Reduced offset error configuration for rotary inductive sensor
By configuring the transmitting coil circuit of opposite polarity in the induction sensor circuit of the rotation sensing sensor and adapting the polarity of each coil in the configuration of the rotation sensing sensor target, the problem of measuring signal offset error under the corner effect is solved, and a higher measurement signal accuracy is achieved.
Patent Information
- Application Number
- CN202380072495.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-10-17
- Filing Date
- 2023-09-28
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2043-09-28
AI Technical Summary
The rotational sensing sensor may be subject to electromagnetic interference in certain environments or configurations, resulting in offset errors in the measurement signal, especially under corner effects.
By configuring the transmitting coil circuit of the opposite polarity in the induction sensor circuit of the rotary induction sensor and adapting the polarity of each coil in the configuration of the rotary induction sensor target, the interaction and interference between the electromagnetic fields of the transmitting coil are reduced.
The offset error of the receiving coil signal caused by the corner effect of the rotary induction sensor transmitting coil circuit is effectively reduced, and the accuracy of the measurement signal is improved.
Smart Images

Figure CN120019252A_ABST
Abstract
Description
Background Art
[0001] Rotation sensing sensors can be used in a variety of applications. One application of rotation sensing sensors is to sense the position of a vehicle pedal, such as a brake pedal or an accelerator pedal. BRIEF DESCRIPTION OF THE DRAWINGS
[0002] The accompanying drawings, in which like reference numerals indicate identical or functionally similar elements in various views, together with the detailed description below, are incorporated into and constitute a part of the specification and serve to further illustrate embodiments, examples, and aspects of the concepts including the claimed subject matter and to explain various principles and advantages of such embodiments, examples, and aspects.
[0003] Figure 1 A perspective view of a vehicle pedal assembly including a rotation sensing sensor is shown according to some examples.
[0004] Figure 2 Based on some examples Figure 1 An exploded perspective view of a vehicle pedal assembly.
[0005] Figure 3 Based on some examples Figure 1 Figure 1. A diagram of a rotation sensing sensor.
[0006] Figure 4A Based on some examples Figure 1 Figure 2. A top view of a rotation sensing sensor.
[0007] Figure 4B Based on some examples Figure 1 FIG. 1 is a diagram of a bottom view of a rotation sensing sensor.
[0008] Figure 4C is a diagram of a top view of a rotation sensing sensor according to some examples.
[0009] Figure 4D Based on some examples Figure 1 FIG. 1 is a diagram of another configuration of a rotation sensing sensor.
[0010] Figure 5A is based on some examples shown by Figure 1 A graph of simulation results of the offset error of the receiving coil signal generated by the rotation induction sensor.
[0011] Figure 5B is based on some examples shown by Figure 1 A graph of simulation results of the offset error of the receiving coil signal generated by the rotation induction sensor.
[0012] Figure 6 Based on some examples Figure 1A schematic diagram of an electronic controller for a vehicle pedal assembly.
[0013] Skilled technicians will understand that the elements in the figures are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the size of some elements in the figures may be enlarged relative to other elements to help better understand the examples, aspects and features shown.
[0014] In certain cases, apparatus and method components have been represented in the drawings with conventional symbols where appropriate, showing only specific details relevant to understanding the illustrated examples, features, and aspects so as not to obscure the disclosure with details that would be readily apparent to one of ordinary skill in the art having the benefit of the description herein. DETAILED DESCRIPTION
[0015] A rotational sensing position sensor (referred to herein as a "rotational sensing sensor") utilizes one or more inductive coil circuits to provide information about the rotational angle or position of an object. In particular, in response to the rotational motion of the object, an inductive change is generated in the electromagnetic field of the inductive coil circuit, and the sensor outputs a current and / or voltage signal generated thereby. Specific electrical characteristics (e.g., voltage and / or current amplitude and polarity) are then analyzed (e.g., via an electronic processor of an electronic controller) to determine the change in rotational position. Some rotational sensing sensors may include multiple coil circuits and be configured to output more than one signal for each circuit (e.g., a redundant rotational sensing sensor may provide two outputs).
[0016] The accuracy of a rotation sensing sensor may be negatively affected by electromagnetic interference / crosstalk caused by the environment or the specific configuration of the sensing coil circuit of the rotation sensing sensor. For example, the electromagnetic field strength along the electrical traces of the transmitting coil circuit of the rotation sensing sensor may be higher in some places than the electromagnetic field strength at the center of the transmitting coil (known as the corner effect).
[0017] One solution to address such issues may be to increase the distance between one or more traces of the coil circuit and / or the coils. However, such a configuration may introduce more crosstalk and / or increase the coupling coefficient between one or more components within the sensor. Such a configuration may also require more precise design and manufacturing control to ensure functionality, which may be expensive. Furthermore, due to the limited size of the printed circuit board (PCB) of the rotation sensing sensor, spaced-apart traces or coils may not be achievable.
[0018] Thus, the systems and methods described herein provide, among other things, a configuration of a rotational inductive sensor for reducing offset errors (eg, caused by corner effects of a transmitter coil circuit of the sensor) in a measurement signal generated thereby.
[0019] One example provides a vehicle pedal assembly including a pedal rotatable relative to an axis and a rotational inductive position sensor. The rotational inductive position sensor includes a rotational inductive sensor target rotatable in response to rotation of the pedal and an inductive sensor assembly. The inductive sensor assembly includes a printed circuit board (PCB) located opposite the rotational inductive sensor target. The inductive sensor assembly includes a first inductive sensor circuit defined on the PCB. The first inductive sensor circuit includes a first coil circuit including a first coil having a first current in a first flow direction, and a second coil having a second current in a second flow direction opposite to the first flow direction. The first inductive sensor circuit is configured such that rotation of the rotational inductive sensor target causes changes in the first current and the second current within the first coil and the second coil.
[0020] Another example provides an inductive sensor assembly. The inductive sensor assembly includes a rotational inductive sensor target and a PCB located opposite the rotational inductive sensor target. The inductive sensor assembly includes a first inductive sensor circuit defined on the PCB. The first inductive sensor circuit includes a first coil circuit, the first coil including a first coil having a first current in a first flow direction and a second coil having a second current in a second flow direction opposite to the first flow direction. The first inductive sensor circuit is configured so that rotation of the rotational inductive sensor target causes changes in the first current and the second current in the first coil and the second coil.
[0021] For ease of description, some or all of the example systems presented herein are illustrated with a single example of each of their component parts. Some examples may not describe or illustrate all of the components of the system. Other examples may include more or less of each of the components shown, may combine some components, or may include additional or alternative components.
[0022] It should be understood that although some of the diagrams presented herein illustrate hardware and software located within a particular device, these descriptions are for illustrative purposes only. In some embodiments, the components shown may be combined or divided into separate software, firmware, and / or hardware. For example, logic and processing may be distributed between multiple electronic processors, rather than being located within and executed by a single electronic processor. Regardless of how they are combined or divided, the hardware and software components may be located on the same computing device, or may be distributed between different computing devices connected by one or more networks or other suitable communication links.
[0023] It should also be understood that although the examples herein are described with respect to a vehicle pedal (particularly an accelerator pedal), the systems and methods described herein may be used in different applications involving rotation sensing sensors (e.g., eBrake pedals). The systems and methods described herein, although described in the form of a dual-output rotation sensing sensor, may be applied to rotation sensing sensors having a different number of outputs.
[0024] Figure 1 and Figure 2 An example vehicle pedal assembly (referred to herein as a vehicle pedal) 10 is depicted having a rotation-sensitive sensor assembly 101 including a rotation-sensitive sensor 102 and a rotation-sensitive sensor target 34, both of which will be described in greater detail below. The vehicle pedal 10 includes a pedal housing 20 including a plurality of outer walls 20A and a base 20B, collectively defining an interior 20C, a front opening 20D, and a side opening 20E.
[0025] The vehicle pedal 10 also includes an elongated plastic pedal arm 30 including a distal end or drum 32 having a metal rotation-sensitive sensor target 34 (referred to herein as a rotation-sensitive sensor target) adapted to be overmolded into an outer side 32A of the drum 32. In the illustrated example, the pedal arm 30, and more specifically the distal end or drum 32 having the rotation-sensitive sensor target 34 thereon, extends into the interior 20C of the pedal housing 20, forming a rotatable relationship relative to the housing 20, and forming a rotatable relationship about and relative to an axis 20F that is integrally formed with one of the lateral outer walls 20A of the housing 20 and extends into the interior 20C of the housing 20.
[0026] The pedal 10 also includes a combined electrical connector assembly and housing 40 secured to the pedal housing 20 in a relationship covering and closing the housing side opening 20E and more specifically in a relationship covering the drum 32 of the pedal arm 30 located in the interior 20C of the housing 20. The combined electrical connector assembly and housing cover 40 is also secured in a relationship opposing and spaced apart from the side outer face 32a of the drum 32 of the pedal arm 30, wherein the rotation sensing sensor target 34 is overmolded. A plurality of screws 45 secure the cover 40 to the housing 20.
[0027] The housing cover 40 includes an integral electrical connector 42 and defines a central circular opening 43 and an interior recess 44 surrounding the opening 42. When the housing cover 40 is secured to the housing 20, the housing cover 40 and the pedal arm 30 are positioned relative to one another in a relationship in which the rotation sensing sensor target 34 on the drum 32 of the pedal arm 30 extends into and is located within the circular opening 43 defined in the housing cover 40.
[0028] The pedal 10 also includes a rotational inductive sensor substrate or printed circuit board (PCB) 50, which includes opposing outer faces 52 and 54. The PCB 50 is configured to be inserted, positioned and seated in the recess 44 defined in the housing cover 40, and is positioned opposite and adjacent to the rotational inductive sensor target 34 on the drum 32 of the pedal arm 30, and as shown, the outer face 54 of the PCB 50 faces the rotational inductive sensor target 34. As described in more detail below, the PCB 50 includes corresponding inductive sensor transmitting and receiving coil circuits defined and formed on the corresponding outer front face 52 and back face 54. A plastic electrical cover or plate 70 covers the PCB 50 and is secured to the outer face of the housing cover 40. The inductive sensor assembly 101 of the pedal 10 includes the rotational inductive sensor target 34 on the drum 32 of the pedal arm 30 and the rotational inductive sensor 102 (explained in detail below).
[0029] The pedal 10 further includes a pedal friction assembly 80 located in the interior 20c of the housing 20. The pedal friction assembly 80 includes a friction device 81 that is seated on the base 22 of the pedal housing 20 and is adapted to pivotally move relative to the base 22. A pair of telescopic springs 82 and 84 extend between the pedal friction assembly 80 and the underside of the elongated pedal arm 30. A spring damper 86 is adapted to be wedged between the two springs 82 and 84.
[0030] from a power source (e.g., connected to an electronic controller (such as described in more detail below) Figure 6 A controller (or a power supply as part of an electronic controller) provides power to the rotation sensing sensor 102, thereby providing current to the transmitting coil circuit of the rotation sensing sensor 102. The transmitting coil circuit (as explained in more detail below) includes a plurality of transmitting coils. Current flows through the transmitting coils, and also generates a magnetic field around the coils. The receiving coil circuit also includes a plurality of receiving coils, which are positioned so that the magnetic field generated by the transmitting coils induces current (and thus its corresponding magnetic field) in the receiving coils. The electrical signal induced in the receiving coils is then provided from the sensor 102 to the electronic controller (not shown). Due to the position of the rotation sensing sensor 102, the rotation sensing sensor target 34 is located within the generated magnetic field. Force applied to or removed from the pedal arm 30 (e.g., from the user's foot) during vehicle operation (not shown) causes movement / rotation of the pedal arm 30, which in turn causes movement / rotation of the pedal arm drum 32 in the interior 20C of the pedal housing 20, thereby causing movement / rotation of the rotation sensing sensor target 34.
[0031] The movement / rotation of the rotation inductive sensor target 34 relative to the inductive sensor 102 transmitting and receiving coil circuits of the rotation inductive sensor 102 causes a change in the magnetic field generated by the corresponding transmitting coil circuits of the rotation inductive sensor 102. Therefore, the movement of the rotation inductive sensor target 34 also causes a change in the voltage and / or current in the corresponding receiving coil circuits of the rotation inductive sensor 102. Then, the controller (e.g., Figure 6 The electronic controller 600 utilizes corresponding changes in the electrical signal provided to the electronic controller to determine the position of the pedal arm 30 and control one or more operations of the vehicle (eg, acceleration and deceleration of the vehicle) accordingly.
[0032] Figure 6 An example embodiment of an electronic controller 600 is schematically shown. In the illustrated embodiment, the electronic controller 600 includes an electronic processor 605, a memory 610, an input / output interface 615, and a power supply 620. The illustrated components and other various modules and components are connected to each other by means of or through one or more control or data buses (e.g., bus 625) that enable communication therebetween. The electronic controller 600 can be housed in a single device (e.g., an application specific integrated circuit (ASIC)), or distributed across multiple devices.
[0033] The electronic processor 605 may include one or more microprocessors, ASICs, or another suitable electronic device. The electronic processor 605 obtains and provides information (e.g., provides information to and from the memory 610 and / or the input / output interface 615), and processes the information by executing one or more software instructions or modules, which may be stored in, for example, a random access memory ("RAM") area of the memory 610, a read-only memory ("ROM") of the memory 610, or another non-transitory computer-readable medium (not shown). The software may include firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The electronic processor 605 is configured to retrieve and execute software related to the processes and methods described herein from the memory 610, etc.
[0034] The electronic processor 605 is configured to control the input / output interface 615 to send communication and / or power signals (e.g., via one or more switches not shown) to at least one other device (e.g., the rotation sensing sensor 102) and receive communication and / or power signals from at least one other device. The input / output interface 615 may include various digital and analog components (e.g., digital signal processors, high-band filters, low-band filters, etc.), which are not described herein for the sake of brevity, and the components may be implemented in hardware, software, or a combination of both. The input / output interface 615 may include, for example, a transceiver, a transmitter, and / or a receiver (not shown). The input / output interface 615 may alternatively or additionally include one or more ports for wired communication with corresponding components (e.g., the rotation sensing sensor 102). In some embodiments, the electronic processor 605 is configured to provide current (from the power supply 620) to power the transmitting coil circuit of the rotation sensing sensor 102. The power supply 620 may be part of the electronic controller 600 itself, or a power supply separate from one or more electrical systems of the vehicle.
[0035] In some embodiments, the electronic controller 600 is configured to operate and receive signals from the rotation sensing sensor 102. Based on the received signals, the controller 600 determines the position, speed and / or position change of the rotation sensing sensor target 34 (and the pedal arm 30) as described above. In one example, the electronic controller 600 provides the obtained information to one or more controllers of the vehicle. One or more controllers control one or more operations of the vehicle (e.g., acceleration and deceleration of the vehicle) based on the received information accordingly. In some embodiments, some or all of the functions of the electronic controller 600 are integrated into the vehicle control unit (VCU) of the vehicle. The controller 600 can transmit information (e.g., the determined position, speed and / or position change determined based on the signal from the rotation sensing sensor 102) to the VCU or another controller of the vehicle to perform the operation of the vehicle based on the obtained information. In some embodiments, some or all of the functions of the electronic controller 600 are integrated into the rotation sensing sensor 102. In some embodiments, some or all of the processing of the signal generated by the sensing sensor 102 can be performed at the electronic controller 600. In some embodiments, the rotation sensing sensor 102 may include circuit components, such as a microprocessor and memory (not shown), for performing at least a portion of the processing of the generated signals (eg, conversion to an appropriate output protocol for transmission to the electronic controller 600 ).
[0036] Figure 3300 is a diagram of a rotational inductive sensor 102 according to some examples. In the illustrated example, the inductive sensor 102 includes a PCB 50 and first and second inductive sensor circuits 301A, 301B of a rotational inductive sensor target 34 according to some examples. Each inductive sensor circuit 301A, 301B includes a transmitting coil circuit 302A, 302B and a receiving coil circuit 304A, 304B, respectively. The transmitting coil circuit 302A, 302B and the receiving coil circuit 304A, 304B are defined and formed on opposite outer surfaces 52 and 54 of the PCB 50, respectively. The overlapping arrangement of the respective transmitting coil circuits 302A, 302B and the respective receiving coil circuits 304A, 304B on the opposite surfaces 52, 54 of the PCB 50 results in interaction and mixing between the respective magnetic fields generated by the respective transmitting coil circuits 302A, 302B. This results in an increase in coupling between the respective transmitting coil circuits 302A, 302B and the respective receiving coil circuits 304A, 304B.
[0037] In the example shown, each transmitting coil circuit 302A, 302B includes two transmitting coils 306A, 306B and 306C, 306D, respectively. Each of the two coils 306A, 306B and 306C, 306D is connected in series. Each receiving coil circuit 304A, 304B includes two receiving coils 308A, 308B and 308C, 308D, respectively. Each of the two coils 308A, 308B and 308C, 308D is connected in series.
[0038] Each of the transmit coils 306A-306D and receive coils 308A-308D is defined and formed on four different and independent portions or quadrants 50A-50D of the PCB 50. Each of the transmit coils 306A-306D and receive coils 308A-308D includes respective traces 312A-312D and 314A-314D, respectively. Associated circuits, components, and output integrated circuits (not shown) on respective opposing sides 52 and 54 of the PCB 50 are electrically coupled to the respective transmit and receive coil circuit traces 312A-312D and 314A-314D on respective opposing sides 52 and 54 of the PCB 50.
[0039] The particular separation between the traces 312A-312D and 314A-314D of the respective transmit coil circuits 302A, 302B and receive coil circuits 304A, 304B reduces the interaction or interference between the respective magnetic fields generated by the respective transmit coil circuits 302A, 302B, thereby reducing the coupling therebetween / lowering the coupling coefficient. As described above, while the corner effect can be reduced by increasing the space between the coils 306A-306D, 308A-308D (particularly the traces 312A-312D, 314A-314D), the modification of increasing the spacing may increase interference and crosstalk between two or more traces 312A-312D.
[0040] Figure 4A 400A is a top view of the inductive sensor circuits 301A, 301B of the rotation inductive sensor 102 and the rotation inductive sensor target 34. In the example shown, the inductive sensor circuits 301A, 301B are configured such that current within the transmitting coils 306A, 306D flows in a first flow direction, while current within the transmitting coils 306B, 306C flows in a second flow direction opposite to the first flow direction (i.e., opposite polarity). The flow directions of the transmitting coils 306A-306D of the PCB 50 are indicated by arrows 402A-402D.
[0041] Figure 4B 400B is a bottom view of the PCB 50 and the rotation sensing sensor target 34. As shown, the rotation sensing sensor target includes a plurality of blades 34A-34G. Since the transmitting coils 306A-306D have opposite polarities, the rotation sensing sensor target 34 (particularly the configuration of the blades 34A-34F and the spacing therebetween) is configured (shaped in this example) such that the area of the receiving coils 308A-308D covered by one or more blades 34A-34F of the rotation sensing sensor target 34 is opposite for the diagonal quadrants 50A, 50B and 50C, 50D. For example, the area covered by blade 34A in quadrant 50A is not covered in quadrant 50B, and the area covered by blades 34D and 34E in quadrant 50B is not covered in quadrant 50A. Blade 34G may be included to increase the angular sensing range of the sensor.
[0042] The receive coil signal can be explained by the following formula:
[0043]
[0044] Where A is the area of a particular receiving coil 308A-308D, θ is the relative angular position of the rotation sensing sensor target 34, and Error offset is the offset error of the receiving coil signal due to the corner effect.
[0045] To calculate the total receive coil signal for a receive coil circuit (e.g., receive coil circuit 304A), the sum of the receive coil signals for the corresponding receive coils (in this example, coils 308A and 308B of circuit 304A) must be determined. The following is a function for determining the receive coil signal for the receive coil pair of receive coil circuits 304A, 304B.
[0046]
[0047]
[0048] Since the polarity of the transmit coils in the corresponding quadrants (e.g., transmit coil 306B for receive coil 308B) is opposite, the offset error of the second receive coil of the receive coil circuit 304A, 304B is negative. Since the spacing between the transmit coil and the receive coil is approximately symmetrical in the two quadrants of the corresponding inductive sensor circuit 301A, 301B, the magnitude of the offset error is approximately equal. Therefore, the receive coil signal of a single receive coil circuit 304A, 304B can be approximated as:
[0049]
[0050] Therefore, by adjusting the configuration of the rotation inductive sensor target 34 and driving the transmit coils 306A, 306B and 306C, 306D of the corresponding transmit coil circuits 302A, 302B to opposite polarities with respect to each other, offset errors may be reduced.
[0051] Figure 4C FIG. 400C is a top view of the inductive sensor circuits 301A, 301B and the rotation inductive sensor target 402C of the PCB 50. In the example shown, the current flow directions of the transmitting coils 306A-306D of the PCB 50 are the same. In other words, the current provided to each of the two transmitting coils 306A, 306B and 306C, 306D of the corresponding inductive sensor circuits 301A, 301B flows in the same direction (same polarity). As shown, the configuration of the rotation inductive sensor target 402C is different from the target 34 to accommodate the polarity of the respective coils 306A-306D.
[0052] Figure 5A5 is a graph 500A showing simulation results of offset error in receive coil signals for both the case where the transmit coils 306A, 306B and 306C, 306D have opposite polarities (line 502A) and the transmit coils 306A, 306B and 306C, 306D have the same polarity (line 502B). Graph 500 shows receive coil signals for an inductive sensor circuit (e.g., circuits 301A and 301B) at a target angular position. As shown, the offset error for the opposite polarity implementation (approximately 3.2 mV) is less than the offset error for the same polarity implementation (approximately 14.4 mV).
[0053] Alternatively, the inductive sensor circuits 301A, 301B may be configured such that the polarity of the receiving coils 308A, 308B and 308C, 308D is reversed instead of the transmitting coils 306A, 306B and 306C, 306D. Figure 4D Diagram 400D shows an example configuration of the inductive sensor circuits 301A, 301B of the PCB 50 and the target 34 according to some embodiments. In the illustrated embodiment, the inductive sensor circuits 301A, 301B are configured so that the currents induced within the receiving coils 308A, 308B and 308C, 308D flow opposite to each other (opposite polarity).
[0054] Figure 5B 500B is a graph showing simulation results of offset error in the receive coil signals for the cases where the receive coils 308A, 308B and 308C, 308D have opposite polarities (line 504A) and the receive coils 308A, 308B and 308C, 308D have the same polarity (line 504B). Graph 500B shows the receive coil signals of the inductive sensor circuit (e.g., circuits 301A and 301B) versus the angular position of the target. As shown, the offset error for the opposite polarity implementation (approximately 6.6 mV) is less than the offset error for the same polarity implementation (approximately 14.4 mV).
[0055] In the foregoing description, various embodiments, examples, aspects and features are described. However, it will be appreciated by those skilled in the art that various modifications and changes may be made without departing from the scope of the present invention as described in the following claims. Therefore, the description and drawings should be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the present teachings.
[0056] Benefits, advantages, solutions to problems, and any elements that may render any benefit, advantage, or solution apparent or apparent should not be construed as a critical, required, or essential feature or element of any or all the claims. The invention is defined solely by the appended claims including any amendments made during the pendency of this application and all equivalents of those claims as issued.
[0057] Furthermore, in this document, relational terms such as first and second, top and bottom, etc., may be used only to distinguish one entity or action from another entity or action, and do not necessarily require or imply any actual relationship or order between these entities or actions. The terms "include", "comprising", "having", "having", "includes", "including", "containing", "containing" or any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes, has, has, or contains a list of elements includes not only these elements, but may also include other elements that are not explicitly listed or inherent in such process, method, article, or apparatus. Without further limitation, an element beginning with "includes...", "having...", "including...", or "containing..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes, has, contains, or contains the element. Unless otherwise expressly stated herein, the terms "a" and "an" are defined as one or more. The terms "substantially," "essentially," "approximately," "about," or any other versions are defined as close to, as understood by one skilled in the art, and in one non-limiting embodiment, within 10%, within 5%, within 1%, and within 0.5%. The term "coupled," as used herein, is defined as connected, although not necessarily directly and not necessarily mechanically. A device or structure that is "configured" in a certain way is configured in at least that way, but may also be configured in ways not listed.
[0058] It should be understood that some embodiments may consist of one or more general or special purpose processors (or "processing devices"), such as microprocessors, digital signal processors, custom processors, and field programmable gate arrays (FPGAs), and unique stored program instructions (including software and firmware) that control the one or more processors together with certain non-processor circuits to implement some, most, or all of the functions of the methods and / or apparatus described herein. Alternatively, some or all of the functions may be implemented by a state machine without stored program instructions, or in one or more application specific integrated circuits (ASICs), where each function or combination of certain functions is implemented as custom logic. Of course, a combination of these two approaches may be used.
[0059] In addition, the embodiments may be implemented as a computer-readable storage medium having computer-readable code stored therein for programming a computer (e.g., including a processor) to perform the methods described and claimed herein. Examples of such computer-readable storage media include, but are not limited to, hard disks, CD-ROMs, optical storage devices, magnetic storage devices, ROMs (read-only memory), PROMs (programmable read-only memory), EPROMs (erasable programmable read-only memory), EEPROMs (electrically erasable programmable read-only memory), and flash memory. In addition, it is expected that, although significant effort may be made and many design choices are made driven by factors such as available time, current technology, and economic considerations, a person of ordinary skill, guided by the concepts and principles disclosed herein, will be able to easily generate such software instructions and programs and ICs with minimal experimentation.
[0060] In the foregoing description, specific embodiments have been described. However, those skilled in the art recognize that various modifications and changes may be made without departing from the scope of the present invention as described in the following claims. Therefore, the description and drawings should be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the present teachings.
[0061] Various features and advantages of some embodiments are set forth in the following claims.
Claims
1. A vehicle pedal assembly, comprising: a pedal rotatable relative to the shaft; as well as A rotary inductive position sensor comprising: a rotation-sensitive sensor target capable of rotating in response to rotation of the pedal, and an inductive sensor assembly comprising a printed circuit board (PCB) located opposite the rotational inductive sensor target, the inductive sensor assembly comprising a first inductive sensor circuit defined on the PCB, the first inductive sensor circuit comprising a first coil circuit, the first coil circuit comprising a first coil having a first current in a first flow direction and a second coil having a second current in a second flow direction opposite the first flow direction, Wherein, the first inductive sensor circuit is configured such that rotation of the rotational inductive sensor target causes changes in the first current and the second current in the first coil and the second coil.
2. The assembly according to claim 1, wherein The first coil and the second coil are transmitting coils.
3. The assembly according to claim 1, wherein: The first coil and the second coil are receiving coils.
4. The assembly according to claim 1, wherein: The inductive sensor assembly includes a second inductive sensor circuit defined on the PCB, the second inductive sensor circuit including a second coil circuit, the second coil circuit including a third coil having a third current in a third flow direction and a fourth coil having a fourth current in a fourth flow direction opposite to the third flow direction, wherein the second inductive sensor circuit is configured such that rotation of the rotational inductive sensor target causes changes in the third current and the fourth current.
5. The assembly according to claim 4, wherein: The first coil, the second coil, the third coil, and the fourth coil are transmitting coils.
6. The assembly according to claim 4, wherein: The first coil, the second coil, the third coil, and the fourth coil are receiving coils.
7. An inductive sensor assembly comprising: Rotation sensing sensor target; as well as a printed circuit board (PCB) located opposite the rotational inductive sensor target, the inductive sensor assembly including a first inductive sensor circuit defined on the PCB, the first inductive sensor circuit including a first coil circuit including a first coil having a first current in a first flow direction and a second coil having a second current in a second flow direction opposite the first flow direction, Wherein, the first inductive sensor circuit is configured such that rotation of the rotational inductive sensor target causes changes in the first current and the second current in the first coil and the second coil.
8. The assembly according to claim 7, wherein: The first coil and the second coil are transmitting coils.
9. The assembly according to claim 7, wherein: The first coil and the second coil are receiving coils.
10. The assembly according to claim 7, wherein: The inductive sensor assembly includes a second inductive sensor circuit defined on the PCB, the second inductive sensor circuit including a second coil circuit, the second coil circuit including a third coil having a third current in a third flow direction and a fourth coil having a fourth current in a fourth flow direction opposite to the third flow direction, wherein the second inductive sensor circuit is configured such that rotation of the rotational inductive sensor target causes changes in the third current and the fourth current.
11. The assembly according to claim 10, wherein The first coil, the second coil, the third coil, and the fourth coil are transmitting coils.
12. The assembly according to claim 10, wherein: The first coil, the second coil, the third coil, and the fourth coil are receiving coils.
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