Micro 3D printing curved surface conformal embedded circuit manufacturing method and system based on charge injection

Abstract

The invention provides a micro 3D printing curved surface conformal embedded circuit manufacturing method and system based on charge injection electric field driving, and the method comprises the steps: manufacturing a micro-nano groove structure which has a certain depth and is consistent with a circuit pattern on a 3D curved surface substrate, and carrying out the roughening and modification processing of the side wall and bottom of the micro-nano groove, the surface of the curved micro-nano groove has super hydrophilicity; taking conductive ink as a printing material, and filling the conductive ink into the micro-nano groove of the curved-surface base material under the combined action of charge injection electrowetting effect and electric capillary force; carrying out sintering conductive treatment on the conductive ink filled in the groove of the base material; and filling the micro-nano groove for multiple times, polishing and removing the redundant conductive material outside the micro-nano groove of the base material, and completing the manufacturing of the curved surface conformal embedded circuit. According to the invention, high-efficiency and low-cost manufacturing of the non-deployable curved surface large depth-to-width ratio embedded circuit can be realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic manufacturing and micro-nano 3D printing, and specifically relates to a method and system for manufacturing a conformal embedded circuit on a micro 3D printed curved surface driven by a charge injection electric field. Background Art

[0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art.

[0003] In the context of the rapid development of science and technology today, the development of complex three-dimensional curved surface conformal circuits is becoming increasingly urgent, and its applications cover many fields such as national defense and military, aerospace, structural health monitoring, intelligent structures, wearable devices, and flexible electronics. The requirements for circuits in these fields are not limited to traditional functional requirements, but also require circuits to have high stability and durability, and to be able to work stably and reliably for a long time under large loads and long-term service environments. Especially for extremely harsh and harsh service environments, higher and higher requirements are put forward for 3D curved surface conformal circuits, such as hypersonic missiles (radome FSS, conformal antennas, etc.), and higher and higher requirements are put forward for the adhesion between conformal circuits and substrates (interface bonding strength greater than 20MPa). The existing surface relief curved surface conformal circuits (circuits attached to the curved substrate / substrate surface) can no longer meet the requirements of super strong adhesion and high electrical performance. Embedded curved surface conformal circuits (embedded conformal circuits into the substrate structure) provide an ideal solution. However, the existing various 3D circuits and curved surface conformal circuit manufacturing technologies are completely unable to realize the manufacture of non-developable complex curved surface embedded micro-conformal circuits.

[0004] Current embedded circuit manufacturing technologies include composite processes of photolithography and nanoimprinting combined with electroplating, composite processes of laser etching combined with sputtering, gravure printing, and processes for directly printing circuits on liquid film substrates. Among them, the micro-nano grooves obtained after photolithography and nanoimprinting need to be filled with conductive materials into the grooves through a scraping and filling process to form a seed layer, and then combined with electroplating to achieve complete filling of the micro-nano grooves with conductive materials. However, on the one hand, photolithography and traditional nanoimprinting cannot achieve patterning of non-developable complex curved surfaces; on the other hand, for complex curved surfaces and non-developable curved surface structures, the scraping and filling process cannot achieve stable and uniform filling on the curved micro-nano groove structure, and it is even difficult to completely fill (for example, for nano grooves with a large aspect ratio, it is impossible to achieve complete filling). The method of combining laser etching with sputtering still has difficulties in manufacturing structures with a large aspect ratio, and it is difficult to ensure the thickness consistency of the sputtered metal layer on the curved surface. Similar to the scraping and filling process, gravure printing cannot achieve curved conformal circuit manufacturing. Printing circuits directly on liquid film substrates has the advantage of simple process. However, due to the complex 3D structure and the characteristics of non-developable surfaces, the liquid material cannot form a film of uniform thickness on the curved surface due to gravity, which greatly affects the forming effect of the common circuit on the curved surface.

[0005] Therefore, the existing surface conformal or embedded circuit manufacturing technology cannot meet the manufacturing requirements of formed surface conformal embedded circuits, especially large aspect ratio surface conformal embedded circuits. It is urgent to develop new solutions to achieve efficient and low-cost manufacturing of high-precision surface conformal embedded circuits. Summary of the invention

[0006] In order to solve the above problems, the present invention proposes a method and system for manufacturing conformal embedded circuits on micro 3D printed surfaces driven by charge injection electric field. The present invention combines the charge injection electrowetting effect to achieve efficient and complete filling and deposition of metal microfluids (conductive ink) in micro-nano grooves with large aspect ratios; based on optimized industrial parameters, the deposition thickness of the conductive ink in the micro-nano grooves can be precisely controlled.

[0007] According to some embodiments, the present invention adopts the following technical solutions:

[0008] A method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving comprises the following steps:

[0009] (1) A micro-nano groove structure with a certain depth consistent with the circuit pattern is manufactured on a 3D curved substrate, and the sidewall and bottom of the micro-nano groove are roughened and modified to make the surface of the curved micro-nano groove have super hydrophilic properties;

[0010] (2) Using conductive ink as the printing material, using electric field driven jet micro-nano 3D printing technology, setting printing parameters, and following the optimized printing path, filling the conductive ink into the micro-nano grooves of the curved substrate under the combined action of the charge injection electrowetting effect and the electrocapillary force;

[0011] (3) performing sintering and conductive treatment on the conductive ink filled into the micro-nano grooves of the 3D curved substrate;

[0012] (4) determining whether the filled conductive layer (embedded circuit) meets the requirements; if not, repeating steps (2)-(3) to fill the micro-nano grooves multiple times; if it meets the design requirements, proceeding to step (5);

[0013] (5) The excess conductive material outside the micro-nano grooves of the 3D curved surface substrate is removed to complete the curved surface conformal embedded circuit manufacturing.

[0014] As an optional embodiment, in step (1), the 3D curved surface substrate material includes but is not limited to ceramic, PEEK, glass or resin substrate and silicone substrate, the curved surface shape includes but is not limited to 3D structure, complex curved surface and non-developable curved surface; the micro-nano groove manufacturing technology includes but is not limited to laser etching, combined curved surface conformal embossing and etching, etc.

[0015] As an optional embodiment, in step (1), the width of the micro-nano groove ranges from 100 nm to 500 μm, and the aspect ratio ranges from 1 to 50;

[0016] As an optional embodiment, in step (1), the roughening treatment includes but is not limited to at least one of laser surface treatment, electrochemical roughening treatment and acid pickling; the modification treatment includes but is not limited to at least one of plasma treatment, corona treatment and solution immersion method.

[0017] As an optional embodiment, in step (2), the conductive ink includes at least one of nanosilver ink, nanocopper conductive ink, silver nanowire ink, liquid metal, and conductive polymer, and the material viscosity ranges from 0 to 10000 cps.

[0018] As an optional implementation, in step (2), the printing parameters include a printing voltage of 0-5000V, a printing pressure of 0-200kPa, a printing speed of 0-60mm / s, a needle electrode applied voltage of 0-5000V, and a printing height of 0.05-5mm.

[0019] As an optional embodiment, in the step (3), the sintering treatment is vacuum oven heating sintering or laser sintering, the temperature range is 60-200° C., and the sintering time is 30-120 min.

[0020] A nozzle for manufacturing a micro 3D printing curved surface conformal embedded circuit based on charge injection electric field driving, comprising a barrel, an adapter, a printing nozzle and a needle electrode, wherein the upper end of the barrel is provided with an adapter, the lower end of the barrel is connected to the printing nozzle, a needle electrode is penetrated through the barrel, and the lower end of the needle electrode extends out of the printing nozzle by a certain additional distance.

[0021] As an optional embodiment, the adapter includes an air pressure module and a needle electrode fixing module. The needle electrode fixing module is located at the center of the adapter and is used to fix the needle electrode. The air pressure module is used to apply pressure to the barrel.

[0022] As an optional implementation, the inner diameter of the print head is in the range of 0.2-0.7 mm, and the print head is externally connected to a high-voltage power supply, and the adjustable range of the high-voltage power supply is 0-5000V.

[0023] As an optional implementation, the pressure range of the air pressure module is 0-200 kPa.

[0024] As an optional implementation, the needle-shaped electrode is nested inside the print head, and the distance beyond the print head is 0.5-1mm according to the printing requirements. The adaptive diameter size is selected according to the inner diameter of the print head. The diameter range of the needle-shaped electrode is 0.1-0.5mm, and the diameter range of the tip of the needle electrode is 0.1-500μm. The internal needle electrode is connected to a high-voltage power supply from an external power supply interface, and the adjustable range of the high-voltage power supply is 0-5000V.

[0025] A charge injection electric field driven micro 3D printing curved surface conformal embedded circuit manufacturing system, comprising an electric field driven jet printing device body, on which the above-mentioned nozzle is arranged, and the electric field driven jet printing device body has a five-axis linkage motion system capable of driving the nozzle and a printing platform carrying a three-dimensional curved surface substrate.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention is different from the traditional coating and filling method. By adopting 3D printing technology to directly fill the micro-nano grooves, it can not only achieve complete filling of the nano-groove structure with a large aspect ratio, but also reduce material waste.

[0028] The present invention combines electric field-assisted fluid / laser multi-module three-dimensional surface graphics printing equipment to control the precise injection and deposition of seed layer materials, realize the manufacture of high-resolution circuits (line width as low as 100nm) on developable or non-developable surfaces, and improve the accuracy and efficiency of seed layer graphics.

[0029] The charge injection electric field driven micro 3D printing curved surface conformal embedded circuit printhead proposed in the present invention can stably control the deposition and spreading of conductive ink, and the guidance of the needle-shaped electrode can achieve precise control at the nanoscale, and produce a conductive film structure with good continuity and conformality in the micro-nano grooves of the complex curved surface substrate. The roughened grooves can further improve the uniformity and adhesion of the seed layer.

[0030] The present invention utilizes the charge injection electrowetting effect to effectively fill micro-nano grooves in an expandable or non-expandable curved surface substrate, providing a new solution strategy for the manufacture of curved surface conformal embedded circuits.

[0031] On the one hand, the present invention realizes the wettability of the conductive ink on the substrate surface through the electrowetting effect, and on the other hand, further reduces the surface tension of the conductive ink by additionally injecting charges to further enhance the wetting on the substrate surface, which can reduce the contact angle between the conductive ink and the substrate surface or the groove structure from 140°C to 20°C, thereby achieving high-quality, complete and efficient filling of the conductive ink in the grooves with a high aspect ratio.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0034] Figure 1 This is a schematic diagram of the charge injection electrowetting effect of the present invention;

[0035] Figure 2 This is a process flow chart of manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving of the present invention;

[0036] Figure 3 This is a non-developable curved surface printing structure diagram of the present invention;

[0037] Figure 4 This is a schematic diagram of the structure of the electric field driven jet printing nozzle of the present invention;

[0038] In the figure, 1 is an adapter, 2 is a material storage barrel, 3 is a printing nozzle, 4 is a needle electrode, 101 is an air pressure module, and 102 is a needle electrode fixing module. DETAILED DESCRIPTION

[0039] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0040] It should be noted that the following detailed descriptions are all illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0041] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0042] In the absence of conflict, the embodiments in this application and the features in the embodiments may be combined with each other.

[0043] Example 1

[0044] A method for manufacturing a conformal embedded circuit on a curved surface based on charge injection electrowetting and electric field driven micro 3D printing, mainly comprising the following steps:

[0045] (1) Micro-nano groove fabrication and surface treatment: Using laser etching and other technologies, a micro-nano groove structure with a certain depth (consistent with the circuit pattern) is manufactured on a curved substrate according to a pre-set printing program. The sidewalls and bottom of the micro-nano groove are roughened and modified to make the surface of the micro-nano groove of the curved substrate super hydrophilic.

[0046] (2) Filling of micro-nano grooves: Using conductive ink as the printing material, an electric field is used to drive the jet print head, which is moved to the marked point of the substrate. The printing parameters are adjusted and the printing path is loaded. Under the combined action of the charge injection electrowetting effect and the electrocapillary force, the conductive ink is filled into the micro-nano grooves of the curved substrate.

[0047] (3) Conductive treatment: The conductive ink filled into the micro-nano grooves of the substrate is sintered.

[0048] (4) Evaluation of filling effect: Determine whether the conductive layer (embedded circuit) after filling meets the requirements. If not, repeat steps (2)-(3) to fill the micro-nano groove multiple times; if it meets the requirements, proceed to step (5).

[0049] (5) Flattening: Use post-processing techniques such as polishing to polish away excess conductive material outside the micro-nano grooves of the substrate to complete the manufacturing of curved surface conformal embedded circuits.

[0050] In this embodiment, the curved surface substrate micro-nano groove substrate in step (1) includes but is not limited to ceramic, PEEK, glass or resin substrate and silicone substrate, etc., and the curved surface shape includes but is not limited to developable curved surface and non-developable curved surface; the micro-nano groove manufacturing includes but is not limited to laser etching, combined curved surface conformal embossing and etching, etc.

[0051] In this embodiment, the width of the micro-nano groove in step (1) can be selected in the range of 100 nm-500 μm, and the aspect ratio can be selected in the range of 1-50;

[0052] In this embodiment, the roughening treatment in step (1) includes but is not limited to laser surface treatment, electrochemical roughening treatment or pickling; the modification treatment includes but is not limited to plasma treatment, corona treatment or solution immersion method, etc.

[0053] In this embodiment, the conductive ink in step (2) includes nanosilver ink, conductive copper ink, and silver nanowire ink, and the viscosity ranges from 0 to 10000 cps;

[0054] In this embodiment, the printing parameters in step (2) include a printing voltage of 0-5000V, a printing pressure of 0-200kPa, a printing speed of 0-60mm / s, a needle electrode applied voltage of 0-5000V, and a printing height of 0.05-5mm.

[0055] In this embodiment, the sintering treatment in step (3) can be physical sintering (such as using a vacuum drying oven) or laser sintering. The physical sintering temperature range is 60-150° C. and the curing time is 30-120 min.

[0056] Example 2

[0057] A method for manufacturing a conformal circuit embedded in a micro 3D printed surface based on charge injection electrowetting and electric field driven micro 3D printing, the specific implementation method is as follows Figure 2 The present invention is further described below in conjunction with the accompanying drawings and implementation examples.

[0058] In this embodiment, a hemispherical ceramic substrate with a radius of 30 mm is selected, a serpentine wire grid structure is selected for the conductive circuit, an area of ​​30×30 mm, a period of 1 mm, a nano-groove width of 300 nm, and a groove depth of 600 nm (aspect ratio of 2:1), and a filling material is selected from nano-silver ink (viscosity of 100 cps). The specific implementation steps are as follows:

[0059] Step 1: Nanogroove manufacturing and surface treatment. First, laser etching technology is used to manufacture a nanogroove structure with a width of 300nm and a depth of 600nm on the curved surface according to a pre-set printing program. Then, the nanogroove surface is roughened by combining the electric field-assisted fluid / laser multi-module three-dimensional surface graphics printing equipment. Using a roughening laser, the ceramic substrate groove is laser roughened according to the planned circuit pattern printing path, so that the nanogroove surface appears uneven. Afterwards, the surface of the groove is hydrophilicized by plasma to reduce the contact angle between the ink and the substrate surface during printing.

[0060] Step 2: Nanogroove filling. Using nanosilver ink as the printing material, adjust the printing equipment, move the print head to the marking point of the substrate, set the printing parameters (printing height 0.1mm, printing voltage 1500V, printing air pressure 50kPa, workbench moving speed 40mm / s), load the printing path, and fill the nanosilver ink into the substrate groove with a width of 300nm under the combined action of charge injection electrowetting effect and electrocapillary force.

[0061] Specifically, the print head is a metal print head coaxially nested with a needle electrode, the inner diameter of the metal print head is 0.2 mm, the diameter of the needle electrode is 0.1 mm, the diameter of the needle electrode tip is less than 0.1 μm, and both the metal print head and the needle electrode are externally connected to a high-voltage power supply. The metal print head printing voltage is 1000V, and the needle electrode printing voltage is 1500V.

[0062] Step 3: Conductive treatment: After printing, the workpiece is placed in a vacuum drying oven at 100°C and cured and sintered for 1 hour to fully evaporate the solvent in the nanosilver ink and leave highly conductive silver particles in the nanogrooves.

[0063] Step 4: Determine whether the filled nanosilver conductive layer meets the design requirements. If not, repeat steps (2)-(3) to fill the nanogrooves multiple times. If it meets the requirements, proceed to step (5).

[0064] Step 5: Flattening: Use post-processing techniques such as polishing to polish away excess silver nanoparticles outside the substrate nanogrooves, completing the manufacturing of the curved surface conformal embedded circuit.

[0065] In some embodiments, the roughening treatment in step 1 includes but is not limited to laser surface roughening treatment, electrochemical polishing treatment or acid washing. The hydrophilic treatment includes but is not limited to corona treatment or immersion treatment.

[0066] In some embodiments, the curved nanogroove substrate in step 1 includes but is not limited to a ceramic, glass or resin substrate and a silicone substrate, etc., and the curved surface shape includes but is not limited to a developable curved surface and a non-developable curved surface;

[0067] In some embodiments, in step 1, the nanogroove width can be selected in the range of 300 nm-50 μm, and the aspect ratio can be selected in the range of 1-10;

[0068] In other embodiments, the conductive ink in step 2 may be conductive copper ink or silver nanowire ink, and the viscosity range is 0-1000 cps;

[0069] In other embodiments, the printing parameters in step 2 include a printing voltage of 0-5000V, a printing pressure of 0-200kPa, a printing speed of 0-60mm / s, a needle electrode applied voltage of 0-5000V, and a printing height of 0.05-5mm.

[0070] In other embodiments, laser melting and sintering may be selected in step 3.

[0071] Example 3

[0072] A method for manufacturing a conformal embedded circuit on a micro 3D printed surface based on charge injection electric field driving, the specific implementation method is as follows Figure 2 The present invention is further described below in conjunction with the accompanying drawings and implementation examples.

[0073] In this embodiment, a non-developable curved resin substrate is selected, and a conductive circuit is selected from a grid structure with an area of ​​30×30 mm, a period of 1 mm, a micron groove width of 10 μm, and a groove depth of 50 μm (aspect ratio of 5:1). The filling material is a conductive copper ink (viscosity of 7000 cps, solid content>80%). Figure 3 As shown, the specific implementation steps are as follows:

[0074] Step 1: Micro-groove fabrication and surface treatment. First, laser etching technology is used to fabricate a micro-groove structure with a width of 10 μm and a depth of 50 μm on the curved surface according to a pre-set printing program. By adding an appropriate amount of electrolyte to the electrolyte, a redox reaction occurs on the surface of the material, forming an irregular micro-nano structure in the nano-groove of the resin substrate. After that, the workpiece is placed in a hydrophilic solution and soaked for 10 minutes, then taken out and blown dry with nitrogen.

[0075] Step 2: Micron groove filling. Place the processed workpiece on the printing platform, use nanosilver ink as the printing material, adjust the printing equipment, move the print head to the marking point of the substrate, set the printing parameters (printing height 0.2mm, printing voltage 2500V, printing air pressure 50kPa, workbench moving speed 20mm / s), load the printing path, and fill the nanosilver ink into the substrate micro groove with a width of 10μm under the combined action of charge injection electrowetting effect and electrocapillary force.

[0076] Specifically, the print head is a metal print head coaxially nested with a needle electrode. Due to the large width of the micro groove, the inner diameter of the metal print head is 0.35mm, the diameter of the needle electrode is 0.2mm, and the tip diameter of the needle electrode is 5μm. The metal print head and the needle electrode are both connected to an external high-voltage power supply. The metal print head printing voltage is 1500V, and the needle electrode printing voltage is 2500V, so that the conductive copper ink can be fully spread in the groove.

[0077] Step 3: Conductive treatment: After printing, the workpiece is placed in a vacuum drying oven at 150°C for 10 minutes of curing and sintering to fully evaporate the solvent in the conductive copper ink and leave a highly conductive copper layer in the groove.

[0078] Step 4: Determine whether the filled conductive copper layer meets the experimental requirements. If not, repeat steps (2)-(3) to fill the groove multiple times. If it meets the experimental requirements, proceed to step (5).

[0079] Step 5: Flattening: Use post-processing techniques such as polishing to polish away the excess conductive copper layer outside the substrate groove to complete the manufacture of the curved surface conformal embedded circuit.

[0080] Example 4

[0081] A nozzle based on charge injection electric field driven micro 3D printing surface conformal embedded circuit manufacturing, such as Figure 3 As shown, it includes an adapter 1, a material storage barrel 2, a printing nozzle 3 and a needle-shaped electrode 4.

[0082] In this embodiment, the adapter 1 is composed of two parts, an air pressure module 101 and a needle electrode fixing module 102. The diameter of the needle electrode fixing module 102 is adjustable and is located at the center of the adapter 1 to ensure that the center of the adapter 1 is aligned with the center of the print head 3; the adapter 1 is connected to the storage barrel 2, the print head 3 is connected to the lower end of the storage barrel 2, the needle electrode 4 extends from the needle electrode fixing module 102 and extends from the lower end of the print head 3, and the needle electrode 4 is fixed by the needle electrode fixing module 102; the print head 3 and the needle electrode 4 are both externally connected to a high-voltage power supply.

[0083] In this embodiment, the print head 3 is one of a metal head, a glass head, a silicon head, and a ceramic head. The inner diameter of the print head can be selected in the range of 0.2-0.7 mm. The print head is externally connected to a high voltage power supply, and the adjustable range of the high voltage power supply is 0-5000V.

[0084] In this embodiment, the pressure range of the air pressure module is 0-200 kPa.

[0085] In this embodiment, the needle electrode 4 is nested inside the print head 3, and the length can exceed the nozzle distance by 0.5-1mm according to the printing requirements. The diameter size can be selected according to the inner diameter of the print head 3, and the optional range is 0.1-0.5mm. The needle electrode 4 is connected to a high-voltage power supply from the external power supply interface, and the high-voltage power supply can be adjusted in the range of 0-5000V.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principle of the present invention without creative labor shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving, characterized in that: The following steps are involved: (1) A micro-nano groove structure with a certain depth and consistent with the circuit pattern is manufactured on a 3D curved substrate, and the sidewall and bottom of the micro-nano groove are roughened and modified to make the surface of the micro-nano groove on the curved substrate super hydrophilic; (2) Using conductive ink as the printing material, using electric field driven jet printing technology, adjusting the printing parameters, and filling the conductive ink into the micro-nano grooves of the 3D curved surface substrate according to the printing path under the combined action of the charge injection electrowetting effect and the electrocapillary force; (3) performing sintering and conductive treatment on the conductive ink filled into the micro-nano grooves of the substrate; (4) determining whether the filled conductive layer meets the requirements; if not, repeating steps (2)-(3) to fill the micro-nano grooves multiple times; if it meets the requirements, proceeding to step (5); (5) The excess conductive material outside the micro-nano grooves of the 3D curved surface substrate is removed to complete the manufacturing of the curved surface conformal embedded circuit.

2. The method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving according to claim 1, characterized in that: In the step (1), the 3D curved surface substrate includes but is not limited to ceramic, PEEK, glass or resin substrate and silicone substrate, and the curved surface shape includes but is not limited to developable curved surface and non-developable curved surface; the micro-nano groove manufacturing includes but is not limited to laser etching, combined curved surface conformal embossing and etching.

3. The method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving as claimed in claim 1, characterized in that: In the step (1), the width of the micro-nano groove is in the range of 100 nm-500 μm, and the aspect ratio is in the range of 1-50; Alternatively, in step (1), the roughening treatment includes but is not limited to at least one of laser surface treatment, electrochemical roughening treatment and acid pickling; the modification treatment includes but is not limited to at least one of plasma treatment, corona treatment and solution immersion method.

4. The method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving as claimed in claim 1, characterized in that: In the step (2), the conductive ink comprises at least one of nanosilver ink, conductive copper ink and silver nanowire ink, and has a viscosity ranging from 0 to 10000 cps; Or, in step (2), the printing parameters include a printing voltage of 0-5000V, a printing pressure of 0-200kPa, a printing speed of 0-60mm / s, a needle electrode applied voltage of 0-5000V, and a printing height of 0.05-5mm.

5. The method for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field driving as claimed in claim 1, characterized in that: In the step (3), the sintering process is physical sintering or laser sintering, the sintering temperature ranges from 60 to 200° C., and the sintering time is 30 to 120 minutes.

6. A nozzle for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field drive, characterized in that: It includes a barrel, an adapter, a print head and a needle electrode. The upper end of the barrel is provided with an adapter, the lower end of the barrel is connected to the print head, a needle electrode is penetrated through the barrel, and the lower end of the needle electrode extends out of the print head by a certain additional distance.

7. The charge injection electric field driven micro 3D printing curved surface conformal embedded circuit manufacturing nozzle according to claim 6, characterized in that: The adapter includes an air pressure module and a needle electrode fixing module, the needle electrode fixing module is located at the center of the adapter and is used to fix the needle electrode, and the air pressure module is used to apply pressure to the barrel; Or further, the pressure range of the air pressure module is 0-200 kPa.

8. A nozzle for manufacturing a circuit by micro 3D printing curved surface conformally embedded circuit based on charge injection electric field drive as claimed in claim 6, characterized in that: The inner diameter of the printing nozzle is in the range of 0.2-0.7 mm. The printing nozzle is externally connected to a high-voltage power supply, and the adjustable range of the high-voltage power supply is 0-5000V.

9. A nozzle for manufacturing a micro 3D printed curved surface conformal embedded circuit based on charge injection electric field drive as claimed in claim 6, characterized in that: The needle-shaped electrode is nested inside the print head, and the distance beyond the print head is 0.5-1mm according to the printing requirements. The adaptive diameter size is selected according to the inner diameter of the print head. The diameter range of the needle-shaped electrode is 0.1-0.5mm, and the diameter range of the tip of the needle-shaped electrode is 0.1-500μm. The internal needle-shaped electrode is connected to a high-voltage power supply from an external power supply interface, and the adjustable range of the high-voltage power supply is 0-5000V.

10. A system for manufacturing curved surface conformal embedded circuits based on charge injection electric field driven micro 3D printing, characterized in that: It comprises an electric field driven jet printing device body, on which is arranged a square nozzle for manufacturing a micro 3D printing curved surface conformal embedded circuit based on charge injection electric field drive according to any one of claims 6-9, and the electric field driven jet printing device body has a five-axis linkage motion system capable of driving the nozzle and a printing platform that carries a 3D curved surface substrate.

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