Low-loss cable connection terminal forming method based on multi-objective optimization

Abstract

The invention discloses a low-loss cable connection terminal forming method based on multi-objective optimization. The low-loss cable connection terminal forming method comprises the following steps: S1, establishing a multi-objective optimization model of a low-loss cable connection terminal; s2, performing global search based on a hummingbird optimization algorithm and screening out an optimal solution region; s3, local optimization is conducted on the optimal solution area, and optimized die design parameters and stamping process parameters are generated; s4, completing design and processing of the mold according to the optimized mold design parameters; s5, realizing punch forming by using the optimized punch process parameters, and generating a preliminarily formed cable connection terminal; s6, performing laser-assisted processing on the preliminarily formed cable connection terminal to generate an optimized cable connection terminal; and S7, carrying out surface treatment on the optimized cable connection terminal, forming conductive salient points on the contact surface of the terminal, and generating the finally formed cable connection terminal. The cable terminal forming process is optimized by using a hummingbird optimization algorithm and intelligent manufacturing, and the method has the advantages of low loss and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of cable connection terminal manufacturing, and particularly to a forming method for low-loss cable connection terminals based on multi-objective optimization. Background Art

[0002] As a key component for power transmission and signal transfer, the performance of cable connection terminals directly affects the overall efficiency and reliability of electrical systems. In the modern industrial field, the widely used cable connection terminals need to meet the requirements of low contact resistance, high mechanical strength, durability, and environmental friendliness simultaneously. However, the existing technologies face a series of technical problems that need to be solved urgently during the terminal manufacturing process, which limit the further improvement of the performance of cable connection terminals.

[0003] Traditional terminal manufacturing technologies mainly rely on single-objective optimization methods, such as optimizing contact resistance or mechanical strength separately, lacking a comprehensive balance of multi-objective performance. This single-objective optimization mode cannot meet the high standards of the modern industry for the comprehensive performance of terminals. For example, in terms of contact resistance optimization, although the use of highly conductive materials such as copper or aluminum can effectively reduce the resistance, the processing difficulty and cost of the materials also increase accordingly. At the same time, only optimizing the contact resistance may lead to the weakening of mechanical strength, unable to ensure the durability and stability of the terminals.

[0004] In addition, the existing die designs usually rely on experience and trial-and-error methods, lacking the support of a scientific multi-objective optimization model, resulting in slow performance improvement of the die structure. For example, the texture design on the die surface has an important impact on the contact area and the uniformity of current distribution, but it is difficult to accurately control the parameters of the microscopic structure on the die surface by traditional methods, thereby increasing the uncertainty of contact resistance and reducing the power transmission efficiency. At the same time, the life of the die is severely affected by material stress concentration, and the traditional design fails to fully consider the problems of local overload and wear of the die, increasing the frequency of die replacement and maintenance.

[0005] During the stamping process of terminals, the existing technologies mostly adopt fixed stamping paths and uniform pressure distributions, failing to dynamically optimize the material thickness distribution by combining flexible forming technologies. This way is likely to cause stress concentration or excessive deformation in local areas of the material, thus leading to cracks and fatigue failures. In addition, due to the unoptimized waste generation path in the stamping process, a large amount of raw materials are wasted, resulting in increased production costs. At the same time, the energy consumption of stamping equipment is not reasonably controlled, and the problem of unbalanced energy distribution also limits the manufacturing efficiency and environmental friendliness of terminals.

[0006] The application of laser-assisted technology in terminal manufacturing is still in its initial stage. The current laser processing technology is mainly used for the subsequent shaping and surface treatment of terminals. However, the existing laser processing technology lacks precise control of laser parameters (such as power, scanning speed, and pulse frequency), resulting in insufficient elimination of residual stress and optimization of material microstructure during the laser heat treatment process. In addition, the laser path planning often adopts a fixed mode and fails to dynamically adjust according to the stress distribution of the actual deformation area, reducing the straightening and heat treatment accuracy and unable to meet the manufacturing requirements of high-performance terminals.

[0007] Surface coating technology plays an important role in terminal manufacturing, which can significantly improve the corrosion resistance and electrical conductivity of terminals. However, the existing coating technology has insufficient accuracy in coating thickness control, resulting in waste of coating materials or unstable performance. In addition, the existing technology fails to effectively combine the real-time feedback control system with the coating equipment, unable to achieve dynamic adjustment of the coating thickness, thereby affecting the optimization effect of contact resistance and the service life of terminals.

[0008] Therefore, how to provide a forming method for low-loss cable connection terminals based on multi-objective optimization is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0009] An object of the present invention is to propose a forming method for low-loss cable connection terminals based on multi-objective optimization. The present invention adopts the hummingbird optimization algorithm and intelligent manufacturing technology, and optimizes the whole process of cable connection terminal forming, covering links such as multi-objective optimization model construction, mold design, dynamic adjustment of stamping process, laser-assisted treatment, and surface coating optimization. This method significantly reduces the contact resistance, improves the mechanical strength and material utilization rate of the terminals, and at the same time realizes energy conservation, consumption reduction and environmental protection in the production process. Compared with the existing technology, the present invention improves the manufacturing accuracy and efficiency while comprehensively optimizing the performance, meeting the high standards of modern industry for low-loss, high-performance and environmentally friendly cable connection terminals.

[0010] A forming method for low-loss cable connection terminals based on multi-objective optimization according to an embodiment of the present invention includes the following steps:

[0011] S1. Establish a multi-objective optimization model for low-loss cable connection terminals, and the optimization objectives include minimizing contact resistance, maximizing drawing force, minimizing scrap rate, and minimizing energy consumption;

[0012] S2. Perform a global search on the multi-objective optimization model based on the hummingbird optimization algorithm, generate an initial solution set, screen out the optimal solution region through fitness evaluation, and generate initial mold design parameters and stamping process parameters;

[0013] S3. Perform local optimization on the optimal solution region, and use the hummingbird optimization algorithm to dynamically adjust the surface curvature of the mold, the material thickness distribution, and the stamping path to generate optimized mold design parameters and stamping process parameters;

[0014] S4. Complete the design and machining of the mold according to the optimized mold design parameters, and use the micron-level texture machining technology on the mold surface;

[0015] S5. Use the optimized stamping process parameters to achieve stamping forming, combine the flexible forming technology to dynamically adjust the material thickness distribution, and generate a preliminarily formed cable connection terminal;

[0016] S6. Perform laser-assisted treatment on the preliminarily formed cable connection terminal, including laser straightening to eliminate residual stress and laser heat treatment to optimize the material microstructure, and generate an optimized cable connection terminal;

[0017] S7. Perform surface treatment on the optimized cable connection terminal, adjust the coating thickness through real-time feedback control, and form conductive bumps on the contact surface of the terminal to generate a finally formed cable connection terminal.

[0018] Optionally, the S1 specifically includes:

[0019] S11. Establish an objective function for minimizing the contact resistance, optimize the electrical conductivity of the contact surface of the cable connection terminal, and the objective is to minimize the contact resistance R:

[0020]

[0021] where ρ represents the resistivity of the conductive material, L represents the length of the current transmission path, A eff represents the effective contact area, and C s represents the contact correction coefficient introduced by the surface roughness;

[0022] S12. Establish an objective function for maximizing the drawing force, optimize the mechanical properties of the terminal, and the objective is to maximize the drawing force F p Maximize:

[0023] F p =(σ y +k·ε n )·A c ;

[0024] where σ y represents the yield strength of the material, k represents the work hardening coefficient of the material, ε represents the plastic strain, n represents the hardening index, and A c represents the actual stressed area;

[0025] S13. Establish an objective function for minimizing the scrap rate, and the objective is to minimize the scrap rate W:

[0026]

[0027] Among them, V p represents the volume of the finished product, V m represents the volume of the raw material, L s represents the ineffective utilization length of the sheared edge, L t represents the total length of the material, and α represents the processing accuracy correction coefficient;

[0028] S14. Establish an objective function for minimizing energy consumption, with the goal of minimizing the energy consumption E per unit product:

[0029]

[0030] Among them, T represents the processing cycle, P m (t) represents the power consumption of the forming equipment, P h (t) represents the power of the auxiliary equipment, and β represents the working ratio of the auxiliary equipment;

[0031] S15. Set the constraint conditions including: the stamping temperature range is 200°C - 400°C, the stamping pressure does not exceed 100 MPa, the material thickness range is 0.5 mm - 1 mm, and the contact surface texture depth range is 0.5 mm - 2 mm;

[0032] S16. Synthesize each objective function and constraint condition to construct a multi-objective optimization model.

[0033] Optionally, the S2 specifically includes:

[0034] S21. Initialize the multi-objective optimization model, represent the die geometric variables, stamping temperature, stamping pressure, and material parameter design variables as hummingbird individuals, and construct an initial population;

[0035] S22. In the global search stage, use the foraging mechanism of the hummingbird optimization algorithm to update the positions of the initial population. Each hummingbird individual conducts random exploration in the multi-objective solution space to generate an initial solution set;

[0036] S23. Evaluate the fitness of each hummingbird individual in the initial solution set and construct a comprehensive fitness function:

[0037]

[0038] Among them, F i represents the comprehensive fitness value of the i-th hummingbird individual, M represents the number of optimization objectives, exp represents the exponential function, ω j represents the dynamic weight of the j-th objective, f ij represents the function value of the i-th hummingbird individual on the j-th objective, represents the optimal value of the current population on the j-th objective, represents the average value of the current population on the j-th objective, Δ j represents the normalized scale parameter of the j-th objective, σ j represents the standard deviation of the j-th objective;

[0039] S24. Screen the initial population according to the comprehensive fitness value, and randomly introduce a variation factor to perturb the position of each hummingbird individual to form a new population;

[0040] S25. Repeat steps S22 to S24 until the comprehensive fitness value converges in multiple rounds of iteration or reaches the set threshold, and then screen out the optimal solution region;

[0041] S26. Select several individuals with the highest comprehensive fitness from the optimal solution region as the initial die design parameters and stamping process parameters.

[0042] Optionally, the specific steps of S3 include:

[0043] S31. Perform local optimization on the optimal solution region, and dynamically adjust the die surface curvature C m , the material thickness distribution T d and the stamping path P c ;

[0044] S32. Based on the hovering mechanism of the hummingbird optimization algorithm, adopt a dynamic position update rule, and perform local search on each variable by introducing a perturbation and a step size self-adaptive adjustment strategy to optimize the die surface curvature C m , the material thickness distribution T d and the stamping path P c ;

[0045] S33. Construct a local optimization fitness function:

[0046]

[0047] where, represents the local fitness value of the i-th hummingbird individual, M represents the number of optimization objectives, exp represents the exponential function, ω j represents the dynamic weight of the j-th objective, f ij represents the function value of the i-th hummingbird individual on the j-th objective, represents the optimal value of the current population on the j-th objective, represents the average value of the current population on the j-th objective, σ j represents the standard deviation of the j-th objective, ∈ represents the smoothing factor, δ represents the penalty intensity parameter, and η represents the exponential factor;

[0048] S34. Select the hummingbird individuals with local fitness values higher than the set threshold T threshold as the local optimal solutions, eliminate the remaining hummingbird individuals, and introduce new individuals through a random perturbation mechanism;

[0049] S35. Repeat steps S32 to S34 until the local fitness value converges in multiple iterations or meets the optimization conditions, and output the optimized die design parameters and stamping process parameters.

[0050] Optionally, the S5 specifically includes:

[0051] S51. Input the optimized stamping process parameters into the stamping equipment, including stamping temperature, stamping pressure, stamping speed, and initial material thickness, and set the initial working conditions of the flexible forming module;

[0052] S52. Before stamping starts, place the material to be processed between the die and the punch, and use the stamping pressure to perform preliminary loading on the material to make the material surface fit the die contour, and monitor the stress distribution on the material surface during the loading process, and record the stress peak area;

[0053] S53. Combine the flexible forming technology, and according to the stress peak area monitored in real time, dynamically adjust the material thickness, and introduce the material elastic modulus and contact area function to model the stamping deformation process:

[0054]

[0055] where S(x, y) represents the material thickness at the position (x, y), S 0 represents the initial material thickness, F(x, y) represents the punching force applied to the material at the position (x, y), Q represents the material elastic modulus, A(x, y) represents the material contact area at the position (x, y), and δ(x, y) represents the dynamic compensation term adaptively corrected according to the measured stress concentration;

[0056] S54. During the stamping process, continuously detect the real-time stamping pressure, stamping temperature, and material transient thickness through the sensor array, compare the monitored data with the set parameters, and automatically adjust the stamping speed and partition pressure distribution if there is a deviation;

[0057] S55. For the areas with significant local deformation or prone to defects, introduce a partitioned elastic support method to perform secondary loading or unloading, and optimize the material thickness by changing the force distribution;

[0058] S56. After completing the stamping, obtain the preliminarily formed cable connection terminals.

[0059] Optionally, the S6 specifically includes:

[0060] S61. Place the preliminarily formed cable connection terminal in the laser-assisted processing area, and set the laser output power P l , the scanning speed v l , the spot diameter d l and the pulse frequency f l ;

[0061] S62. Plan the laser straightening path, design the scanning trajectory according to the deformation area of the terminal and the residual stress distribution σ res (x, y), and divide the straightening area into several independent sections;

[0062] S63. Implement laser straightening, and control the residual stress by local heating and thermal gradient:

[0063] σ corr (x, y) = σ res (x, y) - ξ·ΔT(x, y);

[0064] Among them, σ corr (x, y) represents the stress value after straightening at the position (x, y), ξ represents the material thermal stress coefficient, and ΔT(x, y) represents the temperature increment caused by laser heating at the position (x, y);

[0065] S64. After straightening, perform laser heat treatment to optimize the material structure by controlling the laser residence time and the energy absorption coefficient:

[0066]

[0067] Among them, T laser (t) represents the temperature reached by the local area of the terminal over time t during the laser heat treatment process, T 0 represents the initial temperature, P l (τ) represents the instantaneous power of the laser at time τ, and θ represents the absorption coefficient;

[0068] S65. During the laser-assisted processing, the temperature, stress distribution, and terminal deformation amount are collected in real time through an on-line monitoring system. If the monitored value deviates from the preset range, adjust the scanning speed v l for correction;

[0069] S66. After completing laser straightening and heat treatment, detect the surface flatness and microstructure of the terminal to obtain the optimized cable connection terminal.

[0070] The beneficial effects of the present invention are:

[0071] First, in the optimization model of the present invention, four main indicators, namely contact resistance, drawing force, scrap rate, and energy consumption, are comprehensively considered, and a multi-objective optimization model is constructed. Through the global search and local optimization mechanisms of the hummingbird optimization algorithm, the contradictory relationships among various performance objectives are effectively balanced. While ensuring a significant reduction in contact resistance, the mechanical strength and material utilization rate of the terminals are improved, and the overall energy consumption is significantly reduced, realizing the collaborative optimization of multiple performances.

[0072] Secondly, in terms of die design, based on the optimized die design parameters, the present invention uses micron-level texture processing technology to precisely process the die surface, significantly improving the uniformity of the contact area and the current transmission efficiency, and further reducing the contact resistance. At the same time, by dynamically optimizing the die surface curvature, local stress concentration is reduced, and the service life of the die and the forming quality of the terminals are improved. This intelligent design method overcomes the limitations of traditional die design relying on experience, and greatly improves the design efficiency and accuracy.

[0073] In the stamping forming stage, the present invention combines flexible forming technology to dynamically adjust the material thickness distribution, effectively disperses the stress concentration area through real-time monitoring and closed-loop control, avoids the occurrence of cracks and fatigue failures, and optimizes the stamping path to reduce scrap generation. The efficient utilization of materials significantly reduces the production cost, and optimizes the energy consumption distribution of the equipment, further enhancing the greenness of the production process.

[0074] In the laser-assisted processing link, by precisely controlling the laser power, scanning speed, and pulse frequency, the shape of the preliminarily formed terminals is adjusted and the material heat treatment is carried out. The laser straightening technology of the present invention effectively eliminates residual stress by using thermal gradient control, while laser heat treatment optimizes the microstructure of the material, significantly improving the mechanical properties and shape consistency of the terminals. By real-time monitoring the deformation and stress distribution of the terminals and dynamically adjusting the laser path and parameters, the processing accuracy and treatment effect are ensured, meeting the manufacturing requirements of high-performance terminals.

[0075] In addition, in the surface plating stage, the present invention dynamically adjusts the plating equipment parameters through a real-time feedback control system, ensuring the uniformity and accuracy of the plating thickness, and forming a micro-structured plating with conductive bumps on the contact surface. This plating optimization technology not only significantly reduces the contact resistance, but also improves the corrosion resistance and service life of the terminals. By precisely controlling the usage amount of the plating material, resource waste is further reduced, achieving the best balance between economy and performance. Description of the Drawings

[0076] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0077] Figure 1 This is the overall flowchart of a forming method for low-loss cable connection terminals based on multi-objective optimization proposed by the present invention. Specific embodiments

[0078] Now, the present invention will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention.

[0079] Reference Figure 1 , a forming method for low-loss cable connection terminals based on multi-objective optimization, includes the following steps:

[0080] S1. Establish a multi-objective optimization model for low-loss cable connection terminals, and the optimization objectives include minimizing contact resistance, maximizing drawing force, minimizing scrap rate, and minimizing energy consumption;

[0081] S2. Conduct a global search on the multi-objective optimization model based on the hummingbird optimization algorithm, generate an initial solution set, screen out the optimal solution region through fitness evaluation, and generate initial die design parameters and stamping process parameters;

[0082] S3. Conduct local optimization on the optimal solution region, use the hummingbird optimization algorithm to dynamically adjust the die surface curvature, material thickness distribution, and stamping path, and generate optimized die design parameters and stamping process parameters;

[0083] S4. Complete the design and processing of the die according to the optimized die design parameters, and the die surface adopts micron-level texture processing technology;

[0084] S5. Realize stamping forming using the optimized stamping process parameters, dynamically adjust the material thickness distribution in combination with flexible forming technology, and generate a preliminarily formed cable connection terminal;

[0085] S6. Conduct laser-assisted treatment on the preliminarily formed cable connection terminals, including laser straightening to eliminate residual stress and laser heat treatment to optimize the material microstructure, and generate optimized cable connection terminals;

[0086] S7. Conduct surface treatment on the optimized cable connection terminals, adjust the coating thickness through real-time feedback control, and form conductive bumps on the terminal contact surface to generate the finally formed cable connection terminals.

[0087] In this embodiment, the specific content of S1 includes:

[0088] S11. Establish an objective function for minimizing contact resistance, optimize the electrical conductivity of the contact surface of the cable connection terminal, and the objective is to minimize the contact resistance R:

[0089]

[0090] Among them, ρ represents the resistivity of the conductive material, L represents the length of the current transmission path, and A eff represents the effective contact area, and C s represents the contact correction coefficient introduced by the surface roughness;

[0091] S12. Establish an objective function for maximizing the drawing force, and optimize the mechanical properties of the terminal. The objective is to maximize the drawing force F p Maximize:

[0092] F p =(σ y +k·ε n )·A c ;

[0093] Among them, σ y represents the yield strength of the material, k represents the work hardening coefficient of the material, ε represents the plastic strain, n represents the hardening index, and A c represents the actual stress-bearing area;

[0094] S13. Establish an objective function for minimizing the scrap rate. The objective is to minimize the scrap rate W:

[0095]

[0096] Among them, V p represents the volume of the finished product, V m represents the volume of the raw material, L s represents the ineffective utilization length of the shearing edge, L t represents the total length of the material, and α represents the machining accuracy correction coefficient;

[0097] S14. Establish an objective function for minimizing the energy consumption. The objective is to minimize the energy consumption E per unit product:

[0098]

[0099] Among them, T represents the processing cycle, P m (t) represents the power consumption of the forming equipment, and P h (t) represents the power of the auxiliary equipment, and β represents the working ratio of the auxiliary equipment;

[0100] S15. Set the constraint conditions including: the stamping temperature range is 200°C - 400°C, the stamping pressure does not exceed 100 MPa, the material thickness range is 0.5 mm - 1 mm, and the contact surface texture depth range is 0.5 mm - 2 mm;

[0101] S16. Integrate each objective function and constraint condition to construct a multi-objective optimization model.

[0102] In this embodiment, the S2 specifically includes:

[0103] S21. Initialize the multi-objective optimization model, represent the die geometric variables, stamping temperature, stamping pressure, and material parameter design variables as hummingbird individuals, and construct an initial population;

[0104] S22. In the global search stage, use the foraging mechanism of the hummingbird optimization algorithm to update the positions of the initial population. Each hummingbird individual conducts random exploration in the multi-objective solution space to generate an initial solution set;

[0105] S23. Evaluate the fitness of each hummingbird individual in the initial solution set and construct a comprehensive fitness function:

[0106]

[0107] where F i represents the comprehensive fitness value of the i-th hummingbird individual, M represents the number of optimization objectives, exp represents the exponential function, ω j represents the dynamic weight of the j-th objective, f ij represents the function value of the i-th hummingbird individual on the j-th objective, represents the optimal value of the current population on the j-th objective, represents the average value of the current population on the j-th objective, Δ j represents the normalization scale parameter of the j-th objective, σ j represents the standard deviation of the j-th objective;

[0108] S24. Screen the initial population according to the comprehensive fitness value and randomly introduce a variation factor to perturb the positions of each hummingbird individual to form a new population;

[0109] S25. Repeat steps S22 to S24 until the comprehensive fitness value converges in multiple rounds of iteration or reaches a set threshold, and then screen out the optimal solution region;

[0110] S26. Select several individuals with the highest comprehensive fitness from the optimal solution region as the initial die design parameters and stamping process parameters.

[0111] In this embodiment, the specific steps of S3 include:

[0112] S31. Conduct local optimization on the optimal solution region and dynamically adjust the die surface curvature C m , material thickness distribution T d and stamping path P c ;

[0113] S32. Based on the hovering mechanism of the hummingbird optimization algorithm, adopt a dynamic position update rule, and through introducing perturbation and step size adaptive adjustment strategies, conduct local search on each variable to optimize the die surface curvature Cm 、Material thickness distribution T d and stamping path P c ;

[0114] S33. Construct a local optimization fitness function:

[0115]

[0116] Among them, represents the local fitness value of the i-th hummingbird individual, M represents the number of optimization objectives, exp represents the exponential function, ω j represents the dynamic weight of the j-th objective, f ij represents the function value of the i-th hummingbird individual on the j-th objective, represents the optimal value of the current population on the j-th objective, represents the average value of the current population on the j-th objective, σ j represents the standard deviation of the j-th objective, ∈ represents the smoothing factor, δ represents the penalty intensity parameter, and η represents the exponential factor;

[0117] S34. Select the hummingbird individuals with local fitness values higher than the set threshold T threshold as the local optimal solutions, eliminate the remaining hummingbird individuals, and introduce new individuals through a random perturbation mechanism;

[0118] S35. Repeat steps S32 to S34 until the local fitness value converges in multiple iterations or meets the optimization conditions, and output the optimized die design parameters and stamping process parameters.

[0119] In this embodiment, the S5 specifically includes:

[0120] S51. Input the optimized stamping process parameters into the stamping equipment, including stamping temperature, stamping pressure, stamping speed, and initial material thickness, and set the initial working conditions of the flexible forming module;

[0121] S52. Before starting stamping, place the material to be processed between the die and the punch, and use the stamping pressure to perform preliminary loading on the material to make the material surface fit the die contour, and monitor the stress distribution on the material surface during the loading process, and record the stress peak area;

[0122] S53. Combining with the flexible forming technology, according to the stress peak area monitored in real time, dynamically adjust the material thickness, and introduce the material elastic modulus and contact area function to model the stamping deformation process:

[0123]

[0124] Among them, S(x,y) represents the material thickness at the position (x,y), S0 Let \(t_0\) represent the initial material thickness, \(F(x,y)\) represent the punching force applied to the material at the position \((x,y)\), \(Q\) represent the elastic modulus of the material, \(A(x,y)\) represent the material contact area at the position \((x,y)\), and \(\delta(x,y)\) represent the dynamic compensation term adaptively corrected according to the measured stress concentration;

[0125] S54. During the stamping process, continuously detect the real-time stamping pressure, stamping temperature, and material transient thickness through a sensor array, compare the monitoring data with the set parameters, and automatically adjust the stamping speed and zonal pressure distribution if there is a deviation;

[0126] S55. For areas with significant local deformation or prone to defects, introduce a zonal elastic support method to perform secondary loading or unloading, and optimize the material thickness by changing the stress distribution;

[0127] S56. After stamping, a preliminarily formed cable connection terminal is obtained.

[0128] In this embodiment, the specific steps of S6 include:

[0129] S61. Place the preliminarily formed cable connection terminal in the laser-assisted processing area, and set the laser output power \(P\) l , scanning speed \(v\) l , spot diameter \(d\) l and pulse frequency \(f\) l ;

[0130] S62. Plan the laser straightening path, design the scanning trajectory according to the deformation area and residual stress distribution \(\sigma\) res (x,y) of the terminal, and divide the straightening area into several independent sections;

[0131] S63. Implement laser straightening, and control the residual stress by local heating and thermal gradient:

[0132] \(\sigma\) corr (x,y)=\(\sigma\) res (x,y)-\(\xi\cdot\Delta T(x,y)\);

[0133] where, \(\sigma\) corr (x,y) represents the stress value after straightening at the position \((x,y)\), \(\xi\) represents the material thermal stress coefficient, and \(\Delta T(x,y)\) represents the temperature increment caused by laser heating at the position \((x,y)\);

[0134] S64. After straightening, perform laser heat treatment to optimize the material structure by controlling the laser residence time and energy absorption coefficient:

[0135]

[0136] where, \(T\)laser (t) represents the temperature reached by the local area of the terminal over time t during the laser heat treatment, T 0 represents the initial temperature, P l (τ) represents the instantaneous power of the laser at time τ, and θ represents the absorption coefficient;

[0137] S65. During the laser-assisted processing, the temperature, stress distribution, and terminal deformation are collected in real time through an on-line monitoring system. If the monitored values deviate from the preset range, the scanning speed v is adjusted l for correction;

[0138] S66. After completing the laser straightening and heat treatment, the surface flatness and microstructure of the terminal are detected to obtain an optimized cable connection terminal.

[0139] Example 1:

[0140] To verify the feasibility of the present invention in implementation, the present invention is applied to the cable connection terminal production line of an industrial manufacturing enterprise. This enterprise has long faced problems such as high contact resistance of the terminal, insufficient drawing strength, serious material waste, and excessive production energy consumption, which have seriously affected the electrical transmission performance and mechanical reliability of the terminal, and at the same time increased the production cost. The traditional manufacturing process uses empirical optimization and single-objective improvement methods, and it is difficult to achieve the comprehensive balance of multiple performances. There is an urgent need for an intelligent and multi-objective optimized forming method for improvement.

[0141] During the application of the present invention, a multi-objective optimization model is first established, with minimizing the contact resistance, maximizing the drawing force, minimizing the scrap rate, and minimizing the energy consumption as the main optimization objectives. The multi-objective optimization model is globally searched using the hummingbird optimization algorithm, and a preliminary optimal solution region is screened out. Then, through local optimization, the surface curvature of the mold, the material thickness distribution, and the stamping path are further adjusted to obtain the optimized mold design parameters and stamping process parameters. According to the optimization results, the design and processing of the mold are completed, and the surface of the mold uses a micron-level texture processing technology to improve the uniformity of the terminal contact area.

[0142] In the stamping forming stage, the optimized stamping process parameters are dynamically adjusted, and the precise distribution of the material thickness is realized by combining the flexible forming technology, reducing the stress concentration area, and the stamping pressure and material deformation are monitored in real time through a closed-loop control system to ensure high consistency in production. The preliminary formed terminals generated after stamping are significantly improved in terms of shape consistency and material utilization rate compared with the traditional method.

[0143] Subsequently, the preliminarily formed terminals are straightened and heat-treated using laser-assisted processing technology. By precisely controlling the laser power, scanning speed, and spot size, the residual stress is eliminated, and the microstructure of the material is optimized, further enhancing the mechanical properties of the terminals. Finally, in the surface treatment process, a real-time feedback control system is used to dynamically adjust the coating thickness, forming a microstructured coating with conductive bumps on the contact surface of the terminals, reducing the contact resistance, and enhancing the corrosion resistance and service life of the terminals.

[0144] In actual production, 2000 cable connection terminals were produced from the same batch of raw materials using the traditional process and the method of the present invention respectively, and their key performance parameters were comprehensively tested. The test results show that the production method of the present invention is significantly superior to the traditional method. In the contact resistance test, the average contact resistance of the present invention is 0.75 mΩ, a 37.5% reduction compared to 1.20 mΩ of the traditional process. In the pull-out force test, the average pull-out force of the terminals produced by the present invention is 380 N, a 22.6% increase compared to 310 N of the traditional method. In terms of the scrap rate, the scrap rate of the present invention is 2.3%, while that of the traditional process is as high as 8.7%, significantly improving the material utilization rate. At the same time, the average energy consumption in the stamping stage of the present invention is 12.5 kWh / 1000 pieces, lower than 16.8 kWh / 1000 pieces of the traditional process, with an energy consumption reduction of 25.6%.

[0145] The following table shows the comparison data of the above experimental results.

[0146] Table 1 Comparison of the forming performance of cable connection terminals between the traditional process and the method of the present invention

[0147] Test item Traditional process Method of the present invention Improvement range Average contact resistance (mΩ) 1.20 0.75 -37.5％ Average drawing force (N) 310 380 +22.6％ Scrap rate (%) 8.7 2.3 -73.6％ Energy consumption in stamping stage (kWh / 1000 pieces) 16.8 12.5 -25.6％

[0148] In this embodiment, by applying the method of the present invention to the actual production of cable connection terminals, the problems of high contact resistance, insufficient pull-out strength, serious material waste, and excessive energy consumption in the traditional process are successfully solved. Using the hummingbird optimization algorithm and intelligent manufacturing technology, a comprehensive optimization is carried out for key links such as die design, stamping forming, laser-assisted processing, and surface coating, significantly improving the electrical and mechanical properties of the terminals, while reducing the production cost and energy consumption. The experimental data show that the method of the present invention has significant advantages in reducing the contact resistance by 37.5%, increasing the pull-out force by 22.6%, reducing the scrap rate by 73.6%, and reducing the energy consumption by 25.6%, providing a practical solution for the efficient and green manufacturing of cable connection terminals.

[0149] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. A method for forming a low-loss cable terminal based on multi-objective optimization, characterized in that: The steps include: S1. Establish a multi-objective optimization model for low-loss cable terminals. The optimization objectives include minimizing contact resistance, maximizing pull-out force, minimizing scrap rate, and minimizing energy consumption. S2. Perform a global search on the multi-objective optimization model based on the Hummingbird optimization algorithm to generate an initial solution set, select the optimal solution area through fitness evaluation, and generate initial mold design parameters and stamping process parameters; S3. Locally optimize the optimal solution area, use the Hummingbird optimization algorithm to dynamically adjust the mold surface curvature, material thickness distribution and stamping path, and generate optimized mold design parameters and stamping process parameters; S4. Complete the design and processing of the mold according to the optimized mold design parameters, and use micron-level texture processing technology on the mold surface; S5. Use the optimized stamping process parameters to achieve stamping forming, combine the flexible forming technology to dynamically adjust the material thickness distribution, and generate a preliminarily formed cable connection terminal; S6. Performing laser-assisted processing on the initially formed cable connection terminal, including laser straightening for eliminating residual stress and laser heat treatment for optimizing the material structure, to generate an optimized cable connection terminal; S7. Surface treatment is performed on the optimized cable connection terminal, and the plating thickness is adjusted through real-time feedback control to form conductive bumps on the contact surface of the terminal to generate the final formed cable connection terminal.

2. A method for forming a low-loss cable terminal based on multi-objective optimization according to claim 1, characterized in that: The S1 specifically includes: S11. Establish the contact resistance minimization objective function to optimize the conductive performance of the contact surface of the cable terminal, with the goal of minimizing the contact resistance R: Where ρ represents the resistivity of the conductive material, L represents the length of the current transmission path, and A eff Represents the effective contact area, C s Represents the contact correction factor introduced by surface roughness; S12. Establish the objective function of maximizing the pull-out force and optimize the mechanical properties of the terminal. The objective is the pull-out force F. p maximize: F p =(s y +k·e n )·A c ; Among them, σ y represents the yield strength of the material, k represents the work hardening coefficient of the material, ε represents the plastic strain, n represents the hardening index, A c Indicates the actual force-bearing area; S13, establish a waste rate minimization objective function, the goal is to minimize the waste rate W: Among them, V p Indicates the volume of the finished product, V m Indicates the volume of raw materials, L s Indicates the ineffective length of the shear edge, L t represents the total length of the material, and α represents the processing accuracy correction coefficient; S14. Establish an energy consumption minimization objective function, the goal is to minimize the energy consumption E per unit product: Among them, T represents the processing cycle, P m (t) represents the power consumption of the molding equipment, P h (t) represents the auxiliary equipment power, β represents the auxiliary equipment working ratio; S15. Setting constraints include: stamping temperature range is 200℃-400℃, stamping pressure does not exceed 100MPa, material thickness range is 0.5mm-1mm, and contact surface texture depth range is 0.5mm-2mm; S16. Integrate various objective functions and constraints to build a multi-objective optimization model.

3. A method for forming a low-loss cable connection terminal based on multi-objective optimization according to claim 1, characterized in that: The S2 specifically includes: S21, initializing the multi-objective optimization model, representing the die geometry variables, stamping temperature, stamping pressure and material parameter design variables as hummingbird individuals, and constructing an initial population; S22. In the global search phase, the foraging mechanism of the hummingbird optimization algorithm is used to update the position of the initial population. Each hummingbird individual conducts random exploration in the multi-objective solution space to generate an initial solution set. S23. Evaluate the fitness of each hummingbird individual in the initial solution set and construct a comprehensive fitness function: Among them, F i represents the comprehensive fitness value of the i-th hummingbird individual, M represents the number of optimization targets, exp represents the exponential function, ω j represents the dynamic weight of the jth target, f ij represents the function value of the i-th hummingbird individual on the j-th target, represents the optimal value of the current population on the jth target, represents the average value of the current population on the jth target, Δ j represents the normalized scale parameter of the jth target, σ j represents the standard deviation of the j-th target; S24, screening the initial population according to the comprehensive fitness value, and randomly introducing a variable factor to disturb the position of each hummingbird individual to form a new population; S25, repeating steps S22 to S24 until the comprehensive fitness value converges in multiple rounds of iterations or reaches a set threshold, and selecting an optimal solution region; S26. Select several individuals with the highest comprehensive fitness from the optimal solution region as initial mold design parameters and stamping process parameters.

4. A method for forming a low-loss cable connection terminal based on multi-objective optimization according to claim 1, characterized in that: The S3 specifically includes: S31. Locally optimize the optimal solution area and dynamically adjust the mold surface curvature C m , Material thickness distribution T d and punching path P c ; S32, based on the hovering mechanism of the hummingbird optimization algorithm, adopts dynamic position update rules, introduces disturbance and step size adaptive adjustment strategy, performs local search on each variable, and optimizes the mold surface curvature C m , Material thickness distribution T d and punching path P c ; S33. Construct local optimization fitness function: in, represents the local fitness value of the i-th hummingbird individual, M represents the number of optimization targets, exp represents the exponential function, ω j represents the dynamic weight of the jth target, f ij represents the function value of the i-th hummingbird individual on the j-th target, represents the optimal value of the current population on the jth target, represents the average value of the current population on the jth target, σ j represents the standard deviation of the jth target, ∈ represents the smoothing factor, δ represents the penalty intensity parameter, and η represents the exponential factor; S34, select the local fitness value higher than the set threshold T threshold The hummingbird individuals are taken as the local optimal solution, the remaining hummingbird individuals are eliminated, and new individuals are introduced through the random perturbation mechanism; S35, repeating steps S32 to S34 until the local fitness value converges or meets the optimization conditions in multiple iterations, and outputting the optimized mold design parameters and stamping process parameters.

5. The method for forming a low-loss cable terminal based on multi-objective optimization according to claim 1, characterized in that: The S5 specifically includes: S51, inputting the optimized stamping process parameters into the stamping equipment, including stamping temperature, stamping pressure, stamping speed and initial material thickness, and setting the initial working condition of the flexible forming module; S52. Before the stamping starts, the material to be processed is placed between the die and the punch, and the material is preliminarily loaded with stamping pressure to make the material surface fit the die contour, and the stress distribution on the material surface during the loading process is monitored and the stress peak area is recorded; S53. Combined with flexible forming technology, the material thickness is dynamically adjusted according to the real-time monitored stress peak area, and the material elastic modulus and contact area function are introduced to model the stamping deformation process: Where, S(x,y) represents the material thickness at the position (x,y), S0 represents the initial material thickness, F(x,y) represents the punching force on the material at the position (x,y), Q represents the elastic modulus of the material, A(x,y) represents the material contact area at the position (x,y), and δ(x,y) represents the dynamic compensation term adaptively corrected according to the measured stress concentration; S54. During the stamping process, the real-time stamping pressure, stamping temperature and transient thickness of the material are continuously detected through the sensor array, and the monitoring data are compared with the set parameters. If there is a deviation, the stamping speed and the partition pressure distribution are automatically adjusted; S55. For areas with significant local deformation or prone to defects, a partitioned elastic support method is introduced to perform secondary loading or unloading, and the material thickness is optimized by changing the force distribution; S56. After the stamping is completed, a preliminarily formed cable connection terminal is obtained.

6. A method for forming a low-loss cable connection terminal based on multi-objective optimization according to claim 1, characterized in that: The S6 specifically includes: S61, place the initially formed cable connection terminal in the laser-assisted processing area, and set the laser output power P l , scanning speed v l , spot diameter d l and pulse frequency f l ; S62, plan the laser straightening path according to the deformation area and residual stress distribution σ of the terminal res (x,y) Design the scanning trajectory to divide the straightening area into several independent sections; S63. Implement laser straightening and use local heating and thermal gradient to control residual stress: s corr (x,y)=σ res (x,y)-ξ·ΔT(x,y); Among them, σ corr (x, y) represents the stress value after straightening at the position (x, y), ξ represents the thermal stress coefficient of the material, and ΔT(x, y) represents the temperature increment caused by laser heating at the position (x, y); S64. Laser heat treatment is performed after straightening is completed to optimize the material structure by controlling the laser dwell time and energy absorption coefficient: Among them, T laser (t) represents the temperature reached by the local area of ​​the terminal over time t during the laser heat treatment process, T0 represents the initial temperature, P l (τ) represents the instantaneous power of the laser at time τ, and θ represents the absorption coefficient; S65. During the laser-assisted processing, the temperature, stress distribution and terminal deformation are collected in real time through the online monitoring system. If the monitoring value deviates from the preset range, the scanning speed v is adjusted. l make corrections; S66. After laser straightening and heat treatment, the surface flatness and microstructure of the terminal are tested to obtain an optimized cable connection terminal.

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