Substrate heating device for magnetron sputtering coating equipment

Abstract

The invention discloses a substrate heating device for magnetron sputtering coating equipment. The substrate heating device comprises a driving element, a coupler, a magnetofluid assembly, a heating baffle and a lamp tube assembly, the driving element is arranged on the outer side of a cavity of the magnetron sputtering coating equipment, the output end of the driving element is connected with the magnetic fluid assembly through a coupler, the magnetic fluid assembly penetrates into the cavity of the magnetron sputtering coating equipment in a sealed mode and is connected with the heating baffle, and the lamp tube assembly is arranged on the heating baffle. When the driving element drives the heating baffle to move to the substrate heating station, the heating baffle is located over the workpiece table. When the driving element drives the heating baffle to move to the cavity heating station, the heating baffle is located on one side of the workpiece table. The device has the characteristics of compact structure, simplicity in operation, stability in operation, high heating efficiency and the like, and well meets the heating requirements of the substrate and the cavity.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor vacuum coating, and particularly relates to a substrate heating device for a magnetron sputtering coating equipment. Background Art

[0002] At present, the existing heating devices for substrates in magnetron sputtering coating equipment are mainly resistance heating and radiation heating. For resistance heating, the resistance wire is generally arranged inside the workpiece table, and heat is transferred to the substrate through heat conduction. However, due to the low heat conduction efficiency in a vacuum environment, it is difficult to ensure that the surface of the substrate is heated to a relatively high temperature (600°C) and the uniformity of the substrate surface temperature. Radiation heating mostly uses infrared lamp tubes for heating. To ensure a relatively high temperature and temperature uniformity on the substrate surface, this method requires a separate setting of the substrate heating position. After the substrate is heated to an appropriate temperature, it is then transferred to the sputtering position, with a complex structure and relatively high cost. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a substrate heating device for a magnetron sputtering coating equipment with a compact structure, simple operation, stable operation and low cost, aiming at the deficiencies of the complex structure and high cost of the substrate heating device in the existing magnetron sputtering coating equipment.

[0004] To achieve the above object, the present invention can adopt the following technical solutions:

[0005] A substrate heating device for a magnetron sputtering coating equipment, wherein a workpiece table is arranged inside the cavity of the magnetron sputtering coating equipment, and a substrate table for carrying the substrate is arranged on the workpiece table; the substrate heating device includes: a driving element, a coupling, a magneto-fluid component, a heating baffle and a lamp tube component; the driving element is arranged outside the cavity of the magnetron sputtering coating equipment, and the output end of the driving element is connected to the magneto-fluid component through the coupling. The magneto-fluid component is hermetically penetrated into the cavity of the magnetron sputtering coating equipment and is connected to the heating baffle, and the lamp tube component is arranged on the heating baffle; when the driving element drives the heating baffle to move to the substrate heating station, the heating baffle is located directly above the workpiece table; when the driving element drives the heating baffle to move to the cavity heating station, the heating baffle is located on one side of the workpiece table.

[0006] As a further improvement of the present invention, a water cooling component is further included. The magneto-fluid component adopts a double-layer water-cooled magneto-fluid, and a water cooling flow channel is arranged inside the magneto-fluid component. The water cooling component is respectively connected to the magneto-fluid component and the heating baffle.

[0007] As a further improvement of the present invention, the lamp tube component includes an outer lamp tube and an inner lamp tube arranged in sequence. The outer lamp tube and the inner lamp tube are respectively connected to two independent temperature controllers to realize independent power adjustment.

[0008] As a further improvement of the present invention, a plurality of lamp holders are provided at the bottom of the heating baffle, and the lamp holders are used to fix the outer lamp tube and the inner lamp tube.

[0009] As a further improvement of the present invention, a cooling channel is provided at the top of the heating baffle, and the cooling channel is connected to the water cooling assembly to achieve cooling of the heating baffle.

[0010] As a further improvement of the present invention, the water cooling assembly includes a metal hose, a water cooling pipe and a water cooling joint. One end of the metal hose is connected to the cooling channel, and the other end of the metal hose is connected to one end of the water cooling pipe. The other end of the water cooling pipe and the water cooling joint are respectively connected to the water cooling channel inside the magneto - fluid assembly, so as to realize that the cooling water flows through the magneto - fluid assembly, the water cooling pipe, the metal hose and the cooling channel in sequence and forms a cycle.

[0011] As a further improvement of the present invention, the driving element is a swing cylinder.

[0012] As a further improvement of the present invention, the bottom of the heating baffle is a mirror - polished structure.

[0013] Compared with the prior art, the advantages of the present invention are as follows:

[0014] The substrate heating device for a magnetron sputtering coating equipment of the present invention realizes the transmission connection between the driving element outside the cavity and the heating baffle inside the cavity through the magneto - fluid assembly, and a lamp tube assembly is arranged on the heating baffle. When the lamp tube assembly is powered on, heating can be carried out. The driving element can not only drive the heating baffle to move to the substrate heating station to heat the substrate at a high temperature, but also drive the heating baffle to move to the cavity heating station to heat and degas the cavity. When the sputtering target is pre - sputtered, the heating baffle can also be used as a substrate table anti - pollution baffle to protect the substrate from being polluted, significantly improving the efficiency of substrate sputtering coating. Description of the Drawings

[0015] Figure 1 It is a schematic structural principle diagram of the substrate heating device for a magnetron sputtering coating equipment in a specific embodiment of the present invention;

[0016] Figure 2 It is a schematic structural principle diagram of the substrate heating device in the substrate heating station in a specific embodiment of the present invention;

[0017] Figure 3 It is a schematic front - view structural principle diagram of the substrate heating device in the substrate heating station in a specific embodiment of the present invention;

[0018] Figure 4 It is a schematic top - view structural principle diagram of the substrate heating device in the cavity heating station in a specific embodiment of the present invention;

[0019] Figure 5 Schematic diagram of the structural principle of the bottom of the heating baffle in a specific embodiment of the present invention;

[0020] Figure 6 Schematic diagram of the structural principle of the water-cooling component in a specific embodiment of the present invention;

[0021] Legend: 1. Driving element; 2. Coupling; 3. Magnetohydrodynamic component; 4. Support plate; 5. Water-cooling component; 6. Heating baffle; 7. Outer lamp tube; 8. Inner lamp tube; 9. Lamp tube clamp; 51. Metal hose; 52. Water-cooling pipe; 53. Water-cooling joint; 61. Cooling flow channel; 100. Workpiece table; 101. Substrate table; 102. Driving device; 200. Substrate. Specific embodiments

[0022] The present invention will be further described below in conjunction with the accompanying drawings of the specification and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0023] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "side", "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0024] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0025] Embodiment

[0026] As Figures 1 to 6As shown in the figure, the substrate heating device for a magnetron sputtering coating equipment of the present invention has a workpiece table 100 disposed inside the cavity of the magnetron sputtering coating equipment. A substrate table 101 for carrying a substrate 200 is provided on the workpiece table 100. The substrate table 101 is also connected to a driving device 102. The driving device 102 drives the substrate table 101 to move up and down on the workpiece table 100 to adjust the distance between the substrate 200 and the substrate heating device. At the same time, the workpiece table 100 has a water-cooling and motor-driven self-rotation function. The water-cooling design ensures that the heat during the heating and temperature rise of the substrate 200 does not affect the other components of the workpiece table 100 and the cavity temperature. The motor-driven self-rotation can further improve the surface temperature uniformity of the substrate 200.

[0027] In this embodiment, the substrate heating device includes: a driving element 1, a coupling 2, a magneto-fluid component 3, a heating baffle 6, and a lamp tube assembly. The driving element 1 is fixed to the outside of the cavity of the magnetron sputtering coating equipment through a support plate 4. The output end of the driving element 1 is connected to the magneto-fluid component 3 through the coupling 2. The magneto-fluid component 3 is hermetically penetrated into the cavity of the magnetron sputtering coating equipment, and the output shaft of the magneto-fluid component 3 is connected to the heating baffle 6. The lamp tube assembly is provided on the heating baffle 6. As Figure 3 shown, when the driving element 1 drives the heating baffle 6 to move to the substrate heating station, the heating baffle 6 is located directly above the workpiece table 100. As Figure 4 shown, when the driving element 1 drives the heating baffle 6 to move to the cavity heating station, the heating baffle 6 is located on one side of the workpiece table 100. In this embodiment, the driving element 1 is a swing cylinder, and the swing cylinder drives the heating baffle 6 to rotate to realize the conversion of the lamp tube assembly between the substrate heating station and the cavity heating station.

[0028] In this embodiment, the magneto-fluid component 3 is used to realize the transmission connection between the driving element 1 outside the cavity and the heating baffle 6 inside the cavity, and the lamp tube assembly is provided on the heating baffle 6. When the lamp tube assembly is powered on, heating can be carried out. The driving element 1 can drive the heating baffle 6 to move to the substrate heating station to perform high-temperature heating on the substrate 200, and can also drive the heating baffle 6 to move to the cavity heating station to heat and degas the cavity. When the sputtering target is pre-sputtered, the heating baffle 6 can also be used as a substrate table anti-fouling baffle to protect the substrate 200 from being contaminated, significantly improving the efficiency of substrate sputtering coating.

[0029] As Figure 1As shown in the figure, the substrate heating device further includes a water cooling assembly 5, and the water cooling assembly 5 is respectively connected to the magnetohydrodynamic assembly 3 and the heating baffle 6. In this embodiment, the magnetohydrodynamic assembly 3 adopts a double-layer water-cooled magnetohydrodynamic, and a water cooling channel is provided inside the magnetohydrodynamic assembly 3. Specifically, the magnetohydrodynamic assembly 3 is designed with an inner layer and an outer layer. The outer layer is fixedly installed, and the inner layer transmits motion. There is magnetic fluid between the inner and outer layers to achieve vacuum sealing. And a water cooling channel is arranged inside the inner layer. One end of the water cooling channel is connected to an external cooling water source, and the other end is connected to the water cooling assembly 5. The water cooling channel rotates with the inner layer to ensure that cooling water can be introduced into the heating baffle 6 during substrate heating, cavity heating, and sputtering process states to obtain cooling.

[0030] As Figure 5 shown in the figure, the lamp tube assembly includes an outer lamp tube 7 and an inner lamp tube 8 arranged in sequence. Both the outer lamp tube 7 and the inner lamp tube 8 adopt infrared lamp tubes and are respectively connected to two independent temperature controllers, which can adjust the power size in real time to ensure the temperature uniformity on the surface of the substrate during heating.

[0031] Furthermore, the bottom of the heating baffle 6 is a mirror-polished structure, which can make the heat generated by the lamp tube radiate to the substrate side or the bottom side of the cavity as much as possible to improve the heating efficiency.

[0032] As Figure 5 shown in the figure, a plurality of lamp tube clips 9 are provided at the bottom of the heating baffle 6. The lamp tube clips 9 are used to fix the outer lamp tube 7 and the inner lamp tube 8 to improve the convenience of lamp tube disassembly and maintenance. Moreover, through the reasonable layout of the outer lamp tube 7 and the inner lamp tube 8 and the cooperation with the rotation of the workpiece table 100 during heating, the temperature uniformity on the surface of the substrate 200 in the vacuum environment can be ensured within 3%.

[0033] In this embodiment, the heating baffle 6 can realize two functions of high-temperature heating of the substrate and pre-sputtering of the substrate at one height position, saving space and reducing costs. And the baffle can also be ensured to be cooled during the movement of the heating baffle 6.

[0034] As Figure 1 shown in the figure, a cooling channel 61 is welded to the top of the heating baffle 6. The cooling channel 61 is connected to the water cooling assembly 5. The overall contour of the cooling channel 6 is similar to the contour of the lamp tube to realize the cooling of the heating baffle 6. The design of the cooling channel 61 can reduce the temperature of the heating baffle 6 when the lamp tube is heated. When the substrate 200 needs to be heated to a relatively high temperature (400°C - 600°C), cooling water is introduced into the cooling channel 61, which can minimize the radiation of the heat generated by the lamp tube to the cavity and the other components in the cavity.

[0035] As Figure 6As shown, the water-cooling component 5 includes a metal hose 51, a water-cooling pipe 52, and a water-cooling joint 53. One end of the metal hose 51 is connected to the cooling flow channel 61, the other end of the metal hose 51 is connected to one end of the water-cooling pipe 52, and the other end of the water-cooling pipe 52 and the water-cooling joint 53 are respectively connected to the water-cooling flow channels inside the magneto-fluid component 3, so as to enable the cooling water to flow through the magneto-fluid component 3, the water-cooling pipe 52, the metal hose 51, and the cooling flow channel 61 in sequence and form a cycle, thereby improving the cooling effect of the heating baffle 6. The maximum temperature for heating the substrate by the lamp tube component is 600 °C. Due to the setting of the water-cooling system, the temperature of the cavity can be ensured not to be affected by the heating of the lamp tube during the high-temperature heating of the substrate.

[0036] In this embodiment, when it is necessary to heat the substrate 200, the driving element 1 drives the heating baffle 6 to move directly above the workpiece table 100, that is, the substrate heating position, through the driving coupling 2 and the input shaft of the magneto-fluid component 3. The infrared lamp tube is powered on for heating. When the heating is completed, the infrared lamp tube is turned off, and the heating baffle 6 is moved away to the cavity heating position, and the substrate 200 is subjected to the magnetron sputtering coating process. During the heating and coating processes, the workpiece table 100 rotates continuously, further improving the uniformity of the substrate heating temperature and the thickness of the sputtered deposition film layer. When it is necessary to heat and degas the inside of the cavity, the driving element 1 drives the heating baffle 6 to move to the cavity heating position, the lamp tube is powered on for heating, and the lamp tube is powered off after the cavity heating and degassing are completed.

[0037] Although the present invention is disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes, without departing from the spirit and technical solution of the present invention. Therefore, any simple modification, equivalent replacement, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A substrate heating device for a magnetron sputtering coating device, wherein a workpiece table (100) is provided in a cavity of the magnetron sputtering coating device, and a substrate table (101) for carrying a substrate (200) is provided on the workpiece table (100); characterized in that: The substrate heating device comprises: a driving element (1), a coupling (2), a magnetic fluid component (3), a heating baffle (6) and a lamp tube component; the driving element (1) is arranged outside the cavity of a magnetron sputtering coating device, the output end of the driving element (1) is connected to the magnetic fluid component (3) through the coupling (2), the magnetic fluid component (3) is sealed and penetrates into the cavity of the magnetron sputtering coating device, and is connected to the heating baffle (6), and the heating baffle (6) is provided with a lamp tube component; when the driving element (1) drives the heating baffle (6) to move to the substrate heating station, the heating baffle (6) is located directly above the workpiece table (100); when the driving element (1) drives the heating baffle (6) to move to the cavity heating station, the heating baffle (6) is located on one side of the workpiece table (100).

2. The substrate heating device for magnetron sputtering coating equipment according to claim 1, characterized in that: It also includes a water cooling component (5), the magnetic fluid component (3) uses a double-layer water-cooled magnetic fluid, the inner layer of the magnetic fluid component (3) is provided with a water cooling channel, and the water cooling component (5) is respectively connected to the magnetic fluid component (3) and the heating baffle (6).

3. The substrate heating device for magnetron sputtering coating equipment according to claim 2, characterized in that: The lamp tube assembly comprises an outer lamp tube (7) and an inner lamp tube (8) which are arranged in sequence, and the outer lamp tube (7) and the inner lamp tube (8) are respectively connected to two independent temperature controllers to achieve independent power adjustment.

4. The substrate heating device for magnetron sputtering coating equipment according to claim 3, characterized in that: A plurality of lamp tube clamps (9) are provided at the bottom of the heating baffle (6), and the lamp tube clamps (9) are used to fix the outer lamp tube (7) and the inner lamp tube (8).

5. The substrate heating device for magnetron sputtering coating equipment according to claim 3, characterized in that: A cooling channel (61) is provided on the top of the heating baffle (6), and the cooling channel (61) is connected to the water cooling component (5) to achieve cooling of the heating baffle (6).

6. The substrate heating device for magnetron sputtering coating equipment according to claim 5, characterized in that: The water cooling component (5) comprises a metal hose (51), a water cooling pipe (52) and a water cooling joint (53); one end of the metal hose (51) is connected to a cooling channel (61); the other end of the metal hose (51) is connected to one end of the water cooling pipe (52); the other end of the water cooling pipe (52) and the water cooling joint (53) are respectively connected to the water cooling channel of the inner layer of the magnetic fluid component (3), so that cooling water flows through the magnetic fluid component (3), the water cooling pipe (52), the metal hose (51) and the cooling channel (61) in sequence, thereby forming a circulation.

7. The substrate heating device for magnetron sputtering coating equipment according to any one of claims 1 to 6, characterized in that: The driving element (1) is a swing cylinder.

8. The substrate heating device for magnetron sputtering coating equipment according to any one of claims 1 to 6, characterized in that: The bottom of the heating baffle (6) is a mirror-polished structure.

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