A laminating machine for semiconductor films

Abstract

The present invention discloses a laminating machine for semiconductor film pasting. The present invention relates to the technical field of semiconductor film pasting. For this laminating machine for semiconductor film pasting, a roller-type transmission module is arranged between symmetrically distributed bases. The roller-type transmission module includes a controllable traction unit and a dust removal and temperature control unit. A laminating module for film pasting is arranged at the transmission end of the roller-type transmission module. The roller-type transmission module and the film pasting module together constitute a transmission structure with a starting point. By abandoning the relatively common roller film pasting and choosing the docking of the upper and lower dies, the present invention avoids the mechanical friction damage to the film caused by contact pressing. And by changing the state of the negative pressure through a negative pressure pipe, a non-contact pressing operation is completed. And during the film pasting process, the negative pressure adsorption can prevent the film piece from deviating from its original position, and in cooperation with the industrial camera commonly used in the prior art, the precise docking of the film pasting is completed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor film pasting, and particularly to a laminating machine for semiconductor film pasting. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. The electrical conductivity of semiconductor materials can be changed by doping impurities. The concentration and polarity of the impurities doped into the intrinsic semiconductor will have a great impact on the electrical conductivity characteristics of the semiconductor. For a semiconductor doped with donor impurities, the main current carriers are electrons in the conduction band. For a semiconductor doped with acceptor impurities, it is hole-type conduction.

[0003] The existing method for pasting films on semiconductors is through manual film pasting. The existing processing methods mainly have the following problems. Since the demand for semiconductors is increasing, the number of workers handling and transporting semiconductors is gradually increasing, increasing the labor cost. Since the volume of semiconductors is getting smaller and smaller, they are easily lost during the transportation process. The efficiency of manually pasting films on semiconductors one by one is low, and the quality of film pasting cannot be guaranteed, and it is easy to make mistakes.

[0004] For example, a laminating machine for semiconductor film pasting disclosed in Chinese Patent Publication No. CN106971970B realizes the automatic transmission of semiconductors at multiple angles through a material taking device and a material moving device, reducing the labor cost and ensuring the stable transmission of semiconductors. The position of the semiconductor is adjusted through a detection device and a position adjustment device so that the semiconductor can be aligned with the film pasting device to ensure the quality of film pasting. The automatic film pasting operation of the semiconductor is realized through the film pasting device, improving the efficiency of film pasting.

[0005] The above laminating machine completes the automatic operation of pasting films on semiconductor components through automated transmission, material transfer, docking and other related mechanisms. However, during the laminating process of this laminating machine, when applying pressure through an elastic roller to gradually press the film from one end to the other end onto the film pasting surface and at the same time squeeze out the interface bubbles, there is glue residue, and there is pressure fluctuation during the film pasting process by the roller. The reason is that the thickness of the film pasting surface of the semiconductor substrate is not completely uniform. Even if relevant equipment for adaptive air pressure compensation is introduced, it is difficult to avoid mechanical friction damage to the film caused by contact pressing.

[0006] Moreover, during the film roll transmission process of the above device, it is difficult to adaptively adjust the control of the film tension. Therefore, during the process of the film stripping knife stripping the film, there are various process accidents such as film stretching, tearing, wrinkling and adhesion in the rear station area. Summary of the Invention

[0007] In view of the deficiencies of the prior art, the present invention provides a laminating machine for semiconductor film laminating, which solves the problems raised in the above-mentioned background art.

[0008] To achieve the above objectives, the present invention is realized through the following technical solutions. A laminating machine for semiconductor film laminating, the roller-type transmission module is arranged between symmetrically distributed bases. The roller-type transmission module includes a controllable traction unit and a dust removal and temperature control unit. A laminating module for film laminating is arranged at the transmission end of the roller-type transmission module. The roller-type transmission module and the film laminating module together constitute a transmission structure with a starting point. The controllable traction unit includes a film rod arranged between two bases. A film piece is wound around the film rod. The film piece is transmitted to the terminal roller one and terminal roller two through a middle-end transmission component. The terminal roller two is clamped at one end of an adjustable traction seat. The adjustable traction seat is fixedly connected to an adjustment rotating shaft. A traction groove is opened on the adjustable traction seat. A traction part is abutted in the traction groove. A traction spring in a taut state is hinged on the traction part. The other end of the traction spring is sleeved on a damping part. It should be noted that in this application, the traction adjustment of the film during the transmission process is relatively common in the prior art, that is, by adjusting the fulcrum angle of the roller-type structure, it is ensured that the film is taut during the transmission process. However, in the high-precision semiconductor film laminating process, the offset of the vibration of the roller-type mechanical movement cannot be eliminated. Therefore, in this application, while the adjustable traction seat realizes the fulcrum angle adjustment through the rotation of the adjustment rotating shaft, the traction part abutted in its traction groove has a traction spring that is always in a taut state. Due to its elastic deformation characteristics, the transmission vibration is transmitted to the damping part, realizing the vibration cancellation in the roller-type transmission of the film in the technological process, thereby avoiding the film from being stretched, torn, wrinkled and adhered. Considering the various angle rotations of the adjustment rotating shaft, there is a range where the traction part in the traction groove needs to move. Therefore, after determining the final rotation angle of the adjustment rotating shaft, the abutment of the traction part can be selected as a fixed connection with more obvious vibration transmission.

[0009] A further improvement of the technical solution of the present invention is that the terminal roller one is fixedly installed on a fixed shaft. Both ends of the fixed shaft are connected to the side wall of the base through fasteners. Two sets of smoothing rollers are arranged at one end of the terminal roller one and terminal roller two. There is a gap greater than the thickness of the film piece between the two sets of smoothing rollers. And crankshaft parts are symmetrically arranged at both ends of one of the smoothing rollers. The crankshaft parts are fixedly installed on the base.

[0010] A further improvement of the technical solution of the present invention is that the controllable traction unit further includes a middle-end roller group one and a middle-end roller group two close to the film rod. The middle-end roller group one is fixedly installed on an adjustment frame. The adjustment frame is rotatably installed on a suspension. The suspension is welded to the base. The middle-end roller group two is rotatably installed on a support frame. A hydraulic push rod is fixedly installed on the support frame.

[0011] A further improvement of the technical solution of the present invention lies in that the dust removal and temperature control unit includes a dust removal plate rotatably installed on the suspension and close to one end of the middle roller group two. An adjustment groove is provided on the dust removal plate, and the dust removal plate is slidably connected with an L-shaped plate through the adjustment groove. A scraping rod is rotatably installed on the L-shaped plate, and a convex scraping end face is provided at one end of the dust removal plate close to the middle roller group two. A ranging sensor is provided on the L-shaped plate, a sticky roller is provided on one side of the film rod, and the sticky roller is attached to the film piece.

[0012] A further improvement of the technical solution of the present invention lies in that both the middle roller group one and the middle roller group two are rotatably connected to the corresponding suspension and support frame. Then, the middle roller group has the function of adjusting the tension during the film transmission process. And the purpose of setting multiple groups of transmission rollers in this application also includes reducing vibration by multi-roller support, allowing a higher film transmission speed, and the damage of a single group of roller structures does not affect the normal film pasting. Furthermore, the middle roller group one and the middle roller group two cancel the traction constraint of the spring that always exists in terms of adjustment, so they can be flexibly combined with the dust removal and temperature control unit. The dust removal and temperature control unit further includes a mounting rod rotatably installed on the base. Multiple landfill grooves are provided in the middle of the mounting rod. Each landfill groove is provided with a corresponding temperature control pipeline. Spray holes are arranged in an array on each temperature control pipeline. One end of each temperature control pipeline is fixedly connected to the same transmission pipe, and the other end of the transmission pipe is connected to a blower. It should be noted that during the film covering process, to ensure the firm adhesion of the film to the semiconductor, the dust removal and temperature control unit proposed in this application sprays on the film surface through the temperature conduction of the gas, and the attachment of the film to the mounting rod increases the temperature of the film. The temperature of the film is controlled at about 23°C. Correspondingly, adding a temperature sensor can more accurately complete the temperature monitoring of the film.

[0013] A further improvement of the technical solution of the present invention lies in that in order to avoid the existence of water vapor in the temperature gas, which affects the subsequent film pasting operation, therefore, a molecular sieve is buried in one end of the mounting rod close to the transmission pipe. Belt wheels are fixedly installed at the same end of the film rod and the mounting rod. A transmission belt is sleeved on the two belt wheels, and the film rod is connected to a stepping motor through a coupling.

[0014] A further improvement of the technical solution of the present invention lies in that the film pasting module includes a base installed on the base. Magnetic sliding seats are symmetrically arranged at the left and right ends of the base. A sliding groove is opened in the magnetic sliding seat, and the magnetic sliding seat is slidably connected with a magnetic block through the sliding groove. A stretching roller is inserted on the magnetic block. The film piece is wound on the stretching roller. A passive gear is key-connected to the stretching roller. The passive gear is meshed with an active gear. The active gear is key-connected to a driving shaft. The driving shaft is connected to a servo motor through a coupling. The servo motor is installed on the magnetic sliding seat.

[0015] A further improvement of the technical solution of the present invention lies in that an electric control push rod is fixedly installed in the sliding groove, and a return spring is arranged at the other end of the sliding groove. The magnetic sliding seat is set as a permanent magnet, and one side of the magnetic sliding seat is connected to an external excitation device through a wire.

[0016] A further improvement of the technical solution of the present invention lies in that vertical seats are symmetrically and fixedly installed on both sides of the base. An expansion rod is arranged at the top of the vertical seat. A spring is sleeved on the expansion rod, and the other end of the expansion rod is fixedly connected to an upper die base. The upper die is connected to an upper die through a negative pressure pipe below the upper die base. A lower die is arranged directly below the upper die. The lower die is provided with an opening and closing component. The opening and closing component includes a rotating shaft driven by a motor, and the rotating shaft is connected to an opening and closing plate. The other end of the opening and closing plate is inserted into the notch through magnetic attraction and limited.

[0017] A further improvement of the technical solution of the present invention lies in that in order to quickly separate the film covering area from the whole film, the present application integrates the upper and lower stamping film pasting structure used. Peeling knives are respectively arranged on the upper die and the lower die, and the upper and lower peeling knives form a semiconductor outer shape structure. Beneficial effects

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the relatively common roller film covering is abandoned, and the docking of the upper and lower dies is selected, avoiding mechanical friction damage to the film caused by contact pressing. And by changing the state of negative pressure through the negative pressure pipe, a non-contact pressing operation is completed. And during the film covering process, the adsorption of negative pressure can prevent the film parts from deviating from their original positions, and cooperate with the industrial camera commonly used in the prior art to complete the precise docking of film pasting;

[0019] By adjusting the fulcrum angle of the roller structure, the tension adjustment and maintenance of the tight state of the film during the transmission process are ensured. And through the elastic deformation characteristics of the traction spring, the vibration cancellation in the roller transmission of the film is realized in the technological process, thereby avoiding the film from being stretched, torn, wrinkled and adhered;

[0020] By setting multiple groups of transmission rollers to reduce vibration, a higher film transmission speed is allowed, and the damage of a single group of roller structures does not affect the normal progress of film pasting. In the middle transfer roller group one and the middle transfer roller group two, the traction constraint existing in the spring all the time is cancelled in terms of adjustment, ensuring that the controllable traction unit can be flexibly combined with the dust removal and temperature control unit. Description of the drawings

[0021] Figure 1 It is a schematic diagram of the whole laminating machine for semiconductor film pasting;

[0022] Figure 2 It is a side view of the laminating machine for semiconductor film pasting;

[0023] Figure 3Schematic diagram of the roller transmission module in the laminating machine for semiconductor film

[0024] Figure 4 Side view of the roller transmission module in the laminating machine for semiconductor film

[0025] Figure 5 Schematic diagram of the controllable traction unit in the laminating machine for semiconductor film

[0026] Figure 6 Partial schematic diagram of the controllable traction unit in the laminating machine for semiconductor film

[0027] Figure 7 Schematic diagram of the combination of the middle roller group and the dust removal and temperature control unit in the laminating machine for semiconductor film

[0028] Figure 8 Schematic diagram of the combination of the middle roller group and the dust removal and temperature control unit in the laminating machine for semiconductor film from another perspective

[0029] Figure 9 Schematic diagram of the laminating module in the laminating machine for semiconductor film

[0030] Figure 10 Side view of the laminating module in the laminating machine for semiconductor film

[0031] Figure 11 Schematic structural diagram of the laminating module in the laminating machine for semiconductor film when viewed from above

[0032] In the figure, 1, base; 201, film rod; 202, film piece; 203, terminal roller one; 204, terminal roller two; 205, adjustable traction seat; 206, traction part; 207, traction spring; 208, damping part; 209, fixed shaft; 210, smoothing roller; 211, crankshaft part; 212, middle roller group one; 213, middle roller group two; 214, adjusting frame; 215, suspension; 217, support frame; 218, hydraulic push rod; 219, adhesive roller; 301, dust removal plate; 302, L-shaped plate; 303, scraping rod; 304, convex scraping end face; 305, ranging sensor; 306, mounting rod; 307, landfill groove; 308, temperature control pipeline; 309, spray hole; 310, transmission pipe; 311, blower; 312, pulley; 313, transmission belt; 314, stepping motor; 401, base; 402, magnetic sliding seat; 403, magnet; 404, stretching roller; 405, passive gear; 406, active gear; 407, drive shaft; 408, servo motor; 409, electric control push rod; 410, return spring; 411, wire; 412, vertical seat; 413, telescopic rod; 414, upper die holder; 415, negative pressure pipe; 416, upper die; 417, lower die; 418, rotating shaft; 419, opening and closing plate; 420, notch; 421, film stripping knife. Detailed Embodiments

[0033] Various exemplary embodiments, features, and aspects of the present application will be described in detail below with reference to the accompanying drawings. Identical reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0034] The term "exemplary" used herein means "serving as an example, embodiment, or illustration". Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0035] In addition, for a better description of the present application, numerous specific details are given in the following detailed embodiments. Those skilled in the art should understand that the present application can be implemented without some specific details. In some instances, methods, means, and elements well known to those skilled in the art are not described in detail so as to highlight the gist of the present application.

[0036] The present invention provides a laminating machine for semiconductor films, including a roller-type transmission module disposed between symmetrically distributed bases 1. The roller-type transmission module includes a controllable traction unit and a dust removal and temperature control unit. A laminating module for film laminating is provided at the transmission end of the roller-type transmission module. The roller-type transmission module and the film laminating module together constitute a transmission structure with a starting point.

[0037] The controllable traction unit includes a film rod 201 disposed between two bases 1. A film member 202 is wound around the film rod 201. The film member 202 is transmitted to a terminal roller 203 and a terminal roller 204 through a middle-end transmission assembly. The terminal roller 204 is clamped at one end of an adjustable traction seat 205. The adjustable traction seat 205 is fixedly connected to an adjustment rotating shaft. A traction groove is formed in the adjustable traction seat 205. A traction portion 206 is abutted in the traction groove. A traction spring 207 in a taut state is hinged on the traction portion 206. The other end of the traction spring 207 is sleeved on a damping member 208.

[0038] It should be noted that in the present application, the traction adjustment of the film during transmission is relatively common in the prior art, that is, by adjusting the fulcrum angle of the roller-type structure to ensure the tautness of the film during transmission. However, in high-precision semiconductor film laminating processing, the offset of the vibration of the roller-type mechanical movement cannot be eliminated. Therefore, in the present application, while the adjustable traction seat 205 realizes the adjustment of the fulcrum angle by the rotation of the adjustment rotating shaft, the traction portion 206 abutted in its traction groove has a traction spring 207 that is always in a taut state. Due to its elastic deformation characteristics, the transmission vibration is transmitted to the damping member 208, realizing the vibration cancellation in the roller-type transmission of the film in the process flow, thereby avoiding stretching, tearing, wrinkling, and adhesion of the film.

[0039] Furthermore, considering the rotation of the adjustment shaft at various angles, there is a range within which the traction portion 206 in the traction groove needs to move. Therefore, after determining the final rotation angle of the adjustment shaft, the abutment of the traction portion 206 can be selected as a fixed connection with more obvious vibration transmission.

[0040] Embodiment 1. To complete the structural integration of the fitting structure and the dust removal and temperature control unit, in this embodiment, the first terminal roller 203 is fixedly installed on the fixed shaft 209. Both ends of the fixed shaft 209 are connected to the side wall of the base 1 through fasteners. At one end of the first terminal roller 203 and the second terminal roller 204, there are two sets of flattening rollers 210. There is a gap greater than the thickness of the film member 202 between the two sets of flattening rollers 210. And at both ends of one of the flattening rollers 210, there are crankshaft members 211 symmetrically arranged. The crankshaft members 211 are fixedly installed on the base 1.

[0041] The controllable traction unit further includes a first intermediate roller group 212 and a second intermediate roller group 213 near the film rod 201. The first intermediate roller group 212 is fixedly installed on the adjustment frame 214. The adjustment frame 214 is rotatably installed on the suspension 215. The suspension 215 is welded to the base 1. The second intermediate roller group 213 is rotatably installed on the support frame 217. A hydraulic push rod 218 is fixedly installed on the support frame 217.

[0042] As described above, both the first intermediate roller group 212 and the second intermediate roller group 213 are rotatably connected to the corresponding suspension 215 and support frame 217. Then, the intermediate roller group has the function of adjusting the tension during the film transmission. And the purpose of setting multiple sets of transmission rollers in this application also includes reducing vibration by multi-roller support, allowing a higher film transmission speed, and the normal film pasting is not affected by the damage of a single set of roller structure. Furthermore, the first intermediate roller group 212 and the second intermediate roller group 213 cancel the traction constraint of the spring that always exists in terms of adjustment. Therefore, they can be flexibly combined with the dust removal and temperature control unit. The dust removal and temperature control unit includes a dust removal plate 301 rotatably installed on the suspension 215 and near one end of the second intermediate roller group 213. An adjustment groove is provided on the dust removal plate 301. And the dust removal plate 301 is slidably connected with an L-shaped plate 302 through the adjustment groove. A scraping rod 303 is rotatably installed on the L-shaped plate 302. And a convex scraping end face 304 is provided at one end of the dust removal plate 301 near the second intermediate roller group 213. A distance measuring sensor 305 is provided on the L-shaped plate 302. A sticky roller 219 is provided on one side of the film rod 201. The sticky roller 219 is attached to the film member 202.

[0043] Due to the structure of the L-shaped plate 302 itself, there is a gap between the dust removal plate 301 and the scraping rod 303 that allows the film member 202 to pass through. Therefore, while the film member 202 is being transmitted through, the friction generated by the scraping rod 303 attracts the dust accumulated on the film member 202. And as shown in the appendix Figures 6-8As shown, the convex scraping end face 304 is close to the middle-end roller group two 213, and the angle of the middle-end roller group two 213 is adjustable. Therefore, the other side of the film piece 202 that does not contact the scraping rod 303 can be contacted by the convex scraping end face 304. The scraping rod 303 and the convex scraping end face 304 are made of the same material, and both are selected as a silicone roller or other soft material rollers. Further, because the middle-end roller group two 213 and the middle-end roller group one 212 do not add corresponding damping structures, the film is prevented from shifting, and thus the ranging sensor 305 is provided.

[0044] Embodiment 2. It should be noted that during the film covering process, in order to ensure the firm adhesion of the film to the semiconductor, the dust removal and temperature control unit proposed in this application sprays onto the film surface through the temperature conduction of the gas, and the adhesion of the film to the mounting rod 306 increases the temperature of the film. The temperature of the film is controlled at about 23°C. Correspondingly, adding a temperature sensor can more accurately complete the temperature monitoring of the film. The specific implementation is as follows:

[0045] The dust removal and temperature control unit further includes a mounting rod 306. The mounting rod 306 is rotatably mounted on the base 1. A plurality of landfill grooves 307 are provided in the middle of the mounting rod 306. A corresponding temperature control pipe 308 is provided in each landfill groove 307. Spray holes 309 are arranged in an array on each temperature control pipe 308. One end of each temperature control pipe 308 is fixedly connected to the same transmission pipe 310, and the other end of the transmission pipe 310 is connected to a blower 311.

[0046] In order to prevent water vapor from existing in the temperature gas and thus affecting the subsequent film pasting operation, a molecular sieve is buried in one end of the mounting rod 306 close to the transmission pipe 310;

[0047] A pulley 312 is fixedly installed at the same end of the film rod 201 and the mounting rod 306. A transmission belt 313 is sleeved on the two pulleys 312, and the film rod 201 is connected to a stepping motor 314 through a coupling.

[0048] Embodiment 3. The specific technical solution design of the film pasting in this application is specifically as follows: The film pasting module includes a base 401 installed on the base 1. Magnetic sliding seats 402 are symmetrically arranged at the left and right ends of the base 401. A sliding groove is opened in the magnetic sliding seat 402, and a magnetic block 403 is slidably connected to the magnetic sliding seat 402 through the sliding groove. A stretching roller 404 is inserted into the magnetic block 403. The film piece 202 is wound around the stretching roller 404. A passive gear 405 is key-connected to the stretching roller 404. The passive gear 405 is meshed with an active gear 406. The active gear 406 is key-connected to a drive shaft 407. The drive shaft 407 is connected to a servo motor 408 through a coupling. The servo motor 408 is installed on the magnetic sliding seat 402.

[0049] An electric control push rod 409 is fixedly installed in the sliding groove, and a return spring 410 is arranged at the other end of the sliding groove. The magnetic sliding seat 402 is set as a permanent magnet, and one side of the magnetic sliding seat 402 is connected to an external excitation device through a wire 411.

[0050] Furthermore, during the actual lamination process of this application, due to the lamination of the film and the semiconductor, there is a change in the tension of the film during the roller transmission process. Therefore, there are wrinkles in the entire film. Therefore, the terminal position of the film transmission needs to be flexibly adjusted during film lamination. The magnetic block 403 is adsorbed by the magnetic sliding seat 402 during the film lamination process to fix the position and prevent the film lamination docking from failing. After the film lamination docking is completed, the magnetic sliding seat 402 cancels the energized adsorption state, and the electric control push rod 409 moves backward until the film is flat. Then, the servo motor 408 drives the drive shaft 407 to rotate to wind and recycle the film in this area. The electric control push rod 409 is powered off, and the return spring 410 resets to return to the original state.

[0051] Vertical seats 412 are symmetrically and fixedly installed on both sides of the base 401. An expansion rod 413 is arranged at the top of the vertical seat 412. A spring is sleeved on the expansion rod 413, and the other end of the expansion rod 413 is fixedly connected to an upper mold base 414. The upper mold 416 is connected below the upper mold base 414 through a negative pressure pipe 415. A lower mold 417 is arranged directly below the upper mold 416. The lower mold 417 is provided with an opening and closing assembly. The opening and closing assembly includes a rotating shaft 418 driven by a motor, and the rotating shaft 418 is connected to an opening and closing plate 419. The other end of the opening and closing plate 419 is magnetically adsorbed and inserted into the notch 420.

[0052] In terms of the structural control of semiconductor film lamination in this application, the relatively common roller film lamination is abandoned, and the docking of the upper and lower molds is selected to avoid mechanical friction damage to the film caused by contact pressing. Subsequently, there is a situation where air bubbles are difficult to remove during the film lamination process. In response to this situation, before lamination, the negative pressure pipe 415 adsorbs the film part 202 under negative pressure. After the semiconductor and the film part 202 are laminated, the negative pressure state is changed, and air pressure blows the semiconductor and the film part 202 to complete the non-contact pressing operation. And during the film lamination process, the negative pressure adsorption can prevent the film part 202 from deviating from its original position, and cooperate with the industrial camera commonly used in the existing technology to complete the docking of the film lamination.

[0053] The docking and positioning of the industrial camera specifically include the following operations:

[0054] An industrial camera takes pictures of a semiconductor carrier to obtain the position information of the semiconductor. The industrial camera is a CCD camera, and the CCD camera can be an existing technology. A second picture is taken at the position of the upper die 416 of the lower industrial camera to obtain the position information of the upper die 416. By comparing the position information after the two pictures are taken, the difference in position is obtained, and thus the position of the lower die 417 is correspondingly changed. The preferred connection method of the lower die 417 is to connect the corresponding shifting component.

[0055] In order to quickly separate the film covering area from the whole film, the present application integrates the upper and lower stamping film attaching structures used. Stripping knives 421 are respectively arranged on the upper die 416 and the lower die 417. The upper and lower stripping knives 421 form the contour of the semiconductor outer shape structure. For example, if the semiconductor is circular, the upper and lower stripping knives 421 are circular when the overall structure is closed.

[0056] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0057] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor film laminating machine, comprising a roller transmission module and a film member, characterized in that: The roller transmission module is arranged between symmetrically distributed bases, the roller transmission module includes a controllable traction unit and a dust removal and temperature control unit, the transmission end of the roller transmission module is provided with a laminating module for laminating, the roller transmission module and the laminating module together constitute a transmission structure with a starting point and used to transmit the film piece, the dust removal and temperature control unit includes a sticky roller laminating with the film piece and a dust removal plate rotatably mounted on the controllable traction unit, one end of the dust removal plate is provided with a raised scraping end face, the dust removal plate is provided with an adjustment groove, and the dust removal plate is slidably connected with an L-shaped plate through the adjustment groove, a scraping rod is rotatably mounted on the L-shaped plate, and a distance measuring sensor is provided on the L-shaped plate; The bonding module includes a base installed on a pedestal, vertical seats are fixedly installed on both sides of the base, an upper mold and a lower mold are arranged between the vertical seat and the base, a stretching roller for winding a film is arranged on one side of the lower mold, the stretching roller is inserted into a corresponding magnetic block, the magnetic block is slidably installed in a sliding groove of a magnetic slide, a passive gear is keyed to the stretching roller, the passive gear is meshedly connected to a driving gear, the driving gear is keyed to a driving shaft, the driving shaft is connected to a servo motor through a coupling, the servo motor is installed on the magnetic slide, an electric control push rod is fixedly installed in the sliding groove, and a reset spring is arranged at the other end of the sliding groove, the magnetic slide is configured as a permanent magnet, and one side of the magnetic slide is connected to an external excitation device through a wire.

2. A semiconductor film bonding machine according to claim 1, characterized in that: The controllable traction unit comprises a film rod arranged between two bases, the film rod is wound around a film piece, the film piece is transmitted to the terminal roller 1 and the terminal roller 2, the terminal roller 2 is clamped on one end of an adjustable traction seat, the adjustable traction seat is fixedly connected with an adjustment shaft, a traction groove is provided on the adjustable traction seat, the adjustable traction seat is abutted with a traction part through the traction groove, a traction spring in a taut state is hinged on the traction part, and the other end of the traction spring is sleeved on the damping member; The terminal roller 1 is fixedly mounted on a fixed shaft, and both ends of the fixed shaft are connected to the side walls of the base through fasteners. Two groups of smoothing rollers are arranged at one end of the terminal roller 1 and the terminal roller 2, and there is a gap between the two groups of smoothing rollers that is greater than the thickness of the film member, and crankshaft members are symmetrically arranged at both ends of one of the smoothing rollers, and the crankshaft members are fixedly mounted on the base.

3. A semiconductor film bonding machine according to claim 2, characterized in that: The controllable traction unit also includes a middle-end roller group 1 and a middle-end roller group 2 close to the membrane rod. The middle-end roller group 1 is fixedly installed on an adjusting frame, and the adjusting frame is rotatably installed on a suspension. The suspension is welded to a base, and the middle-end roller group 2 is rotatably installed on a supporting frame, and a hydraulic push rod is fixedly installed on the supporting frame.

4. A semiconductor film bonding machine according to claim 3, characterized in that: The dust removal and temperature control unit also includes a mounting rod, which is rotatably mounted on the base. A plurality of landfill slots are arranged at the middle end of the mounting rod, each of which is provided with a corresponding temperature control pipe, each of which is provided with spray holes arranged in an array, one end of each of which is fixedly connected to the same transmission pipe, and the other end of which is connected to a blower.

5. The semiconductor film bonding machine according to claim 4, characterized in that: A molecular sieve is buried in one end of the mounting rod close to the transmission pipe; The membrane rod and the installation rod are both fixedly mounted with pulleys at the same end, two pulleys are sleeved with transmission belts, and the membrane rod is connected to a stepping motor via a coupling.

6. The semiconductor film bonding machine according to claim 1, characterized in that: A telescopic rod is provided on the top of the vertical seat, a spring is sleeved on the telescopic rod, and the other end of the telescopic rod is fixedly connected to an upper mold seat, the upper mold seat is connected to the upper mold through a negative pressure tube, the upper mold is located directly above the lower mold, and the lower mold is provided with an opening and closing assembly, the opening and closing assembly includes a rotating shaft driven by a motor, and the rotating shaft is connected to an opening and closing plate, and the other end of the opening and closing plate is inserted in the recess by a magnetic limiter.

7. A semiconductor film bonding machine according to claim 6, characterized in that: The upper mold and the lower mold are respectively provided with film stripping knives, and the upper and lower film stripping knives form a semiconductor outer shape structure.

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