Electroplating method and electroplating device

Abstract

The invention provides an electroplating method and an electroplating device, and relates to the technical field of semiconductor processing, the electroplating method comprises the following steps: S10, applying a positive voltage to a middle anode, and enabling an edge electrode not to work; s20, the deposition rate v1 of the plating layer in the middle area is obtained, and the deposition rate v2 of the plating layer in the edge area is obtained; s30, judging the size of v1 and v2; s40, if v1gt; v2, applying a positive voltage to the edge electrode, and outputting a current I; s50, if v1lt; v2, applying a negative voltage to the edge electrode and outputting a current I; and S60, if v1 is equal to v2, keeping the working state of the edge electrode unchanged. According to the method, the deposition rates of the plating layers in the middle area and the edge area are obtained respectively, the voltage and the current of the edge electrode are controlled according to the deposition rates, the deposition rate of the edge area can be dynamically adjusted, the deposition rates of the edge area and the middle area can be balanced in real time, and therefore the electroplating uniformity is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and more specifically, to an electroplating method and an electroplating device. Background Art

[0002] In the field of electroplating, a seed layer is a relatively thin metal layer formed on the surface of a substrate by chemical or physical methods. The seed layer is an essential step in the electroplating process, and it plays a role in guiding and promoting metal deposition. In order to increase the area of the effective electroplating region, the electrical contact positions of the existing electroplating devices with the seed layer on the substrate are all in the edge region of the substrate, and there is no direct contact in the central region of the substrate.

[0003] The higher the resistivity of the seed layer material and the thinner the thickness, the greater the resistance, and the greater the difference in current density distribution. Since the electrical contact position is in the edge region of the substrate, the current density in the edge region of the substrate will be much greater than that in the central region of the substrate. This non-uniform distribution of current density will result in a thick coating at the edge of the substrate and a thin coating in the center, showing a serious non-uniform phenomenon.

[0004] In response to this situation, the current solution is to use an electroplating device with multiple anodes, each anode being independently controlled. According to the known coating thickness difference obtained from preliminary experiments, the power of each anode during the electroplating process is controlled by a preset program. However, the adaptability of this solution is poor and it can only be used for a specific seed layer. After the seed layer is replaced, the program needs to be reset. Summary of the Invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides an electroplating method and an electroplating device.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] An electroplating method includes providing an electroplating device. The electroplating device includes a central anode and edge electrodes. The central anode corresponds to the central region of the substrate, and the edge electrodes correspond to the edge region of the substrate. The electroplating method further includes:

[0008] S10. Applying a positive voltage to the central anode, and the edge electrodes are not working;

[0009] S20. Obtaining the deposition rate v1 of the coating in the central region and obtaining the deposition rate v2 of the coating in the edge region;

[0010] S30. Judging the magnitudes of v1 and v2;

[0011] S40. If v1>v2, applying a positive voltage to the edge electrodes and outputting a current I;

[0012] S50. If v1 < v2, apply a negative voltage to the edge electrode and output current I.

[0013] S60. If v1 = v2, keep the operating state of the edge electrode unchanged.

[0014] The above method first applies a positive voltage to the central anode, with the edge electrode not working. By respectively obtaining the deposition rates of the coatings in the central region and the edge region, the difference in the deposition rates between the edge region and the central region can be known. Based on this difference, the voltage and output current of the edge electrode are controlled, making the coating thicknesses in the central region and the edge region of the substrate closer, thereby improving the electroplating uniformity.

[0015] The present invention also provides an electroplating device, which includes: an electroplating tank for containing electroplating solution, and the electroplating device further includes:

[0016] A central anode disposed in the electroplating solution and corresponding to the central region of the substrate;

[0017] A central power supply connected to the edge region of the substrate and the central anode for applying a positive voltage to the central anode and a negative voltage to the substrate;

[0018] An edge electrode disposed around the outer periphery of the central electrode and corresponding to the edge region of the substrate;

[0019] An edge power supply connected to the clamping region of the substrate and the edge electrode;

[0020] A central rate detection module for obtaining the coating deposition rate v1 of the central region of the substrate;

[0021] An edge rate detection module for obtaining the coating deposition rate v2 of the edge region of the substrate;

[0022] A control module is used to compare the magnitudes of v1 and v2, and according to the comparison result, control the positive / negative voltage and current magnitude applied by the edge power supply to the edge electrode.

[0023] The above electroplating device is provided with a central power supply and an edge power supply. The central power supply can independently supply power to the central anode, and the edge power supply can independently supply power to the edge electrode. The control of the central anode and the edge electrode is relatively independent. By setting a central rate detection module and an edge rate detection module, the coating deposition rates in the central region and the edge region can be obtained in real time. Under the action of the control module, the output of the edge power supply can be intelligently controlled according to the magnitudes of v1 and v2, so that v2 always approaches v1 until it is the same as v1. This device can make the coating thickness of the substrate more uniform and can form a closed-loop control. It can also be applied after the resistance of the seed layer changes, and has a wider adaptability.

[0024] The present invention also provides an electroplating method, including providing an electroplating device. The electroplating device includes a central anode and an edge electrode. The central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. The electroplating method further includes:

[0025] S1000. Apply a positive voltage to the central anode, apply a positive voltage to the edge electrode, and output a current I;

[0026] S1100. Obtain the deposition rate v1 of the coating in the central region, and obtain the deposition rate v2 of the coating in the edge region;

[0027] S1200. Judge the magnitudes of v1 and v2;

[0028] S1300. If v1>v2, apply a positive voltage to the edge electrode, increase the output current I, and return to step S1100;

[0029] S1400. If v1 = v2, keep the working state of the edge electrode unchanged;

[0030] S1500. If v1<v2, apply a positive voltage to the edge electrode, and decrease the output current I.

[0031] In the initial step S1000 of the above method, a positive voltage is applied to the edge electrode and a current I is output. In the case where the resistance of the seed layer of the substrate is relatively small, assuming that only the central anode is set to work, v1 will be greater than v2. Therefore, by using this method, v2 can be quickly adjusted so that v2 can approach v1 faster, thereby accelerating the adjustment speed.

[0032] The present invention also provides an electroplating method, including providing an electroplating device. The electroplating device includes a central anode and an edge electrode. The central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. The electroplating method further includes:

[0033] S2000. Apply a positive voltage to the central anode, apply a negative voltage to the edge electrode, and output a current I;

[0034] S2100. Obtain the deposition rate v1 of the coating in the central region and obtain the deposition rate v2 of the coating in the edge region;

[0035] S2200. Determine the magnitudes of v1 and v2;

[0036] S2300. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100;

[0037] S2400. If v1 = v2, keep the operating state of the edge electrode unchanged;

[0038] S2500. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

[0039] In the initial step S2000 of the above method, a negative voltage is applied to the edge electrode and a current I is output. In the case where the resistance of the seed layer of the substrate is relatively large, assuming only the central anode works, v2 will be greater than v1. Therefore, by using this method, v2 can be quickly adjusted so that v2 can approach v1 faster, thereby accelerating the adjustment speed. Brief Description of the Drawings

[0040] The features and properties of the present invention are further described by the following embodiments and their accompanying drawings.

[0041] Figure 1A Schematic diagram of the electroplating device according to Embodiment 1 of the present invention;

[0042] Figure 1B Schematic diagram of the division of different regions of the wafer according to Embodiment 1 of the present invention;

[0043] Figure 2 Schematic diagram of the electric field when the edge electrode is at a positive voltage according to Embodiment 1 of the present invention;

[0044] Figure 3 Schematic diagram of the electric field when the edge electrode is closed according to Embodiment 1 of the present invention;

[0045] Figure 4 Schematic diagram of the electric field when the edge electrode is at a negative voltage according to Embodiment 1 of the present invention;

[0046] Figure 5 Schematic diagram of the central rate detection module according to Embodiment 1 of the present invention;

[0047] Figure 6 Schematic diagram of the central thickness detector according to Embodiment 1 of the present invention;

[0048] Figure 7 Schematic diagram of the edge rate detection module of Embodiment 1 of the present invention;

[0049] Figure 8 Schematic diagram of the edge thickness detector of Embodiment 1 of the present invention;

[0050] Figure 9 Schematic diagram of the distribution of the middle eddy current sensor and the edge eddy current sensor of Embodiment 1 of the present invention;

[0051] Figure 10 Flow chart of the electroplating method of Embodiment 2 of the present invention;

[0052] Figure 11 Flow chart of the electroplating method of Embodiment 3 of the present invention;

[0053] Figure 12 Flow chart of the electroplating method of Embodiment 4 of the present invention. Detailed implementation manners

[0054] To describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following will be described in detail in conjunction with embodiments and accompanied by drawings, but the present invention is not limited to the scope of the described embodiments.

[0055] Embodiment 1

[0056] In an electroplating device with multiple anodes, independent or common control can be performed for different anodes. The current control methods are all open-loop controls, without a feedback function, unable to adjust the output power of different anodes in real time according to the state of the coating thickness, and unable to form a closed-loop control. Therefore, when the seed layer is replaced, the control program needs to be adjusted to adapt to the new seed layer, and the adaptability is poor. Moreover, during the electroplating process, the thickness change of the coating cannot be detected in real time, and the uniformity of the coating is uncontrollable.

[0057] Such as Figure 1A 、 Figure 1B and Figure 2As shown in the figure, this embodiment provides an electroplating apparatus capable of adjusting the output power of the edge electrode 400 in real time according to the deposition rate of the plating layer, which includes: an electroplating tank 150, a cathode fixture 100, a middle anode 200, a middle power supply 300, an edge electrode 400, an edge power supply 500, a middle rate detection module 600, an edge rate detection module 700, and a control module 800. The electroplating tank 150 is used to hold the electroplating solution. The cathode fixture 100 is used to hold the substrate 910. The substrate 910 includes a middle region 913, an edge region 912, and a clamping region 911. The middle anode 200 is disposed in the electroplating solution and corresponds to the middle region 913 of the substrate 910. The negative electrode of the middle power supply 300 is connected to the clamping region 911 of the substrate 910 through the cathode fixture 100, and is used to apply a negative voltage to the substrate 910. The positive electrode of the middle power supply 300 is connected to the middle anode 200, and is used to apply a positive voltage to the middle anode 200. The edge electrode 400 is disposed around the outer periphery of the middle anode 200 and corresponds to the edge region 912 of the substrate 910. The edge power supply 500 is connected to the clamping region 911 of the substrate 910 through the cathode fixture 100. And the edge power supply 500 is also connected to the edge electrode 400, and is used to apply a positive voltage or a negative voltage to the edge electrode 400. The middle rate detection module 600 is used to obtain the plating layer deposition rate v1 of the middle region 913 of the substrate 910. The edge rate detection module 700 is used to obtain the plating layer deposition rate v2 of the edge region 912 of the substrate 910. The control module 800 is used to compare the magnitudes of v1 and v2, and according to the comparison result, control the positive and negative of the voltage and the magnitude of the current applied by the edge power supply 500 to the edge electrode 400.

[0058] In other embodiments, the middle power supply 300 and the edge power supply 500 may also be directly connected to the clamping region 911 of the substrate 910.

[0059] The electroplating apparatus is provided with a middle power supply 300 and an edge power supply 500. The middle power supply 300 can independently supply power to the middle anode 200, and the edge power supply 500 can independently supply power to the edge electrode 400. The control of the middle anode 200 and the edge electrode 400 is relatively independent. By setting the middle rate detection module 600 and the edge rate detection module 700, the plating layer deposition rates of the middle region 913 and the edge region 912 can be obtained in real time. Under the action of the control module 800, the output of the edge power supply 500 can be intelligently controlled according to the magnitudes of v1 and v2, so that v2 always approaches v1 until it is the same as v1. Through this control method of the electroplating apparatus, the plating layer thickness of the substrate 910 is more uniform, and a closed-loop control can be formed. After the resistance of the seed layer changes, it can also be applied, and the adaptability is wider.

[0060] Reference Figure 1B and Figure 2, To increase the area of the effective electroplating region, the central power supply 300 and the edge power supply 500 of the electroplating device supply power to the seed layer 920 on the substrate 910 through the contact pins 930 of the cathode fixture 100. The contact position of the contact pins 930 with the seed layer 920 is located in the clamping region 911 of the substrate 910. The greater the resistance of the seed layer 920, the more serious the edge effect of the substrate 910. For example, when the seed layer uses cobalt material, due to the poor conductivity of cobalt, the electric field strength in the edge region 912 of the substrate 910 will be much greater than that in the central region 913, which will further cause the current density in the edge region 912 of the substrate 910 to be much greater than that in the central region 913, resulting in the plating thickness in the edge region 912 of the substrate 910 being higher than that in the central region 913 of the substrate 910.

[0061] The edge electrode 400 is usually applied with a positive voltage to improve the edge effect problem by applying an appropriate current. However, as Figure 3 shown, when the resistance of the seed layer 920 is particularly large, even if the edge electrode 400 corresponding to the edge region 912 of the substrate 910 does not work, that is, the output current of the edge power supply 500 is reduced to zero, the electric field strength in the edge region 912 of the substrate 910 will still be greater than that in the central region 913 of the substrate 910, and the plating in the edge region 912 of the substrate 910 will still be thicker than that in the central region 913 of the substrate 910. In view of this situation, the edge power supply 500 in this embodiment can also apply a negative voltage to the edge electrode 400. The voltages of the edge electrode 400 and the central anode 200 are both referenced to the substrate potential. For example, the substrate potential is regarded as 0 potential.

[0062] The edge power supply 500 can apply positive and negative voltages to the edge electrode 400 and can adapt to seed layers with different resistance values. When the resistance of the seed layer 920 of the substrate 910 is small, the edge power supply 500 applies a positive voltage to the edge electrode 400, and the distribution of the electric field lines in the edge region 912 and the central region 913 of the substrate 910 is relatively uniform. Specifically, the electric field line density (i.e., the electric field strength) in the edge region 912 of the substrate 910 is slightly greater than that in the central region 913. In this case, only by reducing the output current of the edge power supply 500 can the electric field line density in the edge region 912 and the central region 913 of the substrate 910 be regulated to achieve the same plating deposition rate in the two regions. The greater the resistance of the seed layer 920 of the substrate 910, the greater the difference in the distribution of the electric field lines between the central region 913 and the edge region 912 of the substrate 910. When the resistance of the seed layer 920 of the substrate 910 is large to a certain extent, even if the current output is stopped when the edge power supply 500 applies a positive voltage to the edge electrode 400, the difference in the plating deposition rate between the edge region 912 and the central region 913 cannot be balanced. In this situation, as Figure 4As shown, the edge power supply 500 can apply a negative voltage to the edge electrode 400, absorb a part of the electric field lines emitted by the middle anode 200 to the edge region 912 of the substrate 910, further reduce the plating deposition rate of the edge region 912, so that the plating layers in the middle region 913 and the edge region 912 of the substrate 910 are more uniform.

[0063] It should be noted that Figure 2 、 Figure 3 and Figure 4 are only used to illustrate the distribution of electric field lines when the edge electrode 400 is in different states, and do not represent the actual electric field distribution.

[0064] As Figure 5 shown, the middle rate detection module 600 includes a middle thickness detector 610 and a middle rate calculation module 620. The middle thickness detector 610 is used to obtain the thickness value of the plating layer in the middle region of the substrate 910, and the middle rate calculation module 620 is used to calculate the deposition rate of the plating layer in the middle region of the substrate 910 according to the thickness value of the plating layer in the middle region of the substrate 910 and the detection frequency of the middle thickness detector 610.

[0065] Furthermore, as Figure 6 and Figure 9 shown, the middle thickness detector 610 includes a plurality of middle eddy current sensors 611 and a middle thickness calculation module 612. The middle eddy current sensors 611 are distributed at intervals on the non-electroplating surface of the middle region 913 of the substrate 910. The middle thickness calculation module 612 is connected to the middle eddy current sensors 611, and the middle thickness calculation module 612 is used to receive the electrical signals of the middle eddy current sensors 611 and output the average thickness value of the plating layer in the middle region 913 of the substrate 910.

[0066] As Figure 7 shown, the edge rate detection module 700 includes an edge thickness detector 710 and an edge rate calculation module 720. The edge thickness detector 710 is used to obtain the thickness value of the plating layer in the edge region of the substrate 910, and the edge rate calculation module 720 is used to calculate the deposition rate of the plating layer in the edge region of the substrate 910 according to the thickness value of the plating layer in the edge region of the substrate 910 and the detection frequency of the edge thickness detector 710.

[0067] Furthermore, as Figure 8 and Figure 9As shown in the figure, the edge thickness detector 710 includes a plurality of edge eddy current sensors 711 and an edge thickness calculation module 712. The edge eddy current sensors 711 are distributed at intervals on the non-electroplated surface of the edge area 912 of the substrate 910. The edge thickness calculation module 712 is connected to the edge eddy current sensors 711. The edge thickness calculation module 712 is used to receive the electrical signals of the edge eddy current sensors 711 and output the average thickness value of the coating on the edge area 912 of the substrate 910.

[0068] Specifically, both the middle thickness detector 610 and the edge thickness detector 710 are connected to the power supply through slip rings. The power supply is used to supply power to the middle thickness detector 610 and the edge thickness detector 710, so as to maintain synchronous rotation with the substrate 910.

[0069] The control module 800, the middle thickness calculation module, and the edge thickness calculation module 712 can be implemented in a software, hardware, or software-hardware combination manner.

[0070] In addition, the specific implementation manners of the middle rate detection module 600 and the edge rate detection module 700 are not limited to the solutions in this embodiment, and relatively mature solutions in the prior art can also be adopted.

[0071] Embodiment 2

[0072] This embodiment also provides an electroplating method. The electroplating device used includes a middle anode and an edge electrode. The middle anode corresponds to the middle area of the substrate, and the edge electrode corresponds to the edge area of the substrate. An exemplary electroplating device is shown in Figure 1, although the implementation environment of the electroplating method in this embodiment is not limited thereto.

[0073] Refer to Figure 10 , the electroplating method in this embodiment specifically includes:

[0074] S10. Apply a positive voltage to the middle anode, and the edge electrode does not work.

[0075] S20. Obtain the deposition rate v1 of the coating in the middle area of the substrate, and obtain the deposition rate v2 of the coating in the edge area of the substrate.

[0076] S30. Judge the magnitudes of v1 and v2.

[0077] S40. If v1 > v2, apply a positive voltage to the edge electrode and output a current I.

[0078] S50. If v1 < v2, apply a negative voltage to the edge electrode and output a current I.

[0079] S60. If v1 = v2, keep the working state of the edge electrode unchanged. That is, do not adjust the voltage of the edge electrode and the output current I.

[0080] The output current I in steps S40 and S50 is the initial preset value, and the two can be the same or different. The output current I in subsequent steps is the current value after changing based on this initial preset value.

[0081] Through the central anode and the edge electrode, the deposition rates of the coatings in the central region and the edge region of the substrate can be controlled respectively. In this method, first a positive voltage is applied to the central anode, and the edge electrode does not work. By respectively obtaining the deposition rates of the coatings in the central region and the edge region, the difference in the deposition rates between the edge region and the central region can be known. Based on this difference, the voltage and output current of the edge electrode are controlled, so that the coating thicknesses in the central region and the edge region of the substrate are closer, thereby improving the plating uniformity.

[0082] Among them, for v1 = v2, a deviation can be set according to actual usage requirements, that is, the difference between v1 and v2 within the preset range can be regarded as v1 = v2.

[0083] After step S40, it further includes:

[0084] S41. Obtain v1 and v2.

[0085] S42. Judge the magnitudes of v1 and v2.

[0086] S43. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

[0087] S45. If v1 = v2, keep the working state of the edge electrode unchanged.

[0088] S46. If v1 > v2, apply a positive voltage to the edge electrode and increase the output current I, and then return to step S41.

[0089] After step S43, it further includes:

[0090] S44. Judge whether the output current I is 0. If I is not equal to 0, return to step S41; if I is equal to 0, return to step S30.

[0091] By adopting the method of closed-loop control, the voltage of the edge electrode and the output current I can be dynamically adjusted according to the magnitudes of v1 and v2 until v1 = v2, thereby further improving the uniformity of substrate electroplating. In step S43, by reducing the output current I, v2 can be decreased. In step S44, if the output current I is not equal to 0, return to step S41. When a positive voltage is applied to the edge electrode, by controlling the magnitude of the output current I, the magnitude of v2 can be changed until v1 = v2. If the output current I is equal to 0, it means that the edge electrode has stopped working and v1 may still be less than v2. In this case, it is necessary to return to step S30, and v2 can be further adjusted by changing the positive and negative of the voltage of the edge electrode.

[0092] After step S50, it further includes:

[0093] S51. Obtain v1 and v2.

[0094] S52. Judge the magnitudes of v1 and v2.

[0095] S53. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I.

[0096] S54. If v1 = v2, keep the working state of the edge electrode unchanged.

[0097] S55. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

[0098] In this embodiment, after step S55, it further includes:

[0099] S56. Judge whether the output current I is 0. If I is not equal to 0, return to step S51; if I is equal to 0, return to step S30.

[0100] In step S50, by applying a negative voltage to the edge electrode, a part of the electric field of the middle anode can be transferred, thereby reducing v2. After step S50, by obtaining the magnitudes of v1 and v2 again and adjusting the magnitude of the output current I according to the magnitudes of v1 and v2, v2 can be dynamically adjusted so that v1 can be equal to v2. And, in step S56, if I is not equal to 0, return to step S51 to re-perform dynamic adjustment; if I is equal to 0, it means that the edge electrode has stopped working and v1 may still be greater than v2. In this case, it is necessary to return to step S30, so that the edge electrode can be controlled to switch from negative voltage to positive voltage to further adjust v2.

[0101] In this embodiment, the step of obtaining the deposition rate v1 of the coating in the middle region in step S20 specifically includes:

[0102] S21. Arrange a middle thickness detector on the non-electroplated surface of the middle region;

[0103] S22. Calculate v1 based on the thickness value output by the middle thickness detector and the detection frequency of the middle thickness detector.

[0104] Specifically, the detection frequency refers to the number of times the middle thickness detector measures the thickness per second. For example, if the detection frequency is 10 Hz, it means the detector can perform 10 thickness measurements per second. By multiplying the difference between the two output thickness values by the detection frequency, v1 can be calculated.

[0105] Furthermore, the middle thickness detector includes multiple middle eddy current sensors and a middle thickness calculation module. The corresponding relationship between the electrical signals output by the middle eddy current sensors and the coating thickness is obtained through a standard sample. The middle thickness calculation module receives the electrical signals output by multiple middle eddy current sensors and outputs the thickness value by taking the average according to the corresponding relationship between the electrical signals output by these middle eddy current sensors and the coating thickness.

[0106] In this embodiment, the steps of obtaining the deposition rate v2 of the coating in the edge region in step S20 specifically include:

[0107] S23. Arrange an edge thickness detector on the non-electroplated surface of the edge region.

[0108] S24. Calculate v2 based on the thickness value output by the edge thickness detector and the detection frequency of the edge thickness detector.

[0109] Among them, the calculation principle of v2 is the same as that of v1.

[0110] Furthermore, the edge thickness detector includes multiple edge eddy current sensors and an edge thickness calculation module. The corresponding relationship between the electrical signals output by the edge eddy current sensors and the coating thickness is obtained through a standard sample. The edge thickness calculation module receives the electrical signals output by multiple edge eddy current sensors and outputs the thickness value by taking the average according to this corresponding relationship.

[0111] The methods for obtaining the deposition rate v1 of the coating in the middle region and the deposition rate v2 of the coating in the edge region are not limited to this, and relatively mature electroplating deposition rate detection technologies in the prior art can also be used.

[0112] Embodiment 3

[0113] Reference Figure 11 , this embodiment provides an electroplating method, which includes:

[0114] S1000. Apply a positive voltage to the middle anode, apply a positive voltage to the edge electrode, and output a current I.

[0115] S1100. Obtain the deposition rate v1 of the coating in the central region and obtain the deposition rate v2 of the coating in the edge region.

[0116] S1200. Judge the magnitudes of v1 and v2.

[0117] S1300. If v1 > v2, apply a positive voltage to the edge electrode, increase the output current I, and return to step S1100.

[0118] S1400. If v1 = v2, keep the working state of the edge electrode unchanged.

[0119] S1500. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

[0120] Different from Embodiment 2, in this embodiment, in the initial step S1000, a positive voltage is applied to the edge electrode and the output current I is output. In the case where the resistance of the seed layer of the substrate is relatively small, assuming that only the central anode works, v1 will be greater than v2. Therefore, by using this method, v2 can be quickly adjusted so that v2 can approach v1 faster, thereby accelerating the adjustment speed.

[0121] The subsequent control logic is similar to the control logic in Embodiment 2 and will not be repeated here for explanation.

[0122] After step S1500, it further includes:

[0123] S1600. Judge whether the output current I is 0. If I is not equal to 0, return to step S1100; if I is equal to 0, execute step S1700. Apply a negative voltage to the edge electrode and output the current I.

[0124] After step S1700, it further includes:

[0125] S1710. Obtain v1 and v2.

[0126] S1720. Judge the magnitudes of v1 and v2.

[0127] S1730. If v1 < v2, apply a negative voltage to the edge electrode, increase the output current I, and then return to step S1710.

[0128] S1740. If v1 = v2, keep the working state of the edge electrode unchanged.

[0129] S1750. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

[0130] After step S1750, it further includes:

[0131] S1760. Determine whether the output current I is 0. If I is not equal to 0, return to step S1710; if I is equal to 0, return to step S1000.

[0132] Example 4

[0133] Reference Figure 12 , this example provides an electroplating method, which includes:

[0134] S2000. Apply a positive voltage to the middle anode, apply a negative voltage to the edge electrode, and output a current I.

[0135] S2100. Obtain the deposition rate v1 of the coating in the middle region and obtain the deposition rate v2 of the coating in the edge region.

[0136] S2200. Judge the magnitudes of v1 and v2.

[0137] S2300. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100.

[0138] S2400. If v1 = v2, keep the working state of the edge electrode unchanged.

[0139] S2500. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

[0140] Different from Example 2, in this example, in the initial step S2000, a negative voltage is applied to the edge electrode and a current I is output. In the case where the seed layer resistance of the substrate is relatively large, assuming that only the middle anode is set to work, v2 will be greater than v1. Therefore, by using this method, v2 can be quickly adjusted so that v2 can approach v1 faster, thereby accelerating the adjustment speed.

[0141] The subsequent control logic is similar to that in Example 2 and will not be repeated here.

[0142] After step S2500, it further includes:

[0143] S2600. Determine whether the output current I is 0. If I is not equal to 0, return to step S2100; if I is equal to 0, execute step S2700. Apply a positive voltage to the middle anode, apply a positive voltage to the edge electrode, and output a current I.

[0144] After step 2700, it further includes:

[0145] S2710. Obtain v1 and v2.

[0146] S2720. Judge the magnitudes of v1 and v2.

[0147] S2730. If v1 > v2, apply a positive voltage to the edge electrode and increase the output current I, then return to step S2710.

[0148] S2740. If v1 = v2, keep the operating state of the edge electrode unchanged.

[0149] S2750. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

[0150] After step S2750, it further includes:

[0151] S2760. Determine whether the output current I is 0. If I = 0, return to step S2000; if I is not equal to 0, return to step S2710.

[0152] Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that these are only examples. Without departing from the principles and essence of the present invention, various changes or modifications can be made to these embodiments. Therefore, the protection scope of the present invention is defined by the appended claims.

Claims

1. An electroplating method, characterized in that: including providing an electroplating device, the electroplating device including a central anode and an edge electrode, the central anode corresponding to the central region of the substrate, the edge electrode corresponding to the edge region of the substrate, the electroplating method further including: S10. Applying a positive voltage to the central anode, with the edge electrode not working; S20. Obtaining the deposition rate v1 of the coating layer in the central region and obtaining the deposition rate v2 of the coating layer in the edge region; S30. Judging the magnitudes of v1 and v2; S40. If v1 > v2, applying a positive voltage to the edge electrode and outputting a current I; S50. If v1 < v2, applying a negative voltage to the edge electrode and outputting a current I; S60. If v1 = v2, keeping the working state of the edge electrode unchanged.

2. The electroplating method according to claim 1, characterized in that: After the step S40, it further includes: S41. Obtaining v1 and v2; S42. Judging the magnitudes of v1 and v2; S43. If v1 < v2, applying a positive voltage to the edge electrode and reducing the output current I; S45. If v1 = v2, keeping the working state of the edge electrode unchanged; S46. If v1 > v2, applying a positive voltage to the edge electrode and increasing the output current I, and then returning to step S41.

3. The electroplating method according to claim 2, characterized in that: After the step S43, it further includes: S44. Judging whether the output current I is 0. If I is not equal to 0, returning to step S41; if I is equal to 0, returning to step S30.

4. The electroplating method according to claim 1, wherein: After the step S50, it further includes: S51. Obtaining v1 and v2; S52. Judging the magnitudes of v1 and v2; S53. If v1 < v2, applying a negative voltage to the edge electrode and increasing the output current I; S54. If v1 = v2, keeping the working state of the edge electrode unchanged; S55. If v1 > v2, applying a negative voltage to the edge electrode and reducing the output current I.

5. The electroplating method according to claim 4, characterized in that: After the step S55, it further includes: S56. Judging whether the output current I is 0. If I is not equal to 0, returning to step S51; if I is equal to 0, returning to step S30.

6. The electroplating method according to claim 1, wherein: The step S20 specifically includes: Arranging a central thickness detector on the non-electroplating surface of the central region; Calculating v1 based on the thickness value output by the central thickness detector and the detection frequency of the central thickness detector; Arranging an edge thickness detector on the non-electroplating surface of the edge region; Calculating v2 based on the thickness value output by the edge thickness detector and the detection frequency of the edge thickness detector.

7. The electroplating method according to claim 6, characterized in that: The central thickness detector includes a plurality of central eddy current sensors and a central thickness calculation module. The method includes: obtaining the corresponding relationship between the electrical signals output by the central eddy current sensors and the coating layer thickness through a standard sample piece. The central thickness calculation module receives the electrical signals output by the plurality of central eddy current sensors and outputs a thickness value by taking the average according to the corresponding relationship. The edge thickness detector includes multiple edge eddy current sensors and an edge thickness calculation module. The method includes: obtaining the correspondence between the electrical signal output by the edge eddy current sensor and the coating thickness through a standard sample, the edge thickness calculation module receives the electrical signals output by the multiple edge eddy current sensors and outputs the thickness value by taking the average value according to the correspondence.

8. An electroplating device, comprising an electroplating tank, the electroplating tank being used to contain an electroplating solution, characterized in that: The electroplating device also includes: A middle anode, disposed in the electroplating solution and corresponding to a middle region of the substrate; a middle power supply connected to the clamping area of ​​the substrate and the middle anode, for applying a positive voltage to the middle anode and a negative voltage to the substrate; an edge electrode, disposed around the periphery of the middle electrode and corresponding to an edge region of the substrate; an edge power supply connected to the clamping area and the edge electrode of the substrate; A middle rate detection module, used to obtain a coating deposition rate v1 in a middle area of ​​the substrate; An edge rate detection module, used to obtain a coating deposition rate v2 of an edge area of ​​the substrate; The control module is used to compare the magnitudes of v1 and v2, and control the voltage and current magnitude applied by the edge power supply to the edge electrode according to the comparison result.

9. The electroplating device according to claim 8, characterized in that: The middle rate detection module comprises: The middle thickness detector is used to obtain the thickness value of the coating; The middle rate calculation module is used to calculate the deposition rate of the coating in the middle area according to the thickness value and the detection frequency of the middle thickness detector.

10. The electroplating device according to claim 9, characterized in that: The middle thickness detector comprises: A plurality of middle eddy current sensors are spaced apart and distributed on the non-electroplated surface in the middle region of the substrate; The middle thickness calculation module is connected to the plurality of middle eddy current sensors, and is used to receive electrical signals from the plurality of middle eddy current sensors and output an average thickness value of the middle area.

11. The electroplating device according to claim 8, characterized in that: The edge rate detection module comprises: Edge thickness detector, used to obtain the thickness value of the coating; The edge rate calculation module is used to calculate the deposition rate of the coating in the edge area according to the thickness value and the detection frequency of the edge thickness detector.

12. The electroplating device according to claim 11, characterized in that: The edge thickness detector comprises: A plurality of edge eddy current sensors are spaced apart and distributed on the non-electroplated surface of the edge region of the substrate; The edge thickness calculation module is connected to the plurality of edge eddy current sensors and is used to receive electrical signals from the plurality of edge eddy current sensors and output an average thickness value of the edge area.

13. An electroplating method, characterized in that: The invention provides an electroplating device, wherein the electroplating device comprises a central anode and an edge electrode, wherein the central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. The electroplating method further comprises: S1000, applying a positive voltage to the middle anode, applying a positive voltage to the edge electrode, and outputting a current I; S1100, obtaining a deposition rate v1 of the coating in the middle region, and obtaining a deposition rate v2 of the coating in the edge region; S1200, determine the size of v1 and v2; S1300, if v1>v2, apply a positive voltage to the edge electrode, increase the output current I, and return to step S1100; S1400. If v1 = v2, keep the operating state of the edge electrode unchanged; S1500. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

14. The electroplating method according to claim 13, characterized in that: After step S1500, it further includes: S1600. Determine whether the applied current I is 0. If I is not equal to 0, return to step S1100; If I is equal to 0, then execute step S1700, apply a negative voltage to the edge electrode, and output the current I.

15. The electroplating method according to claim 14, characterized in that: After step S1700, it further includes: S1710. Obtain v1 and v2; S1720. Determine the magnitudes of v1 and v2; S1730. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S1710; S1740. If v1 = v2, keep the operating state of the edge electrode unchanged; S1750. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

16. The electroplating method according to claim 15, characterized in that: After step S1750, it further includes: S1760. Determine whether the output current I is 0. If I is not equal to 0, return to step S1710; If I is equal to 0, return to step S1000.

17. An electroplating method, characterized in that: It includes providing an electroplating device. The electroplating device includes a central anode and an edge electrode. The central anode corresponds to the central region of the substrate, and the edge electrode corresponds to the edge region of the substrate. The electroplating method further includes: S2000. Apply a positive voltage to the central anode, apply a negative voltage to the edge electrode, and output the current I; S2100. Obtain the deposition rate v1 of the coating in the central region and obtain the deposition rate v2 of the coating in the edge region; S2200. Determine the magnitudes of v1 and v2; S2300. If v1 < v2, apply a negative voltage to the edge electrode and increase the output current I, then return to step S2100; S2400. If v1 = v2, keep the operating state of the edge electrode unchanged; S2500. If v1 > v2, apply a negative voltage to the edge electrode and decrease the output current I.

18. The electroplating method according to claim 17, characterized in that: After step S2500, it further includes: S2600. Determine whether the output current I is 0. If I is not equal to 0, return to step S2100; if I is equal to 0, then execute step S2700, apply a positive voltage to the central anode, apply a positive voltage to the edge electrode, and output the current I.

19. The electroplating method according to claim 18, characterized in that: After step 2700, it further includes: S2710. Obtain v1 and v2; S2720. Determine the magnitudes of v1 and v2; S2730. If v1 > v2, apply a positive voltage to the edge electrode and increase the output current I, then return to step S2710; S2740. If v1 = v2, keep the operating state of the edge electrode unchanged; S2750. If v1 < v2, apply a positive voltage to the edge electrode and decrease the output current I.

20. The electroplating method according to claim 19, characterized in that: After step 2750, it further includes: S2760. Determine whether the output current I is 0. If I = 0, return to step S2000; If I is not equal to 0, return to step S2710.

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