Method and device for determining interface shape of heat dissipation cover of chip

Abstract

According to an embodiment of the invention, a method and a device for determining an interface shape of a heat dissipation cover of a chip are provided. The method comprises the following steps: determining a first plane warping degree of a flat reference heat dissipation cover after a welding process related to a chip; adjusting the interface shape of the reference heat dissipation cover based on the first plane warping degree, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warping degree; determining a second plane warping degree of the reference heat dissipation cover with the adjusted interface shape after the welding process; and determining the adjusted interface shape as the interface shape of the heat dissipation cover in response to the condition that the second plane warping degree meets a preset condition.

Description

Technical Field

[0001] Example embodiments of the present disclosure generally relate to the field of chip packaging technology, and more particularly to methods, devices, and computer-readable storage media for determining an interface shape of a heat dissipation cover of a chip, and a package and an electronic component including a heat dissipation cover having the determined interface shape. Background Art

[0002] During the chip packaging process, the chip needs to be soldered to the substrate, and the heat dissipation cover needs to be bonded to the substrate through an adhesive so that the heat dissipation cover is attached to the surface of the chip through the thermal interface material, thereby taking away the heat generated by the chip during operation. After the packaging process is completed, the entire package can be soldered to a printed circuit board (PCB for short). Before packaging, the surfaces of conventional components such as chips, heat dissipation covers and substrates are flat. However, due to the inconsistency of the thermal expansion coefficients of various components, during the chip packaging process or during the process of soldering the package to the PCB, various components, especially the heat dissipation cover, will warp, which will affect the contact effect between the radiator and the heat dissipation cover. Summary of the invention

[0003] In a first aspect of the present disclosure, a method for determining an interface shape of a heat dissipation cover of a chip is provided, comprising: determining a first plane warpage of a flat reference heat dissipation cover after a chip-related welding process; adjusting the interface shape of the reference heat dissipation cover based on the first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage; determining a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; and in response to the second plane warpage satisfying a predetermined condition, determining the adjusted interface shape as the interface shape of the heat dissipation cover.

[0004] In a second aspect of the present disclosure, a device for determining an interface shape of a heat dissipation cover of a chip is provided, comprising: a first warpage determination module, configured to determine a first plane warpage of a flat reference heat dissipation cover after a chip-related welding process; an interface shape adjustment module, configured to adjust the interface shape of the reference heat dissipation cover based on the first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage; a second warpage determination module, configured to determine a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; and an interface shape determination module, configured to determine the adjusted interface shape as the interface shape of the heat dissipation cover in response to the second plane warpage satisfying a predetermined condition.

[0005] In a third aspect of the present disclosure, an electronic device is provided, comprising: at least one processing unit; and at least one memory, wherein the at least one memory is coupled to the at least one processing unit and stores instructions for execution by the at least one processing unit, wherein the instructions, when executed by the at least one processing unit, cause the device to execute the method of the first aspect of the present disclosure.

[0006] In a fourth aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. The computer program can be executed by a processor to implement the method of the first aspect of the present disclosure.

[0007] In a fifth aspect of the present disclosure, a heat dissipation cover of a chip is provided, wherein the heat dissipation cover has an interface shape determined by the method of the first aspect of the present disclosure.

[0008] In a sixth aspect of the present disclosure, a package body is provided, comprising the heat dissipation cover of the fifth aspect of the present disclosure, wherein an interface shape of the heat dissipation cover is uneven before packaging and is flat after packaging.

[0009] In the seventh aspect of the present disclosure, an electronic component is provided, comprising a printed circuit board and a package, wherein the package is welded on the printed circuit board, and the package comprises the heat dissipation cover of the fifth aspect of the present disclosure, wherein the interface shape of the heat dissipation cover is uneven before the package is welded on the printed circuit board, and is flat after the package is welded on the printed circuit board.

[0010] It should be understood that the contents described in this content section are not intended to limit the key features or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0012] Figure 1 A schematic diagram showing a package in which embodiments of the present disclosure can be implemented;

[0013] Figure 2 shows a schematic diagram of an electronic component in which embodiments of the present disclosure can be implemented;

[0014] Figure 3 shows an example warping of the heat sink cover after the packaging process;

[0015] Figure 4A flow chart showing a process for determining an interface shape of a heat dissipation cover of a chip according to an embodiment of the present disclosure;

[0016] Figure 5 A schematic structural diagram of a heat dissipation cover according to an embodiment of the present disclosure is shown;

[0017] Figure 6 A block diagram showing a device for determining an interface shape of a heat dissipation cover of a chip according to an embodiment of the present disclosure; and

[0018] Figure 7 A block diagram of a device capable of implementing various embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0019] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0020] In the description of the embodiments of the present disclosure, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The term "some embodiments" should be understood as "at least some embodiments". Other explicit and implicit definitions may be included below. The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may be included below.

[0021] As briefly mentioned above, due to the inconsistent thermal expansion coefficients of components such as the chip, heat sink and substrate, during the chip packaging process or in the process of soldering the package body to the PCB, various components, especially the heat sink, will warp, which will affect the contact effect between the heat sink and the heat sink.

[0022] Figure 1 A schematic diagram showing a package in which embodiments of the present disclosure can be implemented is shown, Figure 2 Schematic diagrams showing electronic components in which embodiments of the present disclosure can be implemented.

[0023] like Figure 1As shown, the package described herein generally includes a chip 10, a first solder ball array 111, a substrate 12, a bottom filling material 13, an adhesive 14, a heat dissipation cover 15 and a first thermal interface material 16. The first solder ball array 111 is arranged between the chip 10 and the substrate 12 to solder the chip 10 to the substrate 12. The chip 10 can be soldered to the substrate 12 by a method such as reflow soldering or pressure welding. The bottom filling material 13 fills the space between the chip 10 and the substrate 12 except the first solder ball array 111. The heat dissipation cover 15 includes a top cover 151 and a side cover 152. The top cover 151 is coupled to the chip 15 through the first thermal interface material 16, and the side cover 152 is bonded to the substrate 12 through the adhesive 14. At this point, a structure as shown in FIG. Figure 1 When the chip 10 is working, the heat generated by the chip 10 can be transferred to the heat dissipation cover 15 via the first thermal interface material 16 .

[0024] like Figure 2 As shown, after the packaging is completed, it can be reflowed. Figure 1 The package shown is soldered to the PCB 17 via the second solder ball array 112. The heat sink 20 can then be fastened to the PCB 17 using spring screws 21. One side of the heat sink 20 is coupled to the heat dissipation cover 15 via the second thermal interface material 18, and fins are provided on the other side of the heat sink 20. Most of the heat in the package can be transferred to the heat sink 20 via the second thermal interface material 18.

[0025] During the packaging process of the chip 10 or during the process of soldering the package body to the PCB 17, due to the inconsistency of the thermal expansion coefficients of the chip 10, the heat dissipation cover 15 and the substrate 12, the various components, especially the heat dissipation cover 15, will warp. Even if the surface of the incoming heat dissipation cover 15 is flat, the surface of the heat dissipation cover 15 will warp after the packaging process and the process of being mounted on the PCB 17. As the area of ​​the package body increases, the warping of the heat dissipation cover 15 will also increase. Figure 3 FIG. 1 shows an example of warping of the heat dissipation cover 15 after the packaging process. Figure 3 As shown, after the chip 10 is packaged, the heat dissipation cover 15 and the substrate 12 are warped. For example, the middle portion of the top cover 151 of the heat dissipation cover 15 bulges upward.

[0026] The deterioration of the flatness of the heat dissipation cover 15 will not only affect the coating effect of the second thermal interface material 18, but also affect the installation pressure of the heat sink 20 on the package. The warping of the heat dissipation cover 15 may cause the coverage of the second thermal interface material 18 to fail to meet the thermal design requirements. The design thickness of the second thermal interface material 18, such as silicone grease, is usually 0.1 mm. If the surface warping of the heat dissipation cover 15 exceeds 0.1 mm, the second thermal interface material 18 will not be able to completely fill the gap between the heat dissipation cover 15 and the heat sink 20 in some areas, resulting in the heat dissipation effect failing to meet the thermal design requirements. In addition, the heat sink 20 is generally fixed to the PCB 17 by a spring screw 21. The pressure provided by the spring screw 21 is certain. When the heat dissipation cover 15 is warped, the local pressure borne by the warped heat dissipation cover 15 will increase significantly, which is much greater than the pressure borne by the heat dissipation cover 15 in a flat state, which will bring the risk of poor reliability of the chip 10. In addition, the warped heat dissipation cover 15 may also cause the installation of the heat sink 20 to be tilted, which will also greatly increase the risk of poor reliability of the chip 20.

[0027] In some cases, after the package is soldered to the PCB 17, the warped surface of the heat dissipation cover 15 may be machined using a machine tool to make the surface of the heat dissipation cover 15 flat. However, the package and the PCB 17 may be subjected to mechanical stress during the machining process, which may lead to a problem of poor mechanical reliability.

[0028] Figure 4 A flow chart of a process 400 for determining an interface shape of a heat dissipation cover of a chip according to an embodiment of the present disclosure is shown.

[0029] In block 410, a first plane warpage of a flat reference heat dissipation cover after a chip-related welding process is determined. The first plane warpage can reflect the flatness of the reference heat dissipation cover. As described above, during the packaging process of the chip 10, the chip 10 can be welded to the substrate 12 by means of reflow soldering or pressure welding, and after the packaging process is completed, the package can be welded to the PCB 17 via the second solder ball array 112 by means of reflow soldering. The chip-related welding process described herein may include one of the above two welding processes, that is, welding the chip to the substrate to form a package or welding the package to the printed circuit board.

[0030] In some embodiments, the first plane warpage can be determined by at least one of simulation, experiment and theoretical calculation. In the simulation mode, a structural model of a reference heat dissipation cover can be first established, which can include size information and position information, etc. Then, the physical quantity causing structural deformation is input into the structural model, such as thermal expansion coefficient, elastic modulus, etc. After simulation, the first plane warpage of the reference heat dissipation cover can be obtained. In the experimental mode, the actual reference heat dissipation cover can be packaged or mounted on the PCB after packaging, and the warpage of the reference heat dissipation cover can be measured by the shadow moiré method or by measuring the surface height difference, so as to obtain the first plane warpage. In the theoretical calculation mode, the first plane warpage can be determined based on physical quantities causing structural deformation such as thermal expansion coefficient and elastic modulus.

[0031] In block 420, the interface shape of the reference heat dissipation cover is adjusted based on the obtained first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage. The interface shape described herein refers to the shape of a surface of a side of the heat dissipation cover to be coupled to the heat sink. For example, after the packaging process, the reference heat dissipation cover is formed along the Figure 3 In the case where the base heat dissipation cover is warped upward in the middle in the manner shown, the first plane warpage can characterize the warpage form to reflect the interface shape of the base heat dissipation cover after the packaging process. According to the interface shape reflected by the first plane warpage, the interface shape of the base heat dissipation cover can be adjusted so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage. For example, when the base heat dissipation cover is warped upward along the first plane warpage after the packaging process, Figure 3 In the case of an upward warping in the middle in the manner shown, the middle position of the adjusted interface shape may be recessed downward, so that the interface shape of the reference heat dissipation cover is opposite to the interface shape reflected by the first plane warping.

[0032] In other embodiments, the reference heat dissipation cover may have other forms of warpage after the packaging process, such as W-shape, downward warpage in the middle, etc. In these embodiments, the first plane warpage can also characterize these warpage forms to reflect the interface shape of the reference heat dissipation cover after the packaging process. In the case where the reference heat dissipation cover has a W-shape warpage after the packaging process, the adjusted interface shape can present an inverted W-shape, so that the interface shape of the reference heat dissipation cover is opposite to the interface shape reflected by the first plane warpage. In the case where the reference heat dissipation cover is warped downward in the middle after the packaging process, the middle position of the adjusted interface shape can be convex upward, so that the interface shape of the reference heat dissipation cover is opposite to the interface shape reflected by the first plane warpage.

[0033] In some embodiments, adjusting the interface shape of the reference heat dissipation cover includes: performing reverse machining on the reference heat dissipation cover or modifying the mold of the heat dissipation cover. By performing reverse machining on the reference heat dissipation cover, the interface shape of the heat dissipation cover can be opposite to the interface shape reflected by the first plane warpage. By modifying the mold of the heat dissipation cover, the interface shape of the manufactured heat dissipation cover can be opposite to the interface shape reflected by the first plane warpage.

[0034] Similarly, when the package is soldered to the PCB, the interface shape of the reference heat dissipation cover can also be adjusted based on the obtained first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage.

[0035] At 430, a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process is determined to determine whether the reference heat dissipation cover having the adjusted interface shape is flat after the packaging process or after the package body is mounted on the PCB. The second plane warpage can be determined by at least one of an experiment and a simulation. In an experimental manner, the second plane warpage can be determined by a shadow moiré method or by measuring a surface height difference.

[0036] In block 440, in response to the second plane warpage satisfying a predetermined condition, the adjusted interface shape is determined as the interface shape of the heat dissipation cover. The second plane warpage satisfying the predetermined condition indicates that the flatness of the reference heat dissipation cover after the packaging process or after the package body is mounted on the PCB is sufficiently high. In this case, determining the adjusted interface shape as the interface shape of the heat dissipation cover can solve the problem of heat sink warpage from the source.

[0037] In some embodiments, Figure 4 As shown, in response to the second plane warpage not satisfying the predetermined condition, the process 400 returns from frame 430 to frame 420 to continue the optimization. Specifically, the process 400 may include: adjusting the interface shape of the reference heat dissipation cover based on the second plane warpage, so that the interface shape opposite to the interface shape reflected by the second plane warpage is added to the adjusted interface shape; determining the third plane warpage of the reference heat dissipation cover having the re-adjusted interface shape after the welding process; in response to the third plane warpage satisfying the predetermined condition, determining the re-adjusted interface shape as the interface shape of the heat dissipation cover; and in response to the third plane warpage not satisfying the predetermined condition, adjusting the interface shape of the reference heat dissipation cover based on the third plane warpage. By performing the cyclic optimization, the flatness of the heat dissipation cover after the packaging process or after the package body is mounted on the PCB can be made sufficiently high.

[0038] According to the embodiments of the present disclosure, by adjusting the interface shape of the heat dissipation cover, the surface of the heat dissipation cover can be flat after the packaging process or after the package body is mounted on the PCB. Therefore, the coverage rate of the second thermal interface material can theoretically reach 100%, and the local maximum pressure on the surface of the package body can also be effectively improved, so that the overall heat dissipation level and reliability can be effectively improved.

[0039] The embodiment of the present disclosure further provides a heat dissipation cover for a chip, wherein the heat dissipation cover has an interface shape determined by the process 400 as described above. Figure 5 FIG. 2 shows a schematic diagram of the structure of a heat dissipation cover according to an embodiment of the present disclosure. Figure 5 As shown, the heat dissipation cover 15 initially has an uneven interface shape, which is determined by the above-described process 400. After the packaging process or after the package body is mounted on the PCB, the interface shape of the heat dissipation cover 15 will be flat.

[0040] An embodiment of the present disclosure further provides a package body, including the heat dissipation cover 15 according to an embodiment of the present disclosure, wherein an interface shape of the heat dissipation cover 15 is uneven before a packaging process and is flat after the packaging process.

[0041] Figure 6 FIG. 6 is a block diagram of a device 600 for determining the interface shape of a heat dissipation cover of a chip according to an embodiment of the present disclosure. The device 600 may be used to perform the above-described Figure 4 Process 400 is shown.

[0042] like Figure 6 As shown, the device 600 generally includes: a first warpage determination module 610, configured to determine a first plane warpage of a flat reference heat dissipation cover after a chip-related welding process; an interface shape adjustment module 620, configured to adjust the interface shape of the reference heat dissipation cover based on the first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage; a second warpage determination module 630, configured to determine a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; and an interface shape determination module 640, configured to determine the adjusted interface shape as the interface shape of the heat dissipation cover in response to the second plane warpage satisfying a predetermined condition.

[0043] In some embodiments, the first plane warpage is determined by at least one of experiments, simulations, and theoretical calculations.

[0044] In some embodiments, the soldering process includes soldering the chip to a substrate to form a package or soldering the package to a printed circuit board.

[0045] In some embodiments, the second plane warpage is determined by at least one of experimentation and simulation.

[0046] In some embodiments, the interface shape adjustment module 620 is further configured to adjust the interface shape of the reference heat sink cover based on the second plane warpage in response to the second plane warpage not satisfying a predetermined condition, so that an interface shape opposite to the interface shape reflected by the second plane warpage is added to the adjusted interface shape; the second warpage determination module 630 is further configured to determine the third plane warpage of the reference heat sink cover having the re-adjusted interface shape after the welding process; the interface shape determination module 640 is further configured to determine the re-adjusted interface shape as the interface shape of the heat sink cover in response to the third plane warpage satisfying a predetermined condition; and the interface shape adjustment module 620 is further configured to adjust the interface shape of the reference heat sink cover based on the third plane warpage in response to the third plane warpage not satisfying a predetermined condition.

[0047] In some embodiments, the interface shape adjustment module 620 adjusts the interface shape of the reference heat dissipation cover by performing reverse machining on the reference heat dissipation cover or modifying the mold of the heat dissipation cover.

[0048] An embodiment of the present disclosure also provides an electronic component, including a printed circuit board and a package, the package being welded on the printed circuit board, the package having a heat dissipation cover 15 according to an embodiment of the present disclosure, wherein the interface shape of the heat dissipation cover 15 is uneven before the package is welded on the printed circuit board, and is flat after the package is welded on the printed circuit board.

[0049] Figure 7 A block diagram of an electronic device 700 is shown in which one or more embodiments of the present disclosure may be implemented. It should be understood that Figure 7 The electronic device 700 shown is merely exemplary and should not constitute any limitation on the functionality and scope of the embodiments described herein. Figure 7 The electronic device 700 shown can be used to implement Figure 4 Process 400 is shown.

[0050] like Figure 7As shown, the electronic device 700 is in the form of a general electronic device. The components of the electronic device 700 may include, but are not limited to, one or more processors or processing units 710, a memory 720, a storage device 730, one or more communication units 740, one or more input devices 750, and one or more output devices 760. The processing unit 710 may be an actual or virtual processor and is capable of performing various processes according to a program stored in the memory 720. In a multi-processor system, multiple processing units execute computer executable instructions in parallel to improve the parallel processing capability of the electronic device 700.

[0051] The electronic device 700 typically includes a plurality of computer storage media. Such media may be any accessible media that is accessible to the electronic device 700, including but not limited to volatile and non-volatile media, removable and non-removable media. The memory 720 may be a volatile memory (e.g., a register, a cache, a random access memory (RAM)), a non-volatile memory (e.g., a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), flash memory), or some combination thereof. The storage device 730 may be a removable or non-removable medium, and may include a machine-readable medium, such as a flash drive, a disk, or any other medium, which may be capable of being used to store information and / or data (e.g., training data for training) and may be accessed within the electronic device 700.

[0052] The electronic device 700 may further include additional removable / non-removable, volatile / non-volatile storage media. Figure 7 As shown in , a disk drive for reading or writing from a removable, non-volatile disk (e.g., a "floppy disk") and an optical drive for reading or writing from a removable, non-volatile optical disk may be provided. In these cases, each drive may be connected to the bus (not shown) by one or more data media interfaces. The memory 720 may include a computer program product 725 having one or more program modules that are configured to perform various methods or actions of various embodiments of the present disclosure.

[0053] The communication unit 740 implements communication with other electronic devices through a communication medium. Additionally, the functions of the components of the electronic device 700 can be implemented with a single computing cluster or multiple computing machines that can communicate through a communication connection. Therefore, the electronic device 700 can operate in a networked environment using a logical connection with one or more other servers, a network personal computer (PC), or another network node.

[0054] The input device 750 may be one or more input devices, such as a mouse, a keyboard, a tracking ball, etc. The output device 760 may be one or more output devices, such as a display, a speaker, a printer, etc. The electronic device 700 may also communicate with one or more external devices (not shown) through the communication unit 740 as needed, such as a storage device, a display device, etc., communicate with one or more devices that allow a user to interact with the electronic device 700, or communicate with any device that allows the electronic device 700 to communicate with one or more other electronic devices (e.g., a network card, a modem, etc.). Such communication may be performed via an input / output (I / O) interface (not shown).

[0055] According to an exemplary implementation of the present disclosure, an electronic device is provided. The electronic device includes at least one processing unit and at least one memory. The at least one memory is coupled to the at least one processing unit and stores instructions for execution by the at least one processing unit, and when the instructions are executed by the at least one processing unit, the device performs the method described above.

[0056] According to an exemplary implementation of the present disclosure, a computer-readable storage medium is provided, on which computer-executable instructions are stored, wherein the computer-executable instructions are executed by a processor to implement the method described above. According to an exemplary implementation of the present disclosure, a computer program product is also provided, which is tangibly stored on a non-transitory computer-readable medium and includes computer-executable instructions, and the computer-executable instructions are executed by a processor to implement the method described above.

[0057] Various aspects of the present disclosure are described herein with reference to the flowcharts and / or block diagrams of the methods, devices, equipment, and computer program products implemented according to the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer-readable program instructions.

[0058] These computer-readable program instructions can be provided to a processing unit of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processing unit of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0059] Computer-readable program instructions can be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operational steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, so that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0060] The flow chart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to multiple implementations of the present disclosure. In this regard, each square box in the flow chart or block diagram can represent a part of a module, program segment or instruction, and a part of a module, program segment or instruction includes one or more executable instructions for realizing the logical function of the specification. In some implementations as replacements, the function marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two continuous square boxes can actually be executed substantially in parallel, and they can sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be realized by a special hardware-based system that performs the function or action of the specification, or can be realized by a combination of special hardware and computer instructions.

[0061] Embodiments of the present disclosure are also embodied in the following examples.

[0062] Example 1. A method for determining an interface shape of a heat dissipation cover of a chip, comprising:

[0063] Determining a first plane warpage of a flat reference heat sink cover after a chip-related soldering process;

[0064] adjusting the interface shape of the reference heat dissipation cover based on the first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage;

[0065] determining a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; and

[0066] In response to the second plane warpage satisfying a predetermined condition, the adjusted interface shape is determined as the interface shape of the heat dissipation cover.

[0067] Example 2. The method of Example 1, wherein the first plane warpage is determined by at least one of experiment, simulation, and theoretical calculation.

[0068] Example 3. The method according to Example 1, wherein the welding process includes welding the chip to a substrate to form a package or welding the package to a printed circuit board.

[0069] Example 4. The method of Example 1, wherein the second plane warpage is determined by at least one of experimentation and simulation.

[0070] Example 5. The method according to Example 1 further includes:

[0071] In response to the second plane warpage not satisfying the predetermined condition, adjusting the interface shape of the reference heat dissipation cover based on the second plane warpage so that an interface shape opposite to the interface shape reflected by the second plane warpage is added to the adjusted interface shape;

[0072] determining a third plane warpage of the reference heat dissipation cover having the re-adjusted interface shape after the welding process;

[0073] In response to the third plane warpage satisfying the predetermined condition, determining the re-adjusted interface shape as the interface shape of the heat dissipation cover; and

[0074] In response to the third plane warpage not satisfying the predetermined condition, an interface shape of the reference heat dissipation cover is adjusted based on the third plane warpage.

[0075] Example 6. The method according to Example 1, wherein adjusting the interface shape of the reference heat dissipation cover comprises: performing reverse machining on the reference heat dissipation cover or modifying a mold of the heat dissipation cover.

[0076] Example 7. A device for determining an interface shape of a heat dissipation cover of a chip, comprising:

[0077] A first warpage determination module is configured to determine a first plane warpage of a flat reference heat dissipation cover after a chip-related soldering process;

[0078] an interface shape adjustment module configured to adjust the interface shape of the reference heat dissipation cover based on the first plane warpage so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage;

[0079] A second warpage determination module configured to determine a second-plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; and

[0080] The interface shape determination module is configured to determine the adjusted interface shape as the interface shape of the heat dissipation cover in response to the second plane warpage satisfying a predetermined condition.

[0081] Example 8. An electronic device comprising:

[0082] at least one processing unit; and

[0083] At least one memory, the at least one memory being coupled to the at least one processing unit and storing instructions for execution by the at least one processing unit, the instructions causing the device to perform a method according to any one of Examples 1 to 6 when executed by the at least one processing unit.

[0084] Example 9. A computer-readable storage medium having a computer program stored thereon, wherein the computer program can be executed by a processor to implement the method according to any one of Examples 1 to 6.

[0085] Example 10. A heat dissipation cover for a chip, the heat dissipation cover having an interface shape determined by the method according to any one of Examples 1 to 6.

[0086] Example 11. A package body comprising the heat dissipation cover according to Example 10, wherein an interface shape of the heat dissipation cover is uneven before packaging and is flat after packaging.

[0087] Example 12. An electronic component comprising a printed circuit board and a package, the package being welded on the printed circuit board, the package comprising a heat dissipation cover according to Example 10, wherein an interface shape of the heat dissipation cover is uneven before the package is welded on the printed circuit board, and is flat after the package is welded on the printed circuit board.

[0088] The above descriptions of various implementations of the present disclosure are exemplary, non-exhaustive, and not limited to the disclosed implementations. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described implementations. The selection of terms used herein is intended to best explain the principles of the implementations, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the various implementations disclosed herein.

Claims

1. A method for determining the interface shape of a heat dissipation cover of a chip, include: Determining a first plane warpage of a flat reference heat sink cover after a chip-related soldering process; adjusting the interface shape of the reference heat dissipation cover based on the first plane warpage, so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage; determining a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; as well as In response to the second plane warpage satisfying a predetermined condition, the adjusted interface shape is determined as the interface shape of the heat dissipation cover. 2 . The method according to claim 1 , wherein the first plane warpage is determined by at least one of experiments, simulations, and theoretical calculations. 3 . The method according to claim 1 , wherein the welding process comprises welding the chip to a substrate to form a package or welding the package to a printed circuit board. The method of claim 1 , wherein the second plane warpage is determined by at least one of experiment and simulation.

5. The method according to claim 1, further comprising: include: In response to the second plane warpage not satisfying the predetermined condition, adjusting the interface shape of the reference heat dissipation cover based on the second plane warpage so that an interface shape opposite to the interface shape reflected by the second plane warpage is added to the adjusted interface shape; determining a third plane warpage of the reference heat dissipation cover having the re-adjusted interface shape after the welding process; In response to the third plane warpage satisfying the predetermined condition, determining the re-adjusted interface shape as the interface shape of the heat dissipation cover; as well as In response to the third plane warpage not satisfying the predetermined condition, an interface shape of the reference heat dissipation cover is adjusted based on the third plane warpage.

6. The method according to claim 1, wherein the interface shape of the reference heat dissipation cover is adjusted include: The reference heat dissipation cover is subjected to reverse machining or the mold of the heat dissipation cover is modified.

7. A device for determining the interface shape of a heat dissipation cover of a chip, include: A first warpage determination module is configured to determine a first plane warpage of a flat reference heat dissipation cover after a chip-related soldering process; an interface shape adjustment module configured to adjust the interface shape of the reference heat dissipation cover based on the first plane warpage so that the adjusted interface shape is opposite to the interface shape reflected by the first plane warpage; a second warpage determination module configured to determine a second plane warpage of the reference heat dissipation cover having the adjusted interface shape after the welding process; as well as The interface shape determination module is configured to determine the adjusted interface shape as the interface shape of the heat dissipation cover in response to the second plane warpage satisfying a predetermined condition.

8. An electronic device, include: at least one processing unit; as well as At least one memory, the at least one memory being coupled to the at least one processing unit and storing instructions for execution by the at least one processing unit, the instructions causing the apparatus to perform the method according to any one of claims 1 to 6 when executed by the at least one processing unit.

9. A computer-readable storage medium having a computer program stored thereon, wherein the computer program can be executed by a processor to implement the method according to any one of claims 1 to 6. 10 . A heat dissipation cover for a chip, the heat dissipation cover having an interface shape determined by the method according to any one of claims 1 to 6. 11 . A package body comprising the heat dissipation cover according to claim 10 , wherein an interface shape of the heat dissipation cover is uneven before packaging and is flat after packaging.

12. An electronic component comprising a printed circuit board and a package, wherein the package is welded on the printed circuit board, the package comprising the heat dissipation cover according to claim 10, wherein the interface shape of the heat dissipation cover is uneven before the package is welded on the printed circuit board, and is flat after the package is welded on the printed circuit board.

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