Packaging method and system of four-end laminated assembly

Abstract

The invention belongs to the technical field of packaging, and provides a packaging method and system for a four-end laminated assembly, and the method comprises the steps: obtaining front plate glass; preparing a semitransparent perovskite assembly based on the front plate glass; bus bars are led out from the two ends of the semitransparent perovskite assembly to gather and lead out the positive electrode and the negative electrode of the semitransparent perovskite assembly; preparing a crystalline silicon cell string; laying a front adhesive film layer at the bottom of the crystalline silicon cell string; sequentially laying the laminated crystalline silicon cell string, the rear adhesive film layer and the back plate at the bottom of the semitransparent perovskite assembly to obtain a primary packaging structure of the four-end laminated assembly; and performing low-temperature lamination processing on the initial packaging structure of the four-end laminated assembly to obtain the prepared packaging structure of the four-end laminated assembly. The photoelectric conversion efficiency of the packaging structure of the crystalline silicon cell can be effectively improved.

Description

Technical Field

[0001] The present disclosure belongs to the field of packaging technology, and in particular, relates to a packaging method and system for a four-terminal stacked component. Background Art

[0002] With the development and innovation of crystalline silicon cell technology, there are further requirements for the packaging structure of crystalline silicon cells, that is, the improvement of the photoelectric conversion efficiency of crystalline silicon cell modules. After more than 10 years of development, the photoelectric conversion efficiency of crystalline silicon cell modules has been improved from around 18% to more than 25.2%.

[0003] The current conventional component packaging method in the industry usually uses a single crystalline silicon cell to absorb light to form a power source. Crystalline silicon cells are affected by their own forbidden band width, temperature, and resistance and can only absorb a small part of the energy in the effective light, and cannot absorb all the effective light.

[0004] The estimated photoelectric conversion efficiency of mass-produced crystalline silicon cells is currently 28.4%, and the photoelectric conversion efficiency of the crystalline silicon cell module obtained after packaging is limited to 26.4%. If we only rely on the efficiency improvement of crystalline silicon cells, we cannot effectively improve the photoelectric conversion efficiency of crystalline silicon cell modules. The improvement of the photoelectric conversion efficiency of the crystalline silicon cell module after packaging has serious bottleneck limitations. Summary of the invention

[0005] To solve the above problems, the present disclosure provides a packaging method and system for a four-terminal stacked component. The technology adopts a component packaging mode of semi-transparent perovskite component + back-contact crystalline silicon cell + back high-resistance water backplane, and can break through the limit of the photoelectric conversion efficiency of crystalline silicon cell components through back-contact cell design, back-contact cell glue fixation + laminated metallization packaging process and other means.

[0006] The technology of the present invention specifically includes:

[0007] A packaging method for a four-terminal stacked component, characterized by comprising:

[0008] Obtain a front plate glass, wherein the front plate glass is conductive glass; prepare a semi-transparent perovskite component using the front plate glass as a substrate; lead out bus bars at both ends of the semi-transparent perovskite component to collect and lead out the positive and negative electrodes of the semi-transparent perovskite component;

[0009] Obtain a back contact battery; print insulating ink on the heterogeneous grid lines of the back contact battery and then cure the insulating ink; print solder paste on the pad point of the back contact battery and then cure the solder paste; scribe the back contact battery after the solder paste is cured to obtain a half-cell battery; evenly lay the scribed half-cell battery on the same glass plane according to the layout requirements, with the front of the half-cell battery facing the translucent perovskite component; form a partial overlapping area between adjacent half-cell batteries; lay an interconnection strip on the back of the half-cell battery, and use the interconnection strip to connect the half-cell batteries in series to obtain a crystalline silicon battery string; the positive and negative ends of the crystalline silicon battery string are collected and led out through a bus bar;

[0010] After laying the front adhesive film layer on the bottom of the semi-transparent perovskite module, the crystalline silicon cell string, the rear adhesive film layer, and the backplane are laid on the bottom in sequence to obtain the preliminary packaging structure of the four-terminal stacked module;

[0011] The preliminary packaging structure of the four-terminal stacked component is subjected to low-temperature lamination treatment to obtain a prepared packaging structure of the four-terminal stacked component.

[0012] Further,

[0013] After obtaining the preliminary packaging structure of the four-terminal stacked component, apply a butyl rubber layer on the edge of the backplane.

[0014] Further,

[0015] The butyl rubber layer has a width of 5-8 mm and a thickness of 8-10 mm.

[0016] Further,

[0017] After the positive and negative electrodes of the semi-transparent perovskite component are brought together and led out by the bus bars at both ends of the semi-transparent perovskite component:

[0018] The current is conducted through a single centralized junction box.

[0019] Further,

[0020] Before laying the backplane, circular holes are opened on the backplane according to the positions of the bus lead lines of the crystalline silicon cell strings and the semi-transparent perovskite components.

[0021] Further,

[0022] The method of connecting half-cells in series by using interconnecting bars to obtain a crystalline silicon cell string comprises:

[0023] After adding insulating glue dots on the back of the interconnection strip to fix the interconnection strip, lamination welding is used for metallization connection to obtain a crystalline silicon cell string.

[0024] Further,

[0025] The method of preparing a semi-transparent perovskite component using the front plate glass as a substrate comprises:

[0026] The laser grooving technology is used to complete the scribing on the front glass substrate;

[0027] preparing a first carrier transport layer on a front plate glass substrate;

[0028] Using laser grooving technology to complete the scribing on the first carrier transport layer;

[0029] preparing a perovskite layer on the first carrier transport layer;

[0030] preparing a passivation layer between the perovskite layer and the carrier transport layer;

[0031] preparing a second carrier transport layer on the perovskite layer;

[0032] preparing a buffer layer on the second carrier transport layer;

[0033] preparing a transparent electrode on the buffer layer;

[0034] The scribing is completed after the transparent electrode is prepared.

[0035] Further,

[0036] The glass thickness of the glass plane is 2-3.2 mm.

[0037] Further,

[0038] The insulating ink is printed on the heterogeneous grid lines of the back contact battery and then cured, and the printing thickness of the ink is 20-50 um.

[0039] A packaging system for a four-terminal stacked component, characterized by comprising:

[0040] A semi-transparent perovskite component manufacturing module is used to obtain a front plate glass, wherein the front plate glass is a conductive glass; prepare a semi-transparent perovskite component using the front plate glass as a substrate; and lead out bus bars at both ends of the semi-transparent perovskite component to collect and lead out the positive and negative electrodes of the semi-transparent perovskite component;

[0041] A crystalline silicon battery string manufacturing module is used to obtain a back contact battery; after printing insulating ink on the heterogeneous grid lines of the back contact battery, the insulating ink is cured; after printing solder paste on the pad point of the back contact battery, the solder paste is cured; after the back contact battery with the solder paste cured, half-cutting is performed to obtain half-cut battery cells; the half-cut battery cells after cutting are evenly laid on the same glass plane according to the layout requirements, and the front of the half-cut battery cells faces the semi-transparent perovskite component; a partial overlapping area is formed between adjacent half-cut battery cells; an interconnection strip is laid on the back of the half-cut battery cells, and the half-cut battery cells are connected in series using the interconnection strip to obtain a crystalline silicon battery string; the positive and negative ends of the crystalline silicon battery string are collected and led out through a bus bar;

[0042] The splicing module is used to lay the front adhesive film layer on the bottom of the semi-transparent perovskite component, and then lay the crystalline silicon cell string, the rear adhesive film layer, and the backplane on the bottom in sequence to obtain a preliminary packaging structure of a four-terminal stacked component;

[0043] The packaging module is used to perform low-temperature lamination treatment on the packaging structure of the preliminary four-terminal stacked component to obtain the prepared packaging structure of the four-terminal stacked component.

[0044] Compared with the prior art, the present invention has the following advantages:

[0045] In the preparation of the crystalline silicon cell string, the half-cell cells after dicing are evenly laid on the same glass plane according to the layout requirements and the front faces the semi-transparent perovskite component, forming a partial overlapping area between adjacent half-cell cells. This layout method can make full use of light, reduce the reflection and refraction loss of light in the component, effectively improve the capture rate of light, and thus improve the overall light energy utilization efficiency;

[0046] At the same time, interconnection bars are laid on the back of the half-cell and connected in series, and the current is finally collected and exported through the bus bar, so that the interconnection bars are located on the back of the cell. Compared with traditional components, the interconnection bars do not occupy space on the front, and the effective light-receiving area of ​​crystalline silicon is significantly increased. The increased effective area allows more photons to be absorbed per unit area, thereby greatly improving the photoelectric conversion efficiency per unit area;

[0047] In addition, since perovskite can absorb sunlight with a wavelength below 800nm ​​and crystalline silicon can absorb sunlight with a wavelength of 300-1100nm, the present invention combines the two technologies, effectively avoiding the problem of reduced light energy utilization efficiency caused by crystalline silicon absorbing high-energy photons to generate hot carriers and subsequent thermal effects, successfully improving the utilization efficiency of sunlight in the ultraviolet-visible light region, and effectively breaking through the limit of the photoelectric conversion efficiency of existing crystalline silicon battery components;

[0048] In addition, the connection part of the back-contact battery of the present invention is located on the back of the battery, and there is no raised grid line on the front, which fundamentally eliminates the risk of the front grid line protruding and piercing the adhesive film and then damaging the translucent perovskite component; the insulating ink is printed on the heterogeneous grid lines of the back-contact battery and solidified, which can not only prevent the positive and negative poles from short-circuiting during welding, but also play a buffering and protective role, reducing damage to the adhesive film and the translucent perovskite component; the back-contact battery half-cell is evenly laid flat after dicing, with the front side facing the translucent perovskite component, so that the battery cells are arranged in a regular manner to avoid mutual squeezing and collision to damage the adhesive film and the translucent perovskite component; interconnection strips are laid on the back of the half-cell and connected in series, and the interconnection strips are located on the back, avoiding scratches, punctures and other damages to the adhesive film and the translucent perovskite component caused by the front interconnection strips.

[0049] Other features and advantages of the present disclosure will be described in the following description, and partly become apparent from the description, or be understood by implementing the present disclosure. The purpose and other advantages of the present disclosure can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0051] Figure 1 The schematic diagram of the structure of the present invention is shown;

[0052] Figure 2 The front view of the crystalline silicon battery string of the present invention is shown;

[0053] Figure 3 A schematic diagram of the back side design of a crystalline silicon cell string of the present invention is shown;

[0054] Figure 4 A schematic diagram of the busbar position of a crystalline silicon battery string is shown;

[0055] Figure 5 A schematic diagram of the lead-out line of a semi-transparent perovskite component is shown;

[0056] Figure 6 A schematic diagram of busbar lead-out is shown;

[0057] Figure 7 A schematic diagram of a back contact crystalline silicon module stacked package is shown;

[0058] Figure 8 A schematic diagram of the dispensing package series connection is shown.

[0059] Reference numerals:

[0060] 1-front glass, 2-perovskite layer, 3-front adhesive film, 4-crystalline silicon cell string, 5-rear adhesive film, 6-back panel, 7-butyl adhesive. DETAILED DESCRIPTION

[0061] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0062] Figure 1 The schematic diagram of the structure of the present invention is shown, and the structure of the present invention includes:

[0063] Front glass panel; translucent perovskite component, arranged at the bottom of the front glass panel; crystalline silicon cell string, arranged at the bottom of the translucent perovskite component, the crystalline silicon cell string is formed by stacking multiple back contact cells; back panel, arranged at the bottom of the crystalline silicon cell.

[0064] Specifically, a back adhesive film layer is provided between the crystalline silicon cell string and the back plate.

[0065] Specifically, a butyl rubber layer is provided on the edge of the back plate.

[0066] Based on the structure of the present invention, the embodiment of the present disclosure further provides a packaging method corresponding to the above structure, which includes:

[0067] Step 1: Get conductive glass as the front glass:

[0068] Specifically, conductive glass is used. Considering the hardness and crack resistance of a single piece of glass, the glass size is limited to 2272*1134mm. In the future, considering the improvement of glass strength or the support strength of frame rigid materials, the glass area can be expanded to 2400*1200mm or above. Considering the weight of the stacked components and the actual installation requirements, the glass thickness needs to be controlled between 2-3.2mm.

[0069] Step 2: Preparation of semi-transparent perovskite components:

[0070] Specifically, laser grooving technology is used to complete scribing on the front glass substrate; a first carrier transport layer is prepared on the front glass substrate; laser grooving technology is used to complete scribing on the first carrier transport layer; a perovskite layer is prepared on the first carrier transport layer; a passivation layer is prepared between the perovskite layer and the carrier transport layer; a second carrier transport layer is prepared on the perovskite layer; a buffer layer is prepared on the second carrier transport layer; a transparent electrode is prepared on the buffer layer; and scribing is completed after the transparent electrode is prepared.

[0071] The highest efficiency of organic halide perovskite solar cells can reach 26.7%. Compared with crystalline silicon, the band gap of perovskite materials can be adjusted by changing the material composition. Therefore, the present invention combines it with crystalline silicon to prepare laminated cells or components.

[0072] Step 3: Semi-transparent perovskite module busbar lead-out:

[0073] Specifically, the positive and negative electrodes of the semi-transparent perovskite component are brought together and led out by leading out bus bars at both ends of the semi-transparent perovskite component, and the current is led out through a single centralized junction box.

[0074] Conventional semi-transparent perovskite modules are exported through a double-junction box solution, and two holes need to be opened in the back encapsulation layer, which poses a high risk of water vapor entering the module (in hot and humid environments, the organic matter inside the semi-transparent perovskite module will hydrolyze and cause the module to fail). In the invention, the busbar leads of the perovskite are gathered at the same position and exported using a junction box, which reduces the backplane opening area and reduces the probability of water vapor penetration. (e.g. Figure 6 For busbar lead wire)

[0075] Generally speaking, when conventional crystalline silicon cell technology is used to prepare four-terminal stacked modules, due to the protrusions on the front grid lines of the crystalline silicon cells, there is a risk of puncturing the adhesive film and damaging the translucent perovskite modules during the packaging process, posing a hidden danger to the yield and safety of the four-terminal stacked modules.

[0076] Based on this, the back contact crystalline silicon module stacking packaging technology of the present invention is as follows:

[0077] Step 4: Back contact crystalline silicon module stacking package:

[0078] Specifically, they include:

[0079] (1) Insulating ink printing: Insulating ink is printed on the heterogeneous grid lines of the back contact battery (the printing thickness of the insulating ink is required to be 20-50um) to prevent the welding ribbon from causing an electrical short circuit between the positive and negative electrodes during the welding process.

[0080] (2) Insulation ink curing: According to the type of insulation ink, curing is mainly divided into heating curing (curing temperature: 110-140°C curing time: 30-200S) and UV light curing (energy intensity 9600-11000mj / h curing temperature: 25±2°C).

[0081] (3) Solder paste printing: Use solder paste to print on the cell pad points to increase the adhesion between the cell and the interconnect strip.

[0082] (4) Solder paste curing: A thermosetting tunnel furnace is used to cure the solder paste of the printed battery cells. Since this patent uses ultra-low temperature solder paste, the curing temperature is generally controlled at 120-150°C and the curing time is controlled at 3min-10min.

[0083] (5) Half-cell dicing: Use an optical system to mark and measure the back-contact cell to ensure the accuracy and consistency of dicing. After the coordinates are determined, a non-destructive process is used to evenly divide the cell into two halves.

[0084] (6) Battery stacking: Figure 2 , Figure 3 As shown, the half-cells after dicing are evenly stacked on the same glass plane according to the layout requirements, generally arranged in 9, 10, 11, 12, or 13 pieces (the specific number of pieces is arranged according to actual needs). Partial overlapping areas are formed between adjacent half-cells, which can utilize the light between the string spacings to increase the effective area of ​​illumination per unit area.

[0085] (7) Interconnection strip laying: Figure 4 As shown, since all welding points of the back-contact battery are located on the back of the battery, all interconnecting strips also need to be placed on the back of the battery cell. Generally, integrated cutting and transportation are adopted, and then the servo mechanism of the equipment is used to change the distance of the positive and negative poles, so that the whole string of interconnecting strips can be laid at one time.

[0086] (8) Glue dot packaging series connection: There are generally three welding methods for battery cell welding, infrared heating welding, laser pulse heating welding, and electromagnetic heating welding mode. However, since the solder strips of the back contact battery cells are laid on the back of the battery cells, heating will cause the battery cells to warp. Therefore, this patent fixes the solder strips by adding insulating glue dots on the back of the solder strips + laminating welding scheme to achieve metallization connection conditions. ( Figure 8 (Schematic diagram of glue dispensing package series connection)

[0087] (9) Crystalline silicon battery string stacking interconnection: Crystalline silicon battery strings are interconnected through interconnection strips to achieve a certain output voltage. Figure 7 Schematic diagram of crystalline silicon battery string stacking interconnection packaging)

[0088] (10) The positive and negative terminals of the crystalline silicon battery string are brought together and led out through a bus bar.

[0089] Step 5: perovskite + crystalline silicon stacked cells are combined in series;

[0090] Use the semi-transparent perovskite component completed in step 2 as the front glass, and lay a high-transmittance POE film with a gram weight greater than or equal to 460g / ㎡ on the back (this film acts as an electrical insulation between the crystalline silicon cell and the perovskite cell, and simultaneously forms a protective buffer and overall adhesion effect for the crystalline silicon cell), and then lay the laminated crystalline silicon cell, the rear film layer, and the backplane in sequence (before laying the backplane, it is necessary to open circular holes (diameter of the circular holes is 10-11mm) according to the positions of the crystalline silicon cell and the perovskite cell bus lead-out lines for the lead-out lines to be led out). ( Figure 5 Lead wire for perovskite)

[0091] Step 6: Apply butyl glue to the edge of the back panel:

[0092] Before lamination, apply a layer of butyl rubber with a width of 5-8mm and a thickness of 8-10mm on the edge of the back panel to strengthen the water vapor sealing of the component.

[0093] Step 7: Low temperature lamination:

[0094] Since the laminated component has two main power generation bodies, perovskite and crystalline silicon cells, the risk of decomposition of perovskite cells under high temperature conditions needs to be considered. Therefore, the lamination temperature of the component needs to be controlled at 125-140°C, and the total lamination time must be less than or equal to 30 minutes.

[0095] Principle explanation:

[0096] Generally speaking, the band gap energy of silicon is 1.1eV, corresponding to a wavelength of about 1100nm, so silicon can absorb photons with wavelengths below 1100nm. The band gap of perovskite material is around 1.5eV, corresponding to 800nm ​​in the spectral range, so perovskite can absorb photons with wavelengths below 800nm. The main range of the available spectrum is 300-1100nm, and crystalline silicon can basically absorb all photon energy within the spectral range. Perovskite mainly absorbs photon energy within the spectral range of 300-800nm, of which this part of the spectral energy accounts for about 51% of the total energy. According to the current highest technical level, perovskite can absorb 90.47% of the energy in this band, achieving a conversion efficiency of about 21.50%. The remaining photon energy and photons in other bands are irradiated on the crystalline silicon cell at the bottom for absorption and conversion, and the conversion efficiency of crystalline silicon is about 9.45%. Therefore, the overall conversion efficiency of the stacked components that can be achieved in theory is about 30.95%, which is much higher than the 25.2% based on conventional single crystalline silicon cells.

[0097] Therefore, the present invention uses a stacked design of perovskite cells and crystalline silicon cells to enable perovskite cells and crystalline silicon cells to absorb photons in different wavelength ranges, thereby making fuller use of spectral energy, more effectively utilizing spectral energy, and improving the overall photoelectric conversion efficiency of photovoltaic modules. Under the current technical level, the theoretical efficiency of stacked modules has far exceeded the maximum efficiency of photovoltaic modules based on single crystalline silicon cells, and there will be much room for improvement in the future with the advancement of perovskite cell technology and module packaging technology.

[0098] Terminology explanation:

[0099] Perovskite cell: Perovskite cell is an emerging solar cell technology based on the light absorption layer of perovskite material. The perovskite material involved in the photovoltaic field refers to a class of halides with a crystal structure similar to CaTiO3, usually composed of organic-inorganic hybrid halide perovskites (such as methylamine lead iodide, CH3NH3PbI3). The band gap of perovskite materials can be adjusted by adjusting the chemical composition, so that perovskite cells can present different colors. Combined with the regulation of the thickness of the perovskite layer and the application of transparent electrodes, semi-transparent perovskite cells are prepared. Semi-transparent perovskite cells have a certain transmittance to light.

[0100] Back contact battery: The working principle of the back contact battery is basically the same as that of ordinary batteries. It contains a positive electrode, a negative electrode and an electrolyte. When a circuit is established between the positive and negative electrodes, the battery will start to supply power. The difference is that the connection part of the back contact battery is located on the back of the battery, usually connected to the interface of the device through some metal contacts.

[0101] Battery string: The battery cells are arranged in a certain direction, and the battery cells are interconnected with the interconnecting strips by adding some solder media, fixing them with glue and laminating them to form a metallization method.

[0102] Interconnection ribbon: The interconnection ribbon is usually made of flux and metal materials, mainly copper ribbon, which is used to connect multiple battery cells in series to form a battery string.

[0103] Solder paste: It is mainly composed of tin, lead, flux and some additives. It has the characteristics of good wettability, low welding temperature, and strong and reliable solder joints.

[0104] Backplane: The backplane should be made of materials with good waterproof and moisture-proof properties, including but not limited to glass, PET, aluminum foil, etc. It can effectively isolate the water vapor outside the component and maintain good physical properties under high and low temperature conditions.

[0105] Butyl rubber: A synthetic rubber mainly composed of isobutylene and a small amount of isoprene. It has excellent air tightness and aging resistance and is used for edge sealing of laminated components.

[0106] Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A packaging method for a four-terminal stacked component, characterized in that: include: Obtaining a front plate glass, wherein the front plate glass is conductive glass; A semi-transparent perovskite component is prepared with the front plate glass as a substrate; bus bars are led out from both ends of the semi-transparent perovskite component to collect and lead out the positive and negative electrodes of the semi-transparent perovskite component; Obtain a back contact battery; print insulating ink on the heterogeneous grid lines of the back contact battery and then cure the insulating ink; print solder paste on the pad point of the back contact battery and then cure the solder paste; scribe the back contact battery after the solder paste is cured to obtain a half-cell battery; evenly lay the scribed half-cell battery on the same glass plane according to the layout requirements, with the front of the half-cell battery facing the translucent perovskite component; form a partial overlapping area between adjacent half-cell batteries; lay an interconnection strip on the back of the half-cell battery, and use the interconnection strip to connect the half-cell batteries in series to obtain a crystalline silicon battery string; the positive and negative ends of the crystalline silicon battery string are collected and led out through a bus bar; After laying the front adhesive film layer on the bottom of the semi-transparent perovskite module, the crystalline silicon cell string, the rear adhesive film layer, and the backplane are laid on the bottom in sequence to obtain the preliminary packaging structure of the four-terminal stacked module; The preliminary packaging structure of the four-terminal stacked component is subjected to low-temperature lamination treatment to obtain a prepared packaging structure of the four-terminal stacked component.

2. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: After obtaining the preliminary packaging structure of the four-terminal stacked component, apply a butyl rubber layer on the edge of the backplane.

3. The packaging structure of a four-terminal stacked component according to claim 2, characterized in that: The butyl rubber layer has a width of 5-8 mm and a thickness of 8-10 mm.

4. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: After the positive and negative electrodes of the semi-transparent perovskite component are brought together and led out by the bus bars at both ends of the semi-transparent perovskite component: The current is conducted through a single centralized junction box.

5. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: Before laying the backplane, circular holes are opened on the backplane according to the positions of the bus lead lines of the crystalline silicon cell strings and the semi-transparent perovskite components.

6. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: The method of connecting half-cells in series by using interconnecting bars to obtain a crystalline silicon cell string comprises: After adding insulating glue dots on the back of the interconnection strip to fix the interconnection strip, lamination welding is used for metallization connection to obtain a crystalline silicon cell string.

7. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: The method of preparing a semi-transparent perovskite component using the front plate glass as a substrate comprises: The laser grooving technology is used to complete the scribing on the front glass substrate; preparing a first carrier transport layer on a front plate glass substrate; Using laser grooving technology to complete the scribing on the first carrier transport layer; preparing a perovskite layer on the first carrier transport layer; preparing a passivation layer between the perovskite layer and the carrier transport layer; preparing a second carrier transport layer on the perovskite layer; preparing a buffer layer on the second carrier transport layer; preparing a transparent electrode on the buffer layer; The scribing is completed after the transparent electrode is prepared.

8. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: The glass thickness of the glass plane is 2-3.2 mm.

9. The packaging method of a four-terminal stacked component according to claim 1, characterized in that: The insulating ink is printed on the heterogeneous grid lines of the back contact battery and then cured, and the printing thickness of the ink is 20-50 um.

10. A packaging system for a four-terminal stacked component, characterized in that: include: A semi-transparent perovskite component manufacturing module is used to obtain a front plate glass, wherein the front plate glass is a conductive glass; A semi-transparent perovskite component is prepared with the front plate glass as a substrate; bus bars are led out from both ends of the semi-transparent perovskite component to collect and lead out the positive and negative electrodes of the semi-transparent perovskite component; A crystalline silicon battery string manufacturing module is used to obtain a back contact battery; after printing insulating ink on the heterogeneous grid lines of the back contact battery, the insulating ink is cured; after printing solder paste on the pad point of the back contact battery, the solder paste is cured; after the back contact battery with the solder paste cured, half-cutting is performed to obtain half-cut battery cells; the half-cut battery cells after cutting are evenly laid on the same glass plane according to the layout requirements, and the front of the half-cut battery cells faces the semi-transparent perovskite component; a partial overlapping area is formed between adjacent half-cut battery cells; an interconnection strip is laid on the back of the half-cut battery cells, and the half-cut battery cells are connected in series using the interconnection strip to obtain a crystalline silicon battery string; the positive and negative ends of the crystalline silicon battery string are collected and led out through a bus bar; The splicing module is used to lay the front adhesive film layer on the bottom of the semi-transparent perovskite component, and then lay the crystalline silicon cell string, the rear adhesive film layer, and the backplane on the bottom in sequence to obtain a preliminary packaging structure of a four-terminal stacked component; The packaging module is used to perform low-temperature lamination treatment on the packaging structure of the preliminary four-terminal stacked component to obtain the prepared packaging structure of the four-terminal stacked component.

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