Hyperspectral imaging method, electronic equipment, hyperspectral imager and readable medium

Abstract

The invention discloses a hyperspectral imaging method based on a hyperspectral imaging module, electronic equipment, a hyperspectral imager and a computer readable medium, the hyperspectral imaging module comprises a light source, an optical imaging system, a spectrum chip and a photoelectric detector, and the spectrum chip comprises a plurality of spectrum resolving units. The spectrum resolving unit comprises a plurality of cascaded active tunable spectrum units and phase modulators arranged on the active tunable spectrum units; determining a phase modulation parameter for each phase modulator according to a preset spectral solution mode; respectively sending each phase modulation parameter to a corresponding phase modulator; sending a driving signal to the light source; and according to the electric signal sent by the photoelectric detector and a preset spectral resolving mode, resolving to obtain hyperspectral imaging data. The cost and the size of the hyperspectral imager can be reduced, the resolution of the hyperspectral imager can be improved, the calculated amount of the hyperspectral imager is reduced, and the real-time performance of data processing is improved.

Description

Technical Field

[0001] The present application relates to the technical field of hyperspectral imagers, and in particular to a hyperspectral imaging method, electronic equipment, a hyperspectral imager and a computer-readable medium based on a hyperspectral imaging module. Background Art

[0002] A hyperspectral imager is an analytical instrument that combines imaging technology with spectral technology to detect the two-dimensional geometric space and one-dimensional spectral information of a target. The traditional hyperspectral imager is limited in its application in certain fields due to its large size. The emergence of miniaturized hyperspectral imagers allows it to be more widely used in agriculture, environmental monitoring, geological exploration, medicine, food safety, natural disaster prediction and other fields, and is even expected to enter daily production such as smart phones and IoT devices, thus bringing richer applications and smarter functions.

[0003] However, the existing miniaturized hyperspectral imagers still have many problems such as high cost, low resolution, large amount of calculation, and low real-time data processing. Summary of the invention

[0004] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides a hyperspectral imaging method, an electronic device, a hyperspectral imager and a computer-readable medium based on a hyperspectral imaging module.

[0005] As a first aspect of the present application, a hyperspectral imaging method based on a hyperspectral imaging module is provided, wherein the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution unit includes a plurality of cascaded active tunable spectral units and a phase modulator arranged on each of the active tunable spectral units; the method includes:

[0006] Determining phase modulation parameters for each phase modulator according to a preset spectrum solving method;

[0007] Sending each of the phase modulation parameters to the corresponding phase modulator respectively;

[0008] Sending a driving signal to the light source so that the light source outputs an initial light signal, the optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by an object into each of the spectrum resolution units in the spectrum chip, each of the phase modulators performs phase modulation on the reflected light signal passing through the active tunable spectrum unit where it is located according to a corresponding phase modulation parameter to obtain a modulated light signal which is input into the photoelectric detector, and the photoelectric detector performs photoelectric conversion on the modulated light signal to obtain an electrical signal;

[0009] Hyperspectral imaging data is obtained by calculating the electrical signal sent by the photoelectric detector and the preset spectral calculation method.

[0010] Optionally, the preset spectral solution method includes any one of the following: a convolution spectral solution method, a computational reconstruction spectral solution method, and a Fourier spectral solution method.

[0011] Optionally, the multiple active tunable spectrum units in the spectrum solving unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer MZI.

[0012] Optionally, the hyperspectral imaging module further includes a grating connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in a grating coupling manner through the grating.

[0013] Optionally, the hyperspectral imaging module also includes a fiber optic array connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in an end-face coupling manner through the fiber optic array.

[0014] Optionally, the hyperspectral imaging module further includes a semiconductor optical amplifier SOA arranged at the input end or the output end of each of the spectral resolution units.

[0015] Optionally, the light source includes any one of the following:

[0016] Super luminescent diode SLD, light emitting diode LED, semiconductor optical amplifier SOA.

[0017] As a second aspect of the present application, an electronic device is provided, wherein the electronic device includes:

[0018] one or more processors;

[0019] A memory having one or more computer programs stored thereon, wherein when the one or more computer programs are executed by the one or more processors, the one or more processors implement the hyperspectral imaging method based on the hyperspectral imaging module described in the first aspect of the present application.

[0020] As a third aspect of the present application, a hyperspectral imager is provided, wherein the hyperspectral imager comprises a hyperspectral imaging module and the electronic device described in the second aspect of the present application, the hyperspectral imaging module comprises a light source, an optical imaging system, a spectral chip and a photodetector, the spectral chip comprises a plurality of spectral resolution units, the spectral resolution unit comprises a plurality of cascaded active tunable spectral units and a phase modulator arranged on each of the active tunable spectral units;

[0021] The electronic device is used to determine the phase modulation parameters for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator respectively; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method;

[0022] The light source is used to output an initial light signal;

[0023] The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip;

[0024] The phase modulator is used to phase modulate the reflected light signal passing through the active tunable spectrum unit where the phase modulator is located according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector;

[0025] The photodetector is used to perform photoelectric conversion on the modulated light signal to obtain the electrical signal.

[0026] As a fourth aspect of the present application, a computer-readable medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module described in the first aspect of the present application is implemented.

[0027] In the hyperspectral imaging method based on the hyperspectral imaging module provided in the present application, on the basis of the on-chip spectrometer module including a light source, a spectral chip and a photodetector, an optical imaging system is set between the light source and the spectral chip, and the spectral chip is designed to include a plurality of spectral resolution units, and each spectral resolution unit is designed to include a plurality of cascaded active tunable spectral units and a phase modulator arranged on each active tunable spectral unit, so as to obtain a hyperspectral imaging module. According to the preset spectral resolution method, the phase modulation parameters are determined for each phase modulator, and each phase modulation parameter is sent to the corresponding phase modulator respectively, and a driving signal is sent to the light source, so that the optical imaging system can couple the reflected light of the object into the spectral chip, and each spectral resolution unit in the spectral chip can be used as a "spectral processing unit" of the hyperspectral imaging module to process the reflected light of the object. Finally, the circuit module performs resolution according to the electrical signal fed back by the photodetector and the preset spectral resolution method, so as to obtain the hyperspectral imaging data. It can not only reduce the cost of hyperspectral imagers and further reduce the size of hyperspectral imagers, but also improve the resolution of hyperspectral imagers, reduce the amount of calculation of hyperspectral imagers, and improve the real-time performance of data processing of hyperspectral imagers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present application is further described below in conjunction with the accompanying drawings:

[0029] Figure 1 It is a flowchart of an implementation method of a hyperspectral imaging method based on a hyperspectral imaging module provided in an embodiment of the present application;

[0030] Figure 2 It is a schematic diagram of an implementation method of the signal transmission process in the hyperspectral imager provided in the embodiment of the present application;

[0031] Figure 3 is a schematic diagram of a spectrum solving unit provided in an embodiment of the present application;

[0032] Figure 4 is a schematic diagram of an implementation of a spectrum solving unit provided in an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of another implementation of the spectrum solving unit provided in the embodiment of the present application;

[0034] Figure 6 is a schematic diagram of another implementation of the spectrum solving unit provided in the embodiment of the present application;

[0035] Figure 7 It is a schematic diagram of an implementation method of coupling a reflected light signal grating into a spectral chip provided in an embodiment of the present application;

[0036] Figure 8 It is a schematic diagram of an implementation method of coupling the end face of the reflected light signal into the spectrum chip provided in the embodiment of the present application;

[0037] Fig. 9 is a schematic diagram of an implementation of a spectral chip provided in an embodiment of the present application;

[0038] Fig.10 is a schematic diagram of an implementation method of coupling a modulated optical signal into a photodetector provided in an embodiment of the present application;

[0039] Fig.11 is a schematic diagram of another implementation of coupling a modulated optical signal into a photodetector provided in an embodiment of the present application;

[0040] Fig.12 It is a module diagram of an implementation of an electronic device provided in an embodiment of the present application;

[0041] Fig.13 It is a schematic diagram of a computer-readable medium provided in an embodiment of the present application.

[0042] Description of Reference Numerals

[0043] 101: Processor 102: Memory

[0044] 103: I / O interface 104: bus DETAILED DESCRIPTION

[0045] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments based on the embodiments are intended to be used to explain the present application and cannot be understood as limiting the present application.

[0046] References to "one embodiment" or "an example" or "an example" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0047] A hyperspectral imager is an analytical instrument that combines imaging technology with spectral technology to detect the two-dimensional geometric space and one-dimensional spectral information of a target. The traditional hyperspectral imager is limited in its application in certain fields due to its large size. The emergence of miniaturized hyperspectral imagers allows it to be more widely used in agriculture, environmental monitoring, geological exploration, medicine, food safety, natural disaster prediction and other fields, and is even expected to enter daily production such as smart phones and IoT devices, thus bringing richer applications and smarter functions.

[0048] However, the existing miniaturized hyperspectral imagers still have many problems such as high cost, low resolution, large amount of calculation, and low real-time data processing.

[0049] In this regard, the applicant of this application proposed after research that most of the current miniaturized hyperspectral imagers rely on complementary metal oxide semiconductor cameras or charge coupled device cameras, and add various filters with specific transmission responses in front of the sensor to obtain spectral information. However, the cost of near-infrared complementary metal oxide semiconductor cameras or charge coupled device cameras is high, resulting in high costs for hyperspectral imagers. In addition, relying solely on filters also results in limited performance of hyperspectral imagers, low resolution, large amount of calculation, and low real-time data processing.

[0050] Based on this discovery, the applicant of this application proposes that it is possible to consider making full use of the advantages of on-chip spectrometers, such as ultra-high resolution, real-time data processing, extremely low computational complexity, small size, and low cost, to design a miniaturized hyperspectral imager, which will not only help reduce the cost of the hyperspectral imager and further reduce the size of the hyperspectral imager, but also help improve the performance of the hyperspectral imager.

[0051] The applicant of the present application further proposes that, based on an on-chip spectrometer module including a light source, a spectral chip and a photodetector, an optical imaging system is set between the light source and the spectral chip, and the spectral chip is designed to include multiple spectral resolution units, and each spectral resolution unit is designed to include multiple cascaded active tunable spectral units and a phase modulator set on each active tunable spectral unit, so as to obtain a hyperspectral imaging module. In this way, the optical imaging system can couple the reflected light of the object into the spectral chip, and each spectral resolution unit in the spectral chip can process the reflected light of the object as a "spectral processing unit" of the hyperspectral imaging module. Finally, the hyperspectral imaging function can be realized by performing high-speed analysis and reconstruction.

[0052] As a first aspect of an embodiment of the present application, a hyperspectral imaging method based on a hyperspectral imaging module is provided, wherein the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution unit includes a plurality of cascaded active tunable spectral units and a phase modulator arranged on each of the active tunable spectral units; Figure 1 As shown, the method may include:

[0053] In step S110, a phase modulation parameter is determined for each phase modulator according to a preset spectrum solving method;

[0054] In step S120, each of the phase modulation parameters is sent to the corresponding phase modulator respectively;

[0055] In step S130, a driving signal is sent to the light source so that the light source outputs an initial light signal, the optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum resolution units in the spectrum chip, each of the phase modulators performs phase modulation on the reflected light signal passing through the active tunable spectrum unit in which it is located according to a corresponding phase modulation parameter to obtain a modulated light signal which is input to the photodetector, and the photodetector performs photoelectric conversion on the modulated light signal to obtain an electrical signal;

[0056] In step S140, hyperspectral imaging data is obtained by calculating according to the electrical signal sent by the photodetector and the preset spectral calculation method.

[0057] The embodiment of the present application does not impose any special limitation on the data format of the hyperspectral imaging data. For example, the data may include hyperspectral image data, spectral curves, and related physical parameters.

[0058] Among them, the hyperspectral imaging method provided in the embodiment of the present application can be executed by a circuit module (or an electronic device including a circuit module), and the circuit module (or an electronic device including a circuit module) and the hyperspectral imaging module provided in the embodiment of the present application can constitute a hyperspectral imager.

[0059] like Figure 2 As shown, it is a schematic diagram of an implementation method of the signal transmission process in the hyperspectral imager provided in the embodiment of the present application. The hyperspectral imager includes a light source, an optical imaging system, a spectral chip, a photodetector and a circuit module. In the hyperspectral imager, the circuit module can send an electrical signal (a driving signal, including a phase modulation parameter determined for each phase modulator in the spectral chip) to the light source and the spectral chip, and the photodetector can feedback an electrical signal (obtained after photoelectric conversion according to the modulated light signal) to the circuit module. The light signal can be transmitted sequentially between the light source, the optical imaging system, the spectral chip, and the photodetector, that is: the light source outputs an initial light signal, which is irradiated onto the surface of the object, and a reflected light signal is generated after being reflected by the object; the optical imaging system captures the reflected light signal and inputs it into each spectral resolution unit in the spectral chip; each phase modulator performs phase modulation on the reflected light signal passing through its own active tunable spectral unit according to the corresponding phase modulation parameter, obtains a modulated light signal, and inputs the modulated light signal into the photodetector.

[0060] In the hyperspectral imaging method based on the hyperspectral imaging module provided in the embodiment of the present application, on the basis of the on-chip spectrometer module including the light source, the spectral chip and the photodetector, an optical imaging system is set between the light source and the spectral chip, and the spectral chip is designed to include a plurality of spectral resolution units, and each spectral resolution unit is designed to include a plurality of cascaded active tunable spectral units and a phase modulator arranged on each active tunable spectral unit, so as to obtain a hyperspectral imaging module. According to the preset spectral resolution method, the phase modulation parameters are determined for each phase modulator, and each phase modulation parameter is sent to the corresponding phase modulator respectively, and a driving signal is sent to the light source, so that the optical imaging system can couple the reflected light of the object into the spectral chip, and each spectral resolution unit in the spectral chip can be used as a "spectral processing unit" of the hyperspectral imaging module to process the reflected light of the object. Finally, the circuit module performs resolution according to the electrical signal fed back by the photodetector and the preset spectral resolution method, so as to obtain the hyperspectral imaging data. It can not only reduce the cost of hyperspectral imagers and further reduce the size of hyperspectral imagers, but also improve the resolution of hyperspectral imagers, reduce the amount of calculation of hyperspectral imagers, and improve the real-time performance of data processing of hyperspectral imagers.

[0061] The applicant of the present application further proposes that different types of spectral solution methods can be used depending on the specific application requirements of the hyperspectral imager (e.g., higher resolution, faster speed, higher sensitivity, etc.). Accordingly, in some embodiments, the preset spectral solution method includes any of the following: a convolution spectral solution method, a computational reconstruction spectral solution method, and a Fourier spectral solution method.

[0062] The embodiment of the present application does not specifically limit the specific implementation of the convolution spectrum solution method. The principle of the convolution spectrum solution method is that under the action of the phase modulation parameter, the spectrum chip and the photodetector realize the convolution processing of the reflected light signal within a larger working bandwidth, and the circuit module solves the convolution result (determined by the electrical signal fed back by the photodetector).

[0063] The embodiment of the present application does not limit the specific implementation of the computational reconstruction spectrum solution method. The principle of the computational reconstruction spectrum solution method is that, under the action of the phase modulation parameters and the number of active tunable spectrum units, the spectrum chip and the photodetector construct a spectrum reconstruction matrix, and the circuit module solves the spectrum reconstruction matrix (determined by the electrical signal fed back by the photodetector).

[0064] The embodiment of the present application does not limit the specific implementation of the Fourier spectrum solution method. The principle of the Fourier spectrum solution method is that under the action of the phase modulation parameter, the spectrum chip and the photodetector realize the Fourier transform of the reflected light signal, and the circuit module solves the Fourier transform result (determined by the electrical signal fed back by the photodetector).

[0065] like Figure 3 FIG. 1 is a schematic diagram of a spectrum solving unit provided in an embodiment of the present application, wherein each spectrum solving unit includes a plurality of cascaded active tunable spectrum units and a phase modulator (phase modulator) disposed on each of the active tunable spectrum units. Figure 3 (not shown yet).

[0066] In some embodiments, the plurality of actively tunable spectral units in the spectral resolution unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

[0067] like Figure 4 As shown, it is a schematic diagram of an implementation manner of the spectral solution unit provided in an embodiment of the present application, wherein a plurality of Mach-Zehnder interferometers MZI are cascaded in the spectral solution unit, and two phase modulation structures (i.e., phase modulators) are arranged on each Mach-Zehnder interferometer MZI.

[0068] like Figure 5 As shown, it is a schematic diagram of another implementation of the spectral solution unit provided in an embodiment of the present application, wherein a plurality of Mach-Zehnder interferometers MZI and microring resonators are cascaded in the spectral solution unit, and two phase modulation structures (i.e., phase modulators) are arranged on each Mach-Zehnder interferometer MZI, and one phase modulation structure (i.e., phase modulator) is arranged on each microring resonator.

[0069] like Figure 6 As shown, it is a schematic diagram of another implementation of the spectrum resolution unit provided in the embodiment of the present application, wherein a plurality of micro-ring resonators are cascaded in the spectrum resolution unit, and a phase modulation structure (i.e., a phase modulator) is arranged on each micro-ring resonator.

[0070] It is understandable that if Figure 4 , Figure 5 , Figure 6 As shown, a splitter element is also arranged between two adjacent active tunable spectral units in the spectral solution unit, which may include various common waveguide or fiber splitters, such as directional couplers, multimode interferometers, Y branches (a common optical waveguide structure, whose shape is similar to the letter "Y", which can realize the splitting or combining of optical signals), etc.

[0071] It can be seen that the embodiment of the present application does not impose any special limitation on the number of phase modulation structures provided on each active tunable spectrum unit, and the number may be 1 or 2.

[0072] It should be noted that the number of the multiple active tunable spectrum units cascaded in the spectrum solving unit is not particularly limited in the present embodiment and is not limited to Figure 3 , Figure 4 , Figure 5 , Figure 6 The numbers shown in the figure can be set according to the modulation principle actually required by the spectral chip.

[0073] The applicant of the present application further proposes that the optical imaging system can input the reflected light (i.e., reflected light signal) of the object into each spectral solution unit in the spectral chip in a grating coupling manner, so as to realize the on-chip input of the reflected light signal. Accordingly, in some embodiments, the hyperspectral imaging module further includes a grating connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in a grating coupling manner through the grating.

[0074] like Figure 7 As shown, it is a schematic diagram of an implementation method of coupling the reflected light signal grating into a spectral chip provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI. In the light signal receiving area, each parallel slit of the grating receives the reflected light signal from the optical imaging system and inputs it into a spectral resolution unit.

[0075] The applicant of the present application further proposes that the optical imaging system can input the reflected light (i.e., reflected light signal) of the object into each spectral solution unit in the spectral chip in an end-face coupling manner, so as to realize the off-chip input of the reflected light signal. Accordingly, in some embodiments, the hyperspectral imaging module also includes an optical fiber array connecting the optical imaging system and the spectral chip, and the optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in an end-face coupling manner through the optical fiber array.

[0076] like Figure 8 As shown, it is a schematic diagram of an implementation method of coupling the end face of the reflected light signal into the spectral chip provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI. In the optical signal receiving area, each optical fiber in the optical fiber array receives the reflected light signal from the optical imaging system and inputs it into a spectral resolution unit.

[0077] The applicant of the present application further proposes that, in order to increase the energy of the reflected light signal coupled into the spectral chip, a semiconductor optical amplifier SOA may be provided at the input end of each spectral resolution unit to amplify the reflected light signal online. Alternatively, in order to increase the energy of the modulated light signal entering the photodetector, a semiconductor optical amplifier SOA may be provided at the output end of each spectral resolution unit to amplify the modulated light signal online. Accordingly, in some embodiments, the hyperspectral imaging module further includes a semiconductor optical amplifier SOA provided at the input end or output end of each of the spectral resolution units.

[0078] like Fig. 9 As shown, it is a schematic diagram of an implementation method of the spectral chip provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral solution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI, and a semiconductor optical amplifier SOA is arranged at the output end of each spectral solution unit to perform online amplification of the modulated optical signal, thereby increasing the energy of the modulated optical signal entering the photodetector.

[0079] It should be noted that the number of spectrum solving units in the spectrum chip and the number of multiple active tunable spectrum units cascaded in the spectrum solving unit are not specifically limited in the present embodiment, nor are they limited to Figure 7 , Figure 8 , Fig. 9 The numbers shown in the figure can be set according to the modulation principle actually required by the spectral chip.

[0080] The applicant of the present application further proposes that the spectral chip can couple the modulated optical signal into the photodetector through the optical fiber array, or the spectral chip and the photodetector can be directly integrated on-chip.

[0081] like Fig.10 As shown, it is a schematic diagram of an implementation method of coupling the modulated optical signal into a photodetector provided in an embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as an example of a Mach-Zehnder interferometer MZI, and each optical fiber in the optical fiber array receives a reflected light signal from a spectral resolution unit and inputs it into a photodetector.

[0082] like Fig.11 As shown, it is a schematic diagram of another implementation method of coupling the modulated light signal into the photodetector provided in the embodiment of the present application, wherein each row in the spectral chip is a spectral resolution unit, and the figure takes the active tunable spectral unit as a Mach-Zehnder interferometer MZI as an example, and each spectral resolution unit directly inputs the reflected light signal into a photodetector.

[0083] There is no particular limitation on the light source in the embodiments of the present application. In some embodiments, the light source includes any one of the following: a superluminescent diode SLD, a light emitting diode LED, and a semiconductor optical amplifier SOA.

[0084] It should be noted that the embodiments of the present application are not limited to this, and natural light can also be used directly as the light source. It is understandable that at this time, the circuit module and the light source are not electrically connected, and the circuit module does not need to drive the light source.

[0085] As a second aspect of the embodiments of the present application, an electronic device is provided, wherein: Fig.12 As shown, the electronic device includes:

[0086] One or more processors 101;

[0087] The memory 102 stores one or more computer programs. When the one or more computer programs are executed by the one or more processors 101, the one or more processors 101 implement the hyperspectral imaging method based on the hyperspectral imaging module provided in the first aspect of the embodiment of the present application.

[0088] The electronic device may further include one or more I / O interfaces 103 connected between the processor 101 and the memory 102 and configured to implement information interaction between the processor 101 and the memory 102 .

[0089] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU), etc.; the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory (FLASH); the I / O interface (read-write interface) is connected between the processor and the memory, and can realize information exchange between the processor and the memory, including but not limited to a data bus (Bus), etc.

[0090] In some embodiments, the processor 101 , the memory 102 , and the I / O interface 103 are connected to each other via a bus 104 , and further connected to other components of the computing device.

[0091] As a third aspect of an embodiment of the present application, a hyperspectral imager is provided, wherein the hyperspectral imager includes a hyperspectral imaging module and the electronic device provided in the second aspect of the embodiment of the present application, the hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip and a photodetector, the spectral chip includes a plurality of spectral resolution units, the spectral resolution unit includes a plurality of cascaded active tunable spectral units and a phase modulator arranged on each of the active tunable spectral units;

[0092] The electronic device is used to determine the phase modulation parameters for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator respectively; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method;

[0093] The light source is used to output an initial light signal;

[0094] The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip;

[0095] The phase modulator is used to phase modulate the reflected light signal passing through the active tunable spectrum unit where the phase modulator is located according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector;

[0096] The photodetector is used to perform photoelectric conversion on the modulated light signal to obtain the electrical signal.

[0097] Among them, the specific structure and use principle of the hyperspectral imager have been described in detail above and will not be repeated here.

[0098] As a fourth aspect of the embodiment of the present application, Fig.13 As shown, a computer-readable medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module provided in the first aspect of the embodiment of the present application is implemented.

[0099] It can be understood by a person of ordinary skill in the art that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program. Accordingly, the computer program can be stored in a non-volatile computer-readable storage medium, and the computer program can implement the method of any of the above-mentioned embodiments when executed. Among them, any reference to memory, storage, database or other media used in the embodiments provided in the embodiments of the present application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0100] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. A hyperspectral imaging method based on a hyperspectral imaging module, characterized in that: The hyperspectral imaging module includes a light source, an optical imaging system, a spectral chip and a photodetector, the spectral chip includes a plurality of spectral solving units, the spectral solving units include a plurality of cascaded active tunable spectral units and a phase modulator disposed on each of the active tunable spectral units; the method includes: Determining phase modulation parameters for each phase modulator according to a preset spectrum solving method; Sending each of the phase modulation parameters to the corresponding phase modulator respectively; Sending a driving signal to the light source so that the light source outputs an initial light signal, the optical imaging system inputs a reflected light signal generated after the initial light signal is reflected by an object into each of the spectrum resolution units in the spectrum chip, each of the phase modulators performs phase modulation on the reflected light signal passing through the active tunable spectrum unit where it is located according to a corresponding phase modulation parameter to obtain a modulated light signal which is input into the photoelectric detector, and the photoelectric detector performs photoelectric conversion on the modulated light signal to obtain an electrical signal; Hyperspectral imaging data is obtained by calculating the electrical signal sent by the photoelectric detector and the preset spectral calculation method.

2. The hyperspectral imaging method according to claim 1, characterized in that: The preset spectrum solving method includes any one of the following: a convolution spectrum solving method, a computational reconstruction spectrum solving method, and a Fourier spectrum solving method.

3. The hyperspectral imaging method according to claim 2, characterized in that: The multiple active tunable spectrum units in the spectrum solving unit include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer MZI.

4. The hyperspectral imaging method according to claim 1, characterized in that: The hyperspectral imaging module also includes a grating connecting the optical imaging system and the spectral chip. The optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in a grating coupling manner through the grating.

5. The hyperspectral imaging method according to claim 1, characterized in that: The hyperspectral imaging module also includes a fiber optic array connecting the optical imaging system and the spectral chip. The optical imaging system inputs the reflected light signal into each spectral solution unit in the spectral chip in an end-face coupling manner through the fiber optic array.

6. The hyperspectral imaging method according to any one of claims 1 to 5, characterized in that: The hyperspectral imaging module further includes a semiconductor optical amplifier SOA arranged at the input end or the output end of each of the spectral resolution units.

7. The hyperspectral imaging method according to any one of claims 1 to 5, characterized in that: The light source includes any of the following: Super luminescent diode SLD, light emitting diode LED, semiconductor optical amplifier SOA.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; A memory having one or more computer programs stored thereon, wherein when the one or more computer programs are executed by the one or more processors, the one or more processors implement the hyperspectral imaging method based on the hyperspectral imaging module according to any one of claims 1-7.

9. A hyperspectral imager, characterized in that: The hyperspectral imager comprises a hyperspectral imaging module and the electronic device according to claim 8, wherein the hyperspectral imaging module comprises a light source, an optical imaging system, a spectral chip and a photodetector, wherein the spectral chip comprises a plurality of spectral resolution units, and the spectral resolution unit comprises a plurality of cascaded active tunable spectral units and a phase modulator disposed on each of the active tunable spectral units; The electronic device is used to determine the phase modulation parameters for each phase modulator according to a preset spectral solution method; send each phase modulation parameter to the corresponding phase modulator respectively; send a driving signal to the light source; and obtain hyperspectral imaging data according to the electrical signal sent by the photodetector and the preset spectral solution method; The light source is used to output an initial light signal; The optical imaging system is used to input the reflected light signal generated after the initial light signal is reflected by the object into each of the spectrum solving units in the spectrum chip; The phase modulator is used to phase modulate the reflected light signal passing through the active tunable spectrum unit where the phase modulator is located according to the corresponding phase modulation parameters to obtain a modulated light signal which is input to the photodetector; The photodetector is used to perform photoelectric conversion on the modulated light signal to obtain the electrical signal.

10. A computer readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the hyperspectral imaging method based on the hyperspectral imaging module according to any one of claims 1 to 7 is implemented.

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