Whisker-based insulating anticorrosive paint and method for preparing the same

Abstract

The application provides a whisker-based insulating anticorrosive paint and a preparation method thereof, and belongs to the technical field of insulating materials. The insulating anticorrosive paint comprises component A and component B. According to weight parts, component A comprises 60-80 parts of organic silicon modified copolymer, 0.5-2 parts of dispersing agent, 0.5-5 parts of defoaming agent, 0.1-1.0 parts of adhesion promoter, 0.1-1.0 parts of film forming aid, 1-3 parts of rheological aid and 20-40 parts of filler; component B comprises 95-99 parts of curing agent and 1-5 parts of defoaming agent. The boron nitride whisker is hydroxylated and modified and grafted into the long chain structure of tetramethyl dihydroxy disiloxane, and then polymerized with the epoxy resin to obtain the organic silicon copolymer, so that the dispersibility of the boron nitride in the coating system and the flexibility of the coating system are effectively improved. The insulating anticorrosive paint adopts the brushing or spraying mode, and the film thickness can reach the millimeter level in one time, so that the high voltage resistance requirement of the coating is realized.

Description

A whisker-based insulating and anti-corrosion coating and its preparation method Technical Field

[0001] This invention belongs to the field of insulating materials technology, and particularly relates to an insulating and anti-corrosion coating based on whiskers and its preparation method. Background Technology

[0002] Currently, electrical equipment systems, such as high-voltage equipment and energy storage power station equipment, are developing towards higher voltage levels and more advanced insulation protection systems. Epoxy resin coatings are widely used in electrical equipment due to their excellent adhesion, permeability, corrosion resistance, thermodynamic properties, and outstanding electrical insulation performance. However, epoxy resin, after curing, has a three-dimensional network structure and high cross-linking density, resulting in shortcomings such as high internal stress, brittleness, poor fatigue resistance, heat resistance, and impact toughness. This leads to drawbacks such as poor peel strength, shear strength, and low crack strain. In particular, thick-film coatings cannot meet the needs of the rapidly evolving new power equipment in terms of weather resistance and flexibility.

[0003] To address the aforementioned issues, Chinese patent CN116082647A discloses a water-soluble polyester-modified epoxy resin, comprising a water-soluble polyester mixture, epoxy resin, a dimer acid mixture, a catalyst, and a co-solvent. By using a specific water-soluble polyester resin mixture, dispersion stability can be enhanced, the solid content of the waterborne epoxy resin can be increased, the thickness of a single coating can be effectively increased, and the amount of coating used and the amount of volatile organic compounds can be significantly reduced. Chinese patent CN115521438B discloses an organic-inorganic hybrid epoxy resin, comprising mixing a first organosilicon, a second organosilicon, epoxy resin, and a catalyst uniformly and reacting at 90-130°C for 3-8 hours to obtain a resin intermediate. The first organosilicon contains only short side groups, and the second organosilicon contains both aliphatic chains and active epoxy groups or amino groups. The resin intermediate is then reacted with an alkaline aqueous solution to obtain the organic-inorganic hybrid epoxy resin. Based on molecular structure design, the prepared organic-inorganic hybrid epoxy resin has no fragile interfaces, which is beneficial for improving the mechanical properties, toughness, and weather resistance of the material.

[0004] While the above methods can address the issues of poor mechanical properties, toughness, and weather resistance of epoxy resin to some extent, the development of high-insulation protection in power generation, grid-load-storage systems, ultra-high voltage power transmission and transformation systems, and electrical equipment systems in harsh environments, particularly in desert and Gobi regions, demands higher voltage resistance from epoxy resin-based insulation protection systems. These systems must also meet the requirements for good mechanical properties, toughness, and weather resistance. Furthermore, for epoxy resin-based insulation protection coatings to achieve higher voltage resistance, their drying time and thickness also require specific conditions. Considering factors such as on-site construction, there is a huge market demand for room-temperature drying coatings that can achieve millimeter-thickness films in a single application.

[0005] Therefore, there is an urgent need for an epoxy resin insulating coating with excellent overall performance, including good flexibility, good weather resistance, and coating drying time and thickness that meet the requirements. Summary of the Invention

[0006] The purpose of this invention is to provide a whisker-based insulating and anti-corrosion coating and its preparation method, so as to solve the problems of poor flexibility, poor weather resistance, and inability of the coating drying time and thickness to meet the requirements of electrical equipment in the above-mentioned epoxy resin insulating coatings.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] The first aspect of this invention provides a whisker-based insulating and anti-corrosion coating, comprising component A and component B. Component A, by weight, comprises 60-80 parts of an organosilicon-modified copolymer, 0.5-2 parts of a dispersant, 0.5-5 parts of a defoamer, 0.1-1.0 parts of an adhesion promoter, 0.1-1.0 parts of a film-forming aid, 1-3 parts of a rheology modifier, and 20-40 parts of a filler. Component B comprises 95-99 parts of a curing agent and 1-5 parts of a defoamer.

[0009] Preferably, the filler includes at least one of mica powder, silica powder, and barium sulfate.

[0010] Preferably, the dispersant is at least one of BYK-2152TF, BYK9076, and DISPERBYK-111; the defoamer is at least one of BYK-1765, BYK-1796, BYK-1760, and BYK-054; the adhesion promoter is at least one of BYK-4511, Adherant 1051, and Adherant 1121; the film-forming aid is at least one of DAPRO®FX514, DAPRO®BIO400, and OE300® alcohol ester; the rheology modifier is at least one of GARAMITE-7305, BYK-1958, THIXATROL®8058, and THIXATROL®8056; and the curing agent is at least one of solvent-free polyamide curing agents and cashew nut shell curing agents.

[0011] Preferably, the preparation method of the organosilicon-modified copolymer is as follows:

[0012] (1) Preparation of boron nitride whiskers

[0013] Melamine, boric acid, and a crystal form control agent were dissolved in an aqueous solution under heating and stirring conditions, and then cooled at room temperature to form a boron nitride whisker precursor turbidity.

[0014] The boron nitride whisker precursor turbidity was filtered and dried to obtain the boron nitride precursor.

[0015] The boron nitride precursor was calcined to obtain boron nitride whiskers;

[0016] (2) Preparation of modified boron nitride whiskers

[0017] Toluene and tetramethyldihydroxydisiloxane were mixed and stirred to form a homogeneous solution. The solution was then heated under nitrogen protection, and boron nitride whiskers were added to react. After the reaction was completed, the solution was cooled to room temperature to obtain a modified boron nitride whisker mixture.

[0018] (3) Preparation of organosilicon-modified copolymers

[0019] The film-forming resin was dissolved in toluene, heated under nitrogen protection, and a mixture of modified boron nitride whiskers was added dropwise. A catalyst was added to carry out the reaction. After removing the toluene, an organosilicon-modified copolymer was obtained.

[0020] The reaction equation for synthesizing the modified boron nitride whisker mixture is as follows:

[0021] .

[0022] The reaction equation for synthesizing organosilicon-modified copolymers is as follows:

[0023] .

[0024] Preferably, in step (1), the molar ratio of melamine to boric acid is 1:(1.5~2.5), the concentration of melamine is 0.2~0.5mol / L, melamine and boric acid are mixed in an aqueous solution at 60~70℃ to obtain a mixed solution, and then 5wt% of crystal form control agent is added to the mixed solution, and the mixture is stirred for 20~40min and cooled to obtain a boron nitride whisker precursor turbid liquid;

[0025] The crystal form control agent is at least one of sodium dodecyl sulfate, sodium dodecyl sulfonate, polyvinylpyrrolidone, ethylenediamine, octadecyltrimethylammonium chloride, and hexadecyltrimethylammonium bromide.

[0026] Preferably, in step (1), calcination is carried out under a nitrogen atmosphere at a temperature of 1400~1500℃ and a holding time of 2~35h.

[0027] Preferably, in step (2), the mass ratio of toluene to tetramethyldihydroxydisiloxane is (5~10):1; and the mass ratio of boron nitride whiskers to tetramethyldihydroxydisiloxane is (1~2):10.

[0028] Preferably, in step (2), the heating temperature is 50~80℃ and the reaction time is 5~8h.

[0029] Preferably, in step (3), the mass ratio of film-forming resin to toluene is 1:(0.5~1.5); the film-forming resin is at least one of epoxy resin, polyester resin, polyimide resin, polyurethane resin, silicone resin, polyolefin resin, phenolic resin and its modified derivatives; the heating temperature is 60~70℃; the mass ratio of film-forming resin to modified boron nitride whisker mixture is (3~5):1; the catalyst is one of dibutyltin dilaurate and dioctyltin dilaurate, and the amount of catalyst added is 0.3~1.5wt% of the mass of film-forming resin.

[0030] Preferably, the film-forming resin is a solvent-free epoxy resin, specifically a solvent-free bisphenol F epoxy resin.

[0031] A second aspect of this invention provides a method for preparing a whisker-based insulating and anti-corrosion coating, comprising the following steps:

[0032] S1: Preparation of Component A

[0033] According to the weight parts, add the organosilicon modified copolymer, dispersant, defoamer, adhesion promoter, film-forming aid, and rheology modifier into the reactor, stir at a low speed of 300~400 r / min for 5~10 minutes, slowly add the filler while stirring, and then switch to high speed of 1200~1500 r / min for 30~40 minutes to obtain component A;

[0034] S2: Preparation of Component B

[0035] Mix the curing agent and defoamer according to the weight parts, and stir at a low speed of 300~400r / min for 10~15 minutes to obtain component B;

[0036] S3: Preparation of Insulating and Anti-corrosion Coatings

[0037] Mix component A and component B at a mass ratio of (1~5):1 and stir for 1~10 minutes to obtain an insulating and anti-corrosion coating.

[0038] Preferably, the insulating and anti-corrosion coating can be sprayed or brushed onto the surface of the electrical equipment to form a coating with a thickness of ≥2mm.

[0039] Compared with the prior art, the advantages and beneficial effects of the present invention are as follows:

[0040] 1. The insulating and anti-corrosion coating prepared by this invention has good flexibility and weather resistance. At the same time, the coating formed can be naturally dried at above 0°C and can be formed in one step with a film thickness of up to the millimeter level.

[0041] 2. In this invention, boron nitride whiskers are hydroxylated and grafted into the long-chain structure of tetramethyldihydroxydisiloxane, and then polymerized with epoxy resin to obtain an organosilicon copolymer. This improves the dispersibility of boron nitride whiskers in the coating system and the flexibility of the coating system. At the same time, it forms an integral structure with the cyclic CO bonds in bisphenol F epoxy resin, which can effectively improve the strength and hardness of the coating system, giving the coating excellent strength and toughness.

[0042] 3. In this invention, tetramethyldihydroxydisiloxane in a modified boron nitride whisker mixture is used to modify and graft bisphenol F epoxy resin. Tetramethyldihydroxydisiloxane contains Si-O bonds, which have strong stability and flexibility. At the same time, the dissociation energy of Si-O bonds (460.5 kJ / mol) is higher than the light energy generated by near-ultraviolet light waves irradiating the ground (300~400 kJ / mol), and ultraviolet light is unlikely to generate free radicals in it. Therefore, the high insulation coating proposed in this invention has strong weather resistance. Attached Figure Description

[0043] Figure 1 shows the infrared spectrum of the organosilicon-modified copolymer in Example 1;

[0044] Figure 2 is a schematic diagram of the coating pressure resistance test. Detailed Implementation

[0045] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Example 1

[0047] This embodiment provides a method for preparing a whisker-based insulating and anti-corrosion coating, including the following steps:

[0048] S1: Component Design

[0049] The insulating and anti-corrosion coating includes component A and component B. By weight, component A includes 65 parts of silicone-modified copolymer, 1.0 part of dispersant, 1.5 parts of defoamer, 0.5 parts of adhesion promoter, 1.0 part of film-forming aid, 1.5 parts of rheology modifier, and 30 parts of filler. Component B includes 98 parts of curing agent and 2 parts of defoamer.

[0050] The filler consists of 18 parts mica powder, 10 parts silica powder, and 2 parts barium sulfate;

[0051] The dispersant is BYK9076, the defoamer is BYK-1796, the adhesion promoter is BYK-4511, the film-forming aid is DAPRO®FX514, the rheology modifier is BYK-1958, and the curing agent is a polyamide epoxy curing agent, model number Henster 5650S.

[0052] S2: The preparation method of the organosilicon-modified copolymer is as follows:

[0053] S21: Preparation of boron nitride whiskers

[0054] Melamine and boric acid were mixed at a molar ratio of 1:2 and heated and stirred to dissolve in an aqueous solution at 65°C. The molar concentration of melamine in the mixed solution was 0.35 mol / L. 5 wt% sodium dodecyl sulfate was added to the mixed solution, and the mixture was stirred continuously for 30 min. Then, it was cooled to room temperature to form a boron nitride whisker precursor turbidity.

[0055] The turbid liquid containing boron nitride whisker precursor was filtered and dried to obtain the boron nitride precursor.

[0056] The boron nitride precursor was placed in a vacuum furnace, nitrogen gas was introduced and the temperature was raised to 1450°C. After holding at this temperature for 20 hours, the furnace was stopped and the temperature was lowered to room temperature to obtain boron nitride whiskers.

[0057] S22: Preparation of modified boron nitride whiskers

[0058] Toluene and tetramethyldihydroxydisiloxane were mixed and stirred at a mass ratio of 8:1 to form a homogeneous solution. The solution was ultrasonically dispersed for 30 min and then transferred to an oil bath. Boron nitride whiskers (the mass ratio of boron nitride whiskers to tetramethyldihydroxydisiloxane was 1.5:10) were added, and the mixture was heated to 65°C for 6 h under nitrogen protection and magnetic stirring. After the reaction was completed, the mixture was cooled to room temperature to obtain a modified boron nitride whisker mixture.

[0059] S23: Preparation of Organosilicon Modified Copolymers

[0060] Solvent-free bisphenol F epoxy resin (purchased from Nan Ya NPEF170) was dissolved in toluene at a mass ratio of 1:1. The mixture was heated to 65°C, and under magnetic stirring and nitrogen protection, a modified boron nitride whisker mixture (the mass ratio of solvent-free bisphenol F epoxy resin to modified boron nitride whisker mixture was 4:1) was added dropwise. Dioctyltin dilaurate was then added to carry out the reaction. The amount of catalyst added was 0.8 wt% of the mass of the solvent-free bisphenol F epoxy resin. After reacting for 7 hours, toluene was removed by vacuum rotary evaporation to obtain the organosilicon modified copolymer.

[0061] S3: Preparation of Component A

[0062] According to the weight proportions, the organosilicon modified copolymer, dispersant, defoamer, adhesion promoter, film-forming aid, and rheology modifier are added to the reactor and stirred at a low speed of 400 r / min for 8 minutes. While stirring, the filler is slowly added and the stirring is switched to a high speed of 1300 r / min for 40 minutes to obtain component A.

[0063] S4: Preparation of Component B

[0064] Mix the curing agent and defoamer according to the weight parts, and stir at a low speed of 300r / min for 12 minutes to obtain component B.

[0065] S5: Preparation of Insulating and Anti-corrosion Coatings

[0066] Mix component A and component B at a mass ratio of 2:1 and stir for 5 minutes to obtain an insulating and anti-corrosion coating.

[0067] Example 2

[0068] This embodiment provides a method for preparing a whisker-based insulating and anti-corrosion coating, including the following steps:

[0069] S1: Component Design

[0070] The insulating and anti-corrosion coating includes component A and component B. By weight, component A includes 70 parts of silicone-modified copolymer, 1.0 part of dispersant, 1.5 parts of defoamer, 0.5 parts of adhesion promoter, 0.5 parts of film-forming aid, 1.5 parts of rheology modifier and 25 parts of filler. Component B includes 98 parts of curing agent and 2 parts of defoamer.

[0071] The filler consists of 15 parts mica powder, 8 parts silica powder, and 2 parts barium sulfate;

[0072] The dispersant is DISPERBYK-111, the defoamer is BYK-054T, the adhesion promoter is Adherant 1121, the film-forming aid is OE300® alcohol ester, the rheology modifier is THIXATROL®8058, and the curing agent is cashew phenol epoxy curing agent, model number Zhejiang Wansheng WSCM-4115E.

[0073] S2: The preparation method of the organosilicon-modified copolymer is as follows:

[0074] S21: Preparation of boron nitride whiskers

[0075] Melamine and boric acid were mixed at a molar ratio of 1:2 and heated and stirred to dissolve in an aqueous solution at 65°C. The molar concentration of melamine in the mixed solution was 0.35 mol / L. 5 wt% sodium dodecyl sulfate was added to the mixed solution, and the mixture was stirred continuously for 30 min. Then, it was cooled to room temperature to form a boron nitride whisker precursor turbidity.

[0076] The turbid liquid containing boron nitride whisker precursor was filtered and dried to obtain the boron nitride precursor.

[0077] The boron nitride precursor was placed in a vacuum furnace, nitrogen gas was introduced and the temperature was raised to 1450°C. After holding at this temperature for 20 hours, the furnace was stopped and the temperature was lowered to room temperature to obtain boron nitride whiskers.

[0078] S22: Preparation of modified boron nitride whiskers

[0079] Toluene and tetramethyldihydroxydisiloxane were mixed and stirred at a mass ratio of 8:1 to form a homogeneous solution. The solution was ultrasonically dispersed for 30 min and then transferred to an oil bath. Boron nitride whiskers (the mass ratio of boron nitride whiskers to tetramethyldihydroxydisiloxane was 1.5:10) were added, and the mixture was heated to 65°C for 6 h under nitrogen protection and magnetic stirring. After the reaction was completed, the mixture was cooled to room temperature to obtain a modified boron nitride whisker mixture.

[0080] S23: Preparation of Organosilicon Modified Copolymers

[0081] Solvent-free bisphenol F epoxy resin (purchased from Nan Ya NPEF170) was dissolved in toluene at a mass ratio of 1:1. The mixture was heated to 65°C, and under magnetic stirring and nitrogen protection, a modified boron nitride whisker mixture (the mass ratio of solvent-free bisphenol F epoxy resin to modified boron nitride whisker mixture was 4:1) was added dropwise. Dioctyltin dilaurate was then added to carry out the reaction. The amount of catalyst added was 0.8 wt% of the mass of the solvent-free bisphenol F epoxy resin. After reacting for 7 hours, toluene was removed by vacuum rotary evaporation to obtain the organosilicon modified copolymer.

[0082] S3: Preparation of Component A

[0083] According to the weight proportions, the organosilicon modified copolymer, dispersant, defoamer, adhesion promoter, film-forming aid, and rheology modifier are added to the reactor and stirred at a low speed of 400 r / min for 8 minutes. While stirring, the filler is slowly added and the stirring is switched to a high speed of 1300 r / min for 40 minutes to obtain component A.

[0084] S4: Preparation of Component B

[0085] Mix the curing agent and defoamer according to the weight parts, and stir at a low speed of 300r / min for 12 minutes to obtain component B.

[0086] S5: Preparation of Insulating and Anti-corrosion Coatings

[0087] Mix component A and component B at a mass ratio of 1.5:1 and stir for 5 minutes to obtain an insulating and anti-corrosion coating.

[0088] Test case

[0089] (1) Infrared spectroscopy was performed on the organosilicon-modified copolymer in Example 1. The test results are shown in Figure 1. As can be seen from Figure 1, 815.8 cm⁻¹ -1 and 1386.6cm -1 The absorption peak is a characteristic peak of boron nitride, at 915 cm⁻¹. -1 and 1247.7cm -1 The absorption peaks are characteristic absorption peaks of the symmetric and asymmetric stretching vibrations of the epoxy group, respectively, at 1101.2 cm⁻¹. -1 The absorption peak is the Si-OC and Si-O-Si stretching vibration peak, at 3430.1 cm⁻¹. -1 The absorption peak at the specified location is a vibrational absorption peak of the hydroxyl group, indicating that the product contains boron nitride, epoxy group, and siloxane bond simultaneously, confirming that the boron nitride-modified tetramethyldihydroxydisiloxane underwent a graft copolymerization reaction with bisphenol F epoxy resin.

[0090] (2) The insulating and anti-corrosion coatings prepared in Examples 1 and 2 were brushed onto metal samples. After drying at room temperature for 24 hours, the coating thickness was 3 mm. The coating was then subjected to performance tests, such as adhesion, impact resistance, flexibility, water resistance, and electrical strength. The test results are shown in Tables 1 and 2.

[0091] Table 1. Coating test results of Example 1

[0092]

[0093]

[0094]

[0095] Table 2. Coating test results of Example 2

[0096]

[0097]

[0098] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A whisker-based insulating and anti-corrosion coating, characterized in that, The insulating and anti-corrosion coating includes component A and component B. According to the weight, component A includes 60-80 parts of organosilicon modified copolymer, 0.5-2 parts of dispersant, 0.5-5 parts of defoamer, 0.1-1.0 parts of adhesion promoter, 0.1-1.0 parts of film-forming aid, 1-3 parts of rheology aid and 20-40 parts of filler. Component B includes 95-99 parts of curing agent and 1-5 parts of defoamer. The preparation method of organosilicon modified copolymer is as follows: (1) Preparation of boron nitride whiskers: Melamine and boric acid with a molar ratio of 1:(1.5-2.5) are mixed in an aqueous solution at 60-70°C to obtain a mixed solution. 5wt% of crystal form control agent is added to the mixed solution, and the mixture is stirred for 20-40 minutes. After cooling, a boron nitride whisker precursor turbid liquid is obtained. The boron nitride whisker precursor turbid liquid was filtered and dried to obtain the boron nitride precursor; the boron nitride precursor was calcined to obtain boron nitride whiskers; the concentration of melamine was 0.2~0.5 mol / L; the crystal form control agent was at least one of sodium dodecyl sulfate, sodium dodecyl sulfonate, polyvinylpyrrolidone, ethylenediamine, octadecyltrimethylammonium chloride, and hexadecyltrimethylammonium bromide; (2) Preparation of modified boron nitride whiskers Toluene and tetramethyldihydroxydisiloxane were mixed and stirred to form a uniform solution, then heated under nitrogen protection, and then added Boron nitride whiskers were reacted, and after the reaction was completed, the mixture was cooled to room temperature to obtain a modified boron nitride whisker mixture; the mass ratio of toluene to tetramethyldihydroxydisiloxane was (5~10):1; the mass ratio of boron nitride whiskers to tetramethyldihydroxydisiloxane was (1~2):10; (3) Preparation of organosilicon modified copolymer: The film-forming resin was dissolved in toluene, heated under nitrogen protection, the modified boron nitride whisker mixture was added dropwise, and a catalyst was added to react. After removing toluene, the organosilicon modified copolymer was obtained; the film-forming resin was solvent-free bisphenol F epoxy resin.

2. The whisker-based insulating and anti-corrosion coating according to claim 1, characterized in that, The filler includes at least one of mica powder, silica powder, and barium sulfate.

3. The whisker-based insulating and anti-corrosion coating according to claim 1, characterized in that, The dispersant is at least one of BYK-2152TF, BYK9076, and DISPERBYK-111; the defoamer is at least one of BYK-1765, BYK-1796, BYK-1760, and BYK-054; the adhesion promoter is at least one of BYK-4511, Adherant 1051, and Adherant 1121; the film-forming aid is at least one of DAPRO®FX514, DAPRO®BIO400, and OE300® alcohol ester; the rheology modifier is at least one of GARAMITE-7305, BYK-1958, THIXATROL®8058, and THIXATROL®8056; and the curing agent is at least one of solvent-free polyamide curing agents and cashew nut shell curing agents.

4. The whisker-based insulating and anti-corrosion coating according to claim 1, characterized in that, In step (1), calcination is carried out under a nitrogen atmosphere at a temperature of 1400~1500℃ and a holding time of 2~35h.

5. The whisker-based insulating and anti-corrosion coating according to claim 1, characterized in that, In step (2), the heating temperature is 50~80℃ and the reaction time is 5~8h.

6. The whisker-based insulating and anti-corrosion coating according to claim 1, characterized in that, In step (3), the mass ratio of film-forming resin to toluene is 1:(0.5~1.5); the heating temperature is 60~70℃; the mass ratio of film-forming resin to modified boron nitride whisker mixture is (3~5):1; the catalyst is one of dibutyltin dilaurate and dioctyltin dilaurate, and the amount of catalyst added is 0.3~1.5wt% of the mass of film-forming resin.

7. A method for preparing a whisker-based insulating and anti-corrosion coating according to any one of claims 1 to 6, characterized in that, Includes the following steps: S1: Preparation of Component A: According to the weight parts, add the organosilicon modified copolymer, dispersant, defoamer, adhesion promoter, film-forming aid, and rheology modifier into the reactor, stir at a low speed of 300~400 r / min for 5~10 minutes, slowly add the filler while stirring, and then switch to high speed of 1200~1500 r / min for 30~40 minutes to obtain Component A; S2: Preparation of component B: According to the weight parts, the curing agent and defoamer are mixed and stirred at a low speed of 300~400r / min for 10~15 minutes to obtain component B; S3 Preparation of insulating and anti-corrosion coating: Mix component A and component B at a mass ratio of (1~5):1 and stir for 1~10 min to obtain insulating and anti-corrosion coating.

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