Vacuum melting and rapid hardening device

Abstract

The invention provides a vacuum melting rapid hardening device which comprises a vacuum box body, an induction furnace, a tundish, a flow guide channel and a water cooling disc, the induction furnace, the tundish, the flow guide channel and the water cooling disc are all arranged in the vacuum box body, the upper end of the flow guide channel is located below the tundish, and the lower end of the flow guide channel is located below the water cooling disc. The lower end of the flow guide channel is located above the water cooling disc, alloy raw materials are molten in the induction furnace, sequentially pass through the tundish and the flow guide channel and then enter the water cooling disc, the molten alloy raw materials can be cooled through the water cooling disc, and the cooled alloy raw materials form alloy ingots. According to the device, alloy ingots are formed under cooling of circulating cooling water of the water cooling disc, the oxidation resistance of alloy is enhanced, the alloy shrinkage rate is high, alloy components are accurate and evenly distributed, the gas content is small, and the impurity content is small. According to the device, the production efficiency of the alloy ingots is improved, the quality of the alloy ingots is better, and various production requirements are met.

Description

Technical Field

[0001] The present invention relates to the technical field of alloy preparation, and particularly relates to a vacuum melting and rapid solidification device. Background Art

[0002] A vacuum rapid solidification furnace uses the method of vacuum induction melting to enclose a crucible in a vacuum chamber, uses the eddy current heat generated by electromagnetic induction as a heat source, degasses, melts alloy or conductive material raw materials in a vacuum or inert gas state, and casts them through a crucible tilting furnace system. After passing through a tundish and rapidly solidifying on a water-cooled roller, it is then cooled by a water-cooled disk to reduce the temperature of the alloy to about 30 degrees Celsius, forming alloy flakes.

[0003] Due to production needs, the thickness of the alloy flakes produced by the prior art is 2 - 3 mm, and the thickness of the alloy flakes can no longer meet the production requirements. Alloy ingots thicker than the alloy flakes are needed.

[0004] The alloy ingots produced by the prior art contain impurities, have weak antioxidant ability, and poor quality.

[0005] Therefore, a vacuum melting and rapid solidification device is needed to solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a vacuum melting and rapid solidification device. Using this device, alloy ingots can be produced with high quality and high production efficiency, meeting the needs of various productions.

[0007] To achieve the above purpose, the present invention provides the following technical solutions:

[0008] A vacuum melting and rapid solidification device, the device includes a vacuum chamber, an induction furnace, a tundish, a diversion channel, and a water-cooled disk. Among them, the induction furnace, the tundish, the diversion channel, and the water-cooled disk are all arranged in the vacuum chamber. The upper end of the diversion channel is located below the tundish, and the lower end of the diversion channel is located above the water-cooled disk. The alloy raw materials are melted in the induction furnace and then pass through the tundish and the diversion channel in sequence and enter the water-cooled disk. The water-cooled disk can rotate, and the water-cooled disk can cool the melted alloy raw materials. The cooled alloy raw materials form alloy ingots.

[0009] Further, in the above vacuum melting and rapid solidification device, the induction furnace has a tilting mechanism, the tilting mechanism is connected to the induction furnace, and the tilting mechanism can pour the melted alloy raw materials in the induction furnace into the tundish.

[0010] Further, in the above vacuum melting and rapid solidification device, the included angle between the center line of the diversion channel and the horizontal plane is 30° - 50°.

[0011] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, the diversion channel is formed by connecting two plates, and the included angle between the two plates is 80°-100°.

[0012] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, the cross-section of the plate is triangular, one side of the triangle is close to the tundish, and the vertex opposite to the one side of the triangle is close to the water-cooled disk.

[0013] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, the water-cooled disk includes an upper disk body and a lower disk body. The upper disk body is located above the lower disk body. The upper disk body is of a barrel-shaped structure. The upper disk body is provided with an upper connecting plate. The cross-section of the upper connecting plate is circular ring-shaped. The inner wall of the upper connecting plate is connected to the outer wall of the lower end of the upper disk body. The lower disk body is provided with a lower connecting plate. The cross-section of the lower connecting plate is circular ring-shaped. The inner wall of the lower connecting plate is connected to the outer wall of the upper end of the lower disk body. A plurality of bolt holes are uniformly arranged on the upper connecting plate. A plurality of bolt holes are uniformly arranged on the lower connecting plate. After bolts pass through the bolt holes of the upper connecting plate and the bolt holes of the lower connecting plate, the upper disk body and the lower disk body are connected. The depth of the upper disk body is 100mm-120mm. The water-cooled disk has a temperature measuring mechanism, and the temperature measuring mechanism can accurately measure the temperature of the alloy ingot.

[0014] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, the upper surface of the lower disk body is provided with a groove, and a boss is arranged in the groove. The cross-section of the boss is circular ring-shaped. The center of the boss is located on the axis of the lower disk body. From the axis of the lower disk body to the edge of the lower disk body, the boss is provided with multiple circles. The spacing between the multiple circles of bosses is the same. Each boss is provided with an opening. The openings of two adjacent circles of bosses are respectively located on both sides of the axis of the lower disk body. The space between two adjacent bosses and the opening together form a channel for the cooling medium to flow through. The outer wall of the lower disk body is provided with an inlet for the cooling medium to flow in, and the middle part of the lower disk body is provided with an outlet for the cooling medium to flow out. The depth of the groove is 50mm.

[0015] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, the distance between the lower end of the diversion channel and the water-cooled disk is 20cm-25cm.

[0016] Furthermore, in the above-mentioned vacuum melting and rapid solidification device, it further includes a base. The base is located below the water-cooled disk. The base provides support for the water-cooled disk. A rotating mechanism is arranged in the base. The output end of the rotating mechanism is connected to the water-cooled disk. The rotating mechanism can drive the water-cooled disk to rotate.

[0017] Further, in the above vacuum melting and rapid solidification device, the thickness of the alloy ingot is 30 mm - 35 mm.

[0018] Analysis shows that the present invention discloses a vacuum melting and rapid solidification device. The device forms an alloy ingot under the cooling of circulating cooling water in the water-cooled disk, enhancing the antioxidant ability of the alloy. When the furnace charge is in a fully liquid state, it has a self-stirring effect, with a high alloy shrinkage rate, accurate and uniform alloy composition, low gas content, and few impurities. The device improves the production efficiency of the alloy ingot, makes the quality of the alloy ingot better, and meets the requirements of various productions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. Among them:

[0020] Figure 1 is a schematic structural diagram of an embodiment of the present invention.

[0021] Figure 2 is a top view structural diagram of a diversion channel of an embodiment of the present invention.

[0022] Figure 3 is a top view structural diagram of a lower disk body of an embodiment of the present invention.

[0023] Figure 4 is a top view structural diagram of an upper disk body of an embodiment of the present invention.

[0024] Description of the reference numerals in the drawings: 1 vacuum chamber; 2 induction furnace; 3 tundish; 4 diversion channel; 5 water-cooled disk; 6 plate; 7 base; 8 upper disk body; 9 lower disk body; 10 upper connecting plate; 11 lower connecting plate; 12 groove; 13 boss; 14 opening. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments. Each example is provided by way of explanation of the present invention rather than a limitation of the present invention. In fact, those skilled in the art will clearly understand that modifications and variations can be made to the present invention without departing from the scope or spirit of the present invention. For example, features shown or described as part of one embodiment can be used in another embodiment to yield yet another embodiment. Therefore, it is desirable that the present invention includes such modifications and variations that fall within the scope of the appended claims and their equivalents.

[0026] In the description of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and does not require the present invention to be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. The terms "connected", "connected to", and "arranged" used in the present invention should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection; it can be directly connected or indirectly connected through an intermediate component; it can be a wired electrical connection, a radio connection, or a wireless communication signal connection. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] One or more examples of the present invention are shown in the accompanying drawings. The detailed description uses numerical and alphabetical markings to refer to features in the drawings. Similar or like markings in the drawings and the description have been used to refer to similar or like parts of the present invention. As used herein, terms such as "first", "second", and "third" can be used interchangeably to distinguish one component from another and are not intended to indicate the position or importance of individual components.

[0028] As Figure 1 and Figure 4 shown, according to an embodiment of the present invention, a vacuum melting and rapid solidification device is provided. The device includes a vacuum chamber 1, an induction furnace 2, a tundish 3, a diversion channel 4, and a water-cooled disk 5. Among them, as Figure 1 shown, the induction furnace 2, the tundish 3, the diversion channel 4, and the water-cooled disk 5 are all arranged inside the vacuum chamber 1. The induction furnace 2 is used to melt alloy raw materials, and the alloy raw materials are various metal raw materials such as iron, copper, aluminum, neodymium, and boron. The upper end of the diversion channel is located below the tundish, and the lower end of the diversion channel is located above the water-cooled disk 5. After the alloy raw materials are melted in the induction furnace 2, they sequentially pass through the tundish 3 and the diversion channel 4 and then enter the water-cooled disk 5. The water-cooled disk 5 can rotate, and the water-cooled disk 5 can cool the melted alloy raw materials. The cooled alloy raw materials form alloy ingots. The device does not have a water-cooled roll, which reduces the cost. The device forms alloy ingots under the cooling of the circulating cooling water of the water-cooled disk 5. The induction furnace 2 can extract fine impurities during the alloy melting process, enhancing the antioxidant ability of the alloy. During the rotation of the water-cooled disk 5, the alloy raw materials have a self-stirring effect in the fully liquid state, with a high alloy shrinkage rate, accurate and uniform alloy composition, low gas content, and low impurity content, and the quality of the alloy ingots is better.

[0029] Furthermore, the induction furnace 2 has a tilting mechanism. The tilting mechanism is connected to the induction furnace 2, and the tilting mechanism can pour the melted alloy raw materials in the induction furnace 2 into the tundish 3.

[0030] Furthermore, the included angle between the central axis of the diversion channel 4 and the horizontal plane is 30° - 50° (for example: 30°, 35°, 40°, 45°, 50°). Preferably, the included angle between the central axis of the diversion channel 4 and the horizontal plane is 45°. As Figure 2 shown, the diversion channel 4 is formed by connecting two plates 6. The included angle between the two plates 6 is 80° - 100° (for example: 80°, 85°, 90°, 95°, 100°). Preferably, the included angle between the two plates 6 is 90°. The cross-section of the plate 6 is triangular. One side of the triangle is close to the tundish 3, and the vertex opposite to the side of the triangle close to the tundish 3 is close to the water-cooling plate 5. Such a setting enables the alloy raw materials flowing out of the tundish 3 to conveniently flow into the water-cooling plate 5 through the diversion channel 4.

[0031] Furthermore, as Figure 3 and Figure 4 shown, the water-cooling plate 5 includes an upper plate body 8 and a lower plate body 9. The upper plate body 8 is located above the lower plate body 9. The upper plate body 8 is of a barrel-like structure. The upper plate body 8 is provided with an upper connecting plate 10. The cross-section of the upper connecting plate 10 is circular-ring-shaped. The inner wall of the upper connecting plate 10 is connected to the outer wall of the lower end of the upper plate body 8. The lower plate body 9 is provided with a lower connecting plate 11. The lower connecting plate 11 is of a circular-ring-shaped structure. The inner wall of the lower connecting plate 11 is connected to the outer wall of the upper end of the lower plate body 9. A number of bolt holes are evenly arranged on the upper connecting plate 10, and a number of bolt holes are evenly arranged on the lower connecting plate 11. After the bolts pass through the bolt holes of the upper connecting plate 10 and the bolt holes of the lower connecting plate 11, the upper plate body 8 and the lower plate body 9 are connected. The depth of the upper plate body 8 is 100 mm - 120 mm (for example: 100 mm, 105 mm, 110 mm, 115 mm, 120 mm). Such a setting enables the molten alloy raw materials to solidify into alloy ingots in the water-cooling plate 5 to meet the production requirements. Preferably, the depth of the upper plate body 8 is 100 mm. The water-cooling plate 5 is provided with a temperature measuring mechanism, and the temperature measuring mechanism can accurately measure the temperature of the alloy ingot.

[0032] Furthermore, a groove 12 is provided on the upper surface of the lower plate body 9. A boss 13 is arranged in the groove 12. The cross-section of the boss 13 is circular-ring-shaped. The center of the boss 13 is located on the axis of the lower plate body 9. From the axis of the lower plate body 9 to the edge of the lower plate body 9, multiple circles of the boss 13 are arranged. The spacing between the multiple circles of the boss 13 is consistent. Each boss 13 is provided with an opening 14. The openings 14 of two adjacent circles of the boss 13 are respectively located on both sides of the axis of the lower plate body 9. The space between two adjacent bosses 13 and the opening 14 together form a channel for the cooling medium to flow through. An inlet for the cooling medium to flow in is provided on the outer wall of the lower plate body 9, and an outlet for the cooling medium to flow out is provided in the middle of the lower plate body 9. The cooling medium is cooling water, and the depth of the groove 12 is 50 mm. Under the circulation of the cooling water, it can ensure that the water-cooling plate 5 cools the alloy raw materials evenly and ensure that the quality of the alloy ingot meets the requirements.

[0033] Furthermore, the distance between the lower end of the diversion channel 4 and the water-cooling plate 5 is 20 cm - 25 cm (for example: 20 cm, 21 cm, 22 cm, 23 cm, 24 cm, 25 cm). Such a setting can prevent the molten alloy raw materials from splashing.

[0034] Furthermore, it further includes a base 7. The base 7 is located below the water-cooling plate 5. The base 7 provides support for the water-cooling plate 5. A rotating mechanism is arranged inside the base 7. The output end of the rotating mechanism is connected to the water-cooling plate 5. The rotating mechanism can drive the water-cooling plate 5 to rotate. Such a setting can ensure that an alloy ingot with a uniform thickness can be formed inside the water-cooling plate 5.

[0035] Furthermore, the thickness of the alloy ingot is 30 mm - 35 mm (for example: 30 mm, 31 mm, 32 mm, 33 mm, 34 mm, 35 mm).

[0036] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0037] A vacuum melting and rapid solidification device. The device forms an alloy ingot under the cooling of the circulating cooling water of the water-cooling plate 5. The induction furnace 2 can extract fine impurities during the alloy melting process, enhance the oxidation resistance of the alloy, and when the furnace charge is in a fully liquid state, it has a self-stirring effect, with a high alloy shrinkage rate, accurate and uniform alloy composition, less gas content, and less impurity content. The device improves the production efficiency of the alloy ingot, makes the quality of the alloy ingot better, meets the requirements of various productions, and reduces the production cost.

[0038] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A vacuum melting and quick solidification device, characterized in that: The device comprises a vacuum box, an induction furnace, a tundish, a flow guide channel and a water cooling plate, wherein: The induction furnace, the tundish, the flow guide channel and the water cooling plate are all arranged in the vacuum box. The upper end of the guide channel is located below the tundish, and the lower end of the guide channel is located above the water cooling plate. The alloy raw material is melted in the induction furnace and then passes through the tundish and the guide channel in sequence before entering the water cooling plate. The water cooling plate is rotatable, and the water cooling plate can cool the melted alloy raw material, and the cooled alloy raw material forms an alloy ingot.

2. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The induction furnace has a furnace tilting mechanism, which is connected to the induction furnace and can pour the alloy raw materials melted in the induction furnace into the tundish.

3. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The angle between the center line of the guide channel and the horizontal plane is 30°-50°.

4. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The guide channel is formed by connecting two plates, and the angle between the two plates is 80°-100°.

5. The vacuum melting and rapid solidification device according to claim 4, characterized in that: The cross section of the plate is a triangle, one side of the triangle is close to the tundish, and the vertex opposite to the one side of the triangle is close to the water cooling plate.

6. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The water cooling plate comprises an upper plate body and a lower plate body, wherein the upper plate body is located above the lower plate body, the upper plate body is a barrel-shaped structure, the upper plate body is provided with an upper connecting plate, the cross section of the upper connecting plate is annular, the inner wall of the upper connecting plate is connected to the outer wall of the lower end of the upper plate body, the lower plate body is provided with a lower connecting plate, the cross section of the lower connecting plate is annular, the inner wall of the lower connecting plate is connected to the outer wall of the upper end of the lower plate body, a plurality of bolt holes are evenly arranged on the upper connecting plate, a plurality of bolt holes are evenly arranged on the lower connecting plate, after the bolts pass through the bolt holes of the upper connecting plate and the bolt holes of the lower connecting plate, the upper plate body and the lower plate body are connected, the depth of the upper plate body is 100mm-120mm, The water cooling plate has a temperature measuring mechanism, and the temperature measuring mechanism can accurately measure the temperature of the alloy ingot.

7. The vacuum melting and rapid solidification device according to claim 6, characterized in that: The upper surface of the lower disk body is provided with a groove, and a boss is provided in the groove. The cross section of the boss is annular, and the center of the boss is located on the axis of the lower disk body. From the axis of the lower disk body to the edge of the lower disk body, the boss is provided with multiple circles, and the spacing between the multiple circles of the boss is consistent. Each of the bosses is provided with an opening, and the openings of the two adjacent circles of the bosses are respectively located on both sides of the axis of the lower disk body. The space between the two adjacent bosses and the opening together form a channel for the circulation of the cooling medium. The outer wall of the lower disk body is provided with an inlet for the cooling medium to flow in, and the middle part of the lower disk body is provided with an outlet for the cooling medium to flow out. The depth of the groove is 50 mm.

8. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The distance between the lower end of the guide channel and the water cooling plate is 20cm-25cm.

9. The vacuum melting and rapid solidification device according to claim 1, characterized in that: It also includes a base, which is located below the water cooling plate. The base provides support for the water cooling plate. A rotating mechanism is arranged in the base. The output end of the rotating mechanism is connected to the water cooling plate. The rotating mechanism can drive the water cooling plate to rotate.

10. The vacuum melting and rapid solidification device according to claim 1, characterized in that: The thickness of the alloy ingot is 30 mm-35 mm.

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