An automatic bundling process monitoring method, system and device for metal wire

Abstract

The present invention relates to the technical field of bundling process monitoring, and specifically discloses a method, a system and a device for monitoring the automatic bundling process of metal wire rods. The method includes: screening each qualified metal wire rod into the automatic bundling process, analyzing the characteristic measurement values of each qualified metal wire rod, monitoring the bundling process of each qualified metal wire rod in real time, analyzing the comprehensive operation efficiency index, and adjusting the bundling equipment. The present invention can effectively screen qualified wire rods, avoid defective products from entering the subsequent process, and ensure the basic quality of products. It realizes effective and targeted analysis of the bundling process for wire rods with different characteristics, and makes subsequent adjustments according to the analysis results, enhancing the adaptability of the equipment to production tasks, effectively improving the stability of bundling quality, reducing the defective rate, and reasonably adjusting the speeds of the winding motor and the moving motor, which can ensure the pitch of wire winding and make the wire arrangement uniform and neat.

Description

Technical Field

[0001] The present invention relates to the technical field of bundling process monitoring, and specifically to a method, system and device for monitoring the automatic bundling process of metal wire. Background Technique

[0002] Metal wire, as a basic material, is widely used in many fields such as construction, machinery manufacturing, and electronics. In its bundling link, it is required to fix the end of the steel wire rope or the steel wire rope at the root of the cable joint together to prevent the cracking and scattering of the steel wire rope. When bundling, attention should be paid to the firmness and tightness of the fixation to ensure that it will not come loose or fall off. Reasonable bundling can ensure that the metal wire remains neat and orderly during transportation and storage, avoiding the wire materials from being entangled and worn with each other, thereby ensuring that its performance is not damaged. If there are problems in the bundling link, such as loose bundling resulting in the loosening of the wire materials, it may cause deformation of the wire materials during subsequent handling, affecting its accuracy and strength, reducing the product quality. Over-tight bundling may cause scratches on the surface of the wire materials, increasing the risk of rust and shortening the service life. However, the existing automatic bundling process monitoring modes are often fixed and lack flexibility, making it difficult to adapt to metal wire materials of different specifications and materials, resulting in uneven bundling quality and a high defective rate, seriously affecting production efficiency.

[0003] For example, the invention patent with the publication number CN106971277B discloses a bar and wire material tracking system and method, including: a coding controller for obtaining the raw material information of the current bar and wire material and generating a label associated with the raw material information of the current bar and wire material; and obtaining the information of the semi-finished product to be produced of the current bar and wire material and generating a corresponding label spacing; a label marking mechanism for obtaining the label generated by the coding controller and marking a label associated with the raw material information of the current bar and wire material on the bar and wire material that has not undergone double-length flying shearing according to the spacing; a distance controller for obtaining the spacing generated by the coding controller, detecting whether the label marking mechanism is in a working state, and controlling the movement of the label marking mechanism: if the label marking mechanism is in a non-working state, controlling the label marking mechanism to move according to the spacing; if the label is in a working state, controlling the label marking mechanism to maintain its original position.

[0004] For example, the invention patent with the publication number CN115456374A discloses a production management method for direct rolling of bar and wire rods. The method includes: generating billet virtual materials and finished product virtual materials with corresponding relationships according to the quality control requirements and material requirements in the production process of bar and wire rods, and configuring material parameters and material states for the billet virtual materials and the finished product virtual materials; performing steel rolling scheduling based on each billet virtual material, each finished product virtual material, and the corresponding configured material parameters and material states to obtain steel rolling scheduling information; performing steelmaking scheduling based on the steel rolling scheduling information to obtain steelmaking scheduling information; and executing the direct rolling production of bar and wire rods according to the steelmaking scheduling information and the steel rolling scheduling information. Among them, during the execution of the direct rolling production of bar and wire rods, the steel rolling scheduling information is dynamically adjusted according to the changes in the steelmaking scheduling information.

[0005] However, in the process of implementing the embodiments of the present application, it is found that the above technologies have at least the following technical problems:

[0006] In the current wire bundling monitoring method, the data collection source is limited, and most of them only focus on the basic operating parameters of the bundling equipment. However, metal wires usually have different material specifications and qualities, and there are often differences in the required levels of production control. Only focusing on the supervision of the equipment aspect is difficult to quickly and accurately make intelligent adjustments to the bundling parameters and equipment operating modes, often leading to unstable bundling quality, increasing the defective rate, and reducing the accuracy and efficiency of the automatic bundling monitoring of metal wires. Summary of the Invention

[0007] In view of the deficiencies of the prior art, the present invention provides a method, system and equipment for monitoring the automatic bundling process of metal wires, which can effectively solve the problems involved in the above background technology.

[0008] To achieve the above objectives, the present invention is realized through the following technical solutions: In the first aspect of the present invention, a method for monitoring the automatic bundling process of metal wires is provided, including: S1, starting the wire conveying device, introducing each metal wire to be bundled into the bundling area, obtaining the quality parameters of each metal wire to be bundled, analyzing the quality evaluation values of each metal wire to be bundled, and screening each qualified metal wire into the automatic bundling process.

[0009] S2, obtaining the self-characteristic parameters of each qualified metal wire, analyzing the characteristic measurement values of each qualified metal wire, and thereby obtaining the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire.

[0010] S3, starting the automatic bundling device, real-time monitoring the bundling process of each qualified metal wire, obtaining the equipment operation parameters, analyzing the dynamic stability index of the equipment operation, recording the currently bundled qualified metal wire as the target bundling wire, and synchronously obtaining the bundling status parameters of the target bundling wire and analyzing the bundling stability index of the target bundling wire.

[0011] S4. Based on the dynamic stability index of the equipment operation and the bundling stability index of the target bundling wire, analyze the comprehensive operation efficiency index, and thus adjust the bundling equipment and generate prompt information.

[0012] The second aspect of the present invention provides a monitoring system for the automatic bundling process of metal wires, including:

[0013] A qualified metal wire screening module, which is used to start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire into the automatic bundling process.

[0014] A qualified metal wire feature analysis module, which is used to obtain the self-feature parameters of each qualified metal wire, analyze the feature measurement value of each qualified metal wire, and thus obtain the allowable fluctuation parameter and the comprehensive operation efficiency verification index of each qualified metal wire.

[0015] An automatic bundling process monitoring module, which is used to start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameter of the target bundling wire, and analyze the bundling stability index of the target bundling wire.

[0016] A bundling equipment adjustment module, which is used to analyze the comprehensive operation efficiency index based on the dynamic stability index of the equipment operation and the bundling stability index of the target bundling wire, and thus adjust the bundling equipment and generate prompt information.

[0017] The third aspect of the present invention provides a monitoring device for the automatic bundling process of metal wires, including: an automatic bundling device, a wire bundling monitoring sensing device, a high-definition scanner, and an infrared sensor.

[0018] The automatic bundling device is used for automatically bundling wires.

[0019] The wire bundling monitoring sensing device is used to collect parameters related to the wire automatic bundling process.

[0020] The high-definition scanner is used to obtain and analyze the surface bundling image.

[0021] The infrared sensor is used to sense and collect the temperature.

[0022] Compared with the prior art, the embodiments of the present invention at least have the following advantages or beneficial effects:

[0023] (1) By providing a method, system, and device for monitoring the automatic bundling process of metal wire, the present invention can effectively screen qualified wire, prevent defective products from entering the subsequent processes, and ensure the basic quality of the products. In terms of operation, it can effectively and specifically analyze the bundling process for wires with different characteristics, and make subsequent adjustments according to the analysis results, enhancing the adaptability of the device to production tasks, effectively improving the stability of the bundling quality, and reducing the defective rate. At the same time, according to the deviation between the comprehensive operation efficiency index and the verification index, the speeds of the winding motor and the moving motor are reasonably adjusted to avoid waste of resources and improve production efficiency.

[0024] (2) By screening each qualified metal wire into the automatic bundling process, the present invention can guarantee the quality of the wire entering the automatic bundling link from the source, avoid subsequent bundling problems caused by the quality defects of the wire itself, reduce material waste caused by defective products participating in bundling, and improve the bundling efficiency.

[0025] (3) By obtaining the allowable fluctuation parameters and the comprehensive operation efficiency verification index of each qualified metal wire according to the characteristic measurement values of each qualified metal wire, the present invention realizes the refined management of metal wires with different characteristics during the bundling process, providing an accurate data adjustment basis for the operation of subsequent bundling equipment. It enables the equipment to perform targeted parameter adaptation according to the specific characteristics of the wire, effectively reducing the bundling error caused by wire differences, and improving the consistency and stability of bundling. At the same time, the comprehensive operation efficiency verification index helps to set reasonable operation standards in advance, timely detect potential operation abnormalities, thereby optimizing the entire production process, reducing the equipment failure rate, and improving the bundling efficiency.

[0026] (4) By adjusting the bundling equipment according to the comprehensive operation efficiency index, the present invention can reflect the comprehensive state of the equipment and the wire during the bundling operation in real time. When the index deviates from the ideal value, it can specifically extract the set of bundling equipment adjustment values, and then dynamically optimize the speeds of the winding motor and the moving motor. It avoids the bundling quality fluctuations caused by fixed equipment parameters, improves the bundling efficiency and product quality. At the same time, through precise adjustment, it can also reduce the unnecessary energy consumption of the equipment and extend the service life of the equipment. Description of the Drawings

[0027] The present invention is further described with reference to the accompanying drawings. However, the embodiments in the drawings do not constitute any limitation to the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the following drawings.

[0028] Figure 1 It is a schematic diagram of the method step flow of the present invention.

[0029] Figure 2 It is a schematic diagram of the system module connection of the present invention.

[0030] Figure 3 This is the structural diagram of the device of the present invention.

[0031] Figure 4 This is the structural diagram of the automatic bundling device related to the embodiment of the present invention.

[0032] Figure 5 This is the schematic diagram of the winding mechanism related to the embodiment of the present invention.

[0033] Figure 6 This is the schematic diagram of the moving mechanism related to the embodiment of the present invention.

[0034] Figure 7 This is the schematic diagram of the clamping mechanism related to the embodiment of the present invention.

[0035] Figure 8 This is the schematic diagram of the device for clamping the wire head related to the embodiment of the present invention.

[0036] Figure 9 This is the rendering of the first layer of wire bundling related to this embodiment.

[0037] Figure 10 This is the rendering of the completed wire bundling related to this embodiment.

[0038] Figure 11 This is the spatial position diagram of the two wire heads after winding related to this embodiment.

[0039] In the figure, 1, fixed small gear; 2, winding gear; 3, secondary driving wheel; 4, wire wheel; 5, driving gear; 6, third plate; 7, PLC; 8, second plate; 9, clamping mechanism; 10, first plate; 11, winding motor encoder; 12, steel wire rope; 13, moving motor encoder; 14, winding motor; 15, moving motor; 16, device for clamping wire head; 17, guide post; 18, ball screw; 19, spline shaft; 20, damping device; 901, movable V-shaped block; 902, pin; 903, tension spring; 904, fixed V-shaped block; 1601, spring; 1602, steel ball. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0041] Refer to Figure 1 As shown, the first aspect of the present invention provides a method for monitoring the automatic bundling process of metal wire, including:

[0042] It should be noted that the metal wire in this embodiment is a steel wire rope.

[0043] S1. Start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation values of each metal wire to be bundled, and screen out each qualified metal wire to enter the automatic bundling process.

[0044] Screening out each qualified metal wire to enter the automatic bundling process, the specific analysis process is as follows:

[0045] Obtain the quality parameters of each metal wire to be bundled, including the average wire diameter, wire density, surface roughness, and surface average hardness of each metal wire to be bundled.

[0046] It should be noted that the wire quality parameters can be collected by the wire bundling monitoring and sensing device. Among them, the wire diameter can be collected by a micrometer, the surface roughness can be measured by a roughness meter, and the surface hardness can be measured by a Rockwell hardness tester.

[0047] The method for obtaining the wire density is as follows: The wire quality is measured by a mass sensor, the wire length is obtained synchronously, and the wire density is obtained by dividing the wire quality by the wire length.

[0048] Analyze and process according to the quality parameters of each metal wire to be bundled to obtain the quality evaluation values of each metal wire to be bundled, and the quality evaluation values of each metal wire to be bundled are used to characterize the quality of each metal wire to be bundled.

[0049] Extract the ideal wire quality parameters stored in the database, including the ideal average wire diameter, ideal wire density, ideal surface roughness, and ideal surface average hardness of the wire.

[0050] In a specific embodiment, the method for obtaining the quality evaluation value of each metal wire to be bundled is as follows:

[0051] ;

[0052] Among them, is the quality evaluation value of the i-th metal wire to be bundled, is the average wire diameter of the i-th metal wire to be bundled, is the wire density of the i-th metal wire to be bundled, is the surface roughness of the i-th metal wire to be bundled, is the surface average hardness of the i-th metal wire to be bundled, is the ideal average wire diameter of the wire, is the ideal wire density of the wire, is the ideal surface roughness of the wire, is the ideal surface average hardness of the wire, is the average wire diameter weight, is the linear density weight, is the surface roughness weight, is the average surface hardness weight.

[0053] It should be added that, is the hyperbolic cosecant function.

[0054] It should be noted that the average wire diameter weight, the linear density weight, the surface roughness weight, and the average surface hardness weight are preset values in the database and can be directly extracted from the database during use. For example, the extraction method is to construct a mapping set for the average wire diameter, linear density, surface roughness, and average surface hardness and their corresponding weights one by one. During use, the average wire diameter, linear density, surface roughness, and average surface hardness obtained in real time are respectively input into the corresponding mapping sets to extract the average wire diameter weight, the linear density weight, the surface roughness weight, and the average surface hardness weight.

[0055] It should be understood that the value ranges of the average wire diameter weight, the linear density weight, the surface roughness weight, and the average surface hardness weight are all 0 - 1.

[0056] Extract the preset feed quality verification indicators in the database.

[0057] Record the metal wire to be bundled with a quality evaluation value greater than or equal to the feed quality verification indicator as qualified metal wire.

[0058] It should be noted that if the quality evaluation value of a metal wire to be bundled is less than the feed quality verification indicator, the metal wire to be bundled will be transported to the defective product area.

[0059] It should be noted that if the quality evaluation value of the metal wire to be bundled is greater than or equal to the feed quality verification indicator, it indicates that the overall quality of the wire is good, and it can maintain stable performance during subsequent processing, thus ensuring the efficiency of the entire production process and the reliability of the product quality. Therefore, it can be recognized as qualified metal wire.

[0060] If the quality evaluation value of the metal wire to be bundled is less than the feed quality verification indicator, it indicates that the quality of the wire does not meet the standard, and problems such as loose bundling and easy damage are very likely to occur during subsequent bundling and use, which cannot guarantee the quality and safety of the final product. Transport it to the defective product area and generate a corresponding warning signal for reminder to avoid adverse effects on the entire production batch.

[0061] Traverse each metal wire to be bundled in sequence, and thus screen out each qualified metal wire to enter the automatic bundling process.

[0062] S2. Obtain the characteristic parameters of each qualified metal wire, analyze the characteristic measurement values of each qualified metal wire, and thereby obtain the allowable fluctuation parameters and the comprehensive operation efficiency verification index of each qualified metal wire.

[0063] In this embodiment, analyze the characteristic measurement values of each qualified metal wire, and thereby obtain the allowable fluctuation parameters and the comprehensive operation efficiency verification index of each qualified metal wire. The specific analysis process is as follows:

[0064] Obtain the characteristic parameters of each qualified metal wire, including the elastic modulus, conductivity, coefficient of thermal expansion, and thermal conductivity of each qualified metal wire.

[0065] It should be noted that the characteristic parameters of the wire can be collected by the wire bundling monitoring and sensing device. Among them, the elastic modulus can be collected by a dynamic elastic modulus tester, the conductivity can be measured by a conductivity meter, the coefficient of thermal expansion can be determined by a thermal dilatometer, and the thermal conductivity can be measured by a thermal conductivity tester.

[0066] It should be noted that the elastic modulus mainly reflects the strength of the atomic bonding in the metal wire and determines its ability to resist elastic deformation. The conductivity is closely related to the movement of free electrons inside the metal. The more free electrons and the smoother their movement, the higher the conductivity. The coefficient of thermal expansion depends on the bonding characteristics between atoms and the lattice structure. When the bonding force is weak and the lattice structure is loose, the coefficient of thermal expansion is relatively large. The thermal conductivity is related to the thermal transfer of electrons and phonons. Electron heat conduction plays an important role in metals, and at the same time, lattice vibration (phonons) also participates in the heat conduction process.

[0067] Generally, for metals with a high elastic modulus, the atoms are closely bonded, which may limit the free movement of electrons and reduce the conductivity to a certain extent. Regarding the coefficient of thermal expansion, when the elastic modulus is high, atomic vibration is restricted, and the coefficient of thermal expansion is often small. In terms of thermal conductivity, if the conductivity is high, electrons contribute more to heat conduction, and the thermal conductivity may be high. At the same time, metals with a small coefficient of thermal expansion have good lattice stability during temperature changes, which is conducive to the effective transfer of phonons and may also increase the thermal conductivity.

[0068] Analyze and process the characteristic parameters of each qualified metal wire to obtain the characteristic measurement values of each qualified metal wire. The characteristic measurement values of each qualified metal wire are used to characterize the characteristic state of each qualified metal wire.

[0069] In a specific embodiment, the method for specifically obtaining the characteristic measurement values of each qualified metal wire is as follows:

[0070] ;

[0071] where is the characteristic measurement value of the j-th qualified metal wire, is the elastic modulus of the j-th qualified metal wire rod, is the conductivity of the j-th qualified metal wire rod, is the coefficient of thermal expansion of the j-th qualified metal wire rod, is the thermal conductivity of the j-th qualified metal wire rod, is the characteristic measurement factor corresponding to the unit elastic modulus, is the characteristic measurement factor corresponding to the unit conductivity, is the characteristic measurement factor corresponding to the unit coefficient of thermal expansion, is the characteristic measurement factor corresponding to the unit thermal conductivity, and e is the natural constant.

[0072] It should be noted that the characteristic measurement factors corresponding to the unit elastic modulus, the unit conductivity, the unit coefficient of thermal expansion, and the unit thermal conductivity are all pre-set values in the database and can be directly extracted from the database when used. For example, the extraction method is to construct a mapping set by respectively mapping the elastic modulus, conductivity, coefficient of thermal expansion, and thermal conductivity with the corresponding characteristic measurement factors corresponding to the unit elastic modulus, the unit conductivity, the unit coefficient of thermal expansion, and the unit thermal conductivity. When used, the elastic modulus, conductivity, coefficient of thermal expansion, and thermal conductivity collected in real time are input into the mapping set, so as to extract the characteristic measurement factors corresponding to the unit elastic modulus, the unit conductivity, the unit coefficient of thermal expansion, and the unit thermal conductivity.

[0073] Extract the fluctuation control effect parameters corresponding to each characteristic measurement value interval stored in the database, and map and extract the fluctuation control effect parameters corresponding to the interval where the characteristic measurement value of each qualified metal wire rod is located, which is denoted as the bundling fluctuation control effect parameter.

[0074] The bundling fluctuation control effect parameter includes the allowable fluctuation parameter and the comprehensive operation efficiency verification index of each qualified metal wire rod.

[0075] It should be noted that the larger the characteristic measurement value of a qualified metal wire rod, the better the characteristic state of the qualified metal wire rod, the higher the requirement for its bundling accuracy, the smaller the allowable fluctuation parameter that should be extracted, and the larger the comprehensive operation efficiency verification index.

[0076] S3. Turn on the automatic bundling device, monitor the bundling process of each qualified metal wire rod in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire rod as the target bundled wire rod, synchronously obtain the bundling state parameters of the target bundled wire rod, and analyze the bundling stability index of the target bundled wire rod.

[0077] In this embodiment, the dynamic stability index of the equipment operation, the specific analysis process is as follows:

[0078] During the preset monitoring period, monitor the bundling process, and collect the instantaneous power of the equipment during the bundling process in real time, thereby obtaining the output power stability coefficient of the equipment.

[0079] It should be understood that the steps for obtaining the output power stability coefficient of the equipment are as follows:

[0080] A1. During the preset monitoring period, collect the instantaneous power of the equipment during the bundling process at each time point, and thus calculate the average instantaneous power of the equipment.

[0081] A2. Extract the maximum instantaneous power and the minimum instantaneous power, and subtract the minimum instantaneous power from the maximum instantaneous power to obtain the output power range.

[0082] A3. Divide the output power range by the average instantaneous power of the equipment to obtain the output power stability coefficient of the equipment.

[0083] According to the instantaneous power of the equipment during the bundling process and the duration of the monitoring period, obtain the total energy consumption of the monitored bundling process.

[0084] It should be noted that both the instantaneous power and the total energy consumption of the monitored bundling process can be collected through the power meter in the wire bundling monitoring sensing device.

[0085] Collect the bundling force of each bundling process, and synchronously obtain the set bundling force, thereby analyzing and obtaining the standard deviation of the bundling force deviation.

[0086] It should be noted that the method for obtaining the standard deviation of the bundling force deviation is as follows: Subtract the set bundling force from the bundling force of each bundling process respectively to obtain the bundling force deviation of each time, and obtain the standard deviation of the bundling force deviation according to the standard deviation calculation formula. The standard deviation calculation formula is , where is the standard deviation of the bundling force deviation, is the bundling force of the th bundling process, is the number of each bundling, , is the number of bundling times.

[0087] It should be noted that the bundling force can be collected through the piezoelectric force sensor in the wire bundling monitoring sensing device.

[0088] Synchronously obtain the maximum vibration acceleration of the equipment during the monitoring period.

[0089] It should be noted that the vibration acceleration can be collected through the acceleration sensor in the wire bundling monitoring sensing device.

[0090] The stability coefficient of the device output power, the total energy consumption during the monitoring of the bundling process, the standard deviation of the bundling force deviation, and the maximum vibration acceleration of the device are jointly used as the device operation parameters.

[0091] According to the allowable fluctuation parameters of each qualified metal wire, the allowable fluctuation parameters of the target bundling wire are extracted correspondingly.

[0092] The allowable fluctuation parameters of the target bundling wire include the allowable fluctuation value of the stability coefficient of the device output power, the allowable fluctuation value of the total energy consumption during the monitoring of the bundling process, the allowable fluctuation value of the standard deviation of the bundling force deviation, and the allowable fluctuation value of the maximum vibration acceleration of the device.

[0093] Extract the ideal device operation parameters stored in the database, including the ideal stability coefficient of the device output power, the ideal total energy consumption during the monitoring of the bundling process, the ideal standard deviation of the bundling force deviation, and the ideal maximum vibration acceleration of the device.

[0094] According to the device operation parameters and the allowable fluctuation parameters of the target bundling wire, the device operation dynamic stability index is obtained through analysis and processing, and the device operation dynamic stability index is used to characterize the operation state of the bundling device.

[0095] In a specific embodiment, the method for specifically obtaining the device operation dynamic stability index is as follows:

[0096] Perform a difference operation on the stability coefficient of the device output power and the ideal stability coefficient of the device output power, and take the absolute value of the difference operation result, which is denoted as the deviation value of the stability coefficient of the device output power. Then, perform a ratio operation on the deviation value of the stability coefficient of the device output power and the allowable fluctuation value of the stability coefficient of the device output power to obtain the deviation rate of the stability coefficient of the device output power.

[0097] Perform a difference operation on the total energy consumption during the monitoring of the bundling process and the ideal total energy consumption during the monitoring of the bundling process, and take the absolute value of the difference operation result, which is denoted as the deviation value of the total energy consumption during the monitoring of the bundling process. Then, perform a ratio operation on the deviation value of the total energy consumption during the monitoring of the bundling process and the allowable fluctuation value of the total energy consumption during the monitoring of the bundling process to obtain the deviation rate of the total energy consumption during the monitoring of the bundling process.

[0098] Perform a difference operation on the standard deviation of the bundling force deviation and the allowable fluctuation value of the standard deviation of the bundling force deviation, and take the absolute value of the difference operation result, which is denoted as the deviation value of the standard deviation of the bundling force deviation. Then, perform a ratio operation on the deviation value of the standard deviation of the bundling force deviation and the allowable fluctuation value of the standard deviation of the bundling force deviation to obtain the deviation rate of the standard deviation of the bundling force deviation.

[0099] Perform a difference operation on the maximum vibration acceleration of the device and the ideal maximum vibration acceleration of the device, and take the absolute value of the difference operation result, which is denoted as the deviation value of the maximum vibration acceleration of the device. Then, perform a ratio operation on the deviation value of the maximum vibration acceleration of the device and the allowable fluctuation value of the maximum vibration acceleration of the device to obtain the deviation rate of the maximum vibration acceleration of the device.

[0100] Extract the weight values of the deviation rate of the preset device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device from the database.

[0101] Multiply the deviation rate of the device output power stability coefficient by the corresponding weight value, multiply the deviation rate of the total energy consumption during the monitoring bundling process by the corresponding weight value, multiply the deviation rate of the standard deviation of the bundling force deviation by the corresponding weight value, multiply the deviation rate of the maximum vibration acceleration of the device by the corresponding weight value, then accumulate the obtained products, record the resulting value as the initial accumulated value, and use the initial accumulated value as the independent variable of the exponential function for calculation, where the base of the exponential function is the natural constant e, and record the calculation result as the device operation dynamic stability index.

[0102] It should be noted that for the weight values of the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device, the extraction process is as follows: construct a mapping set one by one for the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device and the corresponding weight values of the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device. When in use, input the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device collected in real time into the corresponding mapping sets respectively, so as to extract the corresponding weight values of the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device.

[0103] It should also be noted that the value ranges of the weight values of the deviation rate of the device output power stability coefficient, the deviation rate of the total energy consumption during the monitoring bundling process, the deviation rate of the standard deviation of the bundling force deviation, and the deviation rate of the maximum vibration acceleration of the device are all 0 - 1.

[0104] In this embodiment, the specific analysis process of the bundling stability index of the target bundling wire is as follows:

[0105] During the preset monitoring period, obtain the surface bundling image of the target bundling wire, identify the contour of the wire bundling circle, and then locate the center points of each bundling circle. Sequentially obtain the distances between the center points of two adjacent bundling circles, and perform mean processing to obtain the average bundling distance of the wire.

[0106] Identify the bundling contour of the wire. Divide the bundled part of the bundling body along the axial direction into equal observation segments, obtain the number of winding turns of each observation segment, thereby obtain the standard deviation of the number of winding turns, and use the standard deviation of the number of winding turns as the bundling uniformity coefficient.

[0107] Identify and locate the center points of each winding coil of the target bundling wire from the surface bundling image of the target bundling wire, and identify and locate the contact points between the winding coil and the extended axes of both sides of the bundling body, which are respectively recorded as the first contact point of the winding coil and the second contact point of the winding coil. Connect the first contact point of the winding coil and the second contact point of the winding coil with the center point of the winding coil in sequence, and record the formed straight lines as the first winding reference line and the second winding reference line respectively. Extract the minimum angles between the first winding reference line and the second winding reference line and the extended axis of one side of the corresponding bundling body, which are respectively recorded as the first winding angle and the second winding angle, so as to obtain the first winding angle and the second winding angle corresponding to the center point of the winding coil. Traverse the center points of each winding coil in sequence, so as to obtain each first winding angle and each second winding angle, and perform average value processing respectively to obtain the first average winding angle and the second average winding angle.

[0108] It should be noted that the extended axes of both sides of the bundling body refer to the extended lines along the axial direction of the bundling body.

[0109] It should also be noted that the surface bundling image can be obtained by a high-definition scanner.

[0110] Obtain the extreme temperature difference of the target bundling wire within a preset monitoring period.

[0111] It should be noted that the temperature can be collected by an infrared sensor.

[0112] Jointly use the average bundling spacing of the wire, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the extreme temperature difference as the bundling state parameters of the target bundling wire.

[0113] It should be noted that during the bundling process of metal wires, if the average bundling spacing of the wires increases, it may cause the bundling uniformity coefficient to also increase, because uneven spacing makes it easier for the number of winding turns to vary greatly at different positions, thus reducing the bundling uniformity. At the same time, a larger average bundling spacing of the wires may also change the first average winding angle and the second average winding angle. Due to the change in the relative position of the wires, the winding angle may become more irregular and tend to increase.

[0114] Extract the reference bundling state parameters stored in the database, including the reference average bundling spacing of the wire, the reference bundling uniformity coefficient, the reference average winding angle and the reference extreme temperature difference.

[0115] According to the bundling state parameters of the target bundling wire, the bundling stability index of the target bundling wire is analyzed and processed, and the bundling stability index of the target bundling wire is used to characterize the bundling state of the target bundling wire.

[0116] In a specific embodiment, the method for specifically obtaining the bundling stability index of the target bundling wire is as follows:

[0117] ;

[0118] wherein, is the bundling stability index of the target bundling wire, is the average bundling spacing of the target bundling wire, is the bundling uniformity coefficient of the target bundling wire, is the first average winding angle of the target bundling wire, is the second average winding angle of the target bundling wire, is the temperature extreme difference of the target bundling wire, is the reference wire bundling average spacing, is the reference bundling uniformity coefficient, is the reference average winding angle, is the reference temperature extreme difference, is the weight of the bundling average spacing, is the weight of the bundling uniformity coefficient, is the weight of the first average winding angle, is the weight of the second average winding angle, is the weight of the temperature extreme difference, and e is the natural constant.

[0119] It should be noted that the weights of the bundling average spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle, and the temperature extreme difference all have a value range of 0 to 1. When used, the pre-set values can be directly extracted from the database. For example, the specific extraction method is to construct a mapping set with the wire bundling average spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle, and the temperature extreme difference and the weights of the bundling average spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle, and the temperature extreme difference respectively. When used, the wire bundling average spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle, and the temperature extreme difference obtained in real time are input into the corresponding mapping set, so as to obtain the weights of the bundling average spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle, and the temperature extreme difference.

[0120] S4. Based on the dynamic stability index of equipment operation and the bundling stability index of the target bundling wire, analyze the comprehensive operation efficiency index, and thus adjust the bundling equipment and generate prompt information.

[0121] In this embodiment, analyzing the comprehensive operation efficiency index, the specific analysis process is as follows:

[0122] Obtain the equipment operation parameters, and analyze and process them to obtain the dynamic stability index of equipment operation.

[0123] Obtain the bundling state parameters of the target bundling wire, and analyze and process them to obtain the bundling stability index of the target bundling wire.

[0124] According to the dynamic stability index of equipment operation and the bundling stability index of the target bundling wire, analyze and process them to obtain the comprehensive operation efficiency index, and the comprehensive operation efficiency index is used to characterize the bundling operation state of the target bundling wire.

[0125] In a specific embodiment, the method for specifically obtaining the comprehensive operation efficiency index is as follows:

[0126] ;

[0127] Wherein, is the comprehensive operation efficiency index, is the dynamic stability index of equipment operation, is the bundling stability index of the target bundling wire, is the weight value of the dynamic stability index of equipment operation, is the weight value of the bundling stability index of the target bundling wire, is the logarithmic function with base 10, and e is the natural constant.

[0128] In this embodiment, thus adjust the bundling equipment and generate prompt information, the specific analysis process is as follows:

[0129] Based on the comprehensive operation efficiency verification index of each qualified metal wire, extract the comprehensive operation efficiency verification index of the target bundling wire, and record it as the comprehensive operation efficiency verification index.

[0130] Perform difference processing on the comprehensive operation efficiency index and the comprehensive operation efficiency verification index to obtain the comprehensive operation efficiency deviation index.

[0131] It should be noted that the difference processing refers to subtracting the comprehensive operation efficiency verification index from the comprehensive operation efficiency index.

[0132] It should be noted that the result of the difference processing can be greater than zero, less than zero or equal to zero.

[0133] Extract the set of bundling equipment adjustment values corresponding to each operating efficiency deviation index range stored in the database, and map and extract the set of bundling equipment adjustment values corresponding to the range where the comprehensive operating efficiency deviation index is located, denoted as the target set of bundling equipment adjustment values.

[0134] The target set of bundling equipment adjustment values includes the winding motor speed adjustment value and the moving motor speed adjustment value.

[0135] Adjust the bundling equipment based on the target set of bundling equipment adjustment values and synchronously generate a prompt message.

[0136] It should be noted that when the comprehensive operating efficiency deviation index is less than zero, it means that the comprehensive operating efficiency index is less than the comprehensive operating efficiency verification index. At this time, the smaller the comprehensive operating efficiency deviation index, that is, the larger its absolute value, the worse the actual comprehensive operating efficiency. To ensure the bundling quality, the bundling speed should be reduced. That is, the corresponding extracted adjustment value should be negative, and the smaller the comprehensive operating efficiency deviation index, the larger the deviation, and the greater the adjustment amplitude required, and the larger the size of the corresponding extracted adjustment value.

[0137] When the comprehensive operating efficiency deviation index is greater than zero, it means that the comprehensive operating efficiency index is greater than the comprehensive operating efficiency verification index. At this time, the larger the comprehensive operating efficiency deviation index, the better the actual comprehensive operating efficiency. To avoid waste of resources, the bundling speed can be increased. That is, the corresponding extracted adjustment value should be positive, and the larger the comprehensive operating efficiency deviation index, the larger the extracted adjustment value.

[0138] When the comprehensive operating efficiency deviation index is equal to zero, no adjustment is made, that is, the extracted adjustment value is 0.

[0139] It should be noted that the winding motor speed adjustment value and the moving motor speed adjustment value should increase or decrease simultaneously, and the speed adjustment will not affect the bundling quality, such as bundling spacing, bundling uniformity, etc.

[0140] In a specific embodiment, for example, in the actual automatic bundling production of metal wire, assuming that the comprehensive operating efficiency deviation index calculated by the system is -0.2 (less than zero), indicating that the actual comprehensive operating efficiency is poor. At this time, the winding motor speed adjustment value mapped and extracted from the database is -0.3 r / min (the rotational speed decreases by 0.3 revolutions per minute), and the moving motor speed adjustment value is also -0.3 r / min (the rotational speed decreases by 0.3 revolutions per minute). The corresponding generated prompt message is "The current comprehensive operating efficiency is lower than the standard. To ensure the bundling quality, please reduce the winding motor speed by 0.3 r / min and the moving motor speed by 0.3 r / min".

[0141] If the comprehensive operation efficiency deviation index is 0.2 (greater than zero), it means that the actual operation efficiency is good. At this time, among the target adjustment value sets of the bundling equipment, the winding motor speed adjustment value is +0.2 r / min, and the moving motor speed adjustment value is +0.2 r / min. The corresponding prompt message is "The equipment is operating efficiently. To avoid resource waste, increase the winding motor speed by 0.2 r / min and the moving motor speed by 0.2 r / min."

[0142] If the comprehensive operation efficiency deviation index is exactly 0, such as in a certain monitoring, then the equipment does not need to be adjusted, and the prompt message is "The equipment is in good operating condition. Keep the current bundling parameters."

[0143] Refer to Figure 2 As shown, the second aspect of the present invention provides a metal wire automatic bundling process monitoring system, including:

[0144] A qualified metal wire screening module for starting the wire conveying device, introducing each metal wire to be bundled into the bundling area, obtaining the quality parameters of each metal wire to be bundled, analyzing the quality evaluation values of each metal wire to be bundled, and screening each qualified metal wire into the automatic bundling process.

[0145] A qualified metal wire feature analysis module for obtaining the self-feature parameters of each qualified metal wire, analyzing the feature measurement values of each qualified metal wire, and thereby obtaining the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire.

[0146] An automatic bundling process monitoring module for starting the automatic bundling device, real-time monitoring the bundling process of each qualified metal wire, obtaining the equipment operation parameters, analyzing the equipment operation dynamic stability index, recording the currently bundled qualified metal wire as the target bundling wire, and synchronously obtaining the bundling status parameters of the target bundling wire and analyzing the bundling stability index of the target bundling wire.

[0147] A bundling equipment adjustment module for analyzing the comprehensive operation efficiency index based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, thereby adjusting the bundling equipment and generating a prompt message.

[0148] Refer to Figure 3 As shown, the third aspect of the present invention provides a metal wire automatic bundling process monitoring device, including: an automatic bundling device, a wire bundling monitoring sensing device, a high-definition scanner, and an infrared sensor. Among them, the wire bundling monitoring sensing device, the high-definition scanner, and the infrared sensor are jointly used to monitor the automatic bundling device.

[0149] Refer to Figure 4As shown in the figure, it is a structural diagram of an automatic bundling device according to an embodiment of the present invention, which is used for automatically bundling wire materials. Among them, the starting point of the first layer of winding is the initial position where the metal wire starts to wind in the automatic bundling device, the ending point of the first layer of winding is the position of the metal wire after completing the first layer of winding in the automatic bundling device, and the ending point of the second layer of winding refers to the position of the metal wire after completing the second layer of winding in the automatic bundling device after the first layer of winding is completed.

[0150] The iron wire is wound around the wire reel 4.

[0151] The automatic bundling device includes a winding mechanism, a moving mechanism, a clamping mechanism and a device for clamping the iron wire head.

[0152] Refer to Figure 5 As shown in the figure, it is a schematic diagram of the winding mechanism according to an embodiment of the present invention.

[0153] The iron wire acts on the winding gear 2, and drives the spline shaft 19, the driving gear 5, and the secondary driving wheel 3 through the winding motor 14, and then drives the winding gear 2 to rotate, and winds the iron wire around the steel wire rope 12.

[0154] Refer to Figure 6 As shown in the figure, it is a schematic diagram of the moving mechanism according to an embodiment of the present invention.

[0155] The moving motor 15 drives the ball screw 18, drives the third plate 6 and the winding mechanism to move left and right, and controls the winding length of the iron wire.

[0156] Refer to Figure 7 As shown in the figure, it is a schematic diagram of the clamping mechanism according to an embodiment of the present invention.

[0157] The clamping mechanism uses a V-shaped clamping mechanism, and can clamp the steel wire rope within a certain diameter range through the 903 tension spring. Pull up the 901 movable V-shaped block, place the steel wire rope therein, and then clamp it.

[0158] Refer to Figure 8 As shown in the figure, it is a schematic diagram of the device for clamping the iron wire head according to an embodiment of the present invention.

[0159] The device for clamping the iron wire head makes the steel ball 1602 clamp and loosen the iron wire through the expansion and contraction of the spring 1601.

[0160] The working process of automatic bundling is as follows: according to the diameter of the steel wire rope 12 to be bundled, the control device calculates the bundling length of the steel wire rope, so as to determine the ending position of the first layer of winding. The moving motor 15 and the winding motor 14 are controlled by the PLC 7.

[0161] First, according to the position where the steel wire rope 12 needs to be bundled, manually place it into the notch of the second plate 8 and the winding gear 2, and clamp the steel wire rope 12 through the clamping mechanism 9.

[0162] Then, start the moving motor 15 to move the third plate 6 closer to the second plate 8. After reaching the starting position of the first layer winding, the moving motor 15 stops running. Start the winding motor 14 to rotate the wire damping device 20 for feeding wire to the same horizontal height as the wire clamping head device 16. The winding motor 14 stops running. Manually pass the wire through the damping wire feeding hole, clamp one end of the wire through the wire clamping head device 16, and the preparation work is completed.

[0163] Next, start the winding motor 14 and the moving motor 15 simultaneously. The rotation of the moving motor 15 drives the ball screw 18 to rotate. Through the ball screw nut pair, the third plate 6 moves away from the second plate 8 at the speed calculated by the control system. At the same time, the rotation of the winding motor 14 drives the spline shaft 19, the driving gear 5, and the secondary driving gear 3, and then drives the winding gear 2 to rotate to wind the wire onto the wire rope 12. When the third plate 6 moves to the end of the first layer winding, the moving motor 15 reverses, and the reverse rotation of the ball screw 18 drives the third plate 6 to move closer to the second plate 8, and winds in the reverse direction to the end of the second layer winding. The winding motor 14 and the moving motor 15 stop running. Manually cut off and extract the wire, and the winding work is completed.

[0164] Finally, manually tighten and press the two wire ends into the wire rope 12, loosen the V-shaped clamp 9, and take out the wire rope 12, and the wire rope bundling is completed.

[0165] The wire bundling monitoring and sensing device is used to collect the parameters related to the automatic wire bundling process.

[0166] The high-definition scanner is used to obtain and analyze the body surface bundling image.

[0167] The infrared sensor is used to sense and collect the temperature.

[0168] Refer to Figure 9 As shown, it is the effect diagram of the first layer of wire bundling involved in this embodiment.

[0169] Refer to Figure 10 As shown, it is the completed effect diagram of the wire bundling involved in this embodiment.

[0170] Refer to Figure 11 As shown, it is the spatial position diagram of the two wire ends after winding involved in this embodiment. In the figure, d is the diameter of the wire rope, is the angle between the wire end 1 and the plane, is the angle between the wire end 1 and the plane. In a specific embodiment, the diameter of the wire rope is between 25 mm and 125 mm. After winding, the angle between the wire end 1 and the plane needs to be greater than or equal to 30°, and the angle between the wire end 1 and the plane needs to be less than or equal to 45° to facilitate the later manual tightening of the two wire ends.

[0171] It should be noted that in a specific embodiment, after the bundling process is completed, the diameter of the steel wire rope is collected, and the allowable diameter range of the wire threading hole is obtained. If the diameter of the steel wire rope is within the allowable diameter range of the wire threading hole, bundling completion information is generated. If the diameter of the steel wire rope exceeds the allowable diameter range of the wire threading hole, a warning message is generated to indicate the failure of bundling.

[0172] It should be understood that the steel wire rope after bundling must be able to pass through the wire threading hole to ensure its normal use. Otherwise, the steel wire rope will be stuck at the bundling point and unable to be pulled. Therefore, the diameter of the steel wire rope after bundling needs to be controlled.

[0173] The above content is only an example and explanation of the structure of the present invention. Those skilled in the art of this technology can make various modifications or supplements to the specific embodiments described or use similar methods for substitution, as long as they do not deviate from the structure of the invention or exceed the scope defined by the present invention, they should all fall within the protection scope of the present invention.

Claims

1. An automatic bundling process monitoring method for metal wire rods, characterized in that, Including: S1, start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation values of each metal wire to be bundled, and screen each qualified metal wire into the automatic bundling process; S2, obtain the self-characteristic parameters of each qualified metal wire, analyze the characteristic measurement values of each qualified metal wire, and thereby obtain the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire; S3, start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, and synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire; S4, based on the dynamic stability index of the equipment operation and the bundling stability index of the target bundling wire, analyze the comprehensive operation efficiency index, and thereby adjust the bundling equipment and generate a prompt message; The comprehensive operation efficiency index is used to characterize the bundling operation state of the target bundling wire; For the dynamic stability index of the equipment operation, the specific analysis process is as follows: During the preset monitoring period, monitor the bundling process, and collect the instantaneous power of the dynamic stability index of the equipment operation in the bundling process in real time, thereby obtaining the equipment output power stability coefficient; According to the instantaneous power of the equipment in the bundling process and the duration of the monitoring period, obtain the total energy consumption of the monitored bundling process; Collect the bundling force of each bundling process, and synchronously obtain the set bundling force, and thereby analyze and obtain the standard deviation of the bundling force deviation; Synchronously obtain the maximum vibration acceleration of the equipment during the monitoring period; Jointly use the equipment output power stability coefficient, the total energy consumption of the monitored bundling process, the standard deviation of the bundling force deviation, and the maximum vibration acceleration of the equipment as the equipment operation parameters; Extract the allowable fluctuation parameters of the target bundling wire according to the allowable fluctuation parameters of each qualified metal wire; According to the equipment operation parameters and the allowable fluctuation parameters of the target bundling wire, analyze and process to obtain the dynamic stability index of the equipment operation, and the dynamic stability index of the equipment operation is used to characterize the operation state of the bundling equipment.

2. The method for monitoring the automatic bundling process of metal wire according to claim 1, wherein: For the screening of each qualified metal wire into the automatic bundling process, the specific analysis process is as follows: Obtain the quality parameters of each metal wire to be bundled, including the average wire diameter, wire density, surface roughness, and surface average hardness of each metal wire to be bundled; Analyze and process the quality parameters of each metal wire to be bundled to obtain the quality evaluation value of each metal wire to be bundled, and the quality evaluation value of each metal wire to be bundled is used to characterize the quality of each metal wire to be bundled; Extract the preset feeding quality verification index in the database; Record the metal wire to be bundled with a quality evaluation value greater than or equal to the feeding quality verification index as a qualified metal wire; Traverse each metal wire to be bundled in turn, and thereby screen each qualified metal wire into the automatic bundling process.

3. The method for monitoring the automatic bundling process of metal wire according to claim 1, characterized in that: For the analysis of the characteristic measurement values of each qualified metal wire, and thereby obtaining the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire, the specific analysis process is as follows: Obtain the self-characteristic parameters of each qualified metal wire, including the elastic modulus, conductivity, thermal expansion coefficient, and thermal conductivity of each qualified metal wire; The characteristic measurement values of each qualified metal wire are analyzed and processed according to the self-characteristic parameters of each qualified metal wire, and the characteristic measurement values of each qualified metal wire are used to characterize the characteristic states of each qualified metal wire; The fluctuation control effect parameters corresponding to each characteristic measurement value interval stored in the database are extracted, and the fluctuation control effect parameters corresponding to the interval where the characteristic measurement value of each qualified metal wire is located are mapped and extracted, which are recorded as the bundling fluctuation control effect parameters; The bundling fluctuation control effect parameters include the allowable fluctuation parameters and the comprehensive operation efficiency verification index of each qualified metal wire.

4. The automatic bundling process monitoring method for metal wire according to claim 1, characterized in that: The bundling stability index of the target bundling wire, the specific analysis process is as follows: Within a preset monitoring period, the surface bundling image of the target bundling wire is obtained, the contour of the wire bundling circle is identified, and then the center points of each bundling circle are located. The distances between the center points of two adjacent bundling circles are obtained in sequence and averaged to obtain the average bundling distance of the wire; The bundling contour of the wire is identified, the bundled part of the bundling main body is equally divided into each observation segment along the axial direction, the number of winding circles of each observation segment is obtained, and the standard deviation of the number of winding circles is obtained therefrom, and the standard deviation of the number of winding circles is used as the bundling uniformity coefficient; The center points of each winding coil of the target bundling wire are identified and located from the surface bundling image of the target bundling wire, and the contact points between the winding coil and the extended axes of both sides of the bundling main body are identified and located, which are respectively recorded as the first contact point of the winding coil and the second contact point of the winding coil. The first contact point of the winding coil and the second contact point of the winding coil are respectively connected to the center point of the winding coil in sequence, and the formed straight lines are respectively recorded as the first winding reference line and the second winding reference line. The minimum angles between the first winding reference line and the second winding reference line and the extended axis of one side of the corresponding bundling main body are extracted, which are respectively recorded as the first winding angle and the second winding angle, so as to obtain the first winding angle and the second winding angle corresponding to the center point of the winding coil. Each center point of the winding coil is traversed in sequence, so as to obtain each first winding angle and each second winding angle, and the first average winding angle and the second average winding angle are respectively obtained by averaging; Within a preset monitoring period, the extreme temperature difference of the target bundling wire is obtained; The average bundling distance of the wire, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the extreme temperature difference are jointly used as the bundling state parameters of the target bundling wire; According to the bundling state parameters of the target bundling wire, the bundling stability index of the target bundling wire is analyzed and processed. The bundling stability index of the target bundling wire is used to characterize the bundling state of the target bundling wire.

5. The automatic bundling process monitoring method for metal wire rods according to claim 1, wherein: The specific analysis process of adjusting the bundling equipment and generating a prompt message therefrom is as follows: Based on the comprehensive operation efficiency verification index of each qualified metal wire, the comprehensive operation efficiency verification index of the target bundling wire is extracted and recorded as the comprehensive operation efficiency verification index; The difference between the comprehensive operation efficiency index and the comprehensive operation efficiency verification index is processed to obtain the comprehensive operation efficiency deviation index; Extract the set of bundling equipment adjustment values corresponding to each operating efficiency deviation index interval stored in the database, and map and extract the set of bundling equipment adjustment values corresponding to the interval where the comprehensive operating efficiency deviation index is located, denoted as the target set of bundling equipment adjustment values; The target set of bundling equipment adjustment values includes the winding motor speed adjustment value and the moving motor speed adjustment value; Adjust the bundling equipment based on the target set of bundling equipment adjustment values and synchronously generate prompt information.

6. The automatic bundling process monitoring method for metal wire according to claim 1, wherein: The specific method for obtaining the comprehensive operating efficiency index is as follows: ； Among them, is the comprehensive operation efficiency index, is the dynamic stability index of equipment operation, is the bundling stability index of the target bundled wire, is the weight of the dynamic stability index of equipment operation, is the weight of the bundling stability index of the target bundled wire, and e is the natural constant.

7. An apparatus for applying the method for monitoring an automatic bundling process of a metal wire according to any one of claims 1-6, characterized in that: It includes: An automatic bundling device, a wire bundling monitoring and sensing device, a high-definition scanner, and an infrared sensor; The automatic bundling device is used for automatically bundling wires; The wire bundling monitoring and sensing device is used to collect parameters related to the wire automatic bundling process; The high-definition scanner is used to obtain and analyze the body surface bundling image; The infrared sensor is used to sense and collect the temperature.

8. A system for applying the method for monitoring the automatic bundling process of metal wire as described in any one of claims 1-6, characterized in that, It includes: A qualified metal wire screening module, which is used to start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation values of each metal wire to be bundled, and screen each qualified metal wire into the automatic bundling process; A qualified metal wire characteristic analysis module, which is used to obtain the own characteristic parameters of each qualified metal wire, analyze the characteristic measurement values of each qualified metal wire, and thereby obtain the allowable fluctuation parameters and the comprehensive operating efficiency verification index of each qualified metal wire; An automatic bundling process monitoring module, which is used to start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the equipment operation dynamic stability index, record the currently bundled qualified metal wire as the target bundled wire, and synchronously obtain the bundling status parameters of the target bundled wire and analyze the bundling stability index of the target bundled wire; A bundling equipment adjustment module, which is used to analyze the comprehensive operating efficiency index based on the equipment operation dynamic stability index and the bundling stability index of the target bundled wire, and thereby adjust the bundling equipment and generate prompt information.

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