Heat transport device

Abstract

The present invention provides a heat transport device capable of suppressing or preventing a decrease in heat transport efficiency due to non-uniformity of a fluid in a heat transport device. A heat transport device (100) is provided with a heat exchanger (1), a fluid supplier (2), and a supply flow path (3). A heat exchanger (1) is provided with a circulation flow path (11) through which a fluid (F) can circulate, and a first cooler (12) for cooling the fluid (F). The circulation flow path (11) includes a heat absorption flow path (111) disposed in the first heat source (H1), and a heat dissipation flow path (112) disposed in the first cooler (12). The supply flow path (3) connects the circulation flow path (11) of the heat exchanger (1) and the fluid supplier (2).

Description

Technical Field

[0001] The present invention relates to a heat transport device. Background Art

[0002] Conventionally, there is known a heat transporter that transports heat by utilizing the circulation of a fluid, and the heat transporter includes a thermosyphon, a Venturi (capillary structure) type heat pipe, and the like.

[0003] For example, Patent Document 1 discloses a ring-shaped thermosyphon in which a working fluid is sealed inside a sealed container. The thermosyphon has an evaporation section and a condensation section. The evaporation section receives heat from a heating element and evaporates the working fluid. The evaporated gas phase working fluid flows toward the condensation section. The condensation section condenses the gas phase working fluid into a liquid phase by dissipating the heat of the gas phase working fluid to the outside.

[0004] In addition, the Venturi-type heat pipe seals the working fluid inside the sealed container. The working fluid evaporates by the heat supplied by the evaporation part, flows to the condensation part, and condenses by heat dissipation in the condensation part. Accordingly, the heat pipe transfers heat from the evaporation part to the outside of the condensation part. In addition, the liquid working fluid condensed by the condensation part flows back to the evaporation part by the capillary force of the Venturi provided on the inner wall surface of the sealed container.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-23666 Summary of the invention

[0008] However, when unevenness of the working fluid occurs in the heat transporter, the heat transport efficiency of the heat transporter may be greatly reduced. For example, when the temperature of the heating element is too high, a large amount of gas-phase working fluid may be generated due to rapid evaporation, resulting in a decrease in the liquid-phase working fluid. In this case, the working fluid is difficult or impossible to circulate between the evaporation section and the condensation section, thereby reducing the amount of heat transported from the heat source to the evaporation section by the heat transporter, which may also make it impossible to transport heat. In addition, when the condensation capacity of the condensation section is insufficient relative to the amount of gas-phase working fluid, the gas-phase working fluid may not be fully condensed, and overheating may also be caused in the working fluid heat transporter. This problem may also occur in thermosiphons, Venturi-type heat pipes, etc.

[0009] In addition, regarding the heat transfer efficiency, the thermosyphon of Patent Document 1 improves the heat transfer efficiency of the evaporation section to the working fluid by providing a multilayer structure having a foamed metal layer in the evaporation section. In this case, since the evaporation of the working fluid in the evaporation section is promoted, when the temperature of the heat source is too high, a large amount of gaseous working fluid will be generated in the thermosyphon, and therefore, the above-mentioned problem is not solved. That is, there is an imbalance in the working fluid, which may cause a significant reduction in the heat transfer efficiency of the thermosyphon.

[0010] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a heat transport device capable of suppressing or preventing a decrease in heat transport efficiency due to unevenness of a fluid in a heat transporter.

[0011] In order to achieve the above-mentioned object, a heat transport device of one embodiment of the present invention comprises: a heat exchanger, a fluid supplier, and a supply flow path. The heat exchanger has: a circulation flow path capable of circulating a fluid, and a first cooler for cooling the fluid. The circulation flow path includes: a heat absorption flow path arranged in a first heat source, and a heat dissipation flow path arranged in the first cooler. The supply flow path connects the circulation flow path of the heat exchanger with the fluid supplier.

[0012] More features and advantages of the present invention will be further clarified through the following embodiments.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide a heat transport device capable of suppressing or preventing a decrease in heat transport efficiency due to unevenness of a fluid in a heat transporter. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram showing a configuration example of the heat transport device according to the first embodiment.

[0016] Figure 2 This is a rear view showing a heat transfer device installed in an exhaust duct through which a high-temperature airflow flows.

[0017] Figure 3 It is a cross-sectional view showing a structural example of a heat exchanger.

[0018] Figure 4 It is a cross-sectional view showing a configuration example of a fluid supply device.

[0019] Figure 5 It is a schematic diagram showing another arrangement example of the fluid supply device.

[0020] Figure 6 It is a schematic diagram showing another configuration example of the heat transport device according to the first embodiment.

[0021] Figure 7 It is a schematic diagram showing a configuration example of a heat transport device according to the second embodiment.

[0022] Figure 8 It is a schematic diagram showing a configuration example of a heat transport device according to a third embodiment.

[0023] Fig. 9 It is a schematic diagram showing a configuration example of a heat transport device according to a fourth embodiment.

[0024] Description of Reference Numerals

[0025] 100…heat transport device; 200…control device; 1, 1a~1e…heat exchanger; 11…circulation flow path; 111…heat absorption flow path; 112…heat dissipation flow path; 113…inflow flow path; 114…outflow flow path; 115…port; 12…cooler; 120…housing; 121…inlet port; 122…outlet port; 123…refrigerant flow path; 1231…solenoid valve; 124…power generation component; 13…sensor; 14…secondary cooler; 140…housing ; 141…refrigerant flow path; 142…solenoid valve; 2…fluid supplier; 21…fluid tank; 22…cooling component; 221…solenoid valve; 23…port; 3…supply flow path; 31…branch flow path; 32…solenoid valve; 4…connecting flow path; H1…exhaust pipe; H2…heat source; H2a…high temperature body; HG…high temperature airflow; P1…pipe flange; P1…flange; Pi…inlet port; Po…outlet port; F…fluid; Td…lower limit temperature; Tu…upper limit temperature. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0027] <1. First embodiment>

[0028] Figure 1 1 is a schematic diagram showing a configuration example of the heat transport device 100 . Figure 2 FIG. 1 is a rear view of a heat transport device 100 installed in an exhaust duct H1 through which a high-temperature airflow HG flows. The exhaust duct H1 is an example of a "first heat source" of the present invention. Figure 1 as well as Figure 2 In the figure, the symbol Z represents the "vertical direction" and the symbol Z1 represents the "vertical upward direction". The symbol X represents the direction perpendicular to the Z direction, and in the following description, it is parallel to the direction in which the high temperature airflow HG flows in the exhaust duct H1. The symbol Y represents the direction perpendicular to both the Z direction and the X direction. These are described later. Figures 3 to 9 The same is true.

[0029] The heat transport device 100 is arranged at a place with a heat source such as an exhaust pipe of an incinerator or exhaust heat of a factory, and is used to transport the heat emitted from the heat source to the outside. The heat transported from the factory is used, for example, for thermal power generation. In this embodiment, the heat source to which the heat transport device 100 is arranged is the exhaust duct H1. In the exhaust duct H1, the high-temperature airflow HG flows along the exhaust pipe H1 from the exhaust pipe H1 to the exhaust pipe H2. Figure 1 The flow is from the left side of the paper to the direction of the arrow on the right side.

[0030] Each component of heat transport device 100 is controlled by control device 200. Heat transport device 100 may be provided with control device 200 or not. In other words, in the latter configuration, control device 200 is an external device that controls heat transport device 100.

[0031] <1-1. Heat transfer device 100 >

[0032] like Figure 1 as well as Figure 2 As shown, the heat transport device 100 includes a heat exchanger 1 , a fluid supplier 2 , a supply flow path 3 , and a connecting flow path 4 .

[0033] The heat exchanger 1 is arranged in the exhaust pipe H1, and does not require mechanical devices such as pumps. The heat can be transported to the outside of the exhaust pipe H1 by the fluid F circulating by natural convection. In the present embodiment, the fluid F is water. However, it is not limited to this example, and the fluid F can also be a liquid other than water, preferably a liquid that can perform latent heat transport through a gas-liquid phase change. There are multiple heat exchangers 1, which are connected to each other via a connecting flow path 4. Each heat exchanger 1 is a thermosyphon of the same structure, and performs latent heat transport by utilizing a gas-liquid phase change. However, it is not limited to this example, and at least one heat exchanger 1 can also be a device capable of heat transport other than a thermosyphon. For example, at least one heat exchanger 1 can be a Venturi-type heat pipe, or it can perform heat transport without utilizing a gas-liquid phase change. In addition, the above example does not exclude the configuration of the heat exchanger 1 being singular. In addition, when the heat exchanger 1 is singular, the connecting flow path 4 can be omitted.

[0034] like Figure 1 as well as Figure 2As shown, the heat exchanger 1 has: a circulation flow path 11 and a cooler 12. In addition, the cooler 12 is an example of: the "first cooler" of the present invention. The circulation flow path 11 is: a hollow tube connected in a ring shape. The fluid F can circulate in the circulation flow path 11. A part of the circulation flow path 11 is arranged in the exhaust duct H1, and the other part is arranged in the cooler 12. For example, the circulation flow path 11 includes: a heat absorption flow path 111 and a heat dissipation flow path 112. The heat absorption flow path 111 is: a flow path of the fluid F arranged in the exhaust duct H1. The heat dissipation flow path 112 is: a flow path of the fluid F arranged in the cooler 12. The cooler 12 cools the fluid F in the circulation flow path 11.

[0035] Figure 4 2 is a cross-sectional view showing a configuration example of the fluid supply device 2. Figure 4 As shown, the fluid supply device 2 includes a fluid box 21 and a cooling component 22. The fluid box 21 is a receiving portion for receiving the fluid F that can be supplied to the heat exchanger 1. The cooling component 22 cools the fluid F in the fluid box 21. In the present embodiment, the cooling component 22 is a hollow tube for unidirectional circulation of the refrigerant, and is arranged in the fluid box 21. The inlet and outlet of the cooling component 22 are respectively arranged on the outer surface of the fluid box 21, and are connected to a circulation device (not shown) such as a pump that circulates the refrigerant.

[0036] The supply flow path 3 is a hollow pipe disposed between the heat exchanger 1 and the fluid supplier 2, and connects the circulation flow path 11 of the heat exchanger 1 and the fluid supplier 2. The fluid F can flow from one of the heat exchanger 1 and the fluid supplier 2 to the other through the supply flow path 3.

[0037] In the heat transport device 100, the fluid supplier 2 is connected to the circulation flow path 11 of the heat exchanger 1 via the supply flow path 3. Thus, even if the fluid F for transporting heat is insufficient in the heat exchanger 1 due to non-uniformity, it can be supplied from the fluid supplier 2 to the heat exchanger 1. Therefore, the heat transport device 100 can suppress or prevent the heat transport efficiency from being reduced due to the non-uniformity of the fluid F, and can also prevent the heat exchanger 1 from being overheated.

[0038] <1-2. Heat exchanger 1>

[0039] Next, refer to Figures 1 to 3 , a configuration example of the heat exchanger 1 is described in detail. Figure 3 It is a cross-sectional view showing a configuration example of the heat exchanger 1 .

[0040] The circulation flow path 11 of the heat exchanger 1 includes an inflow flow path 113 and an outflow flow path 114 in addition to the heat absorption flow path 111 and the heat dissipation flow path 112. In other words, the circulation flow path 11 includes the heat absorption flow path 111, the heat dissipation flow path 112, the inflow flow path 113, and the outflow flow path 114.

[0041] The heat absorption flow path 111 is a vaporization part that vaporizes the fluid F by receiving heat from the high-temperature airflow HG in the exhaust duct H1, and is a hollow pipe that extends in a meandering manner. The inlet of the heat absorption flow path 111 is connected to the inlet port Pi of the exhaust duct H1. The outlet of the heat absorption flow path 111 is connected to the outlet port Po of the exhaust duct H1. The inlet port Pi and the outlet port Po are pipe connection ports arranged on the outer wall surface of the exhaust duct H1 (for example, installed on the duct flange P1 of the exhaust duct H1). The fluid F flows into the heat absorption flow path 111 through the inlet port Pi, and flows out of the heat absorption flow path 111 through the outlet port Po.

[0042] The heat dissipation flow path 112 is a condensation part where the gasified fluid F is cooled and liquefied (i.e., condensed) by passing through the cooler 12. The inlet of the heat dissipation flow path 112 is connected to the inlet port 121 of the cooler 12. The outlet of the heat dissipation flow path 112 is connected to the outlet port 122 of the cooler 12. In addition, the inlet port 121 and the outlet port 122 are pipe connection ports arranged on the housing 120 of the cooler 12. The fluid F flows into the heat dissipation flow path 112 through the inlet port 121, and flows out of the heat dissipation flow path 112 through the outlet port 122.

[0043] The inflow flow path 113 is a flow path of the fluid F that is arranged between the inlet port Pi of the heat absorption flow path 111 and the outlet port 122 of the cooler 12 and connects the two. For example, one end of the inflow flow path 113 is connected to the inlet port Pi of the exhaust duct H1. The other end of the inflow flow path 113 is connected to the outlet port 122 of the cooler 12. The inflow flow path 113 allows the fluid F that flows out of the heat dissipation flow path 112 through the outlet port 122 of the cooler 12 to flow into the heat absorption flow path 111 again through the inlet port Pi of the exhaust duct H1.

[0044] The outflow flow path 114 is a flow path of the fluid F that is disposed between the outlet port Po of the heat absorption flow path 111 and the inlet port 121 of the cooler 12 and connects the two. For example, one end of the outflow flow path 114 is connected to the outlet port Po of the exhaust duct H1. The other end of the outflow flow path 114 is connected to the inlet port 121 of the cooler 12. The outflow flow path 114 allows the fluid F that flows out of the heat absorption flow path 111 through the outlet port Po of the exhaust duct H1 to flow into the heat dissipation flow path 112 through the inlet port 121 of the cooler 12.

[0045] In each heat exchanger 1, the other end of the outflow flow path 114 (and the inlet port 121 of the cooler 12) is arranged at a position closer to the vertical upper side Z1 than one end of the inflow flow path 113 (and the inlet port Pi of the exhaust duct H1) and the other end of the inflow flow path 113 (and the outlet port 122 of the cooler 12). In other words, the inlet and outlet of the heat dissipation flow path 112 are arranged at a position closer to the vertical upper side Z1 than the inlet of the heat absorption flow path 111.

[0046] The temperature of the fluid F in the inflow passage 113 is lower than the temperature of the fluid in the outflow passage 114. In addition, in the present embodiment, in normal operation, the fluid F in the liquid phase flows in the inflow passage 113, and the fluid F in the gas phase flows in the outflow passage 114. Therefore, the density of the fluid F in the inflow passage 113 is greater than the density of the fluid F in the outflow passage 114. Accordingly, by arranging the inlet and outlet of the heat dissipation passage 112 at a position vertically upward Z1 relative to the inlet of the heat absorption passage 111, the fluid F in the circulation passage 11 can be circulated in the order of the heat absorption passage 111 → the outflow passage 114 → the heat dissipation passage 112 → the inflow passage 113 → the heat absorption passage 111 → ... by utilizing the density difference between the fluid F in the inflow passage 113 and the fluid F in the outflow passage 114. That is, the fluid F in the circulation passage 11 can be circulated naturally without the need for a device for circulating the fluid F.

[0047] Next, the cooler 12 also has a refrigerant flow path 123. In the present embodiment, the refrigerant flow path 123 is a hollow tube for one-way circulation of the refrigerant, and is arranged in the shell 120. The inlet and outlet of the refrigerant flow path 123 are respectively arranged on the outer surface of the shell 120, and are connected to a circulation device (pump, etc.; not shown in the figure) that circulates the refrigerant. In addition, the liquid or gaseous refrigerant sent out from the outlet of the refrigerant flow path 123 is sent to the circulation device after the waste heat is utilized. In the case of sending out the liquid refrigerant, the refrigerant can be used for hot water supply, hot and cold heating, etc. In addition, in the case of sending out the gaseous refrigerant, it can be used for power generation by power generation equipment such as gas turbines.

[0048] Alternatively, the cooler 12 may also have: a single or multiple power generation components 124. The power generation component is, for example, a thermoelectric conversion element such as a Peltier element, and is housed in the housing 120, and generates electricity using the heat transported by the heat exchanger 1. For example, in the housing 120, the refrigerant flow path 123 is opposite to the heat dissipation flow path 112 across the Peltier element. In other words, the refrigerant flow path 123 is arranged on one side of the Peltier element. The heat dissipation flow path 112 is arranged on the other side of the Peltier element. The electricity generated by the power generation component 124 can be used as a power source for a component that requires electricity of the heat transport device 100 (for example, an electromagnetic valve installed in the heat exchanger 1, the fluid supplier 2, the supply flow path 3, etc.), and can also be transported to the outside of the heat transport device 100.

[0049] In addition, the refrigerant flow path 123 may be provided with a solenoid valve 1231 for controlling the opening and closing of the refrigerant flow path 123. The opening and closing switching of the solenoid valve 1231 is controlled by the control device 200. The solenoid valve 1231 is a normally open type, and during normal operation, the refrigerant flow path 123 is in an open state so that the refrigerant can flow. However, this example does not exclude a configuration in which the solenoid valve 1231 is not provided in the refrigerant flow path 123.

[0050] In addition, in this embodiment, as described above, there are multiple heat exchangers 1, and the heat transport device 100 further includes a connecting flow path 4. The connecting flow path 4 is a hollow pipe that allows the fluid F to flow, and connects the circulation flow paths 11 of each heat exchanger 1. Figure 1 as well as Figure 2 In the embodiment, a plurality of heat exchangers 1 are arranged along the direction in which the high-temperature airflow HG in the exhaust duct H1 flows. The connecting flow path 4 is disposed between the circulation flow paths 11 of two adjacent heat exchangers 1 in the direction, connected to both, and further connected in series. That is, one end of the connecting flow path 4 is connected to the circulation flow path 11 of one heat exchanger 1. The other end of the connecting flow path 4 is connected to the circulation flow path 11 of the other heat exchanger 1. However, this is not limited to Figure 1 as well as Figure 2 As an example, the connecting flow path 4 may be disposed between the circulation flow paths 11 of three or more heat exchangers 1 and connected to the respective circulation flow paths 11. In addition, the connecting flow path 4 may connect the circulation flow paths 11 of at least a part of the heat exchangers 1 in parallel.

[0051] The connecting flow path 4 connects the circulation flow paths 11 of each heat exchanger 1, thereby, the multiple heat exchangers 1 can share the fluid F. That is, the fluid F is distributed among the heat exchangers 1 via the connecting flow path 4. As a result, the pressure of the fluid F in each heat exchanger 1 is balanced. By balancing the pressure, the saturation temperature of the fluid F in each heat exchanger 1 can be balanced, so that the fluid F shared by the multiple heat exchangers 1 is evenly heated through the exhaust pipe H1. Therefore, even if the temperature of the portion of the heat absorption flow path 111 of each heat exchanger 1 in the exhaust pipe H1 is uneven due to changes, etc., the temperature of the fluid F shared by the multiple heat exchangers 1 can be balanced.

[0052] In addition, the fluid F may be unevenly distributed among the heat exchangers 1, resulting in a shortage of the fluid F in some of the heat exchangers 1. In this case, the fluid F is supplied to the heat exchanger 1 from the fluid supplier 2. Therefore, the heat transport device 100 can suppress or prevent the heat transport efficiency from being reduced due to the uneven distribution of the fluid F, and can also prevent the heat exchanger 1 with insufficient fluid F from being overheated.

[0053] Preferably, at least one connecting flow path 4 connects the inflow flow paths 113 of each heat exchanger 1. The fluid F flowing into the heat absorption flow path 111 flows in the inflow flow path 113. Therefore, by connecting the inflow flow paths 113 of each heat exchanger 1 with each other using the connecting flow path 4, the fluid F can be directly supplied to the inflow flow path 113 of the heat exchanger 1 where the fluid F is insufficient due to unevenness. That is, since the shortage of the fluid F flowing into the heat absorption flow path 111 can be more reliably eliminated, the heat transfer efficiency of the heat exchanger 1 where the fluid F is uneven can be more reliably suppressed or prevented from being reduced. However, this example does not exclude a configuration in which at least one connecting flow path 4 connects the outflow flow paths 114 of each heat exchanger 1 with each other, nor does it exclude a configuration in which all the connecting flow paths 4 connect the inflow flow paths 113 of a part of the heat exchanger 1 with the outflow flow paths of another part.

[0054] In addition, it is preferred that, in at least one connecting flow path 4, one end and the other end of the connecting flow path 4 are arranged at the same height position in the vertical direction Z. In this case, the pressure of the fluid F at one end of the connecting flow path 4 can be made the same as the pressure of the fluid F at the other end of the connecting flow path 4. Therefore, the pressure difference of the fluid F at one end and the other end of the connecting flow path 4 can be eliminated. Accordingly, the fluid F can flow smoothly between the circulation flow paths of the plurality of heat exchangers 1 without being affected by the pressure difference.

[0055] In addition, it is preferred that one end and the other end of all the connecting flow paths 4 are arranged at the same height position in the vertical direction Z. In this way, the pressure of the fluid F at one end and the other end of all the connecting flow paths 4 can be made the same. Therefore, the fluid F shared by the plurality of heat exchangers 1 can be distributed more evenly without being affected by the pressure difference on the different connecting flow paths 4.

[0056] However, the above example neither excludes the configuration in which, in at least one connecting flow path 4, one end and the other end of the connecting flow path 4 are arranged at different height positions in the vertical direction Z, nor excludes the configuration in which one end and the other end of a part of the connecting flow path 4 are arranged at different height positions in the vertical direction Z than one end and the other end of another part of the connecting flow path 4.

[0057] In addition, in the present embodiment, all the heat exchangers 1 are arranged on the same heat source (i.e., the exhaust duct H1). However, this is not limited to the example, and the configuration may be such that a portion of the heat exchangers 1 are arranged on the exhaust duct H1, and another portion of the heat exchangers 1 are arranged on a heat source other than the exhaust duct H1. Alternatively, each heat exchanger 1 may be arranged on a different heat source.

[0058] Next, preferably, at least one heat exchanger 1 further includes a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11 of the heat exchanger 1. In addition, in the present embodiment, a specific heat exchanger 1a described later includes the sensor 13. However, this example is not limiting, and the sensor 13 may also be provided in a heat exchanger 1 other than the specific heat exchanger 1a, or may be provided in all heat exchangers 1. The sensor 13 is, for example, a temperature sensor, which is disposed in the circulation flow path 11 and detects the temperature of the outer surface of the circulation flow path 11. The detection result of the sensor 13 is output to the control device 200. The control device 200 monitors the temperature of the fluid F flowing in the circulation flow path 11 and its change over time based on the output signal of the sensor 13 indicating the detection result.

[0059] <1-3. Fluid supply device 2>

[0060] Next, refer to Figure 1 to Figure 2 as well as Figures 4 to 5 , a configuration example of the fluid supplier 2 is described in detail. Figure 5 It is a schematic diagram showing another arrangement example of the fluid supply device 2 .

[0061] In this embodiment, the fluid supply device 2 is disposed in the heat source H2. In addition, the heat source H2 is an example of the "second heat source" of the present invention. In detail, at least a portion of the fluid box 21 is disposed in the heat source H2. Figure 4In the above, a part of the fluid tank 21 passes through the outer wall surface of the heat source H2 (for example, the flange P2 attached to the outer wall surface) and is arranged in the heat source H2.

[0062] For example, Figure 1 As shown, the fluid supplier 2 can also be set at a high temperature body H2a different from the exhaust pipe H1, that is, the heat source H2. In other words, the heat source H2 can also be: a high temperature body H2a that needs to be cooled outside the exhaust pipe H1. In this case, the fluid supplier 2 can transfer heat to the outside of the heat source H2. Therefore, the fluid supplier 2 can play the same role as the heat exchanger 1.

[0063] Preferably, in Figure 1 In the embodiment, the heat source H2 has a temperature lower than that of the portion of the exhaust pipe H1 where the heat exchanger 1 is provided. In this way, it is possible to effectively suppress or prevent the pressure of the fluid F in the fluid supply device 2 from being too high compared to the pressure of the fluid F in the heat exchanger 1. Therefore, it is possible to prevent the fluid F in the fluid box 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient. However, the above example does not exclude the configuration in which the temperature of the high-temperature body H2a is higher than the temperature of the portion H1a in the exhaust pipe H1 where the heat exchanger 1 is provided. In this case, for example, by setting the cooling capacity of the cooling component 22 in the fluid supply device 2 to be higher, it is possible to prevent the fluid F in the fluid box 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient.

[0064] Or, if Figure 5 As shown, the heat source H2 may be a portion H1b different from the portion H1a in the exhaust duct H1 where the heat exchanger 1 is provided. For example, the portion H1b may be a portion closer to the downstream side of the high-temperature airflow HG than the portion H1a where the heat exchanger 1 is provided. In this case, the fluid supplier 2 can transfer heat to the outside of the exhaust duct H1. Therefore, the fluid supplier 2 can play the same role as the heat exchanger 1.

[0065] Preferably, in Figure 5In the embodiment, the fluid supply device 2 is disposed in a portion (e.g., portion H1b) in the exhaust duct H1 where the internal temperature is below a predetermined lower limit temperature Td. The lower limit temperature Td is set to a temperature at which the fluid F in the fluid tank 21 is not excessively vaporized. In this way, it is possible to effectively suppress or prevent the pressure of the fluid F in the fluid supply device 2 from being too high as compared to the pressure of the fluid F in the heat exchanger 1. Therefore, even if the fluid supply device 2 is disposed in the same exhaust duct H1 as the heat exchanger 1, it is possible to prevent the fluid F from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient. However, the above-mentioned example does not exclude the configuration in which the fluid supply device 2 is disposed in a portion of the exhaust duct H1 where the temperature is higher than the lower limit temperature Td. In this case, for example, by setting the cooling capacity of the cooling member 22 in the fluid supply device 2 to be higher, it is possible to prevent the fluid F in the fluid tank 21 from being supplied to the heat exchanger 1 when the fluid F in the heat exchanger 1 is not insufficient.

[0066] The fluid F in the fluid box 21 is heated by the heat received from the heat source H2, and on the other hand, as described above, it can be cooled by the cooling part 22. That is, the implementation and stop of the cooling of the cooling part 22 can be switched. In the present embodiment, the piping between the inlet (or outlet) of the cooling part 22 and the device for circulating the refrigerant in the cooling part 22 is provided with: a solenoid valve 221 controlled by the control device 200. The solenoid valve 221 switches the circulation and the stop of the circulation of the refrigerant in the piping. By switching the implementation and stop of the cooling of the cooling part 22, even if an opening and closing device or a device for controlling the flow of the fluid F is not provided in the supply flow path 3, the supply state of the fluid F from one side of the fluid supplier 2 and the heat exchanger 1 to the other side can be adjusted.

[0067] For example, in the fluid supply device 2, when the cooling of the cooling component 22 is stopped, the fluid F in the fluid tank 21 is pressurized due to volume expansion accompanying temperature rise. On the other hand, when the heat exchanger 1 is short of the fluid F, the fluid F in the heat exchanger 1 is depressurized. Therefore, in this case, in the fluid supply device 2, for example, the solenoid valve 221 is switched to a closed state to stop the cooling of the cooling component 22, and the fluid F in the fluid tank 21 is kept at the same temperature rise. According to this, the heat transport device 100 can supply the fluid F from the fluid supply device 2 to the heat exchanger 1. That is, by making the pressure of the fluid F in the heat exchanger 1 lower than the pressure of the fluid F in the fluid tank 21, the fluid F is naturally supplied from the fluid tank 21 to the heat exchanger 1 through the supply flow path 3. Therefore, the heat transport device 100 can eliminate the shortage of the fluid F in the heat exchanger 1.

[0068] On the other hand, in the fluid supply device 2, when the cooling of the cooling member 22 is performed, the fluid F in the fluid tank 21 is depressurized by the volume contraction accompanying the temperature drop. On the other hand, when the fluid F in the heat exchanger 1 is not insufficient, the pressure drop of the fluid F will not occur in the heat exchanger 1. In this case, in the fluid supply device 2, for example, the solenoid valve 221 is switched to an open state, and the cooling of the cooling member 22 is performed, and the temperature of the fluid F in the fluid tank 21 is reduced by cooling. According to this, the fluid F in the fluid tank 21 is difficult to be supplied to the heat exchanger 1. That is, by making the pressure of the fluid F in the heat exchanger 1 higher than the pressure of the fluid F in the fluid tank 21, the fluid F in the fluid tank 21 is not naturally supplied to the heat exchanger 1. In addition, according to the increase in the pressure of the fluid F in the heat exchanger 1 relative to the pressure of the fluid F in the fluid tank 21, the fluid F in the heat exchanger 1 is sent out of the fluid tank 21 of the fluid supply device 2. According to this, it is possible to prevent: excessive pressure increase of the fluid F in the heat exchanger 1.

[0069] Preferably, the implementation and stop of cooling the fluid F in the fluid supply device 2 are switched based on the detection result of the sensor 13. For example, the cooling of the fluid F in the fluid supply device 2 is stopped when the sensor 13 detects the overheating of the fluid F. That is, when the control device 200 detects the overheating of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, the electromagnetic valve 221 is closed to stop the cooling of the fluid F in the fluid tank 21 by the cooling member 22. In this way, the fluid F is supplied to the heat exchanger 1 from the fluid tank 21 via the supply flow path 3. In addition, when the overheating of the fluid F is not detected based on the detection result of the sensor 13, the cooling of the fluid F in the fluid supply device 2 is implemented. In this way, when the overheating of the fluid F in the circulation flow path 11 is detected, the fluid F can be supplied from the fluid supply device 2 to the heat exchanger 1. Therefore, the shortage of the fluid F in the circulation flow path 11 of the heat exchanger 1 can be eliminated more reliably and quickly, and the excessively heated fluid F can be cooled down. However, the present invention is not limited to this example, and the cooling and stopping of the fluid F in the fluid supply device 2 may be switched manually.

[0070] In addition, in the supply mechanism of the fluid F as described above, the solenoid valve 221 is in an open state during normal operation (i.e., when the fluid F in the heat exchanger 1 is not insufficient), and is in a closed state when the fluid F in the heat exchanger 1 is insufficient. Therefore, the solenoid valve 221 is preferably a normally open type. In this case, since the solenoid valve 221 can be switched only when the fluid F in the heat exchanger 1 is insufficient, the power consumption of the solenoid valve 221 can be reduced. However, this illustration does not exclude the configuration that the solenoid valve 221 is not a normally open type.

[0071] In addition, in order to realize the supply mechanism of the fluid F as described above, the fluid tank 21 of the fluid supply device 2 is set on the heat source H2 and is heated. Therefore, the heat source H2 may also be: a heating body provided for heating the fluid F in the fluid tank 21. However, the above example does not exclude the configuration in which the fluid tank 21 of the fluid supply device 2 is not set on the heat source H2. That is, the fluid F in the fluid tank 21 may not be heated. Even in this case, for example, by setting the cooling capacity of the cooling part 22 to be higher, the supply mechanism of the fluid F as described above can be realized by utilizing the pressure increase and decrease corresponding to the temperature difference between the cooling performed by the cooling part 22 of the fluid F and the cooling stop.

[0072] <1-4. Supply flow path 3>

[0073] Next, refer to Figures 1 to 6 , the supply flow path 3 is described in detail. Figure 6 It is a schematic diagram showing another configuration example of the heat transport device according to the first embodiment.

[0074] The supply flow path 3 connects the fluid box 21 of the fluid supplier 2 and the circulation flow path 11 of the heat exchanger 1. For example, the fluid supplier 2 has a port 23. The port 23 is an example of the "first flow port" of the present invention, which is a pipe connection port that enables the inflow and outflow of the fluid F relative to the fluid box 21, and is arranged in the fluid box 21. In addition, the circulation flow path 11 of the heat exchanger 1 has a port 115. The port 115 is an example of the "second flow port" of the present invention, which is a pipe connection port that enables the inflow and outflow of the fluid F relative to the circulation flow path 11, and is preferably arranged in the inflow flow path 113. One end of the supply flow path 3 is connected to the port 23 of the fluid supplier 2. The other end of the supply flow path 3 is connected to the port 115 of the heat exchanger 1.

[0075] Preferably, in the vertical direction Z, the height position of the port 23 of the fluid supplier 2 is the same as the height position of the port 115 of the heat exchanger 1. In this way, the pressure of the fluid F at the port 23 (in other words, one end of the supply flow path 3) can be made the same as the pressure of the fluid F at the port 115 (in other words, the other end of the supply flow path 3). Therefore, the pressure difference of the fluid F between the two can be eliminated. Accordingly, the fluid F can flow smoothly between the heat exchanger 1 and the fluid supplier 2 without being affected by the pressure difference. However, this example does not exclude a configuration in which the height position of the port 23 is different from the height position of the port 115 in the vertical direction Z.

[0076] Preferably, in the vertical direction Z, the height position of one end and the other end of at least one connecting flow path 4 is the same as the height position of the port 115 of the heat exchanger 1. More preferably, the height position of one end and the other end of all connecting flow paths 4 is the same as the height position of the port 115 of the heat exchanger 1. In this way, the pressure of the fluid F at one end and the other end of the supply flow path 3 can be made the same as the pressure of the fluid F at one end and the other end of the connecting flow path 4. Therefore, the pressure difference of the fluid F between the two can be eliminated. Accordingly, the fluid F can flow smoothly between the heat exchanger 1 and the fluid supplier 2, and in the connecting flow path 4 without being affected by the pressure difference. However, this example does not exclude the configuration in which the height position of the port 115 of the heat exchanger 1 is different from the height position of one end and the other end of all connecting flow paths 4.

[0077] In addition, if Figure 1 As shown in FIG. 1 and FIG. 2 , in detail, the other end of the supply flow path 3 is connected to (the port 115 of) the circulation flow path 11 of at least one heat exchanger 1 .

[0078] For example, the other end of the supply flow path 3 is connected to (the port 115 of) the circulation flow path 11 of a specific heat exchanger 1a. In addition, the number of specific heat exchangers 1a may be one or more than two. In the latter case, a branch flow path 31 is connected to (the port 115 of) the circulation flow path 11 of each specific heat exchanger 1a. In addition, the branch flow path 31 is a hollow pipe that branches at the other end side of the supply flow path 3.

[0079] For example, the specific heat exchanger 1a is a part of the heat exchangers 1 among the plurality of heat exchangers 1, for example, a heat exchanger 1 disposed in a portion of the exhaust duct H1 where the internal temperature is above a predetermined upper limit temperature Tu. The upper limit temperature Tu is set to a temperature at which the fluid F in the heat absorption flow path 111 is excessively vaporized, for example, higher than the aforementioned lower limit temperature Td for the fluid F in the fluid box 21. Alternatively, the specific heat exchanger 1a (that is, the part of the heat exchangers 1 described above) may be disposed at a position closer to the upstream side of the exhaust duct H1 than the remaining heat exchangers 1.

[0080] When the spatial temperature distribution in the exhaust duct H1 is unlikely to change, more fluid F is easily distributed to the heat exchanger 1 having the heat absorption flow path 111 arranged in a portion having a higher temperature than other portions. In particular, more fluid F is distributed to the heat exchanger 1a arranged in a portion where the internal temperature of the exhaust duct H1 is higher than the upper limit temperature Tu. As a result, a shortage of fluid F is likely to occur in heat exchangers 1 other than the specific heat exchanger 1a. Therefore, the supply flow path 3 is connected to the circulation flow path 11 of the specific heat exchanger 1a, and the fluid F is reliably supplied from the fluid supplier 2 to the specific heat exchanger 1a, thereby reducing the fluid F distributed to the specific heat exchanger 1a. Accordingly, since the imbalance of the fluid F distributed to each heat exchanger 1 can be reduced, the shortage of fluid F in the heat exchangers 1 other than the specific heat exchanger 1a can be suppressed or prevented.

[0081] Or, if Figure 6 As shown, the other end of the supply flow path 3 can also be connected to the circulation flow path 11 (port 115) of each heat exchanger 1. In this way, when the fluid F is insufficient in the heat exchanger 1, the fluid F can be supplied from the fluid tank 21 to each heat exchanger 1. In addition, the amount of fluid F corresponding to the difference between the pressure of the fluid F in the heat exchanger and the pressure of the fluid F in the fluid tank 21 is supplied to each heat exchanger 1. Thus, for example, in the heat exchanger 1 where the fluid F is insufficient due to excessive temperature rise, the greater the insufficient amount, the more fluid F will be supplied. In addition, in the heat exchanger 1 where the fluid F is not insufficient, the supply amount of fluid F will be less, or fluid F will not be supplied.

[0082] In addition, a solenoid valve 32 controlled by the control device 200 may be arranged in the supply flow path 3. In detail, the heat transport device 100 may further include a solenoid valve 32 for switching the opening and closing of the supply flow path 3. The solenoid valve 32 may be arranged at one end side of the supply flow path 3 (that is, the fluid supplier 2 side), or at the other end side of the supply flow path 3 (for example, each branch flow path 31).

[0083] Preferably, the electromagnetic valve 32 switches the open and closed state of the supply flow path 3 by the control device 200 according to the detection result of the sensor 13. For example, the electromagnetic valve 32 switches the supply flow path 3 to an open state according to the overheating of the fluid F detected by the sensor 13. That is, when the control device 200 monitors the overheating of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, the electromagnetic valve 32 is opened to enable the circulation of the supply flow path 3. In this way, when the overheating of the fluid F in the circulation flow path 11 is detected, the fluid F can be supplied from the fluid supplier 2 to the heat exchanger 1. However, the present invention is not limited to this example, and the open and closed state of the electromagnetic valve 32 can also be switched by manual operation.

[0084] In addition, in the configuration in which the supply flow path 3 is provided with the electromagnetic valve 32, the fluid supplier 2 may or may not include the cooling member 22. In particular, in the latter case, by switching the open and closed state of the electromagnetic valve 32, the supply and stop of the fluid F from the fluid tank 21 to the heat exchanger 1 can be switched.

[0085] However, the above-mentioned examples do not exclude a configuration in which the solenoid valve 32 is not disposed in the supply flow path 3 .

[0086] <2. Second Embodiment>

[0087] Next, refer to Figure 7 , describing the second implementation method. Figure 7 1 is a diagram showing a configuration example of a heat transport device 100 according to the second embodiment. The configuration of the second embodiment that is different from the first embodiment will be described below. The same reference numerals are used for the same components as those of the first embodiment, and description thereof will be omitted.

[0088] In the heat transport device 100 according to the second embodiment, at least one heat exchanger 1 further includes a secondary cooler 14. The secondary cooler 14 is an example of the "second cooler" of the present invention, and is disposed between the heat absorption flow path 111 and the heat dissipation flow path 112 in the circulation flow path 11, and cools the fluid F in the circulation flow path 11. The secondary cooler 14 can supplement the cooling capacity of the cooler 12, and can further cool the fluid F in the flow path between the heat absorption flow path 111 and the heat dissipation flow path 112. Therefore, the heat exchanger 1 can sufficiently cool the fluid F sent out from the heat absorption flow path 111, and can make the sufficiently cooled fluid F flow into the heat absorption flow path 111. Accordingly, the excessive temperature rise (in other words, vaporization) of the fluid F in the heat absorption flow path 111 can be effectively suppressed or prevented, thereby preventing the shortage of the fluid F in the circulation flow path 11.

[0089] Preferably, the secondary cooler 14 is disposed in the inflow passage 113 to cool the fluid F in the inflow passage 113. Figure 7 In all the heat exchangers 1 , the secondary cooler 14 is disposed in the inflow passage 113 . However, the present invention is not limited to this example, and the secondary cooler 14 may be disposed in the outflow passage 114 in at least one heat exchanger 1 to cool the fluid F in the outflow passage 114 .

[0090] The secondary cooler 14 has: a shell 140 and a refrigerant flow path 141. In the present embodiment, the refrigerant flow path 141 is: an empty pipe for one-way circulation of the refrigerant, and is arranged in the shell 140. The inlet and outlet of the refrigerant flow path 141 are respectively arranged on the outer surface of the shell 140, and are connected to a circulation device (pump, etc.; not shown in the figure) that circulates the refrigerant. In addition, the liquid or gaseous refrigerant sent out from the outlet of the refrigerant flow path 141 can also be sent to the circulation device after the waste heat is utilized. For example, the liquid refrigerant can be used for hot water supply, hot and cold heating, etc. In addition, the gaseous refrigerant can be used for power generation in power generation equipment such as gas turbines.

[0091] In addition, the cooling of the secondary cooler 14 can be switched on and off. Figure 7 As shown, a solenoid valve 142 is provided in the refrigerant flow path 141. The solenoid valve 142 is controlled by the control device 200 to control the opening and closing of the refrigerant flow path 141. The solenoid valve 142 is a normally open type, and in normal operation, the refrigerant flow path 141 is opened to allow the refrigerant to flow.

[0092] Preferably, the control device 200 switches the implementation and stop of cooling the fluid F by the secondary cooler 14 based on the detection result of the sensor 13. For example, the secondary cooler 14 is used to further cool the fluid F in the circulation flow path 11 based on the detection result of the sensor 13 of the superheat of the fluid F. That is, when the control device 200 detects the superheat of the fluid F in the heat exchanger 1 based on the detection result of the sensor 13, the electromagnetic valve 142 arranged in the secondary cooler 14 of the heat exchanger 1 that has detected the superheat is opened, and the refrigerant in the refrigerant flow path 141 of the secondary cooler 14 is circulated. In this way, when the superheat of the fluid F in the circulation flow path 11 is detected, the secondary cooler 14 of the heat exchanger 1 that has detected the superheat can be operated. Therefore, it is possible to more reliably prevent the excessive temperature rise (in other words, gasification) of the fluid F and the shortage of the fluid F in the circulation flow path 11. However, the present invention is not limited to the above-described example, and in at least one heat exchanger 1 , the open / closed state of the electromagnetic valve 142 may be switched by manual operation.

[0093] However, the above-described example does not exclude the case where the cooling of the secondary cooler 14 cannot be switched between on and off in at least one heat exchanger 1 , nor does it exclude the case where the solenoid valve 142 is not provided in the refrigerant flow path 141 in at least one heat exchanger 1 .

[0094] <3. Third embodiment>

[0095] Next, refer to Figure 8 , describing the third implementation method. Figure 81 is a diagram showing a configuration example of a heat transport device 100 according to the third embodiment. The configuration of the third embodiment that is different from the first and second embodiments will be described below. The same reference numerals are used for the same components as those of the first and second embodiments, and description thereof will be omitted.

[0096] In the heat transport device 100 according to the third embodiment, a part of the heat exchangers 1 is used as a fluid supplier 2 and is connected to the remaining heat exchangers 1 via a supply flow path 3. In other words, the plurality of heat exchangers 1 include a heat exchanger 1b and a heat exchanger 1c. The heat exchanger 1b is an example of the "first heat exchanger" of the present invention. The heat exchanger 1c is an example of the "second heat exchanger" of the present invention.

[0097] For example, in the third embodiment, the heat exchanger 1b is a heat exchanger 1 that functions as a fluid supplier 2 for supplying the fluid F to the heat exchanger 1c. The heat exchanger 1b is used in the same manner as the fluid supplier 2. The number of heat exchangers 1b may be as follows: Figure 8 It may be one, or two or more.

[0098] The heat exchanger 1c is the remaining heat exchanger 1, that is, the heat exchanger other than the heat exchanger 1b among the plurality of heat exchangers 1. One end of the supply flow path 3 is connected to the circulation flow path 11 of the heat exchanger 1b. The other end of the supply flow path 3 (or the branch flow path 31) is connected to the circulation flow path 11 of the heat exchanger 1c.

[0099] In this case, it is not necessary to use a device different from the heat exchanger 1 as the fluid supplier 2. In other words, a device of the same type as the heat exchanger 1 can be used as the fluid supplier 2. Therefore, since the fluid supplier 2 is not newly manufactured, the number of types of components of the heat transport device 100 can be reduced, thereby reducing the manufacturing cost of the heat transport device 100.

[0100] <4. Fourth embodiment>

[0101] Next, refer to Fig. 9 , describing the fourth implementation method. Fig. 9 1 is a diagram showing a configuration example of a heat transport device 100 according to a fourth embodiment. The configuration of the fourth embodiment that is different from the first to third embodiments will be described below. The same reference numerals are used for the same components as those of the first to third embodiments, and their description may be omitted.

[0102] In the heat transport device 100 according to the fourth embodiment, a part of the heat exchangers 1d among the plurality of heat exchangers 1 connected to each other through the connecting flow path 4 through the circulation flow path 11 functions as a fluid supplier 2 for supplying the fluid F to the remaining heat exchangers 1e. Fig. 9 In the embodiment, all the heat exchangers 1 are arranged in the exhaust duct H1. Among these heat exchangers 1, the heat exchanger 1d arranged in the portion of the exhaust duct H1 where the internal temperature is lower than the lower limit temperature Td functions as a fluid supplier 2. In addition, at least a part of the connecting flow path 4 functions as a supply flow path 3 through which the fluid F supplied from the heat exchanger 1d to the heat exchanger 1e passes. In other words, the supply flow path 3 is omitted.

[0103] The plurality of heat exchangers 1 are connected by the connecting flow path 4, so that the distribution of the fluid F between the plurality of heat exchangers 1 is naturally adjusted. For example, when there is a spatial temperature distribution in the exhaust duct H1, the distribution amount of the fluid F distributed to the heat exchanger 1d arranged in the low temperature portion of the exhaust duct H1 (for example, the portion below the lower limit temperature Td) will be reduced. On the other hand, the distribution amount of the fluid F distributed to the heat exchanger 1e arranged in the high temperature portion of the exhaust duct H1 (for example, the portion with a temperature higher than the lower limit temperature Td) will be increased. In addition, since at least a part of the connecting flow path 4 functions as the supply flow path 3, a component separate from the connecting flow path 4 does not need to be used as the supply flow path 3. Therefore, the heat transport device 100 does not need to have a specific fluid supplier 2 and supply flow path 3, and can suppress or prevent the situation where the heat transport efficiency is reduced due to the unevenness of the fluid F.

[0104] <5. Remarks>

[0105] The embodiments of the present invention have been described above. The above embodiments are merely examples, and various modifications may be made to the combinations of the components and processes, which should be understood by those skilled in the art to be within the scope of the present invention.

[0106] <6. Summary>

[0107] The following is a summary of the embodiments described so far.

[0108] For example, the heat transfer device 100 disclosed in the present specification may also be configured as follows (first configuration), comprising: a heat exchanger 1, a fluid supplier 2, and a supply flow path 3, wherein the heat exchanger 1 has: a circulation flow path 11 capable of circulating a fluid F, and a first cooler 12 for cooling the fluid F, the circulation flow path 11 including: a heat absorption flow path 111 arranged in a first heat source H1, and a heat dissipation flow path 112 arranged in the first cooler 12, and the supply flow path 3 connects the circulation flow path 11 with the fluid supplier 2.

[0109] The heat transport device 100 of the first structure may be configured as follows (second structure), further comprising: a connecting flow path 4 through which the fluid F can flow, wherein there are a plurality of heat exchangers 1, and the connecting flow path 4 connects the circulation flow paths 11 of the respective heat exchangers 1.

[0110] In addition, the heat transport device 100 of the above-mentioned second structure can also be constructed as follows (third structure), wherein the circulation flow path 11 also includes: an inlet flow path 113 connecting the inlet of the heat absorption flow path 111 with the outlet of the heat dissipation flow path 112, and the connecting flow path 4 connects the inlet flow paths 113 of each of the heat exchangers 1.

[0111] In addition, the heat transfer device 100 of the second or third structure mentioned above can also be constructed as follows (the fourth structure), wherein the supply flow path 3 is connected to the circulation flow path 11 of a part of the heat exchangers 1a among the multiple heat exchangers 1, and a part of the heat exchangers 1a are arranged at a position closer to the upstream side of the first heat source H1 than the remaining heat exchangers 1.

[0112] In addition, the heat transport device 100 of any of the above-mentioned second to fourth structures can also be configured as follows (fifth structure), wherein the multiple heat exchangers 1 include: a first heat exchanger 1b acting as the fluid supplier 2, and the remaining part of the heat exchanger 1, namely, the second heat exchanger 1c, one end of the supply flow path 3 is connected to the circulation flow path 11 of the first heat exchanger 1b, and the other end of the supply flow path 3 is connected to the circulation flow path 11 of the second heat exchanger 1c.

[0113] In addition, the heat transfer device 100 of any of the above-mentioned second to fourth structures can also be constructed as follows (the sixth structure): a part of the heat exchangers 1d among the multiple heat exchangers 1 acts as the fluid supplier 2 relative to the remaining heat exchangers 1e, and at least a part of the connecting flow path 4 acts as the supply flow path 3.

[0114] In addition, the heat transport device 100 of any of the above-mentioned structures 1 to 6 can also be configured as follows (structure 7), wherein the fluid supplier 2 has: a first flow port 23 connected to one end of the supply flow path 3, and the circulation flow path 11 also has: a second flow port 115 connected to the other end of the supply flow path 3, and in the vertical direction Z, the height position of the first flow port 23 is the same as the height position of the second flow port 115.

[0115] In addition, the heat transfer device 100 of any of the above-mentioned structures 1 to 7 can also be configured as follows (structure 8), wherein the fluid supplier 2 has: a receiving portion 21 for receiving the fluid F that can be supplied to the heat exchanger 1, and a cooling component 22 for cooling the fluid F in the receiving portion 21, and the cooling of the cooling component 22 can be switched between implementation and stop.

[0116] In addition, the heat transfer device 100 of any of the above-mentioned structures 1 to 8 can also be configured as follows (structure 9), wherein the heat exchanger 1 also has: a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11, and the cooling of the fluid F in the fluid supplier 2 is stopped based on the overheating of the fluid F detected by the sensor 13.

[0117] In addition, the heat transport device 100 of any of the above-mentioned structures 1 to 9 can also be configured as follows (structure 10), and further comprises: an electromagnetic valve 32 for switching the opening and closing of the supply flow path 3, and the heat exchanger 1 further comprises: a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11, and the electromagnetic valve 32 switches the supply flow path 3 to an open state according to the overheating of the fluid F detected by the sensor 13.

[0118] Furthermore, the heat transport device 100 of any of the first to tenth structures may be configured as follows (eleventh structure), wherein the fluid supplier 2 is provided at a second heat source H2 different from the first heat source H1.

[0119] In addition, the heat transport device 100 of any of the first to tenth structures may be configured as follows (twelfth structure), wherein the fluid supplier 2 is provided at a portion (eg, portion H1b) of the first heat source H1 where the internal temperature is lower than a predetermined temperature Td.

[0120] In addition, the heat transport device 100 of any of the above-mentioned first to twelfth structures can also be configured as follows (thirteenth structure), in the heat exchanger 1, the inlet and outlet of the heat dissipation flow path 112 are arranged at a position Z1 higher than the inlet of the heat absorption flow path 111.

[0121] In addition, the heat transfer device 100 of any of the above-mentioned structures 1 to 13 can also be configured as follows (structure 14), wherein the heat exchanger 1 also has a second cooler 14, and the second cooler 14 is arranged between the heat absorption flow path 111 and the heat dissipation flow path 112 in the circulation flow path 11, and cools the fluid F in the circulation flow path 11.

[0122] In addition, the heat transfer device 100 of the above-mentioned 14th structure can also be configured as follows (15th structure), and the heat exchanger 1 also has: a sensor 13 for detecting overheating of the fluid F in the circulation flow path 11, which can switch the implementation and stop of the cooling of the second cooler 14, and use the second cooler 14 to further cool the fluid F in the circulation flow path 11 based on the overheating of the fluid F detected by the sensor 13.

Claims

1. A heat transport device, characterized in that: The heat transport device comprises: a heat exchanger, a fluid supplier, and a supply flow path. The heat exchanger includes: a circulation flow path through which a fluid can circulate, and a first cooler for cooling the fluid. The circulation flow path includes: a heat absorbing flow path arranged in the first heat source, and a heat dissipating flow path arranged in the first cooler. The supply flow path connects the circulation flow path and the fluid supplier.

2. The heat transport device according to claim 1, characterized in that The heat transport device further comprises: a connecting flow path through which the fluid can flow, There are multiple heat exchangers. The connecting flow path connects the circulation flow paths of the respective heat exchangers.

3. The heat transport device according to claim 2, characterized in that The circulation flow path further includes: an inflow flow path connecting the inlet of the heat absorption flow path and the outlet of the heat dissipation flow path, The connecting flow path connects the inlet flow paths of the respective heat exchangers.

4. The heat transport device according to claim 2, characterized in that The supply flow path is connected to the circulation flow paths of some of the heat exchangers among the plurality of heat exchangers. A part of the heat exchangers is arranged at a position closer to the upstream side of the first heat source than the remaining heat exchangers.

5. The heat transport device according to claim 2, characterized in that The plurality of heat exchangers include a first heat exchanger functioning as the fluid supplier and a second heat exchanger which is the remaining heat exchanger. One end of the supply flow path is connected to the circulation flow path of the first heat exchanger, and the other end of the supply flow path is connected to the circulation flow path of the second heat exchanger.

6. The heat transport device according to claim 2, characterized in that Some of the heat exchangers among the plurality of heat exchangers function as the fluid supplier relative to the remaining heat exchangers. At least a portion of the connecting flow path functions as the supply flow path.

7. The heat transport device according to any one of claims 1 to 6, characterized in that: The fluid supply device comprises: a first flow port connected to one end of the supply flow path; The circulation flow path further comprises: a second flow port connected to the other end of the supply flow path, In the vertical direction, the height position of the first flow port is the same as the height position of the second flow port.

8. The heat transport device according to any one of claims 1 to 6, characterized in that: The fluid supplier includes: a housing portion for housing the fluid that can be supplied to the heat exchanger, and a cooling member for cooling the fluid in the housing portion. The cooling of the cooling member can be switched between execution and stop.

9. The heat transport device according to any one of claims 1 to 6, characterized in that: The heat exchanger further includes: a sensor for detecting overheating of the fluid in the circulation flow path; Cooling of the fluid in the fluid supplier is stopped in response to the sensor detecting overheating of the fluid.

10. The heat transport device according to any one of claims 1 to 6, characterized in that: The heat transport device further includes: a solenoid valve for switching the opening and closing of the supply flow path; The heat exchanger further includes: a sensor for detecting overheating of the fluid in the circulation flow path; The solenoid valve switches the supply flow path to an open state in response to the sensor detecting overheating of the fluid.

11. The heat transport device according to any one of claims 1 to 6, characterized in that: The fluid supplier is provided at a second heat source different from the first heat source.

12. The heat transport device according to any one of claims 1 to 6, characterized in that: The fluid supplier is provided at a portion of the first heat source where the internal temperature is lower than or equal to a predetermined temperature.

13. The heat transport device according to any one of claims 1 to 6, characterized in that: In the heat exchanger, the inlet and the outlet of the heat dissipation flow path are arranged above the inlet of the heat absorption flow path.

14. The heat transport device according to any one of claims 1 to 6, characterized in that The heat exchanger further comprises a second cooler, The second cooler is disposed between the heat absorbing flow path and the heat radiating flow path in the circulation flow path, and cools the fluid in the circulation flow path.

15. The heat transport device according to claim 14, characterized in that The heat exchanger further includes: a sensor for detecting overheating of the fluid in the circulation flow path; The cooling of the second cooler can be switched on and off. The fluid in the circulation flow path is further cooled by the second cooler in response to the sensor detecting the overheating of the fluid.

Images