Head-mounted device

Abstract

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heat source device, a radiator and a cooling fan, an accommodating space is formed in the shell; the heat source device is arranged in the accommodating space; one side of the radiator is connected with the heat source device, and the other side of the radiator is connected with the shell through a heat-conducting medium; an air outlet of the cooling fan corresponds to the radiator and is used for taking away heat around the radiator through airflow. According to the head-mounted device provided by the embodiment of the invention, through two combined heat dissipation modes of connecting the radiator with the shell and blowing away the heat around the radiator by using the heat dissipation fan, the heat dissipation efficiency can be greatly improved, heat accumulation in the head-mounted device can be well solved, the rotating speed of the fan can be improved, and better man-machine temperature rise and noise experience can be achieved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation structures for head-mounted devices, and specifically relates to a head-mounted device. Background Art

[0002] Currently, in the VR glasses industry, restricted by the internal space of the glasses, heat dissipation is a technical point that is relatively difficult to overcome. If the heat dissipation effect is not good, the temperature of the VR glasses is too high during normal use, the head is hot, causing discomfort to the user and affecting the human-machine experience.

[0003] Due to the large overall power consumption of VR glasses products, conventional natural heat dissipation is difficult to solve the heat dissipation problem, and often the air-cooling method is used to solve the heat dissipation problem of the chip. The common heat dissipation method is that the heat of the chip on the PCB is blown away to the outside of the device by a fan through a substrate with heat dissipation fins.

[0004] When the chip power consumption increases, the heat dissipation area is insufficient, the chip temperature rises rapidly, the heat cannot be discharged from the device in time, the internal temperature of the whole machine is high, and the heat at the air outlet is obvious. At the same time, the fan speed increases, and the noise is obvious when wearing. Summary of the Invention

[0005] In the first aspect of the embodiments of this application, a head-mounted device is provided, and the head-mounted device includes:

[0006] A housing, which forms an accommodation space;

[0007] A heat source device, which is arranged in the accommodation space;

[0008] A radiator, one side of which is connected to the heat source device, and the other side is connected to the housing through a heat conduction medium;

[0009] A cooling fan, the air outlet of the cooling fan is correspondingly arranged for the radiator, and is used to take away the heat around the radiator through air flow.

[0010] For the head-mounted device provided by the embodiments of this application, by combining two heat dissipation methods of connecting the radiator to the housing and using the cooling fan to blow away the heat around the radiator, the heat dissipation efficiency can be greatly improved, the heat accumulation inside the head-mounted device can be better solved, the rotation speed of the fan can be improved, and a better human-machine temperature rise and noise experience can be achieved. Brief Description of the Drawings

[0011] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0012] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application;

[0013] Figure 2 is Figure 1 a schematic block diagram of the heat dissipation structure of the head-mounted device in the embodiment;

[0014] Figure 3 It is a schematic block diagram of the heat dissipation structure of another embodiment of the head-mounted device of the present application;

[0015] Figure 4 It is a schematic block diagram of the heat dissipation structure of still another embodiment of the head-mounted device of the present application;

[0016] Figure 5 It is a schematic block diagram of the heat dissipation structure of yet another embodiment of the head-mounted device of the present application;

[0017] Figure 6 It is a schematic block diagram of the heat dissipation structure of another embodiment of the head-mounted device of the present application. Detailed implementation manners

[0018] Next, with reference to the accompanying drawings and embodiments, the present application will be further described in detail. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0019] The terms "first", "second", and "third" in the embodiments of the present application are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "include" and "have" in the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or components inherent to these processes, methods, products, or devices.

[0020] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0021] As used herein, a "head-mounted device" (or simply "terminal") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a public switched telephone network (PSTN), digital subscriber line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, wireless local area network (WLAN), digital television network such as a DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that can combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include a radiotelephone, pager, Internet / intranet access, web browser, notepad, calendar, and / or global positioning system (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices including a radiotelephone transceiver. Smart devices such as AR, VR, XR, MR, etc. are all head-mounted devices configured with a cellular communication module.

[0022] Please refer to Figure 1 , Figure 1 FIG. is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application. It should be noted that the head-mounted device in the present application may include AR, VR, XR, MR devices, etc. Among them, only a part of the host is shown in the head-mounted device of this embodiment. In addition, it may also include a headband device, etc., which are not shown in the figure. Please refer to Figure 2 , Figure 2 is Figure 1 a schematic block diagram of the heat dissipation structure of the head-mounted device in the embodiment. Among them, the head-mounted device 100 includes a housing 110, a heat source device 120, a radiator 130, a cooling fan 140, and a mask 150. The mask 150 is detachably connected to the housing 110 and is used to fit with the user's face and eyes to play a role in light shielding and buffering.

[0023] Specifically, the housing 110 is formed with a receiving space 1100, and the heat source device 120 is disposed in the receiving space 1100. Among them, the heat source device 120 can be a heat generating device such as the main control board or the display component of the head-mounted device 100, and no specific limitation is made here. Among them, the main control board is used to control the working state of the overall structure of the head-mounted device 100, and the display component can include structures such as an optical engine and lenses, and can realize the functions of 3D image projection or display to present a virtual reality or augmented reality environment. The detailed features of this part are within the understanding of those skilled in the art and will not be elaborated here.

[0024] Optionally, one side of the radiator 130 is connected to the heat source device 120, and specifically, the heat conduction connection can be realized through the heat conduction medium 101. The other side of the radiator 130 is connected to the housing 110 through the heat conduction medium 101. Optionally, the radiator 130 in this embodiment can be a fin radiator made of a metal material (such as aluminum alloy, copper alloy, etc.), and the material of the housing 110 can be a material with good heat conduction performance such as metal. The air outlet of the cooling fan 140 is arranged corresponding to the heat dissipation fins of the radiator 130 for taking away the heat around the radiator 130 through the air flow. It should be noted here that the heat conduction medium 101 in the embodiment of the present application includes any one of heat conduction gel and heat conduction foam, and no specific limitation is made here.

[0025] Optionally, the head-mounted device in this embodiment further includes a wind guide cover 160. The wind guide cover 160 is disposed at the air outlet position of the cooling fan 140 and between the radiator 130 and the air outlet 111 on the housing 110 for guiding the air flow direction to ensure that the air flow passes through the radiator 130 and is discharged outside the housing 110. Among them, the cooling fan 140 is arranged corresponding to the air inlet 112 of the housing 110, and dust-proof nets 170 are arranged corresponding to both the air outlet 111 and the air inlet 112 of the housing 110. The dust-proof nets 170 are used to prevent dust and other pollutants from entering the housing 110. The arrows in the figure indicate the flow direction and path of the air flow, and the same applies hereinafter.

[0026] The head-mounted device provided by the embodiment of the present application can greatly improve the heat dissipation efficiency by combining two heat dissipation methods of connecting the radiator to the housing and using the cooling fan to blow away the heat around the radiator, can better solve the problem of heat accumulation inside the head-mounted device, improve the rotation speed of the fan, and achieve a better human-machine temperature rise and noise experience.

[0027] Please refer to Figure 3 , Figure 3It is a schematic block diagram of the heat dissipation structure of another embodiment of the head-mounted device of the present application. The head-mounted device 100 in this embodiment also includes a housing 110, a heat source device 120, a radiator 130, and a cooling fan 140. The housing 110 forms an accommodation space 1100, and the heat source device 120 is disposed in the accommodation space 1100. Among them, the heat source device 120 can be a heat-generating device such as the main control board or the display component of the head-mounted device 100, and no specific limitation is made here. One side of the radiator 130 is connected to the heat source device 120, specifically, heat conduction connection can be achieved through a heat conduction medium 101, and the other side of the radiator 130 is connected to the housing 110 through the heat conduction medium 101. The air outlet of the cooling fan 140 is arranged corresponding to the heat dissipation fins of the radiator 130, and is used to take away the heat around the radiator 130 through air flow.

[0028] Among them, the air guide cover 160 is disposed at the air outlet position of the cooling fan 140 and between the radiator 130 and the air outlet 111 on the housing 110, and is used to guide the air flow direction to ensure that the air flow passes through the radiator 130 and is discharged outside the housing 110. Among them, the cooling fan 140 is arranged corresponding to the air inlet 112 of the housing 110, and dust-proof nets 170 are arranged corresponding to both the air outlet 111 and the air inlet 112 of the housing 110. The dust-proof nets 170 are used to prevent dust and other pollutants from entering the housing 110.

[0029] Different from the foregoing embodiment, the head-mounted device 100 in this embodiment further includes a heat pipe 180, and the heat pipe 180 is attached to the inner side wall of the housing 110 or embedded in the housing 110. The radiator 130 is connected to the heat pipe 180 through a heat conduction medium 101. Optionally, the heat pipe 180 in this embodiment can be a graphite sheet or a heat pipe and other structures.

[0030] In the head-mounted device of this embodiment, by setting the heat pipe structure, the heat can be transferred to a larger area of the heat dissipation device, and can be dissipated quickly and more evenly, further improving the heat dissipation efficiency of the head-mounted device.

[0031] Please refer to Figure 4 , Figure 4 It is a schematic block diagram of the heat dissipation structure of still another embodiment of the head-mounted device of the present application. Optionally, the heat source device 120 in this embodiment is the main control board, and the main control board includes a PCB board 121 and a first chip 122 disposed on the PCB board 121. The first chip 122 is connected to the radiator 130 through a heat conduction medium 101. The heat dissipation structure of the head-mounted device in this embodiment can dissipate heat from the chip on the main control board.

[0032] Please refer to Figure 5 , Figure 5It is a schematic diagram of the heat dissipation structure block diagram of another embodiment of the head-mounted device of the present application. Different from the foregoing embodiments, the main control board in this embodiment includes a PCB board 121, a first chip 122 disposed on one side of the PCB board 121, and a second chip 123 disposed on the side opposite to the first chip 122. Optionally, a shielding cover 124 is provided on the second chip 123 in this embodiment, the second chip 123 is exposed from the shielding cover 124, and the second chip 123 is connected to the housing 110 through a heat conduction medium 101. In the head-mounted device of this embodiment, by connecting the chips on both sides to the radiator and the housing respectively, the heat dissipation efficiency can be further improved.

[0033] Please refer to Figure 6 , Figure 6 It is a schematic diagram of the heat dissipation structure block diagram of another embodiment of the head-mounted device of the present application. Different from the foregoing embodiments, a through hole 1240 is provided in the shielding cover 124 in this embodiment, and the through hole 1240 is filled with a heat conduction medium 101 to realize the connection between the PCB board 121 and the housing 110. In the head-mounted device of this embodiment, by providing a through hole in the shielding cover and connecting the PCB board to the housing using a heat conduction medium, the direct connection area between the main control board and the housing can be increased, thereby improving the heat dissipation efficiency. By using the above two measures (connecting the radiator to the housing and directly connecting the chip to the housing, stacking the heat dissipation structures in the upper and lower directions of the chip to effectively increase the heat dissipation area) at the same time, the heat of the chip can be quickly taken away, which can greatly improve the heat transfer efficiency, can better solve the problem of heat accumulation inside the VR glasses, improve the rotation speed of the fan, and achieve a better human-machine temperature rise and noise experience.

[0034] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A head-mounted device, It is characterized in that The head mounted device comprises: A housing is formed with a receiving space; A heat source device is arranged in the accommodation space; A heat sink, one side of which is connected to the heat source device, and the other side of which is connected to the housing via a heat-conducting medium; A cooling fan, wherein an air outlet of the cooling fan is arranged corresponding to the radiator, and is used for removing heat around the radiator through airflow.

2. The head mounted device according to claim 1, It is characterized in that The shell is made of metal.

3. The head mounted device according to claim 1, It is characterized in that The shell is provided with a heat spreader, and the radiator is connected to the heat spreader via a heat conducting medium.

4. The head mounted device according to claim 3, It is characterized in that The heat spreader is a graphite sheet or a heat dissipation tube.

5. The head mounted device according to claim 1, It is characterized in that The heat source device is a main control board, which includes a PCB board and a first chip arranged on the PCB board, and the first chip is connected to the heat sink through a heat conducting medium.

6. The head mounted device according to claim 5, It is characterized in that The PCB board is further provided with a second chip on a side facing away from the first chip, and the second chip is connected to the housing via a heat-conducting medium.

7. The head mounted device according to claim 6, It is characterized in that A shielding cover is disposed on the second chip, and the second chip is exposed from the shielding cover.

8. The head mounted device according to claim 7, It is characterized in that The shielding cover is provided with a through hole, and the through hole is filled with a heat-conducting medium to achieve the connection between the PCB board and the housing.

9. The head mounted device according to any one of claims 1 to 8, It is characterized in that The heat-conducting medium includes any one of heat-conducting gel and heat-conducting foam.

10. The head mounted device according to claim 1, It is characterized in that The shell is provided with an air inlet at a position corresponding to the heat dissipation fan, and the air inlet cover is provided with a dustproof net.

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