A grinding and polishing equipment for the surface refinement treatment of semiconductor wafers

Abstract

A grinding and polishing device for the surface refinement treatment of semiconductor wafers, which relates to the technical field of semiconductor wafer surface polishing treatment. It includes a polishing processing box, in which a conveying and transferring component, a rough grinding and fine polishing component, an adsorption and clamping component, and a turning and surface-changing component are respectively arranged; the rough grinding and fine polishing component includes two fixed bases, the lower surfaces of each fixed base are respectively fixedly connected with a rotation driving motor, the end of the output shaft of the rotation driving motor is fixedly connected with a transmission vertical shaft, and the upper ends of the two transmission vertical shafts are respectively fixedly connected with a rough grinding wheel and a fine polishing pad; the two sides of the polishing processing box are respectively fixedly connected with a first side box and a second side box, a thickness detection component is arranged in the first side box, and a drying component is arranged in the second side box. The present invention solves the problems existing in the traditional polishing equipment when used for the surface treatment of semiconductor wafers, such as insufficient functional integration, limited polishing parts, inconvenient surface-changing operation, inability to detect the real-time polishing thickness, and inconvenient recovery of grinding fluid.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer surface polishing treatment, and specifically relates to a grinding and polishing device for semiconductor wafer surface refinement treatment. Background Art

[0002] As the core substrate for integrated circuit manufacturing, semiconductor wafers are usually made of high-purity monocrystalline silicon or third-generation semiconductor materials (such as SiC, GaN). Its production process covers key processes such as crystal growth, slicing, and polishing. The quality of the wafer directly determines the performance and yield of the chip. With the application of advanced processes (3nm and below) and wide-bandgap semiconductor materials, wafer technology is continuously evolving towards large size, low defects, and new materials.

[0003] Polishing is a key link in wafer manufacturing, aiming to achieve ultra-high flatness (nanoscale), low roughness, and no damaged layer on the wafer surface to meet the stringent requirements of subsequent processes such as lithography and thin film deposition. This process mainly includes two stages: grinding (rough grinding) and polishing (fine polishing), and polishing is further divided into mechanical polishing (MP) and chemical mechanical polishing (CMP).

[0004] Currently, semiconductor wafer polishing equipment still has significant defects in process adaptability and functionality, mainly reflected in:

[0005] 1. Poor flexibility in process switching: The equipment is difficult to efficiently switch between grinding and polishing modes, affecting production efficiency.

[0006] 2. Insufficient processing coverage: The polishing method is single, resulting in unqualified processing effects in local areas and affecting the overall uniformity.

[0007] 3. Low double-sided processing efficiency: When polishing the front and back sides of the wafer, it is necessary to frequently change the surface, which is cumbersome and prone to introducing contamination.

[0008] 4. Lack of real-time monitoring: Lack of on-line thickness detection function, making it difficult to dynamically adjust process parameters.

[0009] 5. Defects in grinding fluid management: The supply system is not reasonably designed, resulting in waste of grinding fluid and difficulty in recycling, increasing costs.

[0010] In summary, it is obvious that the existing technology has inconveniences and defects in actual use, so it is necessary to improve. Summary of the Invention

[0011] In view of the defects in the prior art, the present invention provides a grinding and polishing device for semiconductor wafer surface refinement treatment, which is used to solve the problems of insufficient functional integration, limited polishing parts, inconvenient surface changing operation, inability to detect the real-time polishing thickness, and inconvenient grinding fluid recycling when the traditional polishing equipment is used for semiconductor wafer surface treatment.

[0012] To achieve the above object, the present invention provides the following technical solutions:

[0013] A grinding and polishing device for surface refinement treatment of semiconductor wafers, comprising a polishing and processing box, wherein a conveying and transferring assembly, a rough grinding and fine polishing assembly, an adsorption and clamping assembly, and a turning and flipping assembly are respectively arranged in the polishing and processing box.

[0014] As an optimized solution, the adsorption and clamping assembly includes a transverse moving top seat slidably arranged on the inner top surface of the polishing and processing box. A transmission box is arranged below the transverse moving top seat in a lifting manner. A first mounting frame and a second mounting frame capable of rotating and revolving are respectively arranged in the transmission box. A first suction cup is fixedly arranged in the first mounting frame, and a second suction cup is fixedly arranged in the second mounting frame.

[0015] As an optimized solution, the turning and flipping assembly includes a face-changing operation box fixedly arranged on the inner bottom surface of the polishing and processing box. A first flipping seat and a second flipping seat are respectively rotatably arranged near the upper end opening of the face-changing operation box. Flipping limiting mechanisms are respectively arranged in the first flipping seat and the second flipping seat.

[0016] As an optimized solution, the rough grinding and fine polishing assembly includes two fixed bases symmetrically arranged on both sides of the face-changing operation box. A rotating drive motor is fixedly connected to the center of the lower surface of each fixed base. The output shaft end of the rotating drive motor passes through the fixed base upward and is fixedly connected to a transmission vertical shaft. The upper end of one of the transmission vertical shafts is fixedly connected to a horizontal rough grinding wheel, and the upper end of the other transmission vertical shaft is fixedly connected to a fine polishing pad.

[0017] As an optimized solution, a support sleeve is respectively sleeved outside each transmission vertical shaft. The lower ends of the support sleeves are respectively fixedly connected to the upper surface of the fixed base. A collection box is respectively slidably sleeved on the outer peripheral wall of each support sleeve. A plurality of symmetrically arranged grinding liquid spray heads are fixedly connected to the circumferential inner wall of each collection box.

[0018] As an optimized solution, a first side box and a second side box are respectively fixedly connected to both sides of the polishing and processing box. A thickness detection assembly is arranged in the first side box, and a drying assembly is arranged in the second side box.

[0019] As an optimized solution, the thickness detection assembly includes two symmetrically arranged steering mounting arms, which are respectively rotatably mounted on the inner top surface of the first side box. Two symmetric steering drive motors are fixedly connected to the upper surface of the first side box. The output shaft end of the steering drive motor passes through the first side box wall downward and is fixedly connected to the center of the upper surface of the steering mounting arm.

[0020] As an optimized solution, a detection probe that can expand and contract horizontally is respectively provided on the lower surface of each of the steering mounting arms.

[0021] As an optimized solution, the drying assembly includes a blower box fixedly connected to the longitudinal outer wall of the second side box. A rotating blower is provided inside the blower box. A three-way inlet pipe is fixedly connected to the longitudinal inner wall of the second side box, and an inlet check valve is provided inside the three-way inlet pipe.

[0022] As an optimized solution, a heating shunt box is respectively fixedly connected to each transverse inner wall of the second side box. Electric heating wires are respectively provided inside each heating shunt box. A number of air nozzles are fixedly connected to the longitudinal outer wall of the heating shunt box.

[0023] As an optimized solution, the three ports of the three-way inlet pipe are respectively fixedly connected and communicated to the blower box and the two heating shunt boxes.

[0024] As an optimized solution, a control panel is fixedly connected to the transverse side wall of the polishing and grinding processing box.

[0025] As an optimized solution, a conveying communication port is respectively opened on each longitudinal outer wall of the polishing and grinding processing box. The conveying and transferring assembly includes two parallel conveying clamping plates. The two conveying clamping plates pass through the two conveying communication ports and are fixedly connected to the polishing and grinding processing box.

[0026] As an optimized solution, a first conveying roller and a second conveying roller are respectively rotatably provided at both ends of the two conveying clamping plates. A conveyor belt is sleeved between the first conveying roller and the second conveying roller.

[0027] As an optimized solution, a first conveying motor is fixedly connected to the longitudinal outer wall of the first side box. The end of the output shaft of the first conveying motor passes through the conveying clamping plate and is fixedly connected to the first conveying roller. A second conveying motor is fixedly connected to the longitudinal outer wall of the second side box. The end of the output shaft of the second conveying motor passes through the conveying clamping plate and is fixedly connected to the second conveying roller.

[0028] As an optimized solution, the transverse moving top seat is a horizontally arranged square seat. Two guide rails are respectively fixedly connected to the longitudinal two sides of the transverse moving top seat. The guide rail is a U-shaped rail with a transverse opening, and the upper end of the guide rail is fixedly connected to the inner top surface of the polishing and grinding processing box.

[0029] As an optimized solution, a guide wheel is respectively rotatably provided on each longitudinal side end surface of the transverse moving top seat, and the end of the guide wheel is rotatably clamped in the corresponding guide rail.

[0030] As an optimized solution, a displacement driving motor is also fixedly connected to one side of the inner top surface of the polishing processing box. The end of the output shaft of the displacement driving motor is fixedly connected with a driving threaded rod, and the driving threaded rod horizontally passes through and is threadedly connected to the transverse moving top seat.

[0031] As an optimized solution, the transmission box is a cylindrical box with an open lower end. Four centrally symmetric lifting telescopic cylinders are fixedly connected to the lower surface of the transverse moving top seat, and the lower telescopic ends of the lifting telescopic cylinders are fixedly connected to the upper surface of the transmission box.

[0032] As an optimized solution, a transmission driving motor is fixedly connected to the center of the upper surface of the transmission box. The end of the output shaft of the transmission driving motor passes downward through the transmission box and is fixedly connected with a vertical rotating shaft, and a sun gear is rotatably arranged at the lower end of the vertical rotating shaft.

[0033] As an optimized solution, a planetary carrier is fixedly connected to the outer peripheral wall of the vertical rotating shaft. A limiting gear ring is fixedly connected to the circumferential inner wall of the transmission box. A first planetary gear and a second planetary gear are respectively rotatably installed on both sides of the lower surface of the planetary carrier. The first planetary gear and the second planetary gear are of the same size, and both the first planetary gear and the second planetary gear are clamped and meshed between the sun gear and the limiting gear ring.

[0034] As an optimized solution, the first mounting bracket is fixedly connected to the center of the lower surface of the first planetary gear, and the second mounting bracket is fixedly connected to the center of the lower surface of the second planetary gear.

[0035] As an optimized solution, vacuum generators are connected between the first suction cup and the first mounting bracket and between the second suction cup and the second mounting bracket. The size of the first suction cup is larger than that of the second suction cup.

[0036] As an optimized solution, a liquid storage tank is fixedly connected to the middle of the inner bottom surface of the polishing processing box. The liquid storage tank is a horizontally arranged square box.

[0037] As an optimized solution, a fixed column is fixedly connected to the middle of the upper surface of the liquid storage tank, and the upper end of the fixed column is fixedly connected to the center of the lower end surface of the surface-changing operation box.

[0038] As an optimized solution, both the first flipping seat and the second flipping seat are square seats. The size of the first flipping seat is larger than that of the second flipping seat.

[0039] As an optimized solution, the flipping limiting mechanism includes eight flipping support plates. The eight flipping support plates are divided into upper and lower layers. The flipping support plates are centrally symmetrically arranged and are respectively telescopically installed on the first flipping seat, and the flipping support plates are driven by telescopic cylinders.

[0040] As an optimized solution, a vertical support square column is fixedly connected to the middle of the inner bottom surface of the surface-changing operation box. Connecting rotating shafts are fixedly connected to the two transverse side ends of the first flipping seat. One of the connecting rotating shafts is rotatably installed on the transverse inner wall of the surface-changing operation box, and the other connecting rotating shaft is rotatably installed on the side end surface of the support square column.

[0041] As an optimized solution, a flipping driving motor is fixedly connected to the transverse outer wall of the surface-changing operation box near the lower end. The end of the output shaft of the flipping driving motor extends into the surface-changing operation box and is fixedly connected with a transmission gear. A driven gear meshing with the transmission gear is fixedly connected to the connecting rotating shaft.

[0042] As an optimized solution, the second flipping seat is rotatably arranged on the other side of the support square column and adopts the same flipping driving method as the first flipping seat.

[0043] As an optimized solution, the two fixed bases are respectively arranged on the transverse two sides of the liquid storage tank and are fixedly connected to the inner bottom surface of the abrasive machining box. The fixed base is a C-shaped seat with an opening facing downwards.

[0044] As an optimized solution, the collection box is a cylindrical box with an upper opening. The inner diameter size of the collection box is slightly larger than the outer diameter size of the transmission box.

[0045] As an optimized solution, a plurality of hydraulically telescopic cylinders that are centrosymmetric are fixedly connected to the upper surface of the fixed base. The upper telescopic ends of each hydraulically telescopic cylinder are respectively fixedly connected to the lower surface of the collection box.

[0046] As an optimized solution, the upper end of one of the support sleeves is rotationally abutted against the lower surface of the rough grinding wheel, and the upper end of the other support sleeve is rotationally abutted against the lower surface of the fine polishing pad.

[0047] As an optimized solution, a plurality of centrosymmetric water inlets are arranged on the outer peripheral wall of the support sleeve near the upper end. A return pipe is externally connected to the outer peripheral wall of the support sleeve near the lower end. The end of the return pipe is fixedly connected and communicated with the liquid storage tank.

[0048] As an optimized solution, a horizontal waste chip separation net is arranged in the middle of the interior of the liquid storage tank.

[0049] As an optimized solution, an annular shunt pipe is fixedly connected to the outer peripheral wall of each collection box. The annular shunt pipe is at the same horizontal height as a plurality of the grinding liquid spray nozzles. The grinding liquid spray nozzles and the annular shunt pipe are fixedly connected through a water inlet pipe.

[0050] As an optimized solution, each lateral side end face of the liquid storage tank is respectively connected to a booster water supply pump, the upper part of the booster water supply pump is externally connected to a water supply spiral pipe, and the upper end of the water supply spiral pipe is fixedly connected to the annular diverter pipe.

[0051] Compared with the prior art, the present invention has the following beneficial effects:

[0052] The present invention provides a multifunctional integrated semiconductor wafer polishing equipment. Through innovative modular design, it integrates six functional units: conveying and loading, rough grinding and fine polishing, clamping and positioning, flipping and changing surfaces, thickness detection and drying. It significantly improves processing efficiency and surface treatment quality, while solving technical pain points such as the inconvenience of process switching and waste of grinding fluid in traditional equipment.

[0053] The conveying and transfer component provided in the present invention adopts a two-way logistics design, which can realize the automatic loading of wafers and unloading of finished products, seamlessly connect the polishing and grinding process, and reduce manual intervention.

[0054] The rough grinding and fine polishing components provided in the present invention adopt a dual-mode processing integrated design: a variety of surface treatments are completed through rough grinding wheels (rough grinding) and fine polishing pads (fine polishing), adapting to different process requirements. Furthermore, in terms of grinding liquid management: the collection box is built with multiple grinding liquid nozzles to accurately control the injection position; during polishing, the transmission box and the collection box are docked to form a closed space to effectively suppress splashing; the waste liquid is automatically recovered to the liquid storage tank, and recycled after separation to reduce the cost of consumables.

[0055] The adsorption clamping assembly provided in the present invention has the adaptability of clamping: it adopts a floating structure of a transverse top seat + a transmission box, which is compatible with the clamping limit of wafers of different sizes; the transmission box has a built-in planetary gear transmission mechanism (sun gear / planetary gear / limit gear ring) to drive the wafer to rotate + revolve synchronously, thereby improving the uniformity of polishing.

[0056] The flipping and facing assembly provided in the present invention can realize fully automatic facing operation: a dual-specification flip seat (first / second flip seat) is adopted to match different wafer sizes, and 8 retractable flip pallets are built in to ensure stable limiting of the flipping process; both flip seats are driven by a flip drive motor to rotate 180°, avoiding the risk of contamination caused by traditional disassembly and assembly.

[0057] The thickness detection assembly provided in the present invention has the function of online real-time monitoring. Specifically, the detection probe is driven to turn and retract by the steering mounting arm, and the thickness is measured immediately after rough grinding and fine polishing, and the data is fed back to calibrate the process parameters to ensure the material removal accuracy.

[0058] The drying assembly provided in the present invention integrates a hot air drying unit to quickly remove residual droplets on the surface and avoid water stain pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0060] Figure 1 Schematic cross-sectional view of the internal structure of each component in the present invention in the front view direction;

[0061] Figure 2 Schematic cross-sectional view of the internal structure of each component in the present invention in the top view direction;

[0062] Figure 3 Schematic cross-sectional view of the internal structure of each component in the present invention in the side view direction;

[0063] Figure 4 Bottom view schematic of the adsorption and clamping component in the present invention;

[0064] Figure 5 For Figure 1 Partial enlarged schematic of the position A in

[0065] Figure 6 External overall schematic of the present invention in the front view direction;

[0066] Figure 7 External overall schematic of the present invention in the top view direction;

[0067] Figure 8 External overall schematic of the present invention in the side view direction.

[0068] In the figure: 1 - Polishing and grinding processing box, 2 - First side box, 3 - Second side box, 4 - Conveyor connection port, 5 - Conveyor clamping plate, 6 - First conveyor roller, 7 - Second conveyor roller, 8 - Conveyor belt, 9 - First conveyor motor, 10 - Second conveyor motor, 11 - Transverse moving top seat, 12 - Guide rail, 13 - Guide wheel, 14 - Displacement driving motor, 15 - Driving threaded rod, 16 - Transmission box, 17 - Lifting telescopic cylinder, 18 - Transmission driving motor, 19 - Vertical rotating shaft, 20 - Sun gear, 21 - Planet carrier, 22 - Limiting gear ring, 23 - First planet gear, 24 - Second planet gear, 25 - First mounting bracket, 26 - First suction cup, 27 - Second mounting bracket, 28 - Second suction cup, 29 - Vacuum generator, 30 - Liquid storage tank, 31 - Surface-changing operation box, 32 - Fixed column, 33 - First flipping seat, 34 - Second flipping seat, 35 - Flipping support plate, 36 - Support square column, 37 - Connecting rotating shaft, 38 - Flipping driving motor, 39 - Driving gear, 40 - Driven gear, 41 - Fixed base, 42 - Rotating driving motor, 43 - Transmission vertical shaft, 44 - Rough grinding wheel, 45 - Fine polishing pad, 46 - Support sleeve, 47 - Collection box, 48 - Grinding liquid spray head, 49 - Hydraulic telescopic cylinder, 50 - Water inlet, 51 - Return pipe, 52 - Scrap separation net, 53 - Annular shunt pipe, 54 - Water inlet pipe, 55 - Booster water supply pump, 56 - Upper water spiral pipe, 57 - Steering mounting arm, 58 - Steering driving motor, 59 - Detection probe, 60 - Fan box, 61 - Rotating fan, 62 - Three-way inlet pipe, 63 - Air inlet check valve, 64 - Heating shunt box, 65 - Electric heating wire, 66 - Air flow nozzle, 67 - Control panel. Detailed implementation manners

[0069] The embodiments of the technical solution of the present invention will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solution of the present invention more clearly, so they are only examples and cannot be used to limit the protection scope of the present invention.

[0070] As Figures 1 to 8 shown, a grinding and polishing device for semiconductor wafer surface refinement processing includes a polishing and grinding processing box 1. The polishing and grinding processing box 1 is a horizontally arranged square box, and a conveying and transferring assembly, a rough grinding and fine polishing assembly, an adsorption and clamping assembly, and a flipping and surface-changing assembly are respectively arranged in the polishing and grinding processing box 1.

[0071] A first side box 2 and a second side box 3 are respectively fixedly connected to two longitudinal outer walls of the polishing and grinding processing box 1. A thickness detection assembly is arranged in the first side box 2, and a drying assembly is arranged in the second side box 3.

[0072] A conveying connection port 4 is respectively opened on each longitudinal outer wall of the polishing and grinding processing box 1. The conveying and transferring assembly includes two parallel conveying clamping plates 5. The two conveying clamping plates 5 pass through the two conveying connection ports 4 and are fixedly connected to the polishing and grinding processing box 1.

[0073] At both ends of the two conveying clamping plates 5, a first conveying roller 6 and a second conveying roller 7 are respectively rotatably provided, and a conveyor belt 8 is sleeved between the first conveying roller 6 and the second conveying roller 7.

[0074] A first conveying motor 9 is fixedly connected to the longitudinal outer wall of the first side box 2. The end of the output shaft of the first conveying motor 9 passes through the conveying clamping plate 5 and is fixedly connected to the first conveying roller 6. A second conveying motor 10 is fixedly connected to the longitudinal outer wall of the second side box 3. The end of the output shaft of the second conveying motor 10 passes through the conveying clamping plate 5 and is fixedly connected to the second conveying roller 7.

[0075] The adsorption and clamping assembly includes a transverse moving top seat 11. The transverse moving top seat 11 is a horizontally arranged square seat. Two guide rails 12 are respectively fixedly connected to the longitudinal two sides of the transverse moving top seat 11. The guide rails 12 are U-shaped rails with a transverse opening. The upper ends of the guide rails 12 are fixedly connected to the inner top surface of the polishing processing box 1.

[0076] Guide wheels 13 are respectively rotatably provided on each longitudinal side end surface of the transverse moving top seat 11, and the ends of the guide wheels 13 are rotatably clamped in the corresponding guide rails 12.

[0077] A displacement driving motor 14 is also fixedly connected to one side of the inner top surface of the polishing processing box 1. The end of the output shaft of the displacement driving motor 14 is fixedly connected with a driving threaded rod 15. The driving threaded rod 15 horizontally passes through and is threadedly connected to the transverse moving top seat 11.

[0078] A transmission box 16 is provided with a lifting movement below the transverse moving top seat 11. The transmission box 16 is a cylindrical box with an open lower end. Four centrally symmetric lifting telescopic cylinders 17 are fixedly connected to the lower surface of the transverse moving top seat 11. The lower telescopic ends of the lifting telescopic cylinders 17 are fixedly connected to the upper surface of the transmission box 16.

[0079] A transmission driving motor 18 is fixedly connected to the center of the upper surface of the transmission box 16. The end of the output shaft of the transmission driving motor 18 passes downward through the transmission box 16 and is fixedly connected with a vertical rotating shaft 19. A sun gear 20 is rotatably provided at the lower end of the vertical rotating shaft 19.

[0080] A planetary carrier 21 is fixedly connected to the outer peripheral wall of the vertical rotating shaft 19. A limiting gear ring 22 is fixedly connected to the circumferential inner wall of the transmission box 16. A first planetary gear 23 and a second planetary gear 24 are respectively rotatably installed on both sides of the lower surface of the planetary carrier 21. The first planetary gear 23 and the second planetary gear 24 are of the same size. Both the first planetary gear 23 and the second planetary gear 24 are clamped and meshed between the sun gear 20 and the limiting gear ring 22.

[0081] At the center of the lower surface of the first planet gear 23, a first mounting bracket 25 is fixedly connected. A first suction cup 26 is fixedly arranged inside the first mounting bracket 25. At the center of the lower surface of the second planet gear 24, a second mounting bracket 27 is fixedly connected. A second suction cup 28 is fixedly arranged inside the second mounting bracket 27. The size of the first suction cup 26 is larger than that of the second suction cup 28.

[0082] A vacuum generator 29 is connected between the first suction cup 26 and the first mounting bracket 25, and between the second suction cup 28 and the second mounting bracket 27.

[0083] In the middle of the inner bottom surface of the polishing and grinding processing box 1, a liquid storage tank 30 is fixedly connected. The liquid storage tank 30 is a horizontally arranged square box.

[0084] The turning and surface-changing assembly includes a surface-changing operation box 31. The surface-changing operation box 31 is a square box with an open upper end. In the middle of the upper surface of the liquid storage tank 30, a fixed vertical column 32 is fixedly connected. The upper end of the fixed vertical column 32 is fixedly connected to the center of the lower end surface of the surface-changing operation box 31.

[0085] Inside the surface-changing operation box 31, near the upper end opening, a first turning seat 33 and a second turning seat 34 are respectively rotatably arranged. Both the first turning seat 33 and the second turning seat 34 are square seats. The size of the first turning seat 33 is larger than that of the second turning seat 34.

[0086] Inside the first turning seat 33, a turning limiting mechanism is provided. The turning limiting mechanism includes eight turning support plates 35. The eight turning support plates 35 are divided into upper and lower layers. The turning support plates 35 are symmetrically arranged at the center and are respectively telescopically installed on the first turning seat 33. The turning support plates 35 are driven by telescopic cylinders.

[0087] The same turning limiting mechanism is also provided inside the second turning seat 34.

[0088] In the middle of the inner bottom surface of the surface-changing operation box 31, a vertical support square column 36 is fixedly connected. On the two transverse side ends of the first turning seat 33, connecting rotating shafts 37 are respectively fixedly connected. One of the connecting rotating shafts 37 is rotatably installed on the transverse inner wall of the surface-changing operation box 31, and the other connecting rotating shaft 37 is rotatably installed on the side end surface of the support square column 36.

[0089] On the transverse outer wall of the surface-changing operation box 31 near the lower end, a turning drive motor 38 is fixedly connected. The end of the output shaft of the turning drive motor 38 extends into the surface-changing operation box 31 and is fixedly connected with a transmission gear 39. A driven gear 40 meshing with the transmission gear 39 is fixedly connected on the connecting rotating shaft 37.

[0090] The second turning seat 34 is rotatably arranged on the other side of the support square column 36 and adopts the same turning drive method as the first turning seat 33.

[0091] The rough grinding and fine polishing assembly includes two symmetrically arranged fixed bases 41. The two fixed bases 41 are respectively arranged on the transverse sides of the liquid storage tank 30 and fixedly connected to the inner bottom surface of the polishing and grinding processing box 1. The fixed base 41 is a C-shaped seat with an opening facing downwards. A rotating drive motor 42 is fixedly connected to the center of the lower surface of each fixed base 41.

[0092] The end of the output shaft of the rotating drive motor 42 passes upwards through the fixed base 41 and is fixedly connected to a transmission vertical shaft 43. A horizontal rough grinding wheel 44 is fixedly connected to the upper end of one of the transmission vertical shafts 43, and a fine polishing pad 45 is fixedly connected to the upper end of the other transmission vertical shaft 43.

[0093] A support sleeve 46 is sleeved outside each transmission vertical shaft 43. The lower ends of the two support sleeves 46 are respectively fixedly connected to the upper surfaces of the two fixed bases 41. The upper end of one of the support sleeves 46 is rotationally abutted against the lower surface of the rough grinding wheel 44, and the upper end of the other support sleeve 46 is rotationally abutted against the lower surface of the fine polishing pad 45.

[0094] A collection box 47 is slidably sleeved on the outer peripheral wall of each support sleeve 46. The collection box 47 is a cylindrical box with an upper opening. The inner diameter of the collection box 47 is slightly larger than the outer diameter of the transmission box 16.

[0095] A number of centrally symmetric grinding liquid spray nozzles 48 are fixedly connected to the circumferential inner wall of each collection box 47.

[0096] A number of centrally symmetric hydraulic telescopic cylinders 49 are fixedly connected to the upper surface of the fixed base 41. The upper telescopic ends of each hydraulic telescopic cylinder 49 are respectively fixedly connected to the lower surface of the collection box 47.

[0097] A number of centrally symmetric water inlets 50 are provided on the outer peripheral wall of the support sleeve 46 near the upper end. A return pipe 51 is externally connected to the outer peripheral wall of the support sleeve 46 near the lower end. The end of the return pipe 51 is fixedly connected and communicated to the liquid storage tank 30.

[0098] A horizontal waste chip separation net 52 is provided in the middle section of the interior of the liquid storage tank 30.

[0099] An annular diversion pipe 53 is fixedly connected to the outer peripheral wall of each collection box 47. The annular diversion pipe 53 is at the same horizontal height as the number of grinding liquid spray nozzles 48. The grinding liquid spray nozzles 48 and the annular diversion pipe 53 are fixedly connected through a water inlet pipe 54.

[0100] A pressurized water supply pump 55 is externally connected to each transverse side end face of the liquid storage tank 30. An upper water spiral pipe 56 is externally connected to the upper part of the pressurized water supply pump 55. The upper end of the upper water spiral pipe 56 is fixedly connected and communicated to the annular diversion pipe 53.

[0101] The thickness detection component includes two symmetrically arranged steering mounting arms 57. The two steering mounting arms 57 are respectively rotatably mounted on the inner top surface of the first side box 2. Two symmetric steering drive motors 58 are fixedly connected to the upper surface of the first side box 2. The end of the output shaft of the steering drive motor 58 passes downward through the wall of the first side box 2 and is fixedly connected to the center of the upper surface of the steering mounting arm 57.

[0102] A detection probe 59 that can be telescoped in the horizontal direction is respectively provided on the lower surface of each steering mounting arm 57.

[0103] The drying component includes a blower box 60 fixedly connected to the longitudinal outer wall of the second side box 3. A rotating blower 61 is provided in the blower box 60. A three-way inlet pipe 62 is fixedly connected to the longitudinal inner wall of the second side box 3. An inlet check valve 63 is provided in the three-way inlet pipe 62.

[0104] Each transverse inner wall of the second side box 3 is respectively fixedly connected with a heating shunt box 64. Electric heating wires 65 are respectively provided in each heating shunt box 64. A number of air nozzles 66 are fixedly connected to the longitudinal outer wall of the heating shunt box 64.

[0105] The three ports of the three-way inlet pipe 62 are respectively fixedly connected and communicated to the blower box 60 and the two heating shunt boxes 64.

[0106] A control panel 67 is fixedly connected to the transverse side wall of the polishing and grinding processing box 1. The control panel 67 is electrically connected to each drive motor and the detection probe 59.

[0107] When used in the present invention:

[0108] First, perform automatic wafer loading; start the first conveying motor 9 and the second conveying motor 10, respectively drive the first conveying roller 6 and the second conveying roller 7, so that the conveyor belt 8 circulates; place the wafers to be processed on the conveyor belt 8 in sequence and convey them into the polishing and grinding processing box 1.

[0109] Then, perform intelligent wafer clamping and positioning: start the displacement drive motor 14, adjust the transverse moving top seat 11 to move horizontally along the guide rail 12 to directly above the conveyor belt 8 through driving the threaded rod 15; turn on the vacuum generator 29, and select the first suction cup 26 to adsorb large-sized wafers and the second suction cup 28 to adsorb small-sized wafers according to the wafer size.

[0110] Then, perform rough grinding and cooling of the wafer: drive the transverse moving top seat 11 to move above the rough grinding wheel 44; control the lifting telescopic cylinder 17 to extend, drive the collection box 47 to move upward and be hermetically docked with the transmission box 16; start the transmission drive motor 18, and drive the wafer to rotate and revolve through the sun gear 20, the first planet gear 23, the second planet gear 24 and the limit gear ring 22; the lifting telescopic cylinder 17 controls the wafer to press down and contact the rough grinding wheel 44 to complete surface rough grinding.

[0111] Then cooling and waste liquid recovery are carried out: the booster water supply pump 55 draws the grinding liquid in the liquid storage tank 30, and sprays it through the water supply spiral pipe 56 → annular diversion pipe 53 → grinding liquid nozzle 48 for cooling; the waste liquid returns to the liquid storage tank 30 through the collection box 47 → water inlet 50 → reflux pipe 51 for separation and recovery.

[0112] Then, drying and thickness detection are carried out: the rotating fan 61 is started, and the air flow is heated by the heating wire 65 and then ejected from the air flow nozzle 66 to quickly dry the surface; the steering drive motor 58 adjusts the detection probe 59 to a longitudinal vertical position, and controls the detection probe 59 to extend so that it faces the wafer, measures the thickness in real time, and feeds back data.

[0113] Then, fine polishing and secondary inspection are performed: the above operations are repeated, and the wafer is transferred to the fine polishing pad 45 to complete fine polishing, and then dried and inspected again.

[0114] Then, the wafer is automatically flipped over: the adsorption assembly moves the wafer to the top of the flipping operation box 31;

[0115] Select the first flip seat 33 or the second flip seat 34 according to the size: based on the selected flip seat, control the four flip pallets 35 at the bottom to extend to receive the wafer, and at the same time close the vacuum adsorption, and control the four flip pallets 35 at the top to extend to fix the wafer; the flip drive motor 38 drives the flip seat to rotate 180°.

[0116] Finally, secondary processing is carried out: the adsorption component re-clamps the wafer and performs rough grinding and fine polishing on the back side.

[0117] After the wafers are processed, they are transported out via the conveyor belt 8 .

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention.

Claims

1. Grinding and polishing equipment for surface refinement of semiconductor wafers, characterized in that: It comprises a polishing and grinding processing box, in which a conveying and transferring component, a rough grinding and fine polishing component, an adsorption and clamping component and a turning and changing surface component are respectively arranged; The adsorption clamping assembly comprises a transverse top seat slidably arranged on the top surface of the polishing and grinding processing box, a transmission box is lifted and lowered below the transverse top seat, a first mounting frame and a second mounting frame which can rotate and revolve respectively are respectively arranged in the transmission box, a first adsorption plate is fixedly arranged in the first mounting frame, and a second adsorption plate is fixedly arranged in the second mounting frame; The reversing assembly comprises a reversing operation box fixedly arranged on the inner bottom surface of the polishing and grinding processing box, wherein a first reversing seat and a second reversing seat are rotatably arranged near the upper end opening of the reversing operation box, and a reversing limit mechanism is arranged in the first reversing seat and the second reversing seat respectively; The rough grinding and fine polishing assembly comprises two fixed bases symmetrically arranged on both sides of the face changing operation box, a rotary drive motor is fixedly connected to the center of the lower surface of each fixed base, the output shaft end of the rotary drive motor passes through the fixed base upward and is fixedly connected to a transmission vertical shaft, a horizontal rough grinding wheel is fixedly connected to the upper end of one of the transmission vertical shafts, and a horizontal fine polishing pad is fixedly connected to the upper end of the other transmission vertical shaft; A supporting sleeve is sleeved on the outside of each of the vertical transmission shafts, and the lower end of the supporting sleeve is fixedly connected to the upper surface of the fixed base. A collecting box is slidably sleeved on the outer peripheral wall of each of the supporting sleeves, and a plurality of centrally symmetrical grinding liquid nozzles are fixedly connected to the circumferential inner wall of each of the collecting boxes.

2. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: A first side box and a second side box are respectively fixedly connected to both sides of the polishing and grinding processing box, a thickness detection component is arranged in the first side box, and a drying component is arranged in the second side box; The thickness detection assembly includes two symmetrically arranged steering mounting arms, which are rotatably mounted on the inner top surface of the first side box respectively, and the upper surface of the first side box is fixedly connected to two symmetrical steering drive motors, and the output shaft ends of the steering drive motors pass downward through the wall of the first side box and are fixedly connected to the center of the upper surface of the steering mounting arms; The lower surface of each steering mounting arm is provided with a detection probe that is telescopic in the horizontal direction; The drying assembly comprises a fan box fixedly connected to the longitudinal outer wall of the second side box, a rotating fan is arranged in the fan box, a three-way air inlet pipe is fixedly connected to the longitudinal inner wall of the second side box, and an air inlet check valve is arranged in the three-way air inlet pipe; A heating shunt box is fixedly connected to each transverse inner wall of the second side box, each of the heating shunt boxes is provided with a heating wire, and a plurality of air flow nozzles are fixedly connected to the longitudinal outer wall of the heating shunt box; The three ports of the three-way air inlet pipe are respectively fixedly connected to the fan box and the two heating shunt boxes; A control panel is fixedly connected to the transverse side wall of the polishing and grinding processing box.

3. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 2, characterized in that: A conveying connection port is respectively provided on each longitudinal outer wall of the polishing and grinding processing box, and the conveying and transferring assembly comprises two parallel conveying clamping plates, the two conveying clamping plates pass through the two conveying connection ports and are fixedly connected to the polishing and grinding processing box; The two ends of the two conveying clamps are rotatably provided with a first conveying roller and a second conveying roller, and a conveying belt is sleeved between the first conveying roller and the second conveying roller; A first conveying motor is fixedly connected to the longitudinal outer wall of the first side box, and a terminal end of an output shaft of the first conveying motor passes through the conveying clamp and is fixedly connected to the first conveying roller. A second conveying motor is fixedly connected to the longitudinal outer wall of the second side box, and a terminal end of an output shaft of the second conveying motor passes through the conveying clamp and is fixedly connected to the second conveying roller.

4. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: The transverse top seat is a horizontally arranged square seat, and two guide rails are respectively fixedly connected to the longitudinal sides of the transverse top seat, and the guide rails are U-shaped rails with transverse openings, and the upper ends of the guide rails are fixedly connected to the inner top surface of the polishing and grinding processing box; A guide wheel is rotatably provided on each longitudinal side end surface of the transverse top seat, and the end of the guide wheel is rotatably clamped in the corresponding guide rail; A displacement driving motor is also fixedly connected to one side of the inner top surface of the polishing and grinding processing box, and a driving threaded rod is fixedly connected to the end of the output shaft of the displacement driving motor. The driving threaded rod passes horizontally and is threadedly connected to the transverse top seat.

5. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: The transmission box is a cylindrical box with an opening at the lower end, and four centrally symmetrical lifting and telescopic cylinders are fixedly connected to the lower surface of the transverse displacement top seat, and the lower telescopic ends of the lifting and telescopic cylinders are fixedly connected to the upper surface of the transmission box; A transmission drive motor is fixedly connected at the center of the upper surface of the transmission box, the output shaft end of the transmission drive motor passes downward through the transmission box and is fixedly connected to a vertical rotating shaft, and a sun gear is rotatably provided at the lower end of the vertical rotating shaft; A planet carrier is fixedly connected to the outer peripheral wall of the vertical rotating shaft, a limit gear ring is fixedly connected to the circumferential inner wall of the transmission box, and a first planetary gear and a second planetary gear are rotatably mounted on both sides of the lower surface of the planet carrier, the first planetary gear and the second planetary gear have the same size, and the first planetary gear and the second planetary gear are both clamped and meshed between the sun gear and the limit gear ring; The first mounting frame is fixedly connected to the center of the lower surface of the first planetary gear, and the second mounting frame is fixedly connected to the center of the lower surface of the second planetary gear; A vacuum generator is connected between the first adsorption plate and the first mounting frame, and between the second adsorption plate and the second mounting frame. The size of the first adsorption plate is larger than that of the second adsorption plate.

6. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: A liquid storage tank is fixedly connected to the middle of the inner bottom surface of the polishing and grinding processing box, and the liquid storage tank is a horizontally arranged square box; A fixed column is fixedly connected to the middle of the upper surface of the liquid storage box, and the upper end of the fixed column is fixedly connected to the center of the lower end surface of the face-changing operation box; The first flip seat and the second flip seat are both square seats, and the size of the first flip seat is larger than that of the second flip seat; The flip limiting mechanism comprises eight flip pallets, which are divided into two layers, the flip pallets are centrally symmetrically arranged and telescopically mounted on the first flip seat respectively, and the flip pallets are driven by telescopic cylinders.

7. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 6, characterized in that: A vertical supporting square column is fixedly connected to the middle of the inner bottom surface of the face-changing operation box, and connecting shafts are respectively fixedly connected to the two lateral side end surfaces of the first flip seat, one of which is rotatably mounted on the lateral inner wall of the face-changing operation box, and the other is rotatably mounted on the side end surface of the supporting square column; A flip driving motor is fixedly connected to the transverse outer wall of the face-changing operation box near the lower end, the output shaft end of the flip driving motor extends into the face-changing operation box and is fixedly connected to a transmission gear, and a driven gear meshing with the transmission gear is fixedly connected to the connecting shaft; The second flip seat is rotatably arranged on the other side of the supporting square column, and adopts the same flip driving method as the first flip seat.

8. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 6, characterized in that: The two fixed bases are respectively arranged on the lateral sides of the liquid storage box and fixedly connected to the inner bottom surface of the polishing and grinding processing box, and the fixed bases are C-shaped bases with openings facing downwards; The collecting box is a cylindrical box with an opening at the upper end, and the inner ring size of the collecting box is slightly larger than the outer ring size of the transmission box; A plurality of centrally symmetrical hydraulic telescopic cylinders are fixedly connected to the upper surface of the fixed base, and the upper telescopic end of each hydraulic telescopic cylinder is respectively fixedly connected to the lower surface of the collection box.

9. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 8, characterized in that: The upper end of one of the support sleeves is rotatably opposed to the lower surface of the rough grinding wheel, and the upper end of the other support sleeve is rotatably opposed to the lower surface of the fine polishing pad; A plurality of centrally symmetrical water inlets are provided on the outer peripheral wall of the support sleeve near the upper end, and a return pipe is externally connected to the outer peripheral wall of the support sleeve near the lower end, and the end of the return pipe is fixedly connected to the liquid storage tank; A horizontal waste separation net is provided in the middle section of the liquid storage tank; An annular shunt pipe is fixedly connected to the outer peripheral wall of each collecting box, the annular shunt pipe is at the same level as the plurality of grinding liquid spray heads, and the grinding liquid spray heads and the annular shunt pipe are fixedly connected via a water inlet pipe; A booster water supply pump is externally connected to each lateral side end face of the liquid storage tank, and a water supply spiral pipe is externally connected to the upper part of the booster water supply pump. The upper end of the water supply spiral pipe is fixedly connected to the annular diverter pipe.

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