Automatic assembling equipment for CMP (chemical mechanical polishing) pad dresser with planarized tip

Abstract

The invention discloses automatic assembling equipment for a CMP (chemical mechanical polishing) pad trimmer with a planarized tip. The automatic assembling equipment comprises a rack, a large disc feeding module, a small ingot feeding module and a pressurizer bearing module are arranged on the side portion of the machine frame. The large disc feeding module and the small ingot feeding module are used for conveying large discs and small ingots to designated positions to wait for being grabbed correspondingly. The pressurizer bearing module is provided with a pressurizer capable of being grabbed, and the pressurizer is provided with a set of pressing heads corresponding to assembly holes in the large disc. A gluing module is arranged on the rack; the gluing module comprises a first operation platform and a datum plate arranged on the first operation platform; the gluing module further comprises a material moving and gluing device. The special working modules are arranged, all the working modules work cooperatively and are used for automatically installing small ingots with diamond particles distributed on the surfaces into the assembling holes of the large disc to obtain the CMP polishing pad trimmer with the planarized tips, and the production efficiency and the product quality of the CMP polishing pad trimmer are effectively improved.

Description

Technical Field

[0001] The present invention relates to a production device for a polishing pad truing device used in wafer chemical mechanical polishing, and particularly relates to an automatic assembly device for a CMP polishing pad truing device with a planarized tip. Background Art

[0002] Chemical mechanical polishing technology (CMP) is a key process for obtaining a globally planarized surface of a semiconductor wafer during chip manufacturing. In order to meet the requirements of mass production of wafer processing and maintain the stability of quality, during chemical mechanical polishing, a truing device is needed to true the polishing pad. When the CMP polishing pad truing device works, the more the number of tip points that can penetrate into the polishing pad, the better the truing effect, which requires that the height difference of the diamond particle tips on the polishing pad truing device is not too large. In addition, if the height difference of the diamond particle tips is too large, it is also easy to cause damage to the CMP polishing pad by individual protruding diamond particles. Therefore, it is necessary to make the CMP polishing pad truing device have a planarized tip.

[0003] Patent document CN 116494130 A discloses a diamond truing device, which includes a large plate and a group of small ingots arranged on the large plate, and diamond particles are arranged on the small ingots. During manufacturing, after diamond drilling of the small ingots is completed, the large plate is placed on a reference plane, and then the diamond drilling surface of the small ingot is placed face down into the corresponding assembly holes on the large plate, and the large plate is lifted and padded, and epoxy resin is injected into the through holes and cured to form the diamond truing device. This diamond truing device has the advantage of good height consistency of diamond tips, and its diamond drilling surface has a planarized tip. However, the process of installing the small ingots onto the large plate currently can only be completed manually due to the lack of professional automated equipment, which not only has low work efficiency but also is difficult to control the quality, resulting in both the output and quality not meeting the commercial requirements. Therefore, it is necessary to develop an automated assembly device for automatically installing small ingots with diamond particles on the surface onto a large plate to form a CMP polishing pad truing device with a planarized tip. Summary of the Invention

[0004] The present invention provides an automatic assembly device for a CMP polishing pad truing device with a planarized tip, which is used to install the diamond-drilled small ingots into the assembly holes of the large plate. The automatic assembly device for a CMP polishing pad truing device with a planarized tip of the present invention obtains a CMP polishing pad truing device with a planarized tip by setting specific working modules, and the working modules cooperate with each other to automatically install small ingots with diamond particles on the surface into the assembly holes of the large plate, effectively improving the production efficiency and product quality of the CMP polishing pad truing device.

[0005] The technical solution of the present invention is as follows:

[0006] Automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, comprising a frame; a large plate loading module, a small ingot loading module and a pressure applicator placement module are provided on the side of the frame; the large plate loading module and the small ingot loading module are respectively used to convey the large plate and the small ingot to designated positions for being grabbed; a pressure applicator that can be grabbed is provided on the pressure applicator placement module, and a set of pressure heads corresponding to the assembly holes on the large plate are provided on the pressure applicator; a glue coating module is provided on the frame; the glue coating module includes a first operation platform and a reference plate provided on the first operation platform; the upper surface of the reference plate is a reference plane, and a set of pad platforms for raising the large plate are provided on the reference plane; the glue coating module further includes a material transfer and glue coating device. During operation, the material transfer and glue coating device first grabs the large plate and places it on the reference plate, then grabs the small ingot and places it in the assembly hole on the large plate, and then coats glue in the gap between the small ingot and the large plate to form a truing device; after the glue coating is completed, the material transfer and glue coating device grabs the pressure applicator and places it on the truing device, uses the pressure heads of the pressure applicator to press the small ingot, and after the glue liquid is cured, the material transfer and glue coating device removes the pressure applicator from the truing device and places it back on the pressure applicator placement module, and then grabs the truing device and places it at the designated glue coating unloading station.

[0007] The automatic assembly equipment for the CMP polishing pad truing device of the present invention has a large plate loading module, a small ingot loading module, a pressure applicator placement module and a glue coating module that work in coordination. The large plate loading module and the small ingot loading module are respectively used to convey the large plate and the small ingot to designated positions for being grabbed. A pressure applicator that can be grabbed is provided in the pressure applicator placement module. During operation, the material transfer and glue coating device in the glue coating module grabs the large plate from the large plate loading module and places it on the reference plate, then grabs the small ingot from the small ingot loading module and places it in the assembly hole of the large plate, and coats glue liquid in the gap between the small ingot and the large plate. Then, it grabs the pressure applicator from the pressure applicator placement module and presses it on the small ingot. After the glue liquid is cured, the pressure applicator is placed back on the pressure applicator placement module, and then the prepared CMP polishing pad truing device is transported to the designated unloading station, realizing the automatic installation of the small ingot with diamond particles on its surface into the assembly holes of the large plate, and the assembly process is not affected by human factors, improving the production efficiency and product quality of the CMP polishing pad truing device.

[0008] Further, in the automatic assembly equipment for the CMP polishing pad truing device with a flattened tip described above, the large plate loading module and the small ingot loading module are belt conveyors with material in-place sensors provided at the conveying ends; during the loading process of the large plate and the small ingot, after the material in-place sensors detect the materials, the corresponding belt conveyors stop, and after the materials at the conveying ends are grabbed, the belt conveyors restart. The large plate loading module and the small ingot loading module adopt belt conveyors and are configured with material in-place sensors at the conveying ends, which can meet the loading requirements of the large plate and the small ingot, and have high reliability and are easy to implement.

[0009] Further, in the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, the presser holder module is a belt conveyor that can run in reverse and is equipped with a material in-place sensor at the conveying end; a set of pressers is placed on the conveyor belt of the presser holder module. Correspondingly, a set of reference plates with the same quantity is provided in groups on the first operation platform; during operation, each time the material transfer and gluing device fabricates a truing device, it grabs a presser from the end of the belt conveyor until all the pressers are grabbed and used; after the glue has cured, the material transfer and gluing device places the pressers back at the end of the belt conveyor one by one for recycling; during the process of recycling the pressers, after the material in-place sensor detects a presser, the belt conveyor starts to run in reverse, conveying the presser backward for a certain distance to vacate the position at the conveying end for receiving the next presser; when receiving the last presser, the belt conveyor does not start. With the above arrangement, a batch of truing devices can be fabricated on the first operation platform. After fabricating one truing device, the next one can be fabricated immediately, avoiding the idleness of the material transfer and gluing device due to waiting for the glue to cure, thereby further improving production efficiency. In addition, the presser holder module adopts a belt conveyor that can run in reverse and is equipped with a material in-place sensor at the conveying end, which is easy to implement and highly reliable while meeting the functional requirements.

[0010] Further, in the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, the material transfer and gluing device includes a three-axis slide table. A gluing assembly, a material grabbing assembly, and a visual positioning assembly are provided on the Z-axis of the three-axis slide table; the gluing assembly is used to mix the base glue and the curing agent in a set ratio and then quantitatively apply it to the gap between the small ingot and the large plate; the material grabbing assembly includes a large vacuum suction cup and a small vacuum suction cup; the large vacuum suction cup is used to grab the large plate and the presser, and the small vacuum suction cup is used to grab the small ingot; the large vacuum suction cup is connected to the Z-axis of the three-axis slide table through an electric turntable; the visual positioning assembly includes an industrial camera and a light source; during operation, the circumferential postures of the large plate and the presser are determined according to the visual positioning information; after the material grabbing assembly grabs the presser from the presser holder module, the electric turntable adjusts the circumferential posture of the presser to correspond to that of the large plate, enabling the pressing head to align with the assembly hole on the large plate. With the above arrangement of the material transfer and gluing device, during operation, the camera is used to position the material to be grabbed, and the circumferential posture can be adjusted by the electric turntable. Therefore, there are no precise position requirements for the large plate, small ingot, and presser to be grabbed, and there is no need to regulate the circumferential posture, avoiding problems that affect automatic operation due to inaccurate material position or circumferential posture. The equipment is easy to use and highly reliable.

[0011] Furthermore, in the aforementioned automatic assembly equipment for a CMP polishing pad truing tool with a flattened tip, the gluing module further includes a tablet stacking tooling; the tablet stacking tooling is provided with notches for stacking tablets; after gluing, the material transfer and gluing device first grabs a tablet from the notch of the tablet stacking tooling, places it in the assembly hole of the large plate, and then grabs a pressure applicator from the pressure applicator placing module to apply pressure to the small ingot. Thus, the pressure head of the pressure applicator acts on the tablet instead of directly on the small ingot, making the force on the small ingot more uniform, avoiding slight displacement of the small ingot caused by uneven force, thereby improving the assembly accuracy and being beneficial to improving the product quality.

[0012] Furthermore, in the aforementioned automatic assembly equipment for a CMP polishing pad truing tool with a flattened tip, a glue replenishing module is provided on the frame; the glue replenishing module includes a first blanking device, a second operation platform, a material transfer and glue replenishing device, and a first turning device; the first blanking device has a glue application blanking station for receiving the truing tool and conveying it to a specified position for being grabbed; the first turning device is used to turn over the truing tool on the first blanking device; the material transfer and glue replenishing device is used to transport the truing tool turned over on the first blanking device to the second operation platform and replenish glue to the gap between the small ingot and the large plate; after the glue replenishment is completed, the material transfer and glue replenishing device transports the truing tool to the specified glue replenishing blanking station. Thus, after gluing, the glue replenishing module turns over the truing tool and replenishes glue to the gap between the small ingot and the large plate, improving the bonding strength between the small ingot and the large plate. With the above settings of the glue replenishing module, it is easy to implement and has high reliability.

[0013] Furthermore, the first blanking device is a belt conveyor, and two sets of material in-place sensors are arranged one after another at the conveying end of the belt conveyor; corresponding to the first set of material in-place sensors, the first turning device is arranged on the side of the belt conveyor. When the material in-place sensor detects the truing tool, the belt conveyor stops, the first turning device grabs the truing tool, turns it over and then puts it back, and then the belt conveyor restarts; when the second set of material in-place sensors detects the truing tool, the belt conveyor stops waiting for the truing tool to be grabbed by the material transfer and glue replenishing device. With the above design of the first blanking device, it is easy to implement, has high reliability, and is beneficial to the compact structure of the whole machine.

[0014] Furthermore, in the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, a sealant module is provided on the frame; the sealant module includes a second blanking device, a third operation platform, a material transfer and sealant device, and a second turning device; the second blanking device has a glue replenishment blanking station for receiving the truing device and conveying it to a designated position for being grabbed; the second turning device is used to turn over the truing device on the second blanking device; the material transfer and sealant device is used to carry the truing device that has been turned over on the second blanking device to the third operation platform and seal the assembly holes of the large plate; after the sealing is completed, the material transfer and sealant device carries the truing device to a designated sealant blanking station. Thus, after the glue replenishment, the sealant module seals the assembly holes of the large plate (i.e., makes the glue liquid cover the entire assembly hole). After the sealing, the bonding strength between the small ingot and the large plate is further improved, and the non-woven drilling surface of the truing device is also more beautiful, which is conducive to industrial promotion.

[0015] Furthermore, the second blanking device is a belt conveyor, and two sets of material in-place sensors are provided one after another at the conveying end of the belt conveyor; corresponding to the first set of material in-place sensors, the second turning device is arranged on the side of the belt conveyor. When the material in-place sensor detects the truing device, the belt conveyor stops, and the second turning device grabs the truing device, turns it over and then puts it back, and then the belt conveyor restarts; when the second set of material in-place sensors detects the truing device, the belt conveyor stops waiting for the truing device to be grabbed by the material transfer and sealant device. With the above design of the second blanking device, it is easy to implement, has high reliability, and is conducive to the compact structure of the whole machine.

[0016] The aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip further includes a drying module provided on one side of the frame; the drying module includes an oven and a belt conveyor passing through the oven, and the starting end of the belt conveyor has a sealant blanking station. By setting up the drying module, the curing of the glue liquid can be accelerated, and the truing device can be packaged after passing through the drying device.

[0017] In the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, the first turning device includes a fixed telescopic cylinder, a finger cylinder connected to the telescopic cylinder, and a clamping jaw arranged on the finger cylinder; the structure of the second turning device is the same as that of the first turning device. With the above structural design of the turning device, it is easy to implement and has high reliability.

[0018] In the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, the first operating platform, the second operating platform, and the third operating platform are constant-temperature heating tables. Thus, during the working process, the materials can be heated to accelerate the curing of the glue, which is beneficial to improving production efficiency. Moreover, by using constant-temperature heating tables, the production environment is kept uniform, and the products are not affected by thermal expansion and contraction, ensuring a high degree of consistency among products of different batches.

[0019] In the aforementioned automatic assembly equipment for a CMP polishing pad truing device with a flattened tip, the material transfer and glue replenishment device has the same structure as the material transfer and glue coating device except for the absence of small vacuum suction cups; the material transfer and glue sealing device has the same structure as the material transfer and glue replenishment device except that the diameter of the glue coating needle is larger. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of the automatic assembly equipment for a CMP polishing pad truing device with a flattened tip according to an embodiment of the present invention;

[0021] Figure 2 is a top view of the automatic assembly equipment for a CMP polishing pad truing device with a flattened tip according to an embodiment of the present invention;

[0022] Figure 3 is Figure 2 a partial enlarged view of the middle view;

[0023] Figure 4 is a schematic structural diagram of the pressurizer according to an embodiment of the present invention;

[0024] Figure 5 is a schematic structural diagram of the reference plate according to an embodiment of the present invention;

[0025] Figure 6 is a top view of the tablet stacking tooling according to an embodiment of the present invention;

[0026] Figure 7 is a schematic structural diagram (orthographic projection) of the material transfer and glue coating device according to an embodiment of the present invention;

[0027] Figure 8 is a schematic structural diagram of the glue coating assembly, the material grabbing assembly, and the visual positioning assembly according to an embodiment of the present invention.

[0028] Figure markings: 1-frame; 2-large plate loading module; 3-small ingot loading module; 4-pressurizer holding module; 5-first operating platform; 6-reference plate, 601-reference plane, 602-raising platform; 7-large plate; 8-small ingot; 9-material moving and gluing device, 901-three-axis slide, 902-large vacuum suction cup, 903-small vacuum suction cup, 904-electric turntable, 905-industrial camera, 906-light source, 907-AB glue dispenser; 10-pressurizer, 1001-pressing head; 11-tablet stacking tooling; 12-tablet; 13-first unloading device; 14-second operating platform; 15-material moving and glue filling device; 16-first turning device; 17-second unloading device; 18 third operating platform; 19-material moving and glue sealing device; 20-second turning device; 21-oven. DETAILED DESCRIPTION

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments, but is not intended to be limiting of the present invention. The contents not described in detail in the following embodiments are all common technical knowledge in the art.

[0030] Example:

[0031] See also Figure 1 The automatic assembly equipment of the CMP polishing pad dresser with flattened tip in this embodiment comprises a frame 1; a large plate loading module 2, a small ingot loading module 3 and a pressurizer receiving module 4 are provided on the side of the frame 1; the large plate loading module 2 and the small ingot loading module 3 are respectively used to transport the large plate 7 and the small ingot 8 to the designated position to wait for being grasped; the pressurizer receiving module 4 has a pressurizer 10 that can be grasped, and the pressurizer 10 is provided with a group of pressure heads 1001 corresponding to the assembly holes on the large plate 7; a glue coating module is provided on the frame 1; the glue coating module comprises a first operating platform 5 and a reference plate 6 provided on the first operating platform 5; the upper surface of the reference plate 6 is a reference plane 6 01, a group of raising platforms 602 for raising the large plate 7 is provided on the reference plane 601; the gluing module also includes a material moving and gluing device 9. When working, the material moving and gluing device 9 first grabs the large plate 7 and places it on the reference plate 6, then grabs the small ingot 8 and places it in the assembly hole on the large plate 7, and then glues the gap between the small ingot 8 and the large plate 7 to form a trimmer; after the gluing is completed, the material moving and gluing device 9 grabs the pressurizer 10 and places it on the trimmer, and uses the pressure head 1001 of the pressurizer 10 to press the small ingot 8. After the glue liquid is solidified, the material moving and gluing device 9 removes the pressurizer 10 from the trimmer and puts it back to the pressurizer holding module 4, and then grabs the trimmer and puts it into the designated gluing unloading station. Among them, the first operating platform 5 is a constant temperature operating table. The constant temperature operating table ensures that the working environment is always uniform and will not be affected by the room temperature. The product consistency is good. In addition, using a constant temperature workbench for heating can accelerate the curing of the glue and improve work efficiency.

[0032] In the embodiment, the large-disk feeding module 2 and the small-ingot feeding module 3 are belt conveyors with material-in-place sensors provided at the conveying ends; during the feeding processes of the large disk 7 and the small ingot 8, after the material-in-place sensors detect the materials, the corresponding belt conveyors stop running. After the materials at the conveying ends are grabbed, the belt conveyors restart. During operation, after the materials (the large disk 7 and the small ingot 8) are grabbed, the corresponding belt conveyors start and convey the next material to the end for being grabbed. Among them, the material-in-place sensors are photoelectric sensors.

[0033] In the embodiment, the press bearing module 4 is a belt conveyor that can run reversely and is provided with a material-in-place sensor at the conveying end; a group of presses 10 are placed on the conveyor belt of the press bearing module 4. Correspondingly, a group of reference plates 6 with the same quantity are provided on the first operation platform 5 in groups; during operation, every time the material transferring and gluing device 9 manufactures a trimmer, it grabs a press 10 from the end of the belt conveyor until all the presses 10 are grabbed and used; after the glue liquid is cured, the material transferring and gluing device 9 puts the presses 10 back to the end of the belt conveyor one by one for recycling; during the process of recycling the presses 10, after the material-in-place sensors detect the presses 10, the belt conveyor starts to run reversely and conveys the presses 10 backward for a certain distance to vacate the position at the conveying end for receiving the next press 10; when receiving the last press 10, the belt conveyor does not start. Thus, during the working process, the presses 10 are repeatedly taken and put back on the conveyor belt in batches, which is beneficial to improving the production efficiency, easy to implement, and has high reliability.

[0034] In an embodiment, the material transfer and glue application device 9 includes a three-axis slide 901. A glue application assembly, a material grasping assembly, and a vision positioning assembly are provided on the Z-axis of the three-axis slide 901. The glue application assembly is used to mix the base glue and the curing agent in a set ratio and then quantitatively apply the mixture into the gap between the small ingot 8 and the large plate 7 (the glue application assembly is an AB dispenser 907 purchased from the market). The material grasping assembly includes a large vacuum chuck 902 and a small vacuum chuck 903. The large vacuum chuck 902 is used to grasp the large plate 7 and the pressure applicator 10, and the small vacuum chuck 903 is used to grasp the small ingot 8. The large vacuum chuck 902 is connected to the Z-axis of the three-axis slide 901 through an electric turntable 904. The vision positioning assembly includes an industrial camera 905 and a light source 906. During operation, the circumferential postures of the large plate 7 and the pressure applicator 10 are determined according to the vision positioning information. After the material grasping assembly grasps the pressure applicator 10 from the pressure applicator placing module 4, it moves above the large plate 7, and the electric turntable 904 adjusts the circumferential posture of the pressure applicator 10 to correspond to the large plate 7, so that the pressing head 1001 is aligned with the assembly hole on the large plate 7. Then, the pressure applicator 10 is released, and the pressing head 1001 presses on the small ingot 8. Before the material grasping assembly grasps the material from the conveyor belt, the material position is determined according to the vision positioning information. During glue application, the glue application path is determined according to the vision positioning information. Thus, precise placement of the material is not required.

[0035] In an embodiment, the glue application module further includes a tablet stacking tooling 11. The tablet stacking tooling 11 is provided with a notch for stacking tablets 12. During operation, the worker stacks the tablets 12 in the notch of the tablet stacking tooling 11 in advance. After glue application, the material transfer and glue application device 9 first grasps the tablets 12 from the notch of the tablet stacking tooling 11, places them into the assembly holes of the large plate 7, and then grasps the pressure applicator 10 from the pressure applicator placing module 4 to apply pressure to the small ingot 8. Thus, the pressure of the pressing head 1001 is applied to the small ingot 8 through the tablets 12, and the pressure is effectively dispersed.

[0036] In an embodiment, a glue replenishment module is provided on the rack 1; the glue replenishment module includes a first blanking device 13, a second operation platform 14, a material transfer and glue replenishment device 15, and a first turning device 16; the first blanking device 13 has a glue application blanking station for receiving the trimmer and conveying it to a designated position for being grabbed; the first turning device 16 is used to turn over the trimmer on the first blanking device 13; the material transfer and glue replenishment device 15 is used to carry the turned-over trimmer on the first blanking device 13 to the second operation platform 14 (constant temperature operation table) to replenish glue to the gap between the small ingot 8 and the large plate 7; after the glue replenishment is completed, the material transfer and glue replenishment device 15 carries the trimmer to a designated glue replenishment blanking station. After the glue application is completed, the trimmer is turned over for glue replenishment, so that the bonding strength between the small ingot 8 and the large plate 7 is higher. Among them, the material transfer and glue replenishment device 15 has the same structure as the material transfer and glue application device 9 except that it does not have small vacuum suction cups. During glue replenishment, the glue application path is determined by using visual positioning information.

[0037] In an embodiment, the first blanking device 13 is a belt conveyor, and two sets of material in-place sensors are provided one after another at the conveying end of the belt conveyor; corresponding to the first set of material in-place sensors, the first turning device 16 is arranged on the side of the belt conveyor. When the material in-place sensor detects the trimmer, the belt conveyor stops, and the first turning device 16 grabs the trimmer, turns it over and then puts it back, and then the belt conveyor restarts; when the second set of material in-place sensors detects the trimmer, the belt conveyor stops waiting for the trimmer to be grabbed by the material transfer and glue replenishment device 15. In this embodiment, two sets of material in-place sensors are provided one after another at the end of the conveyor belt, and the trimmer is turned over before reaching the end of the conveyor belt, so that the turning action of the first turning device 16 and the grabbing action of the material transfer and glue replenishment device 15 can be carried out simultaneously without affecting each other, which is beneficial to improving work efficiency. Among them, the first turning device 16 includes a fixed telescopic cylinder, a finger cylinder connected to the telescopic cylinder, and a clamping jaw arranged on the finger cylinder; the material in-place sensor is a photoelectric sensor.

[0038] In an embodiment, a sealing module is provided on the rack 1; the sealing module includes a second blanking device 17, a third operation platform 18, a material transfer and sealing device 19, and a second turning device 20; the second blanking device 17 has a glue replenishment blanking station for receiving the trimmer and conveying it to a designated position for being grabbed; the second turning device 20 is used to turn over the trimmer on the second blanking device 17; the material transfer and sealing device 19 is used to transport the turned-over trimmer on the second blanking device 17 to the third operation platform 18 (constant temperature operation table) and seal the assembly holes of the large plate 8; after the sealing is completed, the material transfer and sealing device 19 transports the trimmer to a designated sealing blanking station. After the glue replenishment is completed and then the sealing is carried out, not only can the bonding strength be further improved, but also the product becomes more beautiful. Among them, the material transfer and sealing device 19 has the same structure as the material transfer and glue replenishment device 15 except that the diameter of the glue application needle head is larger. During sealing, the position of the assembly holes on the large plate 8 is determined by using visual positioning information.

[0039] In an embodiment, the second blanking device 17 is a belt conveyor, and two sets of material in-place sensors are provided at the front and back of the conveying end of the belt conveyor; corresponding to the first set of material in-place sensors, the second turning device 20 is arranged on the side of the belt conveyor. When the material in-place sensor detects the trimmer, the belt conveyor stops, the second turning device 20 grabs the trimmer, turns it over and then puts it back, and then the belt conveyor restarts; when the second set of material in-place sensors detects the trimmer, the belt conveyor stops waiting for the trimmer to be grabbed by the material transfer and sealing device 19. In this embodiment, two sets of material in-place sensors are provided at the front and back of the conveyor belt end, and the trimmer is turned over before reaching the conveyor belt end, so that the turning action of the first turning device 16 and the grabbing action of the material transfer and glue replenishment device 15 can be carried out simultaneously without affecting each other, which is beneficial to improving work efficiency. Among them, the structure of the second turning device 20 is the same as that of the first turning device 16; the material in-place sensor is a photoelectric sensor.

[0040] In an embodiment, the CMP polishing pad trimmer automatic assembly equipment with a planarized tip further includes a drying module provided on one side of the rack 1; the drying module includes an oven 21 and a belt conveyor passing through the oven 21, and the starting end of the belt conveyor has a sealing blanking station. After the sealing is completed, the trimmer is placed on the conveyor belt and passes through the oven 21. After coming out of the oven 21, the glue has been cured and can directly enter the packaging link.

[0041] The above general description of the invention involved in this application and the description of its specific embodiments should not be construed as limiting the technical solution of the invention. Those skilled in the art can, based on the disclosure of this application, add, subtract, or combine the disclosed technical features in the above general description or / and specific embodiments (including examples) without departing from the constituent elements of the involved invention, thereby forming other technical solutions that fall within the protection scope of the present invention.

Claims

1. An automatic assembly apparatus for a CMP polishing pad dresser with a planarizing tip, characterized in that: including a frame (1); A large plate loading module (2), a small ingot loading module (3) and a pressurizer receiving module (4) are provided on the side of the frame (1); the large plate loading module (2) and the small ingot loading module (3) are used to transport the large plate (7) and the small ingot (8) to a designated position to wait for being grasped; the pressurizer receiving module (4) is provided with a pressurizer (10) that can be grasped, and the pressurizer (10) is provided with a group of press heads (1001) corresponding to the assembly holes on the large plate (7); The frame (1) is provided with a glue coating module; the glue coating module comprises a first operating platform (5) and a reference plate (6) disposed on the first operating platform (5); the upper surface of the reference plate (6) is a reference plane (601), and a group of raising platforms (602) for raising the large plate (7) are disposed on the reference plane (601); the glue coating module also comprises a material moving and glue coating device (9), and when working, the material moving and glue coating device (9) first grabs the large plate (7) and places it on the reference plate (6), and then grabs the small ingot ( 8) is placed in the assembly hole on the large plate (7), and then glue is applied in the gap between the small ingot (8) and the large plate (7) to form a trimmer; after the gluing is completed, the material moving and gluing device (9) grabs the pressurizer (10) and places it on the trimmer, and uses the pressure head (1001) of the pressurizer (10) to press the small ingot (8); after the glue liquid is solidified, the material moving and gluing device (9) removes the pressurizer (10) from the trimmer and puts it back into the pressurizer holding module (4), and then grabs the trimmer and places it on the designated gluing unloading station.

2. The automatic assembly equipment of a CMP polishing pad dresser with a flattened tip according to claim 1, characterized in that: The large plate loading module (2) and the small ingot loading module (3) are belt conveyors with material in-place sensors at the conveying ends; during the loading process of the large plate (7) and the small ingots (8), after the material in-place sensors detect the material, the corresponding belt conveyors stop, and after the material at the conveying end is grabbed, the belt conveyors restart.

3. The automatic assembly equipment of a CMP polishing pad dresser with a flattened tip according to claim 1, characterized in that: The pressurizer receiving module (4) is a belt conveyor capable of reverse operation and having a material in-place sensor at the conveying end. A group of pressurizers (10) are placed on the conveying belt of the pressurizer receiving module (4), and correspondingly, the first operating platform (5) is provided with the same number of reference plates (6) in groups. When working, the material moving and gluing device (9) grabs a pressurizer (10) from the end of the belt conveyor for each trimmer produced, until all the pressurizers (10) are grabbed and used. After the glue liquid is solidified, the material moving and gluing device (9) puts the pressurizers (10) back to the end of the belt conveyor one by one for recycling. During the process of recycling the pressurizers (10), after the material in-place sensor detects the pressurizer (10), the belt conveyor starts to operate in reverse, transports the pressurizer (10) backward for a distance, and vacates the position at the conveying end for receiving the next pressurizer (10). When the last pressurizer (10) is received, the belt conveyor does not start.

4. The automatic assembly equipment of a CMP polishing pad dresser with a flattened tip according to claim 1, characterized in that: The material transfer and gluing device (9) comprises a three-axis slide table (901), and a gluing component, a material grabbing component and a visual positioning component are arranged on the Z axis of the three-axis slide table (901); The glue coating component is used to mix the glue and the curing agent according to a set ratio, and then apply a quantitative amount of the mixture to the gap between the small ingot (8) and the large plate (7); The material grabbing assembly comprises a large vacuum suction cup (902) and a small vacuum suction cup (903); the large vacuum suction cup (902) is used to grab the large plate (7) and the pressurizer (10), and the small vacuum suction cup (903) is used to grab the small ingot (8); the large vacuum suction cup (902) is connected to the Z axis of the three-axis slide table (901) via an electric turntable (904); The visual positioning component includes an industrial camera (905) and a light source (906); During operation, the circumferential postures of the large plate (7) and the pressurizer (10) are determined based on visual positioning information; after the material grabbing assembly grabs the pressurizer (10) from the pressurizer holding module (4), the electric turntable (904) adjusts the circumferential posture of the pressurizer (10) to correspond to the large plate (7), so that the pressure head (1001) can be aligned with the assembly hole on the large plate (7).

5. The automatic assembly equipment of a CMP polishing pad dresser with a planarized tip according to claim 1, characterized in that: The gluing module further comprises a tablet stacking tool (11); the tablet stacking tool (11) is provided with a notch for stacking tablets (12); after gluing, the material transfer and gluing device (9) first grabs the tablet (12) from the notch of the tablet stacking tool (11), places it in the assembly hole of the large plate (7), and then grabs the pressurizer (10) from the pressurizer holding module (4) to pressurize the small ingot (8).

6. The automatic assembly equipment of a CMP polishing pad dresser with a planarized tip according to claim 1, characterized in that: The frame (1) is provided with a glue filling module; the glue filling module comprises a first feeding device (13), a second operating platform (14), a material moving and glue filling device (15) and a first turning device (16); the first feeding device (13) is provided with a glue coating feeding station for receiving a trimmer and conveying it to a designated position to wait for being grasped; the first turning device (16) is used to turn over the trimmer on the first feeding device (13); the material moving and glue filling device (15) is used to carry the trimmer on the first feeding device (13) after turning over to the second operating platform (14) to fill the gap between the small ingot (8) and the large plate (7) with glue; after the glue filling is completed, the material moving and glue filling device (15) carries the trimmer to the designated glue filling feeding station.

7. The automatic assembly equipment of a CMP polishing pad dresser with a flattened tip according to claim 6, characterized in that: The first unloading device (13) is a belt conveyor, and two sets of material arrival sensors are provided at the conveying end of the belt conveyor, one in front and one behind; corresponding to the first set of material arrival sensors, the first turning device (16) is provided on the side of the belt conveyor, and when the material arrival sensor detects the trimmer, the belt conveyor stops, the first turning device (16) grabs the trimmer, turns it over and puts it back, and then the belt conveyor restarts; when the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material moving and glue filling device (15).

8. The automatic assembly equipment of a CMP polishing pad dresser with a flattened tip according to claim 6 or 7, characterized in that: The frame (1) is provided with a sealing module; the sealing module comprises a second unloading device (17), a third operating platform (18), a material transfer and sealing device (19) and a second turning device (20); the second unloading device (17) is provided with a filling and unloading station for receiving a trimmer and conveying it to a designated position to wait for being grasped; the second turning device (20) is used to turn over the trimmer on the second unloading device (17); the material transfer and sealing device (19) is used to transport the trimmer on the second unloading device (17) after being turned over to the third operating platform (18) to seal the assembly holes of the large plate (7); after the sealing is completed, the material transfer and sealing device (19) transports the trimmer to the designated sealing and unloading station.

9. The automatic assembly equipment of a CMP polishing pad dresser with a planarized tip according to claim 8, characterized in that: The second unloading device (17) is a belt conveyor, and two sets of material arrival sensors are provided at the conveying end of the belt conveyor, one in front and one behind; corresponding to the first set of material arrival sensors, the second turning device (20) is provided on the side of the belt conveyor, and when the material arrival sensor detects the trimmer, the belt conveyor stops, the second turning device (20) grabs the trimmer, turns it over and puts it back, and then the belt conveyor restarts; when the second set of material arrival sensors detects the trimmer, the belt conveyor stops and waits for the trimmer to be grabbed by the material transfer and sealing device (19).

10. The automatic assembly equipment of a CMP polishing pad dresser with a planarized tip according to claim 8, characterized in that: It also comprises a drying module arranged on one side of the frame (1); the drying module comprises an oven (21) and a belt conveyor running through the oven (21); the starting end of the belt conveyor has a sealing glue unloading station.

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