeezes the third metal block 243 in the vertical direction to avoid pressure concentration on a single contact point, but evenly distributes it on the contact surface, thereby alleviating the problem of excessive local stress caused by thermal stress. At the same time, through the pressure caused by the difference in thermal expansion, the third metal block 243 and the fourth metal block 244 maintain close contact to further reduce electromagnetic radiation, and the stable connection between the metal blocks effectively shields external electromagnetic interference, thereby improving the electromagnetic compatibility of the circuit and ensuring the stability of signal transmission.

[0035] Furthermore, the narrow portion of the fourth metal block 244 is embedded between the narrow portions of the two third metal blocks 243 to form a through hole 207. The through hole 207 is provided so that the fourth metal block 244 does not directly contact the output block 132. On the basis of the above-mentioned embodiment, the metal layer 202 is provided with a first pad filling groove 203 at a position corresponding to the first pad portion 210, the first pad filling groove 203 is filled with a first insulating ring (not shown), and the first pad portion 210 is arranged in the first insulating ring; the metal layer 202 is provided with a second pad filling groove 204 at a position corresponding to the second pad portion 220, the second pad filling groove 204 is filled with a second insulating ring (not shown), and the second pad portion 220 is arranged in the second insulating ring. The above-mentioned insulating ring can be formed on the groove wall of the filling groove in the form of a plating layer, and can also be provided in the form of pre-forming the insulating ring and then embedding the insulating ring into the filling groove, which is not limited in this embodiment.

[0036] Embodiment 2: The method for manufacturing a metal-based circuit board provided in this embodiment is used to prepare the metal-based circuit board in Embodiment 1, and comprises: Step S100, providing a mainboard 100, the mainboard 100 includes a signal transmission layer 110 located at the top layer and a wiring part located at the inner layer; a chip guide pillar 120 and an output part 130 are provided on the signal transmission layer 110, the output part 130 includes a ring block 131 and an output block 132 connected to each other, and the ring block 131 is sleeved outside the chip guide pillar 120 at intervals; Step S200, providing an outer plate 200, the outer plate 200 comprising a first pad portion 210 and a second pad portion 220, the first pad portion 210 is used for soldering a chip, and the second pad portion 220 is used for outputting a signal; Step S300 , disposing the outer plate 200 on the signal transmission layer 110 , electrically connecting the chip guide pillar 120 to the first pad portion 210 , and electrically connecting the output block 132 to the second pad portion 220 .

[0037] Further, the main board 100 includes: Step S101, a first groove is formed in the signal transmission layer 110 corresponding to the chip guide pillar 120, and a second groove is formed in the output portion 130; wherein the signal transmission layer 110 may be made of insulating material, thereby leaving insulating material between the first groove (circular groove) and the second groove (including the annular groove partially arranged outside the circular groove); thereby enabling the subsequent ring block 131 to be arranged around the chip guide pillar 120 through the insulating material, so as to improve the stability of the chip 300 when inputting signals to the chip guide pillar 120; S102 , filling the first groove with a conductive material to form a chip guide column 120 ; and filling the second groove with a conductive material to form an output portion 130 .

[0038] Further, providing the outer panel 200 includes: Step S201: Figure 1 As shown, a stacked insulating layer 201 and a metal layer 202 are provided, and a laser hole 205 is opened on the metal layer 202 at the position corresponding to the two third metal blocks 243 of the second metal connecting part 240, the cross section of the laser hole 205 is arranged in a trapezoidal shape, and the two laser holes 205 corresponding to the second metal connecting part 240 are connected by a channel on the surface of the insulating layer 201, and the channel is arranged corresponding to the through hole 207, and the depth of the channel is less than the depth of the laser hole 205; Step S202: Figure 2 As shown, the first metal material is filled at the position of the laser hole 205 and the channel to form two connected third metal blocks 243; Step S203: Figure 3 As shown, the insulating layer 201 and the metal layer 202 are turned over so that the metal layer 202 faces upward; a first pad filling groove 203 and a second pad filling groove 204 are opened on the metal layer 202, and the opening method includes but is not limited to laser processing, mechanical processing, etc.; Next, an etching hole 206 is formed between two third metal blocks 243 by etching on the bottom wall of the second pad filling groove 204; Next, another laser hole 205 corresponding to the first metal connection portion 230 is opened on the bottom wall of the first pad filling groove 203 by laser processing; Step S204: Figure 4 As shown, in the laser hole 205 corresponding to the first metal connection part 230, a second metal block 234 is deposited or set; it should be supplemented that before depositing or setting the second metal block 234, a pad needs to be set at the insulating layer 201 to temporarily support the second metal block 234; the second metal material is filled in the etched hole 206 and the second pad filling groove 204 to form an integrally formed fourth metal block 244 and the second pad part 220; wherein the second metal block 234 is selected from the first metal material, the thermal expansion coefficient of the first metal material is less than the thermal expansion coefficient of the second metal material, and optionally, the first metal material is gold and the second metal material is copper; or, the first metal material is copper and the second metal material is silver; Step S205: Figure 5 As shown, the second metal material is filled in the laser hole 205 and the first pad filling groove 203 corresponding to the first metal connection part 230 to form the first metal block 233 and the first pad part 210; Step S206: Figure 6 As shown, the spacer is removed, and a through hole 207 is opened at a position corresponding to the channel on one side of the insulating layer 201 to obtain the outer plate 200.

[0039] It should be noted that the fourth metal block 244 and the second pad portion 220 are filled and formed based on the etched hole 206, and the etched hole 206 is located between the two third metal blocks 243, which can improve the connection stability among the three; similarly, the first metal block 233 and the first pad portion 210 are filled and formed based on the laser hole 205 provided in the second metal block 234, which can improve the connection stability among the three.

[0040] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A metal-based circuit board, characterized in that: include: A mainboard, the mainboard comprising a signal transmission layer located at the top layer and a wiring portion located at the inner layer; An outer plate, the outer plate is arranged on the signal transmission layer, and comprises a first pad portion and a second pad portion, the first pad portion is used for welding a chip, and the second pad portion is used for outputting a signal; The signal transmission layer is provided with a chip guide column and an output portion, the chip guide column is electrically connected to the first pad portion, and the output portion is electrically connected to the second pad portion; The output part includes a ring block and an output block connected to each other. The ring block is sleeved outside the chip guide column at intervals. The output block is electrically connected to the second pad part. The chip guide column is electrically connected to the ring block through the routing part.

2. The metal-based circuit board according to claim 1, characterized in that: The outer plate comprises an insulating layer and a metal layer which are sequentially arranged in a direction away from the signal transmission layer, and the first pad portion and the second pad portion are arranged on the metal layer; The insulating layer is provided with a first metal connection portion at a position corresponding to the first pad portion and the chip guide column, and the insulating layer is provided with a second metal connection portion at a position corresponding to the output block and the second pad portion; the first metal connection portion is electrically connected to the first pad portion and the chip guide column respectively; the second metal connection portion is electrically connected to the output block and the second pad portion respectively.

3. The metal-based circuit board according to claim 2, characterized in that: The lower surface area of ​​the first metal connection portion is smaller than the upper surface area of ​​the chip guide column, and the lower surface area of ​​the second metal connection portion is smaller than the upper surface area of ​​the output block.

4. The metal-based circuit board according to claim 2, characterized in that: The end of the first metal connection portion close to the first pad portion is a first end portion, and the end of the first metal connection portion close to the chip guide column is a second end portion; the area of ​​the second end portion is smaller than the area of ​​the first end portion.

5. The metal-based circuit board according to claim 2, characterized in that: The first metal connection portion includes a first metal block and a second metal block, the thermal expansion coefficient of the first metal block is greater than the thermal expansion coefficient of the second metal block, and the first pad portion and the first metal block are integrally formed and have the same thermal expansion coefficient; Along the direction close to the chip guide column, the first pad portion, the first metal block and the second metal block are arranged in sequence.

6. The metal-based circuit board according to claim 2, characterized in that: The end of the second metal connection portion close to the output block is the third end, and the end of the second metal connection portion close to the second pad portion is the fourth end; the area of ​​the fourth end is smaller than the area of ​​the third end.

7. The metal-based circuit board according to claim 6, characterized in that: The second metal connection portion includes a third metal block and a fourth metal block, the thermal expansion coefficient of the fourth metal block is greater than the thermal expansion coefficient of the third metal block, and the fourth metal block and the second pad portion are integrally formed and have the same thermal expansion coefficient; The third metal block is electrically connected to the output block and to the fourth metal block.

8. A metal-based circuit board according to any one of claims 2 to 7, characterized in that: A first pad filling groove is formed in the metal layer at a position corresponding to the first pad portion, the first pad filling groove is filled with a first insulating ring, and the first pad portion is arranged in the first insulating ring; A second pad filling groove is formed in the metal layer at a position corresponding to the second pad portion, the second pad filling groove is filled with a second insulating ring, and the second pad portion is arranged in the second insulating ring.

9. A method for manufacturing a metal-based circuit board, characterized in that: For preparing a metal-based circuit board as claimed in any one of claims 1 to 8, comprising: A mainboard is provided, the mainboard comprising a signal transmission layer located at the top layer and a wiring part located at the inner layer; a chip guide column and an output part are arranged on the signal transmission layer, the output part comprises a ring block and an output block connected to each other, and the ring block is sleeved outside the chip guide column at intervals; Providing an external board, the external board comprising a first pad portion and a second pad portion, the first pad portion being used for soldering a chip, and the second pad portion being used for outputting a signal; The outer plate is arranged on the signal transmission layer, the chip guide column is electrically connected to the first pad portion, and the output block is electrically connected to the second pad portion.

10. The method for manufacturing a metal-based circuit board according to claim 9, characterized in that: The mainboard provided comprises: A first groove is formed in the signal transmission layer corresponding to the chip guide column, and a second groove is formed in the signal transmission layer corresponding to the output portion; The first groove is filled with conductive material to form a chip guide column; the second groove is filled with conductive material to form an output portion.

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