Selective plastic package protection structure, selective plastic package method, selective plastic package module and electronic product

Abstract

The invention discloses a selective plastic packaging protection structure, a selective plastic packaging method, a selective plastic packaging module and an electronic product, and relates to the technical field of semiconductors, the selective plastic packaging protection structure comprises a protection cover shell and a protection film, the protection cover shell is provided with a protection cavity and two opposite side openings communicating with the protection cavity, and the protection film is arranged in the protection cavity; the protective film is connected to an opening in one side of the protective cover shell, and the protective cover shell can be at least partially embedded into the protective film under plastic packaging pressure, so that a sealing interface is formed between the protective cover shell and the protective film. According to the technical scheme provided by the invention, the selective plastic packaging cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a selective plastic packaging protection structure, a selective plastic packaging method, a selective plastic packaging module and an electronic product. Background Art

[0002] At present, some special devices (such as microphones, cameras, MEMS sensors, six-axis sensors, etc.) cannot be encapsulated with plastic encapsulation materials, so selective encapsulation is required. The existing selective encapsulation process usually first mounts the devices that need to be encapsulated on the substrate, and then uses a special encapsulation mold to avoid the non-encapsulation area for encapsulation, and then mounts the devices that do not need to be encapsulated in the non-encapsulation area. This process requires the design of a special encapsulation mold, and the cost of selective encapsulation is relatively high. Summary of the invention

[0003] The main purpose of the present invention is to provide a selective plastic packaging protection structure, a selective plastic packaging method, a selective plastic packaging module and an electronic product, aiming to reduce the cost of selective plastic packaging.

[0004] To achieve the above-mentioned purpose, the present invention proposes a selective plastic sealing protection structure, comprising:

[0005] A protective cover shell, the protective cover shell having a protective cavity and two opposite openings communicating with the protective cavity, wherein one opening of the protective cover shell is used to be mounted on a substrate of a device to be encapsulated and to allow a device of the device to be encapsulated that does not need to be encapsulated to be located in the protective cavity;

[0006] A protective film connected to the other side opening of the protective cover shell;

[0007] The protective cover shell can be at least partially embedded in the protective film under the molding pressure, so that a sealing interface is formed between the protective cover shell and the protective film.

[0008] In one embodiment, the material of the protective film is at least one of ethylene-tetrafluoroethylene copolymer and hexafluoropropylene-tetrafluoroethylene copolymer; and / or the Rockwell hardness of the protective cover shell is greater than 80HR.

[0009] In one embodiment, the protective film satisfies at least one of the following conditions:

[0010] The thickness of the connection between the protective film and the protective cover shell ranges from 0.1mm to 0.2mm;

[0011] The tensile strength of the protective film is greater than or equal to 35 MPa;

[0012] The elongation at break of the protective film is greater than or equal to 200%;

[0013] The melting point of the protective film is greater than or equal to 260°C;

[0014] The tolerable temperature of the protective film is greater than or equal to 200°C;

[0015] The protective film has a modulus range of 15 MPa to 35 MPa at 175°C.

[0016] In one embodiment, the protective film covers the opening of the protective cover shell.

[0017] In one embodiment, the surface of the protective film facing the protective cover shell is provided with an annular limiting groove, and the opening side of the protective cover shell is clamped in the annular limiting groove; or,

[0018] The protective membrane comprises a membrane body and an annular stopper, wherein the annular stopper is arranged on the surface of the membrane body facing the protective cover shell, the stopper is provided with an annular stopper groove exposing a part of the surface of the membrane body, and the opening side of the protective cover shell is clamped in the annular stopper groove and abuts against the membrane body; or,

[0019] The protective film comprises a film body and a limiting protrusion convexly arranged on the surface of the film body, and the limiting protrusion is clamped in the opening of the protective cover shell.

[0020] In one embodiment, the protective film is an annular structure, and an annular limiting groove is formed on the surface of the protective film facing the protective cover shell, and the opening side of the protective cover shell is clamped in the annular limiting groove.

[0021] The present invention also provides a selective plastic packaging method, comprising the following steps:

[0022] Providing a substrate and the selective plastic encapsulation protection structure as described above;

[0023] Mounting electronic components on a surface of the substrate, wherein the electronic components include a first component that needs to be plastic-encapsulated and a second component that does not need to be plastic-encapsulated;

[0024] Mounting the selective plastic encapsulation protection structure on the substrate at the periphery of the second device so that the second device is located in the protection cavity of the selective plastic encapsulation protection structure;

[0025] Plastic-sealing the plastic-sealed area so that the plastic-sealed material covers the first device and forms a plastic-sealed layer, and the sidewall of the plastic-sealed layer is in contact with the sidewall of the selective plastic-sealed protective structure;

[0026] The protective film of the selectively molded protective structure is removed.

[0027] In one embodiment, the distance between the protective cover shell of the selectively encapsulated protective structure and the electronic components around the protective cover shell is greater than 0.1 mm; and / or,

[0028] The height of the plastic encapsulation layer is the same as the height of the side wall of the selective plastic encapsulation protection structure.

[0029] The present invention further provides a selective plastic packaging module, which is a selective plastic packaging module manufactured by the selective plastic packaging method described above.

[0030] The present invention further provides an electronic product, which includes the selective plastic packaging module as described above.

[0031] The selective plastic sealing protective structure provided by the present invention includes a protective cover shell and a protective film, the protective cover shell has a protective cavity and openings on two opposite sides connecting the protective cavity, the protective film is connected to one side opening of the protective cover shell, and the protective cover shell can be at least partially embedded in the protective film under the plastic sealing pressure, so that a sealed interface is formed between the protective cover shell and the protective film. When the selective plastic sealing protective structure of the present invention is used to selectively seal the device to be plastic sealed, the opening side of the protective cover shell opposite to the protective film is mounted on the device to be plastic sealed, and the device to be plastic sealed that does not need to be plastic sealed is located in the protective cavity, thereby effectively isolating and protecting the device that does not need to be plastic sealed, so that a universal plastic sealing mold can be used for plastic sealing without using a special plastic sealing mold, and the cost of selective plastic sealing is relatively low. Moreover, during the selective molding process, under the molding pressure, the protective cover shell can be at least partially embedded in the protective film, so that a sealed interface can be formed between the protective cover shell and the protective film, which can more effectively prevent the molding material from entering the protective cavity through the interface between the protective cover shell and the protective film, thereby further enhancing the isolation and protection capability of the selective molding protection structure for the devices that do not need to be molded in the molding devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0033] Figure 1 A schematic structural diagram of an embodiment of the selective plastic encapsulation protection structure provided by the present invention applied to a device to be plastic encapsulated;

[0034] Figure 2 A schematic structural diagram of two viewing angles of an embodiment of a protective film in a selective plastic sealing protective structure provided by the present invention;

[0035] Figure 3 A schematic structural diagram of two viewing angles of another embodiment of a protective film in a selective plastic sealing protective structure provided by the present invention;

[0036] Figure 4 A schematic structural diagram of two viewing angles of another embodiment of the protective film in the selective plastic sealing protective structure provided by the present invention;

[0037] Figure 5 A schematic structural diagram of two viewing angles of another embodiment of a protective film in a selective plastic sealing protective structure provided by the present invention;

[0038] Figure 6 This is a schematic diagram of the structure involved in the selective plastic packaging method provided by the present invention.

[0039] Description of Figure Numbers:

[0040] 100. Selective plastic encapsulation protection structure; 10. Protective cover shell; 11. Protective cavity; 20. Protective film; 21. Film body; 22. Annular limiting member; 23. Annular limiting groove; 24. Limiting protrusion; 200. Component to be plastic encapsulated; 201. Substrate; 202. First component; 203. Second component; 204. Plastic encapsulation layer; 300. Universal plastic encapsulation mold.

[0041] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0045] At present, some special devices (such as microphones, cameras, MEMS sensors, six-axis sensors, etc.) cannot be encapsulated with plastic encapsulation materials, so selective encapsulation is required. The existing selective encapsulation process usually involves first mounting the devices that need to be encapsulated on the substrate, then using a special encapsulation mold to avoid the non-encapsulation area for encapsulation, and then mounting the devices that do not need to be encapsulated in the non-encapsulation area. This process requires the design of a special encapsulation mold, and the cost of selective encapsulation is relatively high.

[0046] In view of the high cost of the existing selective plastic encapsulation process, Figure 1 The present invention proposes a selective plastic encapsulation protection structure 100, which is applied to the selective plastic encapsulation of a device 200 to be plastic encapsulated, aiming to reduce the cost of selective plastic encapsulation. The device 200 to be plastic encapsulated includes a substrate 201 and electronic components mounted on a surface of the substrate 201. The side of the substrate 201 provided with the electronic components is provided with a plastic encapsulation area and a non-plastic encapsulation area. The electronic components located in the plastic encapsulation area are devices that need to be plastic encapsulated, that is, the first device 202. The first device 202 includes but is not limited to integrated circuit chips, resistors, capacitors, etc.; the electronic components located in the non-plastic encapsulation area are devices that do not need to be plastic encapsulated, that is, the second device 203. The second device 203 includes but is not limited to microphones, cameras, micro-electromechanical system sensors, six-axis sensors, etc.

[0047] Please refer again Figure 1In one embodiment of the present invention, a selective plastic encapsulation protective structure 100 includes a protective cover shell 10 and a protective film 20. The protective cover shell 10 has a protective cavity 11 and two opposite openings connected to the protective cavity 11. One side opening of the protective cover shell 10 is used to be mounted on a substrate 201 of a device to be plastic encapsulated 200 and to allow the device to be plastic encapsulated 200 that does not need to be plastic encapsulated to be located in the protective cavity 11; the protective film 20 is connected to the other side opening of the protective cover shell 10; the protective cover shell 10 can be at least partially embedded in the protective film 20 under the plastic encapsulation pressure, so that a sealed interface is formed between the protective cover shell 10 and the protective film 20.

[0048] The molding pressure mentioned in this article refers to the pressure of the molding mold, that is, the pressure applied by the molding mold to the molding material and the device to be molded during the selective molding process, so that the molding material and the device to be molded fit tightly.

[0049] Specifically, the protective cover shell 10 is roughly a cylindrical structure with openings on both sides, and a protective cavity 11 is formed inside. Since the outer contour of the device that does not require plastic encapsulation is usually a square structure, the protective cover shell 10 can be selected as a square protective cover shell 10, that is, the protective cover shell 10 includes four side walls connected in sequence. When used, an open side of the protective cover shell 10 is attached to the surface of the substrate 201 provided with electronic components using adhesive, and is located on the periphery of the second device 203 (that is, the device that does not require plastic encapsulation) to achieve isolation and protection of the second device 203 (that is, the device that does not require plastic encapsulation). The protective film 20 is connected to the other open side of the protective cover shell 10, and the connection method can be selected to be bonding or clamping, which is simple to operate and the connection is relatively firm. After the protective film 20 is assembled and connected to the protective cover shell 10, it encloses the substrate 201 to form a protective cavity 11, and the second device 203 (that is, the device that does not require plastic encapsulation) is located in the protective cavity 11. The material of the protective film 20 can be selected as a flexible material. Thus, under the action of external pressure (i.e., molding pressure), the protective film 20 will deform, so that the side where the protective cover shell 10 is connected to the protective film 20 is at least partially embedded in the protective film 20, but will not penetrate the protective film 20. This can form a sealed interface between the protective cover shell 10 and the protective film 20, and more effectively prevent the molding material from entering the protective cavity 11 through the interface between the protective cover shell 10 and the protective film 20, further enhancing the isolation and protection capability of the selective molding protection structure 100 for the devices that do not need to be molded in the plastic-encapsulated devices 200.

[0050] The technical solution of the present invention uses a selective plastic encapsulation protection structure 100 composed of a protective cover shell 10 and a protective film 20 to isolate and protect the second device 203 (i.e., the device that does not need to be plastic encapsulated) in the plastic encapsulated device 200, so that when performing selective plastic encapsulation, a universal plastic encapsulation mold can be used for plastic encapsulation without using a special plastic encapsulation mold, and the cost of selective plastic encapsulation is relatively low. In addition, during the selective plastic encapsulation process, under the plastic encapsulation pressure, the protective cover shell 10 can be at least partially embedded in the protective film 20, so that a sealed interface can be formed between the protective cover shell 10 and the protective film 20, and the plastic encapsulation material can be more effectively blocked from entering the protective cavity 11 through the interface between the protective cover shell 10 and the protective film 20, further improving the isolation and protection capability of the selective plastic encapsulation protection structure 100 for the device that does not need to be plastic encapsulated in the plastic encapsulated device 200.

[0051] In addition, the specific size of the selective protection structure 100 can be designed according to the specific structure of the device 200 to be encapsulated, which has strong design flexibility and is conducive to design space optimization.

[0052] In some embodiments, the material of the protective film 20 is at least one of ethylene-tetrafluoroethylene copolymer and hexafluoropropylene-tetrafluoroethylene copolymer. Both ethylene-tetrafluoroethylene copolymer and hexafluoropropylene-tetrafluoroethylene copolymer have good flexibility. Under the pressure of plastic sealing, the protective film 20 made of the above materials is easy to deform so that the protective cover shell 10 can be at least partially embedded in the protective film 20, thereby effectively improving the isolation and protection ability of the selective plastic sealing protection structure 100 to the components that do not need plastic sealing in the plastic sealing components 200. At the same time, both ethylene-tetrafluoroethylene copolymer and hexafluoropropylene-tetrafluoroethylene copolymer also have good high temperature resistance, can withstand the high temperature during the plastic sealing process, and their isolation and protection capabilities can be effectively guaranteed.

[0053] In some embodiments, the Rockwell hardness of the protective cover shell 10 is greater than 80HR. The protective cover shell 10 has sufficient hardness to resist the pressure applied during the plastic packaging process, prevent itself from being deformed or damaged, and ensure that the protective cover shell 10 can still maintain the integrity and stability of the structure under the plastic packaging pressure, thereby effectively playing a good role in isolating and protecting the components that do not need plastic packaging. If the Rockwell hardness of the protective cover shell 10 is less than 80HR, it may be dented or cracked under the plastic packaging pressure, causing the plastic packaging material to enter the protective cavity 11 and then destroy the components that do not need plastic packaging. At the same time, the protective cover shell 10 has sufficient hardness to better cooperate with the protective film 20. When subjected to the plastic packaging pressure, the protective cover shell 10 is embedded in the protective film 20, and its hardness helps to maintain close contact and relative position relationship with the protective film 20, thereby ensuring that the protective film 20 can effectively block the plastic packaging material from entering the protective cavity 11. In addition, it also helps to improve the repeatability and stability of the selective plastic packaging process, so that each plastic packaging can achieve the expected plastic packaging effect, reduce product quality fluctuations caused by differences in the hardness of the protective cover shell 10, and thus improve the product qualification rate.

[0054] In some embodiments, the thickness of the connection between the protective film 20 and the protective cover shell 10 ranges from 0.1 mm to 0.2 mm (eg, 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, and any intermediate value between the two end points).

[0055] The present invention limits the thickness range of the connection between the protective film 20 and the protective cover shell 10 to 0.1mm-0.2mm, which can ensure that the protective film 20 and the protective cover shell 10 are tightly fitted during the plastic sealing process to form a good sealing interface, thereby effectively blocking the plastic sealing material from entering the interior of the protective cover shell 10. If the thickness is too thin, gaps may appear at the connection, causing the plastic sealing material to leak, and it is impossible to effectively protect the components that do not require plastic sealing; if the thickness is too thick, it may affect the embedding effect of the protective film 20 under pressure, and also reduce the sealing performance. At the same time, this thickness range helps the protective film 20 to have sufficient strength while maintaining a certain degree of flexibility, ensuring that it can function stably throughout the plastic sealing process.

[0056] In some embodiments, the tensile strength of the protective film 20 is greater than or equal to 35 MPa.

[0057] During the selective plastic encapsulation process, the protective film 20 is subjected to stress from all directions, including the tensile force generated by the embedding of the protective cover shell 10 and the impact force caused by the flow of the plastic encapsulation material. The present invention stipulates that the protective film 20 has a high tensile strength (≥35MPa), which can ensure that the protective film 20 does not break or over-stretch and deform under these complex stress environments, thereby maintaining the protective effect of the protective film 20 on the protective cover shell 10, and effectively preventing the plastic encapsulation material from entering the protective cavity 11.

[0058] In some embodiments, the elongation at break of the protective film 20 is greater than or equal to 200%.

[0059] During the molding process, when the protective cover shell 10 is subjected to the molding pressure and at least partially embedded in the protective film 20, the protective film 20 needs to produce a large deformation to accommodate the displacement of the protective cover shell 10. The present invention limits the elongation at break of the protective film 20 to be greater than or equal to 200%, which can ensure that the protective film 20 will not break due to excessive stretching during this process, thereby maintaining effective sealing and protection of the protective cover shell 10, and further effectively preventing the molding material from entering the protective cavity 11.

[0060] In some embodiments, the melting point of the protective film 20 is greater than or equal to 260°C.

[0061] During the plastic encapsulation process, higher temperatures are often generated, and the plastic encapsulation temperature is usually between 150°C and 250°C. The present invention limits the melting point of the protective film 20 to be greater than or equal to 260°C, and is able to withstand the temperature during the plastic encapsulation process, thereby achieving better isolation and protection for devices that do not require plastic encapsulation. If the melting point of the protective film 20 is too high, it will melt during the plastic encapsulation process, and thus the isolation and protection of devices that do not require plastic encapsulation cannot be achieved. At the same time, a higher melting point can also ensure that the protective film 20 maintains stable physical and chemical properties under the temperature conditions of the plastic encapsulation process, which helps to maintain the structural integrity and performance consistency of the protective film 20 throughout the plastic encapsulation process, so that each plastic encapsulation operation can obtain reliable results, reducing product quality differences caused by performance fluctuations of the protective film 20, thereby improving the stability and repeatability of the plastic encapsulation process, and facilitating quality control of large-scale production.

[0062] In some embodiments, the tolerable temperature of the protective film 20 is greater than or equal to 200° C.;

[0063] The present invention limits the tolerable temperature of the protective film 20 to be greater than or equal to 200°C, which can ensure that the protective film 20 maintains stable physical and chemical properties in a high temperature environment and will not become brittle, degraded or other performance deterioration phenomena due to high temperature, thereby continuously and effectively playing the role of blocking the plastic packaging material from entering the protective cavity 11 and ensuring the smooth progress of the selective plastic packaging operation.

[0064] In some embodiments, the modulus of the protective film 20 at 175° C. ranges from 15 MPa to 35 MPa (eg, 15 MPa, 20 MPa, 25 MPa, 30 MPa, 35 MPa, and intervals between any two end points).

[0065] The present invention limits the modulus range of the protective film 20 at 175°C to 15MPa-35MPa, so that the protective film 20 can maintain a certain rigidity to maintain its own shape and block the plastic packaging material, while having sufficient flexibility to adapt to the embedding and possible slight displacement of the protective cover shell 10. If the modulus is too high, the protective film 20 will be too rigid and may not be able to effectively deform when the protective cover shell 10 is embedded under pressure, resulting in sealing failure or rupture of the protective film 20; if the modulus is too low, the protective film 20 will be too soft and it will be difficult to stably block the entry of the plastic packaging material, and the selective plastic packaging effect cannot be guaranteed.

[0066] In some embodiments, the protective film 20 covers the opening of the protective cover shell 10. Therefore, after the protective film 20 is connected to the protective cover shell 10, it can be enclosed together with the substrate 201 to form a closed protective cavity 11, which can play a better role in isolating and protecting the device that does not need plastic packaging.

[0067] In some embodiments, the protective film 20 is connected and fixed to the open side of the protective cover shell 10 by adhesive, wherein the adhesive can be selected as a high temperature resistant adhesive, which can ensure the firmness of the connection between the protective film 20 and the protective cover shell 10 during the plastic sealing process, thereby ensuring a good isolation and protection effect. Of course, in some other embodiments, the protective film 20 and the protective cover shell 10 are connected by a snap-on method.

[0068] In some embodiments, please refer to Figure 2 ,in, Figure 2 (a) is a schematic diagram of the protective film 20 when viewed from above. Figure 2 (b) is a schematic diagram of the side view of the protective film 20. The surface of the protective film 20 facing the protective cover shell 10 is provided with an annular limiting groove 23, and the opening side of the protective cover shell 10 is clamped in the annular limiting groove 23.

[0069] Specifically, the shape of the annular limiting groove 23 is the same as that of the protective cover shell 10, and the width of the annular limiting groove 23 is adapted to the thickness of the side wall of the protective cover shell 10. Therefore, during assembly, the opening side of the protective cover shell 10 can be directly clamped and fixed in the annular limiting groove 23, and the annular limiting groove 23 can play a good limiting role on the protective cover shell 10, so that under the plastic sealing pressure, it is helpful for the protective cover shell 10 to be partially embedded in the protective film 20, ensuring the close fit between the protective cover shell 10 and the protective film 20, forming a good sealing interface, and then effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10. In this embodiment, the annular limiting groove 23 can be directly opened on one surface of the protective film 20, and the operation is relatively simple.

[0070] In this embodiment, the thickness of the connection between the protective film 20 and the protective cover shell 10 (i.e., the distance from the bottom wall of the annular limiting groove 23 to the other surface of the protective film 20) ranges from 0.1mm to 0.2mm (e.g., 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, and the intermediate value between any two end points). The depth of the annular limiting groove 23 is 0.15mm to 0.25mm (e.g., 0.15mm, 0.18mm, 0.2mm, 0.22mm, 0.25mm, and the intermediate value between any two end points). The width of the annular limiting groove 23 is 0.2mm to 0.3mm (e.g., 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm, and the intermediate value between any two end points), and the side wall thickness of the protective cover shell 10 is 0.5mm smaller than the width of the annular limiting groove 23. The above-mentioned size limitation can more effectively ensure that the protective film 20 and the protective cover shell 10 are closely fitted during the plastic sealing process to form a good sealing interface, thereby more effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10.

[0071] Of course, in order to further strengthen the connection firmness between the protective cover shell 10 and the protective film 20, adhesive is also filled between the protective cover shell 10 and the limiting groove.

[0072] In some embodiments, please refer to Figure 3 ,in, Figure 3 (a) is a schematic diagram of the protective film 20 when viewed from above. Figure 3 (b) is a schematic diagram of the side view of the protective membrane 20. The protective membrane 20 includes a membrane body 21 and an annular stopper 22. The annular stopper 22 is arranged on the surface of the membrane body 21 facing the protective cover shell 10. The stopper is provided with an annular stopper groove 23 that exposes part of the surface of the membrane body 21. The opening side of the protective cover shell 10 is clamped in the annular stopper groove 23 and abuts against the membrane body 21.

[0073] The difference between this embodiment and the above-mentioned embodiment is that the protective film 20 adopts a split structure, that is, it includes a connected film body 21 and an annular stopper 22, and the annular stopper 22 is provided with an annular stopper groove 23 that runs through its two opposite surfaces, so that the opening of the protective cover shell 10 is clamped and fixed in the annular stopper groove 23 and abuts against the film body 21. The film body 21 used in this embodiment is relatively thin, and the material cost is relatively low, wherein the annular stopper 22 can be made of other plastics, which can reduce the cost to a certain extent. Optionally, the annular stopper 22 and the film body 21 are made into an integrated structure by a mold, and the connection between the two is relatively firm.

[0074] During assembly of this embodiment, the open side of the protective cover shell 10 can be directly clamped and fixed in the annular limiting groove 23, and the annular limiting groove 23 can play a good limiting role for the protective cover shell 10, which helps the protective cover shell 10 to be partially embedded in the protective film 20 under the plastic packaging pressure, ensuring the close fit between the protective cover shell 10 and the protective film 20, forming a good sealing interface, and effectively blocking the plastic packaging material from entering the interior of the protective cover shell 10.

[0075] In this embodiment, the thickness of the connection between the protective film 20 and the protective cover shell 10 (i.e., the thickness of the film body 21) ranges from 0.1mm to 0.2mm (e.g., 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, and the intermediate value between any two end points). The depth of the annular limiting groove 23 (i.e., the thickness of the annular limiting member) ranges from 0.15mm to 0.25mm (e.g., 0.15mm, 0.18mm, 0.2mm, 0.22mm, 0.25mm, and the intermediate value between any two end points). The width of the annular limiting groove 23 ranges from 0.2mm to 0.3mm (e.g., 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm, and the intermediate value between any two end points), and the side wall thickness of the protective cover shell 10 is 0.5mm smaller than the width of the annular limiting groove 23. The above-mentioned size limitation can more effectively ensure that the protective film 20 and the protective cover shell 10 are closely fitted during the plastic sealing process to form a good sealing interface, thereby more effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10.

[0076] In some embodiments, please refer to Figure 4 ,in, Figure 4 (a) is a schematic diagram of the protective film 20 when viewed from above. Figure 4 (b) is a schematic diagram of the side view of the protective film 20. The protective film 20 includes a film body 21 and a limiting protrusion 24 protruding from the surface of the film body 21, and the limiting protrusion 24 is clamped in the opening of the protective cover shell 10.

[0077] In this embodiment, the size of the limiting protrusion 24 is adapted to the opening size of the protective cover shell 10, so that when assembled, the limiting protrusion 24 is snap-fitted and fixed in the opening of the protective cover shell 10, so that the connection between the protective cover shell 10 and the protective film 20 can be achieved. The membrane body 21 used in this embodiment is relatively thin, and the material cost is relatively low. Among them, the limiting protrusion 24 can be made of other plastics, which can reduce the cost to a certain extent. Optionally, the annular limiting member 22 and the membrane body 21 are made into an integral structure by a mold, and the connection between the two is relatively firm.

[0078] During assembly of this embodiment, the limiting protrusion 24 of the protective film 20 can be directly snap-fitted and fixed in the opening of the protective cover shell 10, and the limiting protrusion 24 can play a good limiting role on the protective cover shell 10, which helps the protective cover shell 10 to be partially embedded in the protective film 20 under the plastic packaging pressure, ensuring a close fit between the protective cover shell 10 and the protective film 20, forming a good sealing interface, and effectively blocking the plastic packaging material from entering the interior of the protective cover shell 10.

[0079] In this embodiment, the thickness of the connection between the protective film 20 and the protective cover shell 10 (i.e., the thickness of the membrane body 21) ranges from 0.1mm to 0.2mm (e.g., 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, and the intermediate value between any two endpoints). The thickness of the limiting protrusion 24 is 0.2mm-0.5mm (e.g., 0.2mm, 0.3mm, 0.4mm, 0.5mm, and the intermediate value between any two endpoints). The distance between the side of the limiting protrusion 24 and the corresponding edge of the membrane body 21 is 0.15mm-0.25mm (e.g., 0.15mm, 0.18mm, 0.2mm, 0.22mm, 0.25mm, and the intermediate value between any two endpoints), and the opening of the protective cover shell 10 is 0.5mm larger than the radial dimension of the limiting protrusion 24. The above-mentioned size limitation can more effectively ensure that the protective film 20 and the protective cover shell 10 are closely fitted during the plastic sealing process to form a good sealing interface, thereby more effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10.

[0080] In some embodiments, please refer to Figure 5 ,in, Figure 5 (a) is a schematic diagram of the top view of the protective film 20, Figure 5 (b) is a schematic diagram of the side view of the protective film 20. The protective film 20 is an annular structure, and an annular limiting groove 23 is formed on the surface of the protective film 20 facing the protective cover shell 10, and the opening side of the protective cover shell 10 is clamped in the annular limiting groove 23.

[0081] In this embodiment, the protective film 20 is an annular structure, and its specific shape is the same as that of the protective cover shell 10. The protective film 20 is a hollow structure, and an annular limiting groove 23 is formed on its surface facing the protective cover shell 10. The shape of the annular limiting groove 23 is the same as that of the protective cover shell 10, and the width of the annular limiting groove 23 is adapted to the thickness of the side wall of the protective cover shell 10. During assembly, the opening side of the protective cover shell 10 can be directly clamped and fixed in the annular limiting groove 23, and the annular limiting groove 23 can play a good limiting role on the protective cover shell 10.

[0082] In this embodiment, the protective film 20 covers part of the opening (i.e., the periphery of the opening) of the protective cover shell 10, and is suitable for a selective plastic sealing process in which the height of the subsequent plastic sealing layer 204 does not exceed the height of the protective structure 100. Optionally, the height of the subsequent plastic sealing layer 204 is the same as the height of the protective structure 100. This helps the protective cover shell 10 to be partially embedded in the protective film 20 under the plastic sealing pressure, ensuring a close fit between the protective cover shell 10 and the protective film 20, forming a good sealing interface, and then effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10 through the interface between the protective cover shell 10 and the protective film 20, thereby improving its isolation and protection effect.

[0083] In this embodiment, the dimension (i.e., width) of the protective film 20 in a direction parallel to the substrate 201 is 0.4 mm-0.5 mm (e.g., 0.4 mm, 0.42 mm, 0.45 mm, 0.48 mm, 0.5 mm, and any intermediate value between the two end points). The thickness of the connection between the protective film 20 and the protective cover shell 10 (i.e., the distance from the bottom wall of the annular limiting groove 23 to the other surface of the protective film 20) ranges from 0.1 mm to 0.2 mm (e.g., 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, and any intermediate value between the two end points). The depth of the annular limiting groove 23 is 0.15 mm-0.25 mm (e.g., 0.15 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.25 mm, and any intermediate value between the two end points). The width of the annular limiting groove 23 is 0.2mm-0.3mm (such as 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm and the intermediate value between any two end points), and the side wall thickness of the protective cover shell 10 is 0.5mm smaller than the width of the annular limiting groove 23. The above-mentioned size limitation can more effectively ensure that the protective film 20 and the protective cover shell 10 are closely fitted during the plastic sealing process to form a good sealing interface, thereby more effectively preventing the plastic sealing material from entering the interior of the protective cover shell 10 through the interface between the protective cover shell 10 and the protective film 20, thereby improving its isolation and protection effect.

[0084] See also Figure 6 The present invention also provides a selective plastic packaging method, comprising the following steps:

[0085] Step S10, providing a substrate 201 and the selectively encapsulated protective structure 100 as described above

[0086] Step S20, mounting electronic components on a surface of the substrate 201, wherein the electronic components include a first component 202 that needs to be plastic-encapsulated and a second component 203 that does not need to be plastic-encapsulated;

[0087] Step S30, mounting the selective plastic encapsulation protection structure 100 on the substrate 201 at the periphery of the second device 203, so that the second device 203 is located in the protection cavity 11 of the selective plastic encapsulation protection structure 100;

[0088] Step S40, performing plastic sealing on the plastic sealing area, so that the plastic sealing material covers the first device 202 and forms a plastic sealing layer 204, and the side wall of the plastic sealing layer 204 is in contact with the side wall of the selective plastic sealing protection structure 100;

[0089] Step S50 , removing the protective film 20 of the selectively molded protective structure 100 .

[0090] Specifically, before the molding operation, the selective molding protection structure 100 is mounted on the non-molding area of ​​the substrate 201, so that the second device 203 located in the non-molding area is located in the protection cavity 11 of the selective molding protection structure 100, and then the molding area is molded, and the molding layer 204 after molding wraps the first device 202 located in the molding area, and the side wall of the molding layer 204 is in contact with the side wall of the selective molding protection structure 100. Since the selective molding protection structure 100 is used to isolate and protect the second device 203 located in the non-molding area that does not need to be molded before molding, the universal molding mold 300 can be used for molding without using a special molding mold, and the cost of selective molding is relatively low. Furthermore, during the selective molding process, under the molding pressure, the protective cover shell 10 in the selective molding protection structure 100 can be at least partially embedded in the protective film 20, so that a sealed interface can be formed between the protective cover shell 10 and the protective film 20, and the molding material can be more effectively blocked from entering the protective cavity 11 through the interface between the protective cover shell 10 and the protective film 20, further improving the isolation and protection capability of the selective molding protection structure 100 for the components that do not need to be molded in the molding components 200. After the molding is completed, the protective film 20 of the selective molding protection structure 100 can be removed.

[0091] The selective encapsulation process of the present invention is simple to operate, simplifies the process flow, and reduces the cost of selective encapsulation. In addition, the specific size of the selective protection structure 100 can be designed according to the specific structure of the device 200 to be encapsulated, which has strong design flexibility and is conducive to design space optimization.

[0092] It should be noted that the specific structure of the selective plastic packaging structure refers to the above embodiment. Since the present selective plastic packaging method adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0093] In some embodiments, the distance between the protective cover 10 of the selectively molded protective structure 100 and the electronic components around the protective cover 10 is greater than 0.1 mm.

[0094] In the present invention, the specific size of the protective cover shell 10 is first determined according to the size of the device that does not need to be plastic-sealed (i.e., the second device 203) and the distribution of the surrounding devices, ensuring that the distance between the protective cover shell 10 and the electronic components around the protective cover shell 10 (including the internal second device 203 and the external peripheral first device 202) is greater than 0.1 mm. This design can avoid short circuits in the electrical connections between the electronic components during operation, thereby ensuring the normal operation of the device. At the same time, it can also avoid interference with the surrounding electronic components during installation of the protective cover shell 10, ensuring the stability and reliability of the electronic components. In addition, it is also beneficial to heat dissipation and facilitates plastic sealing operations.

[0095] In some embodiments, the height of the plastic encapsulation layer 204 is the same as the height of the sidewall of the selectively plastic encapsulated protection structure 100. Therefore, no special mold is needed for plastic encapsulation, and a universal mold can be used for plastic encapsulation, saving mold costs.

[0096] The present invention further provides a selective plastic packaging module, which is a selective plastic packaging module manufactured by the selective plastic packaging method described above.

[0097] Please refer again Figure 6 The selective molding module of the present invention includes a substrate 201, a first device 202, a second device 203, a protective cover shell 10 and a molding layer 204 arranged on the surface of the substrate 201, wherein the first device 202 is located in the molding area, the second device 203 is located in the non-molding area, the protective cover shell 10 is located outside the second device 203, the molding layer 204 covers the first device 202, and the side wall of the molding layer 204 is in contact with the outer wall of the protective cover shell 10.

[0098] The present invention also provides an electronic product, which includes the selective plastic encapsulation module as described above. The specific structure of the selective plastic encapsulation module refers to the above embodiment. Since the electronic product adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the electronic product includes but is not limited to mobile phones, headphones, watches, etc.

[0099] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A selective plastic sealing protection structure, characterized in that: include: A protective cover shell, the protective cover shell having a protective cavity and two opposite openings communicating with the protective cavity, wherein one opening of the protective cover shell is used to be mounted on a substrate of a device to be encapsulated and to allow a device of the device to be encapsulated that does not need to be encapsulated to be located in the protective cavity; A protective film connected to the other side opening of the protective cover shell; The protective cover shell can be at least partially embedded in the protective film under the molding pressure, so that a sealing interface is formed between the protective cover shell and the protective film.

2. The selective plastic sealing protection structure according to claim 1, characterized in that: The material of the protective film is at least one of ethylene-tetrafluoroethylene copolymer and hexafluoropropylene-tetrafluoroethylene copolymer; and / or, The Rockwell hardness of the protective cover shell is greater than 80HR.

3. The selective plastic sealing protection structure according to claim 1, characterized in that: The protective film meets at least one of the following conditions: The thickness of the connection between the protective film and the protective cover shell ranges from 0.1mm to 0.2mm; The tensile strength of the protective film is greater than or equal to 35 MPa; The elongation at break of the protective film is greater than or equal to 200%; The melting point of the protective film is greater than or equal to 260°C; The tolerable temperature of the protective film is greater than or equal to 200°C; The protective film has a modulus range of 15 MPa to 35 MPa at 175°C.

4. The selective plastic sealing protection structure according to any one of claims 1 to 3, characterized in that: The protective film covers the opening of the protective cover shell.

5. The selective plastic sealing protection structure according to claim 4, characterized in that: The surface of the protective film facing the protective cover shell is provided with an annular limiting groove, and the opening side of the protective cover shell is clamped in the annular limiting groove; or, The protective membrane comprises a membrane body and an annular stopper, wherein the annular stopper is arranged on the surface of the membrane body facing the protective cover shell, the stopper is provided with an annular stopper groove exposing a part of the surface of the membrane body, and the opening side of the protective cover shell is clamped in the annular stopper groove and abuts against the membrane body; or, The protective film comprises a film body and a limiting protrusion convexly arranged on the surface of the film body, and the limiting protrusion is clamped in the opening of the protective cover shell.

6. The selective plastic sealing protection structure according to any one of claims 1 to 3, characterized in that: The protective film is an annular structure, and an annular limiting groove is formed on the surface of the protective film facing the protective cover shell, and the opening side of the protective cover shell is clamped in the annular limiting groove.

7. A selective plastic encapsulation method, characterized in that: The following steps are involved: Provide a substrate and a selective plastic encapsulation protection structure as described in any one of claims 1 to 6; Mounting electronic components on a surface of the substrate, wherein the electronic components include a first component that needs to be plastic-encapsulated and a second component that does not need to be plastic-encapsulated; Mounting the selective plastic encapsulation protection structure on the substrate at the periphery of the second device so that the second device is located in the protection cavity of the selective plastic encapsulation protection structure; Plastic-sealing the plastic-sealed area so that the plastic-sealed material covers the first device and forms a plastic-sealed layer, and the sidewall of the plastic-sealed layer is in contact with the sidewall of the selective plastic-sealed protective structure; The protective film of the selectively molded protective structure is removed.

8. The selective plastic encapsulation method according to claim 7, characterized in that: The distance between the protective cover of the selectively encapsulated protective structure and the electronic components around the protective cover is greater than 0.1 mm; and / or, The height of the plastic encapsulation layer is the same as the height of the side wall of the selective plastic encapsulation protection structure.

9. A selective plastic encapsulation module, characterized in that: The selective plastic encapsulation module is a selective plastic encapsulation module manufactured by the selective plastic encapsulation method described in any one of claims 7 to 8.

10. An electronic product, characterized in that: The electronic product comprises the selective plastic packaging module as claimed in claim 9.

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